TWM615615U - Powder atomic layer deposition device with percussion unit - Google Patents

Abstract

The invention provides a powder atomic layer deposition device with a knocking unit, which mainly includes a vacuum chamber, a shaft sealing device, a driving unit and a knocking unit. The driving unit is connected to the vacuum chamber through the shaft sealing device, and drives the vacuum chamber to rotate. The shaft sealing device includes an outer tube body and an inner tube body, wherein the inner tube body is arranged in the accommodating space of the outer tube body. At least one air extraction line and at least one air intake line are located in the inner tube. The air extraction line is used to extract gas in the reaction space of the vacuum chamber, and the air intake line is used to transport a precursor to the reaction space. The knocking unit is adjacent to the cover plate of the vacuum chamber and is used to knock the cover plate or the chamber of the vacuum chamber to prevent the powder in the reaction space from sticking to the inner surface of the vacuum chamber.

Description

Powder atomic layer deposition device with percussion unit

The invention relates to a powder atomic layer deposition device with a knocking unit. The knocking unit is adjacent to the cover plate of the vacuum chamber and is used to knock the cover plate or the cavity of the vacuum chamber to avoid the inside of the vacuum chamber. The powder sticks.

Nanoparticles are generally defined as particles smaller than 100 nanometers in at least one dimension. Nanoparticles and macroscopic substances have completely different physical and chemical properties. Generally speaking, the physical properties of macroscopic matter have nothing to do with its size, but nanoparticle is not the case. Nanoparticles have potential applications in the fields of biomedicine, optics, and electronics.

Quantum dots (Quantum Dot) are semiconductor nano-particles. The currently studied semiconductor materials are II-VI materials, such as ZnS, CdS, CdSe, etc., of which CdSe has attracted the most attention. The size of quantum dots is usually between 2 and 50 nanometers. After the quantum dots are irradiated with ultraviolet light, the electrons in the quantum dots absorb energy and transition from the valence band to the conduction band. When the excited electron returns from the conduction band to the valence band, it releases energy through light emission.

The energy gap of a quantum dot is related to the size. The larger the size of the quantum dot, the smaller the energy gap, and will emit light with a longer wavelength after irradiation. The smaller the size of the quantum dot, the larger the energy gap, and the wavelength will be emitted after irradiation. Shorter light. For example, quantum dots of 5 to 6 nanometers emit orange or red light, while quantum dots of 2 to 3 nanometers emit blue or green light. Of course, the light color depends on the material composition of the quantum dots.

Light-emitting diodes (LEDs) using quantum dots can produce light close to a continuous spectrum, and at the same time have high color rendering properties, and help to improve the luminous quality of the light-emitting diodes. In addition, the wavelength of the emitted light can be adjusted by changing the size of the quantum dots, making the quantum dots the focus of the development of a new generation of light-emitting devices and displays.

Although quantum dots have the above-mentioned advantages and characteristics, they are prone to agglomeration during the application or manufacturing process. In addition, quantum dots have high surface activity and are easy to react with air and moisture, thereby shortening the lifespan of quantum dots.

Specifically, when the quantum dots are made into a sealant for light-emitting diodes, agglomeration effect may occur, which reduces the optical performance of the quantum dots. In addition, after quantum dots are made into the sealant of light-emitting diodes, external oxygen or moisture may still pass through the sealant and contact the surface of the quantum dots, causing the quantum dots to oxidize and affect the quantum dots and light-emitting diodes. The effectiveness or service life of the product. Surface defects and dangling bonds of quantum dots may also cause nonradiative recombination, which also affects the luminous efficiency of quantum dots.

At present, the industry mainly uses atomic layer deposition (ALD) to form a nanometer-thick film on the surface of quantum dots, or form a multilayer film on the surface of quantum dots to form a quantum well structure.

Atomic layer deposition can form a thin film with uniform thickness on the substrate, and can effectively control the thickness of the thin film. In theory, it is also suitable for three-dimensional quantum dots. When the quantum dots are placed on the carrier plate, there will be contact points between adjacent quantum dots, so that the precursors of atomic layer deposition cannot contact these contact points, and it is impossible to form a uniform thickness on the surface of all nano particles. film.

