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US3846734A - Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates - Google Patents

Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates Download PDF

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Publication number
US3846734A
US3846734A US00330158A US33015873A US3846734A US 3846734 A US3846734 A US 3846734A US 00330158 A US00330158 A US 00330158A US 33015873 A US33015873 A US 33015873A US 3846734 A US3846734 A US 3846734A
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US
United States
Prior art keywords
substrate
connector
housing
contact
style
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00330158A
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English (en)
Inventor
W Pauza
E Poltonavage
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Priority to US00330158A priority Critical patent/US3846734A/en
Priority to GB377174A priority patent/GB1455657A/en
Priority to IT19990/74A priority patent/IT1046555B/it
Priority to DE2404669A priority patent/DE2404669A1/de
Priority to BE140492A priority patent/BE810535R/xx
Priority to NL7401424A priority patent/NL7401424A/xx
Priority to ES422926A priority patent/ES422926A2/es
Priority to CA191,745A priority patent/CA1009716A/en
Priority to SE7401521A priority patent/SE391104B/xx
Priority to BR801/74A priority patent/BR7400801D0/pt
Priority to FR7403768A priority patent/FR2216696B2/fr
Priority to JP49015284A priority patent/JPS507065A/ja
Priority to AT93774A priority patent/AT339412B/de
Priority to YU303/74A priority patent/YU35702B/xx
Priority to CH166074A priority patent/CH599694A5/xx
Priority to AR252221A priority patent/AR210567A1/es
Application granted granted Critical
Publication of US3846734A publication Critical patent/US3846734A/en
Priority to HK197/79A priority patent/HK19779A/xx
Priority to JP56183914A priority patent/JPS57111976A/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding

Definitions

  • the connector will be adapted to receive a 1 corresponding one of two other styles of substrates.
  • the present invention broadly relates to multicontact electrical connectors for interconnecting ceramic substrates or the like with external electrical circuitry and more particularly is concerned with a method of, frames useful for, and multi-contact electrical connect'or assemblies which result from, adapting a multicontact electrical connector, of the general type mountable on a circuit board or the like, from being one only of a first connector class capable of electrically interconnecting external circuitry of the circuit board with two rows of spaced apart terminal contact pads disposed respectively on two opposing side surfaces of a leadless ceramic substrate, to one of a second connector class capable of electrically interconnecting the external electrical circuitry of the circuit board with two rows of spaced apart electrical terminal leads disposed respectively on two opposing side surfaces of a leaded ceramic substrate whichleads extend therefrom in a substantially common direction, or to one of a third connector class capable of electrically interconnectingexternal circuitry of the circuit board with
  • substrates which have conductors thereon extending from the integrated circuit device or .chip" to the marginal portions of the substrate.
  • substrates which have conductors thereon extending from the integrated circuit device or .chip" to the marginal portions of the substrate.
  • substrates which have conductors thereon extending from the integrated circuit device or .chip" to the marginal portions of the substrate.
  • ceramicsubstrates or the like packaging integrated circuit devices or the like are commercially available in several stypes of leadless and leaded" substrates.
  • a first style is a leaded ceramic substrate or the like which has two rows of spaced apart terminal leads respectively disposed on two opposite side surfaces of the leaded substrate which leads connect with the conductors extending from the chip being packaged by the substrate and extend from the substrate in a substantially common direction.
  • a second style is a leadless ceramic substrate or the like which has one-row of spaced apart electrical terminal contact pads respectively disposed on one longitudinal edge margin of one of the face surfaces of the leadless substrate which pads connect with the conductors extending from the chip being packaged by the substrate.
  • a third style is another leadless ceramic substrate or the like which has two rows of spaced apart electrical terminal contact pads respectively disposed on two opposite side surfaces of the leadless substrate which pads connect with the conductors extending from the chip being packaged by the substrate.
  • a further connector designed for the aforementioned third style of ceramic substrate or the like, that being another, different leadless substrate, is illustrated and described in a copending U.S. patent application, Ser. No. 186,876, filed Oct. 6, 1971.
  • An improvement upon the connector described in the aforementioned application for Letters Patent is the connector illustrated with the aforementioned third style of substrate, has
  • the principle which broadly characterizes the present invention is the adaptation of a connector from being one of a first connector class intended only for utilization with one style of substrate to one of a second or third connector class available for utilization with a selected one of the other styles of substrates. This principle represents a rather substantial departure fromthe aforementioned common practice of designing a different connector for each of the different styles of substrates.
  • An object of the invention is to substantially eliminate the need for a different multicontact electrical connector for each of the various styles of leadless and leaded ceramic substrates or the like by adapting a connector normally only used in conjunction with a leadless substrate having contact pads on its opposing side surfaces to additionally accommodate a leadless substrate having contact pads on a edge margin of its face surface or a leaded substrate having leads extending from its opposite side surfaces.
  • Another object of the invention is to provide frames to be selectively used in conjunction with the connector to adapt the connector to accommodate the aforementioned additional substrates.
  • a yet another object of the invention is to provide the capability of interchanging between the styles of substrates used with a connector after the connector has been mounted on a circuit board with its multiple contacts soldered to the external electrical circuitry of the board.
  • a further object of the invention is to provide adapting frames which are both insertable into, and removable from, the connector after the connector has been mounted on the circuit board with its multiple contacts soldered to the circuitry of the board.
  • a still further object of the invention is to provide connector assemblies, comprised by the connector in combination with separate frames, into and from which the additional styles of substrates may be readily plugged and unplugged.
  • FIG. 1 is a perspective exploded view showing the multi-contact electrical connector, originally illustrated and described in our aforementioned copending patent application, Ser. No. 32l,l06, filed Jan. 4, 1973, which forms the preferred embodiment of the connector to be adapted to accommodate other styles of ceramic substrates according to the principle of the present invention;
  • FIG. 2 is a perspective view of the connector of FIG. 1 showing the style of leadless substrate, for which the connector was originally designed, supported in the connector and the connector mounted on the circuit board;
  • FIG. 3 is a cross-sectional view taken along line 3-3- of FIG. 2;
  • FIG. 4 is a cross-sectional view similar to that of FIG. 3 but showing the substrate aligned with the connector prior to insertion of the substrate into the connector;
  • FIG. 5 is a perspective exploded view showing the connector mounted on the circuit board and aligned with a frame for adapting the connector to accommodate another style of substrate, that being a leaded substrate, which is illustrated in the view in alignment with the frame;
  • FIG. 6 is a perspective view of the frame assembled to the connector with the leaded substrate plugged into the assembled connector and frame;
  • FIG. 7 is a cross-sectional view taken along line 77 of FIG. 6;
  • FIG. 8 is a cross-sectional view similar to that of FIG. 7 but showing the leaded substrate aligned with the assembled connector and frame prior to plugging of the substrate into the assembly;
  • FIG. 9 is a perspective exploded view'showing the connector mounted on the circuit board and aligned with another frame for adapting the connector to accommodate a different. style of leadless substrates which are illustratedin the view' in alignment with the frame;
  • FIG. 10 is a perspective view of the frame of FIG. 9 assembled to the connector with both of the leadless substrates of FIG. 9 plugged into the assembled connector and frame;
  • FIG. 11 is a cross-sectional view of the assembled connector and frame with one of the leadless substrates plugged therein taken along line 11-11 of FIG. 10, further showing the other of the same style of-leadless substrates in the process'of being plugged into the assembly.
  • the connector 10 forms the preferred embodiment of the connector to be adapted to accommodate other styles of ceramic substrates or the like according to the principle of the present invention.
  • a substantial portion of the description of the connector vl0 contained in our aforementioned patent application will be repeated hereinafter in order that theprinciple of the present in vention and its practical applications will be readily understood upon a reading of the instant application.
  • the connector is generally comprised by an insulating housing 12 and a plurality of electrical contacts 14 arranged in two opposing rows in the housing 12.
  • the connector 10 was originally designed to serve the function of electrically interconnecting terminal contact pads 16 of a ceramic substrate 18 supported within the housing 12 between the rows of contacts 14 with external electrical circuitry such as the conductors 20 on one side of a printed circuit board 22 as shown in F IG. 3.
