TWI675426B - Method and device for positioning wafer stripping process - Google Patents

Abstract

The invention relates to a positioning method and device for a wafer peeling process. The positioning method includes: pushing a wafer to be peeled out of a swinging mechanism of a peeling mechanism, which can be prepared to be peeled off. One of the foremost strip-shaped wafer portions is moved forward between a stamper and a die holder; the die and the mold holder are relatively displaced to restrict the foremost strip-shaped wafer portion to the stamper and the die. Positioning between mold bases; this makes the structure simple and easy to process, and the positioning is more reliable.

Description

Positioning method and device for wafer peeling process

The present invention relates to a positioning method and device, and more particularly to a positioning method and device for a wafer peeling process for peeling a wafer to be peeled into strip-shaped wafers in a wafer type resistor manufacturing process.

According to the general chip type resistors, a sheet-shaped wafer is usually used to process multiple layers of electroplated layers, and then peeled into strip-shaped wafers, and then stripped from strip-shaped wafers to form granular resistors. The equipment for forming stripe wafers is generally called a stacker, and the equipment for stripping stripe wafers into granular resistors is generally called a pelletizer; the process of stripping wafers from stripe wafers into stripe wafers can be obtained by referring to, for example, the applicant Patents such as the new M448052 "wafer stripping device", M445766 "wafer transfer device", M445761 "wafer collection device", and M445762 "wafer stacking device"; In the process of exfoliating wafers into strip-shaped wafers, the wafers are often placed in a peeling mechanism in, for example, the M448052 "wafer stripping device" on a pendulum and pushed by a pushing mechanism, so that the wafers are wafer-shaped. After the front end is positioned by a positioning device, the swinging seat of the stripping mechanism is driven to swing up and down by a link driven by an eccentric wheel, so that the portion of the sheet-shaped wafer that is positioned by the positioning device is stripped into a strip. Wafer; where The position device may be, for example, a transfer wheel in the M445766 "Transfer Device for Wafers", which is driven by a driving mechanism to be intermittently rotated; a plurality of slots are provided on the circumference of the transfer wheel, and the transfer wheel forms a The feeding side and the discharging side; the material enters the inserting groove on the feeding side of the conveying wheel, and is conveyed to the discharging side by the conveying wheel and is picked up by a collection device and stacked for collection.

However, in the prior art, the positioning device uses the slot of the transfer wheel as a positioning method, but the thickness of the chip-like wafer is relatively thin, and the slot of the corresponding transfer wheel must be relatively thin, so that the cost of processing the transfer wheel is considerable. High, and the accuracy of the slot must be quite accurate, otherwise the effect of the positioning of the clip is not easy to control, and it is easy to have blanking, which still needs to be improved.

That is, an object of the present invention is to provide a positioning method for a reliable wafer peeling process, which can make component processing and positioning easier.

Another object of the present invention is to provide a positioning device which can make the processing and positioning of components easier and more reliable.

Another object of the present invention is to provide a device for performing a positioning method such as the wafer peeling process.

The positioning method of the wafer peeling process according to the purpose of the present invention includes: pushing a wafer to be peeled out from a swinging mechanism capable of being operated and tilting up and down to make the front end ready to be peeled. A strip-shaped wafer portion is moved forward between a stamper and a mold holder; the stamper and the mold holder are relatively displaced to restrict the foremost strip-shaped wafer portion to be restricted between the stamper and the mold holder. Positioning.

A positioning device for a wafer peeling process according to another object of the present invention includes: disposed on the front end of a swing seat capable of being tilted up and down; including: an upper positioning mechanism provided with a stamper; a lower positioning mechanism provided with a The die seat is located below the die; the die and the die seat can be relatively displaced.

A positioning device for a wafer peeling process according to another object of the present invention includes: a device for performing the positioning method of the wafer peeling process as described, the device includes: A peeling mechanism, a stamper and a die holder which can restrict the strip wafer.

