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US7855498B2 - Light-emitting device with a sealing integrated driver circuit - Google Patents

Light-emitting device with a sealing integrated driver circuit Download PDF

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Publication number
US7855498B2
US7855498B2 US11/996,597 US99659706A US7855498B2 US 7855498 B2 US7855498 B2 US 7855498B2 US 99659706 A US99659706 A US 99659706A US 7855498 B2 US7855498 B2 US 7855498B2
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US
United States
Prior art keywords
led
cover plate
transparent substrate
electroluminescent
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US11/996,597
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English (en)
Other versions
US20080231180A1 (en
Inventor
Eberhard Waffenschmidt
Edward Willem Albert Young
Dirk Hente
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Assigned to KONINKLIJKE PHILIPS ELECTRONICS N V reassignment KONINKLIJKE PHILIPS ELECTRONICS N V ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HENTE, DIRK, WAFFENSCHMIDT, EBERHARD, YOUNG, EDWARD WILLEM ALBERT
Publication of US20080231180A1 publication Critical patent/US20080231180A1/en
Application granted granted Critical
Publication of US7855498B2 publication Critical patent/US7855498B2/en
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • the invention relates to an electroluminescent, e.g. a light-emitting device (O-LED) with a sealing integrated driver circuit.
  • O-LED light-emitting device
  • Such a device comprises a transparent substrate and a cover plate having a first side facing the transparent substrate and a second side opposite the first side, at least one electroluminescent element comprising an organic electroluminescent layer arranged between the transparent substrate and the cover plate, and an intermediate sealing means joining the transparent substrate and the cover plate.
  • O-LED Organic light-emitting diodes
  • PCB printed circuit board mounted on the rear side of the O-LED can be used, so that a tight and flat construction is obtained.
  • Such a device is disclosed in WO 03/034513.
  • the intermediate sealing means of the device is used as the substrate for the driving electronics.
  • the problem is that the conventional components needed for these electronics are typically bulky and stiff elements. This is in contrast to the thin and, if possible, flexible O-LED elements.
  • the devices described in WO 03/034513 are based on a substrate layer made of glass and a circuit board made of ceramics.
  • This object is realized in that the driver circuit and the electronic driver elements or the printed circuit board (PCB) with the electronic driver elements are incorporated into the cover plate of the device.
  • PCB printed circuit board
  • a further advantage of the invention is that a lamp covering a large area consists of a number of cells.
  • the invention allows equipping each cell with its own driver on the rear side. In this way, each cell may be easily controlled in order to achieve a homogeneous light output of all cells or the application of certain light patterns.
  • Various electronic functionalities are possible, which can be integrated in the back of an O-LED by using this inventive compact, yet flexible construction.
  • a very simple supply may be a series resistor which can be integrated in the circuit board to adjust the device, e.g. the diode current to the supply voltage.
  • This resistor may be chosen from another flexible material.
  • a somewhat more advanced solution may be a linear control circuit, which is e.g. realized with a current-controlled transistor. Since this transistor does not need to be fast, printed polymer transistors can also be used, so that the construction remains both flat and flexible.
  • the driving electronics preferably consist of a DC/DC converter.
  • a step-down converter with current control is applied for a supply voltage which is higher than the diode voltage of the O-LED.
  • a step-up converter with current control is applied for a supply voltage which is lower than the diode voltage.
  • a flyback converter with an integrated transformer may also be used for a large difference between supply voltage and diode voltage. The secondary side diode of the flyback can be omitted and the O-LED can be used for this purpose.
  • Each converter is equipped with a control stage, such that the output of each cell can be controlled individually. This is important for generating light patterns using invention-related O-LEDs.
  • coils which are flat and flexible, can be produced and incorporated into the device. These coils are needed for several applications.
  • the coils serve for the remote powering of the O-LED (a wireless powered O-LED). This combination is very effective because flexible O-LEDs for generating light patterns can be obtained, which O-LEDs are as flat as films, because no external-to-internal connection of conducting paths is necessary.
  • Different O-LED cells are provided with filters of different center frequencies. Each cell may then be controlled by its related frequency. Groups of cells may have the same frequency, e.g. all red cells, all green cells, and all blue cells have the same frequency. The RGB-color of all cells can thus be jointly controlled.
  • Each cell may be equipped with a tiny transformer integrated in the PCB to adapt an AC-bus voltage to the cell current.
  • the secondary side of the transformer may be equipped with an additional rectifier stage (e.g. full bridge, half bridge, or single diode rectifier).
  • an additional rectifier stage e.g. full bridge, half bridge, or single diode rectifier.
  • two neighboring cells can be connected in an anti-parallel way, thus working as a rectifier. In this way, no additional external rectifier is necessary.
  • the primary side of the transformer can be distributed across a large area covering a number of cells. In every cell, a secondary winding picks up a part of the magnetic flux to drive the cell. In this way, no interconnections to each individual cell are necessary.
  • Integrated capacitors may act as analog sample-and-hold devices to allow easy multiplexing of a large number of cells.
  • Intelligence is added to the driver for stand-alone operation of each cell, e.g. for setting individual light patterns or color schemes.