  • the substrate 18, referred to hereinbefore as the third style of ceramic substrate comprises a generally rectangular ceramic body 24 having parallel faces 26, 28, side surfaces 30, 32, and end surfaces 34, 36. Conductors (not shown) contained in theceramic body 24 extend from the terminal contact pads 16 on the side surfaces 30, 32 of the third style of substrate 18.
  • any suitable dielectric material such as polycarbonate or a glass filled nylon.
  • the housing 12 is generally rectangular having a base wall 38 at a forward side 40 ofthe housing 12 and a pair of opposing, elongated, parallelly-aligned side walls 42, 44 and apair of opposing, relatively short, parallellyaligned end walls 46, 48 extending from the base wall 38 toward a rearward side 50 of the housing 12.
  • the housing 12 is mountable on the circuitboard 22 at an exterior surface 52 of the base wall 38 of the housing 12.
  • the base wall 38 of the housing 12 has two large openings 54 extending therethrough to facilitate dissipation of the heat generated within the housing 12 and to minimize the amount of material in the housing 12.
  • a rwo of spaced apart contact-receiving cavities 68 extend through each of the side walls 42, 44 of the housing 12 from the forward side 40 to the rearward side of the housing 12.
  • the contact-receiving cavities 68 open into the central cavity 56 at the interior surfaces 60, 62 of the side walls 42, 44.
  • a row of spaced apart recesses 76 is formed in the interior surface 58 of the base wall 38 of the housing 12 alongeach of a pair of opposing longitudinal edge portions 78 of the base'wall 38 which edge portions 78 are respectively located adjacent to the interior surfaces 60, 62 of the side walls 42, 44 of the housing 12.
  • Each of the recesses 76 correspond to, and open into, one of the contact-receiving cavities 68.
  • Each of the recesses 76 have a floor 80 at a location therein which is remote from the interior surface 58 of the base wall 38 of the housing 12.
  • each of the recesses 76 have a shoulder 82 at a location therein which is remote from the corresponding contact-receiving cavity 68 and which adjoins the floor 80 of the recess 76 and faces in a direction generally toward the corresponding cavity 68.
  • the connector 10 is further comprised, as stated hereinbefore, by a plurality of electrical contacts 14 arranged in two opposing rows in the housing 12.
  • Each of the contacts 14 may be fabricated by a conventional stamping and forming operation from any suitable metal, such as pre-tin plated stainless steel.
  • the contact 14 is basically comprised by a flat, central post portion 86, a resiliently flexible spring portion 88 which extends outwardly fromone end of the flat post portion 86, and a terminal portion which extends from the opposite end of the flat post portion 86.
  • One contact 14 is retained in each of the contactreceiving cavities 68 of the housing 12.
  • the terminal portion 100 is capable of electrical and mechanical connection to the conductor 20 of the circuit board 22 when the housing 12 is mounted on the board 22preferably by insertion of the terminal portion 100 through an aperture 102 formed through the circuit board 22.
  • the preferred electrical and mechanical ble spring portion 88 extends from its respective cavity 86 proximate the rearward side 50 of the housing 12 in an overlying relationship to the plane of the interior surface 58 of the base wall 38 and in a direction generally toward the corresponding one of the recesses 76 formed in the interior surface 58 of the base wall 38.
  • the spring portion 88 is partially flexed or deflected in a direction generally toward its respective cavity 86 so that a terminating free end 94 of the spring portion 88 will extend into the corresponding one recess 76 upon continued insertion of the contact 14.
  • the free end 94 of the spring portion 88 Upon extension into the one recess 76, the free end 94 of the spring portion 88 is designed to abut the shoulder 82 of the one recess 76 at a location along the shoulder 82 which is spaced from the floor 80 of the one recess 76 to thereby provide'the spring portion 88 of the contact 14 in a pro-loaded condition and also to avoid any tendency for the free end 94 to drag on the floor 80 of the recess 76 upon further deflection of the spring portion 88 toward its respective cavity 86.
  • each contact 14 has a camming surface 106 thereon located remote from the free end 94 of the spring portion 88.
  • the leading opposing longitudinal edges of the third style of substrate 18 engage the camming surfaces 106 during insertion of the substrate 18 into the housing 12 and cause further flexing or deflection of each of the spring portions 88 toward its respective-one of the contact-receiving cavities 86 until each of the spring portions 88 has deflected to its respective desired fully loaded condition atwhich time the third style of substrate 18 is positioned upon the interior surface 58 of the base wall 38 between the rows of contacts 14.
  • each contact 14 has a contact surface 108 thereon located adjacent to the free end 94 of the spring portion 88.
  • I contact surface 108 of thespring portion 88 is disposed adjacent to, and in an'overlying relationship to the plane of, the interior surface 58 of thebase wall 38 and in a facing relationship toward the opposing row of contacts 14.
  • the contact surface 108 is disposed generally perpendicular to the plane ofthe interior surface 58.
  • the contact surface 108 preferably is onan embossment on the spring porthe housing 12 between the opposing rows of contacts 14 with the contact pads 16 of the third style of substrate 18 respectively electrically engaging the contact surfaces 108 on the contacts 14 in the two opposing rows of contacts 14, thespring portion 88 of 'each of the contacts 14 will be additionally flexed or deflected toward its corresponding cavity 68 so as to displace the free end 94 of the spring portion 88 of each contact 14 away from the shoulder 82 of the corresponding recess 76. With the free end 94 of the spring portion 88 so displaced from the shoulder 82 of the recess 76 and from the floor 80 of the recess 76, as shown in FIG.
  • a desired predetermined contacting pressure is achieved between the contact surface 108 and the contact pad- 16 'by substantially normal or perpendicular forces imwalls 46, 48.
  • These slots 112 provide access by a convention prying'tool (not shown) to the face 28 of the third style of substrate 18 on which face 28 the substratefl18 is mounted on the interior surface 58 of the base wall 38 in orderto facilitate one manner of removal of substrate. 18 from the housing 12.
  • a strap 116 is provided for assembly to the housing 12 in an overlying relationship to the third styleof substrate 18 when the substrate 18 is supported on the interior surface 58 of the base wall 38.
  • An interengaging means in the form of a slot 118 is disposed on each of the end walls 46, 48of the housing 12 for securing the strap 116 to the housing 12 as best shown in FIG. 2.
  • the slots 118 defined shoulders 119 respectively in the interior surfaces 64, 64 of the endwalls 46,48 which face toward the plane of the interior surface 58 of the base wall .38 and engage with opposite end tabs 122 of the strap 116 to secure it to the housing 12 with the substrate 18 therebetween.
  • the contact spring portion 88 provide adequate retention of the third style of substrate 18 therebetween under most conditions, the strap 116 is an optional feature of the connector which may be benefiillustrated a slot,
  • the circuit board 22 on which the connector 10 and the third style of substrate 18 are mounted is disposed in a verticalposition or an inverted position instead of the horizontal position as shown in FIG. 2.
  • the strap 116 may be of benefit when the connector 10 is used in an environment wherein severe vibrations may be encountered. 8 t
  • the strap 116 has a central recess 120 on its forward facing surface into which a prying tool or the like (not shown) may be inserted in order to flex the strap 116 and thereby disengage opposing end tabs-122 of the strap 116 from shoulders 119 of the slots-118 of the end walls 46, 48 of the housing 12 and thereby achieve disassembly of the strap 116 from the housing 12.
  • the connector can be serviced from its rearward side; that is it canbe assembled to the board and the third style of ceramic substrate 18 can be plugged into, and unplugged from, the connector 10 from its rearward side.
