TWM612965U - Water cooled head with additional finned radiator - Google Patents

Abstract

This creation is an additional fin radiator for water cooling head, which mainly includes: water pump, hot water pipe, cold water pipe, cooling fan, water cooling radiator, heat conduction equipment, heat dissipation fin set and heat conduction pipe. The hot water pipe and cold water pipe are connected to the water pump at one end. The other end is connected to a water-cooled row with a cooling fan. The heat-conducting device is arranged at the bottom of the water pump. One end of each heat-conducting tube is connected to the heat sink fin group, and the other end is set to contact the heat-conducting device. The hot water pipes and cold water pipes, plus radiating fins and heat pipes, adopt the method of general water cooling combined with the fins and heat pipes attached to the water cooling head to effectively improve the performance of the overall water cooling radiator.

Description

Water cooling head with additional fin radiator

This creation is a device for chip (CPU) to dissipate heat, especially a water-cooled head with additional fin radiator.

By the way, with the advancement of technology, devices that generate high temperatures due to operation, such as chips (CPU), processors, graphics card GPUs, transformers, etc., will use fin-type heat dissipation devices with higher heat dissipation efficiency for heat dissipation. This kind of heat dissipation equipment is mainly composed of multiple heat dissipation fins. A fixed distance between the heat dissipation fins is reserved for heat dissipation. The air convection can be used to reduce the temperature quickly. Although this kind of heat dissipation equipment has a high-efficiency heat dissipation effect, However, the overall weight of the heat dissipation fins is heavier when the number of heat dissipation fins is large. At the same time, since the air flow direction is only a horizontal path, the heat dissipation effect cannot be improved.

The detailed features and advantages of this creation will be described in detail in the following implementations. The content is sufficient to enable anyone familiar with the relevant art to understand the technical content of this creation and implement it accordingly, and based on the content disclosed in this specification, the scope of patent application and the drawings. , Anyone who is familiar with relevant skills can easily understand the purpose and advantages of this creation.

The main purpose of this creation is: the bottom of the water pump installed on the chip (CPU) penetrates the heat pipe and contacts the upper side to set the heat dissipation fin group, by combining the water pump, hot water pipe, and cold water Tubes and water-cooled platoons adopt an improved water-cooling method to effectively enhance the overall heat dissipation efficiency.

In order to achieve the above-mentioned purpose, this creation is a water-cooling head additional fin radiator, which includes: a water pump connected to a hot water pipe and a cold water pipe, the hot water pipe and the cold water pipe are connected to a water cooling row, and the water cooling row is provided A heat dissipation fan; a heat conduction device, which is arranged at the bottom of the water pump; and a plurality of heat conduction tubes, one end of which is penetrated to contact a heat dissipation fin group, and the other end is arranged to contact the heat conduction device.

According to an embodiment of the present invention, the water cooling row defines a hot water delivery row that is connected to the hot water pipe to input hot water and a cold water delivery row that is connected to the hot water delivery row and the cold water pipe. The hot water in the hot water delivery row is cooled by the radiating fan, flows to the cold water delivery row and is discharged from the cold water pipe, flows into the water pump and is used repeatedly.

According to an embodiment of the present invention, the heat-conducting device includes: a first heat-conducting plate arranged at the bottom of the water pump, and a second heat-conducting plate can be added to one side of the first heat-conducting plate to increase the heat-conducting effect.

According to an embodiment of the present invention, the first heat conducting plate is formed with a plurality of grooves for contacting one end of each heat conducting tube.

According to an embodiment of the present invention, a chip is provided at the bottom of the heat-conducting device.

According to an embodiment of the present invention, each of the heat pipes defines a bent portion.

1: radiator

10: Water pump

11: Hot water pipe

12: Cold water pipe

13: cooling fan

14: Thermal equipment

140: The first thermal board

1400: Groove

142: The second heat conduction plate

15: cooling fin set

16: heat pipe

160: bending part

17: Water cooling row

170: Hot water delivery row

172: Cold water conveying row

2: chip

Figure 1 is a three-dimensional schematic diagram of a preferred embodiment of the creation.

