TWI820340B - Resin materials for making three-dimensional objects and methods of using the same - Google Patents
Resin materials for making three-dimensional objects and methods of using the same Download PDFInfo
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- TWI820340B TWI820340B TW109122616A TW109122616A TWI820340B TW I820340 B TWI820340 B TW I820340B TW 109122616 A TW109122616 A TW 109122616A TW 109122616 A TW109122616 A TW 109122616A TW I820340 B TWI820340 B TW I820340B
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- Prior art keywords
- blocked
- group
- polymerizable liquid
- curing agent
- reactive
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 229920005989 resin Polymers 0.000 title claims description 32
- 239000011347 resin Substances 0.000 title claims description 32
- 239000000463 material Substances 0.000 title description 33
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 86
- 239000007788 liquid Substances 0.000 claims abstract description 81
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims abstract description 27
- 125000005442 diisocyanate group Chemical group 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 239000000654 additive Substances 0.000 claims abstract description 5
- 230000000996 additive effect Effects 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims description 65
- 238000006243 chemical reaction Methods 0.000 claims description 61
- 125000006239 protecting group Chemical group 0.000 claims description 46
- 230000000903 blocking effect Effects 0.000 claims description 35
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 24
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 23
- 229920001577 copolymer Polymers 0.000 claims description 18
- 229920002635 polyurethane Polymers 0.000 claims description 16
- 239000004814 polyurethane Substances 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 15
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- 238000005516 engineering process Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 14
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- 150000001412 amines Chemical class 0.000 claims description 12
- BEWCNXNIQCLWHP-UHFFFAOYSA-N 2-(tert-butylamino)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCNC(C)(C)C BEWCNXNIQCLWHP-UHFFFAOYSA-N 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 11
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- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 9
- 150000002576 ketones Chemical class 0.000 claims description 8
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 125000000732 arylene group Chemical group 0.000 claims description 6
- 125000000392 cycloalkenyl group Chemical group 0.000 claims description 6
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 6
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- 125000004494 ethyl ester group Chemical group 0.000 claims description 5
- 125000001841 imino group Chemical group [H]N=* 0.000 claims description 5
- 150000001299 aldehydes Chemical class 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
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- 238000010790 dilution Methods 0.000 claims description 2
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- 150000001735 carboxylic acids Chemical class 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 1
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- 238000001723 curing Methods 0.000 description 127
- -1 carboxylate ester Chemical class 0.000 description 48
- 239000000047 product Substances 0.000 description 31
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
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- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 11
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- 230000015572 biosynthetic process Effects 0.000 description 10
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- 239000002202 Polyethylene glycol Substances 0.000 description 9
- 229920002396 Polyurea Polymers 0.000 description 9
- 150000002513 isocyanates Chemical class 0.000 description 9
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- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 8
- GZDFHIJNHHMENY-UHFFFAOYSA-N Dimethyl dicarbonate Chemical compound COC(=O)OC(=O)OC GZDFHIJNHHMENY-UHFFFAOYSA-N 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 235000010300 dimethyl dicarbonate Nutrition 0.000 description 7
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- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 6
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- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
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- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 5
- 229920002582 Polyethylene Glycol 600 Polymers 0.000 description 5
