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USD951937S1 - Solid state drive storage device - Google Patents

Solid state drive storage device Download PDF

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Publication number
USD951937S1
USD951937S1 US29/693,844 US201929693844F USD951937S US D951937 S1 USD951937 S1 US D951937S1 US 201929693844 F US201929693844 F US 201929693844F US D951937 S USD951937 S US D951937S
Authority
US
United States
Prior art keywords
storage device
solid state
state drive
drive storage
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/693,844
Inventor
Gye-jin Jun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD reassignment SAMSUNG ELECTRONICS CO., LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JUN, GYE-JIN
Application granted granted Critical
Publication of USD951937S1 publication Critical patent/USD951937S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of the solid state drive storage device showing my new design.
FIG. 2 is a front elevation view thereof.
FIG. 3 is a rear elevation view thereof.
FIG. 4 is a left side elevation view thereof.
FIG. 5 is a right side elevation view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines in the drawings illustrate portions of the solid state drive storage device and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a solid state drive storage device, as shown and described.
US29/693,844 2018-12-06 2019-06-05 Solid state drive storage device Active USD951937S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2018-0057455 2018-12-06
KR20180057455 2018-12-06

Publications (1)

Publication Number Publication Date
USD951937S1 true USD951937S1 (en) 2022-05-17

Family

ID=81535867

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/693,844 Active USD951937S1 (en) 2018-12-06 2019-06-05 Solid state drive storage device

Country Status (2)

Country Link
US (1) USD951937S1 (en)
TW (1) TWD202065S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1044799S1 (en) * 2021-08-25 2024-10-01 Redarc Technologies Pty Ltd. Assembled electronics housing

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US20080174965A1 (en) * 2007-01-22 2008-07-24 Long Da Chang Co., Ltd. Memory module and heat sink arrangement
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US7609523B1 (en) * 2004-09-29 2009-10-27 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive and clips
TWD133725S1 (en) 2009-05-25 2010-03-11 廣穎電通股份有限公司 USB flash drive with two-way sliding connector
USD660810S1 (en) * 2011-10-17 2012-05-29 Corsair Memory, Inc. Heat spreader with fins for a computer memory module
US8411443B2 (en) * 2011-01-21 2013-04-02 Comptake Technology Inc. Slidingly-engaged heat-dissipating assembly for memory and memory device having the same
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
US8659904B2 (en) * 2011-08-25 2014-02-25 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Solid state disk assembly
USD717744S1 (en) * 2013-08-30 2014-11-18 Corsair Memory, Inc. Heat spreader on a memory module
US9245820B2 (en) * 2010-03-08 2016-01-26 International Business Machines Corporation Liquid DIMM cooling device
USD793400S1 (en) * 2016-05-09 2017-08-01 Kingston Digital, Inc. Heat sink for memory module
USD824910S1 (en) * 2017-02-17 2018-08-07 Samsung Electronics Co., Ltd. SSD storage device
USD848432S1 (en) * 2017-02-17 2019-05-14 Samsung Electronics Co., Ltd. SSD storage device
USD850364S1 (en) * 2015-11-25 2019-06-04 GreenPack GmbH Power strip
USD862475S1 (en) * 2017-02-17 2019-10-08 Samsung Electronics Co., Ltd. SSD storage device
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink
CN305434156S (en) * 2019-11-12
USD896230S1 (en) * 2018-11-30 2020-09-15 Samsung Electronics Co., Ltd. SSD storage device
USD896229S1 (en) * 2018-11-30 2020-09-15 Samsung Electronics Co., Ltd. SSD storage device
USD896231S1 (en) * 2018-11-30 2020-09-15 Samsung Electronics Co., Ltd. SSD storage device
USD937773S1 (en) * 2020-06-03 2021-12-07 Delta Electronics, Inc. Power supply

