TW201440627A - Portable computer apparatus - Google Patents
Portable computer apparatus Download PDFInfo
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- TW201440627A TW201440627A TW102114878A TW102114878A TW201440627A TW 201440627 A TW201440627 A TW 201440627A TW 102114878 A TW102114878 A TW 102114878A TW 102114878 A TW102114878 A TW 102114878A TW 201440627 A TW201440627 A TW 201440627A
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Abstract
Description
本發明關於一種可攜式電腦設備,尤指一種使用隔熱膜以隔絕或反射發熱元件傳遞至裝置外殼上之熱能的可攜式電腦設備。 The present invention relates to a portable computer device, and more particularly to a portable computer device that uses a thermal barrier film to isolate or reflect the thermal energy transmitted by the heat generating component to the device housing.
隨著可攜式電子科技的進步,可攜式電腦設備(如筆記型電腦等)所能提供的功能越來越複雜及強大,這同時也代表了其內部電子元件(如中央處理器、硬碟、主機板等)之資料處理速度必須越來越快,以使其可應付龐大的系統作業工作量,但這也代表了其內部電子元件在運作過程中所產生的熱能也會不斷的向上飆昇,因此散熱問題便成為業者設計可攜式電腦設備時所必須考慮的一項重要課題。 With the advancement of portable electronic technology, the functions that portable computer devices (such as notebook computers) can provide are more and more complex and powerful, which also represents its internal electronic components (such as central processing unit, hard The data processing speed of the disc, motherboard, etc. must be faster and faster, so that it can cope with the huge system workload, but it also means that the heat generated by the internal electronic components will continue to rise. Soaring, the heat dissipation problem has become an important issue that must be considered when designing portable computer equipment.
就筆記型電腦而言,由於其內部電子元件所產生的熱能會快速累積,因此散熱效能的優劣對筆記型電腦的整體表現著實有著關鍵性的影響。一般而言,在筆記型電腦內需要散熱的電子元件上,如中央處理器、硬碟等,皆會使用風扇與散熱片之組合來達到將電子元件運作時所產生之熱能傳遞至筆記型電腦之裝置外殼排出的效果。然而,在筆記型電腦經使用過一段時間之後,熱能往往會持續累積在筆記型電腦之裝置外殼上而形成熱區,從而產生筆記型電腦之裝置外殼局部表面溫度過高的問題。 In the case of a notebook computer, the heat generated by its internal electronic components can accumulate rapidly, so the heat dissipation performance has a crucial impact on the overall performance of the notebook computer. Generally speaking, in electronic components that need to dissipate heat in a notebook computer, such as a central processing unit, a hard disk, etc., a combination of a fan and a heat sink is used to transfer the heat generated by the operation of the electronic component to the notebook computer. The effect of the device housing discharge. However, after the notebook computer has been used for a period of time, the heat energy tends to accumulate on the device casing of the notebook computer to form a hot zone, thereby causing a problem that the surface temperature of the device casing of the notebook computer is too high.
本發明之目的之一在於提供一種使用隔熱膜以隔絕或反射發熱元件傳遞至裝置外殼上之熱能的可攜式電腦設備,以解決上述之問題。 One of the objects of the present invention is to provide a portable computer device that uses a heat insulating film to insulate or reflect heat energy transmitted from a heat generating component to a device casing to solve the above problems.
本發明之申請專利範圍係揭露一種可攜式電腦設備,其包含一裝置外殼、一電腦裝置,以及一隔熱膜。該電腦裝置設置於該裝置外殼內且具 有至少一發熱元件。該隔熱膜設置於該裝置外殼對應該至少一發熱元件之一內表面上。 The patent application scope of the present invention discloses a portable computer device comprising a device housing, a computer device, and a thermal insulation film. The computer device is disposed in the device casing and has There is at least one heating element. The heat shielding film is disposed on an inner surface of the device housing corresponding to one of the at least one heat generating component.
本發明之申請專利範圍另揭露該隔熱膜係由高熱阻材質所組成。 The patent application scope of the present invention further discloses that the thermal insulation film is composed of a high thermal resistance material.
本發明之申請專利範圍另揭露該隔熱膜係設置於對應該至少一發熱元件之一熱傳遞路徑之位置上以反射或隔絕該至少一發熱元件傳遞至該裝置外殼之熱能。 The patent application scope of the present invention further discloses that the heat insulating film is disposed at a position corresponding to a heat transfer path of at least one heat generating component to reflect or isolate heat energy transmitted from the at least one heat generating component to the device casing.
本發明之申請專利範圍另揭露該隔熱膜係設置在正對於該至少一發熱元件之位置上。 The scope of the patent application of the present invention further discloses that the thermal insulation film is disposed at a position facing the at least one heat generating component.