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 5
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
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- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 5
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- BJZYYSAMLOBSDY-QMMMGPOBSA-N (2s)-2-butoxybutan-1-ol Chemical compound CCCCO[C@@H](CC)CO BJZYYSAMLOBSDY-QMMMGPOBSA-N 0.000 description 4
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 4
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 4
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- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 4
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- 238000010586 diagram Methods 0.000 description 4
- MHDVGSVTJDSBDK-UHFFFAOYSA-N dibenzyl ether Chemical class C=1C=CC=CC=1COCC1=CC=CC=C1 MHDVGSVTJDSBDK-UHFFFAOYSA-N 0.000 description 4
- 239000012975 dibutyltin dilaurate Substances 0.000 description 4
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- DYHSDKLCOJIUFX-UHFFFAOYSA-N tert-butoxycarbonyl anhydride Chemical group CC(C)(C)OC(=O)OC(=O)OC(C)(C)C DYHSDKLCOJIUFX-UHFFFAOYSA-N 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
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- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
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- CFXCGWWYIDZIMU-UHFFFAOYSA-N Octyl-3,5-di-tert-butyl-4-hydroxy-hydrocinnamate Chemical compound CCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 CFXCGWWYIDZIMU-UHFFFAOYSA-N 0.000 description 3
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- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- YHEPZZFDBQOSSN-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate;1-o-methyl 10-o-(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound COC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1.C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 YHEPZZFDBQOSSN-UHFFFAOYSA-N 0.000 description 3
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
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- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 3
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- 230000035484 reaction time Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M sodium chloride Inorganic materials [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 3
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- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 2
- LLVWLCAZSOLOTF-UHFFFAOYSA-N 1-methyl-4-[1,4,4-tris(4-methylphenyl)buta-1,3-dienyl]benzene Chemical compound C1=CC(C)=CC=C1C(C=1C=CC(C)=CC=1)=CC=C(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 LLVWLCAZSOLOTF-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
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- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
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- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 2
- YXXLBTJEDKNEPR-UHFFFAOYSA-N C(C(=C)C)(=O)OCCC(C(C)=O)(C)C Chemical compound C(C(=C)C)(=O)OCCC(C(C)=O)(C)C YXXLBTJEDKNEPR-UHFFFAOYSA-N 0.000 description 2
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- NBTQSAHFCNTNFP-UHFFFAOYSA-N [4-hydroxy-3,3-bis(hydroxymethyl)-1,1-di(prop-2-enoyloxy)butyl] prop-2-enoate Chemical compound C(C=C)(=O)OC(CC(CO)(CO)CO)(OC(C=C)=O)OC(C=C)=O NBTQSAHFCNTNFP-UHFFFAOYSA-N 0.000 description 2
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- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 125000000468 ketone group Chemical group 0.000 description 2
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- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 2
- GTCAXTIRRLKXRU-UHFFFAOYSA-N methyl carbamate Chemical compound COC(N)=O GTCAXTIRRLKXRU-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 2
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- 238000003491 array Methods 0.000 description 1
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
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- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
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- IEPBPSSCIZTJIF-UHFFFAOYSA-N bis(2,2,2-trichloroethyl) carbonate Chemical compound ClC(Cl)(Cl)COC(=O)OCC(Cl)(Cl)Cl IEPBPSSCIZTJIF-UHFFFAOYSA-N 0.000 description 1
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- 125000004432 carbon atom Chemical group C* 0.000 description 1
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- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
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- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical compound [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
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- 125000004663 dialkyl amino group Chemical group 0.000 description 1
- YSSSPARMOAYJTE-UHFFFAOYSA-N dibenzo-18-crown-6 Chemical compound O1CCOCCOC2=CC=CC=C2OCCOCCOC2=CC=CC=C21 YSSSPARMOAYJTE-UHFFFAOYSA-N 0.000 description 1
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- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- BKHISZBKCJRQKW-UHFFFAOYSA-N hexane-1,6-diol prop-1-ene Chemical group CC=C.CC=C.OCCCCCCO BKHISZBKCJRQKW-UHFFFAOYSA-N 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 150000005217 methyl ethers Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- UYWQUFXKFGHYNT-UHFFFAOYSA-N phenylmethyl ester of formic acid Natural products O=COCC1=CC=CC=C1 UYWQUFXKFGHYNT-UHFFFAOYSA-N 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- YSUVXWLFCHRCMI-UHFFFAOYSA-N phosphorosomethylbenzene Chemical compound O=PCC1=CC=CC=C1 YSUVXWLFCHRCMI-UHFFFAOYSA-N 0.000 description 1
- 125000001557 phthalyl group Chemical group C(=O)(O)C1=C(C(=O)*)C=CC=C1 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229950010765 pivalate Drugs 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- SONHXMAHPHADTF-UHFFFAOYSA-M sodium;2-methylprop-2-enoate Chemical compound [Na+].CC(=C)C([O-])=O SONHXMAHPHADTF-UHFFFAOYSA-M 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
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- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- FGTJJHCZWOVVNH-UHFFFAOYSA-N tert-butyl-[tert-butyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound CC(C)(C)[Si](C)(C)O[Si](C)(C)C(C)(C)C FGTJJHCZWOVVNH-UHFFFAOYSA-N 0.000 description 1
- KJTULOVPMGUBJS-UHFFFAOYSA-N tert-butyl-[tert-butyl(diphenyl)silyl]oxy-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C(C)(C)C)O[Si](C(C)(C)C)(C=1C=CC=CC=1)C1=CC=CC=C1 KJTULOVPMGUBJS-UHFFFAOYSA-N 0.000 description 1
- 125000005931 tert-butyloxycarbonyl group Chemical group [H]C([H])([H])C(OC(*)=O)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- HEEHTAJHRWKFGD-UHFFFAOYSA-L tetrabutylazanium bromide chloride Chemical compound [Cl-].[Br-].CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC HEEHTAJHRWKFGD-UHFFFAOYSA-L 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- LGSAOJLQTXCYHF-UHFFFAOYSA-N tri(propan-2-yl)-tri(propan-2-yl)silyloxysilane Chemical compound CC(C)[Si](C(C)C)(C(C)C)O[Si](C(C)C)(C(C)C)C(C)C LGSAOJLQTXCYHF-UHFFFAOYSA-N 0.000 description 1
- WILBTFWIBAOWLN-UHFFFAOYSA-N triethyl(triethylsilyloxy)silane Chemical compound CC[Si](CC)(CC)O[Si](CC)(CC)CC WILBTFWIBAOWLN-UHFFFAOYSA-N 0.000 description 1
- 125000004044 trifluoroacetyl group Chemical group FC(C(=O)*)(F)F 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000002221 trityl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C([*])(C1=C(C(=C(C(=C1[H])[H])[H])[H])[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000002888 zwitterionic surfactant Substances 0.000 description 1
Abstract
Description
本申請涉及可聚合的樹脂材料以及使用該材料製備三維物體的方法。 The present application relates to polymerizable resin materials and methods of producing three-dimensional objects using the materials.
本申請主張2019年12月2日提交之申請號為62/942,678的美國臨時申請案的優先權,2020年2月27日提交之申請號為62/982,154的美國臨時申請案的優先權,以及2020年6月12號提交之申請號為PCT/CN2020/095715的的PCT申請案的優先權,所述申請全部內容通過引用合併於本申請。 This application claims priority to U.S. Provisional Application No. 62/942,678, filed on December 2, 2019, and U.S. Provisional Application No. 62/982,154, filed on February 27, 2020, and Priority to the PCT application with application number PCT/CN2020/095715 filed on June 12, 2020, the entire content of which is incorporated into this application by reference.
光固化3D列印技術使用可光固化的樹脂作為原材料,在可見光或紫外光的照射下使其固化。可光固化的樹脂一般為液態,在特定波長的可見光或紫外光的照射下發生光聚合從而完成固化。典型的光固化3D列印流程中,三維物體逐層堆積成型。其中每一層成型通過將該層的二維圖案投影到可光固化的液體樹脂上,從而固化液體樹脂得到與該二維圖案匹配的固體形狀。該圖案通常會顯示在可程式設計顯示器上,例如基於液晶顯示器(Liquid Crystal Display,LCD)或基於數位微鏡器件的數位光處理(Digital Light Processing,DLP)技術的顯示器。圖案通過光學器件從顯示裝置投影到液體上。由於顯示裝置是可程式設計的,因此可以針對不同的層更改顯示器上的圖案。 Light-curing 3D printing technology uses light-curable resin as raw material, which is cured under the irradiation of visible light or ultraviolet light. Photocurable resins are generally in a liquid state and undergo photopolymerization under the irradiation of visible light or ultraviolet light of a specific wavelength to complete curing. In a typical stereolithography 3D printing process, three-dimensional objects are formed layer by layer. Each layer is formed by projecting the two-dimensional pattern of the layer onto a photocurable liquid resin, thereby curing the liquid resin to obtain a solid shape that matches the two-dimensional pattern. The pattern is usually displayed on a programmable display, such as a display based on Liquid Crystal Display (LCD) or Digital Light Processing (DLP) technology based on digital micromirror devices. Patterns are projected onto the liquid from the display device via optics. Because the display device is programmable, the patterns on the display can be changed for different layers.
傳統的光固化3D列印通常包括兩種列印技術:自由液面式(top-down)和約束液面式(bottom-up)。自由液面式列印流程中,可光固化樹脂通過置於樹脂容器上方的光源固化並附著於構建平臺上。當前層固化完成後,構建平臺向樹脂容器方向下降準備下一層固化。每一新固化層都形成在正在構建的三維物體的上表面。與之相反的,約束液面式列印流程中,可光固化樹脂是通過樹脂容器底部的透光窗下方放置的光源固化,每一新固化層都形成在正在構建的三維物體的下表面。約束液面式列印流程中,構建平臺從樹脂容器中抬起並且在每一層之間都需要執行剝離的步驟以便將固化層從樹脂容器的底部剝離。連續液體介面生產(Continuous Liquid Interface Production,CLIP)是一種約束液面式列印技術,其中可光固化樹脂通過樹脂容器底部透氧窗下方放置的光源進行固化。在透氧窗之上的氧氣層(稱為「死區」或「抑制層」)可防止液體樹脂粘附在樹脂容器的底面,因此不需要剝離的步驟,從而實現連續曝光。但是這種技術也有其局限性,比如死區對於溫度非常敏感,較小的溫度波動即可能導致列印失敗。 Traditional light-curing 3D printing usually includes two printing technologies: top-down and bottom-up. In the free-liquid printing process, the photocurable resin is cured by a light source placed above the resin container and attached to the build platform. After the curing of the previous layer is completed, the build platform is lowered toward the resin container to prepare the next layer for curing. Each new solidified layer is formed on the upper surface of the three-dimensional object being built. In contrast, in the constrained liquid printing process, the photocurable resin is cured by a light source placed under a light-transmitting window at the bottom of the resin container, and each new cured layer is formed on the lower surface of the three-dimensional object being built. In the constrained liquid printing process, the build platform is lifted from the resin container and a peeling step is performed between each layer to peel the cured layer from the bottom of the resin container. Continuous Liquid Interface Production (CLIP) is a constrained liquid surface printing technology in which photocurable resin is cured through a light source placed under an oxygen-permeable window at the bottom of the resin container. The oxygen layer above the oxygen-permeable window (called the "dead space" or "inhibition layer") prevents liquid resin from adhering to the bottom of the resin container, so no peeling step is required, allowing for continuous exposure. However, this technology also has its limitations. For example, the dead zone is very sensitive to temperature, and small temperature fluctuations may cause printing failure.
美國專利9,676,963揭露了一種使用可聚合液體產生三維物體的方法,該可聚合液體包括第一光可聚合液體組分和不同於第一組分的第二可固化組分。但是,該種方法使用複數種不同組分的混合物,當兩種組分混合之後有可能發生過早固化從而導致混合物粘度過大。因此三維列印必須在這兩種組分混合後的數小時內開始,否則混合物變得過黏而無法使用。這就需要分開儲存不同的組分,給生產流程增加了複雜性。 US Patent 9,676,963 discloses a method of producing a three-dimensional object using a polymerizable liquid that includes a first photopolymerizable liquid component and a second curable component different from the first component. However, this method uses a mixture of multiple different components. When the two components are mixed, premature curing may occur, resulting in excessive viscosity of the mixture. Therefore, 3D printing must begin within a few hours of mixing the two components, otherwise the mixture becomes too viscous and unusable. This requires separate storage of different components, adding complexity to the production process.
因此,有需求提供更佳的材料以及生產方法使用光固化3D列印技術製造三維物體。 Therefore, there is a need to provide better materials and production methods to use light-curing 3D printing technology to create three-dimensional objects.
本申請描述了使用增材製造技術生產三維物體的方法及材料。在一些實施例中,可用於形成三維物體的材料包含一種可聚合液體,該液體包含:(a)一種封閉或反應型封閉的聚氨酯預聚體;(b)(可選的)一種反應型稀釋劑;(c)一種封閉或反應型封閉的固化劑;(d)一種光引發劑;和(e)(可選的)一種封閉或反應型封閉的二異氰酸酯。 This application describes methods and materials for producing three-dimensional objects using additive manufacturing technology. In some embodiments, materials useful for forming three-dimensional objects comprise a polymerizable liquid comprising: (a) a blocked or reactive blocked polyurethane prepolymer; (b) (optionally) a reactive diluent agent; (c) a blocked or reactive blocked curing agent; (d) a photoinitiator; and (e) (optional) a blocked or reactive blocked diisocyanate.
在一些實施例中,封閉或反應型封閉的聚氨酯預聚體包含多異氰酸酯。 In some embodiments, the blocked or reactive blocked polyurethane prepolymer includes a polyisocyanate.
在一些實施例中,封閉或反應型封閉的聚氨酯預聚體為公式(A)的結構:,其中A和R為獨立選擇的烴基,R’為NH或O,Z為包含反應型環氧基、烯基、炔基或硫醇端基的封閉基團。 In some embodiments, the blocked or reactive blocked polyurethane prepolymer has the structure of formula (A): , where A and R are independently selected hydrocarbon groups, R' is NH or O, and Z is a blocking group containing a reactive epoxy, alkenyl, alkynyl or thiol end group.
在一些實施例中,Z為2-甲基-2-丙烯酸-2-〔(1,1-二甲基乙基)氨〕乙酯(tert-butyl aminoethyl methacrylate,t-BAEMA)。 In some embodiments, Z is 2-methyl-2-acrylic acid-2-[(1,1-dimethylethyl)amino]ethyl ester (t-BAEMA).
在一些實施例中,可聚合液體中包含的封閉或反應型封閉的固化劑為公式(A1),公式(A2)或公式(A3)的結構:
在一些實施例中,保護基團Y1和Y2具備不同結構。 In some embodiments, the protecting groups Y 1 and Y 2 have different structures.
在一些實施例中,封閉或反應型封閉的固化劑包含一個亞氨基基團,該亞氨基基團為醛或酮與胺反應產生的取代基。 In some embodiments, the blocked or reactive blocked curing agent includes an imino group that is a substituent resulting from the reaction of an aldehyde or ketone with an amine.
在一些實施例中,封閉或反應型封閉的固化劑包含一個氨基甲酸酯基團,該氨基甲酸酯基團為羧酸或羧酸酯與胺產生的取代基。 In some embodiments, the blocked or reactive blocked curing agent includes a urethane group that is a substituent derived from a carboxylic acid or carboxylate ester and an amine.
在一些實施例中,保護基團Y1及/或Y2進一步的包含一個可光固化基團。 In some embodiments, the protecting group Y 1 and/or Y 2 further includes a photocurable group.
在一些實施例中,Y1及/或Y2包含的可光固化基團包含丙烯酸酯或甲基丙烯酸酯基團。 In some embodiments, Y 1 and/or Y 2 comprise photocurable groups comprising acrylate or methacrylate groups.
在一些實施例中,可聚合液體中包含的封閉或反應型封閉的固化劑為公式(A4)、公式(A5)或公式(A6)的結構:
本申請進一步的提供了一種形成三維物體的方法,該方法包含:(a)提供一個列印範圍,該列印範圍由一個構建平臺和一個包含成型表面的樹脂容器所定義;(b)用前述可聚合的液體填充該列印範圍;(c)將該列印範圍曝露於能量以形成與所述三維物體形狀基本相同的固體列印中間體;(d)(可選的)清洗所述列印中間體; (e)加熱、微波輻射,或使用其它方法向所述列印中間體提供能量以形成所述三維物體。 The present application further provides a method for forming a three-dimensional object, which method includes: (a) providing a printing range defined by a building platform and a resin container containing a molding surface; (b) using the aforementioned A polymerizable liquid fills the printing range; (c) exposing the printing range to energy to form a solid printing intermediate substantially the same shape as the three-dimensional object; (d) (optional) cleaning the array printing intermediate; (e) Heating, microwave radiation, or using other methods to provide energy to the printing intermediate to form the three-dimensional object.
在一些實施例中,其中所述封閉或反應型封閉的固化劑以固化的形式存在於所述列印中間體中。 In some embodiments, the blocked or reactive blocked curing agent is present in the printing intermediate in a cured form.
在一些實施例中,所述形成的三維物體包含聚氨酯與聚丙烯酸酯的共混聚合物,互穿聚合物網路,半互穿聚合物網路,或者順序互穿聚合物網路。 In some embodiments, the formed three-dimensional object includes a blend polymer of polyurethane and polyacrylate, an interpenetrating polymer network, a semi-interpenetrating polymer network, or a sequential interpenetrating polymer network.
在一些實施例中,所述形成的三維物體包含聚氨酯與聚丙烯酸酯的共聚物。 In some embodiments, the formed three-dimensional object includes a copolymer of polyurethane and polyacrylate.
本申請的實施例具備其它的優點和特徵,當結合以下圖式中的例子,這些優點和特徵在下文中的具體實施方式以及申請專利範圍中會更加顯著:[圖1]係固化機制A的一個實施例的示意圖,該固化機制使用雙重固化樹脂以及不參與光固化的固化劑。 The embodiments of the present application have other advantages and features. When combined with the examples in the following drawings, these advantages and features will be more obvious in the following detailed description and patent application scope: [Figure 1] is a curing mechanism A Schematic diagram of an embodiment using a dual-cure resin and a curing agent that does not participate in light curing.
[圖2]係固化機制B的一個實施例的示意圖,該固化機制使用雙重固化樹脂以及參與光固化的固化劑。 [Fig. 2] is a schematic diagram of an embodiment of the curing mechanism B, which uses a dual-curing resin and a curing agent that participates in photocuring.
[圖3]係固化機制C的一個實施例的示意圖,該固化機制使用雙重固化樹脂以及包含不對稱保護基團的固化劑。 [Fig. 3] is a schematic diagram of an example of curing mechanism C using a dual-curing resin and a curing agent containing an asymmetric protecting group.
[圖4]係固化機制D的一個實施例的示意圖,該固化機制使用雙重固化樹脂以及進一步包含交聯固化部位的固化劑。 [Fig. 4] is a schematic diagram of an embodiment of the curing mechanism D using a dual curing resin and a curing agent further including a cross-linked curing site.
圖式及下述描述僅通過說明的方式涉及優選實施例。應當注意從下述討論中很容易看到,結構及方法的替代實施例均為可行的替代實施方案,而不會超出要求保護的範圍。 The drawings and the following description refer to preferred embodiments by way of illustration only. It should be noted that it will be readily apparent from the following discussion that alternative embodiments of structures and methods are possible alternatives without departing from the scope of the claims.
「二異氰酸酯」和「多異氰酸酯」可互換使用,二者均可指代平均每個分子包含有複數個,或在一些實施例中多於兩個異氰酸酯(NCO)基團的脂肪族異氰酸酯、脂環族異氰酸酯和芳香族異氰酸酯。 "Diisocyanate" and "polyisocyanate" are used interchangeably, and both can refer to aliphatic isocyanates, lipids, and lipids that contain multiple, or in some embodiments more than two, isocyanate (NCO) groups per molecule. Cyclic and aromatic isocyanates.
「二元醇」和「多元醇」可互換使用,二者均可指代平均每個分子包含有複數個,或在一些實施例中多於兩個羥基(OH)基團的脂肪族醇、脂環族醇和芳香族醇。 "Diols" and "polyols" are used interchangeably, and both refer to aliphatic alcohols that contain an average of multiple, or in some embodiments more than two, hydroxyl (OH) groups per molecule. Alicyclic alcohols and aromatic alcohols.
如本申請所用,術語「及/或」指一個或多個所列組分的任何和所有可能的組合,以及缺少任何組分的組合。例如,「A、B及/或C」表示以下所有可能:單獨的A、單獨的B、單獨的C、A和B、A和C、B和C、A和B和C。 As used herein, the term "and/or" refers to any and all possible combinations of one or more of the listed components, as well as combinations lacking any component. For example, "A, B and/or C" means all of the following possibilities: A alone, B alone, C alone, A and B, A and C, B and C, A and B and C.
如本申請所用,術語「可見光」指波長為400-700nm的電磁輻射,「紫外光」指波長為10-400nm的電磁輻射。 As used in this application, the term "visible light" refers to electromagnetic radiation with a wavelength of 400-700 nm, and "ultraviolet light" refers to electromagnetic radiation with a wavelength of 10-400 nm.
如本申請所用,術語「立體光刻」或「光聚合」指在光引發劑的存在下,使液體樹脂發生光聚合製造三維物體的技術。 As used in this application, the term "stereolithography" or "photopolymerization" refers to the technique of photopolymerizing liquid resin in the presence of a photoinitiator to create three-dimensional objects.
如本申請所用,術語「固化」、「硬化」或「聚合」均指代使單體、寡聚物、預聚物及/或聚合物形成三維聚合物網路的流程,這個流程有或有可能沒有固化劑的存在。 As used herein, the terms "curing," "hardening," or "polymerization" refer to the process of forming monomers, oligomers, prepolymers, and/or polymers into a three-dimensional polymer network, which may or may not There may be no curing agent present.
本申請描述的可聚合液體可以用於增材製造業生產三維物體。在一些實施例中,可聚合液體包含以下組分:(a)一種封閉或反應型封閉的聚氨酯預聚體;(b)(可選的)一種反應型稀釋劑;(c)一種封閉或反應型封閉的固化劑; (d)一種光引發劑;和(e)(可選的)一種封閉或反應型封閉的二異氰酸酯。 The polymerizable liquids described in this application can be used in additive manufacturing to produce three-dimensional objects. In some embodiments, the polymerizable liquid includes the following components: (a) a blocked or reactive blocked polyurethane prepolymer; (b) (optional) a reactive diluent; (c) a blocked or reactive Closed curing agent; (d) a photoinitiator; and (e) (optional) a blocked or reactive blocked diisocyanate.
可聚合液體:封閉或反應型封閉的聚氨酯預聚體Polymerizable liquids: blocked or reactive blocked polyurethane prepolymers
在一些實施例中,封閉或反應型封閉的聚氨酯預聚體包含具有以下公式(A)的化合物:,其中A和R為獨立選擇的烴基,R’為NH或O,Z為封閉基團。封閉基團Z與異氰酸酯(-NCO)基團之間的連接鍵是熱不穩定或其他方式不穩定的,因此在不穩定的條件下,此類連接鍵會發生斷裂從而暴露出異氰酸酯基團(-NCO),從而使其自由的與其它組分發生後續反應。NCO封閉基團的實例包括但不限於:酚、壬基酚、吡啶醇、肟、硫代酚、硫醇、醯胺、環醯胺、醯亞胺、咪唑、咪唑啉、甲基乙基酮肟(methylethylketoxime,MEKO)、醇、ε-己內醯胺、吡唑、三唑、脒、羥酸酯或類似物。 In some embodiments, the blocked or reactive blocked polyurethane prepolymer comprises a compound having the following formula (A): , where A and R are independently selected hydrocarbon groups, R' is NH or O, and Z is a blocking group. The bond between the blocking group Z and the isocyanate (-NCO) group is thermally or otherwise unstable, so under unstable conditions, such bond will break and expose the isocyanate group ( -NCO), leaving it free for subsequent reactions with other components. Examples of NCO blocking groups include, but are not limited to: phenol, nonylphenol, pyridinol, oxime, thiophenol, thiol, amide, cyclic amide, amide imine, imidazole, imidazoline, methyl ethyl ketone Oxime (methylethylketoxime, MEKO), alcohol, ε-caprolactam, pyrazole, triazole, amidine, hydroxy acid ester or the like.
在一些實施例中,NCO封閉基團Z可選的可以包含一個反應型端基,使聚氨酯預聚體被反應型封閉。Z包含的反應型端基的實例包括但不限於環氧、烯烴、炔烴、硫代、乙烯基基團。在一個實施例中,封閉基團Z為2-甲基-2-丙烯酸-2-〔(1,1-二甲基乙基)氨〕乙酯(t-BAEMA),具有下列分子式:。在這個實例中,大叔丁基的空間位阻造成封閉基團與異氰酸酯(-NCO)基團之間的連接鍵不穩定,加熱時可能會發生斷裂,因此在加熱條件下該連接鍵的斷裂使異氰酸酯(-NCO)基團可以與固化劑或者可聚合液體中的其它組分發生反應。在其它的一些實例中,封閉基團Z有可能為甲基丙烯酸叔戊基氨基乙基酯(tertiary penylaminoethyl methacrylate, TPAEMA),甲基丙烯酸叔己基氨基乙基乙酯(tertiary hexylaminoethyl methacrylate,THAEMA),甲基丙烯酸叔丁基氨基丙基酯(tertiary-butylaminopropyl methacrylate,TBAPMA)及其混合物。本領域具有通常知識者可以將(甲基)丙烯酸酯基團偶聯至上述已知的NCO封閉基團之上。 In some embodiments, the NCO blocking group Z may optionally include a reactive end group, so that the polyurethane prepolymer is reactively blocked. Examples of reactive end groups included by Z include, but are not limited to, epoxy, olefin, alkyne, thio, and vinyl groups. In one embodiment, blocking group Z is 2-methyl-2-acrylic acid-2-[(1,1-dimethylethyl)amino]ethyl ester (t-BAEMA), having the following molecular formula: . In this example, the steric hindrance of the tert-butyl group causes the bond between the blocking group and the isocyanate (-NCO) group to be unstable and may break when heated. Therefore, the bond breaks under heating conditions. Isocyanate (-NCO) groups can react with curing agents or other components in the polymerizable liquid. In some other examples, the blocking group Z may be tertiary penylaminoethyl methacrylate (TPAEMA), tertiary hexylaminoethyl methacrylate (THAEMA), Tertiary-butylaminopropyl methacrylate (TBAPMA) and its mixtures. One of ordinary skill in the art can couple (meth)acrylate groups to the known NCO blocking groups described above.
