TWM460879U - Plating device - Google Patents
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- TWM460879U TWM460879U TW102205358U TW102205358U TWM460879U TW M460879 U TWM460879 U TW M460879U TW 102205358 U TW102205358 U TW 102205358U TW 102205358 U TW102205358 U TW 102205358U TW M460879 U TWM460879 U TW M460879U
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Abstract
Description
本新型創作是有關於一種裝置，且特別是有關於一種電鍍裝置。The novel creation is related to a device, and in particular to a plating device.
電鍍技術廣泛的應用在各種不同用途與領域上，像是以美觀為主的裝飾用途例如是於容器表面上形成具有光澤的薄膜，或者是應用於高科技產業中。電鍍裝置通常包括電鍍槽、電鍍液、陰極、陽極、待鍍物以及電鍍金屬等構件，其中待鍍物連接陰極，電鍍金屬連接陽極。當施予陰極與陽極間外加電壓時，電鍍金屬會析出帶正電荷的電鍍金屬離子，而待鍍物表面聚集帶負電荷的電子。電鍍金屬離子被電子吸引並藉由電鍍液而流向待鍍物表面，以在待鍍物表面與電子結合而沉積於待鍍物表面形成鍍膜。Electroplating technology is widely used in a variety of different applications and fields, such as aesthetically-oriented decorative applications such as the formation of glossy films on the surface of containers, or in the high-tech industry. The electroplating apparatus generally includes a plating tank, a plating solution, a cathode, an anode, a material to be plated, and a metal plated member, wherein the object to be plated is connected to the cathode, and the plated metal is connected to the anode. When a voltage is applied between the cathode and the anode, the plating metal precipitates a positively charged plating metal ion, and the surface of the object to be plated concentrates the negatively charged electron. The electroplated metal ions are attracted by electrons and flow to the surface of the object to be plated by the plating solution to form a plating film on the surface of the object to be plated by being combined with electrons on the surface of the object to be plated.
然而，當施加外加電壓於陰極與陽極間時，受到尖端效應(point effect)的影響，待鍍物的尖端處的電場強度大於待鍍物的平坦處的電場強度，使得尖端處的厚度比平坦處的厚度厚，進而造成待鍍物的鍍膜厚度分布不均勻。However, when an applied voltage is applied between the cathode and the anode, the electric field strength at the tip end of the object to be plated is greater than the electric field strength at the flat portion of the object to be plated, so that the thickness at the tip is flat. The thickness of the material is thick, which in turn causes uneven distribution of the coating thickness of the object to be plated.
本新型創作提供一種電鍍裝置，適於對基板進行電鍍，並使電鍍後的基板具有均勻的鍍膜厚度。The novel creation provides a plating apparatus suitable for plating a substrate and having a uniform plating thickness of the substrate after plating.
本新型創作的電鍍裝置適於對一基板進行電鍍。電鍍裝置包括一電鍍槽、一陰極、兩陽極以及兩遮蔽件。陰極配置於電鍍槽內，而基板連接陰極。兩陽極配置於電鍍槽內。基板位於兩陽極之間，並且具有分別面向兩陽極的相對兩待鍍面。兩遮蔽件配置於電鍍槽內並且位於兩陽極之間。兩遮蔽件分別鄰近基板的相對兩側邊，並且相對於兩陽極，分別遮蔽但不接觸基板的兩待鍍面的外圍區域。The electroplating apparatus created by the present invention is suitable for electroplating a substrate. The electroplating apparatus includes a plating tank, a cathode, two anodes, and two shielding members. The cathode is disposed in the plating bath and the substrate is coupled to the cathode. The two anodes are disposed in the plating bath. The substrate is located between the two anodes and has opposite sides to be plated facing the two anodes, respectively. The two shields are disposed in the plating bath and are located between the two anodes. The two shielding members are respectively adjacent to opposite side edges of the substrate, and respectively shield the peripheral regions of the two to-be-plated surfaces of the substrate with respect to the two anodes.
