CN106052444A - Flat-plate heat pipe arrayed radiator - Google Patents
Flat-plate heat pipe arrayed radiator Download PDFInfo
- Publication number
- CN106052444A CN106052444A CN201610550532.1A CN201610550532A CN106052444A CN 106052444 A CN106052444 A CN 106052444A CN 201610550532 A CN201610550532 A CN 201610550532A CN 106052444 A CN106052444 A CN 106052444A
- Authority
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- China
- Prior art keywords
- plate
- flow path
- hot flow
- heating plate
- condensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 49
- 238000009833 condensation Methods 0.000 claims description 39
- 230000005494 condensation Effects 0.000 claims description 39
- 230000005855 radiation Effects 0.000 claims description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 15
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 7
- 238000011049 filling Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 230000005484 gravity Effects 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 description 7
- 230000003416 augmentation Effects 0.000 description 4
- 238000009841 combustion method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000005144 thermotropism Effects 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 210000001367 artery Anatomy 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a flat-plate heat pipe arrayed radiator. The flat-plate heat pipe arrayed radiator comprises a heating plate and condensing plates. The heating plate is arranged horizontally and used for placing heating electronic components. The condensing plates comprise a first condensing plate and a second condensing plate. The first condensing plate and the second condensing plate are arranged at two ends of the heating plate in a vertical up manner separately. A plurality of rows of radiating fins are arranged on both sides of each condensing plate. A first condensing channel is arranged in the first condensing plate and a second condensing channel is arranged in the second condensing plate. A first hot runner communicating with the first condensing channel is arranged on one side of the interior of the heating plate and a second hot runner communicating with the second condensing channel is arranged on the other side of the interior of the heating plate. The radiator has the advantages that the heat transfer property of the radiator is improved and the cooling effect is strengthened; a liquid-state radiating working medium flows to the hot runners under the action of gravity, so that a unidirectional circulating reciprocating motion can be formed and the occurrence of a ''dry burning'' phenomenon in the heating plate can be prevented.
Description
Technical field
The present invention relates to field of radiating, be specifically related to a kind of flat-plate heat pipe array radiator.
Background technology
Flat pulsating heat pipe utilize Working fluid phase changing to carry out heat transfer to have heat transfer efficiency high, the advantages such as even temperature effect is good,
High heat flux electronic equipment dissipating heat direction has huge advantage.The flat pulsating heat pipe of traditional type places heating in the horizontal direction
Time, the liquefaction working medium of condensation segment usually can not be back to bringing-up section in time, finally results in the internal generation " dry combustion method " of pulsating heat pipe existing
As, affect the vibration of working medium, the final heat transfer property reducing pulsating heat pipe.
Summary of the invention
In sum, in order to overcome the deficiencies in the prior art, the technical problem to be solved is to provide a kind of flat
Plate heat pipe array radiator.
The technical scheme is that a kind of flat-plate heat pipe array radiator, including adding
Hot plate and cold plate, described heating plate is horizontally disposed with and for placing heating electronic device, described cold plate includes the first condensation
Plate and the second cold plate, described first cold plate and described second cold plate are arranged on the two of described heating plate the most straight up
End, described cold plate both sides be equipped with multiple row fin, with every string fin one a pair in described first cold plate
The position answered is provided with the first condensation road, is provided with second with every string fin position one to one in described second cold plate
Condensation road, described first condensation road and described second condensation road in specular, and described first condensation road and described the
Two condensation roads, all in downward opening U-shape, described cold plate are respectively equipped with to described first condensation road and described second cold
The liquid filling hole of heat radiation working medium is added in solidifying road；
In described heating plate, side is provided with the first hot flow path being connected with described first condensation road, described first heat
What runner was opening towards outside described heating plate is U-shaped, and the other side in described heating plate is provided with and described second condensation
The second hot flow path that road is connected, described second runner is mirror image about centrage and described first hot flow path of described heating plate
It is symmetrical arranged, and the U-shaped diapire of described first hot flow path and described second hot flow path is provided with rough capillary structure.
The invention has the beneficial effects as follows:
(1) liquid heat radiation working medium thermotropism flow passage under gravity, can form the reciprocal of an one-way circulation
Motion, prevents internal " dry combustion method " phenomenon that occurs of heating plate, the heat transfer property of raising radiator；
(2) during heating plate horizontal positioned, cold plate is vertically to place, and is more beneficial for gravity reflux, and strengthening internal working medium shakes
Swing；
(3) radiator can be regarded two pulsating heat pipes as and share a bringing-up section, chip or components and parts conduction to adding
The heat of hot plate is cooled down by two cold plates simultaneously, enhances cooling effect；
(4) two the cold plate surfaces vertically placed are disposed with multiple fin, on the basis of classic flat-plate pulsating heat pipe
On increase the heat loss through convection area with air, be conducive to increasing the temperature difference at pulsating heat pipe cold and hot two ends, strengthen internal working medium
Vibration, finally plays the effect of augmentation of heat transfer；
(5) by heat spreader module, it is simple to process and install, can need this module is combined according to reality heat radiation
Array；
(6) capillary structure surface (various structures can be made) is had to advantageously form bubble core at hot flow path curved segment,
Increase bringing-up section working medium and generate the probability of bubble, finally play the effect of augmentation of heat transfer.