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN305434156S (en) * 2019-11-12
US20030026076A1 (en) * 2001-08-06 2003-02-06 Wen-Chen Wei Memory heat sink device
US7221569B2 (en) * 2004-09-15 2007-05-22 Comptake Technology Co., Ltd. Memory heat-dissipating device
US7365985B1 (en) * 2004-09-29 2008-04-29 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7609523B1 (en) * 2004-09-29 2009-10-27 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive and clips
US7312996B2 (en) * 2005-03-14 2007-12-25 Wan Chien Chang Heat sink for memory strips
US20060268523A1 (en) * 2005-05-31 2006-11-30 Akust Technology Co., Ltd. Heat sink for memory
US7738252B2 (en) * 2006-01-09 2010-06-15 Ocz Technology, Group, Inc. Method and apparatus for thermal management of computer memory modules
US20070159789A1 (en) * 2006-01-09 2007-07-12 Ocz Technology Group, Inc. Method and apparatus for thermal management of computer memory modules
US7457122B2 (en) * 2006-02-22 2008-11-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clip for mounting a heat sink thereon
US7375964B2 (en) * 2006-03-25 2008-05-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US7391613B2 (en) * 2006-05-12 2008-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US7349220B2 (en) * 2006-05-15 2008-03-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly
US20070263361A1 (en) * 2006-05-15 2007-11-15 Foxconn Technology Co., Ltd. Memory module assembly
US20080174965A1 (en) * 2007-01-22 2008-07-24 Long Da Chang Co., Ltd. Memory module and heat sink arrangement
US7532477B2 (en) * 2007-01-22 2009-05-12 June-On Co., Ltd. Memory module and heat sink arrangement
TWD133725S1 (en) 2009-05-25 2010-03-11 廣穎電通股份有限公司 USB flash drive with two-way sliding connector
US9245820B2 (en) * 2010-03-08 2016-01-26 International Business Machines Corporation Liquid DIMM cooling device
US8411443B2 (en) * 2011-01-21 2013-04-02 Comptake Technology Inc. Slidingly-engaged heat-dissipating assembly for memory and memory device having the same
US8659904B2 (en) * 2011-08-25 2014-02-25 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Solid state disk assembly
USD660810S1 (en) * 2011-10-17 2012-05-29 Corsair Memory, Inc. Heat spreader with fins for a computer memory module
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
USD717744S1 (en) * 2013-08-30 2014-11-18 Corsair Memory, Inc. Heat spreader on a memory module
USD850364S1 (en) * 2015-11-25 2019-06-04 GreenPack GmbH Power strip
USD793400S1 (en) * 2016-05-09 2017-08-01 Kingston Digital, Inc. Heat sink for memory module
USD824910S1 (en) * 2017-02-17 2018-08-07 Samsung Electronics Co., Ltd. SSD storage device
USD848432S1 (en) * 2017-02-17 2019-05-14 Samsung Electronics Co., Ltd. SSD storage device
USD862475S1 (en) * 2017-02-17 2019-10-08 Samsung Electronics Co., Ltd. SSD storage device
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink
USD896230S1 (en) * 2018-11-30 2020-09-15 Samsung Electronics Co., Ltd. SSD storage device
USD896229S1 (en) * 2018-11-30 2020-09-15 Samsung Electronics Co., Ltd. SSD storage device
USD896231S1 (en) * 2018-11-30 2020-09-15 Samsung Electronics Co., Ltd. SSD storage device
USD937773S1 (en) * 2020-06-03 2021-12-07 Delta Electronics, Inc. Power supply

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Communication dated Sep. 9, 2019, issued by the Taiwan Patent Office in counterpart Taiwan Application No. 108303325.
Gen4 7000 NVME SSD, Aorus, techpowerup.com, published by Sebastian Peak on Jan. 18, 2021 © 2004-2021 www.techpowerup.com, online, site visited Mar. 18, 2021. Available from Internet, URL: https://www.techpowerup.com/277429/gigabyte-launches-the-aorus-gen4-7000s-m-2-nvme-ssd (Year: 2021). *
NVME Gen4 SSD, Aorus, pcper.com, published Sebastian Peak on May 28, 2019 © 2000-2021 PC Perspective, online, site visited Mar. 18, 2021. Available from Internet, URL: https://pcper.com/2019/05/gigabyte-introduces-the-aorus-nvme-gen4-ssd/ (Year: 2019). *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1044799S1 (en) * 2021-08-25 2024-10-01 Redarc Technologies Pty Ltd. Assembled electronics housing

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TWD202065S (en) 2020-01-11

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