在本新型創作的一實施例中，上述的各遮蔽件包括相互分離的兩部分。兩部份分別位在兩陽極與陰極之間，以遮蔽兩待鍍面的外圍區域。In an embodiment of the present invention, each of the shield members includes two portions that are separated from each other. The two parts are respectively located between the two anodes and the cathode to shield the peripheral regions of the two surfaces to be plated.
在本新型創作的一實施例中，上述的各遮蔽件為無狹縫連接，並且具有一第一凹槽。基板的相對兩側邊分別插入相應的第一凹槽。In an embodiment of the present invention, each of the shields is a slotless connection and has a first recess. The opposite side edges of the substrate are respectively inserted into the corresponding first grooves.
在本新型創作的一實施例中，上述的兩遮蔽件所遮蔽的兩待鍍面的外圍區域的寬度為0.5至1公分。In an embodiment of the present invention, the peripheral regions of the two surfaces to be plated covered by the two shielding members have a width of 0.5 to 1 cm.
在本新型創作的一實施例中，上述的電鍍裝置更包括多個支撐件，設置於電鍍槽內並分別位在兩陽極與陰極之間。兩遮蔽件分別具有對應於支撐件的多個第二凹槽，且各支撐件的相對兩端分別插入相應的第二凹槽。In an embodiment of the present invention, the electroplating apparatus further includes a plurality of support members disposed in the electroplating bath and positioned between the two anodes and the cathode, respectively. The two shielding members respectively have a plurality of second grooves corresponding to the supporting members, and opposite ends of the respective supporting members are respectively inserted into the corresponding second grooves.
在本新型創作的一實施例中，上述的電鍍裝置更包括多個噴灑模組，設置於電鍍槽內並分別位在兩陽極與陰極之間。兩遮蔽件分別具有對應於噴灑模組的多個第三凹槽，且各噴灑模組的相對兩端分別插入相應的第三凹槽。In an embodiment of the present invention, the electroplating apparatus further includes a plurality of spray modules disposed in the electroplating bath and positioned between the two anodes and the cathode, respectively. The two shielding members respectively have a plurality of third grooves corresponding to the spray module, and opposite ends of the spray modules are respectively inserted into the corresponding third grooves.
在本新型創作的一實施例中，上述的各遮蔽件分別具有多個排水孔。In an embodiment of the present invention, each of the shielding members has a plurality of drainage holes.
基於上述，本新型創作的電鍍裝置適於對基板進行電鍍，其中基板連接陰極並且位於兩陽極之間，而兩遮蔽件分別鄰近基板的相對兩側邊，並且相對於兩陽極，分別遮蔽但不接觸基板的相對兩待鍍面的外圍區域。由此可知，藉由兩遮蔽件遮蔽兩待鍍面的外圍區域，電鍍裝置可避免兩待鍍面的外圍區域受到尖端效應的影響而使鍍膜厚度不均。據此，本新型創作的電鍍裝置適於對基板進行電鍍，並使電鍍後的基板具有均勻的鍍膜厚度。Based on the above, the electroplating apparatus of the present invention is suitable for electroplating a substrate, wherein the substrate is connected to the cathode and located between the two anodes, and the two shielding members are respectively adjacent to opposite side edges of the substrate, and are respectively shielded from each other with respect to the two anodes. Contacting the peripheral regions of the opposite sides of the substrate to be plated. It can be seen that, by shielding the peripheral regions of the two surfaces to be plated by the two shielding members, the plating device can prevent the peripheral regions of the two surfaces to be plated from being affected by the tip effect and causing uneven coating thickness. Accordingly, the electroplating apparatus of the present invention is suitable for electroplating a substrate and having a uniform plating thickness of the substrate after electroplating.
為讓本新型創作的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will become more apparent and understood from the following description.
