TWI833453B - Two-phase immersion heat-dissipating device with strengthened fins - Google Patents
Two-phase immersion heat-dissipating device with strengthened fins Download PDFInfo
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- 238000007654 immersion Methods 0.000 title abstract description 8
- 238000009826 distribution Methods 0.000 claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims description 63
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000002003 electron diffraction Methods 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 239000000110 cooling liquid Substances 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000005242 forging Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000001887 electron backscatter diffraction Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 9
- 238000001816 cooling Methods 0.000 description 8
- 238000000635 electron micrograph Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000002826 coolant Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明涉及一種散熱裝置，具體來說是涉及一種兩相浸沒式散熱裝置，其具有經過預變形處理的薄型散熱鰭片。 The present invention relates to a heat dissipation device, and in particular to a two-phase immersed heat dissipation device having pre-deformed thin heat dissipation fins.
浸沒式冷卻(immersion cooling)技術是將發熱元件(如伺服器、磁碟陣列等)直接浸沒在不導電的冷卻液中，以透過冷卻液吸熱氣化帶走發熱元件運作所產生之熱能。 Immersion cooling technology is to immerse heating components (such as servers, disk arrays, etc.) directly in non-conductive coolant, so that the heat energy generated by the operation of the heating components can be taken away through the coolant absorbing heat and vaporizing it.
一般的散熱裝置能採用薄型散熱鰭片以增加散熱面積，然而，兩相浸沒式散熱裝置不容易搭配薄型散熱鰭片。其原因在於，厚度薄且較高的散熱鰭片的結構強度較低而容易變形翹曲。浸沒式冷卻技術在散熱過程會產生大量氣泡，在散熱鰭片之間的氣泡會產生側向推擠力，而導致散熱鰭片變形翹曲。因此，如何確保得知具有薄型散熱鰭片的散熱裝置能應用於浸沒式冷卻技術進行散熱，而不受到氣泡推擠變形，是本發明所欲解決的問題。 General heat dissipation devices can use thin heat dissipation fins to increase the heat dissipation area. However, two-phase immersed heat dissipation devices are not easy to match with thin heat dissipation fins. The reason is that thin and tall heat dissipation fins have low structural strength and are prone to deformation and warping. Immersion cooling technology will produce a large number of bubbles during the heat dissipation process. The bubbles between the heat dissipation fins will generate lateral pushing forces, causing the heat dissipation fins to deform and warp. Therefore, how to ensure that a heat dissipation device with thin heat dissipation fins can be used in immersion cooling technology to dissipate heat without being pushed and deformed by bubbles is a problem that the present invention aims to solve.
本發明所要解決的技術問題在於，針對現有技術的不足提供一種具強化型鰭片的兩相浸沒式散熱裝置，以解決上述的缺失。 The technical problem to be solved by the present invention is to provide a two-phase immersed heat dissipation device with reinforced fins to solve the deficiencies of the prior art.
為了解決上述的技術問題，本發明所採用的其中一技術方案 是，提供一種具強化型鰭片的兩相浸沒式散熱裝置，其包括一散熱基底及複數個強化型鰭片。所述散熱基底具有第一表面及第二表面，所述第二表面被規劃用以接觸浸沒於兩相冷卻液的發熱元件，所述第一表面與所述第二表面相對且遠離所述發熱元件。所述複數個強化型鰭片一體成型地設置於所述散熱基底的所述第一表面，每一所述強化型鰭片的厚度小於1公厘。其中所述強化型鰭片與所述散熱基底具有不同的微結構，依據背向散射電子繞射的掃描圖譜，該強化型鰭片的局部方位差角分布數值的中位數大於該散熱基底的局部方位差角分布數值的中位數的1.6倍。 In order to solve the above technical problems, one of the technical solutions adopted by the present invention is Yes, a two-phase immersed heat dissipation device with reinforced fins is provided, which includes a heat dissipation base and a plurality of reinforced fins. The heat dissipation base has a first surface and a second surface. The second surface is designed to contact the heating element immersed in the two-phase cooling liquid. The first surface is opposite to the second surface and away from the heat generating element. element. The plurality of reinforced fins are integrally provided on the first surface of the heat dissipation base, and the thickness of each reinforced fin is less than 1 mm. The enhanced fins and the heat dissipation base have different microstructures. According to the backscattered electron diffraction scanning pattern, the median of the local azimuth difference angular distribution values of the enhanced fins is greater than that of the heat dissipation base. 1.6 times the median of the local azimuth angle distribution value.
在一優選實施例中，所述散熱基底的材料為銅、或銅合金、或鋁合金所製成。 In a preferred embodiment, the heat dissipation base is made of copper, copper alloy, or aluminum alloy.
在一優選實施例中，所述複數個強化型鰭片的材料為銅、或銅合金、或鋁合金製成。 In a preferred embodiment, the plurality of reinforced fins are made of copper, copper alloy, or aluminum alloy.
在一優選實施例中，所述複數個強化型鰭片為片狀或柱狀。 In a preferred embodiment, the plurality of reinforced fins are in the shape of sheets or columns.
在一優選實施例中，所述複數個強化型鰭片以其中下列一項的製造方式而成：彎折成型，鍛壓成型、或擠壓成型。 In a preferred embodiment, the plurality of reinforced fins are made by one of the following manufacturing methods: bending forming, forging forming, or extrusion forming.
在一優選實施例中，所述背向散射電子繞射的掃描圖譜，計算範圍為3乘3的像素方格，依核心像素與相鄰的其他像素的方位角計算平均差異，其中該方位角小於5度。 In a preferred embodiment, the calculation range of the backscattered electron diffraction scanning pattern is a 3×3 pixel grid, and the average difference is calculated based on the azimuth angles of the core pixel and other adjacent pixels, where the azimuth angle less than 5 degrees.
在一優選實施例中，所述局部方位差角分布數值的中位數為1.5到3之間。 In a preferred embodiment, the median value of the local azimuth difference angle distribution is between 1.5 and 3.
在一優選實施例中，所述強化型鰭片的厚度與兩個相鄰的所述強化型鰭片的間距比例介於0.7至1.5之間。 In a preferred embodiment, the ratio of the thickness of the reinforced fin to the spacing between two adjacent reinforced fins is between 0.7 and 1.5.
在一優選實施例中，所述強化型鰭片的高度為所述強化型鰭片的厚度30倍以上。 In a preferred embodiment, the height of the reinforced fin is more than 30 times the thickness of the reinforced fin.
在一優選實施例中，所述強化型鰭片的長度為所述強化型鰭片的厚度450倍以上。 In a preferred embodiment, the length of the reinforced fin is more than 450 times the thickness of the reinforced fin.
本發明的其中一有益效果在於，本發明所提供的具強化型鰭片的兩相浸沒式散熱裝置，其中“所述強化型鰭片與散熱基底具有不同的微結構，依據背向散射電子繞射的掃描圖譜，該強化型鰭片的局部方位差角分布數值的中位數大於該散熱基底的局部方位差角分布數值的中位數的1.6倍”能確保鰭片的結構強度，以及具有薄型散熱鰭片的散熱裝置能應用於浸沒式冷卻技術。藉此利用鰭片的高表面積特性散熱，以提升垂直方向的熱傳導性能。 One of the beneficial effects of the present invention is the two-phase immersed heat dissipation device with reinforced fins provided by the present invention, in which "the reinforced fins and the heat dissipation base have different microstructures. According to the scanning pattern of the radiation, the median of the local azimuth angle distribution value of the enhanced fin is greater than 1.6 times the median of the local azimuth angle distribution value of the heat dissipation base, which can ensure the structural strength of the fin and have The heat dissipation device with thin fins can be applied to immersion cooling technology. This utilizes the high surface area characteristics of the fins to dissipate heat and improve the heat conduction performance in the vertical direction.
為使能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本發明加以限制。 In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.
100:散熱裝置 100: Cooling device
10:散熱基底 10:Heat dissipation base
11:第一表面 11: First surface
12:第二表面 12: Second surface
13:強化型鰭片 13: Reinforced fins
D:厚度 D:Thickness
H:高度 H: height
L:長度 L: length
P:間距 P: pitch
P1、P2:降伏點 P1, P2: surrender point
L1、L2:曲線 L1, L2: curve
9:發熱元件 9: Heating element
圖1為本發明具強化型鰭片的兩相浸沒式散熱裝置的立體圖。 Figure 1 is a perspective view of a two-phase immersed heat sink with reinforced fins according to the present invention.
圖2A為本發明的散熱基底的電子顯微相片。 Figure 2A is an electron micrograph of the heat dissipation substrate of the present invention.
圖2B是由圖2A中具有高方向位差角(大於5度)擷取的相片。 Figure 2B is a photo captured from Figure 2A with a high directional disparity angle (greater than 5 degrees).
圖3為本發明的顯示散熱基底局部方位差角的數值分佈狀態圖。 Figure 3 is a numerical distribution state diagram showing the local azimuth angle of the heat dissipation substrate according to the present invention.
圖4A為本發明的強化型鰭片的電子顯微相片。 Figure 4A is an electron micrograph of the reinforced fin of the present invention.
圖4B是由圖4A中具有高方向位差角(大於5度)擷取的相片。 Figure 4B is a photo captured from Figure 4A with a high directional disparity angle (greater than 5 degrees).
圖5為本發明的強化型鰭片的局部方位差角的數值分佈狀態圖。 Figure 5 is a numerical distribution state diagram of the local azimuth angle of the reinforced fin of the present invention.
圖6A為本發明的散熱基底再放大的電子顯微相片。 FIG. 6A is an enlarged electron micrograph of the heat dissipation substrate of the present invention.
圖6B是由圖6A中具有高方向位差角(大於5度)擷取出的相片。 Figure 6B is a photo captured from Figure 6A with a high directional disparity angle (greater than 5 degrees).
圖7是本發明的散熱基底的局部方位差角的數值分佈狀態圖。 Figure 7 is a numerical distribution state diagram of the local azimuth angle of the heat dissipation substrate of the present invention.
圖8A是本發明的強化型鰭片再放大的電子顯微相片。 Figure 8A is an enlarged electron micrograph of the reinforced fin of the present invention.
圖8B是由圖8A中具有高方向位差角(大於5度)擷取出的相片。 Figure 8B is a photo captured from Figure 8A with a high directional disparity angle (greater than 5 degrees).
圖9是本發明的強化型鰭片的局部方位差角的數值分佈狀態圖。 Figure 9 is a numerical distribution diagram of the local azimuth angle of the reinforced fin of the present invention.
圖10是本發明的鰭片在預變形前後的應變應力曲線圖。 Figure 10 is a strain stress curve of the fin of the present invention before and after pre-deformation.
以下是通過特定的具體實施例來說明本發明所公開的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。 The following is a specific example to illustrate the disclosed embodiments of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention.
參閱圖1所示，本發明第一實施例提供一種具強化型鰭片的兩相浸沒式散熱裝置100，用於接觸浸沒於兩相冷卻液中的發熱元件9。以下或簡稱兩相浸沒式散熱裝置100。更具體的說，本實施例提供一種高導熱的基底與高強度的鰭片的兩相浸沒式複合型散熱結構，其包括一散熱基底10、及複數個強化型鰭片13。強化型鰭片13與散熱基底10具有不同的微結構。 Referring to FIG. 1 , a first embodiment of the present invention provides a two-phase immersed heat sink 100 with reinforced fins for contacting the heating element 9 immersed in the two-phase cooling liquid. The two-phase immersed heat dissipation device 100 will be referred to as below. More specifically, this embodiment provides a two-phase immersed composite heat dissipation structure with a high thermal conductivity base and high strength fins, which includes a heat dissipation base 10 and a plurality of reinforced fins 13 . The reinforced fins 13 and the heat dissipation base 10 have different microstructures.
散熱基底10可採用高導熱性材所製成，例如銅、銅合金或鋁合金。進一步說，散熱基底10可呈板狀且具有彼此背對的第一表面11及第二表面12。第二表面11被規劃用以接觸浸沒於兩相冷卻液的發熱元件9。第一表面11與第二表面12相對且遠離該發熱元件9。發熱元件9是浸沒於兩相冷卻液(圖略)，上述“接觸”可以是直接接觸或是透過中介層(圖略)形成間接接觸(熱接觸)。 The heat dissipation substrate 10 can be made of a material with high thermal conductivity, such as copper, copper alloy or aluminum alloy. Furthermore, the heat dissipation substrate 10 may be plate-shaped and have a first surface 11 and a second surface 12 facing away from each other. The second surface 11 is designed to contact the heating element 9 immersed in the two-phase cooling liquid. The first surface 11 is opposite to the second surface 12 and away from the heating element 9 . The heating element 9 is immersed in a two-phase cooling liquid (not shown), and the above-mentioned "contact" can be direct contact or indirect contact (thermal contact) through an intermediary layer (not shown).
複數個強化型鰭片13，一體成型地設置於所述散熱基底10的第 一表面11。本實施例中，複數個強化型鰭片13為薄型鰭片，每一強化型鰭片13的厚度小於1公厘，其範圍可以是介於0.5公厘至1公厘之間。較佳的，強化型鰭片13的厚度小於0.5公厘。上述「強化型」是指鰭片經過一些預變形處理以加強鰭片抵抗變形的強度。 A plurality of reinforced fins 13 are integrally provided on the third side of the heat dissipation base 10 One surface 11. In this embodiment, the plurality of enhanced fins 13 are thin fins, and the thickness of each enhanced fin 13 is less than 1 mm, and may range from 0.5 mm to 1 mm. Preferably, the thickness of the reinforced fins 13 is less than 0.5 mm. The above-mentioned "enhanced type" means that the fins have undergone some pre-deformation processing to enhance the strength of the fins to resist deformation.
本實施例的強化型鰭片13可以是由銅、或銅合金、或鋁合金等金屬製成，並且強化型鰭片13可以是以彎折成型，鍛壓成型、或擠壓成型等方式所形成。強化型鰭片13可以是柱狀鰭片(pin fin)或片狀鰭片(plate fin)。強化型鰭片13的厚度小於1公厘(mm)。在片狀鰭片的實施例中，優選的，強化型鰭片13的高度H為強化型鰭片13的厚度D的15倍以上。舉例說明，強化型鰭片13的厚度D小於0.5公厘時，其高度H可以是大於7.5公厘。此外，強化型鰭片13的長度L為強化型鰭片13的厚度200倍以上。舉例說明，強化型鰭片13的厚度D小於0.5公厘時，其長度L可以是大於10公分。避免鰭片的高度過高或長度過長而結構強度不足以抵抗在浸沒式冷卻中所產生的應力。 The reinforced fins 13 in this embodiment may be made of metal such as copper, copper alloy, or aluminum alloy, and the reinforced fins 13 may be formed by bending, forging, or extrusion. . The reinforced fins 13 may be pin fins or plate fins. The thickness of the reinforced fin 13 is less than 1 millimeter (mm). In the embodiment of sheet-like fins, preferably, the height H of the reinforced fin 13 is more than 15 times the thickness D of the reinforced fin 13 . For example, when the thickness D of the reinforced fin 13 is less than 0.5 mm, its height H may be greater than 7.5 mm. In addition, the length L of the reinforced fin 13 is more than 200 times the thickness of the reinforced fin 13 . For example, when the thickness D of the reinforced fin 13 is less than 0.5 mm, its length L may be greater than 10 cm. Avoid fins that are too high in height or too long to have sufficient structural strength to withstand the stresses generated during immersion cooling.
補充說明，強化型鰭片13的厚度D與兩個相鄰的強化型鰭片13的間距P比例介於0.7至1.5之間。舉例說明，強化型鰭片13的厚度D小於0.5公厘時，兩個相鄰的強化型鰭片13的間距P介於0.35公厘(0.5*0.7)至0.75公厘(0.5*1.5)之間。 It should be added that the ratio of the thickness D of the reinforced fin 13 to the distance P between two adjacent reinforced fins 13 is between 0.7 and 1.5. For example, when the thickness D of the reinforced fins 13 is less than 0.5 mm, the distance P between two adjacent reinforced fins 13 is between 0.35 mm (0.5*0.7) and 0.75 mm (0.5*1.5). between.
以下以銅材料製成的散熱裝置100，依據背向散射電子繞射的掃描圖譜說明，本實施例的強化型鰭片13經過處理後的技術特徵，強化型鰭片13與散熱基底10具有不同的微結構，強化型鰭片13的結構強度適用於接觸浸沒於兩相冷卻液的發熱元件9。 The following is a heat dissipation device 100 made of copper material. Based on the backscattered electron diffraction scanning pattern, the technical characteristics of the enhanced fins 13 of this embodiment after processing are explained. The enhanced fins 13 and the heat dissipation substrate 10 have different characteristics. The structural strength of the reinforced fins 13 is suitable for contacting the heating element 9 immersed in the two-phase coolant.
關於背向散射電子繞射技術(Electron Back Scatter Diffraction,EBSD)是一種利用繞射電子束來鑑別金屬的結晶方位的技術。本實施例將待觀察的散熱裝置，掛載在掃描式電子顯微鏡(Scanning Electron Microscopy, SEM)中，加速後的電子束射入散熱裝置100的基底或鰭片，產生反彈的背向散射電子，經過表面晶體結構繞射，攜帶著散熱裝置100的基底或鰭片表面的晶粒方位的資訊，進入探測器中，藉此判斷其每一顆晶粒的方向性。在知道每一顆晶粒的方位後，可應用於判斷應變(strain)或其他資訊。 About Electron Back Scatter Diffraction (EBSD) is a technology that uses diffracted electron beams to identify the crystallographic orientation of metals. In this embodiment, the heat dissipation device to be observed is mounted on a scanning electron microscope (Scanning Electron Microscopy, In SEM), the accelerated electron beam is injected into the base or fins of the heat sink 100, generating rebound backscattered electrons, which are diffracted by the surface crystal structure and carry the grain orientation of the base or fin surface of the heat sink 100. The information enters the detector to determine the directionality of each grain. After knowing the orientation of each grain, it can be used to determine strain or other information.
判斷的方法，是以軟體計算晶粒的方位差角(Misorientation)，主要分成兩種，第一種是Grain Average Misorientation(GAM)，第二種是Kernel Average Misorientation,(KAM)。GAM是以晶粒為單位進行的方位差角計算。KAM，或稱“核平均偏差”，是以掃描的像素(pixel)為單位，對周圍相鄰的像素進行評估，以確定中心點像素(pixel)方位的評估方法。換句話說，KAM方法是計算內核中心點與內核中所有周圍點之間的偏差並取平均值，得到中心點的局部偏差值。本實施例採用KAM方法，取像的單位為3*3像素(1μm*1μm)。 The method of judgment is to use software to calculate the misorientation of the grain, which is mainly divided into two types. The first is Grain Average Misorientation (GAM), and the second is Kernel Average Misorientation (KAM). GAM is the calculation of azimuth angle in grain units. KAM, or "kernel average deviation", is an evaluation method that uses the scanned pixel as the unit to evaluate the surrounding adjacent pixels to determine the orientation of the central point pixel. In other words, the KAM method calculates the deviation between the kernel center point and all surrounding points in the kernel and averages it to obtain the local deviation value of the center point. This embodiment adopts the KAM method, and the unit of image acquisition is 3*3 pixels (1μm*1μm).
如圖2A、圖2B及圖3所示，其中圖2A為散熱基底的電子顯微相片，圖2B是由圖2A中具有高方向位差角(大於5度)擷取出的相片。經過軟體分析後，如圖3所示，顯示散熱基底的局部方位差角的數值分佈狀態圖，其中的橫軸顯示0到5度，縱軸顯示分佈比例。 As shown in Figures 2A, 2B and 3, Figure 2A is an electron micrograph of the heat dissipation substrate, and Figure 2B is a photo taken from Figure 2A with a high directional disparity angle (more than 5 degrees). After software analysis, as shown in Figure 3, the numerical distribution state diagram of the local azimuth angle of the heat dissipation base is displayed. The horizontal axis shows 0 to 5 degrees, and the vertical axis shows the distribution ratio.
如圖4A、圖4B及圖5所示，其中圖4A為強化型鰭片的電子顯微相片，圖4B是由圖4A中具有高方向位差角(大於5度)擷取出的相片。經過軟體分析後，如圖5所示，顯示強化型鰭片的局部方位差角的數值分佈狀態圖。 As shown in Figures 4A, 4B and 5, Figure 4A is an electron micrograph of the reinforced fin, and Figure 4B is a photo taken from Figure 4A with a high directional disparity angle (greater than 5 degrees). After software analysis, as shown in Figure 5, the numerical distribution state diagram of the local azimuth angle of the enhanced fin is displayed.
如圖6A、圖6B及圖7所示，其中圖6A為散熱基底再放大的電子顯微相片，圖6B是由圖6A中具有高方向位差角(大於5度)擷取出的相片。經過軟體分析後，如圖7所示，顯示散熱基底的局部方位差角的數值分佈狀態圖，其中的橫軸顯示0到5度，縱軸顯示分佈比例。 As shown in Figures 6A, 6B and 7, Figure 6A is an enlarged electron micrograph of the heat dissipation substrate, and Figure 6B is a photo taken from Figure 6A with a high directional disparity angle (more than 5 degrees). After software analysis, as shown in Figure 7, the numerical distribution state diagram of the local azimuth angle of the heat dissipation base is displayed. The horizontal axis shows 0 to 5 degrees, and the vertical axis shows the distribution ratio.
如圖8A、圖8B及圖9所示，其中圖8A為強化型鰭片再放大的電 子顯微相片，圖8B是由圖8A中具有高方向位差角(大於5度)擷取出的相片。經過軟體分析後，如圖9所示，顯示強化型鰭片的局部方位差角的數值分佈狀態圖。 As shown in Figure 8A, Figure 8B and Figure 9, Figure 8A shows the enlarged electric circuit of the reinforced fin. Submicrograph, Figure 8B is a photo taken from Figure 8A with a high directional disparity angle (greater than 5 degrees). After software analysis, as shown in Figure 9, the numerical distribution state diagram of the local azimuth angle of the enhanced fin is displayed.
其中，上述背向散射電子繞射的掃描圖譜，計算範圍為3乘3的像素方格，依核心像素與相鄰的其他像素的方位角計算平均差異，其中該方位角小於5度。 Among them, the calculation range of the above-mentioned backscattered electron diffraction scanning pattern is a 3×3 pixel grid, and the average difference is calculated based on the azimuth angle between the core pixel and other adjacent pixels, where the azimuth angle is less than 5 degrees.
由上述圖式，可觀察得知，本實施中，強化型鰭片的局部方位差角分布數值的中位數為1.5度到3度之間。 From the above diagram, it can be observed that in this implementation, the median value of the local azimuth difference angle distribution value of the reinforced fin is between 1.5 degrees and 3 degrees.
再進一步分析，強化型鰭片13的局部方位差角分布數值的中位數大於所述散熱基底10的局部方位差角分布數值的中位數的1.6倍。 Further analysis shows that the median value of the local azimuth difference angular distribution of the reinforced fins 13 is greater than 1.6 times the median value of the local azimuth difference angular distribution of the heat dissipation base 10 .
請參閱圖10，顯示本創作的鰭片在預變形前後的應變應力曲線圖。其中下方的曲線L1表示一對照組的無預變形的鰭片，上方的曲線L2表示本創作的有預變形的鰭片。明顯的，曲線L2的降伏點P2大於曲線L1的降伏點P1。換句話說，本創作的強化型鰭片13具有較強的結構強度，可以承受較大的應力。 Please refer to Figure 10, which shows the strain stress curve of the fin of this creation before and after pre-deformation. The lower curve L1 represents the fins of a control group without pre-deformation, and the upper curve L2 represents the pre-deformed fins of the present invention. Obviously, the yield point P2 of the curve L2 is greater than the yield point P1 of the curve L1. In other words, the reinforced fin 13 of the present invention has strong structural strength and can withstand greater stress.
