[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

US20160139451A1 - Electronic device and manufacturing method thereof - Google Patents

Electronic device and manufacturing method thereof Download PDF

Info

Publication number
US20160139451A1
US20160139451A1 US15/002,281 US201615002281A US2016139451A1 US 20160139451 A1 US20160139451 A1 US 20160139451A1 US 201615002281 A US201615002281 A US 201615002281A US 2016139451 A1 US2016139451 A1 US 2016139451A1
Authority
US
United States
Prior art keywords
frame member
welded portion
frame
electronic device
punch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/002,281
Inventor
Shu-Hua DAI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wistron Corp
Original Assignee
Wistron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wistron Corp filed Critical Wistron Corp
Priority to US15/002,281 priority Critical patent/US20160139451A1/en
Publication of US20160139451A1 publication Critical patent/US20160139451A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0053—Prismatic sheet or layer; Brightness enhancement element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133504—Diffusing, scattering, diffracting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133524—Light-guides, e.g. fibre-optic bundles, louvered or jalousie light-guides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0051—Diffusing sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/13332—Front frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133325—Assembling processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133328—Segmented frames
    • G02F2001/133314—
    • G02F2001/13332—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49947—Assembling or joining by applying separate fastener
    • Y10T29/49966—Assembling or joining by applying separate fastener with supplemental joining
    • Y10T29/49968—Metal fusion joining

Definitions

  • the present invention relates to a method for manufacturing an electronic device, and in particular to a method providing a smooth device appearance.
  • the metal frame of a liquid-crystal television is made by combining separated pieces of sheet metal.
  • the metal frame is made by combining by four pieces of sheet metal (to form four sides of the metal frame), wherein the four pieces of sheet metal are connected to each other by welding. After the four pieces of sheet metal of the metal frame are welded together, the metal frame is punched to be bent.
  • the welded portions (welding seams) between the pieces of sheet metal are not smooth. Conventionally, the welded portions are planarized by polishing. However, the polishing process reduces the thickness of the welded portion, and the surface sinking occurs on the welded portion after the metal frame is punched and bent.
  • a method for manufacturing an electronic device including the following steps. First, an outer frame is provided, wherein the outer frame comprises the first frame member and the second frame member. Next, the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion is formed between the first frame member and the second frame member. Then, a punch pin and a punch base are provided. Next, the connected structure is placed on the punch base. Finally, the connected structure is punched by the punch pin.
  • a method for manufacturing an electronic device including the following steps. First, an outer frame is provided, wherein the outer frame comprises the first frame member and the second frame member. Next, the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion is formed between the first frame member and the second frame member. Then, a punch pin and a punch base are provided. Next, the connected structure is placed on the punch base. Finally, the connected structure is punched by the punch pin.
  • the electronic device includes a liquid-crystal display module, a diffuser, a prism sheet, a light guide, a back panel and an outer frame.
  • the diffuser, the prism sheet and the light guide are sandwiched between the liquid-crystal display module and the back panel.
  • the outer frame covers the liquid-crystal display module, wherein the outer frame includes a first frame member and a second frame member, a welded portion is formed between the first frame member and the second frame member, the outer frame includes an outer surface, and the outer surface includes a planar area at the welded portion.
  • the welded portion between the frame members is planarized by punch-shaping, and the material of the welded portion need not be removed. Therefore, a surface sinking problem at the welded portion is prevented in the following punch-bending process. Additionally, the appearance of the outer frame can be punch-shaped rapidly. Compared to the conventional polishing process, the method of the embodiment of the invention reduces work time and cost.
  • FIG. 1 shows the electronic device of the embodiment of the invention
  • FIG. 2 shows the method for manufacturing the electronic device of the embodiment of the invention
  • FIGS. 3A-3D show punch-shaping steps of the method for manufacturing the electronic device of the embodiment of the invention
  • FIG. 4A shows the appearance of the welded portion at the outer surface of the outer frame
  • FIG. 4B shows the appearance of the welded portion at the inner surface of the outer frame.
  • FIG. 1 shows an electronic device 1 of an embodiment of the invention, comprising a liquid-crystal display module 10 , a plastic frame 20 , a diffuser 30 , a prism sheet 40 , a light guide 50 , a back panel 60 and an outer frame 100 .
  • the plastic frame 20 , the diffuser 30 , the prism sheet 40 and the light guide 50 are sandwiched between the liquid-crystal display module 10 and the back panel 60 .
  • the outer frame 100 comprises a first frame member 110 , a second frame member 120 , a third frame member 130 and a fourth frame member 140 .
  • a method for manufacturing the electronic device is described with the combination of the first frame member 110 and the second frame member 120 , for example.
  • an outer frame is provided, wherein the outer frame comprises the first frame member and the second frame member (S 1 ).
  • the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion (welding seam) is formed between the first frame member and the second frame member (S 2 ).
  • a punch pin and a punch base are provided (S 3 ).
  • the connected structure (comprising the first frame member and second frame member) is placed on the punch base (S 4 ).
  • the connected structure is punched by the punch pin (S 5 ).
  • FIGS. 3A-3C show steps S 3 ⁇ S 5 of the method for manufacturing the electronic device of the embodiment of the invention.
  • a welded portion (welding seam) 151 is formed between the first frame member 110 and second frame member 120 .
  • the first frame member 110 and the second frame member 120 are placed on the punch base 210 , and an elevation difference is formed between the first frame member 110 and the second frame member 120 .
  • the first frame member 110 , the second frame member 120 and the welded portion 151 are simultaneously punched with the punch pin 220 .
  • the first frame member 110 and the second frame member 120 are connected by laser welding. Therefore, the material thickness of the welded portion 151 is slightly thinner than the material thickness of the first frame member 110 and the second frame member 120 .
  • the punch base 210 comprises a base surface (planar) 211 , and the first frame member 110 and the second frame member 120 are placed on the base surface 211 to be punched.
  • the punch pin 220 comprises a shaping plane 221 and a shaping protrusion 222 , the shaping protrusion 222 is formed on the shaping plane 221 , and the shaping protrusion 222 corresponds to the welded portion 151 .
  • the shaping plane 221 contacts the first frame member 110 and the second frame member 120
  • the shaping protrusion 222 contacts the welded portion 151 and neighboring portions of the welded portion 151 (a portion of the first frame member 110 and a portion of the second frame member 120 ).
  • a width of the welded portion 151 is shorter than or equal to 0.5 mm, and a width of the shaping protrusion 222 is longer than the width of the welded portion 151 by 1 mm ⁇ 2 mm.
  • the outer frame 100 comprises an inner surface 101 and an outer surface 102 .
  • the inner surface 101 faces the liquid-crystal display module 10 .
  • the outer surface 102 contacts the base surface 211 , and the inner surface 101 contacts the punch pin 220 . Therefore, with reference to FIG. 3D , after the punch-shaping process, the outer surface 102 comprises a planar area at the welded portion 151 ( FIG. 4A ), and the inner surface 101 comprises a groove 152 ( FIG. 4B ) formed over the welded portion.
  • a width of the groove 152 is longer than the width of the welded portion by 1 mm ⁇ 2 mm.
  • the combination of the second frame member 120 and the third frame member 130 , the combination of the third frame member 130 and the fourth frame member 140 , and the combination of the fourth frame member 140 and the first frame member 110 can also utilize the manufacturing process described above, and the related details are omitted for brevity.
  • the welded portion between the frame members is planarized by punch-shaping, and the material of the welded portion must not be removed. Therefore, a surface sinking problem at the welded portion is prevented in the following punch-bending process. Additionally, the appearance of the outer frame can be punch-shaped rapidly. Compared to the conventional polishing process, the method of the embodiment of the invention reduces work, time and cost.