In order to solve the above-mentioned problems faced by the prior art, the present invention proposes a powder atomic layer deposition apparatus with a knocking unit. A knocking unit is mainly arranged on the cover plate of the vacuum chamber, and the cover of the vacuum chamber is knocked through the knocking unit. Plate or cavity to shake off the powder adhering to the inner surface of the vacuum cavity during the deposition process.

An object of the present invention is to provide a powder atomic layer deposition device with a knocking unit, which mainly includes a driving unit, a shaft sealing device, a vacuum chamber and a knocking unit, wherein the driving unit is connected to the vacuum chamber through the shaft sealing device A back wall of the body. The knocking unit is adjacent to a cover plate of the vacuum chamber, and knocks the cover plate or the cavity of the vacuum chamber to vibrate the inner surface of the vacuum chamber to remove the powder adhering to the inner surface of the vacuum chamber.

Generally speaking, in the process of atomic layer deposition of the powder, it is likely that a uniform film cannot be formed on the surface of the powder adhering to the vacuum chamber, which will affect the yield, life and performance of the powder. For this reason, the present invention proposes to knock the cover plate of the vacuum cavity through the knocking unit to prevent the powder from sticking to the inner surface of the vacuum cavity.

In order to achieve the above objective, the present invention proposes a powder atomic layer deposition device with a knocking unit, including: a vacuum chamber, including a cover plate and a cavity, wherein the cover plate is connected to the cavity and is connected to the cover plate and the cavity. A reaction space is formed between the bodies, and the reaction space is used to contain a plurality of powders; a shaft sealing device is connected to the rear side of the vacuum chamber and includes an outer tube body and an inner tube body, wherein the outer tube body has a container Space for accommodating the inner tube body; a driving unit connected to the outer tube body of the shaft sealing device and driving the vacuum chamber to rotate through the outer tube body; at least one air extraction pipeline located in the inner tube body and fluidly connected to the vacuum chamber body The reaction space is used to extract a gas in the reaction space; at least one gas inlet line is located in the inner tube and is fluidly connected to the reaction space of the vacuum chamber, and is used to transport a precursor to the reaction space; and a percussion unit , Adjacent to the cover plate of the vacuum chamber, and used to knock the cover plate or cavity of the vacuum chamber.

In the powder atomic layer deposition apparatus with a knocking unit, the knocking unit includes a motor and a knocking part, the motor is connected to the knocking part and drives the knocking part to knock the cover plate or cavity of the vacuum chamber.

In the described powder atomic layer deposition apparatus with a knocking unit, the knocking unit includes a buffer part connected to the knocking part, and the knocking part knocks the cover plate or cavity of the vacuum cavity through the buffering part.

In the powder atomic layer deposition device with percussion unit, the gas inlet pipeline includes at least one non-reactive gas delivery pipeline and at least one reactive gas delivery pipeline, and the non-reactive gas delivery pipeline is used to deliver a non-reactive gas to the reaction space , To blow the powder in the reaction space, and the reaction gas delivery pipeline is used to deliver the precursor to the reaction space.

In the powder atomic layer deposition apparatus with a knocking unit, the non-reactive gas delivery pipeline includes an extension pipeline, which is located in the reaction space and extends toward the cover plate of the vacuum chamber.

The described powder atomic layer deposition device with percussion unit includes a filter unit located at one end of the inner tube body connected to the reaction space, the suction line is fluidly connected to the reaction space via the filter unit, and the extension line passes through the filter unit.

In the powder atomic layer deposition device with a knocking unit, the extension pipeline includes at least one air outlet facing the cover plate of the vacuum chamber or the direction of the cavity.

In the powder atomic layer deposition device with a knocking unit, the gas inlet line is used to transport a non-reactive gas to the reaction space, and the non-reactive gas blows the powder in the reaction space.

In the powder atomic layer deposition device with knocking unit, the inner tube extends from the accommodating space of the outer tube to the reaction space of the vacuum chamber, and a protruding tube is formed in the reaction space.

The described powder atomic layer deposition apparatus with a knocking unit includes a bearing part and a position adjustment mechanism. The shaft sealing device and the driving unit are arranged on the bearing part, and the knocking unit is connected to the bearing part through the position adjustment mechanism, and The position adjustment mechanism drives the percussion unit to move or rotate relative to the bearing portion, so as to change the interval between the percussion unit and the vacuum cavity.