  • the printed circuit board (PCB) on the rear side contains integrated, planar components.
  • This can be realized either as an assembly or as a fully integrated O-LED device in which the rear side is made of a printed circuit board. In this way, the sealing of the O-LED even performs an electronic function.
  • a further Figure shows an example with an integrated inductor. The aspect ratio in the Figures is not 1:1, but the thickness of the printed circuit board (PCB) is exaggerated. Also further passive components such as capacitors or resistors can be integrated in the PCB.
  • the sealing and the electronics can be made flexible, so that a completely flexible or bendable display module can be obtained.
  • each cell or group of cells is equipped with electronic bus-address units, by which each luminescent element or cell or group of luminescent elements or cells can be identified and selectively generated.
  • Each cell or group of cells can thus be generated selectively, and no conductive paths are necessary in combination with a contactless inductive intercoupling.
  • this bus-address circuit is also constructed with planar components only, and, in a special solution, such a device is flexible or bendable.
  • FIG. 1 shows an O-LED with a flex foil as top sealing.
  • FIG. 2 shows an O-LED with a flex foil as top sealing with a substrate for driver electronics.
  • FIG. 3 shows an O-LED with an integrated inductor.
  • FIG. 1 is a cross-sectional view of an O-LED 20 with a flexible foil as top sealing 10 and interconnection. The complete structure is layered, rendering it flexible and bendable.
  • the transparent substrate 1 on the light-emitting side of the O-LED 20 is a light-transmitting flexible material in the sense of the disclosed invention.
  • the flex foil 10 is a layer with a polyimide core with copper layers 2 on both sides in order to realize an interconnection between the inner O-LED and the outer conducting paths. Therefore, this flex foil is bendable.
  • the O-LED cells 3 are located between the flex foil 10 and the transparent substrate 1 .
  • the O-LED cells themselves consist of a conducting layer 4 on one side and a transparent conducting layer 5 on the other side which faces the transparent substrate 1 .
  • the active O-LED layer is located between the conducting layer 4 of the O-LED cell and the transparent conducting layer 5 of the O-LED.
  • the transparent conducting layers of several O-LED cells can be kept together, but the conducting layers on the other side of the O-LEDs must be separated, i.e. they have to be isolated from each other in order to activate each O-LED itself, i.e. independently of each other.
  • the gap between the transparent substrate and the flex foil is sealed with a side sealing 8 at least at the outer sides of an O-LED.
  • the conducting layers of the O-LEDs are bonded with conducting posts, which interconnect these conducting rear sides of the O-LEDs with the inner conducting layers, in this case copper layers 2 of the flex foil 10 .
  • the O-LED-cells 3 are preferably positioned on the transparent substrate 1 , or, more preferably, on the transparent conducting layer 5 with a defined gap between each other.
  • the conducting posts 7 for the common transparent conducting layer is located in this gap.
  • the dimensions of the conducting posts 7 and the gaps are combined so as to preclude a shortcut between these conducting posts and the conducting layers of the O-LED cells.
  • FIG. 2 is a cross-sectional view similar to that in FIG. 1 .
  • An O-LED 20 is shown with flex foil 10 as a top sealing with substrate for driver electronics 11 .
  • the multilayer sandwich construction is similar as in FIG. 1 , but the flex foil 10 is a multilayer system with two polyimide cores 9 , the first of which has substantially the same construction as in FIG. 1 , but the second flex foil layer has an integral circuit board for the driver electronics 11 .
  • One possibility for construction is to mount the electronic components 11 on top of this circuit board which is an integral part of the top sealing of the complete device.
  • Another possibility is to position at least some electronic components in the intermediate layers of the top sealing.
  • the complete device is flexible and bendable and it is necessary to consider the desired range of flexibility so that a satisfactory contact with all electronic components is realized in every case.
  • the external top surface carries the conductive paths, which may be made of copper layers 2 , as is customary for printed circuit boards. Interconnections from these layers to the inner layer of the top sealing downwards are realized by conducting vias 6 , which are made of copper in this case.
  • FIG. 3 is a cross-sectional view of an O-LED with an integral inductor 30 which is completely incorporated into the top sealing of this device.
  • the intermediate layer bulk comprises an inductor 30 consisting of a soft magnetic core 31 and a spiral winding 32 .
  • These inductor components 31 , 32 are completely integrated, i.e. they are completely incorporated into the bulk of the upper layer of the flex foil 10 .
  • the flex foil 10 remains flexible and bendable.
  • the spiral winding 32 as well as the soft magnetic cores 31 are therefore created in a thin-layered way.
  • the rest of the construction is similar to that shown in FIG. 2 .
  • the integrated inductor couples with an external inductor. This results in a contactless steering of the O-LED.
  • capacitors in the sealing top i.e. the flex foil. This may enable devices to allow easy multiplexing of a large number of cells.
  • the invention leads to a very compact, i.e. flat construction of the O-LED. Furthermore, the flat construction supports the option to create the O-LED in a flexible and bendable way. This special embodiment will generate really new fields of application of O-LEDs.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Devices (AREA)
US11/996,597 2005-07-27 2006-07-18 Light-emitting device with a sealing integrated driver circuit Expired - Fee Related US7855498B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP05106924 2005-07-27
EP05106924.3 2005-07-27
EP05106924 2005-07-27
PCT/IB2006/052453 WO2007013001A2 (en) 2005-07-27 2006-07-18 Light-emitting device with a sealing integrated driver circuit

