TWM448052U - Chip peeling device - Google Patents

Description

Wafer stripping device

The present invention is to provide a peeling device, and more particularly to a stripping device for a wafer.

Referring to the first figure, a general wafer type resistor is formed on a sheet substrate 1, and vertical and horizontal creases 11 are obliquely cut on the substrate 1 to form a plurality of lattice wafers. 12; Referring to the second figure, the lattice wafer 12 is then automatically stripped out of a strip of elongated resistive strips 13, and the elongated strips 13 are collected and stacked into a complete group, and then the entire stack is completed. The strip 13 is sent to the next process for dicing the wafer 12 into a unit; such a technique for stripping and stacking the sheet-like substrate 1 forming the wafer-type resistor, such as CN2566426 "wafer resistor stripping" The strip arranging machine mainly uses a conveying device to place the wafer substrate into the conveying belt, and enters the two pressure roller groups driven by the two cylinders, and strips the stripping device in the upper and lower directions. operation.

The above-mentioned prior art peels off the sheet-shaped substrate of the wafer type resistor, and inserts the wafer into the transport belt to enter the two pressure roller groups driven by the two cylinders, and the upper and lower directions are concavely folded. Since the rolling pressing force of the upper and lower pressing wheels does not correspond to the crease line, the quality of the wafer peeling on the conveyor belt is not satisfactory.

Therefore, the object of the present invention is to provide a wafer stripping apparatus which can quickly and surely strip the resistance of the wafer and facilitate adjustment.

According to the purpose of the present invention, the stripping device of the novel wafer comprises: a stripping mechanism and a pushing mechanism; the stripping mechanism is provided with a swing seat driven by the first driving mechanism, and the clamp is provided with a clamp The stripped wafer substrate is placed in the fixture, and can be pushed by the pushing mechanism to cause the front end to enter a positioning device to be positioned, and the first driving mechanism can drive the swinging joint clamping fixture and the wafer substrate thereon to perform the skew bending operation. To strip the resistive strip on the wafer substrate.

The advantages achieved by the present invention: since one end is positioned and the one end is bent, the stripping device is used for stripping, so that the strip of the wafer resistor can be quickly and surely stripped, and the first driving mechanism of the stripping mechanism drives the eccentric wheel to rotate. The amplitude of the connecting rod linkage swing can be adjusted, and the adjustment of the stripping can be effectively adjusted, and the sensing control of the first and second sensing elements in the pushing mechanism and the clamping mechanism of the clamping mechanism can be further controlled. Automate the overall stripping operation and increase the speed of stripping.

Referring to the third and fourth figures, the substrate 2 on which the chip resistance is disposed is stripped in such a manner that one end of the substrate 2 is embedded in a recess 31 of a positioning device 3.

Referring to the fifth embodiment, in the present embodiment, the peeling device 4 carrying the substrate 2 is subjected to a bending operation which is deflected to one side so that the resistive strip 21 to be folded by the substrate 2 is peeled off.

Referring to the sixth figure, the stripped strip 21 is embedded in the recess 31 of the positioning device 3, rotated 180 degrees to the other side via the positioning device 3, and is picked up by a collecting device 5 and stacked for collection; wherein, the positioning is performed. The device 3 and the collecting device 5 are not characteristic of the present invention, and only the peeling device 4 proposed by the present invention will be described in detail below.

Referring to the seventh embodiment, the stripping device 4 of the present embodiment is provided with a stripping mechanism 41 and a pushing mechanism 42 disposed on the stripping mechanism 41. The pushing mechanism 42 is disposed on the stripping mechanism 41, and A sliding rail 421 is fixed on a cantilever 419 protruding from the swinging seat 413. The sliding rail 421 is provided with a sliding seat 422. The sliding seat 422 is driven by a second driving mechanism 7. The second driving mechanism 7 includes a motor 71 fixed under the swinging seat 413, a driving wheel 72 is disposed on the rotating shaft of the motor 71, and a fixed bracket 73 is disposed on the cantilever 419, and a rotating wheel 74 is disposed thereon, and the driving wheel 72 is rotated A belt 75 is provided between the wheels 74. Referring to FIG. 8 , the stripping mechanism 41 is provided with a frame 411 , which is provided with two brackets 412 spaced apart from each other, and a swing seat 413 is disposed between the two brackets 412 . The clamp 413 is provided with a clamp 414 . The clamp 414 is formed by two guide rails 415 spaced apart from each other. A section 416 for the substrate 2 to be stripped is formed between the two guide rails 415, and a front limit member is disposed in front of the clamp 414 formed by the two guide rails 415. 417, and the rear of the clamp 414 is provided with two rear limit members 418 respectively disposed at the rear of each of the guide rails 415; please refer to the eighth, ninth and tenth views, and the seat 413 is subjected to a The first driving mechanism 6 that is intermittently and repeatedly moved is driven, and the pivoting position of the seat 413 and the two brackets 412 can be up and down. The first driving mechanism 6 includes an eccentric wheel 62 driven by the motor 61, and a connecting rod 63 whose one end pivot point is offset from the center of rotation of the eccentric wheel 62 and the other end is pivotally connected to the side of the swing seat 413. The connecting rod 63 is provided with an adjusting section 631. The integral connecting rod 63 can be extended or shortened by the screwing adjustment section 631 to change the swing of the upper and lower swings of the swinging drive rod 63 of the eccentric wheel 62. The ability of the swing seat 413 to sandwich the front end of the substrate 2 is relatively affected.

Referring to FIG. 11, a "shaped carrier 423 is fixed to the sliding seat 422. The carrier 423 is coupled to a fixing member 425 by a connecting member 425 to sandwich the upper side of the belt 75. When the motor 71 rotates and the drive wheel 72 drives the belt 75 to displace, the carrier 423 can be interlocked with the slide rail 422 to reciprocate back and forth on the slide rail 421; the carrier 423 is provided with a ball slide group 426 (the upper part is slippery The lower part is a slide rail with a row of balls arranged therein, and the slide rail and the slide seat can be used for relative sliding displacement; since it is a commercially available component and not a novel feature, it is only fixed by a rectangular parallelepiped) The carrier 91 of the clamping mechanism 9.

The first sensing element 81 is disposed on the fixing frame 73. 83. The clamping mechanism 9 pivots a clamping arm 93 on a fixing base 92 of the carrying platform 91. A clamping end 931 forms a clamping mouth 95 with a clamping seat 94 at the front end of the loading platform 91. The clamping arm 93 is opposite to the clamping arm 93. The other biasing end 932 of the crimping end 931 is provided with a yoke 933. The rear end of the carrying platform 91 is provided with a pneumatic cylinder 96. The front end 962 of the protruding cylinder rod 961 can be pushed forward and reached against the yoke 933. Applying the force end 932 Pressed and pushed down, relatively close the clamping end 931 to the clamping port 95; please refer to the fourteenth figure, the rear end of the carrying platform 91 is provided with a sensing rod 84 and an L-shaped fixing seat 85, the sensing rod 84 After extending through the L-shaped fixing base 85 and protruding from the L-shaped fixing base 85, the end of the sensing rod 84 can extend into the L-shaped fixing base 85 to provide a feeling of lack of a second sensing element 86. In the measuring section 87, a spring element 88 composed of a spring is sleeved on the sensing rod 84 between the rear end of the carrying platform 91 and the L-shaped fixing base 85.

In the implementation of the present invention, the substrate 2 conveyed to the stripping device 4 will be sent to the jig 414 of the pendulum 413 in the stripping mechanism 41, placed on the two rails 415, and located in the front of the section 416. Between the positional element 417 and the rear stop element 418, the second drive mechanism 7 of the push mechanism 42 drives the clamp mechanism 9 to advance and form the clamped end 931 and the clamp 94 by the clamp arm 93 on the support table 91. The clamping port 95 pushes the substrate 2 forward. At this time, the first sensing element 81 on the fixing frame 73 will transfer the sensing piece 82 on the carrier 423 out of the sensing section 83, and transmit a signal to record the number of times of peeling of the substrate 2. Recording, until the front end of the substrate 2 is in the groove 31 of the positioning device 3 and cannot continue to advance, the driving force of the second driving mechanism 7 in the pushing mechanism 42 at this time will cause the carrier 423 to interlock with the L-shaped fixing seat 85 and the The second sensing element 86 is advanced by the ball slide group 426. At this time, the carrier platform 91 above the ball slide group 426 and the carrier 423 below the ball slide group 426 will be relatively displaced, except for the elastic member 88. In addition, the end of the sensing rod 84 will also enter the sensing interval 87 of the second sensing element 86, so that 7 so that the second drive mechanism 42 stops driving means pushing forward the signal, and the first drive unit The driving eccentric wheel 62 rotates the driving link 63 to swing the swinging seat 413 upward to perform the stripping operation on the substrate 2 carried by the swinging seat 413, and when the peeling operation is completed and the pushing mechanism 42 is returned to the original position, Then, the sensing piece 82 on the carrier 423 is moved into the sensing section 83, so that the first sensing component 81 is sensed and the signal recording substrate 2 is transferred to perform a stripping operation; and the resistive strips on the substrate 2 are repeatedly implemented through the above operations. After the peeling is completed, the next substrate 2 continues to be fed into the stripping mechanism 41 to continue the stripping operation.