According to the positioning method and device of the wafer peeling process in the embodiment of the present invention, the structure of the stamper and the die holder is simple and easy to process, and the distance between the stamper and the die holder can be relatively displaced. When the strip-shaped wafer portion is moved forward between the stamper and the mold base, since the stamper is relatively opened with the mold base, the strip-shaped wafer portion is easily moved into alignment, and the stamper and the mold base are relatively closed. At this time, the most suitable front gap of the strip-shaped wafer portion can be restricted to the positioning between the stamper and the die holder, so that the positioning is more reliable.

A‧‧‧ Chip Chip

A1‧‧‧Resistance part

A2‧‧‧ Waste Department

A3‧‧‧Clamping section

A4‧‧‧side

A41‧‧‧Inner side

A42‧‧‧Outer side

A5‧‧‧side

A51‧‧‧Inner side

A52‧‧‧Outer side

A6‧‧‧Line marks

A7‧‧‧Strip chip

A8‧‧‧Bar Chip

B‧‧‧ stripping agency

B1‧‧‧Seat

B11‧‧‧ Pivot arm

B111‧‧‧Pivot

B12‧‧‧ Pivot arm

B13‧‧‧Conveyor

B2‧‧‧ Push Clip

B3‧‧‧carriage

B31‧‧‧Side Seat

B311‧‧‧Pneumatic connector

B312‧‧‧gas nozzle

B32‧‧‧base

B33‧‧‧side seat

B34‧‧‧Rear side seat

B35‧‧‧ rib

B4‧‧‧Box

B5‧‧‧Driver

B6‧‧‧eccentric wheel

B7‧‧‧ connecting rod

C‧‧‧Positioning device

C1‧‧‧up positioning mechanism

C11‧‧‧seat

C111‧‧‧ Upper Seat

C1111‧‧‧Sensor

C112‧‧‧Side frame

C113‧‧‧Side frame

C114‧‧‧space

C12‧‧‧up positioning module

C121‧‧‧Driver

C122‧‧‧Compression Mold

C1221‧‧‧shaft hole

C1222‧‧‧Disc washer

C1223‧‧‧ Upper end

C1224‧‧‧Pressed face

C1225‧‧‧Front side

C1226‧‧‧Guide groove

C1227 ‧‧‧ Buckle

C1228‧‧‧

C1229‧‧‧Inner edge

C123‧‧‧Driver

C1231‧‧‧ bevel

C1232‧‧‧ high

C1233‧‧‧ low

C1234‧‧‧step difference

C1235‧‧‧Sensor

C124‧‧‧ Pivot

C1241‧‧‧Head

C125‧‧‧Fixed

C1251‧‧‧stand

C1252‧‧‧Top Block

C1253‧‧‧ Clearance

C126‧‧‧fine-adjustment seat

C127‧‧‧slide

C1271‧‧‧Fixed parts

C1272‧‧‧roller

C128‧‧‧ bracket

C2‧‧‧Positioning mechanism

C21‧‧‧Mould base

C211‧‧‧Counterpart

C212‧‧‧Front side

C213‧‧‧Positioning Department

C214‧‧‧Induction hole

C215‧‧‧Sensor

C216‧‧‧ Rib

C217‧‧‧Rim

FIG. 1 is a schematic perspective view of a chip wafer in an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a part of a chip wafer in an embodiment of the present invention.

FIG. 3 is a schematic exploded perspective view of a chip wafer in an embodiment of the present invention.

FIG. 4 is an exploded perspective view of a wafer to be stripped in an embodiment of the present invention.

FIG. 5 is a schematic perspective view of the assembly of the positioning device and the peeling mechanism in the embodiment of the present invention.

FIG. 6 is an exploded perspective view of the positioning device and the peeling mechanism in the embodiment of the present invention.

FIG. 7 is a schematic perspective view of an upper positioning module according to an embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view of a part of a die and a fixing seat of an upper positioning module according to an embodiment of the present invention.

FIG. 9 is a schematic front view of a die set and a fixing seat of an upper positioning module according to an embodiment of the present invention.

FIG. 10 is a schematic partial perspective view of a stamper in an embodiment of the present invention.

11 is a schematic view of a buckle groove of a stamper in an embodiment of the present invention.

FIG. 12 is an exploded perspective view of the lower positioning mechanism provided on the carrier in the embodiment of the present invention.

13 is a perspective view of a part of a bar-shaped wafer placed on a die base of a lower positioning mechanism according to an embodiment of the present invention.

FIG. 14 is a partial schematic view of an upper alignment portion and a positioning portion of a die base of a lower positioning mechanism according to an embodiment of the present invention.

15 is a schematic diagram (1) of a peeling positioning operation of a wafer to be stripped in an embodiment of the present invention.

FIG. 16 is a schematic diagram (2) of a peeling positioning operation of a wafer to be stripped in an embodiment of the present invention.

Please refer to FIG. 1. In the embodiment of the present invention, the wafer used for peeling is a rectangular chip wafer A, which has a rectangular area and a resistive portion A1 with a laminated plating layer on the surface. In the order of folding, the X-axis front end of the resistance portion A1 forms a scrap portion A2 without a plating layer, and the X-axis rear end of the resistance portion A1 forms a clip portion A3 without a plating layer. A side of the non-layered plating layer A4 and A5, which are narrower than the scrap portion A2 and the clamping portion A3, are formed on both sides of the Y axis, respectively. In the embodiment of the present invention, the side edges A4 and A5 are respectively formed. Each section includes the inner sides A41 and A51 that rest on the resistance part A1, and the outer sides A42 and A52 that rest on the outside of the resistance part A1. Among them, the outer sides A42 and A52 include the resistance part A1, the waste part A2, and the clamp. The side part of the holding part A3, and the inner sides A41 and A51 only include the side part of the resistance part A1; the boundaries between the parts are shown in the chip wafers as shown in Figs. 1 and 2 respectively. A groove-like line mark A6 is scribed on the lower surface of A, and a line mark A6 of the lower surface of the resistance portion A1 shows A rectangular lattice (not shown) arranged in matrix, each of a rectangular grid of a resistive element, will next peeling resistance element folded granular cell.

Please refer to FIGS. 3 and 4. Before stripping the wafer A8 into strips, the embodiment of the present invention first executes the outer edges A42 and A52 of the sheet wafer A and the scrap part A2 as the parts to be stripped. And execute a process of peeling off the part to be stripped, so that after the sheet wafer A is stripped off the part to be stripped, the sheet wafer A is formed to include only the resistance part A1, the clamping part A3, and The wafer A7 to be stripped on the inner side A41 and A51. The wafer stripping process in the embodiment of the present invention is to peel the wafer A7 to be stripped to include a portion of the resistance portion A1 together with its two inner sides. A41, A51 are stripe-shaped wafers A8 in stripe areas.

Please refer to FIGS. 4 and 5. The positioning method and device of the wafer peeling process in the embodiment of the present invention are a peeling mechanism B that cooperates with the wafer A7 to be stripped into a strip-shaped wafer A8. Positioning; the peeling mechanism B includes: a swing seat B1 and a conveying direction of the wafer A7 to be peeled on the swing seat B1 is a push clip B2 located at the rear end of the swing seat B1, which can be moved forward and backward, and the swing The seat B1 is pivoted on the two side seats B31 on both sides of a carrier B3 by two pivot arms B11 and B12 on each side by a pivot portion B111. A space for the to-be-peeled is provided between the two pivot arms B11 and B12. The wafer A7 is placed in the conveying path B13 which can be pushed by the pusher clip B2. Below the carrier B3 is elevated by a side seat B33 and a back seat B34 standing on a base B32. The swing seat A base box B4 below B1 is provided with a material box B4 for holding the support A3 where the wafer A7 to be peeled is peeled off; the front end of the conveying path B13 of the swing seat B1 is provided with the positioning of the embodiment of the present invention. Device C, the pendulum seat B1 is driven by an eccentric wheel B6 driven by a driving member B5 in conjunction with a link B7 to drive the pendulum seat B1 to swing up and down. By placing the wafer A7 to be stripped behind the pendulum seat B1, The clamping portion A3 at the rear end of the strip wafer A7 is clamped by the push clip B2 and pushed forward along a straight pushing flow path until the front end of the strip wafer A7 is determined by the positioning device C. And by receiving the eccentric wheel drives the link B7 B6 drives the swing seat as B1, the rocking the article to be stripped A7 by the wafer positioning apparatus positioning portion C of the strip is folded stripped wafer A8.