50‧‧‧基板50‧‧‧Substrate
52a、52b‧‧‧待鍍面52a, 52b‧‧‧ to be coated
54‧‧‧側邊54‧‧‧ side
56‧‧‧外圍區域56‧‧‧ peripheral area
100、100a‧‧‧電鍍裝置100, 100a‧‧‧ plating equipment
110‧‧‧電鍍槽110‧‧‧ plating bath
120‧‧‧陰極120‧‧‧ cathode
130‧‧‧陽極130‧‧‧Anode
140、140a、140b‧‧‧遮蔽件140, 140a, 140b‧‧‧ shields
142‧‧‧第一凹槽142‧‧‧first groove
142a、142b‧‧‧部分Section 142a, 142b‧‧‧
144、144b‧‧‧第二凹槽144, 144b‧‧‧ second groove
146、146b‧‧‧第三凹槽146, 146b‧‧‧ third groove
148‧‧‧排水孔148‧‧‧Drainage holes
150‧‧‧支撐件150‧‧‧Support
160‧‧‧噴灑模組160‧‧‧Spray module
162‧‧‧固定架162‧‧‧ fixed frame
164‧‧‧噴嘴164‧‧‧ nozzle
h‧‧‧高度H‧‧‧height
t‧‧‧厚度T‧‧‧thickness
w‧‧‧寬度w‧‧‧Width
圖1是本新型創作的一實施例的電鍍裝置的示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a plating apparatus according to an embodiment of the present invention.
圖2是本新型創作的另一實施例的電鍍裝置的示意圖。2 is a schematic view of a plating apparatus of another embodiment of the present invention.
圖3是圖2的遮蔽件的立體圖。Figure 3 is a perspective view of the shield of Figure 2;
圖4是本新型創作的另一實施例的遮蔽件的立體圖。4 is a perspective view of a shield of another embodiment of the present invention.
圖1是本新型創作的一實施例的電鍍裝置的示意圖。請參考圖1，在本實施例中，電鍍裝置100適於對基板50進行電鍍，並在電鍍完成之後利用移動單元(未繪示)將基板50移出，且接著移入另一未電鍍的基板50，以達成連續製程，但本新型創作的電鍍裝置100不以此為限制。基板50例如為印刷電路板(printed circuit board，PCB)，但本新型創作並不限於此。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a plating apparatus according to an embodiment of the present invention. Referring to FIG. 1, in the present embodiment, the plating apparatus 100 is adapted to plate the substrate 50, and after the plating is completed, the substrate 50 is removed by a moving unit (not shown), and then moved into another unplated substrate 50. In order to achieve a continuous process, the electroplating apparatus 100 created by the present invention is not limited thereto. The substrate 50 is, for example, a printed circuit board (PCB), but the present invention is not limited thereto.
在本實施例中，電鍍裝置100包括電鍍槽110、陰極120、兩陽極130以及兩遮蔽件140，其中電鍍裝置100的陰極120配置於電鍍槽110內，而基板50連接陰極120。兩陽極130配置於電鍍槽110內。基板50位於兩陽極130之間，並且具有分別面向兩陽極130的相對兩待鍍面52a與52b。此外，兩陽極130還分別連接欲電鍍於兩待鍍面52a與52b上的電鍍金屬。In the present embodiment, the electroplating apparatus 100 includes a plating tank 110, a cathode 120, two anodes 130, and two shielding members 140. The cathode 120 of the plating apparatus 100 is disposed in the plating tank 110, and the substrate 50 is connected to the cathode 120. The two anodes 130 are disposed in the plating bath 110. The substrate 50 is located between the two anodes 130 and has opposite sides to be plated surfaces 52a and 52b facing the two anodes 130, respectively. In addition, the two anodes 130 are also respectively connected to the plating metal to be plated on the two surfaces to be plated 52a and 52b.
當施予陰極120與各陽極130之間外加電壓時，連接陰極120的基板50則會聚集帶負電荷的電子。此時，帶正電荷的電鍍金屬離子會被帶負電荷的電子所吸引，並以電鍍槽110內之電鍍液(未繪示)做為介質而流向基板50的兩待鍍面52a與52b。當電鍍金屬離子抵達兩待鍍面52a與52b時，便會與電子結合而形成金屬原子，並沉積於兩待鍍面52a與52b而形成鍍膜(未繪示)。當電鍍金屬完全析出或是停止施加外加電壓時，電鍍反應便停止。When a voltage is applied between the donor cathode 120 and each of the anodes 130, the substrate 50 connected to the cathode 120 concentrates the negatively charged electrons. At this time, the positively charged plating metal ions are attracted by the negatively charged electrons, and the plating liquid (not shown) in the plating bath 110 is used as a medium to flow to the two surfaces to be plated 52a and 52b of the substrate 50. When the plating metal ions reach the two surfaces to be plated 52a and 52b, they are combined with electrons to form metal atoms, and are deposited on the two surfaces to be plated 52a and 52b to form a plating film (not shown). When the plating metal is completely precipitated or the applied voltage is stopped, the plating reaction is stopped.
然而，當施予陰極120與各陽極130之間一外加電壓時，受到尖端效應的影響，基板50的相對兩側邊54與兩待鍍面52a與52b的外圍區域56的電場高於兩待鍍面52a與52b的中間區域的電場。換句話說，當連接陰極120的基板50聚集帶負電荷的電子時，較多的電子聚集在基板50的尖端處，例如是基板50的側邊54與外圍區域56，而較少的電子聚集在基板50的平坦處，例如是兩待鍍面52a與52b的中間區域。此處所述的尖端與平坦僅是兩者互相比較的結果，並非用以限定。因此，在電鍍過程中，聚集較多電子的尖端處吸引較多的電鍍金屬離子，進而在尖端處形成厚度較厚的鍍膜。However, when a voltage is applied between the cathode 120 and each of the anodes 130, the electric field of the opposite side edges 54 of the substrate 50 and the peripheral regions 56 of the two surfaces 52a and 52b to be plated are higher than the two. The electric field in the intermediate portion of the plating surfaces 52a and 52b. In other words, when the substrate 50 connecting the cathodes 120 concentrates the negatively charged electrons, more electrons are concentrated at the tips of the substrate 50, such as the side edges 54 and the peripheral regions 56 of the substrate 50, with less electron accumulation. At the flat portion of the substrate 50, for example, is an intermediate portion between the two surfaces 52a and 52b to be plated. The tip and flatness described herein are only the result of comparing the two, and are not intended to be limiting. Therefore, during the electroplating process, the tip of the collected electrons attracts more plating metal ions, thereby forming a thicker coating at the tip end.
據此，在本實施例中，兩遮蔽件140配置於電鍍槽110內並且位於兩陽極130之間。兩遮蔽件140分別鄰近基板50的相對兩側邊54，並且相對於兩陽極130，分別遮蔽但不接觸基板50的兩待鍍面52a與52b的外圍區域56。遮蔽件140的材料可為具抗腐蝕性的絕緣材料，例如為聚氯乙烯(PVC)、聚四氟乙烯(PTFE)等，但本創作並不以此為限制，而厚度t的尺寸需足以阻絕電場的滲透，其中厚度t是指遮蔽件140橫跨在陰極120與各陽極130之間的距離，但厚度t的具體的尺寸可依實際需求作調整。Accordingly, in the present embodiment, the two shielding members 140 are disposed in the plating tank 110 and located between the two anodes 130. The two shielding members 140 are respectively adjacent to the opposite side edges 54 of the substrate 50, and respectively shield the peripheral regions 56 of the two to-be-plated surfaces 52a and 52b of the substrate 50 with respect to the two anodes 130. The material of the shielding member 140 may be a corrosion-resistant insulating material, such as polyvinyl chloride (PVC), polytetrafluoroethylene (PTFE), etc., but the creation is not limited thereto, and the thickness t is sufficient. The penetration of the electric field is blocked, wherein the thickness t refers to the distance between the shield 140 and the anodes 130, but the specific size of the thickness t can be adjusted according to actual needs.