本發明之申請專利範圍另揭露該裝置外殼具有一底板,該隔熱膜係設置於該底板之該內表面上。 The scope of the patent application of the present invention further discloses that the device casing has a bottom plate, and the heat insulation film is disposed on the inner surface of the bottom plate.
本發明之申請專利範圍另揭露該可攜式電腦設備另包含一導熱膜,其設置於該隔熱膜上或該隔熱膜與該裝置外殼之間,用來使該至少一發熱元件所傳來之熱能均勻地擴散。 The portable computer device further includes a heat conductive film disposed on the heat insulating film or between the heat insulating film and the device casing for transmitting the at least one heat generating component. The heat coming from it spreads evenly.
本發明之申請專利範圍另揭露該導熱膜係由金屬材質所組成。 The patent application scope of the present invention further discloses that the heat conductive film is composed of a metal material.
本發明之申請專利範圍另揭露該至少一發熱元件包含一主機板、一硬碟以及一馬達之至少其中之一。 The patent application scope of the present invention further discloses that the at least one heat generating component comprises at least one of a motherboard, a hard disk, and a motor.
綜上所述,本發明係採用將隔熱膜設置於裝置外殼對應發熱元件之內表面上的設計,以在可攜式電腦設備內之發熱元件傳遞其所產生之熱能至裝置外殼之內表面上時,透過隔熱膜之隔熱特性來產生反射或隔絕熱能的功效,藉以改善熱能持續累積在可攜式電腦設備之裝置外殼上的情況。如此一來,本發明即可確實地避免局部熱區的產生以及降低裝置外殼之表面溫度,從而有效地解決先前技術中所提及之可攜式電腦設備之裝置外殼局部表面溫度過高的問題。 In summary, the present invention adopts a design in which a heat insulating film is disposed on an inner surface of a device casing corresponding to a heat generating component, so that heat generated by the heat generating component in the portable computer device transmits the heat energy generated to the inner surface of the device casing. In the above, the heat insulating property of the heat insulating film is used to generate the effect of reflecting or isolating the heat energy, thereby improving the heat energy continuously accumulated on the device casing of the portable computer device. In this way, the present invention can surely avoid the generation of the local hot zone and reduce the surface temperature of the device casing, thereby effectively solving the problem of excessive surface temperature of the device casing of the portable computer device mentioned in the prior art. .
關於本發明之優點與精神可以藉由以下的實施方式及所附圖式得到進一步的瞭解。 The advantages and spirit of the present invention will be further understood from the following embodiments and the accompanying drawings.
10‧‧‧可攜式電腦設備 10‧‧‧Portable computer equipment
12‧‧‧裝置外殼 12‧‧‧ device housing
14‧‧‧電腦裝置 14‧‧‧Computer equipment
16‧‧‧隔熱膜 16‧‧‧Insulation film
18‧‧‧發熱元件 18‧‧‧heating components
19‧‧‧內表面 19‧‧‧ inner surface
20‧‧‧底板 20‧‧‧floor
22‧‧‧導熱膜 22‧‧‧ Thermal film
P‧‧‧熱傳導路徑 P‧‧‧heat conduction path
第1圖為根據本發明之一實施例所提出之可攜式電腦設備之部分剖面簡示圖。 1 is a partial cross-sectional, simplified view of a portable computer device in accordance with an embodiment of the present invention.
第2圖為第1圖之裝置外殼之部分立體示意圖。 Figure 2 is a partial perspective view of the device housing of Figure 1.
請參閱第1圖,其為根據本發明之一實施例所提出之一可攜式電腦設備10之部分剖面簡示圖,在此實施例中,可攜式電腦設備10係可較佳地為一筆記型電腦,但不受此限,其亦可為其他常見之可攜式電腦裝置,如平板電腦等。如第1圖所示,可攜式電腦設備10包含一裝置外殼12、一電腦裝置16,以及一隔熱膜18。裝置外殼12係可採用常見應用於一般可攜式電腦上的機殼設計,其相關結構設計常見於先前技術中,故於此不再贅述。電腦裝置14係設置於裝置外殼12內且具有至少一發熱元件18(於第1圖中僅顯示一個,但不受此限),如主機板、硬碟、馬達或其組合等。 Please refer to FIG. 1 , which is a partial cross-sectional view of a portable computer device 10 according to an embodiment of the present invention. In this embodiment, the portable computer device 10 is preferably A notebook computer, but not limited to this, it can also be other common portable computer devices, such as tablets. As shown in FIG. 1, the portable computer device 10 includes a device housing 12, a computer device 16, and a thermal insulation film 18. The device casing 12 can be designed to be commonly used in a general portable computer, and its related structural design is common in the prior art, and thus will not be described herein. The computer device 14 is disposed in the device housing 12 and has at least one heat generating component 18 (only one shown in FIG. 1 but not limited thereto), such as a motherboard, a hard disk, a motor, or a combination thereof.
