USD896229S1 - SSD storage device - Google Patents
SSD storage device Download PDFInfo
- Publication number
- USD896229S1 USD896229S1 US29/692,883 US201929692883F USD896229S US D896229 S1 USD896229 S1 US D896229S1 US 201929692883 F US201929692883 F US 201929692883F US D896229 S USD896229 S US D896229S
- Authority
- US
- United States
- Prior art keywords
- storage device
- ssd storage
- ssd
- view
- elevation view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines are for environmental purposes only and form no part of the claimed design.
Claims (1)
- The ornamental design for an SSD storage device, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR30-2018-0056410 | 2018-11-30 | ||
KR20180056410 | 2018-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD896229S1 true USD896229S1 (en) | 2020-09-15 |
Family
ID=72380542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/692,883 Active USD896229S1 (en) | 2018-11-30 | 2019-05-29 | SSD storage device |
Country Status (2)
Country | Link |
---|---|
US (1) | USD896229S1 (en) |
TW (1) | TWD202064S (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD943586S1 (en) * | 2019-05-22 | 2022-02-15 | Samsung Electronics Co., Ltd. | SSD (solid state drive) |
USD951937S1 (en) * | 2018-12-06 | 2022-05-17 | Samsung Electronics Co., Ltd. | Solid state drive storage device |
USD988318S1 (en) * | 2020-09-10 | 2023-06-06 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD996424S1 (en) * | 2020-06-09 | 2023-08-22 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD1024985S1 (en) | 2019-01-17 | 2024-04-30 | Telefonaktiebolaget Lm Ericsson (Publ) | Heat sink |
USD1048027S1 (en) * | 2020-07-09 | 2024-10-22 | Samsung Electronics Co., Ltd. | SSD (solid state drive) memory device |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060056154A1 (en) * | 2004-09-15 | 2006-03-16 | International Business Machines Corporation | Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board |
US20060268523A1 (en) * | 2005-05-31 | 2006-11-30 | Akust Technology Co., Ltd. | Heat sink for memory |
US20080101036A1 (en) * | 2006-10-26 | 2008-05-01 | Chiung Yi Chen | Heat-dissipating assembly structure |
US7738252B2 (en) * | 2006-01-09 | 2010-06-15 | Ocz Technology, Group, Inc. | Method and apparatus for thermal management of computer memory modules |
USD657756S1 (en) * | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
USD698792S1 (en) * | 2012-01-05 | 2014-02-04 | Kingston Digital, Inc. | Memory module |
USD702689S1 (en) * | 2012-08-17 | 2014-04-15 | Kingston Digital, Inc. | Memory module |
USD702690S1 (en) * | 2012-10-17 | 2014-04-15 | Kingston Digital, Inc. | Memory module |
USD714789S1 (en) * | 2013-02-04 | 2014-10-07 | Comptake Technology Inc. | Housing of solid state drive |
US20140367077A1 (en) * | 2013-06-17 | 2014-12-18 | Che Yuan Wu | Complex heat dissipation assembly |
USD735201S1 (en) * | 2014-07-30 | 2015-07-28 | Kingston Digital, Inc. | Memory module |
USD793400S1 (en) * | 2016-05-09 | 2017-08-01 | Kingston Digital, Inc. | Heat sink for memory module |
USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
USD862402S1 (en) * | 2017-12-18 | 2019-10-08 | Kingston Digital, Inc. | Memory heat dissipation sink |
-
2019
- 2019-05-29 US US29/692,883 patent/USD896229S1/en active Active
- 2019-05-30 TW TW108303223F patent/TWD202064S/en unknown
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060056154A1 (en) * | 2004-09-15 | 2006-03-16 | International Business Machines Corporation | Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board |
US20060268523A1 (en) * | 2005-05-31 | 2006-11-30 | Akust Technology Co., Ltd. | Heat sink for memory |
US7738252B2 (en) * | 2006-01-09 | 2010-06-15 | Ocz Technology, Group, Inc. | Method and apparatus for thermal management of computer memory modules |
US20080101036A1 (en) * | 2006-10-26 | 2008-05-01 | Chiung Yi Chen | Heat-dissipating assembly structure |
USD657756S1 (en) * | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
USD698792S1 (en) * | 2012-01-05 | 2014-02-04 | Kingston Digital, Inc. | Memory module |
USD702689S1 (en) * | 2012-08-17 | 2014-04-15 | Kingston Digital, Inc. | Memory module |
USD702690S1 (en) * | 2012-10-17 | 2014-04-15 | Kingston Digital, Inc. | Memory module |
USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
USD714789S1 (en) * | 2013-02-04 | 2014-10-07 | Comptake Technology Inc. | Housing of solid state drive |
US20140367077A1 (en) * | 2013-06-17 | 2014-12-18 | Che Yuan Wu | Complex heat dissipation assembly |
USD735201S1 (en) * | 2014-07-30 | 2015-07-28 | Kingston Digital, Inc. | Memory module |
USD793400S1 (en) * | 2016-05-09 | 2017-08-01 | Kingston Digital, Inc. | Heat sink for memory module |
USD862402S1 (en) * | 2017-12-18 | 2019-10-08 | Kingston Digital, Inc. | Memory heat dissipation sink |
USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
Non-Patent Citations (1)
Title |
---|
Communication dated Sep. 9, 2019, issued by the Taiwan Patent Office in counterpart Taiwan Application No. 108303223. |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD951937S1 (en) * | 2018-12-06 | 2022-05-17 | Samsung Electronics Co., Ltd. | Solid state drive storage device |
USD1024985S1 (en) | 2019-01-17 | 2024-04-30 | Telefonaktiebolaget Lm Ericsson (Publ) | Heat sink |
USD943586S1 (en) * | 2019-05-22 | 2022-02-15 | Samsung Electronics Co., Ltd. | SSD (solid state drive) |
USD996424S1 (en) * | 2020-06-09 | 2023-08-22 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD997939S1 (en) * | 2020-06-09 | 2023-09-05 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD998612S1 (en) * | 2020-06-09 | 2023-09-12 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
US11979996B2 (en) | 2020-06-09 | 2024-05-07 | Samsung Electronics Co., Ltd. | Memory device and electronic device including the same |
USD1048027S1 (en) * | 2020-07-09 | 2024-10-22 | Samsung Electronics Co., Ltd. | SSD (solid state drive) memory device |
USD988318S1 (en) * | 2020-09-10 | 2023-06-06 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD997161S1 (en) * | 2020-09-10 | 2023-08-29 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
Also Published As
Publication number | Publication date |
---|---|
TWD202064S (en) | 2020-01-11 |
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Legal Events
Date | Code | Title | Description |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |