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US20140202665A1 - Integrated thin film evaporation thermal spreader and planar heat pipe heat sink - Google Patents

Integrated thin film evaporation thermal spreader and planar heat pipe heat sink Download PDF

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Publication number
US20140202665A1
US20140202665A1 US13/746,453 US201313746453A US2014202665A1 US 20140202665 A1 US20140202665 A1 US 20140202665A1 US 201313746453 A US201313746453 A US 201313746453A US 2014202665 A1 US2014202665 A1 US 2014202665A1
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US
United States
Prior art keywords
heat
working fluid
thin film
film evaporator
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/746,453
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English (en)
Inventor
John Steven Paschkewitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Palo Alto Research Center Inc
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Palo Alto Research Center Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Palo Alto Research Center Inc filed Critical Palo Alto Research Center Inc
Priority to US13/746,453 priority Critical patent/US20140202665A1/en
Assigned to PALO ALTO RESEARCH CENTER INCORPORATED reassignment PALO ALTO RESEARCH CENTER INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PASCHKEWITZ, JOHN STEVEN
Priority to JP2014004230A priority patent/JP2014143417A/ja
Priority to CN201410020047.4A priority patent/CN103943576A/zh
Priority to EP14152200.3A priority patent/EP2757584A3/en
Publication of US20140202665A1 publication Critical patent/US20140202665A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present application relates generally to thermal management. It finds particular application in conjunction with cooling heat-producing bodies, such as integrated circuits, and will be described with particular reference thereto. However, it is to be appreciated that the present application is also amenable to other like applications.
  • Thermal management for electronics packaging is an active area of research given the increasing demands for high power density and three-dimensional (3D) integrated circuit (IC) architectures.
  • 3D three-dimensional integrated circuit
  • FIG. 1 a typical electronics package for a 3D IC is shown. As can be seen, the electronics package relies upon a passive heat sink for thermal management.
  • 3D die stacks have severe problems with hotspots on each of the layers.
  • Spreading this heat is a major challenge since the typical combination of solder balls, (relatively) low thermal conductivity filler and copper-filled through silicon vias (TSVs) does not provide a sufficiently conductive thermal path. Further, spreading the heat only partially solves the problem as the heat still needs to be dissipated to the environment.
  • thermoelectric thermal bump examples of which are shown in FIG. 1 .
  • thermoelectric thermal bumps suffer from the typical shortcomings of thermoelectric materials: poor efficiency and high cost.
  • thin film evaporation uses a phase change process such as boiling, but mitigates some of the well-known shortcomings of boiling. Specifically, thin film evaporation mitigates the amount of superheat required to initiate boiling, the unpredictability of boiling nucleation sites, handling of combined vapor-liquid flow after boiling (in a flow system) and the critical heat flux (CHF) in which the hot surface dries out if the heat flux is too high.
  • phase change process such as boiling
  • CHF critical heat flux
  • the second reason can be clarified using the relationship between heat transferred, thermal resistance and temperature drop, and the definition of the heat transfer coefficient.
  • a high thermal resistance means less heat is transferred and there is a large temperature gradient across the material of interest.
  • the present application provides new and improved methods and systems which overcome the above-referenced challenges.
  • a heat dissipation device to provide thermal spreading and cooling for a heat-producing body.
  • a thin film evaporator in thermal communication with the heat-producing body removes heat from the heat-producing body using a working fluid.
  • a pumping element at least one of: 1) pumps working fluid to the thin film evaporator; and 2) augments transfer of working fluid to the thin film evaporator.
  • a heat dissipation method to provide thermal spreading and cooling for a heat-producing body is provided.
  • a thin film evaporator in thermal communication with the heat-producing body, heat from the heat-producing body is removed using a working fluid.
  • a heat pipe integrated with the thin film evaporator and extending from the thin film evaporator heat removed by the thin film evaporator is dissipated to the external environment of the heat dissipation device.
  • a pumping element at least one of: 1) working fluid is pumped to the thin film evaporator; and 2) transfer of working fluid to the thin film evaporator is augmented.
  • a heat dissipation device to provide thermal spreading and cooling for a heat-producing body.
  • a sealed housing includes a fluid reservoir of working fluid in liquid phase and a vapor chamber, the heat-producing body thermally coupled to an external surface of the sealed housing.
  • a thin film evaporator is within the sealed housing and in thermal communication with an internal surface of the sealed housing adjacent the external surface. The thin film evaporator receives working fluid in liquid phase from the fluid reservoir and vaporizes the received working fluid to working fluid in gaseous phase using heat from the heat-producing device.
  • a heat pipe within the sealed housing transfers the working fluid in gaseous phase away from the thin film evaporator, condenses the working fluid in gaseous phase to liquid phase, and returning the condensed working fluid to the fluid reservoir.
  • a pumping element at least one of: 1) pumps working fluid to the thin film evaporator; and 2) augments transfer of working fluid to the thin film evaporator.
  • FIG. 1 illustrates an electronics package relying on passive cooling
  • FIG. 2 illustrates an embodiment of a heat dissipation device according to aspects of the present application
  • FIG. 3A illustrates a cross sectional view of the heat dissipation device of FIG. 2 ;
  • FIG. 3B illustrates an alternative cross sectional view of the heat dissipation device of FIG. 2 ;
  • FIG. 4 illustrates a return wick according to aspects of the present application.
  • FIG. 5 illustrates another embodiment of a heat dissipation device according to aspects of the present application.
  • FIG. 6 illustrates another embodiment of a heat dissipation device using pulsating heat pipe technology according to aspects of the present application.
  • FIG. 7 illustrates another view of the heat dissipation device according to FIG. 6 .
  • This present application combines an actively driven thin film evaporator for spreading heat with an integrated planar heat pipe extended surface for heat sinking.
  • the thin film evaporator allows for a high rate of heat removal to remove hot spots, and the integrated planar heat pipe transports heat from the thin film evaporator to an extended surface for dissipation to the environment or sinking to an interposer layer.
  • a perspective view of a heat dissipation device 10 of the present application is provided.
  • the heat dissipation device 10 provides thermal spreading and cooling to an associated heat-producing body 12 , such as an integrated circuit (IC) package (illustrated).
  • IC integrated circuit
  • the IC package is three-dimensional (3D).
  • the heat dissipation device 10 is capable of managing heat fluxes of 10 to 1000 Watts per square centimeter (W/cm2) or more, such as 100 W/cm2.
  • the heat dissipation device 10 includes a sealed housing 14 , which is constructed of a thermally conductive material.
  • the thermally conductive material can, for example, include one or more of copper, copper foil, copper alloys, aluminum, aluminum alloys, polyimides, metals, and the like.
  • the sealed housing 14 can be flexible and seals in a working fluid 16 ( FIGS. 3A & B) for transfer of heat away from the heat-producing device 12 , as discussed hereafter.
  • the sealed housing 14 when the sealed housing 14 is flexible, the sealed housing 14 can be shaped after manufacture when installing the heat dissipation device 10 for the heat-producing body 12 .
  • An external surface 18 of an interface portion 20 of the sealed housing 14 thermally contacts the heat-producing body 12 .
  • the external surface 18 can directly contact the heat-producing body 12 .
  • the external surface 18 can indirectly contact the heat-producing body 12 by way of a substrate upon which the heat-producing body 12 rests or a thermal interface material intermediate the heat-producing body 12 and the external surface 18 .
  • the interface portion 20 is formed from copper, copper foil, copper alloys, aluminum, or aluminum alloys, but other materials are contemplated.
  • the sealed housing 14 further includes one or more extended portions or fins 22 (two as illustrated).
  • the extended portions 22 are used to convey heat into the external environment, typically by convection, or to sink heat to an interposer layer.
  • the extended portions 22 are typically formed from a flexible polyimide or metallic substrate to allow the extended portions 22 to be shaped into a desired form factor after manufacture, but other materials are contemplated.
  • the heat dissipation device 10 includes a vapor chamber 24 and a fluid reservoir 26 .
  • the vapor chamber 24 includes an internal surface 28 of the interface portion 20 adjacent the external portion 18 of the interface portion 20 . Further, the vapor chamber 24 extends into each of the extended portions 22 of the sealed housing 14 , typically to the distal ends 30 of the extended portions 22 .
  • the fluid reservoir 26 is typically disposed in the interface portion 20 of the sealed housing 14 central to the extended portions 22 .
  • the fluid reservoir 26 holds working fluid 16 in the liquid phase (i.e., liquid working fluid 32 ), and the vapor chamber 24 holds working fluid 16 in the gaseous phase (i.e., gaseous working fluid 34 shown by the arrows in the vapor chamber 24 ).
  • the working fluid 16 can include, for example, water, Freon, acetone, alcohol, and the like.
  • the working fluid 16 is employed to transfer heat away from the heat-producing body 12 through the sealed housing 14 using thin film evaporation, where the extended portions 22 act as heat pipes. In this way, heat fluxes of 10 to 1000 Watts per square centimeter (W/cm2) or more can be managed.
  • the heat dissipation device 10 includes a thin film evaporator 36 for evaporating liquid working fluid 32 from the fluid reservoir 26 into gaseous working fluid 34 with heat from the heat-producing body 12 .
  • the thin film evaporator 36 is actively driven to ensure sufficient transfer of working fluid 16 to cool the heat-producing body 12 , as discussed above, but it can also be passive.
  • the thin film evaporator 36 can be actively driven when the heat-producing body 12 is producing heat exceeding a predetermined threshold and passively driven when the heat-producing body 12 is producing heat less than the predetermined threshold.
  • the thin film evaporator 36 includes an evaporator wick 38 in thermal contact with the internal surface 28 of the interface portion 20 of the sealed housing 14 and within the vapor chamber 24 .
  • the surface area of the evaporator wick 38 in contact with the internal surface 28 is approximately (i.e., +/ ⁇ 5%) equal to, or greater than, the surface area of the heat-producing device 12 in contact with the external surface 18 .
  • the evaporator wick 38 receives liquid working fluid 32 from the fluid reservoir 26 and disperses the liquid working fluid 32 substantially uniformly on the internal surface 28 of the interface portion 20 of the sealed housing 14 to form a thin layer 40 of liquid working fluid 32 .
  • the evaporator wick 38 is engineered to maximize the extent of capillary wicking and the area of the thin layer 40 .
  • the heat dissipating device 10 is designed to allow sufficient transfer of heat to the thin layer 40 of liquid working fluid 32 to cool the heat-producing body 12 .
  • R the heat transfer coefficient
  • a feed conduit 42 of the sealed housing 14 extends between the fluid reservoir 26 and the evaporator wick 38 to provide liquid working fluid 32 to the evaporator wick 38 from the fluid reservoir 26 .
  • the evaporator wick 38 draws liquid working fluid 32 from the fluid reservoir 26 by way of the feed conduit 42 using capillary action. This capillary action also serves to disperse the liquid working fluid 32 on the internal surface 28 of the interface portion 20 of the sealed housing 14 .
  • the greater the dispersion of liquid working fluid 32 the greater the transfer of heat from the heat-producing body 12 .
  • Additional feed channels are also contemplated to improve the transfer of liquid working fluid 32 to the evaporator wick 38 .
  • One or more synthetic jets 44 within the sealed housing 14 can be employed to improve the transfer of liquid working fluid 32 to gaseous working fluid 34 by removing gaseous working fluid 34 from the vapor chamber 24 and cooling the evaporator wick 38 to allow greater dispersion of the liquid working fluid 32 before evaporation.
