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US9506876B2 - X-ray inspection device, inspection method, and X-ray detector - Google Patents

X-ray inspection device, inspection method, and X-ray detector Download PDF

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Publication number
US9506876B2
US9506876B2 US14/371,427 US201214371427A US9506876B2 US 9506876 B2 US9506876 B2 US 9506876B2 US 201214371427 A US201214371427 A US 201214371427A US 9506876 B2 US9506876 B2 US 9506876B2
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ray
sample
tdi
scintillator
detector
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US20140328459A1 (en
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Yuta Urano
Toshifumi Honda
Yasuko Aoki
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/043—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using fluoroscopic examination, with visual observation or video transmission of fluoroscopic images
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/16—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the material being a moving sheet or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/18—Investigating the presence of flaws defects or foreign matter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/24—Measuring radiation intensity with semiconductor detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/642—Specific applications or type of materials moving sheet, web
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/643—Specific applications or type of materials object on conveyor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/646—Specific applications or type of materials flaws, defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/652—Specific applications or type of materials impurities, foreign matter, trace amounts

Definitions

  • the present invention pertains to an X-ray inspection device irradiating X-rays on a sample and inspecting the sample on the basis of the irradiance distribution of X-rays transmitted through the sample; a detection method; and an X-ray detector used in the X-ray inspection device.
  • Patent Literature 1 JP-A-09-72863
  • Claim 1 of the Claims a simple high-resolution automatic X-ray transmission inspection device wherein a sample under inspection is transported at a level which is several tens of centimeters in the upward direction from the floor face and characterized by being provided with:
  • X-ray fluence refers to the product of the irradiance of X-rays irradiated on the sample and the accumulated time (exposure time) of the detector.
  • the fact that the former is necessary is because, in the case where the resolution is low as compared to the size of the objects, the images end up becoming blurred and the contrast of the images of the objects is diminished.
  • shot noise designates photon shot noise or what is also called quantum noise and, in the case where the ratio accounting for the shot noise component within the noise of the images is great, the S/N ratio of the images is improved by increasing the X-ray fluence, in proportion to the square root of the X-ray fluence.
  • Patent Literature 1 there is reported an automatic X-ray transmission inspection device with high resolution.
  • a raising and lowering stage having an inspected sample horizontal transfer function and going up and down between the height level of said carry-in/carry-out aperture and the height level of said imaging face in the imaging place inside said 215 shielded box, going down to the upper side inspection level of said imaging face while supporting a sample under inspection received in said carry-in aperture and going up to the height level of the carry-out aperture while supporting the imaged sample under inspection” as a configuration for acquiring high-resolution images, but no report regarding the necessity of increasing X-ray fluence is made. Also, no report is made regarding the inspection method of a sample transported with high speed.
  • the present invention it is possible, by obtaining a high-resolution X-ray transmission image with sufficiently great X-ray fluence, to detect microscopic defects.
  • FIG. 1 is a block diagram for describing the configuration of an X-ray detection device related to the present invention.
  • FIG. 2 is a block diagram describing an X-ray source related to the present invention.
  • FIG. 3 is a diagram describing the positional relationship of an X-ray source, an object subject to inspection and a TDI camera that are related to the present invention.
  • FIG. 4 is a diagram describing the positional relationship and the relationship with the amount of image blurring, of an X-ray source, an object subject to inspection and a TDI camera that are related to the present invention.
  • FIG. 5 is a block diagram describing a configuration example in which a plurality of TDI cameras related to the present invention are lined up.
  • FIG. 6 is a diagram describing the duplication of images due to a plurality of X-ray tubes related to the present invention.
  • FIG. 7 is a diagram describing the arrangement of light source parts and TDI cameras, related to the present invention.
  • FIG. 8 is a diagram describing an X-ray TDI camera having flat pixels, related to the present invention.
  • FIG. 9 is a diagram describing another embodiment of an X-ray TDI camera having flat pixels, related to the present invention.
  • FIG. 10 is a diagram describing the configuration of a high-resolution X-ray TDI camera.
  • FIG. 11 is a diagram describing aperture masks improving the resolution of a scintillator of an X-ray TDI camera related to the present invention.