  • the principle which broadly characterizesv the present invention is the adaptation of a connector from being one of a first connector class intended only forutilization with one style of substrates to one of a second or third connector class available for utilization with a selected one of other styles of .sub-
  • FIG. 5 through 8 and 9 through 11 respectively illustrate two embodiments of the present invention which represent physical applications of the aforemenone style of a ceramic substrate or the like that being I the leadless substrate 18 referred to hereinbefore as the third style of ceramic substrate.
  • the connector 10 may be adapted toaccommodate a leaded ceramic substrate or the like, referred to herein-before as the first style of ceramic substrate-which is shown at 126 in FIG. 5, by providing the frame l24'which is designed generally rectangular ceramic body 128 having parallel faces 130, 132, side surfaces 134, 136,. and end surfaces 138, 140.
  • Conductors '(not shown) contained in the ceramic body 128 extend from the electrical terminal leads 142 on the side surfaces 134, 136 of the first style of substrate 126.
  • the leads 142 extend from the substrate 126 in a substantially common direction which is generallyparallel to the side surfaces 134, 136 and perpendicular to the faces 130, 132.
  • the frame 124 may be manufactured by conventional injection molding methods from any suitable dielectric, insulating material, such'as polycarbonate or a glass filled nylon.
  • the frame 124 is generally rectangular having a pair .of opposing, elongated,parallelly aligned side walls 144, 146, a pair of opposing, relatively short, parallellyaligned end walls 148, 150, and severalspaced apart intermediate walls, 152 which are parallelly-aligned with each other and with the end walls 148,150 and interconnect the sidewalls 144, 146. This arrangement.
  • Each of the slots 170 have an interior surface portion 176 facing in a general direction toward the contact surface 108 on the contact spring portion 88 being accommodated in each slot 170 when the for- 7 Ward end 158 of the frame body 154 is received and 154 at the rearward end 160 thereof.
  • Each of the lateral portions 162, 164 overlie one of the two opposing rows of contacts 14 and one of the two rows of contactreceiving cavities 68 ofthe side walls 42, 44 of the housing 12 at the rearward side 50 thereof when the forward end 158 of the body 154 is received and supported in the housing central cavity 56, as shown in FIG. 8.
  • a plurality of spaced apart apertures 166 are arranged in two rows and defined respectively in the two side walls 144, 146 of the body 154 at the rearward end 160 thereof adjacent respectively to the two opposing lateral portions 162, 164 of the frame body 154.
  • the mounting surface 168 is spaced from the rearward side 50 of the housing 12 when the forward end 158 of the body 154 is received and supported in the housing cavity 56, as shown in FIG. 8.
  • the mounting surface 168 on the frame body 154 will mount the third style of substrate 126 thereon, as shown in FIG. 7, in a spaced relationship to the rearward side 50 of the housing 12, and generally parallel, spaced relationship to the circuit board 22, after the housing 12 is mounted on the board 22 and the forward end 158 of the frame body 154 is received and supported in the housing cavity 56.
  • a plurality of spaced apart slots 170 are arranged in two rows and defined respectively in the exterior surfaces 172, 174 of the side walls 144, 146 of the frame body- 154. As shown in FIG. 8, the exterior surfaces 172, 174 ofthe side walls 144, 146 are disposed respectively adjacent to the two rows of contacts 14 and the interior surfaces 60, 62 of the side walls 42, 44 of the housing 12 when the forward end 158 of the body 154 is received and supported in the housing cavity 56. Each of the slots 170 is aligned with one of the apertures 166 at the rearward end 160 of the body 154 and extends therefrom to the forward end 158 of the body 154.
  • Each of the slots 170 is capable of accommodating therein one of the contact spring portions 88 with the one aperture corresponding to each slot 170 aligned with the one contact spring portion 88 being accommodated by each slot 170 when the forward end 158 of the supported in the housing cavity 56.
  • the portion of the forward end 158 of the frame body 154 between the interior surface portions 176 of the two rows of slots 170 is generally disposed between the rows of the terminal leads 142 of the first style of substrate 126 with each of the interior surface portions 176 of the slots 170 accommodating therealong one of the terminal leads 142 and supporting the one lead 142 in electrical and mechanical contact with the corresponding one contact surface 108 of the contact spring portion 88 being accommodated in each slot 170 when the first style of substrate 126 is mounted on the mounting surface 168 of the rearward end of the frame body 154 after the forward end 158 of the body 154 is received and supported in the housing cavity 56.
  • each slot supports the lead 142 as it is being inserted therealong and prevents deflection of the lead 142 away from the respective contact spring portion 88. Therefore, as the lead engages the contact surface 108 of the contact spring portion 88, the contact spring portion 88 must flex or deflect in a general direction away from the interior surface portion 176 of the slot 170 in order to allow the lead 142 to pass therebetween since the lead 142 is not allowed to deflect and the contact surface 108 and the interior surface portion 176 are initially either disposed subend walls 148, 150 of the frame body 154 (only the lug 178 on end wall 148 is shown) at the forward end 158 thereof and projects outwardly therefrom.
  • the exterior surfaces 180, 182 of the end walls 148, 150 of the body 154 are located proximate to the interior surfaces 66, 64 of the end walls 48, 46 of the housing 12, with the lugs 178 respectively engaging the shoulders 119 in the interior surfaces 64, 66 of the end walls 46, 48 of the housing 12, when the forward end 158 of the body 154 is received and supported in the housing cavity 56 as shown in FIG. 6.
  • the body 154 is retained in the housing cavity 56.
  • the material of the housing 12, while forming a substantially rigid structure, is still sufflciently resiliently deformable to allow outward bowing of the mid-sections of the end walls 46, 48 of the housing 12 in order to allow the lugs 178 of the frame 124 topass by the end walls 46, 48 to their desired posi-- tion under the shoulders 119.
  • the edge of a thin knife or other suitable tool may be used to again bow the end walls 46, 48 outwardly enough to allow the lugs 178 to pass by the end walls 46, 48 during retraction of the frame 124 from the housing 12.
  • the connector. 10 is now adapted to receive the first style of leaded substrate 126.
  • the first style of leaded substrate 126 is plugged" into the now adapted connector 10 by inl1 serting the leads 142 of the two rows thereof respectively through the apertures 166 in the two rows thereof and along the interior surface portions 176 of j the two rows of slots 170 until the first style of substrate 126 is mounted on.
  • the leads 142 engage the contact surfaces 108 of the contactsl4 and thereby cause the pre-loaded contact spring portions 88 of the contacts 14 to become additionally flexedor deflected toward their respective cavities 68, as-shwon in FIG. 7.
  • the desired predetermined contacting pressure is thereby achieved between the leads 142 and the contact surfaces 108 by the substantially normal or perpendicular forces imposed on the leads 142 by the additionally'flexed and loaded spring portions 88 to pro more particularly toFIG. 9, there is shown at 180 another adapter frame forming another embodiment of the present invention.
  • the connector may also be adapted to accommodate preferably two of another leadless ceramic substrate or the like, referred'to here inbefore as the second style of ceramic'substrate, which is shown at 182 in FIG. 9, by providing the frame 180 which is designed to be received within the connector vl0 in place of the third style of substrate 18 and by inserting the frame 180 therein, preferably, prior to the supporting ofthe second style of substrate 182 therein.
  • the second style of ceramic substrate 182 comprises a generally rectangular ceramic body 184 having paral: lel faces 186, 188,-side surfaces 190, 192, and end surfaces 194, 196i Conductors (not shown) contained in the ceramic body 184 extend from spaced apart .
  • termi- I forward end 216 of the frame body 212 is so received by, and supported in, the. housing 12, as more clearly shown in FIG. 11, the rearward end 218 of the'body 212 extends from the housing central cavity 56.
  • Ribs 220 interconnect the two side walls 202, 204 at v the forward end 216 of the frame body 212 and project therefrom.
  • the ribs are received in the openings 54 of the base wall 38 of the housing 12 and engaged with opposing side portions 222 of the openings 54 to thereby center the frame body 212 between the rows of contact surfaces 108, as clearly shown in FIG. 11, when the forward end 216 of the frame body 212 is received and supported in the housing central cavity 56.
  • Guide structures 224 are formed on the rearward end 218 of the frame body 212 at each of four corners 226 defined by the respective intersections between the side walls 202, 204 and the end walls 206, 208.
  • Each of the guide structures 224 have a right-angled shape and project outwardly from the side walls 202, 204.
  • each of the guide structures 224 seats on respective corners 228 defined by the intersections between therespective side walls 42, 44and end walls 46, 48 of the housing 12, as shown in FIG. 10.
  • the guide structures 224 may be viewed as two pairs respectively projecting from the side walls 202, 204.
  • First interior surface portions 230 of one of theitwo pairs of guide structures 224 are aligned parallel to, and generally face toward, each other as are the first interior surfaceportions 230 of the other of the two pairs of guide structures 224.
  • Second interior surface portions 232 of one of the two pairs of guide structures 224 are aligned in the same plane as are the second interior surface portions'232 ofthe nalcontactpads198arranged, in arow thereof and disposed on alongitudinal edge margin 200 of one face surface 186 of the second style of substrate 182.
  • the frame 180 maybe manufactured by conventional injection molding methodsfrom any suitable dielectric, insulating materiahsuchas polycarbonate or a glass filled nylon. I
  • the frame 180 is generally rectangular having a pair of opposing, elongated, parallelly-alignedside walls 202, 204, apa'ir of opposing, relatively short, parallellyother of the two pairs of guidestructures 224. F urther,
  • the second interior surface portions 230 of each of the two pairs of guide structures generally face toward their respectively adjacent one of the side walls 202, 204.
  • the first interior surface portions 230 of each respective pair of guide structures are spaced frome'ach other through a distance slightly greater than the length of the secondstyle of substrate 182 whereby each of I the pairs ofguide structures is capable of receiving one of the substrates 182 therebetween.
  • Each of the side walls 202, 2 04 of theframe body- 212 preferably have a plurality of spaced apart rails 234 aligned-end walls 206, 208, and severalspaced apart intermediate walls 210 which are paralleIly-aligned witheachother'and withtheend walls 206, 208 and interconnect the' sidejwalls 202, 204:1" his arrangement I of the side walls 202, 204, end walls 206,208, and interm'ed'iatewalls 210jtogeth'er defines a body212 of the frame 180 havingifive large openings214 therethrough' v to facilitatcidissipation of the heat generated within the I connector 10 andftominimizeathe amount of material in the frame i a
  • the body'212 of the frame' 'l80 has, in general, a forend 216 is'capable ofbeing received in the central cavity 56 ofthe-housing 12 betweenflthe rows of contact surfaces 108of'the contacts 14 retained in the housing
  • Each of the rails 234 have an exterior surface portion 236.
  • the exterior surface portions 236 of the respective rails on one of theside walls202, 204 are aligned in the same plane as-arelthe exterior surface portions 2360f the respective rails 234 on the other of the side walls 202, 204.
  • the pre-loaded contact spring portions 88 of one of the rows ofeontacts 14 extends into the forward end of the slot 238 with the contact surfaces 108 on each of the contact spring portions 88 in that row thereof preferably being spaced from the plane of the exterior surface portions 236 of the rails 234 on the one of the side walls 202, 204 adjacent to that row of contact spring portions 88 through a distance slightly less than the thickness of the second style of substrate 182.
  • FIG. 11 depicts the frame 180 received and supported in the housing cavity 56 with one of the substrates 182 fully inserted into the frame 180 to a desired final position.
  • the substrate 182 at its side surface 190 is supported on the interior surface 58 of the base wall 38'of the housing 12 between the exterior surface portions 236 of the rails 234 on the side wall 204 of the frame body 212 and the corresponding one of the rows of contact surfaces 108 in a generally perpendicular relationship to the plane of the interior surface 58 of the base wall 38 of the housing 12 and in a generally perpendicular, spaced relationship to the circuit board 22.
  • the leading edge margin of the substrate 182 engages the contact spring portions 88 and flexes or deflects them in a general direction toward their respective contact-receiving cavities until the substrate 182 is seated on the interior surface 58 of the housing base wall 38.
  • the desired predetermined contacting pressure is thereby achieved between the contact pads 198 and the contact surfaces 108 by the substantially normal or perpendicular force-s imposed the contact pads 198 by the additionally flexed and loaded spring portions 88 to provide a good electrical connection therebetween having adesired low contact resistance characteristic.
  • FIG. 11 illustrates one of the substrates 182 in the process of being plugged into the assembly (by reversing the arrow, the substrate 182 may be viewed in the process of being unplugged from the assembly).
  • each of theside walls 202, 204 is partially discontinuous at a midsection thereof.
  • a resiliently flexible latch arm 240 is formed on each of the side walls 202, 204 and extends through the discontinuous mid-section of each side wall and projects rearwardly from the rearward end 218 of the frame body 212.
  • Each of the latch arms 240 has latching shoulder 242 projecting outwardly therefrom and facing toward the forward end 216 of the frame body 216. As illustrated in FIG. 11, one latch arm 240 may be flexed toward the other when a substrate 182 is inserted into the slot 238 of the frame 180 adjacent thereto.
  • the latch arm 240 is released and returns to its original unflexed condition, as illustrated in the left-hand portion of F IG. 11, to thereby positively lock the sub- 14 strate in the desired rested position within the assembly.
  • a ramped lug 244 is'disposed on each of the exterior surfaces 246, 248 of the end walls 206, 208 of the frame body 212 (only the lug 244 on end wall 206 is shown) at the forward end 216.
  • the exterior surfaces 246, 248 of the end walls 206, 208 of the body 212 are located proximate to the interior surfaces 66, 64 of the end walls 48, 46 of the housing 12, with the lugs 244 respectively engaging the shoulders 119 in the interior surfaces 64, 66 of the end walls 46, 48 of the housing 12, when the forward end 216 of the frame body 212 is received and supported in the housing cavity 56 as shown in FIG. 10.
  • the body 212 is retained in the housing cavity 56.
  • the material of the housing 12 while forming a substantially rigid structure, is still sufficiently resiliently deformable to allow outward bowing of mid-sections of the end walls 46, 48 of the housing 12 in order to allow the lugs 244 of the frame to pass by the end walls 46, 48 to their desired position under the shoulders 119.
  • the edge ofa thin knife or other suitable tool may be used to again bow the end walls 46, 48 outwardly enough to allow the lugs 244 to pass by the end walls 46, 48 during retraction of the frame 180 from the housing 12.
  • a printed circuit board having an electrical circuit thereon,,apertures in'said board, a ceramic substrate having a plurality of electrical contacts exposed to one'side of said substrate, said contacts on the substrate comprising electrical leads extending at an angle to the plane of the substrate, and a housing for connecting said substrate to said board, said housing comprising:
  • electrically conductive spring members positioned in said parallel sides to accomodate the ceramic substrate and effect an electrical connection withthe contacts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
US00330158A 1973-02-06 1973-02-06 Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates Expired - Lifetime US3846734A (en)