  • the synthetic jets 44 include a plurality of synthetic jets arranged in a grid or other two-dimensional arrangement to cool, and/or remove gaseous working fluid 34 from, the whole of the evaporator wick 38 . Power is provided to the synthetic jets 44 by way of corresponding wires 46 and power sources 48 .
  • the synthetic jets 44 create a series of vortex rings of gaseous working fluid 34 in the vapor chamber 24 using corresponding orifices 50 and corresponding oscillating actuators 52 .
  • the axes of the vortex rings are suitably perpendicular to the internal surface 28 .
  • the oscillating actuators 52 are piezoelectric actuators (illustrated), but other oscillating actuators are contemplated. While any configuration of the synthetic jets 44 is contemplated, the oscillating actuators 52 of the synthetic jets 44 typically oscillate corresponding diaphragms along the axes of the vortex rings.
  • the oscillating actuators 52 can be the diaphragms (e.g., piezoelectric diaphragms), as illustrated, or merely oscillate the corresponding diaphragms.
  • the orifices 50 typically include corresponding open ends 54 through which the vortex rings enter the vapor chamber 24 from the orifices 50 .
  • the oscillating actuators 52 can be, for example, positioned within the orifices 50 to push vapor within the orifices 50 out the open ends 54 .
  • the orifices 50 can further include additional corresponding open ends 56 opposite the open ends 54 through which the vortex rings enter the vapor chamber 24 from the orifices 50 .
  • the oscillating actuators 52 can then be, for example, positioned at the additional open ends 54 to create the vortex rings using, for example, diaphragms spanning the additional open ends 54 .
  • the oscillating actuators 52 can also be employed to pump liquid working fluid 32 to the evaporator wick 38 by way of the feed conduit 42 to ensure that sufficient liquid working fluid 32 is provided to the evaporator wick 38 to prevent dry out of the thin layer 40 of liquid working fluid 32 .
  • the oscillating actuators 52 are out of plane (i.e., oscillate perpendicular to the direction flow of the liquid working fluid 32 ). In such instances, it's important to ensure that the liquid working fluid 32 can only flow in the direction of the feed conduit 42 . Other approaches to pumping the liquid working fluid 32 can also be employed.
  • the oscillating actuators 52 can be the diaphragms (illustrated) or merely oscillate the corresponding diaphragms.
  • the diaphragms partially define the wall of the fluid reservoir 26 and oscillate in and out of the fluid reservoir 26 .
  • the oscillations are perpendicular to the thin film evaporator 36 and the flow of liquid working fluid 32 .
  • the diaphragms pump liquid working fluid 32 .
  • the diaphragms creates the above described vortex rings.
  • the synthetic jets 44 can spray liquid working fluid 32 from the fluid reservoir 26 , or some other fluid, on to the evaporator wick 38 substantially uniformly. As illustrated in FIG. 3B , the synthetic jets 44 receive liquid working fluid 32 from corresponding feed wicks or conduits 58 , which control the flow of liquid working fluid 32 from the fluid reservoir 26 to the orifices 50 . This can help to disperse the liquid working fluid 32 on the internal surface 28 of the interface portion 20 of the sealed housing 14 to form the thin layer 40 of liquid working fluid 32 .
  • the thin film evaporator 36 employs the evaporator wick 38 for receiving and dispersing the liquid working fluid 32
  • other approaches for receiving and dispersing the liquid working fluid 32 can be employed.
  • a wickless approach or an electrohydrodynamics (EHD) polarization pumping in conjunction with an electrically conductive wick can be employed.
  • the synthetic jets 44 can spray the liquid working fluid 32 , as described above, on to the internal surface 28 to create the thin layer 40 of liquid working fluid 32 without the evaporator wick 38 .
  • the thin film evaporator 36 can work without the synthetic jets 44 , but optionally with the oscillating actuators 52 pumping liquid working fluid 32 as described above.
  • the thin film evaporator 36 and/or the synthetic jets 44 need to be designed to transfer and disperse a sufficient amount of liquid working fluid 32 to remove the heat transferred by the heat-producing body 12 to the thin layer 40 of liquid working fluid 32 .