  • FIG. 12 is a flow diagram for describing an X-ray inspection method related to the present invention.
  • FIG. 13 is a diagram describing the arrangement of photoreceptive sensors of an X-ray TDI camera related to the present invention.
  • FIG. 1 is an example of a block diagram of an X-ray inspection device of the present embodiment.
  • X-ray inspection device 100 has an X-ray source 1 , a radiation source shielding part 2 , a radiation source slit 3 , an X-ray TDI camera 4 , a direct light shielding part 5 , a device cover 6 , a defect judgment part 7 , a control part 8 , and a display part 9 .
  • X-ray source 1 irradiates X-rays toward a sample W.
  • the shape of the X-ray irradiation region on the sample, due to X-ray source 1 is restricted by means of radiation source slit 3 .
  • Radiation source shielding part 2 shields X-rays directed to other places than the irradiation region on the sample. By means of radiation source shielding part 2 and radiation source slit 3 , the amount of leakage of X-rays not needed for the inspection is reduced, so the safety of X-ray inspection device 100 is improved.
  • the X-rays irradiated on sample W are transmitted through sample W and are detected as an X-ray transmission image by means of X-ray TDI camera 4 .
  • TDI camera 4 as a detector, it is possible to acquire X-ray transmission images uninterruptedly of a continuously transported sample W. Also, compared to the case of using a normal X-ray line camera, it is possible to obtain accumulation time that is greater only by the extent of the number of TDI stages, and by increasing the X-ray fluence, images with a high S/N ratio are obtained, so detection sensitivity is improved.
  • Direct light shielding part 5 shields X-rays transmitted through sample W and TDI camera 4 and is a part for preventing X-rays from leaking to the outside of the device.
  • Device cover 6 together with shielding the X-ray component that was too much to shield in radiation source shielding part 2 , radiation source slit 3 , and direct light shielding part 5 as well as the reflected/scattered X-ray component, is a part for separating the space in which X-rays are irradiated and preventing a hand, or the like, of a human being from entering into the same space.
  • FIG. 1 there was shown an arrangement in which X-ray source 1 is placed above sample W and X-ray TDI camera 4 is placed below sample W, but in the case where the distance from the face of the floor where X-ray inspection device 100 is installed to sample W is long and it is possible to ensure enough space below sample W, it is acceptable, in order to make the external form of X-ray inspection device 100 compact, to install X-ray source 1 below sample W and to install X-ray TDI camera 4 above sample W. Also, defect judgment part 7 , control part 8 , or display part 9 may be installed inside device cover 6 .
  • Defect judgment part 7 distinguishes defects that are present in the sample on the basis of X-ray transmission images detected with X-ray TDI camera 4 , and outputs the presence or absence thereof and the number present, location, or size.
  • the term “defect” refers to a primary factor that may cause the reliability of a finished lithium ion accumulator product to diminish in the electrode material of a lithium ion accumulator and includes e.g. microscopic metal contaminants included in positive electrode material, negative electrode material, a current collector, or a separator of a lithium ion accumulator or a vacancy or coating defect in positive electrode material, negative electrode material, or a separator thereof.
  • the same appear as defect signals that are darker than the background in the X-ray transmission image.
  • metal components constituted by elements that are lighter than the positive electrode material are embedded in the interior of the positive electrode material, or in the case where there are positive electrode material coating leaks and vacancies, the same appear as defect signals that are brighter than the background in the X-ray transmission image.
  • the center (the position where the luminosity difference with the background is at a maximum or the center-of-gravity position of the luminosity difference) of the spatial spread of the luminosity of the defect part is measured as the defect position.
  • the size of the defect is measured from the luminosity difference with the background of the defect part and the spatial spread of the luminosity.
  • the defect image including the defect part and the surrounding background is saved in memory incorporated in defect judgment part 7 or control part 8 .
  • Control part 8 receives signals from an input part 10 or each of the aforementioned constituent components and carries out parameter setting and control of X-ray source 1 , X-ray TDI camera 4 , and defect judgment part 7 .