另外，在本實施例中，各遮蔽件140例如是無狹縫連接，並且具有第一凹槽142。基板50的相對兩側邊54分別插入相應的第一凹槽142，其中遮蔽件140的第一凹槽142不接觸兩待鍍面52a與52b的外圍區域56，以避免影響鍍膜形成於外圍區域56。 詳細而言，各遮蔽件140的高度h約為1至2公分，而兩遮蔽件140所遮蔽的兩待鍍面52a與52b的外圍區域56的寬度w約為0.5至1公分，其中外圍區域56是指待鍍面52a與52b接近側邊54並被遮蔽件140所遮蔽之處，而寬度w即是從側邊54往待鍍面52a與52b的中間方向延伸至對應於遮蔽件140的上端的距離。但，本新型創作並不限制各遮蔽件140的高度h與外圍區域56的寬度w的數值，其可依據設計與實際需求作調整。經由遮蔽件140的第一凹槽142的遮蔽，能降低基板50的兩待鍍面52a與52b的外圍區域56的電場，以使外圍區域56的電場接近兩待鍍面52a與52b的中間區域的電場，進而使基板50的兩待鍍面52a與52b在電鍍完成後具有較為均勻的鍍膜厚度。In addition, in the present embodiment, each of the shielding members 140 is, for example, a slit-free connection, and has a first recess 142. The opposite side edges 54 of the substrate 50 are respectively inserted into the corresponding first grooves 142, wherein the first grooves 142 of the shielding member 140 do not contact the peripheral regions 56 of the two surfaces to be plated 52a and 52b to avoid affecting the formation of the coating film in the peripheral region. 56. In detail, the height h of each of the shielding members 140 is about 1 to 2 cm, and the width w of the peripheral regions 56 of the two to-be-plated surfaces 52a and 52b shielded by the two shielding members 140 is about 0.5 to 1 cm, wherein the peripheral region 56 means that the to-be-plated surfaces 52a and 52b are close to the side edges 54 and are shielded by the shielding member 140, and the width w is extended from the side edges 54 to the intermediate direction of the surfaces to be plated 52a and 52b to correspond to the shielding member 140. The distance from the top. However, the novel creation does not limit the values of the height h of each of the shield members 140 and the width w of the peripheral region 56, which can be adjusted according to design and actual needs. The shielding of the first recess 142 of the shield 140 can reduce the electric field of the peripheral regions 56 of the two surfaces to be plated 52a and 52b of the substrate 50 such that the electric field of the peripheral region 56 approaches the intermediate portion of the two surfaces to be plated 52a and 52b. The electric field, in turn, causes the two surfaces to be plated 52a and 52b of the substrate 50 to have a relatively uniform coating thickness after plating.
在本實施例中，電鍍裝置100更包括多個支撐件150，設置於電鍍槽110內並分別位在兩陽極130與陰極120之間。兩遮蔽件140分別具有對應於支撐件150的多個第二凹槽144，且各支撐件150的相對兩端分別插入相應的第二凹槽144。基板50在電鍍液中會經由電鍍液的浮力而產生漂移。因此，將支撐件150分別配置在基板50的兩側並面對兩待鍍面52a與52b，可使基板50保持位在兩陽極130之間。支撐件150並不接觸基板50，僅是用來限制基板50產生範圍較大的漂移。因此，本新型創作並不限制支撐件150的數量與形狀，亦不限制支撐件150是否固定於第二凹槽144內，只需達到上述功效即可。支撐件150的數量與形狀以及固定與否，可依據設計與實際需求作調整。In the present embodiment, the plating apparatus 100 further includes a plurality of support members 150 disposed in the plating bath 110 and positioned between the two anodes 130 and the cathodes 120, respectively. The two shielding members 140 respectively have a plurality of second grooves 144 corresponding to the supporting members 150, and opposite ends of the respective supporting members 150 are respectively inserted into the corresponding second grooves 144. The substrate 50 is drifted in the plating solution via the buoyancy of the plating solution. Therefore, the support members 150 are respectively disposed on both sides of the substrate 50 and face the two surfaces to be plated 52a and 52b, so that the substrate 50 can be held between the two anodes 130. The support member 150 does not contact the substrate 50, and is only used to limit the drift of the substrate 50 to a large extent. Therefore, the novel creation does not limit the number and shape of the support members 150, nor does it limit whether the support member 150 is fixed in the second recess 144, and only needs to achieve the above effects. The number and shape of the support members 150 and whether they are fixed or not can be adjusted according to the design and actual needs.
