TWM494476U - Heat dissipation device with electromagnetic wave elimination function - Google Patents

Description

Heat sink with electromagnetic wave elimination

The present invention relates to a heat sink, and more particularly to a heat sink with electromagnetic wave elimination.

With the advancement of technology, the computing performance of notebook computers, tablet computers and smart handheld phones has gradually increased, but with the increase of waste heat generated during the operation of the above electronic devices, if the problem of waste heat is not addressed The waste heat will gradually accumulate in the electronic device along with the running time of the electronic device, causing the electronic device to fail to operate normally, causing a problem of thermal crash, or even a problem of component burnout.

In addition, due to the fact that today's electronic devices are light and thin, the space in the electronic device is limited, and the assembly position of each component in the electronic device is very similar, in addition to affecting the heat dissipation of the electronic device, The electromagnetic wave generated by the operation of one of the components affects another component disposed adjacent thereto, which is disadvantageous for the operation of the electronic device. However, although some manufacturers have proposed an embodiment in which a conductive foam is assembled on a heat sink, the electromagnetic wave that causes the operation of the electronic device is derived from the conductive foam, but the above embodiment still has heat dissipation. Poor question.

The main purpose of this creation is to solve the problem of poor heat dissipation in the conventional implementation. To achieve the above object, the present invention provides a heat dissipating device with electromagnetic wave elimination, the heat dissipating device comprising a heat dissipating body, an insulating layer, a heat conducting layer and a conductive foam. The heat dissipating body has a first surface and a second surface. The insulating layer is disposed at a local position where the first surface is not provided with the insulating layer. The conductive foam is disposed on the heat dissipating body.

In one embodiment, the insulating layer is disposed at a local location on the first surface by an adhesive means.

In one embodiment, the insulating layer includes a first insulating region and a second insulating region, and the first surface includes a first portion between the first insulating region and the second insulating region. And a heat exchange area and a second heat exchange area disposed on a side of the first insulation area away from the first heat exchange area.

In one embodiment, the conductive foam is disposed on the first surface and has a pair of first portions disposed on the first heat exchange region and a second portion disposed on the second heat exchange region.

In an embodiment, the heat conducting layer is disposed in the first heat exchange region.

In an embodiment, the heat conducting layer is disposed in the first heat exchange region by the adhesive means.

In an embodiment, the heat dissipation body can be a copper foil or an aluminum foil.

In one embodiment, the thermally conductive layer can be a graphene or a graphite.

In one embodiment, the thermal conductivity of the thermally conductive layer is greater than the thermal conductivity of the heat dissipating body.

Through the above structure of the creation, the following features are compared with the conventional ones: 1. The heat dissipation layer absorbs the waste heat accumulated on the heat dissipation body, and disperses the waste heat with better heat dissipation efficiency, so that the heat dissipation body is Waste heat can be specifically dissipated. 2. The present invention is provided with the conductive foam on the heat dissipating body to receive electromagnetic waves generated during the operation of the electronic device by using the conductive foam, and specifically avoids occurrence of abnormal or damaged electronic devices caused by excessive electromagnetic waves.

The detailed description and technical content of this creation are as follows:

Referring to FIG. 1 and FIG. 2, as shown in the figure, the heat dissipation device with electromagnetic wave elimination can be applied to an electronic product to provide waste heat generated during the operation of the electronic product during the operation. And electromagnetic waves, and the electronic product can be a notebook computer, a tablet computer or a smart handheld phone. The heat dissipating device 1 can be designed as a piece of a structure as shown in the accompanying drawings. The heat dissipating device 1 includes a heat dissipating body 11 , an insulating layer 12 , a heat conducting layer 13 , and a conductive foam 14 . 11 may be made of a metal material through at least one mechanical processing, and includes a first surface 111 and a second surface 112. More specifically, the first surface 111 may be a substantial front surface of the heat dissipation body 11 , and the second surface 112 may be a substantial back surface of the heat dissipation body 11 . The insulating layer 12 is disposed at a local position of the first surface 111, and the heat conducting layer 13 is disposed at a local position where the first surface 111 is not provided with the insulating layer 12, that is, the heat is thermally conductive. The layer 13 is disposed separately from the insulating layer 12, and the conductive foam 14 is disposed on the heat dissipation body 1 and connected to an electrical connection line (not shown), the electrical connection line and the conductive The other end of the foam 14 extends to the outside of the electronic device. During the implementation of the creative operation, the conductive foam 14 receives the electromagnetic wave generated during the operation of the electronic device, and further leads the electromagnetic wave to the electronic device. Avoid excessive electromagnetic waves that may cause abnormalities in the components of the electronic device. More specifically, in an embodiment, the insulating layer 12 is disposed at a local position on the first surface by an adhesive means. The adhesive means may be an adhesive layer bonded to the insulating layer 12 by an external adhesive. The first surface 111 of the heat dissipation body 11 or the side of the insulating layer 12 is made viscous to provide adhesion to the heat dissipation body 11. Furthermore, the insulating layer 12 further includes a first insulating region 121 and a second insulating region 122, and the first surface 111 includes a first insulating region 121 and the second insulating region 122. A first heat exchange region 113 is disposed between the first heat exchange region 113 and a second heat exchange region 114 disposed on a side of the first insulation region 121 away from the first heat exchange region 113. Furthermore, the conductive foam 14 is further disposed on the first surface 111, and the conductive foam 14 has a pair of first portions 141 disposed on the first heat exchange region 113 and a pair of second heats. The second portion 142 of the swap area 114 is provided. In addition, the heat conductive layer 12 may be disposed in the first heat exchange region 113, and the heat conductive layer 12 may also be disposed in the first heat exchange region 113 by using the adhesive means, and the adhesive means Please refer to the above for the description, which will not be repeated here. Moreover, the present invention further makes the thermal conductivity of the heat conducting layer 13 larger than the thermal conductivity of the heat dissipating body 11, and can more effectively absorb the waste heat on the heat dissipating body 11 and exchange heat with the outside air. However, in an embodiment, the heat dissipation body 11 can be a copper foil or an aluminum foil, and the heat conductive layer 13 can be a graphene or a graphite.

In summary, the heat dissipating device with electromagnetic wave elimination comprises a heat dissipating body, an insulating layer, a heat conducting layer and a conductive foam. The heat dissipating body has a first surface and a second surface. The insulating layer is disposed at a local position of the first surface, and the heat conducting layer is disposed at a local position where the first surface is not provided with the insulating layer. The foam is disposed on the heat dissipation body. Moreover, the creation system further makes the thermal conductivity of the heat conducting layer larger than the thermal conductivity of the heat dissipating body, thereby making the heat dissipating device of the present invention not only provide the function of eliminating electromagnetic waves, but also specifically improving the problem of poor heat dissipating effect of the conventional heat dissipating device. .

The above description has been made in detail, but the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the creation of the creation, that is, the equality of the patent application scope according to the present creation. Changes and modifications are still covered by the patents of this creation.

1‧‧‧heating device
11‧‧‧Solution body
111‧‧‧ first surface
112‧‧‧ second surface
113‧‧‧First heat exchange area
114‧‧‧Second heat exchange area
12‧‧‧Insulation
121‧‧‧First insulation area
122‧‧‧Second insulation area
13‧‧‧Conducting layer
14‧‧‧conductive foam
141‧‧‧ first part
142‧‧‧ second part

FIG. 1 is a schematic view showing a first surface planar structure of an embodiment of a heat dissipating device with electromagnetic wave elimination. FIG. 2 is a schematic diagram showing the second surface planar structure of an embodiment of the heat sink with electromagnetic wave elimination.

1‧‧‧heating device

11‧‧‧Solution body

111‧‧‧ first surface

113‧‧‧First heat exchange area

114‧‧‧Second heat exchange area

12‧‧‧Insulation

121‧‧‧First insulation area

122‧‧‧Second insulation area

13‧‧‧Conducting layer

14‧‧‧conductive foam

141‧‧‧ first part

142‧‧‧ second part

Claims (9)

A heat dissipating device with electromagnetic wave elimination, comprising: a heat dissipating body having a first surface and a second surface; an insulating layer disposed at a local position of the first surface; a heat conducting layer disposed on the first surface A partial position of the insulating layer is not provided; and a conductive foam is disposed on the heat dissipation body. The heat dissipation device with electromagnetic wave elimination according to claim 1, wherein the insulating layer is disposed at a local position of the first surface by an adhesive means. The heat dissipation device with electromagnetic wave elimination according to claim 2, wherein the insulating layer comprises a first insulating region and a second insulating region disposed separately, and the first surface comprises a first insulating region and the first insulating region a first heat exchange region between the second insulating regions and a second heat exchange region disposed on a side of the first insulating region away from the first heat exchange region. The heat dissipation device with electromagnetic wave elimination according to claim 3, wherein the conductive foam is disposed on the first surface, and has a pair of first portions to be disposed in the first heat exchange region and a pair of second heats The second part of the exchange area setting. The heat dissipation device with electromagnetic wave elimination according to claim 3, wherein the heat conduction layer is disposed in the first heat exchange region. The heat dissipation device with electromagnetic wave elimination according to claim 5, wherein the heat conductive layer is adhered by the adhesive layer The means is disposed in the first heat exchange area. The heat dissipation device with electromagnetic wave elimination according to claim 1, wherein the heat dissipation body is a copper foil or an aluminum foil. The heat dissipation device with electromagnetic wave elimination according to claim 1, wherein the heat conduction layer is a graphene or a graphite. The heat dissipation device with electromagnetic wave elimination according to any one of claims 1 to 8, wherein a thermal conductivity of the heat conductive layer is greater than a thermal conductivity of the heat dissipation body.