TWM473039U - A kind of substrate board device - Google Patents

Abstract

The creation discloses a substrate board device, including a thermally conductive layer and the FR4 board or FPC board, the FR4 board or the FPC board having electronic chips to provide high power with the heat conduction layer in direct contact heat transfer hollow hole; the FR4 board or the FPC board having provided in the upper and lower sides of the first copper clad layer and the second copper clad, the first copper clad printed circuit, the second copper clad layer is connected with the thermally conductive layer welding. Compared with the prior art, the creation on the one hand to avoid the frequent expansion and contraction since the viscose FR4 board or FPC board tilt and high power electronic wafer damage; Other use of the FR4 board or the FPC board having a higher anti-peeling force characteristics, can be solved the problem of pad peeling easily, and to ensure that the service life of the entire substrate means.

Description

Substrate device

The present invention relates to high power electronic wafers in the field of application for both heat dissipation and insulation, and more particularly to a substrate device which has a long service life.

In order to realize the application of high-power electronic wafers in consideration of both heat conduction and insulation withstand voltage, please refer to a device for considering both heat conduction and insulation withstand voltage of the LED in the invention patent application No. 101118463.

As shown in FIG. 1A to FIG. 1D, it is an FR-4 epoxy board (FR-4 is a material standard specified by the NEMA American Electrical Manufacturers Association; FR means that the substrate is made of a material that is not easily ignited to make the substrate flame retardant ( Flame Retardent) or Flame resistance; FR-4 is a code name for a flame resistant material. It means a material specification that the resin material must be self-extinguishing after being burned. It is not a material name, but A material grade; that is, an FR-4 grade epoxy glass cloth laminate or a fiberglass board, or a flexible printed circuit board (FPC; or soft board) 11 is connected to the temperature equalization board 12 to form a substrate device. The schematic diagram of the FR-4 epoxy board or the flexible printed circuit board 11 is fixedly connected to the temperature equalizing plate 12 by adhesive, on the one hand, because of the improvement on the FR-4 epoxy board or the flexible printed circuit board 11 The high-power electronic chip 13 has a heat-dissipating hole 111, so that in order to prevent overflow, it is troublesome to operate, and it is contaminated due to the problem of overflowing glue. The pad causes poor thermal conductivity. On the other hand, since the high-power electronic chip 13 will continue to generate heat, the adhesive will be subjected to high temperature and low temperature environment changes, and the FR-4 epoxy board or the flexible printed circuit board is prone to occur due to the frequent expansion and contraction of the thermal expansion and contraction. 11 tilting causes the FR-4 epoxy board or flexible printed circuit board 11 to be detached from the temperature equalizing plate 12 and directly causes damage to the high power electronic chip 13.

Referring to FIG. 2A to FIG. 2D, the circuit layer 21 is directly printed on the temperature equalizing plate 22, so that the FR-4 epoxy board or the flexible printed circuit board and the temperature equalizing plate 22 can be solved due to the above adhesive. The problem of detaching and damaging high power electronic chips. However, when a company's average temperature board is provided to customers to do the whole lamp export to the Middle East countries, it will receive foreign customers' complaints within half a year, because the black glue level on the uniform temperature plate falls off, causing the whole lamp to be bad, and it is required to handle the repair after the repair. . The reason is that after the wire is soldered on the pad 23, in order to make the connection between the wire and the pad 23 sufficiently stable, it is required to be fixed by epoxy glue because the temperature change and the epoxy resin contain hard acrylic. Therefore, the pad 23 is continuously pulled during use, and eventually the pad 23 is peeled off, so that the service life of the entire substrate device is lowered.

In view of this, the creator has conducted in-depth research on the above-mentioned defects in the prior art, and this case has arisen.

The purpose of the present invention is to provide a substrate device to solve the problem of the operation of preventing the overflow of glue in the production process in the prior art and the short service life due to the easy lifting of the FR-4 epoxy board or the flexible printed circuit board and the easy separation of the pads. The problem.

In order to achieve the above object, the solution of the present invention is: a substrate device comprising a heat conductive layer and an FR-4 epoxy board or a flexible printed circuit board having a high power electronic chip , such as high-power LED chips, which are in direct contact with the heat-conducting layer and transfer heat. The FR-4 epoxy board or the flexible printed circuit board has a first copper clad layer and a second copper clad layer respectively disposed on the upper and lower sides, and the first copper clad layer has a printed circuit The second copper clad layer is soldered to the thermally conductive layer.

Further, the second copper clad layer is soldered to the heat conductive layer by solder paste.

Further, the heat conductive layer is an aluminum substrate, a copper substrate or a temperature equalizing plate.

After adopting the above structure, the present invention relates to a substrate device which is directly soldered on a heat conductive layer by using a FR-4 epoxy board or a second copper clad layer on the underside of a flexible printed circuit board, thereby avoiding compared with the prior art. FR-4 epoxy board or flexible printed circuit board is lifted and high-power electronic chip is damaged due to frequent thermal expansion and contraction of the adhesive; and FR-4 epoxy board or flexible printed circuit board is used for peeling resistance The high force feature can solve the problem that the pad is easily peeled off, ensuring the service life of the entire substrate device.

11‧‧‧FR-4 epoxy board or flexible printed circuit board

111‧‧‧ hollow holes

12‧‧‧Wall plate

13‧‧‧LED chip

21‧‧‧ circuit layer

22‧‧‧Mean plate

23‧‧‧ pads

30‧‧‧Substrate unit

31‧‧‧Conducting layer

32‧‧‧FR-4 epoxy board or flexible printed circuit board

321‧‧‧ hollow holes

322‧‧‧First copper foil layer

323‧‧‧Second copper foil layer

33‧‧‧LED chip

1A is a schematic structural view of a FR-4 epoxy board or a flexible printed circuit board in the prior art; FIG. 1B is a schematic structural view of a temperature equalizing board in the prior art; and FIG. 1C is an FR-4 epoxy board or a flexible printed circuit board; FIG. 1D is a schematic view of the prior art in which the LED chip is assembled; FIG. 2A is a schematic structural view of the prior art having a printed circuit layer on the temperature equalizing plate; FIG. 2B is a cross-sectional view of FIG. 2A; 2C is a schematic view of assembling an LED chip in FIG. 2A; FIG. 2D is a cross-sectional view of FIG. 2C; 3 is a schematic structural view of a substrate device; FIG. 3A is a cross-sectional view of FIG. 3; FIG. 4 is a schematic structural view of the assembled LED chip of FIG. 3; FIG. 4A is a FR-4 epoxy board of FIG. 3 and FIG. A cross-sectional view of a specific structure of a flexible printed circuit board.

In order to further explain the technical solution of the present creation, the present invention will be described in detail below through specific embodiments.

As shown in FIG. 3 and FIG. 3A, the present invention relates to a substrate device 30 comprising a heat conductive layer 31 and an FR-4 epoxy board or a flexible printed circuit board 32, the FR-4 epoxy board or the flexible printed circuit board 32 having a hollow a hole 321 for directly contacting a high-power electronic chip such as the LED chip 33 with the heat conductive layer 31, so that heat generated by the LED (Light Emitting Diode) wafer 33 can be directly and quickly transferred to the heat conductive layer 31. In this embodiment, the heat conducting layer 31 is a temperature equalizing plate; of course, the heat conducting layer 31 may also be an aluminum substrate or a copper substrate.

The main improvement of the present invention is that the FR-4 epoxy board or the flexible printed circuit board 32 has a first copper clad layer 322 and a second copper clad layer 323 respectively disposed on the upper and lower sides, the first cover The copper foil layer 322 has a printed circuit thereon, and the second copper clad layer 323 is soldered to the heat conducting layer 31. Specifically, the second copper clad layer 323 is soldered to the heat conductive layer 31 by solder paste, such that the second copper clad layer 323 is fixedly connected to the heat conductive layer 31 by, for example, infrared reflow soldering.

Thus, the present invention relates to a substrate device 30 which is directly soldered to the heat conducting layer 31 by means of an FR-4 epoxy board or a second copper clad layer 323 on the underside of the flexible printed circuit board 32, as compared with the prior art. On the one hand, the present invention avoids the problem that the FR-4 epoxy board or the flexible printed circuit board 32 is lifted and the LED wafer 33 is damaged due to the frequent thermal expansion and contraction of the adhesive; on the other hand, the FR-4 epoxy board is utilized. Or soft The printed circuit board 32 has a high peeling resistance and can solve the problem that the pad is easily peeled off, ensuring the life of the entire substrate device 30.

It should be noted that the FR-4 epoxy board or the flexible printed circuit board 32 of the prior art has a double-sided copper-clad layer structure, which makes the creation of the present invention very convenient, and the core of the present invention is the following The second copper clad layer 323 is used as a solder layer, which produces an unexpected technical effect to those skilled in the art, overcoming the technical bias of the second copper clad layer 323 as a printed circuit. In general, if only A single-sided copper-clad layer is required, and one of the copper-clad layers needs to be removed.

The above embodiments and drawings are not intended to limit the product form and the scope of the present invention. Any changes or modifications made by those skilled in the art should be considered as not departing from the scope of the invention.

30‧‧‧Substrate unit

31‧‧‧Conducting layer

32‧‧‧FR-4 epoxy board or flexible printed circuit board

321‧‧‧ hollow holes

Claims (6)

A substrate device comprising a heat conducting layer and an FR-4 epoxy board having a hollow hole for direct contact of a high power electronic chip with a heat conducting layer for heat transfer; wherein the FR-4 epoxy The plate has a first copper clad layer and a second copper clad layer respectively disposed on the upper and lower sides, the first copper clad layer has a printed circuit thereon, and the second copper clad layer is connected to the heat conducting layer by solder paste bonding on. A substrate device according to claim 1, wherein the heat conductive layer is an aluminum substrate, a copper substrate or a temperature equalizing plate. A substrate device according to claim 1, wherein the high power electronic chip is an LED chip. A substrate device comprising a heat conductive layer and a flexible printed circuit board having a hollow hole for direct contact between a high power electronic chip and a heat conductive layer for heat transfer; wherein the flexible printed circuit board is respectively disposed above and below a first copper clad layer and a second copper clad layer on both sides, the first copper clad layer has a printed circuit, and the second copper clad layer is connected to the heat conducting layer by solder paste bonding. A substrate device according to claim 4, wherein the heat conductive layer is an aluminum substrate, a copper substrate or a temperature equalizing plate. A substrate device according to claim 4, wherein the high power electronic chip is an LED chip.