Please refer to FIG. 6, a positioning device C for a wafer peeling process according to an embodiment of the present invention includes: an upper positioning mechanism C1 and a lower positioning mechanism C2, wherein: the upper positioning mechanism C1 is provided with a reed-shaped seat C11 and a An upper positioning module C12 provided on the seat frame C11; wherein, the seat frame C11 includes an upper seat frame C111 and two side frames C112 and C113 located on both sides of the upper seat frame C111, and the seat frame C11 uses the two sides Frames C112 and C113 are respectively fixed on two side seats B31 of the carrier B3; a space C114 is formed between the two side frames C112 and C113; the upper positioning module C12 includes a drive provided above the upper seat frame C111 A piece C121 and a stamper C122 in the space C114 provided between the two side frames C112 and C113 can be moved upward and downward by the driving member C121.

Please refer to FIG. 7. The driving member C121 in the upper positioning module C12 drives a cylindrical driving seat C123 below the upper seat C111 in a rotating manner. The cylindrical bottom end of the driving seat C123 forms a spiral shape. The circular bevel C1231 has a high C1232 and a low C1233. The high C1232 and the low C1233 form a difference C1234. The center of rotation of the drive base C123 is the Z axis. A cylindrical peripheral edge is provided with a sensing element C1235, and the sensing element C1235 is sensed by a sensor C1111 provided under the upper frame C111. The stamper C122 is provided on a fixed seat C125 with a pivoting member C124. Above the fixed seat C125 is a fine adjustment seat C126 which can be used for fine adjustment of the horizontal X and Y axis directions. The fine adjustment seat C126 is fixed above a slide seat C127 which can be moved up and down, so that the slide seat C127 can be linked with the Fine-adjustment seat C126, the fixed seat C125, and die C122 are moved up and down. One side of the slide seat C127 is fixed on a bracket C128 fixed at the upper end and the upper seat frame C111, and the other side is fixed by a fixing member 1271. A roller C1272 is provided thereon, and the rotation center of the roller C1272 It is in the X-axis direction; when the driving seat C123 is driven to rotate, the inclined surface C1231 at the bottom end of the driving seat C1232 can be pushed against the roller C1272, so that the roller C1272 can be linked with the slide C127, the fine adjustment seat C126, the fixed seat C125, The stamper C122 is moved up and down.

Please refer to FIGS. 8 and 9. The stamper C122 is fixed on a vertical Z-axis vertical stand C1251 of the fixed seat C125 by screwing the pivot member C124 such as a bolt in a horizontal X-axis direction. The piece C124 is located at about the center of the Y-axis width of the stamper C122, and the pivotal member C124 passes through a shaft hole C1221 of the stamper C122 in a pivoted state, and only the pivotal member A head C1241 at one end of C124 squeezes the dish washer C1222 when the other end is screwed into the stand C1251 with appropriate tightness, and the upper end C1223 of the die C122 and a horizontal top seat C1252 of the fixed seat C125 are pressed. Maintaining a small gap C1253, so that a pressing surface C1224 at the bottom of the die C122 can make a proper arc deflection around the pivot member C124 when a force is exerted on one side.

Please refer to FIGS. 9 to 11. The front side C1225 of the stamper C122 is provided with two Z-axis groove-shaped guide grooves C1226 near the edges of the two sides; the pressing surface C1224 of the stamper C122 is near the front side. C1225 is provided with a concave Y-axis buckle groove C1227. The buckle groove C1227 and the front side C1225 are provided with a convex mold C1228. The bottom surface of the mold C1228 is flat and higher than the pressing surface. The plane of C1224 has a step difference that is slightly greater than the thickness of the strip-shaped wafer A8; the buckle groove C1227 forms an inclined inner edge C1229 on the other side of the die C1228; the bottom end of the guide groove C1226 Intersect with this buckle groove C1227.

Please refer to FIGS. 5 and 12. The lower positioning mechanism C2 is provided with a substantially rectangular cube-shaped mold base C21. The mold base C21 is disposed on a rib B35 of the carrier B3 and disposed between the two side seats B31. It is located between the two side seats B31 and correspondingly located in the forward direction of the swing seat B1 in the conveying direction; the upper surface of the mold seat C21 is provided with a Y-axis long convex-shaped alignment portion C211, so that the Between the alignment portion C211 and the front side C212 of the mold base C21, a horizontal strip-shaped positioning portion C213 having a width approximately equal to the X-axis width of the strip-shaped wafer A8 and lower than the alignment portion C211 is formed. ; There is a gas pressure connector B311 on the outside of the side seat B31 of the carrier B3, and a pressure source can be connected to provide gas from the air nozzle B312 on the pivot portion B111 at the side seat B31 to blow toward the positioning portion C213 Clean it.

Please refer to FIGS. 12 and 13. The Y-axis length of the strip wafer A8 is longer than the mold base C21 and the positioning portion C213, and the inner sides A41 and A51 of the strip wafer A8 are exposed to the mold base C21 and The positioning portion C213 is outside of both sides; the alignment portion C211 is provided with two Z-axis sensing holes C214 near the edges of the two sides, and the rib B35 of the carrier B3 is provided with a spaced interval in the Y1 axis. Two sensing elements C215, which can be detected in the Z-axis direction through the sensing hole C214 in the alignment portion C211 of the mold base C21 to detect the condition of the strip wafer A8 on the positioning portion C213.

Please refer to FIG. 14, the alignment portion C211 forms a lower front, up and down rib C216 inclined backward at an angle of θ toward one side of the positioning portion C213, and the alignment portion C211 faces another position opposite to the positioning portion C213. An inclined outer edge C217 is formed on one side.

Please refer to FIGS. 13 and 15, when the strip wafer A7 to be stripped is pushed forward from the swing base B1, the strip-shaped wafer A8 which is ready to be stripped is moved forward to the lower position of the positioning device C. On the positioning portion C213 of the mold base C21 in the mechanism C2, the front end of the strip-shaped wafer A8 stops against the rib C216, and at the same time, as shown in FIGS. 10 and 13, the induction member C215 passes through the bottom of the guide groove C1226. The end and the intersection of the buckle slot C1227 pass through the guide slot C1226 upwards to perform a detection procedure for the placement status of the strip wafer A8; see FIG. 16, and then the upper positioning mechanism C1 drives the stamper. C122 is pressed down, so that the pressing surface C1224 of the stamper C122 abuts the upper surface of the die holder C21 in the lower positioning mechanism C2, and buckles the positioning portion C211 with the buckle groove C1227. At this time, the stamper The pressing surface C1224 of C122 can freely swing under the force provided by the pivot member C124 in FIG. 9. On the one hand, it can abut against the upper surface of the mold base C21 on the other hand, and on the other hand, it can make the pressing mold. C1228 The bottom surface of the strip-shaped wafer A8 is abutted but not pressed against the positioning portion C213, so that the strip-shaped wafer A8 is restricted to the positioning portion C213. The square and the bottom surface of the die C1228 are positioned, and then the pendulum seat B1 is driven and tilted up and down to peel the strip-shaped wafer A8 at the forefront, and the stripped wafer A8 is left in place. Between the top of the positioning portion C213 and the bottom surface of the die C1228.

The positioning method and device for the wafer peeling process in the embodiment of the present invention, because the stamper C122 and the die holder C21 have a simple structure and are easy to process, and the distance between the stamper C122 and the die holder C21 can be relatively displaced. When the portion of the wafer A8 is moved forward between the stamper C122 and the die holder C21, since the stamper C122 and the die holder C21 are relatively opened, the stripe wafer A8 is easily moved into alignment, and the stamper C122 and When the mold base C21 is relatively closed, it can be optimally placed. The gap restricts the foremost part of the strip-shaped wafer A8 to the positioning between the stamper C122 and the die holder C21, so that the positioning is more reliable.

However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the description of the invention, All are still within the scope of the invention patent.