On the basis of technique scheme, the present invention can also do improvement further below:
Further, described first hot flow path include exterior-heat runner that opening is bigger and multiple be arranged in exterior-heat runner in and open
Mouthful less interior hot flow path, the first condensation road described in same connects described exterior-heat runner and the nearer interior-heat of distance exterior-heat runner
Runner or adjacent two interior hot flow paths.
Use above-mentioned further technical scheme has the beneficial effect that increase area of dissipation, it is ensured that heat radiation is uniformly.
Further, described heat radiation working medium is any one or the nano-fluid in methanol, ethanol and acetone.
Use above-mentioned further technical scheme has the beneficial effect that increase radiating efficiency.
Further, described heating plate, described cold plate and described fin are copper or aluminum is made.
Use above-mentioned further technical scheme has the beneficial effect that heat conductivity is high, increases radiating efficiency.
Further, described heating plate, described cold plate and described fin print one-shot forming through 3D.
Having the beneficial effect that of above-mentioned further technical scheme is used to avoid flat-plate heat pipe bending causes the broken of tube chamber
Bad.
Accompanying drawing explanation
Fig. 1 is the front view of the present invention；
Fig. 2 is the top view of the present invention；
Fig. 3 is the A-A sectional view of Fig. 2；
Fig. 4 is the side view of the present invention；
Fig. 5 is the B-B sectional view of Fig. 4.
In accompanying drawing, the list of parts representated by each label is as follows:
1, heating plate, the 2, first cold plate, the 3, second cold plate, the 4, fin, 5, first condensation road, the 6, second condensation
Road, 7, liquid filling hole, the 8, first hot flow path, the 9, second hot flow path, 10, capillary structure.
Detailed description of the invention
Being described principle and the feature of the present invention below in conjunction with accompanying drawing, example is served only for explaining the present invention, and
Non-for limiting the scope of the present invention.
As Figure 1-4, a kind of flat-plate heat pipe array radiator, including heating plate 1 and cold plate, described heating plate 1
Being horizontally disposed with and for placing heating electronic device, described cold plate includes the first cold plate 2 and the second cold plate 3, described
One cold plate 2 and described second cold plate 3 are arranged on the two ends of described heating plate 1 the most straight up, described cold plate
Both sides are equipped with multiple row fin 4.Cold plate is vertically placed, and is disposed with multiple fin 4 and uses above the wooden partition of cold plate both sides
To strengthen thermolysis, fin 4 shape can make variously-shaped (straight wing, ripple type, S type etc.) according to radiating requirements,
Two the cold plate surfaces vertically placed are disposed with multiple fin 4, between fin 4 all leaves between up and down suitably
Gap, in order to blowing air over of different directions, plays preferable heat exchange effect.Increase on the basis of classic flat-plate pulsating heat pipe with
The heat loss through convection area of air, is conducive to increasing the temperature difference at the cold and hot two ends of pulsating heat pipe, strengthens the vibration of internal working medium, finally rise
Effect to augmentation of heat transfer.
It is provided with the first condensation road 5, described with every string fin position one to one in described first cold plate 2
It is provided with the second condensation road 6, described first condensation road 5 and institute with every string fin position one to one in second cold plate 3
The structure stating the second condensation road 6 is specular, and described first condensation road 5 and described second condensation road 6 are all in opening court
Under U-shape, described cold plate is respectively equipped with to described first condensation road 5 and described second condensation road 6 in add heat radiation work
The liquid filling hole 7 of matter.Preferred: described heat radiation working medium be in methanol, ethanol and acetone any one/methanol, ethanol and acetone
Mixed working fluid/nano-fluid.
In described heating plate 1, side is provided with and condenses the first hot flow path 8 that road 5 is connected with described first, and described first
Hot flow path 8 is U-shaped towards outside described heating plate 1 in opening, and the other side in described heating plate 1 is provided with and described second
The second hot flow path 9 of being connected of condensation road 6, described second runner 9 is about the centrage of described heating plate 1 and described first hot-fluid
Road 8 is arranged in specular, and the U-shaped diapire of described first hot flow path 8 and described second hot flow path 9 is provided with uneven
Capillary structure 10.Heat radiation working medium hot flow path in heating plate 1 by liquid absorbent heat when gaseous state converts, hot flow path elbow
Section has capillary structure 10 surface (can make various structures) to advantageously form bubble core, increases bringing-up section working medium and generates gas
The probability of bubble, finally plays the effect of augmentation of heat transfer.Described first hot flow path 8 includes exterior-heat runner that opening is bigger and multiple row
Be listed in exterior-heat runner and interior hot flow path that opening is less, the first condensation road 5 described in same connect described exterior-heat runner and away from
Interior hot flow path close to exterior-heat runner or adjacent two interior hot flow paths.
Described heating plate 1, described cold plate and described fin 4 are the high metal material of copper of heat conductivity or aluminium
Expect to print one-shot forming through 3D, flat-plate heat pipe bending need not be destroyed condensation road or hot flow path.Radiator after forming
Inside tube chamber, heat radiation working medium (pure refrigerant of methanol, ethanol, acetone etc. or mixed working fluid, nanometer stream it is filled with after carrying out evacuation
Body etc.).Heat is conducted to the heat radiation working medium within hot flow path in heating plate, heat radiation by heating electronic device by heating plate wooden partition
After working medium absorbs heat vaporization, there is pressure differential in heating road and condensation road, thus drives heat radiation working medium from heating road to condensation road
Flowing, heat is put to fin by the heat radiation working medium in condensation road, and the heat radiation working medium finally condensed is converted into liquid, liquid by gaseous state
State heat radiation working medium thermotropism flow passage under gravity, eventually forms the reciprocating motion of an one-way circulation, prevents heating
There is " dry combustion method " phenomenon in intralaminar part, improves the heat transfer property of radiator.Additionally during heating plate 1 horizontal positioned, cold plate is vertical
Place, be more beneficial for the gravity reflux of heat radiation working medium, the vibration of strengthening internal heat dissipating working medium.Radiator can regard two arteries and veins as
Dynamic heat pipe shares the while that a bringing-up section, chip or components and parts conducting the heat to heating plate and is carried out cold by two cold plates
But, cooling effect is enhanced.
Finally different modules can also be selected to carry out array according to actual heating power heat spreader module, it is simple to
Processing and installation.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (5)
1. a flat-plate heat pipe array radiator, including heating plate (1) and cold plate, described heating plate (1) is horizontally disposed with also
For placing heating electronic device, described cold plate includes the first cold plate (2) and the second cold plate (3), described first condensation
Plate (2) and described second cold plate (3) are arranged on the two ends of described heating plate (1) the most straight up, it is characterised in that described
Cold plate both sides be equipped with multiple row fin (4), in described first cold plate (2) with every string fin one_to_one corresponding
Position be provided with the first condensation road (5)；It is provided with every string fin position one to one in described second cold plate (3)
Second condensation road (6)；Described first condensation road (5) and the described second structure condensing road (6) they are specular, and described the
One condensation road (5) and described second condensation road (6), all in downward opening U-shape, described cold plate are respectively equipped with to described
The liquid filling hole (7) of heat radiation working medium is added in first condensation road (5) and described second condensation road (6)；
In described heating plate (1), side is provided with and described first condensation road (5) the first hot flow path (8) of being connected, and described the
One hot flow path (8) is U-shaped towards described heating plate (1) outside in opening, other side in described heating plate (1) be provided with
The second hot flow path (9) that described second condensation road (6) is connected, described second runner (9) is about the center of described heating plate (1)
Line and described first hot flow path (8) are arranged in specular, and described first hot flow path (8) and described second hot flow path (9)
U-shaped diapire be provided with rough capillary structure (10).
Radiator the most according to claim 1, it is characterised in that outside described first hot flow path (8) includes that opening is bigger
Hot flow path and multiple being arranged in exterior-heat runner and interior hot flow path that opening is less, the first condensation road (5) connection described in same
Described exterior-heat runner and the distance nearer interior hot flow path of exterior-heat runner or adjacent two interior hot flow paths.
Radiator the most according to claim 1, it is characterised in that described heat radiation working medium is in methanol, ethanol and acetone
Any one or nano-fluid.
4. according to the arbitrary described radiator of claims 1 to 3, it is characterised in that described heating plate (1), described cold plate with
And described fin (4) is copper or aluminum is made.
Radiator the most according to claim 4, it is characterised in that described heating plate (1), described cold plate and described dissipate
Backing (4) prints one-shot forming through 3D.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610550532.1A CN106052444B (en) | 2016-07-13 | 2016-07-13 | A kind of flat-plate heat pipe array radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610550532.1A CN106052444B (en) | 2016-07-13 | 2016-07-13 | A kind of flat-plate heat pipe array radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106052444A true CN106052444A (en) | 2016-10-26 |
| CN106052444B CN106052444B (en) | 2017-11-14 |
Family
ID=57185538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610550532.1A Active CN106052444B (en) | 2016-07-13 | 2016-07-13 | A kind of flat-plate heat pipe array radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106052444B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106777754A (en) * | 2016-12-30 | 2017-05-31 | 吉林建筑大学 | A kind of flat-plate type micro heat pipe array radiator optimization method |
| CN107466195A (en) * | 2017-09-14 | 2017-12-12 | 郭良安 | Pulsating heat pipe and heat exchanger |
| CN107529321A (en) * | 2017-09-06 | 2017-12-29 | 邹剑青 | A kind of radiator for electronic product |
| CN109565945A (en) * | 2017-03-02 | 2019-04-02 | 华为技术有限公司 | Conducting-heat elements and mobile terminal |
| TWI697651B (en) * | 2017-12-13 | 2020-07-01 | 奇鋐科技股份有限公司 | Heat dissipation device manufacturing method |
| CN114895512A (en) * | 2022-06-09 | 2022-08-12 | 中国科学院长春光学精密机械与物理研究所 | Active and passive mixed cooling heat dissipation rear cover of industrial camera |
| WO2022238086A1 (en) * | 2021-05-11 | 2022-11-17 | Robert Bosch Gmbh | Cooling device |
| WO2023118405A1 (en) * | 2021-12-22 | 2023-06-29 | Robert Bosch Gmbh | Cooling device |
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| CN203177704U (en) * | 2013-01-25 | 2013-09-04 | 苏州聚力电机有限公司 | Clamping locating type uniform temperature board fin integration module |
| CN104567499A (en) * | 2015-01-20 | 2015-04-29 | 北京建筑大学 | Pulse heat pipe heat radiation device used for electronic device and heat radiation device thereof |
| CN205991730U (en) * | 2016-07-13 | 2017-03-01 | 梁才航 | A kind of flat-plate heat pipe array radiator |
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| JP2004156835A (en) * | 2002-11-06 | 2004-06-03 | Ts Corporation | Device radiator |
| CN2869741Y (en) * | 2005-12-21 | 2007-02-14 | 李建明 | Flat-heat-tube radiator |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106777754A (en) * | 2016-12-30 | 2017-05-31 | 吉林建筑大学 | A kind of flat-plate type micro heat pipe array radiator optimization method |
| CN106777754B (en) * | 2016-12-30 | 2020-04-28 | 吉林建筑大学 | Optimization method for flat micro heat pipe array radiator |
| CN109565945A (en) * | 2017-03-02 | 2019-04-02 | 华为技术有限公司 | Conducting-heat elements and mobile terminal |
| CN109565945B (en) * | 2017-03-02 | 2020-07-28 | 华为技术有限公司 | Heat conduction part and mobile terminal |
| US10831249B2 (en) | 2017-03-02 | 2020-11-10 | Huawei Technologies Co., Ltd. | Heat conduction component and mobile terminal |
| CN107529321A (en) * | 2017-09-06 | 2017-12-29 | 邹剑青 | A kind of radiator for electronic product |
| CN107466195A (en) * | 2017-09-14 | 2017-12-12 | 郭良安 | Pulsating heat pipe and heat exchanger |
| TWI697651B (en) * | 2017-12-13 | 2020-07-01 | 奇鋐科技股份有限公司 | Heat dissipation device manufacturing method |
| WO2022238086A1 (en) * | 2021-05-11 | 2022-11-17 | Robert Bosch Gmbh | Cooling device |
| WO2023118405A1 (en) * | 2021-12-22 | 2023-06-29 | Robert Bosch Gmbh | Cooling device |
| CN114895512A (en) * | 2022-06-09 | 2022-08-12 | 中国科学院长春光学精密机械与物理研究所 | Active and passive mixed cooling heat dissipation rear cover of industrial camera |
| CN114895512B (en) * | 2022-06-09 | 2023-08-15 | 中国科学院长春光学精密机械与物理研究所 | Industrial camera conformal active and passive mixed cooling heat dissipation rear cover |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106052444B (en) | 2017-11-14 |
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Application publication date: 20161026 Assignee: Guilin Qunmei Technology Co.,Ltd. Assignor: GUILIN University OF ELECTRONIC TECHNOLOGY Contract record no.: X2023980044664 Denomination of invention: A flat heat pipe array heat sink Granted publication date: 20171114 License type: Common License Record date: 20231031 |