M426513 、新型說明： 【新型所屬之技術領域】 • 本創作係提供一種導熱自黏線路基板改良，尤指一 • 種利用導熱絕緣雙面膠來達到散熱及連接安裝目的之一種 導熱自黏線路基板。 【先前技術】 由於科技的進步，照明設備也由亮度較高、使用壽命 Φ 較長及耗電量較低的LED燈取代過去的傳統燈源，而被大 量的應用在各個不同的領域。 LED燈内设置有線路基板，一般而言’線路基板通常 是由鋁基板或陶瓷基板製成，但是此兩種基板都有使用上 的缺陷，鋁基板的缺陷在於導熱性與耐電壓性差，造成散 熱不易，影響LED的使用壽命，並且安裝上也需要以繁瑣 反覆的上螺絲動作來協助固定，相當不便，而陶瓷基板雖 φ 然具有不錯的導熱性，但製造成本較高 '質地易碎，並且 與铭基板相同，在安裝上也相當不便。 為了解決上述之缺陷，如中華民國專利號M394569所 揭露的一種導熱自黏線路基板，利用導熱雙面膠來使線路 基板具有撓性’不易損壞，並可黏貼於不同形狀之表面 但此種導熱自黏線路基板在不僅在製作上較為複雜，需要 粑費許多時間成本，例如必須在絕緣層上打上鍍錫孔才口 以進行使外部電子設備通過並電性連接，假若加工時作/ 3 M426513 瑕疫’以致於鍍錫孔沒有打好，會造成線路基板本身 無法使用之情事產生。 有鑑於此，本案之創作去丨、；夕& 釗作者以多年之研究經驗，研發出 -種可解決習知技術所無法解決的—種導熱自黏線路基板 改良。 【新型内容】 本創作之主要目的，在於提供一種導熱自黏線路基板 改良，藉由改變導電層之排列方式，冑導電層可以直接電 性連接於外部電子設備，不需再藉由打洞之方式製造出電 性連接之位置，減少生產時花費的時間及材料成本，同時， 藉由設置具有撓性的絕緣層，使線路基板不但具有支撑的 效果，更具有可黏貼於不同曲度表面之功能。 該導熱自黏線路基板改良係包含：一導電層，其表面 设有電子線路，以供一外部電子設備做電性連接；一絕緣 層，係連接於該導電層，具有絕緣並支撐線路基板的效果； 及自黏層，係連接於該絕緣層與該導電層連接之相對 面並具有導熱、絕緣及黎貼的功能；及_遮蔽層，係形 成於導電層與絕緣層連接之相對面，係具有絕緣的效果； 其中，因導電層、絕緣層及自黏層因厚度小，故具有撓性， 可作微幅的彎曲。 【實施方式】 為了此夠更清楚地描述本創作所提出之一種導熱自漆占 M426513 /破路基板改良，以下將配合圖示，詳盡說明本創作之較佳 實施例。 ♦ 請同時參閱第一圖、第二圖及第三圖，係本創作之一 •較佳實施例之結構展開示意圖、結構組合示意圖及應用示 意圖，其中，該導熱自黏線路基板改良係包含：一導電層 1，在本實施例中為-銅笛層，其表面設有以藥劑之顯影姓 刻製作而成之電子線路，可供一外部電子設備5做電性連 •接’該電子設備5可為led燈或〇1^燈（如第三圖所示）； 一絕緣層2,在本實施例中係一耐高溫絕緣薄膜，係連接 於該導電層1，並具有絕緣並支撐線路基板的效果；及一 自黏層3,係連接於該絕緣層2與該導電層丨連接之相對 面，並且具有導熱、散熱、絕緣及黏貼的功能，該自黏層 3可為導熱絕緣雙面膠、P1膠或PET膠；及一遮蔽層4， 係可為白油或絕緣薄膜，，若使用白油，則會將白油塗佈 鲁於導電層1與絕緣層2連接之相對面，使之具有絕緣的效 果，並且在塗佈時即可直接將導電層之電性連接焊接點位 置空出’增加製造時的便利性，若使用絕緣薄膜，則會事 先於絕緣薄膜上打上孔洞，在加工黏貼於導電層1時，直 接將導電層上的電性連接焊接點位置空出；其中，導電層 1、絕緣層2及自黏層3因厚度小，故使之具有撓性，可作 微幅的彎曲’故再搭配具有黏貼效果的自黏層3，可使之 黏貼於任一平面或具有小幅彎曲的曲面上。 5 M426513 綜上所述，本創作已作了相當完整之揭露，從中，可 以得知歸納出本創作係具有下列之優點： . 丨_藉由調整各層的排列方式，也就是將導電層的位置從 • 中間層移至表層，並以油墨當作遮蔽層，在製造時可 直接空出電性連接的焊接點或者事先對絕緣薄膜打洞 當作遮蔽層，同樣的可以直接空出電性連接的焊接 點，改善了習知技術中將導電層設置在中間層，必須 # 額外在絕緣層上加工打上鍍錫孔以便用於電性連接的 缺陷，同時減少了加工所耗費的時間及材料成本。 2.絕緣層本身具有支撐性及撓性，一方面可以支撐住整 體線路基板的結構，另一方面亦可彎曲並搭配自黏層 黏貼於具有弯曲之曲面上，擴充了使用性跟便利性。 然而’上述之詳細說明係針對本創作可行實施例之具 體說明’惟該實施例並非用以限制本創作之專利範圍，凡 _ 未脫離本創作技藝精神所為之等效實施或變更，均應包含 於本案之專利範圍中。 【圖式簡單說明】 第一圖係本創作之一種導熱自黏線路基板改良之一較佳實 施例之結構展開示意圖； 第二圖係、本創作之—種導熱自黏線路基板改良之該較佳實 施例之結構組合示意圖；及 6 M426513 三圖係本創作之一種導熱自黏線路基板改良之較佳實施 例之應用示意圖。 【主要元件符號說明】 1 導電層 2 絕緣層 3 自黏層 4 遮蔽層 5 外部電子設備M426513, new description: [New technical field] • This creation provides a kind of self-adhesive self-adhesive circuit board, especially a kind of self-adhesive self-adhesive circuit board that uses heat-conductive and insulating double-sided tape to achieve heat dissipation and connection installation. . [Prior Art] Due to advances in technology, lighting equipment has been replaced by traditional LED sources with high brightness, long life Φ and low power consumption, and has been widely used in various fields. A circuit board is provided in the LED lamp. Generally, the circuit board is usually made of an aluminum substrate or a ceramic substrate, but both of the substrates have defects in use, and the defects of the aluminum substrate are poor thermal conductivity and withstand voltage, resulting in The heat dissipation is not easy, affecting the service life of the LED, and the installation also requires a complicated and repeated screw action to assist the fixing, which is quite inconvenient, and the ceramic substrate has good thermal conductivity, but the manufacturing cost is high, the texture is fragile. And it is the same as the Ming substrate, and it is quite inconvenient to