USD856947S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD856947S1 USD856947S1 US29/644,401 US201829644401F USD856947S US D856947 S1 USD856947 S1 US D856947S1 US 201829644401 F US201829644401 F US 201829644401F US D856947 S USD856947 S US D856947S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- ornamental design
- design
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines illustrate portions of the semiconductor device and form no part of the claimed design.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-023165 | 2017-10-19 | ||
JPD2017-23165F JP1603175S (en) | 2017-10-19 | 2017-10-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD856947S1 true USD856947S1 (en) | 2019-08-20 |
Family
ID=62066955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/644,401 Active USD856947S1 (en) | 2017-10-19 | 2018-04-17 | Semiconductor device |
Country Status (2)
Country | Link |
---|---|
US (1) | USD856947S1 (en) |
JP (1) | JP1603175S (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD901405S1 (en) * | 2017-03-28 | 2020-11-10 | Rohm Co., Ltd. | Semiconductor device |
USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
USD974311S1 (en) * | 2020-07-31 | 2023-01-03 | Rohm Co., Ltd. | Semiconductor module |
USD975666S1 (en) * | 2020-07-31 | 2023-01-17 | Rohm Co., Ltd. | Semiconductor module |
USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1017533S1 (en) * | 2022-01-28 | 2024-03-12 | Mitsubishi Electric Corporation | Semiconductor device |
USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US3825876A (en) * | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
USD259559S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
US6177718B1 (en) * | 1998-04-28 | 2001-01-23 | Kabushiki Kaisha Toshiba | Resin-sealed semiconductor device |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD473199S1 (en) * | 2001-11-30 | 2003-04-15 | Kabushiki Kaisha Toshiba | Portion of semiconductor device |
USD480371S1 (en) * | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD489338S1 (en) * | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
USD508682S1 (en) * | 2004-02-23 | 2005-08-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD521952S1 (en) * | 2004-02-23 | 2006-05-30 | Kabushiki Kaisha Toshiba | Semiconductor device |
US7170150B2 (en) * | 2001-03-27 | 2007-01-30 | Amkor Technology, Inc. | Lead frame for semiconductor package |
USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD674760S1 (en) * | 2011-04-01 | 2013-01-22 | Fuji Electric Co., Ltd. | Semiconductor device |
USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD822628S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
USD822627S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
USD823270S1 (en) * | 2016-09-30 | 2018-07-17 | Rohm Co., Ltd. | Semiconductor device |
-
2017
- 2017-10-19 JP JPD2017-23165F patent/JP1603175S/ja active Active
-
2018
- 2018-04-17 US US29/644,401 patent/USD856947S1/en active Active
Patent Citations (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3825876A (en) * | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
USD259559S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
US6177718B1 (en) * | 1998-04-28 | 2001-01-23 | Kabushiki Kaisha Toshiba | Resin-sealed semiconductor device |
US7170150B2 (en) * | 2001-03-27 | 2007-01-30 | Amkor Technology, Inc. | Lead frame for semiconductor package |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD473199S1 (en) * | 2001-11-30 | 2003-04-15 | Kabushiki Kaisha Toshiba | Portion of semiconductor device |
USD480371S1 (en) * | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD489338S1 (en) * | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
USD521952S1 (en) * | 2004-02-23 | 2006-05-30 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD508682S1 (en) * | 2004-02-23 | 2005-08-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD674760S1 (en) * | 2011-04-01 | 2013-01-22 | Fuji Electric Co., Ltd. | Semiconductor device |
USD752000S1 (en) * | 2013-03-07 | 2016-03-22 | Vlt, Inc. | Semiconductor device |
USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
USD823270S1 (en) * | 2016-09-30 | 2018-07-17 | Rohm Co., Ltd. | Semiconductor device |
USD822628S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
USD822627S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD901405S1 (en) * | 2017-03-28 | 2020-11-10 | Rohm Co., Ltd. | Semiconductor device |
USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
USD975666S1 (en) * | 2020-07-31 | 2023-01-17 | Rohm Co., Ltd. | Semiconductor module |
USD974311S1 (en) * | 2020-07-31 | 2023-01-03 | Rohm Co., Ltd. | Semiconductor module |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1017533S1 (en) * | 2022-01-28 | 2024-03-12 | Mitsubishi Electric Corporation | Semiconductor device |
USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
Also Published As
Publication number | Publication date |
---|---|
JP1603175S (en) | 2018-05-07 |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |