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US20190214784A1 - Electrical element mounting package, array package, and electrical device - Google Patents

Electrical element mounting package, array package, and electrical device Download PDF

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Publication number
US20190214784A1
US20190214784A1 US16/323,803 US201716323803A US2019214784A1 US 20190214784 A1 US20190214784 A1 US 20190214784A1 US 201716323803 A US201716323803 A US 201716323803A US 2019214784 A1 US2019214784 A1 US 2019214784A1
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US
United States
Prior art keywords
base
element mounting
substrate
light emitting
mounting package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/323,803
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English (en)
Inventor
Sentarou Yamamoto
Youji Furukubo
Masanori Okamoto
Toshifumi Higashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
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Filing date
Publication date
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Assigned to KYOCERA CORPORATION reassignment KYOCERA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIGASHI, TOSHIFUMI, FURUKUBO, YOUJI, OKAMOTO, MASANORI, YAMAMOTO, SENTAROU
Publication of US20190214784A1 publication Critical patent/US20190214784A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H01S5/02236—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H01S5/02276—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms

Definitions

  • the disclosed embodiments relate to an electrical element mounting package, an array package, and an electrical device.
  • Patent Literature 1 Japanese Patent Application Publication No. 2014-116514
  • An electrical element mounting package includes a substrate that is plate-like, and at least one base that protrudes from a front surface of the substrate, and that has a mounting surface on which an electrical element is mounted, wherein the substrate and the at least one base are made of ceramics integrally.
  • an array package includes a plurality of the electrical element mounting packages, wherein the plurality of electrical element mounting packages are connected.
  • an electrical device includes the electrical element mounting package, and an electrical element that is mounted on the mounting surface of the electrical element mounting package.
  • an electrical element mounting package an array package, and an electrical device with high heat dissipation performance.
  • FIG. 1A is a perspective view of an electrical element mounting package according to a first embodiment.
  • FIG. 1B is a cross-sectional view taken along the direction of arrow A-A in FIG. 1A .
  • FIG. 1C is a cross-sectional view taken along the direction of arrow B-B in FIG. 1B .
  • FIG. 2A is a perspective view of an electrical element mounting package according to a second embodiment.
  • FIG. 2B is a cross-sectional view taken along the direction of arrow C-C in FIG. 1A .
  • FIG. 2C is a cross-sectional view taken along the direction of arrow D-D in FIG. 1B .
  • FIG. 3A is a cross-sectional view of an electrical element mounting package according to a first variation of the embodiments.
  • FIG. 3B is a cross-sectional view of an electrical element mounting package according to a second variation of the embodiments.
  • FIG. 3C is a cross-sectional view of an electrical element mounting package according to a third variation of the embodiments.
  • FIG. 3D is a cross-sectional view of an electrical element mounting package according to a fourth variation of the embodiments.
  • FIG. 4A is a perspective view of an electrical element mounting package according to a fifth variation of the embodiments.
  • FIG. 4B is an enlarged cross-sectional view of the electrical element mounting package according to the fifth variation of the embodiments.
  • FIG. 4C is an enlarged cross-sectional view of a connection portion in which an edge of a power supply terminal does not fit an edge of an end surface.
  • FIG. 4D is a perspective view of an electrical element mounting package according to a sixth variation of the embodiments.
  • FIG. 5A is a perspective view of an electrical element mounting package according to a seventh variation of the embodiments.
  • FIG. 5B is an enlarged cross-sectional view of an electrical element mounting package according to the seventh variation of the embodiments.
  • FIG. 5C is a perspective view of an electrical element mounting package according to an eighth variation of the embodiments.
  • FIG. 5D is a perspective view of an electrical element mounting package according to a ninth variation of the embodiments.
  • FIG. 5E is a perspective view of an electrical element mounting package according to a tenth variation of the embodiments.
  • FIG. 5F is a perspective view of an electrical element mounting package according to an eleventh variation of the embodiments.
  • FIG. 5G is a perspective view of an electrical element mounting package according to a twelfth variation of the embodiments.
  • FIG. 6A is a perspective view of an electrical element mounting package according to a thirteenth variation of the embodiments.
  • FIG. 6B is a perspective view of an electrical element mounting package according to a fourteenth variation of the embodiments.
  • FIG. 6C is a side view of the electrical element mounting package according to the fourteenth variation of the embodiments.
  • FIG. 6D is an enlarged top view of an electrical element mounting package according to a fifteenth variation of the embodiments.
  • FIG. 7A is a perspective view of a base according to a sixteenth variation of the embodiments.
  • FIG. 7B is a perspective view of a base according to a seventeenth variation of the embodiments.
  • FIG. 7C is a side view of the base according to the seventeenth variation of the embodiments.
  • FIG. 7D is a plan view illustrating an array package according to the embodiments.
  • FIG. 8 is a plan view illustrating one manufacturing process of the electrical element mounting package according to the first embodiment.
  • FIG. 9 is a cross-sectional view illustrating another manufacturing process of the electrical element mounting package according to the first embodiment.
  • FIG. 10 is a plan view illustrating one manufacturing process of the electrical element mounting package according to the second embodiment.
  • FIG. 11 is a plan view illustrating another manufacturing process of the electrical element mounting package according to the second embodiment.
  • FIG. 12 is a cross-sectional view illustrating another manufacturing process of the electrical element mounting package according to the second embodiment.
  • FIG. 13 is a cross-sectional view illustrating one manufacturing process of the electrical element mounting package according to the first variation of the embodiments.
  • FIG. 14 is a cross-sectional view illustrating one manufacturing process of the electrical element mounting package according to the third variation of the embodiments.
  • a conventional electrical element mounting package has low heat dissipation performance of dissipating heat that is generated by an electrical element to the outside. This is because both of thermal resistance at the interface between a sub mount and a joint material and thermal resistance at the interface between the joint material and a metal base are large, and heat is not effectively transferred from the sub mount to the metal base.
  • Some modes of embodiments have been conceived in view of the foregoing situations, and an object is to provide an electrical element mounting package, an array package, and an electrical device with high heat dissipation performance.
  • an electrical element mounting package, an array package, and an electrical device disclosed in the present application will be described below with reference to the accompanying drawings.
  • modes in which a light emitting element is adopted as an electrical element will be described as examples of the electrical element mounting package, the array package, and the electrical device (hereinafter, referred to as a light emitting element mounting package and a light emitting device); however, the present invention is not limited to the light emitting element, but is, of course, applicable to general electrical elements that have heat generation property.
  • Examples of the electrical element that have heat generation property include a large scale integrated circuit (LSI), a charge coupled device (CCD), a laser diode, and a light emitting diode (LED).
  • LSI large scale integrated circuit
  • CCD charge coupled device
  • LED light emitting diode
  • the light emitting element mounting package A 1 includes a plate-like substrate 10 and a base 11 that protrudes upward from a front surface 10 a of the substrate 10 .
  • a mounting surface 11 a is provided on an upper surface of the base 11 , and a light emitting element 30 is mounted on the mounting surface 11 a.
  • the substrate 10 and the base 11 of the light emitting element mounting package A 1 are made of ceramics integrally.
  • an interface that is made of different kinds of materials and causes large thermal resistance is not provided between the base 11 that is mounted with the light emitting element 30 and the substrate 10 that has a function to discharge heat to the outside.
  • a process of bonding the substrate 10 and the base 11 is not needed and a joint material, such as solder, is also not needed in the light emitting element mounting package A 1 . Therefore, it is possible to realize the light emitting element mounting package A 1 at low manufacturing cost.
  • FIG. 1B it is preferable to provide a side conductor 13 on a side surface 11 b of the base 11 and provide a substrate-side via conductor 15 a inside the substrate 10 in the light emitting element mounting package A 1 . Further, it is preferable to connect the side conductor 13 and the substrate-side via conductor 15 a in a thickness direction of the light emitting element mounting package A 1 .
  • the area of the side conductor 13 is equal to or greater than 10%, or more preferably, 50% of the area of the one side surface 11 b of the base 11 on which the side conductor 13 is provided. Further, it is more preferable that the area of the side conductor 13 approaches the area of the side surface 11 b , and it is acceptable that the area of the side conductor 13 is equal to the area of the side surface 11 b.
  • While the side conductor 13 and the substrate-side via conductor 15 a are connected using a flat conductor 14 as illustrated in FIG. 1B , it may be possible to directly connect the side conductor 13 and the substrate-side via conductor 15 a without using the flat conductor 14 .
  • the light emitting element mounting package A 1 is made of ceramics.
  • the ceramics used herein for example, alumina, silica, mullite, cordierite, forsterite, aluminum nitride, silicon nitride, silicon carbide, or glass ceramics is appropriate.
  • aluminum nitride AlN
  • AlN aluminum nitride
  • the phrase “aluminum nitride is contained as a major component” indicates that the light emitting element mounting package A 1 contains 80% by mass or more of aluminum nitride. If the light emitting element mounting package A 1 contains less than 80% by mass of aluminum nitride, the thermal conductivity of the light emitting element mounting package A 1 is reduced, so that the heat dissipation performance may be degraded.
  • the light emitting element mounting package A 1 contains 90% by mass or more of aluminum nitride. If the content of aluminum nitride is 90% by mass or more, the thermal conductivity of the light emitting element mounting package A 1 becomes equal to or higher than 150 W/mK, so that it is possible to realize the light emitting element mounting package A 1 with excellent heat dissipation performance.
  • the light emitting element mounting package A 1 includes the substrate 10 and the base 11 , and an element terminal 12 a is provided on the mounting surface 11 a of the base 11 . Further, as illustrated in FIG. 1B , the element terminal 12 a is electrically connected to a power supply terminal 16 a that is connected to an external power supply (not illustrated), which is provided on the back surface 10 b , via the above-described side conductor 13 , the flat conductor 14 that is provided on the front surface 10 a of the substrate 10 , and the above-described substrate-side via conductor 15 a.
  • an external power supply not illustrated
  • another element terminal 12 b is provided on the front surface 10 a of the substrate 10 so as to be adjacent to the base 11 .
  • the element terminal 12 b is electrically connected to another power supply terminal 16 b that is connected to an external power supply provided on the back surface 10 b , via another substrate-side via conductor 15 b that extends in the thickness direction of the substrate 10 , similarly to the element terminal 12 a.
  • the element terminals 12 a and 12 b are formed of metalized films that are sintered metal powder.
  • the metalized films can be bonded to the ceramics surfaces constituting the substrate 10 and the base 11 with high strength, so that it is possible to realize the light emitting element mounting package A 1 with high reliability.
  • coated films that are made of Ni on the surfaces of the metalized films.
  • solder or Au—Sn coated films on the surfaces of the coated films.
  • a sealing metal film 20 is provided on the front surface 10 a of the substrate 10 so as to surround the base 11 and the element terminal 12 b .
  • the sealing metal film 20 is a portion to which a cap 40 is bonded when the cap 40 is provided so as to cover the front surface 10 a of the substrate 10 .
  • the light emitting element 30 and the cap 40 as illustrated in FIG. 1A are mounted on the light emitting element mounting package A 1 as described above, and thus the light emitting device is constructed.
  • a semiconductor laser also referred to as a laser diode
  • the light emitting element 30 is arranged such that an emitting surface 30 a , which is provided on one end surface, faces a predetermined direction of the light emitting element mounting package A 1 .
  • the light emitting element 30 is bonded to the mounting surface 11 a of the base 11 using a conductive joint material, such as solder.
  • a first electrode (not illustrated) that is provided on a lower surface of the light emitting element 30 and the element terminal 12 a that is provided on the mounting surface 11 a are electrically connected to each other by the conductive joint material.
  • a second electrode (not illustrated) that is provided on an upper surface of the light emitting element 30 and the element terminal 12 b that is provided adjacent to the base 11 are electrically connected to each other using bonding wire (not illustrated) or the like.
  • the cap 40 is a member for realizing airtight sealing of a region, such as the light emitting element 30 , that is surrounded by the sealing metal film 20 .
  • the cap 40 may be composed of a metallic material, ceramics, or the like.
  • Kovar Fe—Ni—Co alloy
  • a side window 41 is provided on a side surface of the cap 40 , and transparent glass is put in the side window 41 .
  • the cap 40 is arranged such that the side window 41 faces the same direction as the emitting surface 30 a of the light emitting element 30 . Further, light emitted from the emitting surface 30 a is emitted to the outside through the side window 41 .
  • brazing material it is possible to improve the airtightness of the region sealed with the cap 40 , so that it is possible to improve the reliability of the light emitting device.
  • the light emitting element mounting package A 2 is different from the light emitting element mounting package A 1 as described above in that the power supply terminals 16 a and 16 b , which are used for connection to external power supplies, are arranged differently.
  • Other components are basically the same as those of the light emitting element mounting package A 1 , so that the same components are denoted by the same reference signs and detailed explanation thereof will be omitted.
  • the power supply terminals 16 a and 16 b are provided on the front surface 10 a of the substrate 10 in the light emitting element mounting package A 2 .
  • the power supply terminals 16 a and 16 b are provided on the front surface 10 a instead of the back surface 10 b of the substrate 10 as described above, it becomes possible to provide a heat dissipation member, such as a heatsink, so as to come in contact with the entire back surface 10 b of the substrate 10 . Therefore, it is possible to further improve the heat dissipation performance of the package.
  • a heat dissipation member that is made of metal with high heat dissipation performance is provided on the back surface 10 b of the substrate 10 , it is preferable to provide a metal film 21 on the back surface 10 b in order to enable bonding using solder or the like.
  • the area ratio of the metal film on the back surface 10 b is equal to or higher than 50%, or more preferably, equal to or higher than 80%.
  • the planar shape of the metal film 21 is similar to the planar shape of the back surface 10 b of the substrate 10 . Furthermore, if the area of the metal film 21 is less than the area of the back surface 10 b , it is preferable to arrange the metal film 21 such that a central portion thereof is located right under the base 11 .
  • the side conductor 13 , the flat conductor 14 , and the substrate-side via conductor 15 a are connected to the element terminal 12 a in this order.
  • the substrate-side via conductor 15 a does not penetrate to the back surface 10 b of the substrate 10 , but is connected to one end side of a wiring conductor 17 a that extends in a surface direction of the substrate 10 inside the substrate 10 .
  • the wiring conductor 17 a extends such that the other end side thereof reaches the lower side of the power supply terminal 16 a through the lower side of the sealing metal film 20 . Further, the other end side of the wiring conductor 17 a and the power supply terminal 16 a are electrically connected to each other by an element-side via conductor 18 a.
  • the power supply terminal 16 a is electrically connected to the element terminal 12 a via the element-side via conductor 18 a , the wiring conductor 17 a , the substrate-side via conductor 15 a , the flat conductor 14 , and the side conductor 13 .
  • the power supply terminal 16 b is electrically connected to the element terminal 12 b via another element-side via conductor 18 b , another wiring conductor 17 b , and another substrate-side via conductor 15 b.
  • the light emitting element mounting package A 2 is configured such that the wiring conductors 17 a and 17 b and the sealing metal film 20 three-dimensionally intersect with each other via at least one insulating layer that constitutes the substrate 10 .
  • the insulating layer it is possible to reduce generation of irregularities on the surface of the sealing metal film 20 that three-dimensionally intersects with the wiring conductors 17 a and 17 b , due to the thicknesses of the wiring conductors 17 a and 17 b.
  • the wiring conductors 17 a and 17 b it is preferable to provide the wiring conductors 17 a and 17 b at positions that are closer to the back surface 10 b than the front surface 10 a of the substrate 10 .
  • the wiring conductors 17 a and 17 b made of metal are provided at positions that are closer to the back surface 10 b , and if a heat dissipation member made of metal is provided on the back surface 10 b , it is possible to reduce a difference between a thermal expansion coefficient of the heat dissipation member and a thermal expansion coefficient of the substrate 10 .
  • a light emitting element mounting package A 3 illustrated in FIG. 3A is a variation of the light emitting element mounting package A 1 according to the first embodiment, and FIG. 3A is a cross-sectional view corresponding to FIG. 1B .
  • the element terminal 12 a and the substrate-side via conductor 15 a are electrically connected to each other by a base-side via conductor 19 that is provided inside the base 11 and extends in a thickness direction of the base 11 , instead of the side conductor 13 (see FIG. 1B ).
  • the base-side via conductor 19 that has a columnar shape with a volume greater than that of the side conductor 13 that has a thin film shape, it is possible to more effectively transfer heat generated by the light emitting element 30 (see FIG. 1A ) to the back surface 10 b of the substrate 10 . Therefore, it is possible to further improve the heat dissipation performance of the light emitting element mounting package A 3 .
  • the base-side via conductor 19 is arranged in the center of the mounting surface 11 a that is provided on the upper surface of the base 11 . Thereby, it becomes possible to more easily transfer heat from an inner portion that is far from the side surface 11 b inside the base 11 .
  • the base-side via conductor 19 and the substrate-side via conductor 15 a are integrally formed so as to penetrate in the thickness direction of the base 11 and the substrate 10 . Thereby, it is possible to easily form the base-side via conductor 19 and the substrate-side via conductor 15 a through a via embedding process that is performed in a manufacturing process to be described later. Therefore, it is possible to prevent an increase in manufacturing cost of the light emitting element mounting package A 3 .
  • a light emitting element mounting package A 4 illustrated in FIG. 3B is a variation of the light emitting element mounting package A 2 according to the second embodiment, and FIG. 3B is a cross-sectional view corresponding to FIG. 2B .
  • the element terminal 12 a and the substrate-side via conductor 15 a are electrically connected to each other by the base-side via conductor 19 that is arranged inside the base 11 . Therefore, as described above, it is possible to further improve the heat dissipation performance of the package. Even in this case, it is preferable to set the shape and the position of the metal film 21 that is arranged on the back surface 10 b of the substrate 10 in the same manner as the light emitting element mounting package A 2 as described above.
  • a light emitting element mounting package A 5 illustrated in FIG. 3C is another variation of the light emitting element mounting package A 2 according to the second embodiment.
  • a groove 10 c is provided on the front surface 10 a of the substrate 10 so as to surround the base 11 and the element terminal 12 b (see FIG. 2A ), and the sealing metal film 20 is provided on a bottom surface of the groove 10 c.
  • the cap 40 by mounting the cap 40 (see FIG. 2A ) so as to be engaged with the groove 10 c when the cap 40 is bonded to the sealing metal film 20 , the bonded portion of the cap 40 is extended to side surfaces of the groove 10 c . Thereby, it is possible to further improve the airtightness of the region sealed with the cap 40 , so that it is possible to further improve the reliability of the light emitting device.
  • the groove 10 c on the substrate 10 , it is possible to increase the surface area of the substrate 10 that has a heat dissipation function, so that it is possible to further improve the heat dissipation performance of the package.
  • the sealing metal film 20 is provided on the bottom surface of the groove 10 c in FIG. 3C , the sealing metal film 20 need not be always arranged in this manner.
  • the sealing metal film 20 may be provided so as to extend from the bottom surface of the groove 10 c to the side surfaces of the groove 10 c or to the front surface 10 a of the substrate 10 in the vicinity of the groove 10 c.
  • a light emitting element mounting package A 6 illustrated in FIG. 3D is a variation of the light emitting element mounting package A 4 illustrated in FIG. 3B .
  • the sealing metal film 20 is provided inside the groove 10 c that is provided on the front surface 10 a of the substrate 10 , similarly to the light emitting element mounting package A 5 . Therefore, as described above, it is possible to further improve the reliability of the light emitting device, and further improve the heat dissipation performance of the package.
  • a light emitting element mounting package A 7 illustrated in FIG. 4A is another variation of the light emitting element mounting package A 2 according to the second embodiment.
  • edges 16 c on a side opposite to a light emitting direction (hereinafter, the side is also referred to as a “rear side”) of the power supply terminals 16 a and 16 b having rectangular shapes are provided so as to fit an edge of an end surface of the substrate 10 on the rear side.
  • an FPC 200 is formed by laminating a coverlay film 201 , a copper foil 202 , and a base film 203 in this order from the top. Further, the copper foil 202 that is an intermediate layer and each of the power supply terminals 16 a and 16 b is bonded using a conductive joint material, such as solder, so that each of the power supply terminals 16 a and 16 b and the FPC 200 are electrically connected.
  • a conductive joint material such as solder
  • the light emitting element mounting package A 7 it is possible to connect the FPC 200 to each of the power supply terminals 16 a and 16 b while the FPC 200 is kept flat. Therefore, it is possible to improve the durability of the connection portion between the FPC 200 and each of the power supply terminals 16 a and 16 b.
  • a light emitting element mounting package A 8 illustrated in FIG. 4D is another variation of the light emitting element mounting package A 2 according to the second embodiment.
  • edges 16 d of the rectangular power supply terminals 16 a and 16 b on vertical sides (hereinafter, also referred to as “lateral sides”) with respect to the light emitting direction are provided so as to fit edges of side surfaces 10 e that are end surfaces on the lateral sides of the substrate 10 .
  • an external terminal such as the FPC 200 (see FIG. 4B )
  • edges 16 d of the power supply terminals 16 a and 16 b are provided so as to fit the edges of the side surfaces 10 e , it is possible to connect the FPC 200 to each of the power supply terminals 16 a and 16 b while keeping the FPC 200 flat by cutting an end portion of the base film 203 . Therefore, it is possible to improve the durability of the connection portion between the FPC 200 and each of the power supply terminals 16 a and 16 b.
  • a light emitting element mounting package A 9 illustrated in FIG. 5A is a variation of the light emitting element mounting package A 7 illustrated in FIG. 4A .
  • the rear side edges 16 c of the rectangular power supply terminals 16 a and 16 b are provided so as to fit the edge of the rear side end surface 10 d of the substrate 10 .
  • the power supply terminals 16 a and 16 b are provided at positions that are one step lower than the front surface 10 a of the substrate 10 .
  • concave portions 10 f are provided at the rear side edge of the front surface 10 a of the substrate 10
  • the power supply terminals 16 a and 16 b are arranged on bottom surfaces of the concave portions 10 f.
  • an upper surface of the FPC 200 can be positioned flush with the front surface 10 a of the substrate 10 or can be positioned lower than the front surface 10 a.
  • the FPC 200 is less likely to be damaged, so that it is possible to improve the durability of the light emitting device.