In the design of the present invention, since the one end is positioned and the one end is bent, the stripping device 4 is used for stripping, so that the strip of the wafer resistor can be quickly and surely stripped, and the first driving mechanism 6 of the stripping mechanism 41 is driven. The amplitude of the swing of the eccentric wheel 62 of the rotary drive link 63 in conjunction with the swing seat 413 can be adjusted, and the effective control of the peeling can be effectively adjusted, and the sensing control of the first and second sensing elements 81 and 86 in the push mechanism 42 is added. The pinch control with the clamping mechanism 9 can further automate the overall stripping operation and increase the speed of the stripping.

However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent.

Conventional technology number

1‧‧‧Substrate

11‧‧‧ crease

12‧‧‧ wafer

13‧‧‧Resistance strip

The figure of the new embodiment

2‧‧‧Substrate

21‧‧‧Resistance strip

3‧‧‧ Positioning device

31‧‧‧Inlay

4‧‧‧ peeling device

41‧‧‧Folding mechanism

411‧‧‧Rack

412‧‧‧ bracket

413‧‧‧Seat

414‧‧‧ fixture

415‧‧‧rail

416‧‧‧

417‧‧‧ front limit components

418‧‧‧ rear limit components

42‧‧‧ Pushing agency

421‧‧‧Slide rails

422‧‧‧Slide

423‧‧‧Hosting

424‧‧‧Connecting parts

425‧‧‧Fixed parts

426‧‧‧Rolling track group

5‧‧‧Collection device

6‧‧‧First drive mechanism

61‧‧‧Motor

62‧‧‧Eccentric wheel

63‧‧‧ linkage

631‧‧‧ adjustment section

7‧‧‧Second drive mechanism

71‧‧‧Motor

72‧‧‧ drive wheel

73‧‧‧Retaining frame

74‧‧‧Runner

75‧‧‧Land

81‧‧‧First sensing element

82‧‧‧Sense film

83‧‧‧Sensing interval

84‧‧‧Sensing rod

85‧‧‧ Fixed seat

86‧‧‧Second sensing element

87‧‧‧Sensing interval

88‧‧‧Flexible components

9‧‧‧Clamping mechanism

91‧‧‧Loading station

92‧‧‧ fixed seat

93‧‧‧ clip arm

931‧‧‧ pinch end

932‧‧‧ 施力端

933‧‧‧Round

94‧‧‧ clamp seat

95‧‧‧ Sandwich

96‧‧‧ pneumatic cylinder

961‧‧‧Cylinder rod

962‧‧‧ front end

The first figure is a schematic diagram of the structure of the general wafer resistor before stripping.

The second figure is a schematic diagram of the strip of resistance stripped by the general chip resistor.

The third figure is the process relationship of the entire embodiment in the entire stripping and stacking process. Figure.

The fourth figure is an enlarged schematic view of the novel embodiment pushing the chip resistor into the slot of the positioning device.

The fifth figure is a schematic view of the operation of stripping the resistor of the wafer in the novel embodiment.

The sixth figure is a schematic diagram of the process of the strip of the strip stripped by the positioning device being transferred to the stacking device by the positioning device.

The seventh figure is a schematic view of the three-dimensional structure of the novel embodiment.

The eighth figure is a schematic view of the three-dimensional structure of the stripping mechanism in the novel embodiment.

The ninth drawing is a front view of the stripping mechanism in the novel embodiment.

The tenth figure is a schematic structural view of the deflection mechanism of the stripping mechanism in the new embodiment.

The eleventh figure is a three-dimensional structural diagram of the push mechanism in the present embodiment.

The twelfth figure is a schematic view showing the three-dimensional structure of the pushing mechanism in the novel embodiment.

The thirteenth drawing is a schematic view showing the opening and closing structure of the clamping mechanism of the pushing mechanism in the novel embodiment.

Figure 14 is a perspective view showing the sensing structure of the second sensing element of the pushing mechanism in the novel embodiment.

4‧‧‧ peeling device

41‧‧‧Folding mechanism

413‧‧‧Seat

419‧‧‧cantilever

42‧‧‧ Pushing agency

421‧‧‧Slide rails

422‧‧‧Slide

7‧‧‧Second drive mechanism

71‧‧‧Motor

72‧‧‧ drive wheel

73‧‧‧Retaining frame

74‧‧‧Runner

75‧‧‧Land

Claims (14)

A stripping device for a wafer, comprising: a stripping mechanism and a pushing mechanism; the stripping mechanism is provided with a swing seat driven by the first driving mechanism, the clip is provided with a clamp, and the wafer substrate to be stripped is placed The clamp can be pushed by the push mechanism to position the front end into a positioning device, and the first drive mechanism can drive the swing joint clamp and the wafer substrate thereon to perform the skew bending operation to peel off the resistance on the wafer substrate. article. The stripping device for a wafer according to claim 1, wherein the stripping device of the wafer further comprises a rack on which two brackets are disposed at an appropriate interval, and the pendulum is pivoted between the two brackets. The stripping device for a wafer according to claim 1, wherein the jig is composed of two rails spaced apart by an appropriate interval, and an interval between the two rails for forming the substrate to be stripped is formed. The stripping device for a wafer according to claim 1, wherein a front limiting member is disposed in front of the clamp, and a rear limiting member is disposed behind the clamp. The stripping device for a wafer according to claim 2, wherein the first driving mechanism intermittently moves to drive the pivotal joint between the swing seat and the two brackets, and repeatedly swings up and down. The stripping device for a wafer according to claim 1, wherein the first driving mechanism comprises an eccentric wheel driven by a motor, and one end pivot point is offset from the center of rotation of the eccentric wheel and the other end is seated. A link that is pivoted on one side. The stripping device for a wafer according to claim 6, wherein the connecting rod is provided with an adjusting section, and the integral connecting rod can be extended or shortened by a screw rotating adjustment section to change the eccentric rotating drive link linkage pendulum The swing of the upper and lower swings. The stripping device of the wafer of claim 1, wherein the pushing mechanism is disposed on the stripping mechanism and is fixed on a cantilever by the sliding rail; the slide rail is provided with a The sliding seat is driven by a second driving mechanism. The sliding seat is provided with a carrier. The carrier is provided with a loading platform for fixing a clamping mechanism on the upper side. The stripping device of the wafer of claim 8, wherein the second driving mechanism comprises a motor fixed under the swing seat, a rotating wheel is provided on the rotating shaft of the motor, and a fixed frame is arranged on the cantilever A rotating wheel is disposed thereon, and a belt is disposed between the driving wheel and the rotating wheel. The stripping device for a wafer according to claim 9, wherein the carrier is coupled with a fixing member to sandwich the upper side of the belt, so that the motor rotates to drive the belt to move the belt. The carrier is slidably moved back and forth on the slide rail by the slide. The stripping device for a wafer according to claim 8, wherein the carrier is fixed on the carrier by a ball slide group. The stripping device for a wafer according to claim 9, wherein the holder is provided with a first sensing element, and the carrier is fixed The sensing sheet can be moved into the sensing interval of the first sensing element. The stripping device for a wafer according to claim 8, wherein the clamping mechanism pivots a clamping arm on a fixing base of the loading platform, and a clamping end forms a clip with a clamping seat at the front end of the loading platform. The mouth of the clamping arm is provided with a yoke on the other end of the clamping end, and the rear end of the carrying platform is provided with a pneumatic cylinder, and the front end of the protruding cylinder rod can be pushed forward and forwarded to the yaw wheel, so that the urging end Pressed down and pushed down, so that the pinch end is opened. The stripping device of the wafer of claim 8, wherein the rear end of the carrying platform is provided with a sensing rod and a fixing seat, and the sensing rod extends through the fixing base and protrudes from the fixing seat, and senses The rod end can extend into the sensing section of the second sensing element disposed on the fixing seat, and a spring element formed by a spring is sleeved on the sensing rod between the rear end of the carrying platform and the fixing seat.