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TWM409370U - LED heat dissipation device - Google Patents

LED heat dissipation device Download PDF

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Publication number
TWM409370U
TWM409370U TW100204896U TW100204896U TWM409370U TW M409370 U TWM409370 U TW M409370U TW 100204896 U TW100204896 U TW 100204896U TW 100204896 U TW100204896 U TW 100204896U TW M409370 U TWM409370 U TW M409370U
Authority
TW
Taiwan
Prior art keywords
heat
led
heat sink
dissipating
connecting end
Prior art date
Application number
TW100204896U
Other languages
Chinese (zh)
Inventor
Sheng-Huang Lin
guo-sheng Lin
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW100204896U priority Critical patent/TWM409370U/en
Publication of TWM409370U publication Critical patent/TWM409370U/en

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  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M409370 五、新型說明: 【新型所屬之技術領域】M409370 V. New description: [New technology field]

一種LED散熱器’尤指一種可減少工時並降低製造成本的LED 政熱器。 【先前技術】 - 發光二極體(light emitting diode,LED)為一種將電能轉換 • 為光能的固態光源,係利用磊晶成長技術與半導體材料製程製作 ^ 而成。其具有體積小、驅動電壓低、反應速率快、耐震、壽命長 及符合環保等特性。且隨著科技不斷的發展與進步,其發光效率 從1960年代問世以來即持續提升,不僅早已超越了鶴絲燈泡(效 能約為10〜201m/W) ’目前也已凌駕在日光燈管(效能約為 〇 801m/W)之上。由於LED的相關技術不斷的在進展,預估在近 年内將可望達到l〇〇lm/W的水準。由於LED已成為新世代固態光 源最受®目點,目前電子元件越來越要求輕薄短小化,使得 燈/包型發《二極體燈具逐漸取代鶴絲燈泡而成為大量且廣泛應用 的”、、月袁置。且隨著號諸燈、路燈、家用照明燈、車燈、廣告燈 等L漸擴大並普及使用,led成為照明市場的主流趨勢已銳不可 擋。 由於現行LED照明裝置已為廣泛使用,並且外觀及亮度上皆 為設計之首錄件,因高亮度之LED燈泡亦會產生較高之熱量, 同時對於散熱之需求則更為重要。 部分具造型之LED照職置係已將散熱元件-併結合於該 LED照明裝置為—體並且具有造频計,故絲熱元狀外觀及其 、U冓自傳統散熱%件來的複雜,相制該散熱元件之製造方法 3 鰭2複雜’傳統散熱70件如散熱器係以賴方式製造複數散熱 轉之方式所城該·器,又或者贿射透過擠出 2成型-塊狀之散細,前述兩财應·製造結構較 mmm雜之散熱器職法製造。 制n轉錄熱11其本賴可為單—材質透過擠出之方式 衣k,…、法以兩種或兩種以上之材質搭配製造。 細組合錄無雖翻域之方式可以複數種材質 元成’但相對的將耗費大量卫時令製造成本增加,故習 知具有下列缺點: 1. 較複雜結構製造困難; 2. 無法以複數種材質搭配製造; 3·製造成本高。 【新型内容】 。。本創作之主要目的在提供一種具有較佳散熱效果的LED散熱 H ° …、 為達上述目的,本創作係提供一種led散熱器,係包含:一 本體、複數散熱,ϋ>{,所述本體具有—受解延伸—導熱部,該 ,熱部具有複數受接槽;該等散熱縛片具有-連接端及-散熱 端所述連接端與前述受接槽連接,該散熱端係由該連接端向相 反該,熱部之方向延伸所形成,並鮮散熱端共同界定—散熱部。 【實施方式】 本創作之上述目的及其結構與功能上的雜,將依據所附圖 式之較佳實施例予以說明。 請參閱第卜2圖,係為本創作LED散熱器第—實施例立體分 M409370 解及組合圖,所述LED散熱器1係包含:一本體11、複數散熱鰭 片12 ; 所述本體11具有一受熱部111延伸一導熱部112,該導熱部 112具有複數受接槽1121。 該等散熱鰭片12具有一連接端121及一散熱端122,所述連 接端121與前述受接槽112ι連接,該散熱端122係由該連接端121 向相反該導熱部112之方向延伸所形成,並該等散熱端122共同 界定一散熱部123。 本實施例之本體11係為一圓形中空柱體,該受熱部111設於 該本體11 一側,並該導熱部112由該受熱部1U向相反該受熱部 111之方向延伸所構形,並該等受接槽1121環設於該本體11外 部,即该導熱部112外側處,該等散熱鰭片12係呈放射狀設於該 本體11外部。An LED heat sink, especially an LED heat exchanger that reduces man-hours and reduces manufacturing costs. [Prior Art] - A light emitting diode (LED) is a solid-state light source that converts electrical energy into light energy by using epitaxial growth technology and semiconductor material manufacturing. It has the characteristics of small volume, low driving voltage, fast reaction rate, shock resistance, long life and environmental protection. And with the continuous development and advancement of technology, its luminous efficiency has been continuously improved since its inception in the 1960s, not only has it surpassed the crane light bulb (efficiency is about 10~201m/W). At present, it has also dominated the fluorescent tube (performance is about Above 〇 801m/W). As LED related technologies continue to progress, it is estimated that it will reach the level of l〇〇lm/W in recent years. Since LED has become the most important point of the new generation of solid-state light sources, the current electronic components are increasingly demanding light and thin, making the lamp/package type "diode lamps gradually replace the crane bulbs and become a large number and widely used". And the month Yuan set. And with the number of lights, street lights, home lighting, car lights, advertising lights, etc. L gradually expanded and popularized, led to become the mainstream trend of the lighting market has been unstoppable. Because the current LED lighting device has been Widely used, and the appearance and brightness are the first record of the design, because the high-intensity LED bulb will also generate higher heat, and the need for heat dissipation is more important. Some of the shaped LED photo-services have been The heat dissipating component is combined with the LED lighting device and has a frequency generator, so that the thermal appearance of the wire and the U 冓 are complicated by the conventional heat dissipating component, and the manufacturing method of the heat dissipating component 3 fin 2 complex 'traditional heat sink 70 pieces such as radiators to make a plurality of heat transfer methods to the way of the city, or bribe through the extrusion 2 molding - block of the fine, the aforementioned two financial should · manufacturing structure Mm m miscellaneous radiator manufacturing method. The production of n transcription heat 11 can be a single material through the way of extrusion k, ..., the method is made of two or more materials. The method of turning over the domain can be a plurality of materials, but the relative cost will increase the manufacturing cost. Therefore, the conventional disadvantages are as follows: 1. It is difficult to manufacture a complicated structure; 2. It cannot be manufactured with a plurality of materials; ·High manufacturing cost. [New content] The main purpose of this creation is to provide a LED heat dissipation H ° with better heat dissipation effect. To achieve the above purpose, the present invention provides a LED heat sink, which comprises: an ontology a plurality of heat dissipation, ϋ>{, the body has a -extended extension-heat transfer portion, wherein the heat portion has a plurality of receiving grooves; the heat dissipation tabs have a connection end and a heat dissipation end, the connection end and the aforementioned The slot is connected, the heat radiating end is formed by the connecting end extending opposite to the direction of the hot portion, and the fresh heat radiating end jointly defines a heat dissipating portion. [Embodiment] The above object of the creation and its structure and function are The description will be made in accordance with the preferred embodiment of the drawings. Please refer to FIG. 2, which is a schematic diagram of a three-dimensional sub-division M409370 of the LED heat sink of the present invention, and the LED heat sink 1 includes The main body 11 has a heat receiving portion 112 extending from a heat conducting portion 112, and the heat conducting portion 112 has a plurality of receiving grooves 1121. The heat dissipating fins 12 have a connecting end 121 and a The heat-dissipating end 122 is connected to the receiving groove 1121, and the heat-dissipating end 122 is formed by extending the connecting end 121 in the opposite direction of the heat conducting portion 112, and the heat-dissipating ends 122 jointly define a heat-dissipating portion The main body 11 of the embodiment is a circular hollow cylinder. The heat receiving portion 111 is disposed on the side of the body 11 , and the heat conducting portion 112 is extended from the heat receiving portion 1U in the direction opposite to the heat receiving portion 111 . And the receiving fins 1121 are disposed outside the body 11 , that is, outside the heat conducting portion 112 , and the heat dissipating fins 12 are radially disposed outside the body 11 .

所述本體η與該散熱趙片12係可為雜材質或異種材質其 中任’本實酬細異種㈣作為說明,但柯以為限,本實 施例之本體u係選用導鮮較佳之銅材f,該散熱鰭片12係選 用散^效雜佳之鋪質條糊;當齡可树丨丨及散_ 12 ^選用銅材質或皆選用鋁材質。 睛翏閱第3、4 縱及έ且人 W" w手…糾乍LED散熱器第二實施例立體分 解及組S圖,如圖所示,本實施例部分結構係為與前述第一實施 例部为結構相同故在此將不再^ 、 个丹為述,惟本實施例盥前述篦一眚祐 例之不同錢林實關之讀 L ㈣ 係為一基座,該等散熱鰭片12 係與林體11呈垂直,接•本體η之-側。 凊參閱第5、6、7、8、9、1〇圖总& 圖,係為本創作LED散熱器第 5 M409370 二、四、五實施例之立體圖及散熱鰭片正視圖,如圖所示,所述 散熱鰭片12之連接端121係呈連續或分段之凹、凸單元,所述: 單元係呈(L狀、凸塊狀、階梯狀)及溝縫及破口及割邊(平整切 (如第9圖所示)或不規則狀口(如第8圖所示)、鋸齒狀切口(如第 ίο圖所不))其中任一,用以使該連接端121得緊密牢固與該本體 11之該等受接槽1121結合。 【圖式簡單說明】 第1圖係為本創作led散熱器第一實施例立體分解圖; 第2圖係為本創作led散熱器第一實施例立體組合圖; 弟3圖係為本創作led散熱器第二實施例立體分解圖; 第4圖係為本創作LE:D散熱器第二實施例立體組合圖; 第5圖係為本創作led散熱第二貫施例之立體圖; 第6圖係為本創作LE:D散熱器第四實施例之立體圖; 第7圖係為本創作led散熱器第五實施例之立體圖; 第8圖係為本創作LE:D散熱器之散熱鰭片正視圖; 第9圖係為本創作LEI)散熱器之散熱鰭片正視圖; 第1〇圖係為本創作LE1D散熱器之散熱鰭片正視圖。 【主要元件符號說明】 散熱器1 本體11 受熱部111 導熱部112 i接·槽1121 散熱鳍片12 M409370 連接端121 散熱端122 散熱部123The body η and the heat dissipating film 12 may be made of a miscellaneous material or a dissimilar material, and any of the refinements (four) are described. However, the body u of the embodiment is a copper material f which is preferably fresh. The heat-dissipating fins 12 are made of loosely-packed pastes; the ages can be smashed and scattered _ 12 ^ using copper or aluminum. The third embodiment of the embodiment of the present invention is the same as the first embodiment described above. The example is the same structure, so it will not be described here, but the description of the other is the same as the above-mentioned 钱一眚 例 钱 钱 钱 钱 钱 钱 ( ( ( ( ( ( ( ( ( ( ( ( , , , , , , The 12 series is perpendicular to the forest body 11 and is connected to the side of the body η.凊 Refer to Figures 5, 6, 7, 8, 9, and 1 for the total & The connecting end 121 of the heat dissipating fin 12 is a continuous or segmented concave and convex unit, and the unit is in the form of (L-shaped, convex-shaped, stepped) and grooved and broken and cut-edge. (either flat (as shown in Figure 9) or irregularly shaped mouth (as shown in Figure 8), serrated cut (as shown in Figure 355), to make the connection end 121 tight It is firmly coupled with the receiving grooves 1121 of the body 11. [Simple description of the figure] The first figure is a three-dimensional exploded view of the first embodiment of the LED heatsink; the second figure is a three-dimensional combination of the first embodiment of the LED heatsink; The second embodiment of the heat sink is an exploded perspective view; the fourth figure is a three-dimensional combination diagram of the second embodiment of the LE:D heat sink; the fifth figure is a perspective view of the second embodiment of the LED heat dissipation; The perspective view of the fourth embodiment of the LE:D heat sink is the first embodiment; the seventh figure is the perspective view of the fifth embodiment of the LED heat sink; the eighth figure is the heat sink fin of the LE:D heat sink. Fig. 9 is a front view of the heat sink fin of the created LEI) heat sink; the first drawing is a front view of the heat sink fin of the created LE1D heat sink. [Main component symbol description] Heatsink 1 Body 11 Heated part 111 Heat transfer part 112 i Connection groove 1121 Heat sink fin 12 M409370 Connection end 121 Heat sink end 122 Heat sink 123

Claims (1)

M4U9370 六、申請專利範圍: 1. 種led散熱器,係包含: 複有一受熱部延伸一導熱部’該導熱部具有複數受接槽; 散厂日片該等散熱則具有—連接端及—散熱端,所述連 端與别述X接槽連接,該散熱端係由該連接端向相反該導熱 部之方向延伸所形成,並該等散熱端共同界定—散熱部。… 2. ,申π專她圍第丨彻述之LED散熱器,其巾職本體與該 政熱鰭片係可為同種材質或異種材質其中任一。 3·如申請專利麵第i項所述之⑽散熱器,其中所述連接端呈 連續或分段之凹、凸單元及溝縫及破口及割邊其中任一。 ’如申明專利範圍第3項所述之led散熱器,其中所述凸單元係 為L型狀及凸塊狀及梯型狀其中任一。 5.如申請專概圍第3彻叙LED散㈣,其巾騎割邊係為 平整切或不規則狀口、鑛齒狀切口其中任一。 6·如申請專利細第2項所叙⑽散熱器,其帽述本體及散 熱籍片係為紹材質及銅材質其中任一。M4U9370 VI. Patent application scope: 1. A type of LED heat sink, comprising: a heat-receiving part extending a heat-conducting part', the heat-conducting part has a plurality of receiving grooves; and the heat-dissipating piece of the factory has a connection end and a heat dissipation The connecting end is connected to the X slot, and the heat radiating end is formed by extending the connecting end in a direction opposite to the heat conducting portion, and the heat radiating ends jointly define a heat dissipating portion. ... 2. Shen π specializes in her LED heatsink, which can be used for the same kind of material or different materials. 3. The heat sink according to item (i) of claim i, wherein the connecting end is a continuous or segmented concave, convex unit and groove slit, and any of the broken and cut edges. The led heat sink according to claim 3, wherein the convex unit is any of an L-shaped shape, a convex shape, and a trapezoidal shape. 5. If you apply for the third round of the LED scatter (four), the towel riding edge is a flat cut or irregular mouth, mineral toothed cut. 6. If the radiator is described in the second paragraph of the patent application, the cap body and the heat-dissipating film are either material or copper material.
TW100204896U 2011-03-18 2011-03-18 LED heat dissipation device TWM409370U (en)

Priority Applications (1)

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TW100204896U TWM409370U (en) 2011-03-18 2011-03-18 LED heat dissipation device

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Application Number Priority Date Filing Date Title
TW100204896U TWM409370U (en) 2011-03-18 2011-03-18 LED heat dissipation device

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TWM409370U true TWM409370U (en) 2011-08-11

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103578571A (en) * 2012-08-01 2014-02-12 奇鋐科技股份有限公司 Heat sink and manufacturing method thereof
TWI507860B (en) * 2012-08-01 2015-11-11 Asia Vital Components Co Ltd Heat sink structure and manufacturing method thereof
TWI512440B (en) * 2012-08-01 2015-12-11 Asia Vital Components Co Ltd Heat-dissipating device and method for manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103578571A (en) * 2012-08-01 2014-02-12 奇鋐科技股份有限公司 Heat sink and manufacturing method thereof
TWI507860B (en) * 2012-08-01 2015-11-11 Asia Vital Components Co Ltd Heat sink structure and manufacturing method thereof
TWI512440B (en) * 2012-08-01 2015-12-11 Asia Vital Components Co Ltd Heat-dissipating device and method for manufacturing the same
US9550226B2 (en) 2012-08-01 2017-01-24 Asia Vital Components Co., Ltd. Heat-dissipating device and method for manufacturing the same
US9851158B2 (en) 2012-08-01 2017-12-26 Asia Vital Components Co., Ltd. Heat sink structure

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