USD539761S1 - Semiconductor - Google Patents
Semiconductor Download PDFInfo
- Publication number
- USD539761S1 USD539761S1 US29/267,014 US26701406F USD539761S US D539761 S1 USD539761 S1 US D539761S1 US 26701406 F US26701406 F US 26701406F US D539761 S USD539761 S US D539761S
- Authority
- US
- United States
- Prior art keywords
- semiconductor
- view
- elevational view
- ornamental design
- side elevational
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a top, front and left side perspective view of a semiconductor showing our new design,
FIG. 2 is a front elevational view thereof,
FIG. 3 is a rear elevational view thereof,
FIG. 4 is a right side elevational view thereof, a left side elevational view being identical thereto
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a semiconductor, as shown and described.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006022163 | 2006-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD539761S1 true USD539761S1 (en) | 2007-04-03 |
Family
ID=37898024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/267,014 Expired - Lifetime USD539761S1 (en) | 2006-08-22 | 2006-10-04 | Semiconductor |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD539761S1 (en) |
| TW (1) | TWD120408S1 (en) |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD743399S1 (en) * | 2014-05-30 | 2015-11-17 | Emc Corporation | Flash module |
| USD748595S1 (en) * | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
| USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD755741S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD755742S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD762597S1 (en) | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
| USD769834S1 (en) | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD836073S1 (en) * | 2017-01-25 | 2018-12-18 | Shindengen Electric Manufacturing Co., Ltd. | Solid state relay |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
| USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
| USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
| USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
| USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
| USD1046801S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1046800S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
-
2006
- 2006-10-04 US US29/267,014 patent/USD539761S1/en not_active Expired - Lifetime
- 2006-10-11 TW TW095305598F patent/TWD120408S1/en unknown
Cited By (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD769834S1 (en) | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| USD805485S1 (en) | 2013-08-21 | 2017-12-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD785577S1 (en) | 2013-08-21 | 2017-05-02 | Mitsubishi Electric Corporation | Semiconductor device |
| USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD743399S1 (en) * | 2014-05-30 | 2015-11-17 | Emc Corporation | Flash module |
| USD762597S1 (en) | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
| USD748595S1 (en) * | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
| USD755742S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD755741S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD836073S1 (en) * | 2017-01-25 | 2018-12-18 | Shindengen Electric Manufacturing Co., Ltd. | Solid state relay |
| USD836565S1 (en) * | 2017-01-25 | 2018-12-25 | Shindengen Electric Manufacturing Co., Ltd. | Solid state relay |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD864135S1 (en) | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
| USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
| USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| USD978809S1 (en) | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
| USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
| USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
| USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
| USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
| USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
| USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
| USD1046801S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1046800S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD120408S1 (en) | 2007-12-11 |
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