  • thin film evaporator 36 and the synthetic jets 44 are designed around this equation.
  • the gaseous working fluid 34 is transported to the extended portions 22 , typically to the distal ends 30 of the extended portions 22 , by way of the vapor chamber 24 .
  • the synthetic jets 44 facilitate transport of the gaseous working 34 fluid to the extended portions 22 by pushing the gaseous working fluid 34 to the extended portions 22 .
  • the gaseous working fluid 34 dissipates and condenses back into liquid working fluid 32 .
  • each extended portion 22 Adjacent the vapor chamber 24 , each extended portion 22 includes a return wick 60 at least extending from the corresponding distal ends 30 to the fluid reservoir 26 and typically lining the extended portion 22 .
  • the return wicks 60 capture working fluid 16 as it condenses back to liquid and return it to the fluid reservoir 26 , typically using capillary action. In this way, the extended portions 22 can be viewed as planar heat pipes.
  • the design of the return wicks 60 is important to the successful operation of the heat dissipation device 10 .
  • the flow of working fluid 16 through the return wicks 60 must be sufficient to complete the working fluid recirculation loop (shown by the arrows).
  • the return wicks 60 are multi-layer wicks with engineered hydrophobic condensation surfaces and a sub-layer of feed channels that return the liquid working fluid 32 to the fluid reservoir 26 .
  • gaseous working fluid 34 condenses into a ball 62 at the apex 64 of one of the feed channels 66 before flowing into the feed channel for transport back to the fluid reservoir 26 .
  • examples of the return wicks 60 at different magnifications are provided.
  • wickless approach or an electrohydrodynamics (EHD) polarization pumping in conjunction with an electrically conductive wick can be employed.
  • EHD electrohydrodynamics
  • FIG. 5 shows a cut away of the heat dissipation device 10 with an emphasis on the extended portions 22 . Also, the extended portions 22 are not bent upward as done in the FIGS. 2 , 3 A and 3 B. As noted above, the heat dissipation device 10 can be shaped as need be after manufacture.
  • the heat dissipation device 10 of this embodiment works as described in connection with the embodiment of FIG. 2 . Hence, elements paralleling those of the discussion of the embodiment of the heat dissipation device 10 of FIG. 2 are labeled the same.
  • the evaporator wick 38 receives liquid working fluid 32 using capillary action and/or the synthetic jets 44 from the fluid reservoir 26 .
  • the evaporator wick 38 creates the thin layer 40 (not shown in FIG. 5 ) of liquid working fluid 32 on the internal surface 28 (not shown in FIG. 5 ) of the interface portion 20 of the sealed housing 14 .
  • the gaseous working fluid 34 (not shown in FIG. 5 ) generated by evaporation of the liquid working fluid 32 in the thin layer 40 then travels to the extended portions 22 of the sealed housing 14 by way of the vapor chamber 24 .
  • the synthetic jets 44 can be employed to move the gaseous working fluid 34 to the extended portions 22 .
  • the gaseous working fluid 34 cools and condenses back to liquid working fluid 32 .
  • This liquid working fluid 32 can collect at corresponding capture reservoirs 68 at the distal ends 30 of the extended portions 22 and/or be collected by the return wicks 60 .
  • the return wicks 60 return liquid working fluid 32 collected thereby and/or from the capture reservoirs 68 to the fluid reservoir 26 , typically using capillary action. In this way, the working fluid 34 follows a fluid recirculation loop, which is shown by the arrows.
  • additional or alternative approaches for removing gaseous working fluid from the interface portion can be employed.
  • impinging jets can be employed.
  • additional or alternative approaches to spreading heat in the extended portions 22 can be employed.
  • the extended portions 22 can include pulsating heat pipes (PHPs). Such embodiments employing pulsating heat pipes would be limited by the conduction contact area between the PHPs and the vapor chamber.
  • FIGS. 6 and 7 another embodiment of the heat dissipation device 10 employing PHP technology, which is known in the art, is illustrated.