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

An electronic device is provided. The electronic device includes a liquid-crystal display module, a diffuser, a prism sheet, a light guide, a back panel and an outer frame. The diffuser, the prism sheet and the light guide are sandwiched between the liquid-crystal display module and the back panel. The outer frame covers the liquid-crystal display module, wherein the outer frame includes a first frame member and a second frame member, a welded portion is formed between the first frame member and the second frame member, the outer frame includes an outer surface, and the outer surface includes a planar area at the welded portion.

Description

    CROSS REFERENCE TO RELATED APPLICATIONS
  • This application is a Divisional of pending U.S. patent application Ser. No. 14/214,401, filed Mar. 14, 2014 and entitled “Electronic device and manufacturing method thereof”, which claims priority of China Patent Application No. 201310513871.9, filed on Oct. 25, 2013, the entirety of which is incorporated by reference herein.
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a method for manufacturing an electronic device, and in particular to a method providing a smooth device appearance.
  • 2. Description of the Related Art
  • The metal frame of a liquid-crystal television is made by combining separated pieces of sheet metal. Commonly, the metal frame is made by combining by four pieces of sheet metal (to form four sides of the metal frame), wherein the four pieces of sheet metal are connected to each other by welding. After the four pieces of sheet metal of the metal frame are welded together, the metal frame is punched to be bent. The welded portions (welding seams) between the pieces of sheet metal are not smooth. Conventionally, the welded portions are planarized by polishing. However, the polishing process reduces the thickness of the welded portion, and the surface sinking occurs on the welded portion after the metal frame is punched and bent.
    • BRIEF SUMMARY OF THE INVENTION
  • In one embodiment, a method for manufacturing an electronic device is provided, including the following steps. First, an outer frame is provided, wherein the outer frame comprises the first frame member and the second frame member. Next, the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion is formed between the first frame member and the second frame member. Then, a punch pin and a punch base are provided. Next, the connected structure is placed on the punch base. Finally, the connected structure is punched by the punch pin.
  • A method for manufacturing an electronic device is provided, including the following steps. First, an outer frame is provided, wherein the outer frame comprises the first frame member and the second frame member. Next, the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion is formed between the first frame member and the second frame member. Then, a punch pin and a punch base are provided. Next, the connected structure is placed on the punch base. Finally, the connected structure is punched by the punch pin.
  • An electronic device is provided. The electronic device includes a liquid-crystal display module, a diffuser, a prism sheet, a light guide, a back panel and an outer frame. The diffuser, the prism sheet and the light guide are sandwiched between the liquid-crystal display module and the back panel. The outer frame covers the liquid-crystal display module, wherein the outer frame includes a first frame member and a second frame member, a welded portion is formed between the first frame member and the second frame member, the outer frame includes an outer surface, and the outer surface includes a planar area at the welded portion.
  • Utilizing the method for manufacturing the electronic device of the embodiment of the invention, the welded portion between the frame members is planarized by punch-shaping, and the material of the welded portion need not be removed. Therefore, a surface sinking problem at the welded portion is prevented in the following punch-bending process. Additionally, the appearance of the outer frame can be punch-shaped rapidly. Compared to the conventional polishing process, the method of the embodiment of the invention reduces work time and cost.
  • A detailed description is given in the following embodiments with reference to the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
  • FIG. 1 shows the electronic device of the embodiment of the invention;
  • FIG. 2 shows the method for manufacturing the electronic device of the embodiment of the invention;
  • FIGS. 3A-3D show punch-shaping steps of the method for manufacturing the electronic device of the embodiment of the invention;
  • FIG. 4A shows the appearance of the welded portion at the outer surface of the outer frame; and
  • FIG. 4B shows the appearance of the welded portion at the inner surface of the outer frame.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.
  • FIG. 1 shows an electronic device 1 of an embodiment of the invention, comprising a liquid-crystal display module 10, a plastic frame 20, a diffuser 30, a prism sheet 40, a light guide 50, a back panel 60 and an outer frame 100. The plastic frame 20, the diffuser 30, the prism sheet 40 and the light guide 50 are sandwiched between the liquid-crystal display module 10 and the back panel 60. The outer frame 100 comprises a first frame member 110, a second frame member 120, a third frame member 130 and a fourth frame member 140.
  • With reference to FIG. 2, a method for manufacturing the electronic device is described with the combination of the first frame member 110 and the second frame member 120, for example. First, an outer frame is provided, wherein the outer frame comprises the first frame member and the second frame member (S1). Next, the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion (welding seam) is formed between the first frame member and the second frame member (S2). Then, a punch pin and a punch base are provided (S3). Next, the connected structure (comprising the first frame member and second frame member) is placed on the punch base (S4). Finally, the connected structure is punched by the punch pin (S5).
  • FIGS. 3A-3C show steps S3˜S5 of the method for manufacturing the electronic device of the embodiment of the invention. With reference to FIG. 3A, a welded portion (welding seam) 151 is formed between the first frame member 110 and second frame member 120. The first frame member 110 and the second frame member 120 are placed on the punch base 210, and an elevation difference is formed between the first frame member 110 and the second frame member 120. With reference to FIGS. 3B and 3C, the first frame member 110, the second frame member 120 and the welded portion 151 are simultaneously punched with the punch pin 220.
  • With reference to FIG. 3A, in one embodiment, the first frame member 110 and the second frame member 120 are connected by laser welding. Therefore, the material thickness of the welded portion 151 is slightly thinner than the material thickness of the first frame member 110 and the second frame member 120. The punch base 210 comprises a base surface (planar) 211, and the first frame member 110 and the second frame member 120 are placed on the base surface 211 to be punched. The punch pin 220 comprises a shaping plane 221 and a shaping protrusion 222, the shaping protrusion 222 is formed on the shaping plane 221, and the shaping protrusion 222 corresponds to the welded portion 151.
  • With reference to FIGS. 3B˜3C, when the punch-shaping process is performed, the shaping plane 221 contacts the first frame member 110 and the second frame member 120, and the shaping protrusion 222 contacts the welded portion 151 and neighboring portions of the welded portion 151 (a portion of the first frame member 110 and a portion of the second frame member 120).
  • In one embodiment, a width of the welded portion 151 is shorter than or equal to 0.5 mm, and a width of the shaping protrusion 222 is longer than the width of the welded portion 151 by 1 mm˜2 mm.
  • With reference to FIGS. 3A˜3C, the outer frame 100 comprises an inner surface 101 and an outer surface 102. When the electronic device is assembled, the inner surface 101 faces the liquid-crystal display module 10. When the punch-shaping process is performed, the outer surface 102 contacts the base surface 211, and the inner surface 101 contacts the punch pin 220. Therefore, with reference to FIG. 3D, after the punch-shaping process, the outer surface 102 comprises a planar area at the welded portion 151 (FIG. 4A), and the inner surface 101 comprises a groove 152 (FIG. 4B) formed over the welded portion. In one embodiment, a width of the groove 152 is longer than the width of the welded portion by 1 mm˜2 mm.
  • An example of the combination of the first frame member 110 and the second frame member 120 is described above. The combination of the second frame member 120 and the third frame member 130, the combination of the third frame member 130 and the fourth frame member 140, and the combination of the fourth frame member 140 and the first frame member 110 can also utilize the manufacturing process described above, and the related details are omitted for brevity.
  • Utilizing the method for manufacturing the electronic device of the embodiment of the invention, the welded portion between the frame members is planarized by punch-shaping, and the material of the welded portion must not be removed. Therefore, a surface sinking problem at the welded portion is prevented in the following punch-bending process. Additionally, the appearance of the outer frame can be punch-shaped rapidly. Compared to the conventional polishing process, the method of the embodiment of the invention reduces work, time and cost.
  • Use of ordinal terms such as “first”, “second”, “third”, etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having the same name (but for use of the ordinal term) to distinguish the claim elements.
  • While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims (4)

What is claimed is:
1. An electronic device, comprising:
a liquid-crystal display module;
a diffuser;
a prism sheet;
a light guide;
a back panel, wherein the diffuser, the prism sheet and the light guide are sandwiched between the liquid-crystal display module and the back panel; and
an outer frame, covering the liquid-crystal display module, wherein the outer frame comprises a first frame member and a second frame member, a welded portion is formed between the first frame member and the second frame member, the outer frame comprises an outer surface, and the outer surface comprises a planar area at the welded portion.
2. The electronic device as claimed in claim 1, wherein a width of the welded portion is shorter than or equal to 0.5 mm.
3. The electronic device as claimed in claim 2, wherein the outer frame comprises an inner surface, the inner surface comprises a groove formed over the welded portion, and a width of the groove is longer than the width of the welded portion by 1 mm˜2 mm.
4. The electronic device as claimed in claim 1, wherein the first frame member is connected to the second frame member by laser welding.
US15/002,281 2013-10-25 2016-01-20 Electronic device and manufacturing method thereof Abandoned US20160139451A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/002,281 US20160139451A1 (en) 2013-10-25 2016-01-20 Electronic device and manufacturing method thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201310513871.9 2013-10-25
CN201310513871.9A CN104570413B (en) 2013-10-25 2013-10-25 Case of electronic device and electronic device case manufacturing method
US14/214,401 US9329420B2 (en) 2013-10-25 2014-03-14 Electronic device and manufacturing method thereof
US15/002,281 US20160139451A1 (en) 2013-10-25 2016-01-20 Electronic device and manufacturing method thereof

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US14/214,401 Division US9329420B2 (en) 2013-10-25 2014-03-14 Electronic device and manufacturing method thereof

Publications (1)

Publication Number Publication Date
US20160139451A1 true US20160139451A1 (en) 2016-05-19

Family

ID=52995023

Family Applications (2)

Application Number Title Priority Date Filing Date
US14/214,401 Active 2034-07-19 US9329420B2 (en) 2013-10-25 2014-03-14 Electronic device and manufacturing method thereof
US15/002,281 Abandoned US20160139451A1 (en) 2013-10-25 2016-01-20 Electronic device and manufacturing method thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US14/214,401 Active 2034-07-19 US9329420B2 (en) 2013-10-25 2014-03-14 Electronic device and manufacturing method thereof

Country Status (3)

Country Link
US (2) US9329420B2 (en)
CN (1) CN104570413B (en)
TW (1) TWI533779B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9888588B2 (en) 2015-06-15 2018-02-06 Bernecker + Rainer Industrie-Elektronik Ges.M.B.H. Frame and input and output device comprising said frame

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6294967B2 (en) * 2014-07-29 2018-03-14 シャープ株式会社 Electronics

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010011673A1 (en) * 1997-07-23 2001-08-09 Kinya Aota Method of forming structural body using friction stir welding, and structural body formed
US20020025406A1 (en) * 2000-08-25 2002-02-28 Nec Corporation Metal mask structure and method for maufacturing thereof
US20020082117A1 (en) * 2000-06-09 2002-06-27 Bridgestone Sports Co., Ltd. Golf club
US20030017356A1 (en) * 2000-10-02 2003-01-23 The Boeing Company Joining of structural members by welding
US20080192412A1 (en) * 2007-02-13 2008-08-14 Jochu Technology Co. Ltd. (A Corporation Of Taiwan R.O.C.) Flat display panel frame
US20100245710A1 (en) * 2004-01-07 2010-09-30 Yong-Il Kim Chassis and display device having same
CN202652790U (en) * 2012-07-09 2013-01-02 州巧科技股份有限公司 Combined type frame
US20130078031A1 (en) * 2010-06-07 2013-03-28 Shuichi Nakamura Ultrahigh-strength welded joint and production method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1277431C (en) * 1987-10-16 1990-12-04 Masayasu Kojima Metal case for housing an ic and a manufacturing method therefor
CN2511997Y (en) * 2001-11-16 2002-09-18 彭庆龙 Aluminum extruded frame for liquid crystal display device
JP3538419B2 (en) * 2002-08-20 2004-06-14 川崎重工業株式会社 Friction stir welding equipment
KR100720931B1 (en) * 2006-06-12 2007-05-23 (주)동광디스플레이 Manufacturing method of the housing for lcd module and housing made by the same
CN201373957Y (en) * 2009-03-24 2009-12-30 上海森林特种钢门有限公司 Welded and jointed panel framework