Priority Applications (18)

Application Number Priority Date Filing Date Title
US00330158A US3846734A (en) 1973-02-06 1973-02-06 Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
GB377174A GB1455657A (en) 1973-02-06 1974-01-28 Electrical connector assembly
IT19990/74A IT1046555B (it) 1973-02-06 1974-01-30 Connettore per sottostrato
DE2404669A DE2404669A1 (de) 1973-02-06 1974-01-31 Elektrischer stecker
NL7401424A NL7401424A (es) 1973-02-06 1974-02-01
BE140492A BE810535R (fr) 1973-02-06 1974-02-01 Connecteur
BR801/74A BR7400801D0 (pt) 1973-02-06 1974-02-05 Conector eletrico
SE7401521A SE391104B (sv) 1973-02-06 1974-02-05 Elektrisk anslutningsenhet
ES422926A ES422926A2 (es) 1973-02-06 1974-02-05 Un dispositivo conectador electrico.
FR7403768A FR2216696B2 (es) 1973-02-06 1974-02-05
CA191,745A CA1009716A (en) 1973-02-06 1974-02-05 Electrical connector assembly for substrates
AT93774A AT339412B (de) 1973-02-06 1974-02-06 Elektrischer verbinder
JP49015284A JPS507065A (es) 1973-02-06 1974-02-06
YU303/74A YU35702B (en) 1973-02-06 1974-02-06 Arrangement of an electric connector
CH166074A CH599694A5 (es) 1973-02-06 1974-02-06
AR252221A AR210567A1 (es) 1973-02-06 1974-02-06 Un dispositivo conector electrico
HK197/79A HK19779A (en) 1973-02-06 1979-03-29 Electrical conector assembly
JP56183914A JPS57111976A (en) 1973-02-06 1981-11-18 Electric connector assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00330158A US3846734A (en) 1973-02-06 1973-02-06 Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates

Publications (1)

Publication Number Publication Date
US3846734A true US3846734A (en) 1974-11-05

Family

ID=23288547

Family Applications (1)

Application Number Title Priority Date Filing Date
US00330158A Expired - Lifetime US3846734A (en) 1973-02-06 1973-02-06 Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates

Country Status (17)

Country Link
US (1) US3846734A (es)
JP (2) JPS507065A (es)
AR (1) AR210567A1 (es)
AT (1) AT339412B (es)
BE (1) BE810535R (es)
BR (1) BR7400801D0 (es)
CA (1) CA1009716A (es)
CH (1) CH599694A5 (es)
DE (1) DE2404669A1 (es)
ES (1) ES422926A2 (es)
FR (1) FR2216696B2 (es)
GB (1) GB1455657A (es)
HK (1) HK19779A (es)
IT (1) IT1046555B (es)
NL (1) NL7401424A (es)
SE (1) SE391104B (es)
YU (1) YU35702B (es)

Cited By (43)

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US3949276A (en) * 1974-02-15 1976-04-06 Elmeg Elektro-Mechanik Gmbh Plug-in type relay
US3993381A (en) * 1974-11-05 1976-11-23 Stephen Horbach Intermediate connector
US4037270A (en) * 1976-05-24 1977-07-19 Control Data Corporation Circuit packaging and cooling
FR2375800A1 (fr) * 1976-12-27 1978-07-21 Amp Inc Instrument electrique tel qu'une montre et son procede de fabrication
US4147889A (en) * 1978-02-28 1979-04-03 Amp Incorporated Chip carrier
US4349238A (en) * 1980-11-05 1982-09-14 Amp Incorporated Integrated circuit package connector
US4376560A (en) * 1980-12-15 1983-03-15 Amp Incorporated Socket for a ceramic chip carrier
US4406508A (en) * 1981-07-02 1983-09-27 Thomas & Betts Corporation Dual-in-line package assembly
US4417095A (en) * 1981-10-23 1983-11-22 Northern Telecom Limited Support member for electronic devices
US4494095A (en) * 1981-11-20 1985-01-15 Alps Electric Co., Ltd. High frequency circuit shielding structure having tuning coils double shielded
US4504887A (en) * 1983-04-01 1985-03-12 Amp Incorporated Leadless integrated circuit package housing having means for contact replacement
US4539621A (en) * 1982-12-20 1985-09-03 Motorola, Inc. Integrated circuit carrier and assembly
WO1985005006A1 (en) * 1984-04-23 1985-11-07 Amp Incorporated Dual in-line package carrier assembly
US4569000A (en) * 1981-11-13 1986-02-04 Alps Electric Co., Ltd. Mounting structure for electric elements
US4737884A (en) * 1982-05-26 1988-04-12 Fujitsu Limited Semiconductor device module
US4814857A (en) * 1987-02-25 1989-03-21 International Business Machines Corporation Circuit module with separate signal and power connectors
USRE33268E (en) * 1984-02-27 1990-07-17 Amp Incorporated Chip carrier socket having improved contact terminals
US4943891A (en) * 1988-09-28 1990-07-24 Alan Ouellette Microelement and base assembly
US4976624A (en) * 1989-01-19 1990-12-11 Japan Aviation Electronics Industry Limited IC socket
US5138521A (en) * 1985-04-05 1992-08-11 Omron Tateisi Electronics Co. Electronic component assembly with direct mounting for proper and effective cooling
US5373230A (en) * 1991-06-17 1994-12-13 Itt Corporation Test clip for five pitch IC
US5616886A (en) * 1995-06-05 1997-04-01 Motorola Wirebondless module package
US5898128A (en) * 1996-09-11 1999-04-27 Motorola, Inc. Electronic component
US5982635A (en) * 1996-10-23 1999-11-09 Concept Manufacturing, Incorporated Signal adaptor board for a pin grid array
US6576989B1 (en) * 2000-11-28 2003-06-10 National Semiconductor Corporation Locking of mold compound to conductive substrate panels
US20080156325A1 (en) * 2006-12-27 2008-07-03 Charles Galauner Heating element connector assembly with insert molded strips
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
US20160141131A1 (en) * 2013-08-30 2016-05-19 Yazaki Corporation Connection structure of electronic component and terminal metal fittings
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module

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JPS5384038A (en) * 1976-12-24 1978-07-25 Nippon Chem Ind Co Ltd:The Adhesive composition
DE2952599C2 (de) * 1979-01-05 1984-02-02 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka Vorrichtung zum lösbaren Anschluß eines elektrischen Bauteils an eine Leiterplatine
US4755146A (en) * 1987-06-04 1988-07-05 Molex Incorporated Heat-dissipating socket connector for leaded modules

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US3345541A (en) * 1966-02-21 1967-10-03 Amp Inc Mounting and connecting means for circuit devices
US3409861A (en) * 1967-09-28 1968-11-05 Barnes Corp Integrated circuit carrier
US3475657A (en) * 1967-01-03 1969-10-28 Litton Systems Inc Mounting of electronic components on baseboard or panel
US3605075A (en) * 1968-07-01 1971-09-14 Martin Alex Stofkooper Modular electrical system
US3710299A (en) * 1971-06-01 1973-01-09 Aries Electronics Low profile socket for integrated circuit pack
US3753211A (en) * 1971-10-06 1973-08-14 Amp Inc Connecting means for ceramic substrate package
US3754203A (en) * 1971-07-01 1973-08-21 Amp Inc Substrate connector and terminal therefore

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GB1152765A (en) * 1967-01-24 1969-05-21 Amp Inc An Electrical Circuit Assembly
CA921613A (en) * 1968-05-29 1973-02-20 E. Henschen Homer Printed circuit board guides
US3584189A (en) * 1968-08-13 1971-06-08 Texas Instruments Inc Temperature stabilizer for integrated circuits
GB1371030A (en) * 1970-08-18 1974-10-23 Sdc Products Electronics Ltd Plug and socket connectors and sockets therefor