install. In order to solve the above defects, for example, a thermally conductive self-adhesive circuit substrate disclosed in the Republic of China Patent No. M394569 utilizes a heat-conductive double-sided tape to make the circuit substrate flexible, which is not easily damaged and can be adhered to surfaces of different shapes but such heat conduction. The self-adhesive circuit substrate is not only complicated in fabrication, but also requires a lot of time cost. For example, it is necessary to put a tin-plated hole on the insulating layer to make the external electronic device pass through and electrically connect, if it is processed, 3 M426513 The plague 'so that the tin-plated holes are not well-made, will cause the circuit board itself to be unusable. In view of this, the creation of this case went to the 导热, 夕 & 钊 以 以 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年 多年[New content] The main purpose of this creation is to provide a heat-conducting self-adhesive circuit substrate. By changing the arrangement of the conductive layers, the conductive layer can be directly electrically connected to external electronic devices without the need for holes. The method is to manufacture the position of the electrical connection, reduce the time and material cost of production, and at the same time, by providing a flexible insulating layer, the circuit substrate not only has the effect of supporting, but also has the ability to adhere to different curved surfaces. Features. The thermally conductive self-adhesive circuit substrate improvement system comprises: a conductive layer having an electronic circuit on its surface for electrically connecting an external electronic device; an insulating layer connected to the conductive layer, having insulation and supporting the circuit substrate The self-adhesive layer is connected to the opposite surface of the insulating layer and the conductive layer and has the functions of heat conduction, insulation and adhesion; and the shielding layer is formed on the opposite side of the connection between the conductive layer and the insulating layer. It has the effect of insulation; among them, since the conductive layer, the insulating layer and the self-adhesive layer have a small thickness, they are flexible and can be bent slightly. [Embodiment] For the purpose of more clearly describing the improvement of the heat-conductive self-painting of the M426513/breaking substrate proposed in the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the drawings. ♦ Please refer to the first, second and third figures at the same time. It is a schematic diagram of the structure of the preferred embodiment, a schematic diagram of the structure combination and an application diagram. The improved self-adhesive circuit board includes: A conductive layer 1, in this embodiment, is a copper flute layer having an electronic circuit formed on the surface of the developer by a developer, for an external electronic device 5 to be electrically connected to the electronic device. 5 can be a led lamp or a lamp (as shown in the third figure); an insulating layer 2, in this embodiment is a high temperature resistant insulating film, is connected to the conductive layer 1, and has insulation and supports the line The effect of the substrate; and a self-adhesive layer 3 is connected to the opposite side of the insulating layer 2 and the conductive layer, and has the functions of heat conduction, heat dissipation, insulation and adhesion, and the self-adhesive layer 3 can be a thermal insulation double a face glue, a P1 glue or a PET glue; and a masking layer 4, which may be a white oil or an insulating film. If white oil is used, the white oil is coated on the opposite side of the conductive layer 1 and the insulating layer 2. , to make it have an insulating effect, and can be straight when coated The position of the electrical connection of the conductive layer is vacated to increase the convenience of manufacturing. If an insulating film is used, a hole is formed in the insulating film in advance, and when the film is processed and adhered to the conductive layer 1, the conductive layer is directly applied. The position of the electrical connection solder joint is vacant; wherein the conductive layer 1, the insulating layer 2 and the self-adhesive layer 3 have a small thickness, so that they have flexibility and can be used for micro-bending bending, so the self-adhesive effect with the adhesive effect is matched. Layer 3, which can be applied to any plane or curved surface with a small curvature. 5 M426513 In summary, this creation has been fairly completely revealed, from which it can be known that the creation department has the following advantages: . 丨 _ By adjusting the arrangement of the layers, that is, the position of the conductive layer Move from the middle layer to the surface layer and use the ink as the shielding layer. During the manufacturing process, the solder joints of the electrical connection can be directly vacated or the insulating film can be holed as a shielding layer in advance, and the same electrical connection can be directly made. The soldering point improves the conventional technique of placing the conductive layer on the intermediate layer, and must additionally process the tinned hole on the insulating layer for the electrical connection defect, and reduce the time and material cost of the processing. . 2. The insulating layer itself has support and flexibility. On the one hand, it can support the structure of the whole circuit substrate, on the other hand, it can be bent and adhered to the curved surface with the self-adhesive layer, which expands the usability and convenience. However, the above detailed description is intended to be illustrative of the specific embodiments of the present invention, and is not intended to limit the scope of the present invention. In the scope of the patent in this case. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic development diagram of a preferred embodiment of a thermally conductive self-adhesive circuit substrate of the present invention; the second figure is a modification of the heat conduction self-adhesive circuit substrate of the present invention. A schematic diagram of a structural combination of a preferred embodiment; and 6 M426513 is a schematic diagram of an application of a preferred embodiment of a thermally conductive self-adhesive circuit substrate. [Main component symbol description] 1 Conductive layer 2 Insulating layer 3 Self-adhesive layer 4 Masking layer 5 External electronic equipment