  • PHP technology which is known in the art.
  • the heat dissipation device 10 can be shaped as need be after manufacture.
  • the heat dissipation device 10 of this embodiment works as described in connection with the embodiment of FIG. 2 .
  • elements paralleling those of the discussion of the embodiment of the heat dissipation device 10 of FIG. 2 are labeled the same.
  • Each of the extended portions 22 includes one or more PHPs 80 and a heat exchanger 82 .
  • the extended portions 22 can share a common PHP.
  • the heat exchangers 82 are typically positioned proximate the interface portion 20 at the bases of the corresponding extended portions 22 .
  • the PHPs 80 typically extend from the distal ends 30 of the corresponding extended portions 22 in to the corresponding heat exchangers 82 .
  • the heat exchangers 82 receive gaseous working fluid 34 from the vapor chamber 24 .
  • the heat from the gaseous working fluid 34 is absorbed by the PHPs 80 , which transfer the absorbed heat to the distal ends 30 of the extended portions 22 for dissipation to the external environment.
  • the gaseous working fluid 34 condenses back to liquid working fluid 32 and is returned to the fluid reservoir 26 .
  • Each of the heat exchangers 82 includes a capture reservoir 84 in which condensed working fluid 32 collects.
  • the capture reservoirs 84 are typically positioned under the portions of the PHPs 80 extending into the heat exchangers 82 . Further, notwithstanding the orientation of the PHPs 80 , those skilled in the art will appreciate that other orientations are amenable.
  • “Drop-wise condensation” is generally desired since it gives higher heat fluxes. This is encouraged by coating and/or encapsulating the portions of the PHPs 80 extending into the heat exchangers 82 with hydrophobic material 86 .
  • hydrophobic material 86 For example, a thin layer of Polytetrafluoroethylene (PTFE), such as that found on a nonstick cooking pan, can coat these portions of the PHPs 80 .
  • PTFE Polytetrafluoroethylene
  • the PHPs 80 are encapsulated in hydrophobic material 86 and cause droplets 88 of liquid working fluid 32 to form and fall into the capture reservoirs 82 .
  • each of the extended portions 22 includes a return wick 90 extending from the corresponding capture reservoir 84 to the fluid reservoir 26 .
  • the return wick 90 uses capillary action as described above to transfer the liquid working fluid 32 in the captured.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US13/746,453 2013-01-22 2013-01-22 Integrated thin film evaporation thermal spreader and planar heat pipe heat sink Abandoned US20140202665A1 (en)

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US13/746,453 US20140202665A1 (en) 2013-01-22 2013-01-22 Integrated thin film evaporation thermal spreader and planar heat pipe heat sink
JP2014004230A JP2014143417A (ja) 2013-01-22 2014-01-14 一体化した薄膜蒸発式熱拡散器および平面ヒートパイプヒートシンク
CN201410020047.4A CN103943576A (zh) 2013-01-22 2014-01-16 集成薄膜蒸发热分散器和平面热管散热器
EP14152200.3A EP2757584A3 (en) 2013-01-22 2014-01-22 Integrated thin film evaporation thermal spreader and planar heat pipe heat sink

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Cited By (12)

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US20160120066A1 (en) * 2014-10-28 2016-04-28 Goodrich Corporation Planar heat cup with confined reservoir for electronic power component
US20170064868A1 (en) * 2015-01-08 2017-03-02 General Electric Company System and method for thermal management using vapor chamber
US9750160B2 (en) 2016-01-20 2017-08-29 Raytheon Company Multi-level oscillating heat pipe implementation in an electronic circuit card module
US20170328648A1 (en) * 2016-05-11 2017-11-16 Toyota Motor Engineering & Manufacturing North America Inc. Programmable ultrasonic thermal diodes
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US10136553B2 (en) * 2016-06-23 2018-11-20 Lenovo (Beijing) Co., Ltd. Heat dissipation device and electronic device containing the same
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