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US3345541A (en) * 1966-02-21 1967-10-03 Amp Inc Mounting and connecting means for circuit devices
US3475657A (en) * 1967-01-03 1969-10-28 Litton Systems Inc Mounting of electronic components on baseboard or panel
US3409861A (en) * 1967-09-28 1968-11-05 Barnes Corp Integrated circuit carrier
US3605075A (en) * 1968-07-01 1971-09-14 Martin Alex Stofkooper Modular electrical system
US3710299A (en) * 1971-06-01 1973-01-09 Aries Electronics Low profile socket for integrated circuit pack
US3754203A (en) * 1971-07-01 1973-08-21 Amp Inc Substrate connector and terminal therefore
US3753211A (en) * 1971-10-06 1973-08-14 Amp Inc Connecting means for ceramic substrate package

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3949276A (en) * 1974-02-15 1976-04-06 Elmeg Elektro-Mechanik Gmbh Plug-in type relay
US3993381A (en) * 1974-11-05 1976-11-23 Stephen Horbach Intermediate connector
US4037270A (en) * 1976-05-24 1977-07-19 Control Data Corporation Circuit packaging and cooling
FR2375800A1 (fr) * 1976-12-27 1978-07-21 Amp Inc Instrument electrique tel qu'une montre et son procede de fabrication
US4142287A (en) * 1976-12-27 1979-03-06 Amp Incorporated Electrical devices such as watches and method of construction thereof
US4147889A (en) * 1978-02-28 1979-04-03 Amp Incorporated Chip carrier
US4349238A (en) * 1980-11-05 1982-09-14 Amp Incorporated Integrated circuit package connector
US4376560A (en) * 1980-12-15 1983-03-15 Amp Incorporated Socket for a ceramic chip carrier
US4406508A (en) * 1981-07-02 1983-09-27 Thomas & Betts Corporation Dual-in-line package assembly
US4417095A (en) * 1981-10-23 1983-11-22 Northern Telecom Limited Support member for electronic devices
US4569000A (en) * 1981-11-13 1986-02-04 Alps Electric Co., Ltd. Mounting structure for electric elements
US4494095A (en) * 1981-11-20 1985-01-15 Alps Electric Co., Ltd. High frequency circuit shielding structure having tuning coils double shielded
US4737884A (en) * 1982-05-26 1988-04-12 Fujitsu Limited Semiconductor device module
US4539621A (en) * 1982-12-20 1985-09-03 Motorola, Inc. Integrated circuit carrier and assembly
US4504887A (en) * 1983-04-01 1985-03-12 Amp Incorporated Leadless integrated circuit package housing having means for contact replacement
USRE33268E (en) * 1984-02-27 1990-07-17 Amp Incorporated Chip carrier socket having improved contact terminals
WO1985005006A1 (en) * 1984-04-23 1985-11-07 Amp Incorporated Dual in-line package carrier assembly
US5138521A (en) * 1985-04-05 1992-08-11 Omron Tateisi Electronics Co. Electronic component assembly with direct mounting for proper and effective cooling
US4814857A (en) * 1987-02-25 1989-03-21 International Business Machines Corporation Circuit module with separate signal and power connectors
US4943891A (en) * 1988-09-28 1990-07-24 Alan Ouellette Microelement and base assembly
US4976624A (en) * 1989-01-19 1990-12-11 Japan Aviation Electronics Industry Limited IC socket
US5373230A (en) * 1991-06-17 1994-12-13 Itt Corporation Test clip for five pitch IC
US5616886A (en) * 1995-06-05 1997-04-01 Motorola Wirebondless module package
US5898128A (en) * 1996-09-11 1999-04-27 Motorola, Inc. Electronic component
US5982635A (en) * 1996-10-23 1999-11-09 Concept Manufacturing, Incorporated Signal adaptor board for a pin grid array
US6576989B1 (en) * 2000-11-28 2003-06-10 National Semiconductor Corporation Locking of mold compound to conductive substrate panels
US20080156325A1 (en) * 2006-12-27 2008-07-03 Charles Galauner Heating element connector assembly with insert molded strips
US7513781B2 (en) * 2006-12-27 2009-04-07 Molex Incorporated Heating element connector assembly with insert molded strips
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
US20160141131A1 (en) * 2013-08-30 2016-05-19 Yazaki Corporation Connection structure of electronic component and terminal metal fittings
US9520255B2 (en) * 2013-08-30 2016-12-13 Yazaki Corporation Connection structure of electronic component and terminal metal fittings
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module

Also Published As

Publication number Publication date
BR7400801D0 (pt) 1974-11-19
DE2404669A1 (de) 1974-08-15
FR2216696B2 (es) 1977-09-16
IT1046555B (it) 1980-07-31
HK19779A (en) 1979-04-06
SE391104B (sv) 1977-01-31
AR210567A1 (es) 1977-08-31
JPS57111976A (en) 1982-07-12
AT339412B (de) 1977-10-25
NL7401424A (es) 1974-08-08
JPS507065A (es) 1975-01-24
FR2216696A2 (es) 1974-08-30
ES422926A2 (es) 1977-07-01
CA1009716A (en) 1977-05-03
ATA93774A (de) 1977-02-15
BE810535R (fr) 1974-08-01
GB1455657A (en) 1976-11-17
CH599694A5 (es) 1978-05-31
YU35702B (en) 1981-04-30
YU30374A (en) 1980-10-31

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