接下來,請參閱第1圖以及第2圖,第2圖為第1圖之裝置外殼12之部分立體示意圖,由第1圖以及第2圖可知,在此實施例中,裝置外殼12係可具有一底板20,而隔熱膜16則是較佳地設置在裝置外殼12之底板20對應發熱元件18之一內表面19上,更詳細地說,隔熱膜16係可較佳地設置於對應發熱元件18之一熱傳遞路徑P之位置上而正對於發熱元件18(如第1圖所示)以反射或隔絕發熱元件18傳遞至裝置外殼12之熱能,但不受此限,也就是說,只要是將隔熱膜設置在裝置外殼對應發熱元件之內表面上之設計,其均可為本發明所採用之。另外,隔熱膜16係可由高熱阻材質所組成,例如由聚酯薄膜與高純度金屬塗層(如銀、鎳、鋁、銅等)所組成或是由聚酯薄膜與Silver 20HC塗層所組成等,其相關隔熱原理說明及其設計係常見於先前技術中,故於此不再贅述。需注意的是,隔熱膜16之隔熱面積係可根據底板20上因熱能持續累積所形成之熱區或熱點之面積而定。 Next, please refer to FIG. 1 and FIG. 2, and FIG. 2 is a partial perspective view of the device casing 12 of FIG. 1. As can be seen from FIG. 1 and FIG. 2, in this embodiment, the device casing 12 is There is a bottom plate 20, and the heat insulating film 16 is preferably disposed on the inner surface 19 of the bottom plate 20 of the device casing 12 corresponding to the heat generating component 18. More specifically, the heat insulating film 16 is preferably disposed on Corresponding to the position of one of the heat transfer paths P of the heat generating component 18, and for the heat generating component 18 (shown in FIG. 1) to reflect or isolate the heat energy transmitted from the heat generating component 18 to the device housing 12, but not limited thereto, that is, It is said that as long as the heat insulating film is provided on the inner surface of the device casing corresponding to the heat generating component, it can be used in the present invention. In addition, the thermal insulation film 16 may be composed of a high thermal resistance material, such as a polyester film and a high-purity metal coating (such as silver, nickel, aluminum, copper, etc.) or a polyester film and a Silver 20HC coating. Composition, etc., the description of the related thermal insulation principle and its design are common in the prior art, and therefore will not be described here. It should be noted that the thermal insulation area of the thermal insulation film 16 may be determined according to the area of the hot zone or hot spot formed on the bottom plate 20 due to the continuous accumulation of thermal energy.
如此一來,如第1圖所示,當可攜式電腦設備10內之發熱元件 18運作一段時間後沿熱傳遞路徑P傳遞熱能(例如透過可攜式電腦設備10內之散熱裝置(如風扇與散熱片之組合等)之散熱引導設計等)至裝置外殼12之底板20之內表面19上時,隔熱膜22就可以利用本身之隔熱特性而反射或是隔絕發熱元件18所傳來之熱能,藉以防止熱能持續累積在裝置外殼12之底板20上的情況發生,如此即可避免局部熱區的產生以及降低裝置外殼12之底板20的表面溫度,從而解決先前技術中所提及之可攜式電腦設備之裝置外殼局部表面溫度過高的問題。 In this way, as shown in FIG. 1, when the heating element in the portable computer device 10 After a period of operation, the heat transfer along the heat transfer path P (for example, through a heat sink device (such as a combination of a fan and a heat sink) in the portable computer device 10, etc.) to the bottom plate 20 of the device casing 12 On the surface 19, the thermal insulation film 22 can reflect or isolate the thermal energy from the heating element 18 by its own thermal insulation property, thereby preventing the thermal energy from continuously accumulating on the bottom plate 20 of the device casing 12, thus The generation of the local hot zone and the surface temperature of the bottom plate 20 of the device casing 12 can be avoided, thereby solving the problem of excessive surface temperature of the device casing of the portable computer device mentioned in the prior art.