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010011673A1 (en) * 1997-07-23 2001-08-09 Kinya Aota Method of forming structural body using friction stir welding, and structural body formed
US20020082117A1 (en) * 2000-06-09 2002-06-27 Bridgestone Sports Co., Ltd. Golf club
US20020025406A1 (en) * 2000-08-25 2002-02-28 Nec Corporation Metal mask structure and method for maufacturing thereof
US20030017356A1 (en) * 2000-10-02 2003-01-23 The Boeing Company Joining of structural members by welding
US20100245710A1 (en) * 2004-01-07 2010-09-30 Yong-Il Kim Chassis and display device having same
US20080192412A1 (en) * 2007-02-13 2008-08-14 Jochu Technology Co. Ltd. (A Corporation Of Taiwan R.O.C.) Flat display panel frame
US20130078031A1 (en) * 2010-06-07 2013-03-28 Shuichi Nakamura Ultrahigh-strength welded joint and production method thereof
CN202652790U (en) * 2012-07-09 2013-01-02 州巧科技股份有限公司 Combined type frame

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
English translation of CN 202652790 U, Title: Combined type frame , Author: CAI WENQING; Date of publication: 2013-01-02 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9888588B2 (en) 2015-06-15 2018-02-06 Bernecker + Rainer Industrie-Elektronik Ges.M.B.H. Frame and input and output device comprising said frame

Also Published As

Publication number Publication date
US20150116629A1 (en) 2015-04-30
CN104570413B (en) 2017-12-08
TW201517746A (en) 2015-05-01
TWI533779B (en) 2016-05-11
CN104570413A (en) 2015-04-29
US9329420B2 (en) 2016-05-03

Similar Documents

Publication Publication Date Title
US7948574B2 (en) Bezel made of two L-shaped and two I-shaped bezel parts joined end to end for accommodating display panel
US8902376B2 (en) Backlight module and display device using the same
US20160351593A1 (en) A display panel and a manufacturing method thereof
CN104158924A (en) Display device and mobile terminal having the same
US20160139451A1 (en) Electronic device and manufacturing method thereof
JP2005331911A (en) Light emitting device, backlight for liquid crystal display device, and liquid crystal display device
US8605413B2 (en) Electronic device housing and manufacturing method thereof
JP2013046930A (en) Hemming material, device and method for press hemming or roll hemming
US20200117236A1 (en) Display device
US8466377B2 (en) Electronic device housing
US20130140967A1 (en) Housing of electronic device and method for manufacturing same
US9936592B2 (en) Rear housing of display apparatus and display apparatus
CN103008417B (en) The stamping manufacture method of electronic installation metal shell and housing
CN201047895Y (en) Backlight module and frame structure thereof
US9475156B2 (en) Heat-dissipation unit and method of manufacturing same
US20120032567A1 (en) Electronic device frame
KR102050588B1 (en) Manufacturing method of mobile phone metal case formed by banding and process using cam cype mold
US20190025496A1 (en) Panel light and manufacturing method thereof
CN108449701B (en) Terminal device, receiver decoration and its receiver decoration processing method
US10503024B2 (en) Liquid crystal display panel and liquid crystal display device
JP2016090686A (en) Display panel hold frame, display device and manufacturing method of display device
TWI489881B (en) Fixer for loudspeaker and electronic device using the same
US9885897B2 (en) Front frame of liquid crystal display and method of forming the same
KR102536721B1 (en) Case for display panel and display device comprising the same
US20160273844A1 (en) Fixing structure for heat dissipation element

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION