TWI828912B - Polysilicone rubber composition and polysilicone rubber mold for molding - Google Patents
Polysilicone rubber composition and polysilicone rubber mold for molding Download PDFInfo
- Publication number
- TWI828912B TWI828912B TW109117435A TW109117435A TWI828912B TW I828912 B TWI828912 B TW I828912B TW 109117435 A TW109117435 A TW 109117435A TW 109117435 A TW109117435 A TW 109117435A TW I828912 B TWI828912 B TW I828912B
- Authority
- TW
- Taiwan
- Prior art keywords
- sio
- component
- molding
- rubber composition
- mass
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 58
- 229920001971 elastomer Polymers 0.000 title claims description 41
- 238000000465 moulding Methods 0.000 title claims description 37
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 39
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 20
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910004298 SiO 2 Inorganic materials 0.000 claims abstract description 10
- 229910004283 SiO 4 Inorganic materials 0.000 claims abstract description 8
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 8
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 7
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 6
- 239000007809 chemical reaction catalyst Substances 0.000 claims abstract description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 2
- -1 polysiloxane Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 238000004438 BET method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 abstract description 23
- 239000004945 silicone rubber Substances 0.000 abstract description 23
- 239000000047 product Substances 0.000 description 12
- 150000002430 hydrocarbons Chemical group 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000004677 Nylon Substances 0.000 description 8
- 229920001778 nylon Polymers 0.000 description 8
- 239000004615 ingredient Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- 239000012756 surface treatment agent Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 6
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 6
- 229910002012 Aerosil® Inorganic materials 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- UHOKSCJSTAHBSO-UHFFFAOYSA-N indanthrone blue Chemical compound C1=CC=C2C(=O)C3=CC=C4NC5=C6C(=O)C7=CC=CC=C7C(=O)C6=CC=C5NC4=C3C(=O)C2=C1 UHOKSCJSTAHBSO-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 235000014692 zinc oxide Nutrition 0.000 description 2
- KJDMMCYMVUTZSN-UHFFFAOYSA-N (1-ethynylcyclohexyl)oxy-trimethylsilane Chemical compound C[Si](C)(C)OC1(C#C)CCCCC1 KJDMMCYMVUTZSN-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical class [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- ZCTILCZSUSTVHT-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-yloxy(trimethyl)silane Chemical compound CC(C)CC(C)(C#C)O[Si](C)(C)C ZCTILCZSUSTVHT-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910002014 Aerosil® 130 Inorganic materials 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- 229910002018 Aerosil® 300 Inorganic materials 0.000 description 1
- 208000032544 Cicatrix Diseases 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- KZMRYBLIGYQPPP-UHFFFAOYSA-O [4-[(2-chlorophenyl)-[4-[ethyl-[(3-sulfophenyl)methyl]amino]phenyl]methylidene]cyclohexa-2,5-dien-1-ylidene]-ethyl-[(3-sulfophenyl)methyl]azanium Chemical compound C=1C=C(C(=C2C=CC(C=C2)=[N+](CC)CC=2C=C(C=CC=2)S(O)(=O)=O)C=2C(=CC=CC=2)Cl)C=CC=1N(CC)CC1=CC=CC(S(O)(=O)=O)=C1 KZMRYBLIGYQPPP-UHFFFAOYSA-O 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- NFCHUEIPYPEHNE-UHFFFAOYSA-N bis(2,2-dimethylbut-3-ynoxy)-dimethylsilane Chemical compound C#CC(C)(C)CO[Si](C)(C)OCC(C)(C)C#C NFCHUEIPYPEHNE-UHFFFAOYSA-N 0.000 description 1
- YNHIGQDRGKUECZ-UHFFFAOYSA-L bis(triphenylphosphine)palladium(ii) dichloride Chemical compound [Cl-].[Cl-].[Pd+2].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 YNHIGQDRGKUECZ-UHFFFAOYSA-L 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- FBNCDTLHQPLASV-UHFFFAOYSA-L disodium;5-methyl-2-[[5-(4-methyl-2-sulfonatoanilino)-9,10-dioxoanthracen-1-yl]amino]benzenesulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)C1=CC(C)=CC=C1NC1=CC=CC2=C1C(=O)C1=CC=CC(NC=3C(=CC(C)=CC=3)S([O-])(=O)=O)=C1C2=O FBNCDTLHQPLASV-UHFFFAOYSA-L 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000010076 replication Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- QBERHIJABFXGRZ-UHFFFAOYSA-M rhodium;triphenylphosphane;chloride Chemical compound [Cl-].[Rh].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QBERHIJABFXGRZ-UHFFFAOYSA-M 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- 230000037387 scars Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- JNRUXZIXAXHXTN-UHFFFAOYSA-N trimethyl(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C)C JNRUXZIXAXHXTN-UHFFFAOYSA-N 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
- B29C39/006—Monomers or prepolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本發明提供可賦予耐熱性優異、可重複使用之聚矽氧橡膠模具之聚矽氧橡膠組成物。 該組成物含有: (A)有機聚矽氧烷(1) Vi(3-a) R1 a SiO(R1 2 SiO)m SiR1 a Vi(3-a) (1) (R1 為非含烯基之1價烴基,Vi為乙烯基,m為黏度成為10,000~ 200,000mPa・s之數,a為0~2) (B)有機聚矽氧烷(2) (R1 3 SiO1/2 )p (Vi(3-b) R1 b SiO1/2 )q (SiO4/2 )r (2) (R1 、Vi與前述相同,p、q、r滿足p>0,q>0,r>0,p+q+r=1,b為0~2), (C)BET比表面積為50m2 /g以上之氧化矽, (D)有機氫聚矽氧烷(3) (R1 3 SiO1/2 )s (H(3-c) R1 b SiO1/2 )2-s (HR1 1 SiO2/2 )t (R1 2 SiO2/2 )u (3) (R1 與前述相同,c為1或2,s為0~2,t、u滿足t>0,u≧0,2≦t+u≦100,0.05≦t/(t+u)≦1.0), (E)氫矽烷化反應觸媒。The present invention provides a silicone rubber composition that can provide a reusable silicone rubber mold with excellent heat resistance. The composition contains: (A) Organopolysiloxane (1) Vi (3-a) R 1 a SiO (R 1 2 SiO) m SiR 1 a Vi (3-a) (1) (R 1 is not A monovalent hydrocarbon group containing an alkenyl group, Vi is a vinyl group, m is the number at which the viscosity becomes 10,000~200,000mPa·s, a is 0~2) (B) Organopolysiloxane (2) (R 1 3 SiO 1/ 2 ) p (Vi (3-b) R 1 b SiO 1/2 ) q (SiO 4/2 ) r (2) (R 1 and Vi are the same as above, p, q, r satisfy p>0, q> 0, r>0, p+q+r=1, b is 0~2), (C) Silicon oxide with a BET specific surface area of more than 50m 2 /g, (D) Organohydrogen polysiloxane (3) ( R 1 3 SiO 1/2 ) s (H (3-c) R 1 b SiO 1/2 ) 2-s (HR 1 1 SiO 2/2 ) t (R 1 2 SiO 2/2 ) u (3) (R 1 is the same as above, c is 1 or 2, s is 0~2, t and u satisfy t>0, u≧0, 2≦t+u≦100, 0.05≦t/(t+u)≦1.0 ), (E) Hydrosilylation reaction catalyst.
Description
本發明有關成型用聚矽氧橡膠組成物及聚矽氧橡膠模具,更詳言之,有關加成硬化型之成型用聚矽氧橡膠組成物及將其硬化而成之聚矽氧成型母模(亦及雌模)。The present invention relates to a silicone rubber composition for molding and a silicone rubber mold. More specifically, it relates to an addition-cured polysilicone rubber composition for molding and a polysilicone molding master mold obtained by hardening the silicone rubber composition. (Also female models).