  • the parameter setting values, states, inspection conditions, and defect judgment results (number of defects, positions, defect dimensions, and defect images) of each of the aforementioned constituent parts are displayed in display part 9 .
  • input part 10 input such as parameter setting values or inspection conditions of each constituent requirement from the exterior such as a user is received and sent to control part 8 .
  • transport system 11 By means of transport system 11 , a sample W subject to inspection is transported and scanned.
  • the line rate of X-ray TDI camera 4 is set to match the speed of sample scanning due to transport system 11 , so imaging synchronized with the scanning speed is carried out.
  • Transport system 11 outputs information needed for the timing synchronization of X-ray TDI camera 4 , such as transport speed or transport distance, to control part 8 .
  • X-ray inspection device 100 is installed in an environment where, in the sample manufacturing process or the like, the sample is already substantially transported with a fixed speed, there is no need for X-ray inspection device 100 itself to have a transport system 11 , so the transport system already installed in the manufacturing process or the like is used in combination, and X-ray TDI camera 4 may be set and operated in synchronization herewith.
  • output of the transport system of the sample manufacturing process or the like, or the position measurement value obtained by measurement by means of an encoder, or the speed measurement value obtained by measurement by means of a speed indicator is input to the control part as information used for synchronization and used.
  • FIG. 2 is a block diagram describing the X-ray source of the present embodiment.
  • X-ray source 1 has a plurality of X-ray tubes.
  • FIG. 2 and FIG. 6 and FIG. 7 to be subsequently described, there was illustrated an example in which X-ray source 1 has two X-ray tubes 101 and 102 , but it is acceptable to use three or more X-ray tubes in order to augment the X-ray fluence more.
  • Each of X-ray tubes 10 and 102 irradiate on sample W in mutually different regions. In order that irradiation regions on sample W do not overlap, a radiation source slit 3 is installed and adjusted.
  • the X-rays transmitted through the regions on sample W that are irradiated by X-ray tubes 101 and 102 are incident on photoreceptive part 103 of X-ray TDI camera 4 and are detected.
  • the length of the region irradiated by one X-ray tube gets multiplied by 1/N, and the distance between one X-ray tube and the sample gets multiplied by 1/N. Since the X-ray irradiance is inversely proportional to the square of the distance from the X-ray tubes, the X-ray irradiance supplied per unit area on the sample is increased by the square of N. In this way, it is possible to increase the X-ray fluence.
  • FIG. 7 is a diagram describing the arrangement of the light source part and the TDI camera of this embodiment.
  • FIG. 3 is a diagram describing the positional relationship of an X-ray source, an object subject to inspection, and a TDI camera.
  • a focal spot In the interior of an X-ray tube included in an X-ray source, the region where the X-rays are generated is called a focal spot.
  • Ref 201 of FIG. 3 indicates the focal spot region of an X-ray tube.
  • Focal spot region 201 has a finite size.
  • the focal spot size is taken to be disc, the focal spot size disc being set to be greater than a defect diameter.
  • the X-rays emitted from focal spot region 201 are transmitted through sample face W and an image 204 of a microscopic object 203 in the photoreceptive part.
  • image blur 205 corresponding to focal spot size d on both flanks of image 204 .
  • photoreceptive part 103 it is possible to reduce the size of the blur with respect to the image of the microscopic object. If the size of the blur is large with respect to the size of the image of the object, the detection sensitivity diminishes since the contrast of the microscopic object in the transmitted X-ray irradiance distribution detected with photoreceptive part 103 diminishes.
  • the size of blur 205 on the photoreceptive part is expressed as bd/a, using a focal spot size d, a radiation source—sample distance a, and a sample—photoreceptive part distance b. Since the image on the sample is expanded by an expansion factor (a+b)/a on the photoreceptive part, the size of blur 205 converted into the dimensions on the sample can be found as bd/(a+b).
  • FIG. 4 is a diagram describing the positional relationship and the relationship with the amount of blurring, of a light source part, an object subject to inspection and a TDI camera of the present embodiment.
  • the ratio of the sample—photoreceptive part distance b to the radiation source—photoreceptive part distance (a+b) is shown on the abscissa axis and the amount of blurs converted to the sample face is obtained, and the amount of blur for each focal spot size is shown on the ordinate axis.
  • the thickness of the positive electrode material subject to inspection is on the order of 200 ⁇ m.
  • the sample—photoreceptive part distance b approach the order of 1 mm.
  • the radiation source—sample distance a becomes 140 mm.
  • the size of blur 205 converted to dimensions on the sample, becomes d/140, so even if there is used a high-output X-ray source with a large focal spot size, on the order of 5 mm, the blur can be restrained down to the order of 36 ⁇ m.
  • the extent to which the distance between the X-ray tube and the sample becomes shorter has a tendency to enlarge the size of blur 205 , converted to dimensions on the sample, but particularly in the case where, as mentioned above, the sample subject to inspection is thin, e.g. 1 mm or less, the sample—photoreceptive part distance b can be compressed to the order of 1 mm, so it is possible to ensure a sufficiently high resolution.
  • FIG. 5 is a block diagram describing a configuration example of lining up a plurality of TDI cameras.
  • FIG. 6 is a diagram describing the duplication of images due to a plurality of X-ray tubes.
  • sample face W is covered without any gap by means of a plurality of X-ray tubes 101 , 102 , it is detected, relative to the y direction, that the images of a part of the regions, near the boundary of the it radiation regions of each of the X-ray tubes (regions 404 ), overlap on the photoreceptive part (region 405 ). Defect judgment processing corresponding to image overlap is carried out in defect judgment part 7 regarding overlap region 405 .
  • it is e.g. effective to use an X-ray tube with a small (e.g. 30° or less) angle of irradiation (the angle of spread of the X-ray beam emitted from an X-ray tube) or, particularly in the case of a small-thickness sample, to reduce the sample—photoreceptive part distance (e.g. b ⁇ 1 mm), or to increase the number of lined up X-ray tubes and narrow the irradiation region covered by one X-ray tube, or the like.
  • FIG. 8 is a diagram describing an X-ray TDI camera having flat pixels.
  • X-ray TDI camera 4 there is a need to synchronize the sample scanning speed and the imaging frequency (line rate) in order to correctly carry out TDI accumulation.
  • sample scanning speed vx is high, there is the problem that synchronized imaging becomes difficult, due to the upper-limit constraint of the line rate of the TDI camera.
  • the line rate needed for synchronization can be reduced, so a response to high-speed inspection becomes possible.
  • the fact of enlarging the pixel size is related with a reduction in sensitivity, since the resolution of detected images diminishes, but by keeping the pixel size small in the y direction and enlarging the pixel size only in the x direction, it becomes possible to carry out high-speed scanning while restraining the reduction in sensitivity due to the resolution decrease to the minimum required.
  • a normal TDI camera with square pixels is made to operate binning only in the x direction, it is possible to use it as a TDI camera for which the aforementioned pixel size in the x direction is greater compared to the pixel size in the y direction.
  • FIG. 9 is a diagram describing another embodiment of an X-ray IDE camera having flat pixels.
  • An X-ray TDI camera has a configuration in which a scintillator is combined by a fiber optic plate with a TDI camera for visible light.
  • a fiber optic plate has the function of transferring an image converted into light by the scintillator without carrying out an image transformation or the like, and with the same size, to a IDE camera for visible light.
  • an asymmetric fiber optic plate 501 such as one shown in FIG.
  • the asymmetric fiber optic plate it is possible to make a substitution with one that transforms and transfers visible tight images with different magnifications lengthwise and breadthwise.
  • an image formation optical system with different magnifications in the x direction and the y direction and having the combination of a cylindrical lens, an aspherical lens, a spherical lens, and the like, there may be formed an image of the output face of the scintillator on a photoreceptive part 502 of a TDI camera for visible light.
  • FIG. 10 is a diagram describing the configuration of a high-resolution X-ray TDI camera.
  • the X-ray TDI camera converts X-rays into visible light with a scintillator and detects the same, but since the light is scattered and blurs are generated in the conversion process thereof, there is the problem that the upper limit of the resolution is restricted to the order of 50 pin.