Please refer to Figure 1, Figure 2 and Figure 3, which are respectively a three-dimensional schematic diagram, a cross-sectional schematic diagram of an embodiment of a new type of powder atomic layer deposition device with a knocking unit, and a shaft sealing device of the powder atomic layer deposition device with a knocking unit. A schematic cross-sectional view of an embodiment. As shown in the figure, the powder atomic layer deposition apparatus 10 with a knocking unit mainly includes a vacuum chamber 11, a shaft sealing device 13, a driving unit 15 and a knocking unit 14, wherein the driving unit 15 is connected through the shaft sealing device 13 The vacuum chamber 11 drives the vacuum chamber 11 to rotate.

The vacuum chamber 11 includes a front wall 111, a rear wall 113, and a side wall 115. The front wall 111 faces the rear wall 113, and the side wall 115 is located between the front wall 111 and the rear wall 113 and connects the front wall 111 and the rear wall. The wall 113 forms a reaction space 12 between the front wall 111, the rear wall 113 and the side wall 115.

The reaction space 12 is used to accommodate a plurality of powders 121, wherein the powder 121 can be a quantum dot (Quantum Dot), such as ZnS, CdS, CdSe and other II-VI semiconductor materials, and the thin film formed on the quantum dot can be two oxides Aluminum (Al2O3). In an embodiment of the present invention, the vacuum chamber 11 may include a cover 117 and a cavity 119, wherein the cover 117 is used to cover and connect the cavity 119 to form a reaction space 12 therebetween. The cover plate 117 may be the front wall 111 of the vacuum chamber 11, and the chamber 119 is formed by the rear wall 113 and the side wall 115 of the vacuum chamber 11.

The shaft sealing device 13 is connected to the rear wall 113 of the vacuum chamber 11 and includes an outer tube body 131 and an inner tube body 133. The outer tube body 131 has an accommodation space 132, and the inner tube body 133 has a connection space 134. For example, the outer tube body 131 and the inner tube body 133 may be hollow cylindrical bodies. The accommodating space 132 of the outer tube body 131 is used for accommodating the inner tube body 133, wherein the outer tube body 131 and the inner tube body 133 are coaxially arranged. The shaft sealing device 13 may be a common shaft seal or a magnetic fluid shaft seal, and is mainly used to isolate the reaction space 12 of the vacuum chamber 11 from the external space, so as to maintain the vacuum of the reaction space 12.

The driving unit 15 is connected to one end of the shaft sealing device 13, and the other end of the shaft sealing device 13 is connected to the rear wall 113 of the vacuum chamber 11. The driving unit 15 drives the vacuum chamber 11 to rotate through the shaft sealing device 13, for example, the driving unit 15 is a motor that connects the rear wall 113 of the vacuum chamber 11 through the outer tube body 131, and drives the vacuum chamber 11 to rotate through the outer tube body 131. In addition, the driving unit 15 is not connected to the inner tube body 133, so when the driving unit 15 drives the outer tube body 131 and the vacuum chamber 11 to rotate, the inner tube body 133 will not rotate with it.

The driving unit 15 can drive the outer tube 131 and the vacuum chamber 11 to continuously rotate in the same direction, for example, to continuously rotate clockwise or counterclockwise. In different embodiments, the driving unit 15 can drive the outer tube body 131 and the vacuum chamber 11 to rotate a specific angle in a clockwise direction, and then rotate a specific angle in a counterclockwise direction, for example, the specific angle may be 360 degrees. When the vacuum chamber 11 rotates, the powder 121 in the reaction space 12 is stirred, so that the powder 121 is evenly heated and comes into contact with the precursor or non-reactive gas.

The connecting space 134 of the inner tube body 133 can be provided with at least one gas extraction line 171, at least one gas inlet line 173, at least one non-reactive gas delivery line 175, a heater 177 and/or a temperature sensing unit 179, as shown in FIG. 2 and Figure 3.

The gas extraction line 171 is fluidly connected to the reaction space 12 of the vacuum chamber 11 and is used to extract gas in the reaction space 12 so that the reaction space 12 is in a vacuum state for the atomic layer deposition process. Specifically, the pumping line 171 can be connected to a pump, and the gas in the reaction space 12 can be pumped out through the pump.

The gas inlet line 173 is fluidly connected to the reaction space 12 of the vacuum chamber 11 and is used to transport a precursor and/or a non-reactive gas to the reaction space 12, where the non-reactive gas may be an inert gas such as nitrogen or argon. In practical applications, the gas inlet line 173 may transport a carrier gas and precursors into the reaction space 12 together. In addition, the gas inlet line 173 can also transport the non-reactive gas into the reaction space 12 and pump the gas through the gas extraction line 171 to remove the precursors in the reaction space 12. In an embodiment of the present invention, the gas inlet pipeline 173 can be connected to a plurality of branch pipelines, and different precursors can be sequentially delivered into the reaction space 12 through each branch pipeline.

The gas inlet line 173 can increase the flow rate of the non-reactive gas delivered to the reaction space 12, and blow the powder 121 in the reaction space 12 through the non-reactive gas, so that the powder 121 is driven by the non-reactive gas and diffuses into the reaction space 12 Various areas.

In an embodiment of the present invention, the gas inlet pipeline 173 may include at least one non-reactive gas delivery pipeline 175 and at least one reactive gas delivery pipeline. The non-reactive gas delivery pipeline 175 is fluidly connected to the reaction space 12 of the vacuum chamber 11 and is used to deliver a non-reactive gas to the reaction space 12. The non-reactive gas is used to blow the powder 121 in the reaction space 12 and cooperate with the driving unit 15 to drive the vacuum chamber 11 to rotate, which can effectively and uniformly stir the powder 121 in the reaction space 12 and deposit thickness on the surface of each powder 121 Uniform film. The reaction gas delivery pipeline is fluidly connected to the reaction space 12 and is used to deliver the precursor to the reaction space 12.

The vacuum chamber 11 is driven to rotate through the drive unit 15 via the shaft sealing device 13, and the non-reactive gas is transported to the reaction space 12 through the gas inlet line 173, although the powder 121 in the reaction space 12 can be stirred. However, in practical applications, there is still a certain amount of powder 121 sticking to the inner surface of the vacuum chamber 11, so that the precursor delivered to the reaction space 12 cannot contact the powder 121 stuck on the vacuum chamber 11, and thus cannot A thin film of uniform thickness is formed on the surface of all the powder 121.

In order to solve the above-mentioned and the problems faced by the prior art, the present invention proposes to provide a percussion unit 14 on the side of the front wall 111 or the cover plate 117 of the vacuum chamber 11, wherein the percussion unit 14 and the front wall 111 of the vacuum chamber 11 Or the cover plate 117 is adjacent to each other and used to knock the front wall 111, cover plate 117, cavity 119 or side wall 115 of the vacuum chamber 11.

When the striking unit 14 strikes the front wall 111, the cover plate 117, the cavity 119 or the side wall 115 of the vacuum chamber 11, the vacuum chamber 11 will vibrate, so that the adhered powder 121 will leave the inner surface of the vacuum chamber 11 , And scattered in the reaction space 12 of the vacuum chamber 11.

Specifically, through the arrangement of the driving unit 15, the air inlet pipe 173 and the knocking unit 14, the problem of the powder 121 sticking to the vacuum chamber 11 can be effectively solved, and it is beneficial to form a thickness on the surface of most of the powder 121 Uniform film.

In an embodiment of the present invention, the percussion unit 14 includes a motor 141 and a percussion part 143, wherein the motor 141 is connected to and drives the percussion part 143 to strike the front wall 111, the cover plate 117, and the cavity of the vacuum chamber 11 119 or sidewall 115. In addition, a buffer part 145 can be provided on the knocking part 143, wherein the knocking part 143 knocks the front wall 111, the cover plate 117, the cavity 119 or the side wall 115 of the vacuum chamber 11 through the buffer part 145 to avoid hitting the vacuum During the cavity 11 process, the vacuum cavity 11 and/or the knocking unit 14 are damaged. For example, the buffer portion 145 may be a rubber pad.

Both the gas inlet pipe 173 and the non-reactive gas delivery pipe 175 of the powder atomic layer deposition apparatus 10 with percussion unit are used to deliver the non-reactive gas to the reaction space 12, and the flow rate of the non-reactive gas delivered by the gas inlet pipe 173 is relatively small. , Which is mainly used to remove the precursors in the reaction space 12, and the non-reactive gas transported by the non-reactive gas pipeline 175 has a relatively large flow rate, which is mainly used to blow the powder 121 in the reaction space 12.

Specifically, the time points at which the gas inlet line 173 and the non-reactive gas conveying line 175 convey the non-reactive gas to the reaction space 12 are different. Therefore, in actual applications, the non-reactive gas conveying line 175 may not be provided, and the gas inlet line 173 may be adjusted in time. The flow of non-reactive gas delivered at different time points. When the precursors in the reaction space 12 are to be removed, the flow rate of the non-reactive gas delivered by the gas inlet line 173 to the reaction space 12 can be reduced, and when the powder 121 in the reaction space 12 is to be blown, the gas inlet line 173 is added to deliver The flow rate of the non-reactive gas to the reaction space 12.

When the driving unit 15 of the present invention drives the outer tube body 131 and the vacuum chamber 11 to rotate, the inner tube body 133 and its internal air extraction pipeline 171, intake pipeline 173 and/or non-reactive gas delivery pipeline 175 will not rotate with it , It is beneficial to improve the stability of the non-reactive gas and/or precursor that the gas inlet pipe 173 and/or the non-reactive gas delivery pipe 175 transports to the reaction space 12.

The heater 177 is used to heat the connection space 134 and the inner tube body 133, and heat the gas extraction line 171, the gas inlet line 173, and/or the non-reactive gas delivery line 175 in the inner tube body 133 to increase the gas extraction line 171 and the gas inlet The temperature of the gas in the gas pipeline 173 and/or the non-reactive gas delivery pipeline 175. The temperature sensing unit 179 is used to measure the temperature of the heater 177 or the connecting space 134 to know the working state of the heater 177. Another heating device 16 is usually arranged inside, outside or around the vacuum chamber 11. The heating device 16 is adjacent to or in contact with the side wall 115 of the vacuum chamber 11 and is used to heat the vacuum chamber 11 and the reaction space 12.

One end of the inner tube 133 connected to the reaction space 12 may be provided with a filter unit 139, wherein the suction line 171, the gas inlet line 173, and/or the non-reactive gas delivery line 175 in the inner tube 133 are fluidly connected to the vacuum chamber via the filter unit 139体11的反应空间12。 Body 11 of the reaction space 12.

The gas extraction line 171 is connected to the reaction space 12 through the filter unit 139, which can prevent the powder 121 in the reaction space 12 from being drawn out when the gas extraction line 171 extracts the gas in the reaction space 12, which can reduce the loss of the powder 121.

In an embodiment of the present invention, as shown in FIG. 4, the gas inlet line 173 and/or the non-reactive gas delivery line 175 can be extended from the connecting space 134 of the inner tube body 133 of the shaft sealing device 13 to the reaction space of the vacuum chamber 11 Within 12, the gas inlet line 173 and/or the non-reactive gas delivery line 175 extending to the reaction space 12 can be defined as an extension line 172. The extension line 172 may pass through the filter unit 139 and extend to the reaction space 12.

In an embodiment of the present invention, the gas inlet pipeline 173, the non-reactive gas delivery pipeline 175 and/or the extension pipeline 172 located in the reaction space 12 extend toward the front wall 111 or the cover plate 117 of the vacuum chamber 11. In different embodiments, the gas inlet pipe 173, the non-reactive gas delivery pipe 175, and/or the extension pipe 172 located in the reaction space 12 can also be bent toward the side wall 115 and/or the rear wall 113 of the vacuum chamber 11 and extend. In addition, the extension pipeline 172 may include at least one air outlet 1721, wherein the air outlet 1721 faces the front wall 111, the cover plate 117, the cavity 119 and/or the side wall 115 of the vacuum chamber.

In another embodiment of the present invention, the extension pipeline 172 can continuously transport the non-reactive gas to the reaction space 12 and can adjust the flow rate of the non-reactive gas. Specifically, the non-reactive gas output mode of the extension line 172 may include agitation mode and general mode. In the agitation mode, the flow rate of the non-reactive gas output by the extension line 172 is relatively large, and the output non-reactive gas can agitate the reaction space 12的粉121。 The powder 121. In the general mode, the flow rate of the non-reactive gas output from the extension line 172 is small, and may not agitate the powder 121 in the reaction space 12, but the non-reactive gas output in the general mode will form a positive pressure at the air outlet 1721 of the extension line 172 , To prevent the powder 121 from entering the extension pipeline 172 from the air outlet 1721.

In an embodiment of the present invention, the powder atomic layer deposition apparatus 10 with a knocking unit may include a carrying part 191 for supporting the driving unit 15, the vacuum chamber 11, the shaft sealing device 13 and/or the knocking unit 14. For example, the carrying portion 191 is connected to the driving unit 15, and the shaft sealing device 13 and the vacuum chamber 11 are connected through the driving unit 15. In addition, the shaft sealing device 13 and/or the vacuum chamber 11 can also be connected to the bearing portion 191 through at least one support frame 193 to improve the stability of the connection.

As shown in FIGS. 5 and 6, the shaft sealing device 13 and/or the driving unit 15 are disposed on the bearing portion 191, and the percussion unit 14 can be connected to the bearing portion 191 through a position adjustment mechanism 195, for example, the percussion unit 14 is connected through a connection The bracket 147 is connected to the position adjustment mechanism 195.

The position adjustment mechanism 195 is used to drive the percussion unit 14 to move or rotate relative to the carrying portion 191 to change the distance and/or angle between the percussion unit 14 and the front wall 111 or the cover plate 117 of the vacuum chamber 11.

In addition, the inner tube body 133 of the shaft sealing device 13 can extend from the accommodating space 132 of the outer tube body 131 to the reaction space 12 of the vacuum chamber 11, so that the inner tube body 133 forms a protruding tube portion 130 in the reaction space 12.

In an embodiment of the present invention, the position adjustment mechanism 195 may be a slide rail, and the percussion unit 14 can move along the slide rail relative to the vacuum chamber 11 to change the distance between the percussion unit 14 and the vacuum chamber 11 . During the deposition process, the percussion unit 14 can move along the slide rail and approach the front wall 111 or the cover plate 117 of the vacuum chamber 11, so that the percussion unit 14 can strike the front wall 111 and the cover plate 117 of the vacuum chamber 11 , The cavity 119 or the side wall 115, as shown in FIG. 5. After the deposition process is completed, as shown in FIG. 6, the percussion unit 14 can be displaced along the slide rail and away from the front wall 111 or the cover plate 117 of the vacuum chamber 11, so that the percussion unit 14 and the front wall of the vacuum chamber 11 There is an interval between 111 or the cover plate 117 to facilitate the removal of the vacuum chamber 11 or the cover plate 117 and take out the powder 121 in the vacuum chamber 11.

In different embodiments, the position adjustment mechanism 195 can also be a rotating device, and the percussion unit 14 can be rotated relative to the vacuum chamber 11 via the rotating device. For example, the percussion unit 14 can be moved horizontally or vertically relative to the vacuum cavity 11 , And move away from the vacuum chamber 11, so that the percussion unit 14 will not be located on the path of removing the vacuum chamber 11 or the cover plate 117.

The above is only one of the preferred embodiments of the present invention, and is not intended to limit the scope of implementation of the present invention, that is, all the equivalent changes and changes in the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention Modifications should be included in the scope of the patent application for this new model.

10: Powder atomic layer deposition device with percussion unit 11: Vacuum chamber 111: front wall 113: Back Wall 115: sidewall 117: cover 119: Cavity 12: reaction space 121: powder 13: Shaft seal device 130: protruding tube 131: Outer tube body 132: accommodating space 133: inner tube body 134: Connecting Space 139: filter unit 14: Percussion unit 141: Motor 143: Percussion Department 145: Buffer 147: connecting bracket 15: drive unit 16: heating device 171: Extraction line 172: Extension pipeline 1721: air outlet 173: intake line 175: Non-reactive gas pipeline 177: heater 179: temperature sensing unit 191: Carrying Department 193: support frame 195: Position adjustment mechanism

[Figure 1] is a three-dimensional schematic diagram of an embodiment of a new type of powder atomic layer deposition apparatus with a knocking unit.