Publications (2)

Publication Number Publication Date
US20080231180A1 US20080231180A1 (en) 2008-09-25
US7855498B2 true US7855498B2 (en) 2010-12-21

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Country Status (7)

Country Link
US (1) US7855498B2 (de)
EP (1) EP1911110A2 (de)
JP (1) JP2009503777A (de)
KR (1) KR20080042094A (de)
CN (1) CN101228649B (de)
TW (1) TW200717890A (de)
WO (1) WO2007013001A2 (de)

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US20160122180A1 (en) * 2008-11-19 2016-05-05 Silex Microsystems Ab Method of making a semiconductor device having a functional capping
US11435038B2 (en) 2013-01-25 2022-09-06 Lumileds Llc Lighting assembly and method for manufacturing a lighting assembly

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US20160122180A1 (en) * 2008-11-19 2016-05-05 Silex Microsystems Ab Method of making a semiconductor device having a functional capping
US9620390B2 (en) * 2008-11-19 2017-04-11 Silex Microsystems Ab Method of making a semiconductor device having a functional capping
US20150362136A1 (en) * 2013-01-25 2015-12-17 Koninklijke Philips N.V. Lighting assembly and method for manufacturing a lighting assembly
US10551011B2 (en) * 2013-01-25 2020-02-04 Lumileds Llc Lighting assembly and method for manufacturing a lighting assembly
US11435038B2 (en) 2013-01-25 2022-09-06 Lumileds Llc Lighting assembly and method for manufacturing a lighting assembly
US12007081B2 (en) 2013-01-25 2024-06-11 Lumileds Llc Lighting assembly and method for manufacturing a lighting assembly

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KR20080042094A (ko) 2008-05-14
EP1911110A2 (de) 2008-04-16
WO2007013001A3 (en) 2007-10-18
CN101228649A (zh) 2008-07-23
JP2009503777A (ja) 2009-01-29
US20080231180A1 (en) 2008-09-25
CN101228649B (zh) 2011-09-28
WO2007013001A2 (en) 2007-02-01

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