值得一提的是,如第1圖所示,在此實施例中,可攜式電腦設備10可另包含一導熱膜22,導熱膜22係可較佳地由金屬材質(如銅、鋁等)所組成且設置於隔熱膜16與裝置外殼12之底板20之間,藉此,當發熱元件18傳遞熱能至裝置外殼12之底板20之內表面19上時,導熱膜22即可利用本身之導熱特性以使得發熱元件18所傳來之熱能可以均勻地擴散於裝置外殼12之底板20之內表面19上,進而發揮均溫作用。如此一來,透過導熱膜22之均勻導熱設計以及上述隔熱膜16之熱能反射或隔絕設計,本發明即可更進一步地消除在裝置外殼12之底板20上所產生的熱能局部累積現象。此外,導熱膜22之配置係可不限於如第1圖所示之配置,其亦可改採用直接貼附於隔熱膜22上之設計以取代如第1圖所示之貼附於隔熱膜16與底板20之間的設計,至於採用何種配置,其端視可攜式電腦設備10之實際應用而定。 It is to be noted that, as shown in FIG. 1 , in this embodiment, the portable computer device 10 can further include a heat conductive film 22 , which is preferably made of a metal material (such as copper, aluminum, etc.). And consisting of being disposed between the heat insulating film 16 and the bottom plate 20 of the device casing 12, whereby when the heat generating component 18 transfers thermal energy to the inner surface 19 of the bottom plate 20 of the device casing 12, the heat conductive film 22 can utilize itself. The thermal conductivity is such that the thermal energy transmitted from the heating element 18 can be uniformly diffused on the inner surface 19 of the bottom plate 20 of the device housing 12 to provide a temperature equalization effect. In this way, the present invention can further eliminate the local accumulation of thermal energy generated on the bottom plate 20 of the device casing 12 through the uniform heat conduction design of the heat conductive film 22 and the thermal energy reflection or isolation design of the heat insulation film 16. In addition, the arrangement of the heat conductive film 22 is not limited to the configuration as shown in FIG. 1 , and the design directly attached to the heat insulation film 22 may be used instead of the heat insulation film as shown in FIG. 1 . The design between the 16 and the backplane 20 depends on the configuration of the portable computer device 10 depending on the configuration.
綜上所述,相較於先前技術,本發明係採用將隔熱膜設置於裝置外殼對應發熱元件之內表面上的設計,以在可攜式電腦設備內之發熱元件傳遞其所產生之熱能至裝置外殼之內表面上時,透過隔熱膜之隔熱特性來產生反射或隔絕熱能的功效,藉以改善熱能持續累積在可攜式電腦設備之裝置外殼上的情況。如此一來,本發明即可確實地避免局部熱區的產生以及降低裝置外殼之表面溫度,從而有效地解決先前技術中所提及之可攜式電腦設備之裝置外殼局部表面溫度過高的問題。 In summary, compared with the prior art, the present invention adopts a design in which a heat insulating film is disposed on the inner surface of the device casing corresponding to the heat generating component, so as to transmit the heat energy generated by the heat generating component in the portable computer device. When it is placed on the inner surface of the device casing, the heat insulating property of the heat insulating film is utilized to generate the effect of reflecting or isolating the heat energy, thereby improving the accumulation of heat energy on the device casing of the portable computer device. In this way, the present invention can surely avoid the generation of the local hot zone and reduce the surface temperature of the device casing, thereby effectively solving the problem of excessive surface temperature of the device casing of the portable computer device mentioned in the prior art. .
10‧‧‧可攜式電腦設備 10‧‧‧Portable computer equipment
12‧‧‧裝置外殼 12‧‧‧ device housing
14‧‧‧電腦裝置 14‧‧‧Computer equipment
16‧‧‧隔熱膜 16‧‧‧Insulation film
18‧‧‧發熱元件 18‧‧‧heating components
19‧‧‧內表面 19‧‧‧ inner surface
20‧‧‧底板 20‧‧‧floor
22‧‧‧導熱膜 22‧‧‧ Thermal film
P‧‧‧熱傳導路徑 P‧‧‧heat conduction path
Claims (10)
Applications Claiming Priority (1)
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CN201310123424.2A CN104102277A (en) | 2013-04-10 | 2013-04-10 | portable computer equipment |
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TW201440627A true TW201440627A (en) | 2014-10-16 |
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TW102114878A TW201440627A (en) | 2013-04-10 | 2013-04-25 | Portable computer apparatus |
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CN105704978A (en) * | 2014-11-26 | 2016-06-22 | 英业达科技有限公司 | Electronic device |
CN105224039A (en) * | 2015-11-10 | 2016-01-06 | 苏州海而仕信息科技有限公司 | A kind of notebook computer |
CN105224038A (en) * | 2015-11-10 | 2016-01-06 | 苏州海而仕信息科技有限公司 | A kind of laptop computer |
CN105392343A (en) * | 2015-12-11 | 2016-03-09 | 赛尔康技术(深圳)有限公司 | Radiating treatment structure |
CN107943254B (en) * | 2017-12-15 | 2019-10-25 | 商洛学院 | A portable computer device and its cooling module |
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CN2663136Y (en) * | 2003-08-18 | 2004-12-15 | 仁宝电脑工业股份有限公司 | Insulation sheet |
US20120020010A1 (en) * | 2010-07-22 | 2012-01-26 | Chia-Cheng Chang | Notebook computer housing structure |
TWM448716U (en) * | 2012-08-10 | 2013-03-11 | Giant Technology Co Ltd | Thermal insulation element structure |
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