[Figure 2] is a schematic cross-sectional view of an embodiment of a new type of powder atomic layer deposition apparatus with a knocking unit.

[Figure 3] is a schematic cross-sectional view of an embodiment of a shaft sealing device of a new type of powder atomic layer deposition device with a knocking unit.

[Fig. 4] is a schematic cross-sectional view of another embodiment of the new type of powder atomic layer deposition apparatus with knocking unit.

[Figure 5] is a schematic cross-sectional view of another embodiment of a new type of powder atomic layer deposition apparatus with a knocking unit.

[Fig. 6] is a schematic cross-sectional view of another embodiment of a new type of powder atomic layer deposition apparatus with a knocking unit.

10: Powder atomic layer deposition device with percussion unit

11: Vacuum chamber

13: Shaft seal device

14: Percussion unit

15: drive unit

16: heating device

191: Carrying Department

193: support frame

Claims (10)

A powder atomic layer deposition device with percussion unit, including: A vacuum chamber includes a cover plate and a cavity, wherein the cover plate is connected to the cavity, and a reaction space is formed between the cover plate and the cavity, and the reaction space is used for accommodating a plurality of powders; A shaft sealing device connected to the vacuum chamber and comprising an outer tube body and an inner tube body, wherein the outer tube body has an accommodating space for accommodating the inner tube body; A driving unit connected to the outer tube body of the shaft sealing device, and drives the vacuum chamber to rotate through the outer tube body; At least one gas extraction pipeline located in the inner tube, fluidly connected to the reaction space of the vacuum chamber, and used to extract a gas in the reaction space; At least one gas inlet line located in the inner tube, fluidly connected to the reaction space of the vacuum chamber, and used to transport a precursor to the reaction space; and A knocking unit is adjacent to the cover plate of the vacuum cavity and used for knocking the cover plate or the cavity of the vacuum cavity. The powder atomic layer deposition apparatus having a knocking unit according to claim 1, wherein the knocking unit includes a motor and a knocking part, and the motor is connected to the knocking part and drives the knocking part to knock the vacuum The cover or cavity of the cavity. The powder atomic layer deposition apparatus with a knocking unit according to claim 2, wherein the knocking unit includes a buffer part connected to the knocking part, and the knocking part knocks the lid of the vacuum chamber through the buffering part Plate or the cavity. The powder atomic layer deposition apparatus with a knocking unit according to claim 1, wherein the gas inlet pipeline includes at least one non-reactive gas delivery pipeline and at least one reactive gas delivery pipeline, and the non-reactive gas delivery pipeline is used to transfer a non-reactive gas The gas is delivered to the reaction space to blow the powder in the reaction space, and the reaction gas delivery pipeline is used to deliver the precursor to the reaction space. The powder atomic layer deposition apparatus with a knocking unit according to claim 4, wherein the non-reactive gas delivery pipeline includes an extension pipeline located in the reaction space and facing the direction of the cover plate of the vacuum chamber extend. The powder atomic layer deposition apparatus with percussion unit according to claim 5, comprising a filter unit at one end of the inner tube connected to the reaction space, the suction line is fluidly connected to the reaction space via the filter unit, and the The extension pipeline passes through the filter unit. According to claim 5, the powder atomic layer deposition apparatus having a knocking unit, wherein the extension pipeline includes at least one air outlet facing the cover plate of the vacuum chamber or the direction of the cavity. The powder atomic layer deposition apparatus with a knocking unit according to claim 1, wherein the gas inlet line is used to transport a non-reactive gas to the reaction space, and the non-reactive gas is used to blow the powder in the reaction space . The powder atomic layer deposition apparatus with a knocking unit according to claim 1, wherein the inner tube body extends from the accommodating space of the outer tube body to the reaction space of the vacuum chamber, and is in the reaction space A protruding tube is formed. The powder atomic layer deposition apparatus with a knocking unit according to claim 1, comprising a bearing part and a position adjustment mechanism, the shaft sealing device and the driving unit are arranged on the bearing part, and the knocking unit is through The position adjustment mechanism is connected to the bearing portion, and the percussion unit is moved or rotated relative to the bearing portion through the position adjustment mechanism to change the interval between the percussion unit and the vacuum cavity.

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