  • a scintillator 512 On the top and bottom of a scintillator 512 , there are arranged aperture masks 511 and 513 having a resolution that is higher than the upper limit of the scintillator resolution and by guiding the transmitted light thereof to a photoreceptive part with a fiber optic plate 514 , blurring due to light scattering in the conversion process is restrained, so a high resolution, at 50 ⁇ m or less, can be obtained.
  • aperture mask 511 and aperture mask 513 are adjusted so that the center part of the light beam that is output with scintillator 512 , by means of an X-ray beam having passed through each aperture part of aperture mask 511 , passes through each of the corresponding aperture parts of aperture mask 513 .
  • photoreceptive part 103 of aforementioned X-ray TDI camera 4 corresponds to the input face (being substantially the same as the face of aperture mask 103 in the case of using an aperture mask) of scintillator 512 .
  • FIG. 11 is a diagram describing aperture masks enhancing the resolution of the scintillator of an X-ray TDI camera.
  • the transmission region has been indicated with white and the shielding region with black.
  • Aperture mask 511 is formed with a quality of material that shields X-rays and the shielding regions of aperture mask 513 are formed with a quality of material that shields light that is output with the scintillator.
  • 11 is one in which transmission regions with a diameter of 25 ⁇ m are arranged with a pitch in the x and y directions of 50 ⁇ m, so a resolution of 25 ⁇ m and an aperture ratio of 39% are obtained. If the present aperture masks are used together with a normal CCD camera or a line scan camera, there is the problem that images of the shielded regions cannot be obtained, but by combining the same with a TDI camera, it is possible to acquire an image of the entire face of the sample with high resolution since, by means of the scanning of the sample, arbitrary regions on the sample mutually pass through shielded regions and transmission regions.
  • FIG. 12 is a flow diagram for describing an X-ray scanning method related to the present invention.
  • a signal pertaining to scanning conditions or the like and received from input part 10 in FIG. 1 or one of the other constituent components is received by control part 8 (Step 1201 ) and, by means of control part 8 , there is carried out setting of conditions of transport system 11 , X-ray TDI camera 4 , X-ray source 1 , and the like (Step 1202 ).
  • the sample is irradiated with X-rays (Step 1203 ) by means of X-ray source 1 with the conditions set in Step 1202 .
  • the X-rays irradiated on the sample in Step 1203 are transmitted through the sample and X-ray transmission images are detected by means of X-ray TDI camera 4 (Step 1204 ).
  • Defect judgment part 7 processes the X-ray transmission images detected in Step 1204 and detects defects present in the sample (Step 1205 ).
  • the defect detection results due to Step 1205 are displayed on display part 9 (Step 1206 ).
  • FIG. 13 is a diagram describing the arrangement of photoreceptive sensors of an X-ray TDI camera related to the present invention.
  • an X-ray TDI camera 4 there is used one in which there are formed photoreceptive regions that are longer in the y direction, by means of a plurality of photoreceptive sensors 413 , 414 that are shifted in the x direction and there is used one that is provided with X-ray tubes corresponding to each of the photoreceptive sensors, so by shifting the x direction positions of a plurality of sample images 411 , 412 , due to the plurality of X-ray tubes, so that they do not mutually overlap, it is possible to avoid the overlap of images described in FIG. 6 .
  • the present invention is not one limited to the aforementioned embodiments, diverse variations being included therein.
  • the aforementioned embodiments are ones that have been described in detail in order to comprehensibly describe the present invention, but the invention is not necessarily one limited to ones comprising the entire described configuration.
  • a part of the configuration of each embodiment it is possible to supplement, delete, and substitute other configurations thereto.
  • control lines and information lines those considered necessary for the description are indicated, so there are not necessarily indicated all control lines and information lines on the manufactured product. In practice, it may be considered that nearly all of the configurations are interconnected.

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US20160097865A1 (en) * 2014-10-07 2016-04-07 Canon Kabushiki Kaisha Radiographic imaging apparatus and imaging system
US10448908B2 (en) * 2014-10-07 2019-10-22 Canon Kabushiki Kaisha Radiographic imaging apparatus and imaging system
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