另外，在本實施例中，電鍍裝置100更包括多個噴灑模組160，例如是兩個噴灑模組160，設置於電鍍槽110內並分別位在兩陽極130與陰極120之間。兩遮蔽件140分別具有對應於噴灑模組160的多個第三凹槽146，且各噴灑模組160的相對兩端分別插入相應的第三凹槽146。具體而言，噴灑模組160配置在基板50的兩側，包括固定架162與設置於固定架162上的多個噴嘴164，固定架162的相對兩端分別插入相應的第三凹槽146，而噴嘴164可將電鍍液注入電鍍槽110中。因此，本新型創作並不限制噴灑模組160的數量，不限制噴灑模組160為固定架162與噴嘴164的方式實施，亦不限制噴灑模組160是否固定於第三凹槽146內，噴灑模組160只需達到上述功效即可。In addition, in the present embodiment, the plating apparatus 100 further includes a plurality of spray modules 160, for example, two spray modules 160 disposed in the plating tank 110 and positioned between the two anodes 130 and the cathodes 120, respectively. The two shielding members 140 respectively have a plurality of third recesses 146 corresponding to the spray module 160, and opposite ends of the spray modules 160 are respectively inserted into the corresponding third recesses 146. Specifically, the spray module 160 is disposed on two sides of the substrate 50, and includes a fixing frame 162 and a plurality of nozzles 164 disposed on the fixing frame 162. The opposite ends of the fixing frame 162 are respectively inserted into the corresponding third grooves 146. The nozzle 164 can inject the plating solution into the plating bath 110. Therefore, the present invention does not limit the number of the spray modules 160, and does not limit the manner in which the spray modules 160 are the fixed racks 162 and the nozzles 164, and does not limit whether the spray modules 160 are fixed in the third recesses 146, and sprays. The module 160 only needs to achieve the above effects.
圖2是本新型創作的另一實施例的電鍍裝置的示意圖。在本實施例中，電鍍裝置100a的構件在圖2中的標號與電鍍裝置100的構件在圖1中的標號相同者具有相同或類似的結構或功能，在此不多加贅述，以下僅就電鍍裝置100a與電鍍裝置100的差異處作說明。電鍍裝置100a的兩遮蔽件140a配置於電鍍槽110內並且位於兩陽極130之間。兩遮蔽件140a分別鄰近基板50的相對兩側邊54，並且相對於兩陽極130，分別遮蔽但不接觸基板50的兩待鍍面52a與52b的外圍區域56。2 is a schematic view of a plating apparatus of another embodiment of the present invention. In the present embodiment, the components of the plating apparatus 100a have the same or similar structures or functions as those of the components of the plating apparatus 100 in FIG. 1 , and the details are not described herein. The difference between the device 100a and the plating device 100 will be described. The two shielding members 140a of the plating apparatus 100a are disposed in the plating tank 110 and located between the two anodes 130. The two shielding members 140a are respectively adjacent to the opposite side edges 54 of the substrate 50, and respectively shield the peripheral regions 56 of the two to-be-plated surfaces 52a and 52b of the substrate 50 with respect to the two anodes 130.