  • the concave portions 10 f may be separated from each other on the front surface 10 a of the substrate 10 as illustrated in FIG. 5A , or the two concave portions 10 f may be integrated as in a light emitting element mounting package A 10 illustrated in FIG. 5C .
  • the power supply terminals 16 a and 16 b it is possible to arrange the power supply terminals 16 a and 16 b at close positions, so that it is possible to reduce the sizes of the light emitting element mounting package A 10 and an external terminal, such as the FPC 200 .
  • a light emitting element mounting package A 11 illustrated in FIG. 5D is a variation of the light emitting element mounting package A 8 illustrated in FIG. 4D .
  • the lateral side edges 16 d of the rectangular power supply terminals 16 a and 16 b are provided so as to fit the edges of the side surfaces 10 e that are the end surfaces on the lateral sides of the substrate 10 .
  • an external terminal such as the FPC 200
  • the power supply terminals 16 a and 16 b are provided at positions that are one step lower than the front surface 10 a of the substrate 10 , similarly to the light emitting element mounting package A 9 as illustrated in FIG. 5A .
  • the concave portions 10 f are provided at the lateral side edges of the front surface 10 a of the substrate 10
  • the power supply terminals 16 a and 16 b are arranged on the bottom surfaces of the concave portions 10 f.
  • the upper surface of the FPC 200 can be positioned flush with the front surface 10 a of the substrate 10 or can be positioned lower than the front surface 10 a.
  • the FPC 200 is less likely to be damaged, so that it is possible to improve the durability of the light emitting device.
  • a light emitting element mounting package A 12 illustrated in FIG. 5E is a variation of the light emitting element mounting package A 9 illustrated in FIG. 5A .
  • the rear side edges 16 c of the rectangular power supply terminals 16 a and 16 b are provided so as to fit the edge of the rear side end surface 10 d of the substrate 10 .
  • the lateral side edges 16 d of the rectangular power supply terminals 16 a and 16 b are arranged so as to fit the edges of the lateral side surfaces 10 e of the substrate 10 . Thereby, it is possible to increase the flexibility in connecting an external terminal, such as the FPC 200 , so that it is possible to facilitate module design of the light emitting device.
  • the power supply terminals 16 a and 16 b are provided at positions that are one step lower than the front surface 10 a of the substrate 10 .
  • the concave portions 10 f are provided at the lateral rear side edges of the front surface 10 a of the substrate 10
  • the power supply terminals 16 a and 16 b are arranged on the bottom surfaces of the concave portions 10 f.
  • the upper surface of the FPC 200 can be positioned flush with the front surface 10 a of the substrate 10 or can be positioned lower than the front surface 10 a.
  • the FPC 200 is less likely to be damaged, so that it is possible to improve the durability of the light emitting device.
  • a light emitting element mounting package A 13 illustrated in FIG. 5F is a variation of the light emitting element mounting package A 7 illustrated in FIG. 4A .
  • an inner region of the sealing metal film 20 is recessed from the front surface 10 a of the substrate 10 except for a portion corresponding to the base 11 .
  • a concave portion 10 g is provided in the inner region of the sealing metal film 20
  • the base 11 is arranged on a bottom surface of the concave portion 10 g .
  • the mounting surface 11 a of the base 11 is positioned higher than the front surface 10 a of the substrate 10 .
  • the light emitting element mounting package A 13 it is possible to lower the position of the mounting surface 11 a that is located at the highest position, so that it is possible to further reduce the height of the light emitting device.
  • a distance between the mounting surface and the front surface of the substrate in the inner region of the sealing metal film is reduced.
  • a distance between the light emitting element mounted on the mounting surface and the front surface is reduced in the inner region of the sealing metal film.
  • the concave portion 10 g is provided in the inner region of the sealing metal film 20 , so that it is possible to secure, in the inner region of the sealing metal film 20 , a distance between the mounting surface 11 a and the concave portion 10 g that is located in the vicinity of the mounting surface 11 a and serves as a surface on the front surface 10 a side of the substrate 10 . Therefore, it is possible to suppress reflection of light from the surface on the front surface 10 a side in the inner region of the sealing metal film 20 .
  • the light emitting element mounting package A 13 it is possible to further reduce the height of the light emitting device and suppress reflection of light from the surface on the front surface 10 a side.
  • a light emitting element mounting package A 14 illustrated in FIG. 5G is a variation of the light emitting element mounting package A 13 illustrated in FIG. 5F .
  • the inner region of the sealing metal film 20 is recessed from the front surface 10 a of the substrate 10 except for a portion corresponding to the base 11 . Thereby, it is possible to further reduce the height of the light emitting device and suppress reflection of light from the surface on the front surface 10 a side.
  • the rear side edges 16 c of the rectangular power supply terminals 16 a and 16 b are provided so as to fit the edge of the rear side end surface 10 d of the substrate 10 .
  • the lateral side edges 16 d of the rectangular power supply terminals 16 a and 16 b are provided so as to fit the edges of the lateral side surfaces 10 e of the substrate 10 .
  • an external terminal such as the FPC 200
  • the power supply terminals 16 a and 16 b are provided at positions that are one step lower than the front surface 10 a of the substrate 10 .
  • the concave portions 10 f are provided at the lateral rear side edges of the front surface 10 a of the substrate 10
  • the power supply terminals 16 a and 16 b are arranged on the bottom surfaces of the concave portions 10 f.
  • the upper surface of the FPC 200 can be positioned flush with the front surface 10 a of the substrate 10 or can be positioned lower than the front surface 10 a.
  • the FPC 200 is less likely to be damaged, so that it is possible to improve the durability of the light emitting device.
  • a light emitting element mounting package A 15 illustrated in FIG. 6A is a variation of the light emitting element mounting package A 7 illustrated in FIG. 4A .
  • the plurality of bases 11 are provided in the inner region of the sealing metal film 20 .
  • the bases 11 are arranged in a direction perpendicular to the light emitting direction, and the light emitting elements 30 are mounted on the mounting surfaces 11 a of the bases 11 . In this case, it is sufficient to arrange all of the light emitting elements 30 such that the emitting surfaces 30 a are oriented toward the light emitting direction.
  • the bases 11 are arranged in the direction perpendicular to the light emitting direction.
  • the light emitting elements 30 need not always be arranged in the direction perpendicular to the light emitting direction.
  • a light emitting element mounting package A 16 illustrated in FIG. 6B and FIG. 6C is a variation of the light emitting element mounting package A 15 illustrated in FIG. 6A .
  • a first base 11 A for mounting a laser diode 31 which is one example of the light emitting element 30
  • a second base 11 B for mounting a photodiode 32 are provided in the inner region of the sealing metal film 20 .
  • the first base 11 A and the second base 11 B in combination constitute a composite base 11 C.
  • the first base 11 A is arranged on the light irradiation direction side
  • the second base 11 B is arranged on the side opposite to the light irradiation direction side. Further, a height of the second base 11 B is less than the height of the first base 11 A.
  • the laser diode 31 mounted on the composite base 11 C as described above has a dimension of, for example, width of 0.3 millimeters (mm) ⁇ length of 1.0 mm ⁇ height of 0.1 mm
  • the photodiode 32 has a dimension of, for example, width of 0.5 mm ⁇ length of 0.5 mm ⁇ height of 0.3 mm.
  • the “width” is a dimension of one side in a direction that is approximately perpendicular to the horizontal direction and the light emitting direction
  • the “length” is a dimension of one side in a direction that is approximately parallel to the horizontal direction and the light emitting direction (the same applies to the following description).
  • an emitting surface 31 a of the laser diode 31 is arranged so as to face the light irradiation direction, and a detection surface 32 a of the photodiode 32 is arranged so as to face upward. Furthermore, light L 1 with a width of about 30° on one side is emitted from an upper portion of the emitting surface 31 a of the laser diode 31 .
  • the light L 1 is light that is emitted from the light emitting device to the outside.
  • weak light L 2 with a width of about 30° on one side is emitted from an upper portion of a surface opposite to the emitting surface 31 a of the laser diode 31 .
  • the amount of the light L 2 varies depending on the amount of the light L 1 .
  • a light emitting element mounting package A 17 illustrated in FIG. 6D is a variation of the light emitting element mounting package A 16 illustrated in FIG. 6B and FIG. 6C .
  • the light emitting element mounting package A 17 three sets of the composite bases 11 C are provided in the inner region of the sealing metal film 20 .
  • optical elements 25 and 26 having functions of combining incident light and emitting combined light in a predetermined direction are provided in the inner region of the sealing metal film 20 .
  • optical elements 25 and 26 as described above are arranged side by side in the light irradiation direction (rightward direction in the figure), and the optical element 26 is arranged on the light irradiation direction side relative to the optical element 25 .
  • the three sets of the composite bases 11 C include a red composite base 11 C 1 for mounting a red laser diode 31 R, a green composite base 11 C 2 for mounting a green laser diode 31 G, and a blue composite base 11 C 3 for mounting a blue laser diode 31 B.
  • the first base 11 A and the second base 11 B of the red composite base 11 C 1 are arranged side by side in the light irradiation direction so as to face the optical element 25 . Further, the red laser diode 31 R and a photodiode 32 R for detecting red laser are respectively mounted on the first base 11 A and the second base 11 B of the red composite base 11 C 1 .
  • the first base 11 A and the second base 11 B of the green composite base 11 C 2 are arranged side by side in a direction perpendicular to the light irradiation direction so as to face the optical element 25 . Further, the green laser diode 31 G and a photodiode 32 G for detecting green laser are respectively mounted on the first base 11 A and the second base 11 B of the green composite base 11 C 2 .
  • the first base 11 A and the second base 11 B of the blue composite base 11 C 3 are arranged side by side in the direction perpendicular to the light irradiation direction so as to face the optical element 26 . Further, the blue laser diode 31 B and a photodiode 32 B for detecting blue laser are respectively mounted on the first base 11 A and the second base 11 B of the blue composite base 11 C 3 .
  • red light L R coming from the red laser diode 31 R is applied to the optical element 25
  • green light L G coming from the green laser diode 31 G is applied to the optical element 25 .
  • the optical element 25 combines the light L R and the light L G , and emits combined light L RG to the optical element 26 .
  • blue light L B coming from the blue laser diode 31 B is applied to the optical element 26 , and the optical element 26 combines the light L RG and the light L B . Then, the optical element 26 emits combined light L RGB in the light irradiation direction.
  • the embodiments by providing the three sets of the composite bases 11 C in the inner region of the sealing metal film 20 , it is possible to combine the red light L R , the green light L G , and the blue light L B , and emits the combined light to the outside. Therefore, it is possible to realize an optical device that may be used as a light source for a display device.
  • the photodiode 32 R for detecting red laser, the photodiode 32 G for detecting green laser, and the photodiode 32 B for detecting blue laser are mounted on the corresponding second bases 11 B. Therefore, it is possible to perform feedback control on each of the amount of light L R that comes from the red laser diode 31 R, the amount of light L G that comes from the green laser diode 31 G, and the amount of light L B that comes from the blue laser diode 31 B. Therefore, it is possible to emit the light L RGB that is adjusted and has high quality.
  • an interval D 1 that is a smaller one of an interval between the red composite base 11 C 1 and the green composite base 11 C 2 and an interval between the red composite base 11 C 1 and the blue composite base 11 C 3 is greater than an interval D 2 between the green composite base 11 C 2 and the blue composite base 11 C 3 .
  • the red laser diode 31 R which is likely to be influenced by heat from other elements, at a position away from the green laser diode 31 G and the blue laser diode 31 B. Therefore, it is possible to stably emit the light L R from the red laser diode 31 R.
  • the direction of the light L R emitted from the red laser diode 31 R, the direction of the light L G emitted from the green laser diode 31 G, and the direction of the light L B emitted from the blue laser diode 31 B are oriented in directions in which the light does not hit the three sets of the composite bases 11 C.
  • each of the light emitting element mounting packages A 1 to A 17 is set such that the width and the length are about 2 to 5 mm and the height is about 0.2 to 1 mm.
  • the element terminal 12 a is mounted on the mounting surface 11 a of the base 11 and the element terminal 12 b is arranged at a position away from the base 11 (i.e., the mounting surface 11 a ).
  • the configuration is not limited to the above-described example.
  • the element terminal 12 a and the element terminal 12 b may be arranged on the mounting surface 11 a of the base 11 so as to be separated from each other by a predetermined interval.
  • the element terminal 12 a and the element terminal 12 b are insulated from each other on the mounting surface 11 a of the base 11 by ceramics contained in the base 11 .
  • the element terminal 12 a and the element terminal 12 b may be formed in a three-dimensional manner with predetermined heights on the mounting surface 11 a of the base 11 .
  • the element terminals 12 a and 12 b in a three-dimensional manner as described above, it may be possible to integrally provide, on the mounting surface 11 a , small bases 11 D and 11 E that correspond to the respective areas of the element terminals 12 a and 12 b , by using the same material as the base 11 as illustrated in FIG. 7B , for example.
  • the element terminal 12 a and the element terminal 12 b are located at higher positions than the other region of the mounting surface 11 a on the mounting surface 11 a of the base 11 .
  • regions corresponding to the element terminal 12 a and the element terminal 12 b are convex portions, and the other region is a concave portion.
  • the element terminal 12 a and the element terminal 12 b are formed in a three-dimensional manner with predetermined heights on the mounting surface 11 a of the base 11 , it is possible to provide the light emitting element 30 in a floating manner above the mounting surface 11 a.
  • a height h 2 of the element terminal 12 b with respect to the mounting surface 11 a is greater than a height h 1 of the element terminal 12 a with respect to the mounting surface 11 a .
  • the height h 2 of the element terminal 12 b is greater than the height h 1 of the element terminal 12 a by an amount corresponding to a thickness t of the light emitting element 30 .
  • FIG. 7D is a plan view illustrating an array package C 1 according to the embodiments.
  • the array package C 1 illustrated in FIG. 7D is obtained by connecting the plurality of light emitting element mounting packages A 1 among the light emitting element mounting packages as described above.
  • FIG. 8 is a plan view of each of processes performed in a first half stage, as viewed from above ( FIG. 8( d ) is viewed from below), and FIG. 9 is a cross-sectional view of each of processes performed in a second half stage, as viewed from side.
  • a green sheet 50 which has preliminarily been processed into a predetermined shape, is prepared. Subsequently, predetermined two portions in the green sheet 50 are punched into circular shapes in a plan view, and via conductors 51 a and 51 b are embedded in the punched two holes ( FIG. 8( b ) ).
  • a conductor pattern 52 a is printed on an upper surface of the green sheet 50 so as to be connected to the via conductor 51 a
  • a conductor pattern 52 b is printed so as to be connected to the via conductor 51 b
  • a frame-shaped conductor pattern 52 c is printed so as to surround the conductor patterns 52 a and 52 b ( FIG. 8( c ) ).
  • a conductor pattern 53 a is printed on a lower surface of the green sheet 50 so as to be connected to the via conductor 51 a
  • a conductor pattern 53 b is printed so as to be connected to the via conductor 51 b ( FIG. 8( d ) ).
  • FIG. 9 which illustrates the subsequent processes, is a cross-sectional view taken along the direction of arrow E-E in FIG. 8( d ) .
  • the green sheet 50 is pressed from the upper side to the lower side using a press mold 100 that has a predetermined shape as illustrated in FIG. 9( a ) , so that a convex portion 54 is formed ( FIG. 9( b ) ).
  • the conductor pattern 52 a (see FIG. 9( a ) ) is deformed such that a conductor pattern 52 a 1 is formed on an upper surface of the convex portion 54 , a conductor pattern 52 a 2 is formed on a side surface of the convex portion 54 , and a conductor pattern 52 a 3 is formed adjacent to the convex portion 54 .
  • the convex portion 54 is a portion that corresponds to the base 11 of the light emitting element mounting package A 1 (see FIG. 1B ), and the conductor patterns 52 al , 52 a 2 , and 52 a 3 are portions that correspond to the element terminal 12 a (see FIG. 1B ), the side conductor 13 (see FIG. 1B ), and the flat conductor 14 (see FIG. 1B ), respectively.
  • the via conductor 51 a is a portion that corresponds to the substrate-side via conductor 15 a of the light emitting element mounting package A 1 (see FIG. 1B ), the conductor pattern 53 a is a portion that corresponds to the power supply terminal 16 a (see FIG. 1B ), and the conductor pattern 52 c is a portion that corresponds to the sealing metal film 20 (see FIG. 1B ).
  • the via conductor 51 b is a portion that corresponds to the substrate-side via conductor 15 b of the light emitting element mounting package A 1 (see FIG. 1C ).
  • the conductor pattern 52 b (see FIG. 8( c ) ) is a portion that corresponds to the element terminal 12 b of the light emitting element mounting package A 1 (see FIG. 1C ), and the conductor pattern 53 b (see FIG. 8( d ) ) is a portion that corresponds to the power supply terminal 16 b (see FIG. 1C ).
  • the green sheet 50 formed as illustrated in FIG. 9( b ) is fired at high temperature (about 1800° C.), so that the light emitting element mounting package A 1 is completed.
  • the green sheet 50 used in the manufacturing process as described above is, as a basic configuration, inorganic powder that is obtained by, for example, mixing aluminum nitride powder as main raw material with powder that is made of yttria (Y 2 O 3 ), calcia (CaO), erbia (Er 2 O 3 ), or the like as sintering agent. Further, the green sheet 50 is formed by adding and mixing organic binder, fluxing material, and solvent to the inorganic powder in a slurry manner, and applying a conventional known doctor blade method or calendar roll method thereto.
  • the conductor patterns 52 a , 52 b , 52 c , 53 a , and 53 b and the via conductors 51 a and 51 b are formed as paste by mixing, for example, tungsten (w) as main raw material with aluminum nitride, organic binder, fluxing material, and the like as additives.
  • the light emitting element mounting package A 2 is formed by first performing a predetermined process on each of two green sheets, laminating the two green sheets, and firing such a laminate.
  • each of processes performed in a first half stage on a green sheet 60 that is an upper sheet of the two green sheets will be described based on FIG. 10 that is a plan view of the processes, and each of processes performed in the first half stage on a green sheet 70 that is a lower sheet will be described based on FIG. 11 that is a plan view of the processes.
  • Each of processes performed in a second half stage on the green sheets 60 and 70 will be described lastly based on FIG. 12 that is a cross-sectional view of the processes.
  • the green sheet 60 which has preliminarily been processed into a predetermined shape, is prepared. Subsequently, predetermined four portions in the green sheet 60 are punched into circular shapes in a plan view, and via conductors 61 a , 61 b , 61 c , and 61 d are embedded in the punched four holes ( FIG. 10( b ) ).
  • a conductor pattern 62 a is printed on the green sheet 60 so as to be connected to the via conductor 61 a
  • a conductor pattern 62 b is printed so as to be connected to the via conductor 61 b
  • a frame-shaped conductor pattern 62 e is printed so as to surround the conductor patterns 62 a and 62 b
  • a conductor pattern 62 c is printed so as to be connected to the via conductor 61 c
  • a conductor pattern 62 d is printed so as to be connected to the via conductor 61 d ( FIG. 10( c ) ).
  • the green sheet 70 which has preliminarily been processed into a predetermined shape, is prepared. Subsequently, conductor patterns 71 a and 71 b are printed on an upper surface of the green sheet 70 ( FIG. 11( b ) ). Meanwhile, the conductor pattern 71 a is provided at a position corresponding to the via conductors 61 a and 61 c that are provided on the green sheet 60 , and the conductor pattern 71 b is provided at a position corresponding to the via conductors 61 b and 61 d that are provided on the green sheet 60 .
  • a conductor pattern 72 a is printed so as to cover a lower surface of the green sheet 70 ( FIG. 11( c ) ).
  • FIG. 12 which illustrates the subsequent processes, is a cross-sectional view taken along the direction of arrow F-F in FIG. 10( c ) .
  • the green sheet 60 is pressed from the upper side to the lower side using a press mold 101 that has a predetermined shape as illustrated in FIG. 12( a ) , so that a convex portion 63 is formed ( FIG. 12( b ) ).
  • the conductor pattern 62 a (see FIG. 12( a ) ) is deformed such that a conductor pattern 62 al is formed on an upper surface of the convex portion 63 , a conductor pattern 62 a 2 is formed on a side surface of the convex portion 63 , and a conductor pattern 62 a 3 is formed adjacent to the convex portion 63 .
  • the convex portion 63 is a portion that corresponds to the base 11 of the light emitting element mounting package A 2 (see FIG. 2B ), and the conductor patterns 62 al , 62 a 2 , and 62 a 3 are portions that correspond to the element terminal 12 a (see FIG. 2B ), the side conductor 13 (see FIG. 2B ), and the flat conductor 14 (see FIG. 2B ), respectively.
  • the via conductors 61 a and 61 c are portions that correspond to the substrate-side via conductor 15 a (see FIG. 2B ) and the element-side via conductor 18 a (see FIG. 2B ) of the light emitting element mounting package A 2 , respectively.
  • the conductor patterns 62 c and 62 e are portions that correspond to the power supply terminal 16 a (see FIG. 2B ) and the sealing metal film 20 (see FIG. 2B ) of the light emitting element mounting package A 2 , respectively.
  • a laminate molded body 80 is formed by arranging the green sheet 70 under the green sheet 60 that has been pressed and applying heat and pressure thereto ( FIG. 12( d ) ).
  • the conductor pattern 71 a is a portion that corresponds to the wiring conductor 17 a (see FIG. 2B ) of the light emitting element mounting package A 2
  • the conductor pattern 72 a is a portion that corresponds to the metal film 21 (see FIG. 2B ).
  • the via conductors 61 b and 61 d are portions that correspond to the substrate-side via conductor 15 b (see FIG. 2C ) and the element-side via conductor 18 b (see FIG. 2C ) of the light emitting element mounting package A 2 , respectively.
  • the conductor patterns 62 b and 62 d are portions that correspond to the element terminal 12 b (see FIG. 2C ) and the power supply terminal 16 b (see FIG. 2 C) of the light emitting element mounting package A 2 , respectively, and the conductor pattern 71 b (see FIG. 11( b ) ) is a portion that corresponds to the wiring conductor 17 b (see FIG. 2C ).
  • the laminate molded body 80 formed as illustrated in FIG. 12( d ) is fired at high temperature (about 1800° C.), so that the light emitting element mounting package A 2 is completed.
  • the method of manufacturing the light emitting element mounting package A 3 is basically the same as the method of manufacturing the light emitting element mounting package A 1 as illustrated in FIG. 8 and FIG. 9 , and therefore, different processes will be mainly described.
  • the green sheet 50 in which a plurality of conductor patterns and via conductors are formed, is pressed from the upper side to the lower side of the green sheet 50 using a press mold 102 that has a predetermined shape ( FIG. 13( b ) ), so that the convex portion 54 is formed.
  • the conductor pattern 52 a that is provided on the upper surface of the green sheet 50 is printed so as to be arranged on only an upper surface of the convex portion 54 , and the via conductor 51 a that penetrates through the green sheet 50 is provided so as to be located inside the convex portion 54 .
  • the conductor pattern 52 a is a portion that corresponds to the element terminal 12 a (see FIG. 3A ) of the light emitting element mounting package A 3
  • the via conductor 51 a is a portion that corresponds to the base-side via conductor 19 (see FIG. 3A ) and the substrate-side via conductor 15 a (see FIG. 3A ). Therefore, it is possible to form the light emitting element mounting package A 3 in which the base-side via conductor 19 is provided.
  • the method of manufacturing the light emitting element mounting package A 5 illustrated in FIG. 3C is basically the same as the method of manufacturing the light emitting element mounting package A 2 as illustrated in FIG. 10 to FIG. 12 , and therefore, different processes will be mainly described.
  • the green sheet 60 in which a plurality of conductor patterns and via conductors are formed, is pressed from the upper side to the lower side of the green sheet 60 using a press mold 103 that has a predetermined shape ( FIG. 14( a ) ).
  • a convex portion 103 a is provided on the press mold 103 at a position corresponding to the conductor pattern 62 e , so that a groove 64 is formed on a front surface of the green sheet 60 by the convex portion 103 a , and the conductor pattern 62 e is arranged inside the groove 64 ( FIG. 14( b ) ).
  • the groove 64 is a portion that corresponds to the groove 10 c of the light emitting element mounting package A 5 (see FIG. 3C ), and the conductor pattern 62 e is a portion that corresponds to the sealing metal film 20 (see FIG. 3C ).
  • the groove 10 c is provided on the front surface 10 a of the substrate 10 and the sealing metal film 20 is provided inside the groove 10 c.
  • the light emitting element mounting packages A 1 to A 6 according to the embodiments and variations were specifically manufactured, and light emitting devices to which the light emitting element mounting packages A 1 to A 6 were applied were manufactured.
  • mixed powder was prepared by mixing 5% by mass of yttria powder and 1% by mass of calcia powder with 94% by mass of aluminum nitride powder.
  • slurry was prepared by adding 20 parts by mass of acrylic binder as organic binder and 50 parts by mass of toluene to 100 parts by mass of the mixed powder (solid content), and then a green sheet with a predetermined thickness was manufactured by using a doctor blade method.
  • conductor pastes were used, which were obtained by adding 20 parts by mass of aluminum nitride powder, 8 parts by mass of acrylic binder, and an appropriate amount of terpineol to 100 parts by mass of tungsten powder.
  • the green sheet 50 (see FIG. 9( b ) and FIG. 13( b ) ) and the laminate molded body 80 (see FIG. 12( d ) ) were manufactured using the green sheet and the conductors containing the above-described components, through the manufacturing methods as illustrated in FIG. 8 to FIG. 14 .
  • the light emitting element mounting packages A 1 to A 6 were manufactured by firing, in the reducing atmosphere, the green sheet 50 and the laminate molded body 80 manufactured as above for two hours under a condition in which the maximum temperature was 1800° C.
  • the manufactured light emitting element mounting packages A 1 to A 6 had sizes such that, in the shapes after the firing, width of 2.5 mm ⁇ length of 4.2 mm ⁇ height of 0.6 mm, and the mounting surface 11 a had a size such that width of 0.5 mm ⁇ length of 0.5 mm.
  • Ni coated films with thicknesses of about 5 ⁇ m were formed and Au coated films with thicknesses of about 0.1 ⁇ m were further formed.
  • the light emitting elements 30 were mounted on the mounting surfaces 11 a of the light emitting element mounting packages A 1 to A 6 .
  • Au—Sn solder (melting point: 280° C.) was used to bond the light emitting elements 30 to the mounting surfaces 11 a.
  • the cap 40 made of Kovar was bonded to the sealing metal film 20 .
  • Ag—Sn solder (melting point: 221° C.) was used and the atmosphere inside the cap 40 was replaced with He gas.
  • a glass plate that had a predetermined size and was coated with an antireflection film was bonded to the side window 41 of the cap 40 by low-melting-point glass paste at about 430° C.
  • the light emitting devices to which the light emitting element mounting packages A 1 to A 6 according to the embodiments were applied, were manufactured. Further, as a comparative example, a light emitting device using a light emitting element mounting package, to which a conventional metal base was applied, was manufactured.
  • thermal resistance of each of the manufactured light emitting devices was evaluated.
  • a larger value of the temperature difference indicated lower thermal resistance and higher heat dissipation performance.
  • the thermal resistance of each of the light emitting devices evaluation was performed for each of a case in which a heat dissipation member was not bonded to the back surface 10 b of the substrate 10 and a case in which a heat dissipation member was bonded to the back surface 10 b .
  • the size of the heat dissipation member to be bonded was set such that the heat dissipation member could be attached to the entire back surface 10 b of the substrate 10 (e.g., width of 2 mm ⁇ length of 3 mm ⁇ thickness of 2 mm), with respect to the samples in which the power supply terminals 16 a and 16 b were provided on the front surface 10 a of the substrate 10 .
  • the size of the heat dissipation member was set such that portions corresponding to the power supply terminals 16 a and 16 b were excluded.
  • leakage property of He gas inside the cap 40 was evaluated. Specifically, the manufactured light emitting devices were set in a vacuum container, and times of detection of He gas were measured using gas chromatography. Further, values of evaluation results were relative times under the condition that the time at which He was first detected in sample 1 , in which the light emitting element mounting package A 1 was adopted, was assumed as 1.0.
  • samples to which the light emitting element mounting packages A 7 to A 17 were adopted were manufactured in the same manner and evaluation was performed.
  • the thermal resistance of these samples was in a range of ⁇ 1° C. with respect to each of the values of sample 6 , both in the case in which the heat dissipation member was not provided and the case in which the heat dissipation member was provided. Further, results of the He leakage test were within a range of 0.95 ⁇ 0.01.
  • the present invention is not limited to the embodiments as described above, but various modifications may be made without departing from the gist of the present invention.
  • a member that realizes the airtight sealing is not limited to the cap 40 .
  • the electrical element mounting package includes the plate-like substrate 10 , and at least one base 11 that protrudes from the front surface 10 a of the substrate 10 and has the mounting surface 11 a on which an electrical element (the light emitting element 30 , the laser diode 31 , the red laser diode 31 R, the green laser diode 31 G, and the blue laser diode 31 B) is mounted, where the substrate 10 and the base 11 are made of ceramics integrally.
  • an electrical element the light emitting element 30 , the laser diode 31 , the red laser diode 31 R, the green laser diode 31 G, and the blue laser diode 31 B
  • the electrical element mounting package according to the embodiments includes the element terminal 12 a that is provided on the mounting surface 11 a of the base 11 , the side conductor 13 that is provided on the side surface 11 b of the base 11 and extends in the thickness direction of the base 11 , and the substrate-side via conductor 15 a that is provided inside the substrate 10 and extends in the thickness direction of the substrate 10 , wherein the element terminal 12 a , the side conductor 13 , and the substrate-side via conductor 15 a are connected to one another.
  • the element terminal 12 a , the side conductor 13 , and the substrate-side via conductor 15 a are connected to one another.
  • the electrical element mounting package includes the element terminal 12 a that is provided on the mounting surface 11 a of the base 11 , the base-side via conductor 19 that is provided inside the base 11 and extends in the thickness direction of the base 11 , and the substrate-side via conductor 15 a that is provided inside the substrate 10 and extends in the thickness direction of the substrate 10 , wherein the element terminal 12 a , the base-side via conductor 19 , and the substrate-side via conductor 15 a are connected to one another.
  • the element terminal 12 a , the base-side via conductor 19 , and the substrate-side via conductor 15 a are connected to one another.
  • the electrical element mounting package according to the embodiments includes the wiring conductor 17 a that is provided inside the substrate 10 and extends in the surface direction of the substrate 10 , wherein the wiring conductor 17 a and the substrate-side via conductor 15 a are connected to each other.
  • the power supply terminal 16 a it is possible to arrange the power supply terminal 16 a not only on the back surface 10 b of the substrate 10 but also on the front surface 10 a of the substrate 10 .
  • the wiring conductor 17 a is provided at a position closer to the back surface 10 b of the substrate 10 than the front surface 10 a of the substrate 10 . Therefore, it is possible to realize the electrical element mounting package with high reliability.
  • the electrical element mounting package according to the embodiments includes the sealing metal film 20 that is provided on the front surface 10 a side of the substrate 10 so as to surround the base 11 and the power supply terminal 16 a that is provided on the outer side of the sealing metal film 20 , wherein the power supply terminal 16 a and the wiring conductor 17 a are connected to each other. Thereby, it is possible to further improve the heat dissipation performance of the package.
  • the groove 10 c is provided on the front surface 10 a of the substrate 10 so as to surround the base 11 , and the sealing metal film 20 is provided inside the groove 10 c .
  • the power supply terminals 16 a and 16 b are provided at positions that are lower than the front surface 10 a of the substrate 10 . Thereby, it is possible to easily determine the position of the FPC 200 .
  • outer edges of the power supply terminals 16 a and 16 b include the two linear edges 16 c and 16 d that intersect with each other, and the two edges 16 c and 16 d are positioned so as to respectively fit the edge of the end surface 10 d and the edge of the side surface 10 e of the substrate 10 .
  • the two edges 16 c and 16 d are positioned so as to respectively fit the edge of the end surface 10 d and the edge of the side surface 10 e of the substrate 10 .
  • the inner region of the sealing metal film 20 is recessed from the front surface 10 a of the substrate 10 except for a portion corresponding to the base 11 . Therefore, it is possible to further reduce the height of the electrical device and prevent reflection of light from the surface on the front surface 10 a side.
  • the plurality of bases 11 are provided in the inner region of the sealing metal film 20 . Thereby, it is possible to reduce the size of the electrical device.
  • the composite base 11 C including the first base 11 A and the second base 11 B is provided as the base 11 in the inner region of the sealing metal film 20 , and the height of the second base 11 B is less than the height of the first base 11 A in the composite base 11 C.
  • the electrical element mounting package according to the embodiments (the light emitting element mounting package A 17 ), three sets of the composite bases 11 C are provided in the inner region of the sealing metal film 20 . Thereby, it is possible to emit the light L RGB that is adjusted and has high quality, as a light source for a display device.
  • the three sets of the composite bases 11 C include the red composite base 11 C 1 that includes the first base 11 A for mounting the red laser diode 31 R, the green composite base 11 C 2 that includes the first base 11 A four mounting the green laser diode 31 G, and the blue composite base 11 C 3 that includes the first base 11 A for mounting the blue laser diode 31 B, and the interval D 1 that is a smaller one of the interval between the red composite base 11 C 1 and the green composite base 11 C 2 and the interval between the red composite base 11 C 1 and the blue composite base 11 C 3 is greater than the interval D 2 between the green composite base 11 C 2 and the blue composite base 11 C 3 .
  • the interval D 1 that is a smaller one of the interval between the red composite base 11 C 1 and the green composite base 11 C 2 and the interval between the red composite base 11 C 1 and the blue composite base 11 C 3 is greater than the interval D 2 between the green composite base 11 C 2 and the blue composite base 11 C 3 .
  • the three sets of the composite bases 11 C are arranged such that the directions of the light L R , L G , and L B emitted from the respective mounted laser diodes (the red laser diode 31 R, the green laser diode 31 G, and the blue laser diode 31 B) are oriented in directions in which the light does not hit the three sets of the composite bases 11 C.
  • the red laser diode 31 R, the green laser diode 31 G, and the blue laser diode 31 B are oriented in directions in which the light does not hit the three sets of the composite bases 11 C.
  • the plurality of electrical element mounting packages (the light emitting element mounting package A 1 to A 17 ) are connected to one another. Thereby, it is possible to obtain an array electrical device.
  • the electrical element mounting packages (the light emitting element mounting package A 1 to A 17 ) are sintered integrally. Thereby, it is possible to obtain an array electrical device with high heat dissipation performance and high strength.
  • the electrical device includes the electrical element mounting package (the light emitting element mounting package A 1 to A 17 ), and the electrical element (the light emitting element 30 , the laser diode 31 , the red laser diode 31 R, the green laser diode 31 G, and the blue laser diode 31 B) that is mounted on the mounting surface 11 a of the electrical element mounting package (the light emitting element mounting package A 1 to A 17 ).
  • the electrical element mounting package the light emitting element mounting package A 1 to A 17
  • the electrical element the light emitting element mounting package A 1 to A 17
  • the electrical device includes the electrical element mounting package (the light emitting element mounting package A 1 to A 17 ), the electrical element (the light emitting element 30 , the laser diode 31 , the red laser diode 31 R, the green laser diode 31 G, and the blue laser diode 31 B) that is mounted on the mounting surface 11 a of the electrical element mounting package (the light emitting element mounting package A 1 to A 17 ), and the cap 40 that is provided on the sealing metal film 20 and has the side window 41 .
  • the electrical element mounting package the light emitting element mounting package A 1 to A 17
  • the electrical element the light emitting element 30 , the laser diode 31 , the red laser diode 31 R, the green laser diode 31 G, and the blue laser diode 31 B
  • the electrical device includes the array package C 1 , and the electrical element (the light emitting element 30 , the laser diode 31 , the red laser diode 31 R, the green laser diode 31 G, and the blue laser diode 31 B) that is mounted on the mounting surface 11 a of the array package C 1 .
  • the electrical element the light emitting element 30 , the laser diode 31 , the red laser diode 31 R, the green laser diode 31 G, and the blue laser diode 31 B

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JP6577616B2 (ja) 2019-09-18
RU2019106302A (ru) 2020-09-16
US11784459B2 (en) 2023-10-10
JP6884823B2 (ja) 2021-06-09
JP6305668B1 (ja) 2018-04-04
CN109564900A (zh) 2019-04-02
JP6577617B2 (ja) 2019-09-18
EP3499559A4 (en) 2020-03-18
KR102449952B1 (ko) 2022-10-04
EP3499559A1 (en) 2019-06-19
WO2018030486A1 (ja) 2018-02-15
JP2019195097A (ja) 2019-11-07
JP2019195096A (ja) 2019-11-07
KR20190034545A (ko) 2019-04-02
US20220094135A1 (en) 2022-03-24
JPWO2018030486A1 (ja) 2018-08-09

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