TWM614453U - Detachable powder atomic layer deposition device - Google Patents

Abstract

The invention provides a detachable powder atomic layer deposition device, which mainly includes a vacuum chamber, a shaft sealing device and a driving unit. The driving unit is connected to the shaft sealing device, and the bottom of the vacuum chamber is locked in by at least one connecting unit. One end of the shaft sealing device. The driving unit drives the vacuum chamber to rotate through the shaft sealing device to stir the powder in a reaction space of the vacuum chamber to facilitate the formation of a thin film with uniform thickness on the surface of the powder. In addition, the vacuum chamber completed with atomic layer deposition can be removed from the shaft sealing device, and the bottom of the vacuum chamber is covered by a protective cover to prevent the powder in the vacuum chamber from being lost from the bottom and reduce the powder loss rate.

Description

Detachable powder atomic layer deposition device

The invention relates to a detachable powder atomic layer deposition device, which mainly covers the bottom of a vacuum chamber through a protective cover to prevent the powder in the vacuum chamber from being lost from the bottom of the vacuum chamber.

Nanoparticles are generally defined as particles smaller than 100 nanometers in at least one dimension. Nanoparticles and macroscopic substances have completely different physical and chemical properties. Generally speaking, the physical properties of macroscopic matter have nothing to do with its size, but nanoparticle is not the case. Nanoparticles have potential applications in the fields of biomedicine, optics, and electronics.

Quantum dots are nano-particles of semiconductor materials. The semiconductor materials currently studied are II-VI materials, such as ZnS, CdS, CdSe, etc., of which CdSe has attracted the most attention. The size of quantum dots is usually between 2 and 50 nanometers. After the quantum dots are irradiated with ultraviolet light, the electrons in the quantum dots absorb energy and transition from the valence band to the conduction band. When the excited electron returns from the conduction band to the valence band, it releases energy through light emission.

The energy gap of a quantum dot is related to the size. The larger the size of the quantum dot, the smaller the energy gap, and will emit light with a longer wavelength after irradiation. The smaller the size of the quantum dot, the larger the energy gap, and the wavelength will be emitted after irradiation. Shorter light. For example, quantum dots of 5 to 6 nanometers emit orange or red light, while quantum dots of 2 to 3 nanometers emit blue or green light. Of course, the color of light also depends on the material composition of the quantum dots.

Light-emitting diodes (LEDs) using quantum dots produce light close to a continuous spectrum, and at the same time have high color rendering properties, and help to improve the luminous quality of the light-emitting diodes. In addition, the wavelength of the emitted light can be adjusted by changing the size of the quantum dots, making the quantum dots the focus of the development of new generation light-emitting devices and displays.

Although quantum dots have the above-mentioned advantages and characteristics, they are prone to agglomeration during the application or manufacturing process. In addition, quantum dots have high surface activity and are easy to react with air and moisture, thereby shortening the lifespan of quantum dots.

Specifically, when the quantum dots are made into a sealant for light-emitting diodes, agglomeration effect may occur, which reduces the optical performance of the quantum dots. In addition, after quantum dots are made into the sealant of light-emitting diodes, external oxygen or moisture may still pass through the sealant and contact the surface of the quantum dots, causing the quantum dots to oxidize and affect the quantum dots and light-emitting diodes. The effectiveness or service life of the product. Defects on the surface of quantum dots and dangling bonds may also cause non-radiative recombination, which also affects the luminous efficiency of quantum dots.

At present, the industry mainly uses atomic layer deposition (ALD) to form a nano-thick film on the surface of quantum dots, or form multiple layers of thin films on the surface of quantum dots to form a quantum well structure.

Atomic layer deposition can form a thin film with uniform thickness on the substrate, and can effectively control the thickness of the thin film. In theory, it is also suitable for three-dimensional quantum dots. When the quantum dots are placed on the carrier plate, there will be contact points between adjacent quantum dots, so that the precursor gas deposited by the atomic layer cannot contact these contact points, and it is impossible to form a uniform thickness on the surface of all nano particles.的膜。 The film.

Generally speaking, atomic layer deposition usually needs to be performed in a vacuum environment. Therefore, the structure of the atomic layer deposition device is often thicker and has a certain weight, which is not conducive to the user's handling and operation. For this reason, the present invention proposes a detachable powder atomic layer deposition device. After the powder atomic layer deposition process is completed, the vacuum chamber can be removed from the shaft seal device and/or the drive unit to facilitate the user to take out the vacuum chamber Powder and clean the vacuum chamber. In addition, a protective cover can cover a bottom of the vacuum chamber to prevent the powder in the vacuum chamber from being lost from the bottom.

One purpose of the present invention is to provide a detachable powder atomic layer deposition device, which mainly includes a driving unit, a shaft sealing device and a vacuum chamber, wherein the driving unit is connected to the shaft sealing device, and the other end of the shaft sealing device passes through At least one connecting unit is locked at the bottom of the vacuum chamber, so that the driving unit can drive the vacuum chamber to rotate through the shaft sealing device. After the atomic layer deposition process is completed, the vacuum chamber can be removed from the shaft sealing device, and a protective cover can cover the bottom of the vacuum chamber. The setting of the protective cover can prevent the powder in the vacuum cavity from being lost from the bottom during the process of moving the vacuum cavity, and is beneficial to reduce the material cost of the manufacturing process and improve the convenience in use.

One purpose of the present invention is to provide a detachable powder atomic layer deposition device, which can unload the vacuum chamber and powder that complete the atomic layer deposition process from the shaft sealing device, and lock another vacuum chamber that contains the powder. It is fixed on the shaft sealing device for atomic layer deposition of powder. In addition, the bottoms of the above-mentioned vacuum chambers that have completed atomic layer deposition and those that have not undergone atomic layer deposition are covered with a protective cover to prevent the powder that has completed atomic layer deposition and the powder that has not completed atomic layer deposition from escaping from the vacuum chamber. .

An object of the present invention is to provide a detachable powder atomic layer deposition device, wherein the bottom of the vacuum chamber has a concave part, and an inner tube protruding from the shaft seal device is used to insert the bottom of the vacuum chamber. A protruding tube is formed in the concave part and in the reaction space of the vacuum chamber. A protective cover and the vacuum chamber are connected through a buckle unit, a magnetic attraction unit or a connecting unit, and cover the recess at the bottom of the vacuum chamber to prevent the powder in the vacuum chamber from being lost through the recess.

One objective of the present invention is to provide a detachable powder atomic layer deposition device, which is mainly provided with a filter unit at the bottom of the vacuum chamber. When the shaft seal device is connected to the vacuum chamber, the air extraction pipeline arranged in the shaft seal device will The reaction space of the vacuum chamber is fluidly connected via the filter unit. A protective cover and the vacuum chamber are connected through a snap unit, a magnetic attraction unit or a connecting unit, and cover the filter unit at the bottom of the vacuum chamber to prevent the powder in the vacuum chamber from being lost through the filter unit.

In order to achieve the above purpose, the present invention proposes a detachable powder atomic layer deposition device, which includes: a shaft sealing device; a driving unit connected to the shaft sealing device; a vacuum chamber including a bottom fixed to the shaft through at least one connecting unit The sealing device includes a reaction space for accommodating a plurality of powders. The driving unit drives the vacuum chamber to rotate through the shaft sealing device. After the connecting unit is unlocked, the vacuum chamber is removed by the shaft sealing device; The gas pipeline is located in the shaft sealing device, fluidly connected to the reaction space of the vacuum chamber, and used to extract a gas in the reaction space; at least one gas inlet pipeline, located in the shaft sealing device, is fluidly connected to the reaction space of the vacuum chamber and used To deliver a precursor gas or a non-reactive gas to the reaction space, where the non-reactive gas is used to blow the powder in the reaction space; and a protective cover to cover the bottom of the vacuum chamber removed by the shaft sealing device .

In the detachable powder atomic layer deposition device, a perforation is provided at the bottom of the vacuum chamber, and the protective cover is used to cover the perforation.

In the detachable powder atomic layer deposition device, the shaft sealing device includes an outer tube body and an inner tube body, and the outer tube body includes an accommodating space for accommodating the inner tube body, and the air extraction line and the air inlet The pipeline is located in the inner tube and is fluidly connected to the reaction space through the perforation of the vacuum chamber.

The detachable powder atomic layer deposition device includes a filter unit arranged in the perforation of the vacuum chamber, the suction line and the inlet line are fluidly connected to the reaction space of the vacuum chamber through the filter unit, and the protective cover is connected to the vacuum chamber At least one annular sealing element is arranged on one surface of the body. When the protective cover covers the bottom of the vacuum chamber, the annular sealing element is located around the perforation and filter unit.

In the detachable powder atomic layer deposition device, the bottom of the vacuum chamber includes a recess, which extends from the bottom of the vacuum chamber to the reaction space for accommodating the inner tube protruding from the shaft seal device, and the perforation is located The recess is connected to one end of the reaction space, and the protective cover is used to cover the recess and the perforation.

The detachable powder atomic layer deposition device includes a filter unit arranged in the perforation of the recess, the suction line and the inlet line are fluidly connected to the reaction space of the vacuum chamber through the filter unit, and a surface of the protective cover is provided At least one annular sealing unit. When the protective cover covers the bottom of the vacuum chamber, the annular sealing unit is located around the perforation and filter unit.