利用聚矽氧橡膠模具作為反轉母模,於其中填充樹脂並使之硬化而製造複數製品,自有趣的迷你模型及至產業上之試作模型,已廣泛盛行。 該等中使用之聚矽氧橡膠於硬化前為液狀,藉由與硬化劑混合於常溫或加熱即可簡單硬化,具有可作為反轉模具之優點。然而相反地,由於為橡膠,故經注入成型之樹脂與橡膠模具密著,有不易脫模之問題點。 作為其解決策略,一般使用脫模劑,但就縮短步驟上之時間方面成為問題。Using a polysilicone rubber mold as an inverted master mold, filling it with resin and hardening it to produce multiple products, from interesting mini models to industrial trial models, has become widely popular. The polysilicone rubber used in these applications is in liquid form before hardening and can be easily hardened by mixing it with a hardener at room temperature or heating, and has the advantage of being used as a reversible mold. However, on the contrary, since it is rubber, the injected resin adheres closely to the rubber mold, making it difficult to release the mold. As a solution, a release agent is generally used, but this poses a problem in terms of shortening the step time.
作為解決其之手段,專利文獻1中提案添加具有交聯之基底聚合物以上之鏈長之非交聯性聚矽氧聚合物,就脫模性之提高方面提升較大成果。 然而,以該方法,尼龍等之具有高熱變形溫度之樹脂藉由射出成型等進行真空注模重複進行成型時,因反轉母模之撕裂強度降低而變得不易脫模,而有對母模造成裂紋等之傷痕之問題。 作為其對策,於專利文獻2中,提案有於組成中添加鈦酸鋰等之微細陶瓷之方法,但其效果未必充分。 [先前技術文獻] [專利文獻]As a means to solve this problem, Patent Document 1 proposes to add a non-crosslinked polysiloxane polymer having a chain length longer than that of the crosslinked base polymer, thereby achieving a greater improvement in mold releasability. However, when resins such as nylon and the like that have a high heat deformation temperature are repeatedly molded by vacuum injection molding using this method, the tear strength of the inverted master mold is reduced, making it difficult to demold, and there is a risk of damage to the master mold. The mold causes cracks and other scars. As a countermeasure, Patent Document 2 proposes a method of adding fine ceramics such as lithium titanate to the composition, but the effect is not necessarily sufficient. [Prior technical literature] [Patent Document]
[專利文獻1] 日本特開平7-118534號公報 [專利文獻2] 日本特開2016-165802號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 7-118534 [Patent Document 2] Japanese Patent Application Publication No. 2016-165802
[發明欲解決之課題][Problem to be solved by the invention]
本發明係鑒於上述情況而完成者,其目的在於提供可賦予耐熱性優異、可重複使用之聚矽氧橡膠模具之成型用聚矽氧橡膠組成物及使用該成型用聚矽氧橡膠組成物之樹脂製複製品之製造方法。 [用以解決課題之手段]The present invention was made in view of the above circumstances, and its object is to provide a silicone rubber composition for molding that can be provided with a silicone rubber mold that is excellent in heat resistance and can be reused, and a product using the silicone rubber composition for molding. Method for manufacturing resin replicas. [Means used to solve problems]
本發明人等為解決上述課題而積極檢討之結果,發現特定之加成硬化型聚矽氧橡膠組成物可賦予耐熱性優異、可重複使用之聚矽氧橡膠模具,因而完成本發明。As a result of active examination by the present inventors to solve the above-mentioned problems, the inventors found that a specific addition-cured silicone rubber composition can provide a reusable silicone rubber mold with excellent heat resistance, and thus completed the present invention.
亦即,本發明提供 1. 一種成型用聚矽氧橡膠組成物,其特徵係含有: (A)以下述平均式(1)表示之有機聚矽氧烷:100質量份 Vi(3-a) R1 a SiO(R1 2 SiO)m SiR1 a Vi(3-a) (1) (式中,R1 分別獨立表示非取代或取代之不含烯基之1價烴基,Vi表示乙烯基,m為於25℃下之(A)成分之黏度成為10,000~200,000 mPa・s之數,a為0~2之數) (B)以下述平均式(2)表示之有機聚矽氧烷:5~100質量份 (R1 3 SiO1/2 )p (Vi(3-b) R1 b SiO1/2 )q (SiO4/2 )r (2) (式中,R1 及Vi表示與前述相同之意義,p、q及r係滿足p>0,q>0,r>0,p+q+r=1之數,b為0~2之數), (C)利用BET法之比表面積為50m2 /g以上之氧化矽:3~50質量份 (D)以下述平均式(3)表示之有機氫聚矽氧烷:0.1~200質量份 (R1 3 SiO1/2 )s (H(3-c) R1 b SiO1/2 )2-s (HR1 1 SiO2/2 )t (R1 2 SiO2/2 )u (3) (式中,R1 表示與前述相同意義,c為1或2,s為0~2之數,t及u分別係滿足t>0,u≧0,且2≦t+u≦100及0.05≦t/(t+u)≦1.0之數),及 (E)氫矽烷化反應觸媒。 2. 如1之成型用聚矽氧橡膠組成物,其中前述(A)成分中,a為0~ 1.8之數。 3. 如1或2之成型用聚矽氧橡膠組成物,其中前述(A)成分於25℃下之黏度為20,000~150,000 mPa・s。 4. 如1至3中任一項之成型用聚矽氧橡膠組成物,其中前述(C)成分之比表面積為150m2 /g以上。 5. 如1至4中任一項之成型用聚矽氧橡膠組成物,其中前述(D)成分中,t及u分別係滿足t>0,u>0,且2≦t+u≦70及0.2≦t/(t+u)≦0.5之數。 6. 一種成型劑,其係由如1至5中任一項之成型用聚矽氧橡膠組成物所成。 7. 一種聚矽氧橡膠模具,其係使如1至5中任一項之成型用聚矽氧橡膠組成物硬化而成。 8. 一種樹脂製複製品之製造方法,其係使用如7之聚矽氧橡膠模具。 [發明效果]That is, the present invention provides 1. A polysiloxane rubber composition for molding, characterized by containing: (A) Organopolysiloxane represented by the following average formula (1): 100 parts by mass Vi (3-a) R 1 a SiO(R 1 2 SiO) m SiR 1 a Vi (3-a) (1) (In the formula, R 1 independently represents an unsubstituted or substituted monovalent hydrocarbon group without an alkenyl group, and Vi represents a vinyl group , m is the number at which the viscosity of component (A) becomes 10,000 to 200,000 mPa·s at 25°C, and a is the number from 0 to 2) (B) Organopolysiloxane represented by the following average formula (2): 5~100 parts by mass (R 1 3 SiO 1/2 ) p (Vi (3-b) R 1 b SiO 1/2 ) q (SiO 4/2 ) r (2) (where R 1 and Vi represent The same meaning as above, p, q and r are numbers that satisfy p>0, q>0, r>0, p+q+r=1, b is a number from 0 to 2), (C) Use the BET method Silicon oxide with a specific surface area of 50 m 2 /g or more: 3 to 50 parts by mass (D) Organohydrogen polysiloxane represented by the following average formula (3): 0.1 to 200 parts by mass (R 1 3 SiO 1/2 ) s (H (3-c) R 1 b SiO 1/2 ) 2-s (HR 1 1 SiO 2/2 ) t (R 1 2 SiO 2/2 ) u (3) (where R 1 represents The same meaning as above, c is 1 or 2, s is a number from 0 to 2, t and u respectively satisfy t>0, u≧0, and 2≦t+u≦100 and 0.05≦t/(t+u )≦1.0), and (E) hydrosilylation reaction catalyst. 2. The polysilicone rubber composition for molding as in 1, wherein in the aforementioned component (A), a is a number between 0 and 1.8. 3. The polysilicone rubber composition for molding as in 1 or 2, wherein the viscosity of the aforementioned component (A) at 25°C is 20,000~150,000 mPa·s. 4. The polysiloxane rubber composition for molding according to any one of 1 to 3, wherein the specific surface area of the component (C) is 150 m 2 /g or more. 5. The polysiloxane rubber composition for molding according to any one of 1 to 4, wherein in the aforementioned component (D), t and u respectively satisfy t>0, u>0, and 2≦t+u≦70 And the number 0.2≦t/(t+u)≦0.5. 6. A molding agent made of the polysiloxane rubber composition for molding according to any one of 1 to 5. 7. A silicone rubber mold, which is formed by hardening the silicone rubber composition for molding according to any one of 1 to 5. 8. A method of manufacturing a resin replica, which uses a silicone rubber mold as in 7. [Effects of the invention]
使本發明之成型用聚矽氧橡膠組成物硬化而得之聚矽氧橡膠模具耐熱性優異,尤其作為尼龍等之具有高硬化溫度之樹脂用成模材料而有用。The silicone rubber mold obtained by hardening the silicone rubber composition for molding of the present invention has excellent heat resistance and is particularly useful as a molding material for resins such as nylon that have a high curing temperature.
以下,針對本發明具體說明。 又,本發明中,所謂成型用聚矽氧橡膠組成物係指於未硬化狀態具有流動性,藉注模或塗佈之方法接觸於原模之全部表面或一部分表面,以該狀態使之硬化而形成供於利用樹脂等之複製之模具(成膜用之母模)的未硬化狀態之(液狀)組成物。Hereinafter, the present invention will be described in detail. In addition, in the present invention, the term "silicone rubber composition for molding" refers to a composition that has fluidity in an uncured state and is contacted with the entire surface or part of the surface of the original mold by injection molding or coating, and is cured in this state. This forms an uncured (liquid) composition that is used in a mold (master mold for film formation) that is replicated using resin or the like.
本發明之成型用聚矽氧橡膠組成物係含有下述(A)~(E)成分者。 (A)以下述平均式(1)表示之有機聚矽氧烷 Vi(3-a) R1 a SiO(R1 2 SiO)m SiR1 a Vi(3-a) (1) (式中,R1 分別獨立表示非取代或取代之不含烯基之1價烴基,Vi表示乙烯基,m為於25℃下之(A)成分之黏度成為10,000~200,000 mPa・s之數,a為0~2之數) (B)以下述平均式(2)表示之有機聚矽氧烷 (R1 3 SiO1/2 )p (Vi(3-b) R1 b SiO1/2 )q (SiO4/2 )r (2) (式中,R1 及Vi表示與前述相同之意義,p、q及r係滿足p>0,q>0,r>0,p+q+r=1之數,b為0~2之數), (C)利用BET法之比表面積為50m2 /g以上之氧化矽 (D)以下述平均式(3)表示之有機氫聚矽氧烷 (R1 3 SiO1/2 )s (H(3-c) R1 b SiO1/2 )2-s (HR1 1 SiO2/2 )t (R1 2 SiO2/2 )u (3) (式中,R1 表示與前述相同意義,c為1或2,s為0~2之數,t及u分別係滿足t>0,u≧0,且2≦t+u≦100及0.05≦t/(t+u)≦1.0之數),及 (E)氫矽烷化反應觸媒。The polysilicone rubber composition for molding of the present invention contains the following components (A) to (E). (A) Organopolysiloxane Vi (3-a) R 1 a SiO (R 1 2 SiO) m SiR 1 a Vi (3-a) (1) represented by the following average formula (1) (where, R 1 independently represents an unsubstituted or substituted monovalent hydrocarbon group without an alkenyl group, Vi represents a vinyl group, m is the number at which the viscosity of component (A) at 25°C becomes 10,000~200,000 mPa·s, and a is 0 ~2 number) (B) Organopolysiloxane (R 1 3 SiO 1/2 ) p (Vi (3-b ) R 1 b SiO 1/2 ) q (SiO) represented by the following average formula (2) 4/2 ) r (2) (In the formula, R 1 and Vi represent the same meaning as above, p, q and r satisfy p>0, q>0, r>0, p+q+r=1 number, b is a number from 0 to 2), (C) Silicon oxide (D) with a specific surface area of 50 m 2 /g or more using the BET method (D) Organohydrogen polysiloxane (R 1 ) represented by the following average formula (3) 3 SiO 1/2 ) s (H (3-c) R 1 b SiO 1/2 ) 2-s (HR 1 1 SiO 2/2 ) t (R 1 2 SiO 2/2 ) u (3) (Eq. Among them, R 1 means the same meaning as above, c is 1 or 2, s is a number from 0 to 2, t and u satisfy t>0, u≧0, and 2≦t+u≦100 and 0.05≦t respectively. /(t+u)≦1.0), and (E) hydrosilylation reaction catalyst.
[1](A)成分 (A)成分係以下述平均式(1)表示之有機聚矽氧烷。 Vi(3-a) R1 a SiO(R1 2 SiO)m SiR1 a Vi(3-a) (1)[1] Component (A) Component (A) is an organopolysiloxane represented by the following average formula (1). Vi (3-a) R 1 a SiO(R 1 2 SiO) m SiR 1 a Vi (3-a) (1)
式(1)中,R1 分別獨立表示非取代或取代之不含烯基之1價烴基,Vi表示乙烯基。 作為R1 之1價烴基只要不含烯基者則並未特別限定,可為直鏈、分支、環狀之任一者,但較佳為碳原子數1~20之1價烴基,更佳為碳原子數1~10之1價烴基,又更佳為碳原子數1~5之1價烴基。 作為其具體例可舉例為甲基、乙基、正丙基、異丙基、正丁基、第三丁基、正己基等之直鏈或分支烷基;環己基等之環狀烷基;苯基、甲苯基等之芳基;苄基、苯基乙基等之芳烷基等。 又,該等之1價烴基之氫原子一部分或全部可經F、Cl、Br等鹵原子、氰基等取代,作為此等基之具體例,舉例為3,3,3-三氟丙基等之鹵素取代烴基;2-氰基乙基等之氰基取代烴基等。 該等中R1 較佳為甲基。In formula (1), R 1 each independently represents an unsubstituted or substituted monovalent hydrocarbon group without an alkenyl group, and Vi represents a vinyl group. The monovalent hydrocarbon group of R 1 is not particularly limited as long as it does not contain an alkenyl group. It may be linear, branched, or cyclic, but it is preferably a monovalent hydrocarbon group with 1 to 20 carbon atoms, and more preferably It is a monovalent hydrocarbon group having 1 to 10 carbon atoms, more preferably a monovalent hydrocarbon group having 1 to 5 carbon atoms. Specific examples thereof include linear or branched alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, n-hexyl, etc.; cyclic alkyl groups such as cyclohexyl; Aryl groups such as phenyl, tolyl, etc.; aralkyl groups such as benzyl, phenylethyl, etc. In addition, part or all of the hydrogen atoms of these monovalent hydrocarbon groups may be substituted with halogen atoms such as F, Cl, Br, or cyano groups. Specific examples of these groups include 3,3,3-trifluoropropyl. Such as halogen-substituted hydrocarbon groups; 2-cyanoethyl, etc., cyano-substituted hydrocarbon groups, etc. Among these, R 1 is preferably methyl.
基於本發明之成型用聚矽氧橡膠組成物之處理性之觀點、以及所得硬化物之撕裂強度及耐熱性之觀點,(A)成分於25℃下之黏度為10,000~200,000 mPa・s,較佳為25,000~150,000 mPa・s。 然而,式(1)之m為於25℃下之(A)成分之黏度成為10,000~200,000 mPa・s之數,但較佳為200~1,300之數。又,本發明中之黏度係使用旋轉黏度計之測定值。 又,式(1)之a為0~2之數,較佳為0~1.8之數。Based on the processing properties of the polysiloxane rubber composition for molding of the present invention and the tear strength and heat resistance of the resulting hardened product, the viscosity of component (A) at 25°C is 10,000~200,000 mPa·s, Preferably, it is 25,000~150,000 mPa・s. However, m in formula (1) is a number where the viscosity of component (A) at 25°C is 10,000 to 200,000 mPa·s, but is preferably a number of 200 to 1,300. In addition, the viscosity in the present invention is a value measured using a rotational viscometer. In addition, a in the formula (1) is a number from 0 to 2, preferably a number from 0 to 1.8.
作為(A)成分之具體例,舉例為以下述平均式表示之有機聚矽氧烷等。 Vi3 SiO(Me2 SiO)250 SiVi3 Vi3 SiO(Me2 SiO)750 SiVi3 Vi3 SiO(Me2 SiO)1000 SiVi3 ViMe2 SiO(Me2 SiO)250 SiMe2 Vi ViMe2 SiO(Me2 SiO)750 SiMe2 Vi ViMe2 SiO(Me2 SiO)1000 SiMe2 Vi (式中,Vi意指乙烯基,Me意指甲基(以下同))。Specific examples of the component (A) include organopolysiloxane represented by the following average formula. Vi 3 SiO(Me 2 SiO) 250 SiVi 3 Vi 3 SiO(Me 2 SiO) 750 SiVi 3 Vi 3 SiO(Me 2 SiO) 1000 SiVi 3 ViMe 2 SiO(Me 2 SiO) 250 SiMe 2 Vi ViMe 2 SiO(Me 2 SiO) 750 SiMe 2 Vi ViMe 2 SiO (Me 2 SiO) 1000 SiMe 2 Vi (in the formula, Vi means vinyl and Me means methyl (the same below)).
又,(A)成分可單獨使用1種亦可併用2種以上。Moreover, (A)component may be used individually by 1 type, or may use 2 or more types together.
[2](B)成分 (B)成分係以下述平均式(2)表示之有機聚矽氧烷。 (R1 3 SiO1/2 )p (Vi(3-b) R1 b SiO1/2 )q (SiO4/2 )r (2)[2] Component (B) The component (B) is an organopolysiloxane represented by the following average formula (2). (R 1 3 SiO 1/2 ) p (Vi (3-b) R 1 b SiO 1/2 ) q (SiO 4/2 ) r (2)
式(2)中,R1 表示與上述式(1)相同之意義,其具體例亦與上述例示之基相同,該情況亦較佳為甲基。 p、q及r分別係滿足p>0,q>0,r>0,p+q+r=1之數,但基於所得硬化物之力學特性之觀點,(B)成分之有機聚矽氧烷中,M單位相對於Q單位之比率(p+q)/r較佳為0.3~2.0,更佳為0.4~1.0。 b為0~2之數。In the formula (2), R 1 has the same meaning as in the above-mentioned formula (1), and its specific examples are also the same as the above-exemplified groups. In this case, a methyl group is also preferred. p, q and r are numbers that satisfy p>0, q>0, r>0 and p+q+r=1 respectively. However, from the viewpoint of the mechanical properties of the obtained hardened material, the organic polysiloxane of component (B) In alkanes, the ratio of M units to Q units (p+q)/r is preferably 0.3 to 2.0, more preferably 0.4 to 1.0. b is a number from 0 to 2.
(B)成分之分子量並未特別限定,但基於對於其他成分之相溶性及所得硬化物之力學特性之觀點,較佳為1,000~50,000,更佳為2,000 ~10,000。又,分子量係凝膠滲透層析(GPC)之標準聚苯乙烯換算之重量平均分子量。The molecular weight of component (B) is not particularly limited, but from the viewpoint of the compatibility with other components and the mechanical properties of the obtained hardened material, it is preferably 1,000 to 50,000, more preferably 2,000 to 10,000. In addition, the molecular weight is the weight average molecular weight converted to standard polystyrene by gel permeation chromatography (GPC).
作為(B)成分之具體例,舉例為以下述式表示之有機聚矽氧烷等。 (Me3 SiO1/2 )0.4 (ViMe2 SiO1/2 )0.045 (SiO4/2 )0.555 、 (Me3 SiO1/2 )0.1 (Vi3 SiO1/2 )0.2 (SiO4/2 )0.7 、 (Me3 SiO1/2 )0.35 (ViMe2 SiO1/2 )0.2 (Vi3 SiO1/2 )0.1 (SiO4/2 )0.35 Specific examples of component (B) include organopolysiloxane represented by the following formula. (Me 3 SiO 1/2 ) 0.4 (ViMe 2 SiO 1/2 ) 0.045 (SiO 4/2 ) 0.555 , (Me 3 SiO 1/2 ) 0.1 (Vi 3 SiO 1/2 ) 0.2 (SiO 4/2 ) 0.7 , (Me 3 SiO 1/2 ) 0.35 (ViMe 2 SiO 1/2 ) 0.2 (Vi 3 SiO 1/2 ) 0.1 (SiO 4/2 ) 0.35
(B)成分之調配量,相對於(A)成分100質量份為5~100質量份,較佳為10~50質量份。(B)成分之調配量若未達5質量份,所得硬化物之力學特性不足,若超過100質量份,則由於組成物之黏度變高,故難以成型。 又,由於(B)成分有於25℃成為固體之情況,故亦可溶解於上述(A)成分中而使用。 又,(B)成分可單獨使用1種亦可併用2種以上。The compounding amount of component (B) is 5 to 100 parts by mass, preferably 10 to 50 parts by mass relative to 100 parts by mass of component (A). If the blending amount of component (B) is less than 5 parts by mass, the resulting hardened product will have insufficient mechanical properties. If it exceeds 100 parts by mass, the viscosity of the composition will become high, making it difficult to mold. In addition, since component (B) may become solid at 25°C, it can also be used by being dissolved in component (A). Moreover, (B)component may be used individually by 1 type, or may use 2 or more types together.
[3](C)成分 (C)成分係利用BET法之比表面積為50m2 /g以上,較佳50~500 m2 /g,更佳150~350m2 /g之氧化矽,係用以對自本發明之聚矽氧橡膠組成物所得之硬化物賦予拉伸強度、撕裂強度、切斷時伸長時之力學特性之成分。 作為氧化矽舉例為例如發煙氧化矽、結晶性氧化矽(石英粉)、沉降性氧化矽、該等之表面經疏水化處理之氧化矽等,該等可單獨使用1種亦可組合2種以上使用。[3](C) Component (C) Component is silicon oxide with a specific surface area of 50 m 2 /g or more by BET method, preferably 50 to 500 m 2 /g, more preferably 150 to 350 m 2 /g, and is used for A component that imparts tensile strength, tear strength, and mechanical properties when elongated at the time of cutting to the cured product obtained from the polysiloxane rubber composition of the present invention. Examples of silicon oxide include fumed silicon oxide, crystalline silicon oxide (quartz powder), precipitated silicon oxide, silicon oxide whose surface has been hydrophobized, etc. One type of these can be used alone or two types can be combined. Used above.
作為此等氧化矽,作為親水性氧化矽,舉例為Aerosil 130、200、300(日本Aerosil公司製)、Cabosil MS-5、MS-7(Cabot公司製)、Rheorosil QS-102、103 (TOKUYAMA(股)製)等之發煙氧化矽;Tokusil US-F (TOKUYAMA(股)製)、Nipsil LP(日本SILICA工業(股)製)等之沉降性氧化矽等,作為疏水性氧化矽,舉例為Aerosil R-812、R-812S、R-972、R-974(日本Aerosil (股)製)、Rheorosil MT-10 (TOKUYAMA (股)製)等之發煙氧化矽;Nipsil SS系列(日本SILICA工業(股)製)等之沉降性氧化矽;Crystalite(龍森(股)製)、MIN-U-SIL(U.S.Silica Company公司製)、Imisil(Illinois Mineral公司製)等之結晶性氧化矽等。As such silicon oxide, examples of hydrophilic silicon oxide include Aerosil 130, 200, and 300 (manufactured by Japan Aerosil Co., Ltd.), Cabosil MS-5, MS-7 (manufactured by Cabot Co., Ltd.), Rheorosil QS-102, 103 (TOKUYAMA (TOKUYAMA) Fumed silicon oxide made by TOKUYAMA Co., Ltd.); precipitated silicon oxide such as Tokusil US-F (manufactured by TOKUYAMA Co., Ltd.), Nipsil LP (manufactured by Nippon SILICA Industrial Co., Ltd.), etc. As hydrophobic silicon oxide, examples are: Aerosil R-812, R-812S, R-972, R-974 (manufactured by Japan Aerosil Co., Ltd.), Rheorosil MT-10 (manufactured by TOKUYAMA Co., Ltd.) and other fumed silicon oxides; Nipsil SS series (Japan SILICA Industrial Sedimentable silicas such as Crystalite (manufactured by Ronsen Co., Ltd.), MIN-U-SIL (manufactured by U.S. Silica Company), Imisil (manufactured by Illinois Mineral Company), etc.
該等氧化矽直接使用亦無妨,但較佳使用以表面處理劑預先表面疏水化處理者,或於(A)成分混練時添加表面處理劑將氧化矽表面進行疏水化處理而使用。作為表面處理劑,舉例為烷基烷氧基矽烷、烷基羥基矽烷、烷基氯矽烷、烷基矽氮烷、矽烷偶合劑、低分子聚矽氧烷、鈦酸酯系處理劑、脂肪酸酯等,較佳為烷基矽氮烷,更佳為六甲基二矽氮烷。該等之表面處理劑可單獨使用1種,亦可於同時或不同時點使用2種以上。 表面處理劑之使用量,相對於氧化矽100質量份,較佳為0.5~50質量份,更佳為1~40質量份,又更佳為2~30質量份。表面處理劑之使用量若為上述範圍內,則組成物中不殘存表面處理劑或其分解物,可獲得流動性,可抑制經時之黏度上升。There is no problem in using the silicon oxide as it is, but it is preferable to use a surface treatment agent to hydrophobize the surface of the silicon oxide in advance, or to add a surface treatment agent when kneading component (A) to hydrophobize the silicon oxide surface. Examples of surface treatment agents include alkylalkoxysilane, alkylhydroxysilane, alkylchlorosilane, alkylsilazane, silane coupling agent, low molecular weight polysiloxane, titanate treatment agent, and fatty acid ester, etc., preferably alkylsilazane, more preferably hexamethyldisilazane. One type of these surface treatment agents can be used alone, or two or more types can be used at the same time or at different points in time. The usage amount of the surface treatment agent is preferably 0.5 to 50 parts by mass, more preferably 1 to 40 parts by mass, and still more preferably 2 to 30 parts by mass relative to 100 parts by mass of silicon oxide. If the amount of the surface treatment agent used is within the above range, the surface treatment agent or its decomposition products will not remain in the composition, fluidity can be obtained, and the increase in viscosity over time can be suppressed.
(C)成分之調配量,基於組成物之處理性及硬化物之機械強度之觀點,相對於(A)成分100質量份為3~50質量份,較佳為5~30質量份。(C)成分之調配量若未達3質量份,所得硬化物之力學特性不足,若超過50質量份,則由於組成物之黏度變高,故難以成型。The compounding amount of component (C) is 3 to 50 parts by mass, preferably 5 to 30 parts by mass, based on the properties of the composition and the mechanical strength of the hardened material, based on 100 parts by mass of component (A). If the blending amount of component (C) is less than 3 parts by mass, the resulting hardened product will have insufficient mechanical properties. If it exceeds 50 parts by mass, the viscosity of the composition will become high, making it difficult to mold.
[4](D)成分 (D)成分係以下述平均式(3)表示之有機氫聚矽氧烷。 (R1 3 SiO1/2 )s (H(3-c) R1 b SiO1/2 )2-s (HR1 1 SiO2/2 )t (R1 2 SiO2/2 )u (3)[4] Component (D) Component (D) is an organohydrogen polysiloxane represented by the following average formula (3). (R 1 3 SiO 1/2 ) s (H (3-c) R 1 b SiO 1/2 ) 2-s (HR 1 1 SiO 2/2 ) t (R 1 2 SiO 2/2 ) u (3 )
式(3)中,R1 表示與上述式(1)相同之意義,其具體例亦與上述例示之基相同,該情況亦較佳為甲基。 c為1或2,s為0~2之數。 t及u分別係滿足t>0,u≧0,且2≦t+u≦100及0.05≦t/(t+u)≦1.0之數,但t+u較佳為8~80,t/(t+u)較佳為0.2~0.8。t+u未達2時,(D)成分於硬化時有揮發之可能性,超過100時,因(D)成分之黏度變高故作業性惡化。又t/(t+u)若未達0.05,則所得硬化物之橡膠物性不充分。In the formula (3), R 1 has the same meaning as in the above-mentioned formula (1), and its specific examples are also the same as the above-exemplified groups. In this case, a methyl group is also preferred. c is 1 or 2, and s is a number from 0 to 2. t and u are numbers that satisfy t>0, u≧0, and 2≦t+u≦100 and 0.05≦t/(t+u)≦1.0 respectively, but t+u is preferably 8~80, t/ (t+u) is preferably 0.2~0.8. When t+u is less than 2, component (D) may volatilize during hardening. When t+u exceeds 100, the viscosity of component (D) becomes high and workability deteriorates. If t/(t+u) is less than 0.05, the rubber physical properties of the obtained hardened product will be insufficient.
(D)成分之分子量並未特別限定,但若考慮提高組成物之作業性及硬化物之力學特性,較佳為1,000~30,000,更佳為1,500~10,000。The molecular weight of component (D) is not particularly limited, but in consideration of improving the workability of the composition and the mechanical properties of the hardened product, it is preferably 1,000 to 30,000, more preferably 1,500 to 10,000.
作為(D)成分之有機氫聚矽氧烷之具體例,可舉例為分子鏈兩末端三甲基矽氧基封端甲基氫聚矽氧烷、分子鏈兩末端三甲基矽氧基封端二甲基矽氧烷・甲基氫矽氧烷共聚物、分子鏈兩末端三甲基矽氧基封端二甲基聚矽氧烷・甲基氫矽氧烷・甲基苯基矽氧烷共聚物、分子鏈兩末端二甲基氫矽氧基封端二甲基聚矽氧烷、分子鏈兩末端二甲基氫矽氧基封端二甲基矽氧烷・甲基氫矽氧烷共聚物、分子鏈兩末端二甲基氫矽氧基封端二甲基矽氧烷・甲基苯基矽氧烷共聚物、分子鏈兩末端二甲基氫矽氧基封端甲基苯基聚矽氧烷,該等之有機聚矽氧烷之2種以上所成之混合物等。 更具體而言,舉例為以下述式表示之有機氫聚矽氧烷等。Specific examples of the organohydrogen polysiloxane as component (D) include trimethylsiloxy-capped methyl hydrogen polysiloxane at both ends of the molecular chain and trimethylsiloxy-capped both ends of the molecular chain. Terminated dimethylsiloxane, methylhydrogensiloxane copolymer, trimethylsiloxy-terminated dimethylpolysiloxane, methylhydrogensiloxane, methylphenylsiloxane at both ends of the molecular chain Alkane copolymer, dimethylpolysiloxane terminated with dimethylhydrogensiloxy groups at both ends of the molecular chain, dimethylsiloxane and methylhydrogensiloxane terminated with dimethylhydrogensiloxy groups at both ends of the molecular chain Alkane copolymer, dimethylsiloxy-methylphenylsiloxane copolymer terminated with dimethylhydrogensiloxy groups at both ends of the molecular chain, methylbenzene terminated with dimethylhydrogensiloxy groups at both ends of the molecular chain Organic polysiloxanes, mixtures of two or more of these organopolysiloxanes, etc. More specifically, examples thereof include organohydrogen polysiloxane represented by the following formula.
(式中,矽氧烷單位之排列為任意)。 (In the formula, the arrangement of siloxane units is arbitrary).
(D)成分之調配量,相對於(A)成分100質量份為0.1~200質量份,較佳為0.3~50質量份。(D)成分之調配量若未達0.1質量份,則交聯不充分,若超過200質量份,則硬化時容易因氫氣發生而引起發泡,因硬化物內部之空隙發生而使橡膠強度降低。 又,(A)成分及(B)成分中之每1個乙烯基之(D)成分中之與矽原子鍵結之氫原子數較佳為0.4~4個,更佳為0.8~3個。 又,(D)成分可單獨使用1種亦可併用2種以上。The compounding amount of component (D) is 0.1 to 200 parts by mass, preferably 0.3 to 50 parts by mass relative to 100 parts by mass of component (A). If the blending amount of component (D) is less than 0.1 parts by mass, cross-linking will be insufficient. If it exceeds 200 parts by mass, foaming will easily occur due to the generation of hydrogen during hardening, and the rubber strength will decrease due to the generation of voids inside the hardened product. . Furthermore, the number of hydrogen atoms bonded to silicon atoms in component (D) per vinyl group in component (A) and component (B) is preferably 0.4 to 4, more preferably 0.8 to 3. Moreover, (D)component may be used individually by 1 type, or may use 2 or more types together.