Figure 2 is a three-dimensional exploded schematic diagram of a preferred embodiment of the creation.

Figure 3 is a schematic diagram of the use state of the preferred embodiment of the authoring.

The following specific examples illustrate the implementation of this creation. Those familiar with this technique can easily understand the other advantages and effects of this creation from the content disclosed in this manual.

The structure, ratio, size, etc. shown in the drawings in this manual are only used to match the contents disclosed in the manual for the understanding and reading of those who are familiar with the art, and are not used to limit the implementation of this creation. Conditions, so it has no technical significance. Any structural modification, proportional relationship change, or size adjustment, without affecting the effects and goals that can be achieved by this creation, should still fall into this creation. The technical content of the disclosure must be within the scope of coverage. At the same time, the terms such as "one", "two", "shang", etc. cited in this specification are only for ease of description, and are not used to limit the scope of implementation of the creation, changes in their relative relationships or Adjustments, without substantial changes to the technical content, shall also be regarded as the scope of the creation that can be implemented.

Please refer to FIG. 1 and FIG. 2, which are a three-dimensional schematic diagram and a three-dimensional exploded schematic diagram of a preferred embodiment of the creation. This creation is an additional fin radiator for water cooling head. The radiator 1 mainly includes: water pump 10, hot water pipe 11, cold water pipe 12, cooling fan 13, heat conduction equipment 14, heat dissipation fin group 15, heat conduction pipe 16 and water cooling row 17 , One end of the hot water pipe 11 and the cold water pipe 12 is connected to the water pump 10, and the other end is connected to the water cooling row 17. The water cooling row 17 is provided with a cooling fan 13, and the water cooling row 17 defines a hot water delivery row that is connected to the hot water pipe 11 to input hot water. 170 and a cold water delivery row 172 that is in communication with the hot water delivery row 170 and the cold water pipe 12, wherein the hot water in the hot water delivery row 170 is cooled by the radiator fan 13 and delivered to the cold water delivery row 172 and discharged from the cold water pipe 12 , And then flow into the water pump 10 for repeated use. The heat-conducting device 14 is arranged at the bottom of the water pump 10, wherein the heat-conducting device 14 includes a first heat-conducting plate 140 arranged at the bottom of the water pump 10, and a second heat-conducting plate 142 can be installed on the side of the first heat-conducting plate 140 to increase the heat dissipation effect. One end of each heat pipe 16 is penetrated to contact the heat dissipation fin group 15, and the other end is configured to contact the heat conducting device 14. The water-cooling row 17 is combined with a heat-conducting device 14, and combined with a water pump 10, a hot water pipe 11 and a cold water pipe 12, so that this creation adopts a water-cooling method to effectively improve the overall heat dissipation efficiency.

The aforementioned first heat conduction plate 140 forms a plurality of grooves 1400. The grooves 1400 are used to fix one end of the heat conduction pipe 16 and are arranged in contact with each other. In addition to fixing, the contact area between the heat conduction pipe 16 and the first heat conduction plate 140 can also be increased to increase Heat dissipation efficiency.

In addition, the bottom of the aforementioned heat conducting device 14 is provided with a chip 2 (refer to FIGS. 2 and 3 ), and each heat conducting tube 16 defines a bent portion 160.