In the detachable powder atomic layer deposition device, the bottom of the vacuum chamber and the protective cover are provided with at least one corresponding snap unit or at least one magnetic attraction unit, and the protective cover is connected and fixed by the snap unit or the magnetic attraction unit At the bottom of the vacuum chamber.

The detachable powder atomic layer deposition device includes at least one connecting unit for fixing the protective cover on the bottom of the vacuum chamber.

In the detachable powder atomic layer deposition device, the gas inlet pipeline includes at least one non-reactive gas delivery pipeline located in the shaft seal device, fluidly connected to the reaction space of the vacuum chamber, and used to deliver the non-reactive gas to the vacuum chamber The reaction space to blow the powder in the reaction space.

In the detachable powder atomic layer deposition device, the vacuum chamber includes a cover plate and a cavity, an inner surface of the cover plate covers the cavity to form a reaction space between the two, and is located inside the cover plate A monitoring wafer is provided on the surface.

Please refer to Figure 1, Figure 2, Figure 3 and Figure 4, which are respectively a three-dimensional schematic diagram of an embodiment of the new detachable powder atomic layer deposition device, a cross-sectional schematic diagram and a cross-section of the shaft sealing device of the detachable powder atomic layer deposition device Schematic diagram and cross-sectional decomposition diagram. As shown in the figure, the detachable powder atomic layer deposition apparatus 10 mainly includes a vacuum chamber 11, a shaft sealing device 13 and a driving unit 15. The driving unit 15 is connected through the shaft sealing device 13 and drives the vacuum chamber 11 to rotate.

The vacuum cavity 11 has a reaction space 12 for accommodating a plurality of powders 121. The powders 121 may be Quantum Dots, such as II-VI semiconductor materials such as ZnS, CdS, and CdSe, which are formed in the quantum dots. The above film can be aluminum oxide (Al2O3). The vacuum chamber 11 may include a cover 111 and a cavity 113, wherein an inner surface 1111 of the cover 111 is used to cover the cavity 113, and a reaction space 12 is formed between the two.

In an embodiment of the present invention, a monitoring wafer 115 may be disposed on the inner surface 1111 of the cover plate 111, and when the cover plate 111 covers the cavity 113, the monitoring wafer 115 will be located in the reaction space 12. When atomic layer deposition is performed in the reaction space 12, a thin film is formed on the surface of the monitoring wafer 115. In actual application, the film thickness on the surface of the monitoring wafer 115 and the film thickness on the surface of the powder 121 can be further measured, and the relationship between the two can be calculated. Then, the film thickness on the surface of the monitoring wafer 115 can be measured to calculate the film thickness on the surface of the powder 121.

The shaft sealing device 13 includes an outer tube body 131 and an inner tube body 133. The outer tube body 131 has a accommodating space 132, and the inner tube body 133 has a connecting space 134, such as the outer tube body 131 and the inner tube body. 133 can be a hollow cylinder. The accommodating space 132 of the outer tube body 131 is used for accommodating the inner tube body 133, wherein the outer tube body 131 and the inner tube body 133 are coaxially arranged. The shaft sealing device 13 may be a common shaft seal or a magnetic fluid shaft seal, and is mainly used to isolate the reaction space 12 of the vacuum chamber 11 from the external space, so as to maintain the vacuum of the reaction space 12.

The driving unit 15 is connected to one end of the shaft sealing device 13, and drives the vacuum chamber 11 to rotate through the shaft sealing device 13, for example, connects to the vacuum chamber 11 through the outer tube body 131, and drives the vacuum chamber 11 to rotate through the outer tube body 131.

The driving unit 15 can drive the outer tube 131 and the vacuum chamber 11 to continuously rotate in the same direction, for example, to continuously rotate clockwise or counterclockwise. In different embodiments, the driving unit 15 can drive the outer tube body 131 and the vacuum chamber 11 to rotate a specific angle in a clockwise direction, and then rotate a specific angle in a counterclockwise direction, for example, the specific angle may be 360 degrees. When the vacuum chamber 11 rotates, it will agitate the powder 121 in the reaction space 12, so that the powder 121 is evenly heated and comes into contact with the precursor gas or non-reactive gas.

In an embodiment of the present invention, the driving unit 15 may be a motor, which is connected to the outer tube body 131 through at least one gear 14 and drives the outer tube body 131 and the vacuum chamber 11 to rotate relative to the inner tube body 133 via the gear 14.

As shown in FIGS. 2 and 3, the connecting space 134 of the inner tube body 133 can be provided with at least one gas extraction line 171, at least one gas inlet line 173, at least one non-reactive gas delivery line 175, a heater 177 and/or A temperature sensing unit 179. In an embodiment of the present invention, the bottom 117 of the vacuum chamber 11 may be provided with a perforation 118, and the suction line 171, the inlet line 173 and/or the non-reactive gas delivery line 175 may be fluidly connected to the vacuum chamber 11 through the perforation 118 The reaction space 12.

The gas extraction line 171 is fluidly connected to the reaction space 12 of the vacuum chamber 11 and is used to extract gas in the reaction space 12 so that the reaction space 12 is in a vacuum state for the atomic layer deposition process. Specifically, the pumping line 171 can be connected to a pump, and the gas in the reaction space 12 can be pumped out through the pump.

The gas inlet line 173 is fluidly connected to the reaction space 12 of the vacuum chamber 11 and is used to transport a precursor gas or a non-reactive gas to the reaction space 12, where the non-reactive gas can be an inert gas such as nitrogen or argon. For example, the gas inlet line 173 may be connected to a precursor gas storage tank and a non-reactive gas storage tank through the valve assembly, and the precursor gas can be transported into the reaction space 12 through the valve assembly, so that the precursor gas deposits on the surface of the powder 121. In practical applications, the gas inlet line 173 may transport a carrier gas and precursor gas into the reaction space 12 together. Then, the non-reactive gas is transported into the reaction space 12 through the valve assembly, and is pumped through the gas extraction line 171 to remove the precursor gas in the reaction space 12. In an embodiment of the present invention, the gas inlet pipeline 173 can be connected to a plurality of branch pipelines, and different precursor gases can be sequentially delivered into the reaction space 12 through each branch pipeline.

In addition, the gas inlet line 173 can increase the flow rate of the non-reactive gas delivered to the reaction space 12, and blow the powder 121 in the reaction space 12 through the non-reactive gas, so that the powder 121 is driven by the non-reactive gas and diffuses into the reaction space. 12 various areas.

In an embodiment of the present invention, the gas inlet pipeline 173 may include at least one non-reactive gas delivery pipeline 175 fluidly connected to the reaction space 12 of the vacuum chamber 11, and is used to deliver a non-reactive gas to the reaction space 12, such as non-reactive gas The delivery line 175 can be connected to a nitrogen storage tank through the valve assembly, and deliver the nitrogen to the reaction space 12 through the valve assembly. The non-reactive gas is used to blow the powder 121 in the reaction space 12 and cooperate with the driving unit 15 to drive the vacuum chamber 11 to rotate, which can effectively and uniformly stir the powder 121 in the reaction space 12 and deposit thickness on the surface of each powder 121 Uniform film.

The gas inlet pipeline 173 and the non-reactive gas delivery pipeline 175 of the detachable powder atomic layer deposition apparatus 10 are both used to deliver the non-reactive gas to the reaction space 12, and the flow rate of the non-reactive gas delivered by the gas inlet pipeline 173 is relatively small. The non-reactive gas is used to remove the precursor gas in the reaction space 12, and the non-reactive gas transported by the non-reactive gas delivery line 175 has a relatively large flow rate, which is mainly used to blow the powder 121 in the reaction space 12.

Specifically, the time points at which the gas inlet line 173 and the non-reactive gas conveying line 175 convey the non-reactive gas to the reaction space 12 are different. Therefore, in actual applications, the non-reactive gas conveying line 175 may not be provided, and the gas inlet line 173 may be adjusted in time. The flow of non-reactive gas delivered at different time points. When the precursor gas in the reaction space 12 is to be removed, the flow rate of the non-reactive gas delivered to the reaction space 12 by the gas inlet line 173 can be reduced, and when the powder 121 in the reaction space 12 is to be blown, the gas inlet line 173 is added. The flow rate of the non-reactive gas delivered to the reaction space 12.

When the driving unit 15 of the present invention drives the outer tube body 131 and the vacuum chamber 11 to rotate, the inner tube body 133 and its internal air extraction pipeline 171, intake pipeline 173 and/or non-reactive gas delivery pipeline 175 will not rotate with it , Which is beneficial to improve the stability of the non-reactive gas and/or precursor gas delivered by the gas inlet line 173 and/or the non-reactive gas delivery line 175 to the reaction space 12.

The heater 177 is used to heat the connection space 134 and the inner tube body 133, and heat the air extraction line 171, the air inlet line 173 and/or the non-reactive gas delivery line 175 in the inner tube body 133 through the heater 177 to improve air extraction The temperature of the gas in the pipeline 171, the gas inlet pipeline 173, and/or the non-reactive gas delivery pipeline 175. For example, the temperature of the non-reactive gas and/or the precursor gas delivered by the gas inlet line 173 to the reaction space 12 can be increased, and the temperature of the non-reactive gas delivered by the non-reactive gas delivery line 175 to the reaction space 12 can be increased. When non-reactive gases and/or precursor gases enter the reaction space 12, the temperature of the reaction space 12 will not drop or change significantly. In addition, the temperature of the heater 177 or the connecting space 134 can be measured by the temperature sensing unit 179 to know the working state of the heater 177. Of course, another heating device is usually arranged inside, outside or around the vacuum cavity 11, wherein the heating device is adjacent to or in contact with the vacuum cavity 11 and is used to heat the vacuum cavity 11 and the reaction space 12.

During the atomic layer deposition process, the reaction space 12 of the vacuum chamber 11 needs to be maintained in a vacuum state. Therefore, the structure of the vacuum chamber 11 is usually relatively thick and heavy. The shaft sealing device 13 is used to carry and drive the vacuum chamber 11, and is also relatively thick and heavy. During operation, the user needs to remove the vacuum chamber 11 and the shaft sealing device 13 from the driving unit 15 together to take out the powder 121 in the vacuum chamber 11 and clean the vacuum chamber 11. This will not only cause a burden on the user, but also may cause a collision during operation and cleaning, which may cause injury to the user or damage to the device.

In order to improve the above-mentioned problems, the present invention designs the vacuum chamber 11 and the shaft sealing device 13 as two independent components. During atomic layer deposition, the vacuum chamber 11 is fixed on the shaft sealing device 13. As shown in FIG. 3, the bottom 117 of the vacuum chamber 11 is connected and fixed to one end of the shaft sealing device 13 through at least one connecting unit 112, for example The connecting unit 112 may be a screw. The connecting unit 112 being a screw is only an embodiment of the present invention. In actual application, the vacuum chamber 11 can be locked on the shaft sealing device 13 through other different forms of connecting unit 112, such as a cylinder joint, a buckle mechanism, and a clamp. A connecting unit 112 with a detachable function such as a tenon, a quick-release device, and a screw connects the vacuum chamber 11 and the shaft sealing device 13.

In an embodiment of the present invention, the connecting unit 112, the vacuum chamber 11, and the shaft sealing device 13 can be three independent components. For example, the connecting unit 112 is a screw, and the vacuum chamber 11 and the shaft sealing device 13 are provided with corresponding Connection hole. In another embodiment of the present invention, the connecting unit 112 can be directly arranged on the vacuum chamber 11 and/or the shaft sealing device 13, for example, corresponding cylinder joints and connecting holes are provided on the vacuum chamber 11 and the shaft sealing device 13. Tenon and mortise, external thread and internal thread, etc. can also be used to lock the vacuum chamber 11 on the shaft sealing device 13 through the connecting unit 112.

The driving unit 15 can drive the vacuum chamber 11 to rotate through the shaft sealing device 13 to stir the powder 121 in the reaction space 12 of the vacuum chamber 11. When the vacuum chamber 11 is connected to the shaft sealing device 13, the suction line 171, the gas inlet line 173 and/or the non-reactive gas delivery line 175 in the shaft seal device 13 will be fluidly connected to the reaction space 12 of the vacuum chamber 11.

After the atomic layer deposition of the powder 121 is completed, the locking of the connecting unit 112 can be released, and the vacuum chamber 11 can be removed from the shaft sealing device 13, as shown in FIG. 4. Since the weight of the vacuum chamber 11 is less than the weight of the vacuum chamber 11 plus the shaft sealing device 13, removing the vacuum chamber 11 from the shaft sealing device 13 can reduce the burden on the user to operate or carry the vacuum chamber 11. The vacuum chamber 11 is removed from the shaft sealing device 13, and it is also convenient for the operator to take out the atomic layer deposition powder 121 in the vacuum chamber 11, clean and maintain the vacuum chamber 11 and/or the shaft seal device 13, and replace The powder 121 is put into the reaction space 12 of the vacuum chamber 11.

In addition, the detachable powder atomic layer deposition device 10 of the present invention is also beneficial to improve the process efficiency of atomic layer deposition. Specifically, a plurality of vacuum chambers 11 may be prepared, and the powder 121 may be placed in each vacuum chamber 11 respectively. One of the vacuum chambers 11 is locked on the shaft sealing device 13, and the powder 121 in the vacuum chamber 11 is subjected to atomic layer deposition. After the atomic layer deposition of the powder 121 is completed, the vacuum chamber 11 and the powder 121 are removed from the shaft sealing device 13, and the other vacuum chamber 11 is fixed on the shaft sealing device 13, and the pressure in the vacuum chamber 11 The powder 121 undergoes an atomic layer deposition process. The unloaded vacuum chamber 11 can be placed in the cooling zone, and after the temperature of the vacuum chamber 11 and the powder 121 drops, the powder 121 is taken out of the vacuum chamber 11.

In an embodiment of the present invention, a filter unit 139 can be provided in the perforation 118 at the bottom 117 of the vacuum chamber 11, and when the vacuum chamber 11 is connected to the shaft sealing device 13, the filter unit 139 on the vacuum chamber 11 will cover the shaft The inner tube 133 of the sealing device 13 is sealed so that the gas extraction line 171, the gas inlet line 173 and/or the non-reactive gas delivery line 175 in the inner tube 133 are fluidly connected to the reaction space 12 of the vacuum chamber 11 via the filter unit 139.

The arrangement of the filter unit 139 can prevent the powder 121 in the reaction space 12 from being drawn out when the gas extraction line 171 extracts the gas in the reaction space 12, resulting in the loss of the powder 121. In addition, the filter unit 139 is arranged on the vacuum chamber 11 instead of the shaft sealing device 13, so as to prevent the powder 121 from being removed from the reaction space of the vacuum chamber 11 when the vacuum chamber 11 is removed from the shaft sealing device 13 12 scattered to the outside.

Although the bottom 117 of the vacuum chamber 11 is provided with a filter unit 139, the powder 121 in the vacuum chamber 11 removed from the shaft seal device 13 may still be lost from the filter unit 139 to the outside, and cause damage in the vacuum chamber 11 The powder 121 is lost, which in turn increases the material cost of the manufacturing process. In order to avoid the above situation, the present invention adds a protective cover 16 to cover the bottom 117 of the vacuum chamber 11 and to cover the perforation 118 on the bottom 117 of the vacuum chamber 11 to prevent powder in the vacuum chamber 11. 121 is lost.

In an embodiment of the present invention, as shown in FIGS. 5 and 6, the bottom 117 of the vacuum chamber 11 can be provided with at least one snap unit 116, and the protective cover 16 is provided with a snap unit 116 corresponding to each other. At least one buckle unit 161 enables the protective cover 16 and the bottom 117 of the vacuum chamber 11 to be connected and fixed via the corresponding buckle unit 116/161. For example, the buckle unit 116 on the vacuum chamber 11 may be a buckle, and the buckle unit 161 on the protective cover 16 may be a protruding buckle. Of course, the buckle unit 116 of the vacuum chamber 11 is a buckle slot, and the buckle unit 161 of the protective cover 16 is a protruding buckle, which is only an embodiment of the present invention and is not a limitation of the scope of rights of the present invention.

In an embodiment of the present invention, the bottom 117 of the vacuum chamber 11 may be provided with a recess 119. The recess 119 is recessed from the bottom 117 of the vacuum chamber 11 toward the reaction space 12, wherein the perforation 118 and/or the filter unit 139 are provided in In the recess 119, for example, the perforation 118 and/or the filter unit 139 are located at one end of the recess 119 connected to the reaction space 12. The recess 119 can extend from the bottom 117 of the vacuum chamber 11 into the reaction space 12, and the inner tube 133 of the shaft sealing device 13 extends from the accommodating space 132 of the outer tube 131 to the outside, and protrudes the shaft sealing device 13 and The outer tube body 131 is shown in FIG. 7. When connecting the vacuum chamber 11 and the shaft sealing device 13, the inner tube 133 protruding from the shaft sealing device 13 can be inserted into the recess 119. When the vacuum chamber 11 is connected to the shaft sealing device 13, the inner tube 133 of the shaft sealing device 13 will extend from the accommodating space 132 of the outer tube 131 to the recess 119 of the vacuum chamber 11 and/or the reaction space 12, so that the inner tube The tube body 133 and the concave portion 119 form a protruding tube portion 130 in the reaction space 12.

The arrangement of the protruding pipe 130 can shorten or adjust the distance between the gas inlet pipe 173 and/or the non-reactive gas conveying pipe 175 and the cover 111, and the gas inlet pipe 173 and/or the non-reactive gas conveying pipe 175 can be conveyed to the reaction The non-reactive gas in the space 12 can be transferred to the inner surface 1111 of the cover plate 111 and diffuse to various areas of the reaction space 12 through the inner surface 1111 of the cover plate 111 to facilitate blowing the powder 121 in the reaction space 12.

In an embodiment of the present invention, at least one annular seal 163, such as an O-ring, may be provided on the surface of the protective cover 16 connected to the bottom 117 of the vacuum chamber 11. When the protective cover 16 covers the bottom 117 of the vacuum chamber 11, The protective cover 16 will cover the perforation 118, the recess 119 and/or the filter unit 139 of the vacuum chamber 11, and the annular seal 163 will be located on the perforation 118, the recess 119 and/or the filter unit 139 on the bottom 117 of the vacuum chamber 11 It can further prevent the powder 121 in the vacuum chamber 11 from being lost through the perforation 118 of the bottom 117 and/or the filter unit 139.

In addition, the surface of the protective cover 16 connected to the bottom 117 of the vacuum chamber 11 can be provided with a groove 165, wherein the annular seal 163 is located around the groove 165. When the protective cover 16 is connected to the bottom 117 of the vacuum chamber 11, the groove 165 of the protective cover 16 will be aligned with the perforation 118 of the vacuum chamber 11 and/or the filter unit 139.

In an embodiment of the present invention, as shown in FIGS. 8 and 9, the bottom 117 of the vacuum chamber 11 can be provided with at least one connecting hole 118, and the protective cover 16 can be provided with a through hole 167. At least one connecting unit 181 can pass through the through hole 167 on the protective cover 16 and be fixed on the connecting hole 118 of the bottom 117 of the vacuum chamber 11 to fix the protective cover 16 on the bottom 117 of the vacuum chamber 11.

In another embodiment of the present invention, as shown in FIGS. 10 and 11, at least one magnetic attraction unit 183 can be provided on the bottom 117 of the vacuum chamber 11, and a magnetic attraction unit 183 is provided on the protective cover 16 corresponding to each other. At least one magnetic attraction unit 185, for example, both of the magnetic attraction units 183/185 can be magnets, or at least one of them can be magnets. When the protective cover 16 is connected to the bottom 117 of the vacuum chamber 11, the magnetic unit 185 on the protective cover 16 and the magnetic unit 183 on the bottom 117 of the vacuum chamber 11 will attract each other to fix the protective cover 16 in the vacuum chamber. 11 of the bottom 117.

In an embodiment of the present invention, the detachable powder atomic layer deposition apparatus 10 may also include a carrying plate 191 and at least one fixing frame 193, wherein the carrying plate 191 may be a plate body for carrying the driving unit 15 and the vacuum chamber体11和轴封装置13。 Body 11 and shaft sealing device 13. For example, the carrier board 191 is connected to the driving unit 15, and the shaft sealing device 13 and the vacuum chamber 11 are connected through the driving unit 15. In addition, the shaft sealing device 13 and/or the vacuum chamber 11 can also be connected to the bearing plate 191 through at least one support frame to improve the stability of the connection.

The carrying plate 191 can be connected to the fixing frame 193 through at least one connecting shaft 195, wherein the number of the fixing frame 193 can be two, and the fixing frames 193 can be respectively arranged on both sides of the carrying plate 191. The bearing plate 191 can rotate relative to the fixing frame 193 with the shaft 195 as the axis to change the elevation angle of the driving unit 15, the shaft sealing device 13, and the vacuum chamber 11, so as to facilitate the formation of a thin film of uniform thickness on the surface of each powder 121.

The above is only one of the preferred embodiments of the present invention, and is not intended to limit the scope of implementation of the present invention, that is, all the equivalent changes and changes in the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention Modifications should be included in the scope of the patent application for this new model.

10: Detachable powder atomic layer deposition device 11: Vacuum chamber 111: cover 1111: inner surface 112: connection unit 113: Cavity 115: monitor wafer 116: buckle unit 117: bottom 118: Piercing 119: Concave 12: reaction space 121: powder 13: Shaft seal device 130: protruding tube 131: Outer tube body 132: accommodating space 133: inner tube body 134: Connecting Space 139: filter unit 14: Gear 15: drive unit 16: Protective cover 161: buckle unit 163: Ring seal 165: Groove 167: Piercing 171: Extraction line 173: intake line 175: Non-reactive gas pipeline 177: heater 179: temperature sensing unit 181: connection unit 183: Magnetic unit 185: Magnetic unit 191: Carrier Board 193: fixed frame 195: connecting shaft

[Figure 1] is a three-dimensional schematic diagram of an embodiment of the new detachable powder atomic layer deposition apparatus.

[Figure 2] is a schematic cross-sectional view of an embodiment of the shaft sealing device of the novel detachable powder atomic layer deposition device.

[Figure 3] is a schematic cross-sectional view of an embodiment of the new detachable powder atomic layer deposition device.

[Fig. 4] is a schematic exploded cross-sectional view of an embodiment of the new detachable powder atomic layer deposition apparatus.

[Figure 5] is a three-dimensional exploded schematic view of an embodiment of the vacuum chamber and protective cover of the new detachable powder atomic layer deposition device.

[Figure 6] is a three-dimensional schematic diagram of an embodiment of the vacuum chamber and the protective cover of the new detachable powder atomic layer deposition device.

[Figure 7] is a schematic cross-sectional exploded view of another embodiment of the new detachable powder atomic layer deposition device.

[Figure 8] is a schematic cross-sectional view of another embodiment of the vacuum chamber and the protective cover of the new detachable powder atomic layer deposition device.

[Figure 9] is a schematic cross-sectional exploded view of another embodiment of the vacuum chamber and the protective cover of the new detachable powder atomic layer deposition device.

[Figure 10] is a schematic cross-sectional view of another embodiment of the vacuum chamber and protective cover of the new detachable powder atomic layer deposition device.

[Figure 11] is a schematic cross-sectional exploded view of another embodiment of the vacuum chamber and the protective cover of the new detachable powder atomic layer deposition device.

11: Vacuum chamber

116: buckle unit

117: bottom

16: Protective cover

161: buckle unit

163: Ring seal

165: Groove

Claims (10)

A detachable powder atomic layer deposition device, including: One shaft sealing device; A drive unit connected to the shaft sealing device; A vacuum chamber includes a bottom fixed to the shaft sealing device through at least one connecting unit, and includes a reaction space for accommodating a plurality of powders, wherein the driving unit drives the vacuum chamber to rotate through the shaft sealing device, After the connection unit is unlocked, the vacuum chamber is removed by the shaft sealing device; At least one gas extraction pipeline located in the shaft sealing device, fluidly connected to the reaction space of the vacuum chamber, and used to extract a gas in the reaction space; At least one gas inlet line is located in the shaft seal device, fluidly connected to the reaction space of the vacuum chamber, and used to transport a precursor gas or a non-reactive gas to the reaction space, wherein the non-reactive gas is used for blowing The powder in the reaction space; and A protective cover is used to cover the bottom of the vacuum chamber removed by the shaft sealing device. The detachable powder atomic layer deposition apparatus according to claim 1, wherein the bottom of the vacuum chamber is provided with a perforation, and the protective cover is used to cover the perforation. The detachable powder atomic layer deposition device according to claim 2, wherein the shaft sealing device includes an outer tube body and an inner tube body, and the outer tube body includes an accommodating space for accommodating the inner tube body, The air extraction line and the air intake line are located in the inner tube, and are fluidly connected to the reaction space through the perforation of the vacuum chamber. The detachable powder atomic layer deposition device according to claim 3, comprising a filter unit provided in the perforation of the vacuum chamber, and the suction line and the air inlet line are fluidly connected to the vacuum chamber through the filter unit At least one annular sealing element is provided on a surface of the protective cover connected to the vacuum chamber. When the protective cover covers the bottom of the vacuum chamber, the annular sealing element is located around the perforation and the filter unit . The detachable powder atomic layer deposition apparatus according to claim 3, wherein the bottom of the vacuum chamber includes a recess, and the recess extends from the bottom of the vacuum chamber to the reaction space for accommodating the protrusion In the inner tube body of the shaft sealing device, the perforation is located at one end of the recess connected to the reaction space, and the protective cover is used to cover the recess and the perforation. The detachable powder atomic layer deposition apparatus according to claim 5, comprising a filter unit disposed in the perforation of the recess, and the air suction line and the air inlet line are fluidly connected to the vacuum chamber through the filter unit In the reaction space, at least one annular sealing unit is arranged on a surface of the protective cover. When the protective cover covers the bottom of the vacuum chamber, the annular sealing unit is located around the perforation and the filter unit. The detachable powder atomic layer deposition apparatus according to claim 2, wherein the bottom of the vacuum chamber and the protective cover are provided with at least one corresponding snap unit or at least one magnetic attraction unit, and the protective cover penetrates the card The buckle unit or the magnetic attraction unit is connected and fixed on the bottom of the vacuum chamber. The detachable powder atomic layer deposition apparatus according to claim 2 includes at least one connecting unit for fixing the protective cover on the bottom of the vacuum chamber. The detachable powder atomic layer deposition apparatus according to claim 1, wherein the gas inlet line includes at least one non-reactive gas delivery line located in the shaft seal device, and the non-reactive gas delivery line is fluidly connected to the reaction of the vacuum chamber The space is used to deliver the non-reactive gas to the reaction space of the vacuum chamber to blow the powder in the reaction space. The detachable powder atomic layer deposition apparatus according to claim 1, wherein the vacuum chamber includes a cover plate and a cavity, and an inner surface of the cover plate covers the cavity to form the reaction between the two Space, and a monitoring wafer is arranged on the inner surface of the cover plate.

Images