在本實施例中，各遮蔽件140a包括相互分離的兩部分142a。兩部份142a分別位在兩陽極130與陰極120之間，以遮蔽兩待鍍面52a與52b的外圍區域56。當遮蔽件140a的兩部分142a 遮蔽外圍區域56時，兩部分142a不接觸兩待鍍面52a與52b的外圍區域56，以避免影響鍍膜形成於外圍區域56。經由遮蔽件140a的兩部分142a的遮蔽，能降低兩待鍍面52a與52b的外圍區域56的電場，以使外圍區域56的電場接近兩待鍍面52a與52b的中間區域的電場，進而使基板50的兩待鍍面52a與52b在電鍍完成後具有較為均勻的鍍膜厚度。In the present embodiment, each of the shielding members 140a includes two portions 142a that are separated from each other. The two portions 142a are respectively positioned between the two anodes 130 and the cathode 120 to shield the peripheral regions 56 of the two surfaces to be plated 52a and 52b. When the two parts 142a of the shield 140a When the peripheral region 56 is shielded, the two portions 142a do not contact the peripheral regions 56 of the two surfaces to be plated 52a and 52b to avoid affecting the formation of the coating on the peripheral region 56. The shielding of the two portions 142a of the shield member 140a reduces the electric field of the peripheral regions 56 of the two surfaces to be plated 52a and 52b such that the electric field of the peripheral region 56 approaches the electric field in the intermediate portion of the two surfaces 52a and 52b to be plated, thereby The two surfaces to be plated 52a and 52b of the substrate 50 have a relatively uniform coating thickness after plating is completed.
圖3是圖2的遮蔽件的立體圖。圖4是本新型創作的另一實施例的遮蔽件的立體圖。請參考圖3與圖4，在圖3的實施例中，遮蔽件140a的兩部分142a的第二凹槽144與第三凹槽146為溝渠(trench)。因此，板狀的支撐件150與板狀的固定架162可插入溝渠內。在圖4的實施例中，遮蔽件140b的兩部分142b的第二凹槽144b與第三凹槽146b為開孔(hole)。因此，柱狀的支撐件與柱狀的固定架可插入開孔內。上述的溝渠與開孔亦可應用於無狹縫連接的遮蔽件140的第二凹槽144與第三凹槽146。由此可知，本新型創作的遮蔽件的第二凹槽與第三凹槽可依據支撐件150與噴灑裝置160的數量與形狀而調整其數量與形狀，且第二凹槽與第三凹槽不限制為相同形狀。Figure 3 is a perspective view of the shield of Figure 2; 4 is a perspective view of a shield of another embodiment of the present invention. Referring to FIG. 3 and FIG. 4, in the embodiment of FIG. 3, the second recess 144 and the third recess 146 of the two portions 142a of the shield 140a are trenches. Therefore, the plate-shaped support member 150 and the plate-shaped holder 162 can be inserted into the trench. In the embodiment of FIG. 4, the second recess 144b and the third recess 146b of the two portions 142b of the shield 140b are holes. Therefore, the columnar support and the columnar holder can be inserted into the opening. The above-mentioned trenches and openings can also be applied to the second recess 144 and the third recess 146 of the shield 140 without the slit connection. It can be seen that the second groove and the third groove of the shield member of the present invention can be adjusted according to the number and shape of the support member 150 and the spraying device 160, and the second groove and the third groove Not limited to the same shape.
此外，在圖3與圖4所示的實施例中，各遮蔽件140a與140b分別具有多個排水孔148。排水孔148分布在各遮蔽件140a與140b上，使得電鍍液可經由排水孔148而通過遮蔽件140a與140b。因此，當遮蔽件140在基板50連接陰極120之後欲移動至鄰近基板50的側邊54時，可避免遮蔽件140受到在電鍍液中移 動所產生的阻力而無法移動至預定的位置。同樣地，圖1的無狹縫連接的兩遮蔽件140亦可分別具有多個排水孔148，而達到上述功效，但本新型創作並不限制排水孔148的設置與否。Further, in the embodiment shown in FIGS. 3 and 4, each of the shielding members 140a and 140b has a plurality of drainage holes 148, respectively. Drain holes 148 are distributed over the respective shields 140a and 140b such that the plating solution can pass through the shields 140a and 140b via the drain holes 148. Therefore, when the shielding member 140 is to be moved to the side 54 of the adjacent substrate 50 after the substrate 50 is connected to the cathode 120, the shielding member 140 can be prevented from being displaced in the plating solution. The resistance generated by the movement cannot move to the predetermined position. Similarly, the two shield members 140 of the slitless connection of FIG. 1 can also have a plurality of drainage holes 148, respectively, to achieve the above effects, but the novel creation does not limit the setting of the drainage holes 148.
綜上所述，本新型創作的電鍍裝置適於對基板進行電鍍，其中基板連接陰極並且位於兩陽極之間，並且具有分別面向兩陽極的相對兩待鍍面，而兩遮蔽件分別鄰近基板的相對兩側邊，並且相對於兩陽極，分別遮蔽但不接觸基板的相對兩待鍍面的外圍區域。由此可知，藉由兩遮蔽件遮蔽兩待鍍面的外圍區域，電鍍裝置可避免兩待鍍面的外圍區域受到尖端效應的影響而使鍍膜厚度不均。據此，本新型創作的電鍍裝置適於對基板進行電鍍，並使電鍍後的基板具有均勻的鍍膜厚度。In summary, the electroplating apparatus of the present invention is suitable for electroplating a substrate, wherein the substrate is connected to the cathode and is located between the two anodes, and has two opposite to-be-plated surfaces facing the two anodes respectively, and the two shielding members are respectively adjacent to the substrate. Opposite the two sides, and opposite to the two anodes, respectively, but not the peripheral regions of the opposite two surfaces to be plated of the substrate. It can be seen that, by shielding the peripheral regions of the two surfaces to be plated by the two shielding members, the plating device can prevent the peripheral regions of the two surfaces to be plated from being affected by the tip effect and causing uneven coating thickness. Accordingly, the electroplating apparatus of the present invention is suitable for electroplating a substrate and having a uniform plating thickness of the substrate after electroplating.
雖然本新型創作已以實施例揭露如上，然其並非用以限定本新型創作，任何所屬技術領域中具有通常知識者，在不脫離本新型創作的精神和範圍內，當可作些許的更動與潤飾，故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.
50‧‧‧基板50‧‧‧Substrate
52a、52b‧‧‧待鍍面52a, 52b‧‧‧ to be coated
54‧‧‧側邊54‧‧‧ side
56‧‧‧外圍區域56‧‧‧ peripheral area
100‧‧‧電鍍裝置100‧‧‧ plating equipment
110‧‧‧電鍍槽110‧‧‧ plating bath
120‧‧‧陰極120‧‧‧ cathode
130‧‧‧陽極130‧‧‧Anode
140‧‧‧遮蔽件140‧‧‧Shield
142‧‧‧第一凹槽142‧‧‧first groove
144‧‧‧第二凹槽144‧‧‧second groove
146‧‧‧第三凹槽146‧‧‧ third groove
150‧‧‧支撐件150‧‧‧Support
160‧‧‧噴灑模組160‧‧‧Spray module
162‧‧‧固定架162‧‧‧ fixed frame
164‧‧‧噴嘴164‧‧‧ nozzle
h‧‧‧高度H‧‧‧height
t‧‧‧厚度T‧‧‧thickness
w‧‧‧寬度w‧‧‧Width
Claims (7)
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| Application Number | Priority Date | Filing Date | Title |
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| TW102205358U TWM460879U (en) | 2013-03-22 | 2013-03-22 | Plating device |
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| Application Number | Priority Date | Filing Date | Title |
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| TW102205358U TWM460879U (en) | 2013-03-22 | 2013-03-22 | Plating device |
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| Publication Number | Publication Date |
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| TWM460879U true TWM460879U (en) | 2013-09-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111647935A (en) * | 2019-03-04 | 2020-09-11 | 河南理工大学 | Scanning type electrodeposition processing method and device with multi-wire anodes arranged in parallel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111647935A (en) * | 2019-03-04 | 2020-09-11 | 河南理工大学 | Scanning type electrodeposition processing method and device with multi-wire anodes arranged in parallel |
| CN111647935B (en) * | 2019-03-04 | 2023-08-01 | 河南理工大学 | Scanning type electrodeposition processing method and device with multi-line anodes arranged in parallel |
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