Refer also to FIG. 3, which is a schematic diagram of the use state of the preferred embodiment of the authoring. In the figure, the direction of the solid arrow is the direction of hot water flow, and the direction of the dashed arrow is the direction of cold water flow. In addition to being installed on the motherboard, the chip 2 is installed on the bottom of the heat-conducting device 14. The heat-conducting device 14 is made of copper with good thermal conductivity. It is better, so the heat generated by the chip 2 can be quickly discharged. At this time, the heat pipe 16 arranged between the first heat conducting plate 140 and the second heat conducting plate 142 transfers heat energy to the heat dissipation fin group 15 by means of the heat dissipation fins. The group 15 performs cold and heat exchange. As for the bent portion 160 on the heat pipe 16 can be bent and fitted according to the position of the heat dissipation fin group 15, thereby increasing the area of the overall heat pipe 16 contacting the heat dissipation fin group 15 to improve the heat dissipation effect In addition, the water pump 10 connected with the hot water pipe 11 and the cold water pipe 12 can transfer heat energy through the hot water pipe 11 to the water-cooled row 17 in a liquid manner. At this time, the hot water pipe 11 connected to the water-cooled row 17 will heat The water is input to the hot water delivery row 170 and transferred to the cold water delivery row 172. At this time, the hot water is cooled by the cooling fan 13 into cold water and output through the cold water pipe 12, and then delivered to the water pump 10 through the cold water pipe 12 and The temperature of a heat conducting plate 140 and a second heat conducting plate 142 are reduced, thereby achieving the effect of controlling the temperature of the chip 2.

It is worth mentioning that the aforementioned heat dissipation fin set 15 can be additionally equipped with a heat dissipation fan to increase the heat dissipation effect. From the above, it can be seen that the bottom of the water pump 10 installed above the chip 2 (CPU) The heat pipe 16 passes through the heat pipe 16 and is in contact with the upper part of the heat dissipation fin group 15. By combining the water pump 10, the hot water pipe 11, the cold water pipe 12 and the water cooling row 17, an improved water cooling method is adopted to effectively improve the overall heat dissipation efficiency.

It can be seen from the above that the combination of the heat conduction heat dissipation method of the heat dissipation fin set 15 and the water cooling heat dissipation method can greatly improve the overall heat dissipation effect.

The above-mentioned embodiments are merely illustrative to illustrate the principle and effects of the creation, and are not used to limit the creation. Anyone familiar with this technique can modify the above-mentioned embodiments without departing from the spirit and scope of this creation. Therefore, the scope of protection of the rights of this creation should be listed in the scope of patent application described later.

1: radiator

10: Water pump

11: Hot water pipe

12: Cold water pipe

13: cooling fan

14: Thermal equipment

15: cooling fin set

16: heat pipe

17: Water cooling row

160: bending part

170: Hot water delivery row

172: Cold water conveying row

Claims (8)

An additional fin radiator for a water cooling head, which includes: A water pump connected to a hot water pipe and a cold water pipe, the hot water pipe and the cold water pipe are connected to a water cooling row, and the water cooling row is provided with a cooling fan; A heat-conducting device installed at the bottom of the water pump; and One end of the plurality of heat conduction pipes is penetrated to contact a heat dissipation fin group, and the other end is set to contact the heat conduction device. The water-cooling head additional fin radiator according to claim 1, wherein the water-cooling row defines a hot water delivery row that is connected to the hot water pipe to input hot water, and a hot water delivery row that is connected to the hot water delivery row and the cold water pipe In the cold water delivery row, the hot water in the hot water delivery row is cooled by the radiating fan and delivered to the cold water delivery row and discharged from the cold water pipe, and then flows into the water pump for repeated use. The water-cooling head additional fin radiator according to claim 1, wherein the heat-conducting device includes: a first heat-conducting plate arranged at the bottom of the water pump. According to claim 3, the water-cooling head additional fin radiator, wherein the first heat-conducting plate forms a plurality of grooves for contacting one end of each heat-conducting tube. The water-cooling head additional fin heat sink according to claim 3, wherein a chip is provided at the bottom of the heat-conducting device. The water-cooling head additional fin heat sink according to claim 1, wherein each of the heat pipes defines a bent portion. The water-cooling head additional fin heat sink as described in claim 1, wherein a cooling fan can be additionally installed at the side of the cooling fin assembly. The water-cooling head additional fin heat sink according to claim 1, wherein the heat-conducting device can add a second heat-conducting plate on one side of the first heat-conducting plate.

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