[5](E)成分 (E)成分係用以促進(A)成分中之乙烯基與(B)成分中之SiH基之氫矽烷化反應之氫矽烷化反應觸媒。 作為其具體例,舉例為鉑黑、氯化鉑、氯化鉑酸、氯化鉑酸與1元醇之反應物、氯化鉑酸與烯烴類之錯合物、鉑雙乙醯乙酸鹽等之鉑系觸媒、四(三苯膦)鈀、二氯雙(三苯膦)鈀等之鈀系觸媒、氯三(三苯膦)銠、四(三苯膦)銠等之銠系觸媒等。 又,(E)成分可單獨使用1種亦可併用2種以上。[5](E)Component Component (E) is a hydrosilylation reaction catalyst used to promote the hydrosilylation reaction between the vinyl group in component (A) and the SiH group in component (B). Specific examples thereof include platinum black, platinum chloride, chlorinated platinic acid, the reaction product of chlorinated platinic acid and monohydric alcohol, complexes of chlorinated platinic acid and olefins, platinum bisacetyl acetate, etc. Platinum-based catalysts, palladium-based catalysts such as tetrakis(triphenylphosphine)palladium, dichlorobis(triphenylphosphine)palladium, etc., rhodium-based catalysts such as tris(triphenylphosphine)rhodium chloride, tetrakis(triphenylphosphine)rhodium, etc. Catalysts, etc. Moreover, (E)component may be used individually by 1 type, or may use 2 or more types together.
(E)成分之調配量,若為可促進組成物之硬化(氫矽烷化反應)之亮,則未特別限定,相對於本組成物之各成分之質量合計,以本成分中之金屬原子之質量換算較加成為0.1~1,000ppm之範圍,更佳為1~500ppm之範圍,又更佳為3~100ppm之範圍。若為該範圍,則加成反應之反應速度成為適當。The blending amount of component (E) is not particularly limited as long as it can accelerate the hardening (hydrosilylation reaction) of the composition. It is calculated based on the total mass of the components of the composition. The mass conversion ratio is preferably in the range of 0.1~1,000ppm, more preferably in the range of 1~500ppm, and even more preferably in the range of 3~100ppm. If it is within this range, the reaction rate of the addition reaction becomes appropriate.
[6](F)成分 本發明之成型用聚矽氧橡膠組成物中,於調製組成物時或成型時等之加熱硬化前,基於控制氫矽烷化反應觸媒之反應性以使不引起增黏或膠凝化之目的,亦可根據需要添加(F)反應控制劑。 作為反應控制劑之具體例舉例為3-甲基-1-丁炔-3-醇、3-甲基-1-戊炔-3-醇、3,5-二甲基-1-己炔-3-醇、1-乙炔基環己醇、乙炔基甲基癸基卡必醇、3-甲基-3-三甲基矽氧基-1-丁炔、3-甲基-3-三甲基矽氧基-1-戊炔、3,5-二甲基-3-三甲基矽氧基-1-己炔、1-乙炔基-1-三甲基矽氧基環己烷、雙(2,2-二甲基-3-丁炔氧基)二甲基矽烷、1,3,5,7-四甲基-1,3,5,7-四乙烯基環四系氧烷、1,1,3,3-四甲基-1,3-二乙烯基二矽氧烷等,該等可單獨使用1種,亦可組合2種以上使用。 該等中,較佳為1-乙炔基環己醇、乙炔基甲基癸基卡必醇、3-甲基-1-丁炔-3-醇。[6](F)Component In the polysiloxane rubber composition for molding of the present invention, the reactivity of the hydrosilylation reaction catalyst is controlled so as not to cause viscosity increase or gelation before heating and hardening during preparation of the composition or molding. , you can also add (F) reaction control agent as needed. Specific examples of the reaction control agent include 3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, and 3,5-dimethyl-1-hexyn- 3-alcohol, 1-ethynylcyclohexanol, ethynylmethyldecylcarbitol, 3-methyl-3-trimethylsiloxy-1-butyne, 3-methyl-3-trimethyl Siloxy-1-pentyne, 3,5-dimethyl-3-trimethylsiloxy-1-hexyne, 1-ethynyl-1-trimethylsiloxycyclohexane, bis (2,2-Dimethyl-3-butynyloxy)dimethylsilane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasyloxane, 1,1,3,3-tetramethyl-1,3-divinyldisiloxane, etc., one type of these may be used alone, or two or more types may be used in combination. Among these, 1-ethynylcyclohexanol, ethynylmethyldecylcarbitol, and 3-methyl-1-butyn-3-ol are preferred.
使用(F)成分時,其添加量,相對於(A)成分及(B)成分之合計100質量份,較佳為0.01~3.0質量份,更佳為0.01~1.5質量份。若為此等範圍則可充分發揮反應控制效果。When component (F) is used, the addition amount is preferably 0.01 to 3.0 parts by mass, more preferably 0.01 to 1.5 parts by mass relative to 100 parts by mass in total of component (A) and component (B). If it is within this range, the reaction control effect can be fully exerted.
[7]其他成分 本發明之成型用聚矽氧橡膠組成物中,除了上述(A)~(F)成分以外,只要不損及本發明目的,亦可調配以下例示之其他成分。 作為其他成分,舉例為氧化鐵、碳黑、導電性鋅白、金屬粉等之導電劑;氧化鈦、氧化鈰等之耐熱劑;二甲基矽氧油等之內部脫模劑;接著性賦予劑;觸變性賦予劑;著色劑等。[7]Other ingredients In addition to the above-mentioned components (A) to (F), the polysiloxy rubber composition for molding of the present invention may also contain other components exemplified below as long as the purpose of the present invention is not impaired. Examples of other components include conductive agents such as iron oxide, carbon black, conductive zinc white, and metal powder; heat-resistant agents such as titanium oxide and cerium oxide; internal release agents such as dimethyl silicone oil; and adhesion imparting properties. Agent; thixotropy imparting agent; coloring agent, etc.
作為著色劑之具體例舉例為群青、氧化鐵、氧化鈦、鈦黃、碳黑、鋅白、鉻綠等之無機顏料;蒽醌紫、蒽醌藍、陰丹士林藍、茜素綠、派松紅等之有機顏料;鋁粉、銅粉、青銅粉、錫粉等之金屬粉顏料;蓄光顏料,進而為不阻礙硬化之染料等,可考慮色調及彩度等適當選擇。Specific examples of the coloring agent include inorganic pigments such as ultramarine blue, iron oxide, titanium oxide, titanium yellow, carbon black, zinc white, chrome green, etc.; anthraquinone violet, anthraquinone blue, indanthrene blue, alizarin green, Organic pigments such as pine red; metallic powder pigments such as aluminum powder, copper powder, bronze powder, tin powder, etc.; light-storing pigments, and dyes that do not hinder hardening, etc. can be selected appropriately considering the hue and chroma.
本發明之成型用聚矽氧橡膠組成物可藉由將上述(A)~(E)成分、根據需要使用之(F)成分及其他成分使用捏合機、行星式混合機等之習知方法混合而調製。 本發明之成型用聚矽氧橡膠組成物亦可設為分別調製由(A)成分、(B)成分、(C)成分、(E)成分及根據需要之其他成分所成之第一劑,與由(A)成分、(D)成分、(C)成分及根據需要之其他成分所成之第二劑,於使用前將第一劑與第二劑混合之二劑型組成物。又,亦可具有第一劑及第二劑共通使用之成分。藉由將組成物設為此等二劑型,可進而確保保存安定性。The polysiloxane rubber composition for molding of the present invention can be mixed by conventional methods such as the above-mentioned (A) to (E) components, (F) component if necessary, and other components using a kneader, a planetary mixer, etc. And modulation. The polysiloxane rubber composition for molding of the present invention can also be prepared as a first component consisting of component (A), component (B), component (C), component (E) and other components as needed. A two-dose composition consisting of a second dose consisting of component (A), component (D), component (C) and other ingredients as needed, and the first and second doses are mixed before use. In addition, the first agent and the second agent may have components used in common. By configuring the composition into these two-dose forms, storage stability can be further ensured.