Claims (17)

A positioning method for a wafer peeling process includes: pushing a wafer to be peeled out from a swinging mechanism capable of being operated and tilting up and down to make one of the foremost strip-shaped wafers ready to be peeled. The part is moved forward between a stamper and a die holder; the stamper and the die holder are relatively displaced to restrict the foremost strip-shaped wafer portion to be positioned between the stamper and the die holder. For example, the positioning method of the wafer peeling process described in item 1 of the scope of the patent application, wherein the die can be moved up and down; the die seat is set at a fixed position. According to the positioning method of the wafer peeling process described in item 1 of the scope of patent application, when the stamper and the die seat are relatively displaced, the stamper can be forced to swing. The positioning method of the wafer peeling process according to item 1 of the scope of the patent application, further comprising a pair of positioning portions on the mold base for the strip-shaped wafer portion to perform a cleaning process of blowing air. According to the positioning method of the wafer peeling process described in item 1 of the scope of the patent application, it further includes a procedure for detecting the position of the strip-shaped wafer portion on a positioning portion on a mold base by using an induction component. A positioning device for a wafer peeling process is provided at the front end of a swing seat that can be used as an upper and lower swing; including: an upper positioning mechanism provided with a stamper; a lower positioning mechanism provided with a mold seat under the stamper; The pressing die and the die base can be relatively displaced. For example, the positioning device of the wafer peeling process described in item 6 of the patent application scope, wherein the upper positioning mechanism is provided with a frame and an upper positioning module provided on the seat frame; the seat frame includes a The upper seat frame and two side frames located on both sides of the upper seat frame; the upper positioning module includes a driving member disposed above the upper seat frame and the stamper driven between the two side frames and driven by the driving member. According to the positioning device of the wafer peeling process described in item 7 of the scope of patent application, wherein the driving member in the upper positioning module drives a driving seat below the upper seat in a rotating manner, and a bottom edge of the driving seat A helical annular inclined surface is formed to push against a roller, so that the stamper is displaced up and down. According to the positioning device of the wafer peeling process described in item 8 of the scope of the patent application, wherein a periphery of the driving base is provided with a sensing element, and the sensing element is sensed by a sensor. According to the positioning device of the wafer peeling process described in claim 6 of the patent application scope, wherein the stamper is provided on a fixed base by a pivot joint, a pressing surface at the bottom of the stamper can be stressed on one side When the pivot joint is used as the center, an appropriate arc-shaped deflection can be made; a fine adjustment seat which can be used for fine adjustment of the horizontal X and Y axis directions is arranged above the fixed seat. For example, the positioning device of the wafer peeling process described in claim 10 of the patent scope, wherein the upper part of the fine adjustment base is fixed on a slide base which can be moved up and down, so that the slide base can be linked with the fine adjustment base and the fixed position. Displacement of seat and die. For example, the positioning device of the wafer peeling process described in claim 11 of the patent application scope, wherein the upper positioning mechanism is provided with a frame, the seat frame includes an upper seat frame and two side frames on both sides of the upper seat frame, and the slide seat One side is fixed on a bracket fixed on the upper end and under the upper seat frame, and a roller is arranged on the other side with a fixing member. For example, the positioning device of the wafer peeling process according to item 11 of the patent application scope, wherein the front side of the stamper is provided with a guide groove; and the die base is provided with a sensing element for detection. The positioning device of the wafer peeling process according to item 6 of the patent application scope, wherein: A pressing groove of the pressing die is provided with a buckling groove near a front side, and a buckling die is provided between the buckling groove and the front side; the upper surface of the die seat is provided with a pair of positioning portions, and the positioning portion and the die seat are provided. A positioning portion is provided between a front side surface. According to the positioning device of the wafer peeling process described in item 11 of the scope of the patent application, the mold base is located on a carrier and located between two side bases, and is fixedly positioned in front of the swing base in the conveying direction. According to the positioning device of the wafer peeling process described in claim 15 of the scope of the patent application, the side seat of the carrier can be connected to a pressure source to provide gas from the side seat toward a positioning portion of the mold seat. clean. A positioning device for a wafer peeling process, comprising: a device for performing a positioning method for a wafer peeling process as described in any one of claims 1 to 5 of the scope of patent application, the device includes: A peeling mechanism of a pendulum seat can restrain a die and a die seat of the strip-shaped wafer.