綜上，本實施例的具強化型鰭片的兩相浸沒式散熱裝置100，接觸浸沒在兩相冷卻液中的發熱元件(發熱元件)，發熱元件所產生的熱能可以散發至散熱基底10，並將熱能快速傳給散熱基底10上的強化型鰭片13。強化型鰭片13具有較強的結構強度，可以抵抗兩相冷卻液的氣泡的推擠力量。藉此，利用兩相冷卻液吸熱氣化將高熱導率的強化型鰭片13吸收的熱能帶走。 In summary, the two-phase immersed heat sink 100 with reinforced fins of this embodiment contacts the heating element (heating element) immersed in the two-phase cooling liquid, and the heat energy generated by the heating element can be dissipated to the heat dissipation base 10. And the heat energy is quickly transferred to the reinforced fins 13 on the heat dissipation base 10 . The reinforced fins 13 have strong structural strength and can resist the pushing force of the bubbles of the two-phase coolant. Thereby, the heat energy absorbed by the reinforced fins 13 with high thermal conductivity is taken away by utilizing the heat absorption and vaporization of the two-phase coolant.
[實施例的有益效果] [Beneficial effects of the embodiment]
本發明的其中一有益效果在於，本發明所提供的具強化型鰭片的兩相浸沒式散熱裝置，其中“依據背向散射電子繞射的掃描圖譜，該強化型鰭片的局部方位差角分布數值的中位數大於該散熱基底的局部方位差角 分布數值的中位數的1.6倍”能確保鰭片的結構強度，以及具有薄型散熱鰭片的散熱裝置能應用於浸沒式冷卻技術，不受到氣泡推擠變形。藉此利用鰭片的高表面積特性散熱，以提升垂直方向的熱傳導性能。 One of the beneficial effects of the present invention is that in the two-phase immersed heat dissipation device with reinforced fins provided by the present invention, "according to the scanning pattern of backscattered electron diffraction, the local azimuth difference angle of the reinforced fins The median of the distribution value is greater than the local azimuth angle of the heat dissipation base "1.6 times the median of the distribution value" can ensure the structural strength of the fins, and the heat sink with thin heat dissipation fins can be used in immersion cooling technology without being pushed and deformed by the bubbles. This can take advantage of the high surface area of the fins Features heat dissipation to improve heat conduction performance in the vertical direction.
以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的申請專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的申請專利範圍內。 The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.
100:散熱裝置 100: Cooling device
10:散熱基底 10:Heat dissipation base
11:第一表面 11: First surface
12:第二表面 12: Second surface
13:強化型鰭片 13: Reinforced fins
D:厚度 D:Thickness
H:高度 H: height
L:長度 L: length
P:間距 P: pitch
9:發熱元件 9: Heating element
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201104207A (en) * | 2009-07-27 | 2011-02-01 | Chia Cherne Industry Co Ltd | Heat dissipater structure |
| US20200115779A1 (en) * | 2018-10-16 | 2020-04-16 | Mitsubishi Aluminum Co., Ltd. | Aluminum alloy fin material and heat exchanger |
| TWM627557U (en) * | 2021-07-02 | 2022-06-01 | 艾姆勒車電股份有限公司 | Immersion-cooled porous heat-dissipation substrate structure |
| TWM630294U (en) * | 2022-03-25 | 2022-08-01 | 邁萪科技股份有限公司 | Heat sink with improved surface structure for liquid immersion cooling heat source |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201104207A (en) * | 2009-07-27 | 2011-02-01 | Chia Cherne Industry Co Ltd | Heat dissipater structure |
| US20200115779A1 (en) * | 2018-10-16 | 2020-04-16 | Mitsubishi Aluminum Co., Ltd. | Aluminum alloy fin material and heat exchanger |
| TWM627557U (en) * | 2021-07-02 | 2022-06-01 | 艾姆勒車電股份有限公司 | Immersion-cooled porous heat-dissipation substrate structure |
| TWM630294U (en) * | 2022-03-25 | 2022-08-01 | 邁萪科技股份有限公司 | Heat sink with improved surface structure for liquid immersion cooling heat source |
Non-Patent Citations (1)
| Title |
|---|
| 期刊 徐瑋志；張維哲；孫佩玲；張六文 高解析電子背向繞射在極低碳冷軋鋼片初期再結晶研究的應用 鑛冶：中國鑛冶工程學會會刊 59卷3期 中國鑛冶工程學會 2015/09/01 p.p.66 * |
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