本發明之成型用聚矽氧橡膠組成物以特定模具注模,藉由硬化可獲得聚矽氧橡膠模具。尤其較佳使用真空注模進行注模,作為硬化條件例如於常溫(5~35℃)硬化亦可進行,但亦可藉由加熱促進硬化,於欲提高量產性之情況,該方法為有效。 使之加熱硬化時,通常可於40~60℃之溫度2~20小時左右之條件下進行。The silicone rubber composition for molding of the present invention is injected into a specific mold, and the silicone rubber mold can be obtained by hardening. In particular, it is preferable to use a vacuum injection mold for injection molding. As a hardening condition, hardening at normal temperature (5~35°C) can also be performed. However, hardening can also be promoted by heating. This method is effective when mass productivity is to be improved. . When heating and hardening, it can usually be carried out at a temperature of 40 to 60°C for about 2 to 20 hours.
自本發明之成型用聚矽氧橡膠組成物所得之聚矽氧橡膠模具可有效使用於尼龍樹脂、環氧樹脂、胺基甲酸酯樹脂等之樹脂成型物之成形。尤其較適用於熔融中需要50~200℃,較佳70~180℃之熱變形溫度之尼龍樹脂之成形。 [實施例]The silicone rubber mold obtained from the silicone rubber composition for molding of the present invention can be effectively used for molding resin molded articles such as nylon resin, epoxy resin, urethane resin, etc. It is especially suitable for the molding of nylon resin that requires a heat deformation temperature of 50~200℃, preferably 70~180℃ during melting. [Example]
以下列舉實施例及比較例更具體說明本發明,但本發明並非限定於該等實施例。The present invention will be described in more detail below with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.
[實施例1~4、比較例1] 以表1所示之調配比(質量份)混合下述成分,調製聚矽氧橡膠組成物。具體而言,首先使用捏合機將(A)成分、(B)成分、(C)成分、六甲基二矽氮烷1.5質量份及水0.7質量份於25℃混合1小時後,升溫至150℃,持續攪拌2小時,冷卻至25℃,對所得之聚矽氧橡膠基底,利用鉑的質量換算以相對於組成物全體成為100ppm之方式添加(E)成分,使用行星式混合機於25℃攪拌混合15分鐘後,添加(D)成分及(F)成分,使用行星式混合機於25℃進行攪拌混合15分鐘,進而於25℃減壓脫泡30分鐘,獲得聚矽氧橡膠組成物。[Examples 1 to 4, Comparative Example 1] The following components were mixed at the mixing ratio (parts by mass) shown in Table 1 to prepare a polysilicone rubber composition. Specifically, first, component (A), component (B), component (C), 1.5 parts by mass of hexamethyldisilazane, and 0.7 parts by mass of water were mixed at 25°C for 1 hour using a kneader, and then the temperature was raised to 150°C. ℃, continue stirring for 2 hours, cool to 25°C, and add component (E) to the obtained polysiloxane rubber base so that it becomes 100 ppm relative to the entire composition based on the mass conversion of platinum, and use a planetary mixer at 25°C After stirring and mixing for 15 minutes, component (D) and component (F) were added, stirred and mixed at 25° C. for 15 minutes using a planetary mixer, and then degassed under reduced pressure at 25° C. for 30 minutes to obtain a polysilicone rubber composition.
[比較例2] 除了不使用(B)成分以外,與實施例1同樣獲得聚矽氧橡膠組成物。[Comparative example 2] A polysilicone rubber composition was obtained in the same manner as in Example 1 except that component (B) was not used.
[比較例3] 除了不使用(C)成分、六甲基二矽氮烷及水以外,與實施例1同樣獲得聚矽氧橡膠組成物。[Comparative example 3] A polysilicone rubber composition was obtained in the same manner as in Example 1, except that component (C), hexamethyldisilazane, and water were not used.
(A)成分: (A-1)兩末端經三乙烯基矽烷基封端之於25℃之黏度為100,000 mPa・s之二甲基聚矽氧烷 (A-2)兩末端經二甲基乙烯基矽烷基封端之於25℃之黏度為50,000mPa・s之二甲基聚矽氧烷 (A-3)兩末端經三乙烯基矽烷基封端之於25℃之黏度為60,000 mPa・s之二甲基聚矽氧烷 (A-4:比較例)兩末端經二甲基乙烯基矽烷基封端之於25℃之黏度為5,000 mPa・s之二甲基聚矽氧烷(A)Ingredients: (A-1) Dimethylpolysiloxane with a viscosity of 100,000 mPa·s at 25°C and capped with trivinylsilyl groups at both ends (A-2) Dimethylpolysiloxane with a viscosity of 50,000mPa·s at 25°C and capped with dimethylvinylsilyl groups at both ends (A-3) Dimethylpolysiloxane with a viscosity of 60,000 mPa·s at 25°C and capped with trivinylsilyl groups at both ends (A-4: Comparative Example) Dimethylpolysiloxane with a viscosity of 5,000 mPa·s at 25°C and capped with dimethylvinylsilyl groups at both ends
(B)成分: (B-1)以(Me3 SiO1/2 )0.4 (ViMe2 SiO1/2 )0.045 (SiO4/2 )0.555 表示之有機聚矽氧烷(重量平均分子量3,500)(B) Component: (B-1) Organopolysiloxane (weight average molecular weight 3,500) represented by (Me 3 SiO 1/2 ) 0.4 (ViMe 2 SiO 1/2 ) 0.045 (SiO 4/2 ) 0.555
(C)成分: (C-1)發煙氧化矽(日本Aerosil(股)製,Aerosil R976,BET比表面積240m2 /g)(C) Ingredients: (C-1) Fumed silicon oxide (manufactured by Japan Aerosil Co., Ltd., Aerosil R976, BET specific surface area 240m 2 /g)
(D)成分: (D-1)以下述平均式表示之甲基氫聚矽氧烷(D)Ingredients: (D-1) Methyl hydrogen polysiloxane represented by the following average formula
(式中,矽氧烷單位之排列為無規或嵌段)。 (In the formula, the arrangement of siloxane units is random or block).
(D-2)以下述平均式表示之甲基氫聚矽氧烷(D-2) Methyl hydrogen polysiloxane represented by the following average formula
(式中,矽氧烷單位之排列為無規或嵌段)。 (In the formula, the arrangement of siloxane units is random or block).
(E)成分: (E-1)氯化鉑酸辛醇錯合物(E)Ingredients: (E-1) Platinum chloride octanol complex
(F)成分: (F-1)乙炔基環己醇(F)Ingredients: (F-1) Ethynylcyclohexanol
使用上述實施例1~4及比較例1~3所調製之聚矽氧橡膠組成物,評價下述各特性。結果示於表2。Using the polysilicone rubber compositions prepared in Examples 1 to 4 and Comparative Examples 1 to 3, the following characteristics were evaluated. The results are shown in Table 2.
[硬度] 將組成物以成為2mm厚之方式流入模具中,於60℃、2小時之條件硬化所得之硬化物之硬度(硬度計A)依據JIS K 6253-3:2012測定。且同樣製作之硬化物暴露於180℃、150小時之環境後之硬度與上述同樣測定。 [拉伸強度、切斷時伸長率、撕裂強度] 將組成物以成為2mm厚之方式流入模具中,於60℃、2小時之條件硬化之啞鈴狀試驗片,依據JIS K 6249: 2003,分別測定拉伸強度(MPa)、切斷時伸長率(%)及撕裂強度(kN/m)。 且,同樣製作之啞鈴狀試驗片暴露於180℃、150小時之環境後測定上述各物性。 [複製次數] 將聚矽氧橡膠組成物流入凹型模框中,於60℃、2小時之硬化條件硬化,製作凹型之聚矽氧橡膠模具。 重複下述作業:於聚矽氧橡膠模具之凹部流入尼龍樹脂(SLM公司製PA3000),於180℃硬化1小時製作尼龍樹脂複製品,所得尼龍樹脂複製品自聚矽氧橡膠模具取出。評價直至於聚矽氧橡膠模具觀察到裂紋之可重複之複製次數。[hardness] The composition was poured into a mold so that it became 2 mm thick, and the hardness (hardness meter A) of the obtained hardened product was measured in accordance with JIS K 6253-3:2012 after curing at 60°C for 2 hours. And the hardness of the hardened material made in the same way was measured in the same way as above after being exposed to an environment of 180°C for 150 hours. [Tensile strength, elongation at cut, tear strength] The composition was poured into a mold to a thickness of 2 mm, and the dumbbell-shaped test piece was hardened at 60°C for 2 hours. The tensile strength (MPa) and elongation at cut (MPa) were measured in accordance with JIS K 6249: 2003. %) and tear strength (kN/m). Furthermore, the dumbbell-shaped test piece prepared in the same manner was exposed to an environment of 180° C. for 150 hours, and then the above-mentioned physical properties were measured. [Number of copies] The polysilicone rubber composition is poured into the concave mold frame and hardened under hardening conditions of 60°C and 2 hours to produce a concave polysilicone rubber mold. Repeat the following operations: flow nylon resin (PA3000 manufactured by SLM Company) into the recessed part of the silicone rubber mold, and harden at 180° C. for 1 hour to produce a nylon resin replica. The obtained nylon resin replica is taken out from the silicone rubber mold. Evaluate the number of repeatable replicates until cracks are observed in the silicone rubber mold.
如表2所示可知,由實施例1~4調製之本發明之成型用聚矽氧橡膠組成物所得之硬化物,耐熱性優異,尼龍樹脂複製物之複製次數良好。 另一方面,未使用本發明之(A)成分之比較例1,未使用(B)成分之比較例2,及未使用(C)成分之比較例3,由於耐熱性差,故容易發生聚矽氧橡膠模具之裂紋,可知並非適於成型者。As shown in Table 2, it can be seen that the cured product obtained from the polysiloxane rubber composition for molding of the present invention prepared in Examples 1 to 4 has excellent heat resistance, and the number of replications of the nylon resin replica is good. On the other hand, Comparative Example 1 that does not use component (A) of the present invention, Comparative Example 2 that does not use component (B), and Comparative Example 3 that does not use component (C) of the present invention have poor heat resistance and are prone to polysilica. The cracks in the oxygen rubber mold indicate that it is not suitable for molding.
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-098643 | 2019-05-27 | ||
JP2019098643A JP7107279B2 (en) | 2019-05-27 | 2019-05-27 | Silicone rubber composition for molding and silicone rubber mold |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202108700A TW202108700A (en) | 2021-03-01 |
TWI828912B true TWI828912B (en) | 2024-01-11 |
Family
ID=73466357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109117435A TWI828912B (en) | 2019-05-27 | 2020-05-26 | Polysilicone rubber composition and polysilicone rubber mold for molding |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7107279B2 (en) |
KR (1) | KR20200136318A (en) |
CN (1) | CN111995871B (en) |
TW (1) | TWI828912B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7456964B2 (en) * | 2021-03-26 | 2024-03-27 | 信越化学工業株式会社 | composite film |
CN115246990B (en) * | 2021-04-27 | 2023-11-03 | 中蓝晨光化工有限公司 | Double-component addition type room temperature vulcanization mold silicon rubber and preparation method thereof |
CN113881168A (en) * | 2021-11-09 | 2022-01-04 | 海南鸿飞企业管理有限公司 | Reusable composition for mold and mold manufacturing method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104419208A (en) * | 2013-09-05 | 2015-03-18 | 信越化学工业株式会社 | Addition curable liquid silicone rubber composition and silicone rubber cured article |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0684477B2 (en) * | 1988-08-23 | 1994-10-26 | 信越化学工業株式会社 | Organopolysiloxane composition |
JPH0786175B2 (en) * | 1990-11-29 | 1995-09-20 | 信越化学工業株式会社 | Silicone rubber composition with excellent release durability |
JP3020386B2 (en) * | 1993-07-21 | 2000-03-15 | ジーイー東芝シリコーン株式会社 | Silicone rubber composition for molding |
JP3106812B2 (en) | 1993-10-20 | 2000-11-06 | 信越化学工業株式会社 | Method for producing organopolysiloxane composition for molding mold for urethane resin |
JP3945984B2 (en) * | 2000-12-27 | 2007-07-18 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Molding material for transparent resin molding |
JP4563977B2 (en) * | 2006-09-22 | 2010-10-20 | 信越化学工業株式会社 | Heat-curable silicone composition and light-emitting diode device using the same |
CN104744943B (en) * | 2015-02-16 | 2017-09-12 | 成都拓利科技股份有限公司 | One kind injection machine-shaping bi-component addition type molded silicon rubber |
JP2016165802A (en) | 2015-03-09 | 2016-09-15 | 株式会社二幸技研 | Manufacturing method of nylon molded article |
JP6344333B2 (en) * | 2015-08-05 | 2018-06-20 | 信越化学工業株式会社 | Addition-curing silicone rubber composition |
-
2019
- 2019-05-27 JP JP2019098643A patent/JP7107279B2/en active Active
-
2020
- 2020-05-22 KR KR1020200061297A patent/KR20200136318A/en unknown
- 2020-05-26 CN CN202010453144.8A patent/CN111995871B/en active Active
- 2020-05-26 TW TW109117435A patent/TWI828912B/en active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104419208A (en) * | 2013-09-05 | 2015-03-18 | 信越化学工业株式会社 | Addition curable liquid silicone rubber composition and silicone rubber cured article |
Also Published As
Publication number | Publication date |
---|---|
JP2020193260A (en) | 2020-12-03 |
CN111995871B (en) | 2023-07-07 |
JP7107279B2 (en) | 2022-07-27 |
CN111995871A (en) | 2020-11-27 |
KR20200136318A (en) | 2020-12-07 |
TW202108700A (en) | 2021-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4684860B2 (en) | Addition-curing liquid silicone rubber composition for injection molding, method for adjusting fluidity of the composition, and injection molding method for silicone rubber composition | |
TWI828912B (en) | Polysilicone rubber composition and polysilicone rubber mold for molding | |
TWI648348B (en) | Addition hardening liquid silicone rubber composition | |
KR101800341B1 (en) | Polysiloxane composition and cured product thereof | |
JP5072508B2 (en) | Silicone rubber composition | |
TWI713535B (en) | Addition hardening silicone rubber composition and hardening | |
JPH0270755A (en) | Organopolysiloxane composition | |
JP2000034411A (en) | Oil-bleeding silicone rubber composition | |
JP2519563B2 (en) | Organopolysiloxane composition and cured product thereof | |
TW202111009A (en) | Room temperature curable silicone rubber composition providing a room temperature curable silicone rubber composition which greatly reduces yellowing or entrainment of bubbles, and gives a cured product having a small change in hardness | |
JPS6335655A (en) | Silicone gel composition | |
JP2000169714A (en) | Curable silicone composition | |
JP7409090B2 (en) | Silicone rubber composition for mold making and silicone rubber mold | |
JP4801941B2 (en) | Silicone rubber composition for tire production and method for producing the same | |
TWI844665B (en) | Silicone rubber composition for molding and silicone rubber mold | |
JP6245119B2 (en) | Silicone rubber composition and method for improving tear strength of cured silicone rubber | |
JP7107276B2 (en) | Molding agent for glass | |
JP2004331742A (en) | Addition-reaction-curing conductive silicone rubber composition, method for curing the same, and cured product of the same | |
JP7143814B2 (en) | Marking ink made of silicone rubber composition | |
JP3746139B2 (en) | Manufacturing method of silicone rubber reversal mold for casting | |
JP5780204B2 (en) | Silicone rubber molding material | |
JP2023119641A (en) | Room temperature curable silicone rubber composition | |
JP2020186342A (en) | Mold-making silicone rubber composition and silicone rubber mold | |
JP2015209451A (en) | Liquid addition-curable silicone rubber composition and method for improving releasability of silicone rubber from mold (metal) | |
JP5072556B2 (en) | Rubber composition for dummy rubber |