在一些實施例中,封閉或反應型封閉的聚氨酯預聚體包含由至少一個二異氰酸酯和至少一個多元醇反應產生的多異氰酸酯寡聚物。二異氰酸酯的實例包括但不限於異佛爾酮二異氰酸酯(isophorone diisocyanate,IPDI)、六亞甲基二異氰酸酯(hexamethylene diisocyanate,HDI)、亞甲基雙(苯基異氰酸酯)(methylenebis(phenyl isocyanate),MDI)、甲苯二異氰酸酯(toluene diisocyanate,TDI)、萘二異氰酸酯(naphthalene diisocyanate,NDI)、亞甲基雙環己基異氰酸酯(methylene bis-cyclohexylisocyanate,HMDI)。多元醇的實例包括但不限於聚醚多元醇和聚酯多元醇,其中一個具體實例為聚丙二醇(poly(propylene oxide),PPO)。此類反應的實例在Velankar、Pazos和Cooper發表的文章Journal of Applied Polymer Science 162,1361(1996)中有所描述,其揭露內容通過引用合併於本申請。 In some embodiments, the blocked or reactive blocked polyurethane prepolymer includes a polyisocyanate oligomer resulting from the reaction of at least one diisocyanate and at least one polyol. Examples of diisocyanates include, but are not limited to, isophorone diisocyanate (IPDI), hexamethylene diisocyanate (HDI), methylenebis(phenyl isocyanate), MDI), toluene diisocyanate (TDI), naphthalene diisocyanate (NDI), methylene bis-cyclohexylisocyanate (HMDI). Examples of polyols include, but are not limited to, polyether polyols and polyester polyols, of which a specific example is poly(propylene oxide), PPO. Examples of such reactions are described in Journal of Applied Polymer Science 162, 1361 (1996) by Velankar, Pazos, and Cooper, the disclosure of which is incorporated herein by reference.
可聚合液體:反應型稀釋劑Polymerizable liquid: reactive diluent
在一些實施例中,反應型稀釋劑可以是具有可光固化基團的可光固化單體或寡聚體。在一些實施例中,可光固化基團可以是可進行自由基聚合的基團。在另一些實施例中,可光固化基團可以是可進行陽離子聚合的基團。在一些實施例中,可光固化的單體或寡聚體可以包含丙烯酸酯、甲基丙烯酸酯、烯烴、N-乙烯基、乙烯基醯胺、乙烯基醚、乙烯基酯、丙烯醯胺、甲基丙烯醯胺、苯乙烯、丙烯酸丙烯酸、環氧、硫代、1,3-二烯、鹵乙烯、丙烯腈、乙烯基酯、馬來醯亞胺、乙烯基醚、以及前述中的兩種或更多種的組合。在一些實施方案中,可光固化的單體或寡聚物可包含環氧/胺、環氧/羥基、氧 雜環丁烷/胺、氧雜環丁烷/醇。反應型稀釋劑可降低光固化聚合物網路的粘度,並與可聚合液體中的可光固化組分發生共聚。 In some embodiments, the reactive diluent can be a photocurable monomer or oligomer having photocurable groups. In some embodiments, the photocurable group may be a radically polymerizable group. In other embodiments, the photocurable group may be a cationically polymerizable group. In some embodiments, photocurable monomers or oligomers may include acrylates, methacrylates, olefins, N-vinyl, vinylamide, vinyl ether, vinyl ester, acrylamide, Methacrylamide, styrene, acrylic, epoxy, thio, 1,3-diene, vinyl halide, acrylonitrile, vinyl ester, maleimide, vinyl ether, and two of the above one or more combinations. In some embodiments, the photocurable monomer or oligomer can comprise epoxy/amine, epoxy/hydroxyl, oxygen Hetetane/amine, oxetane/alcohol. The reactive diluent reduces the viscosity of the photocurable polymer network and copolymerizes with the photocurable component in the polymerizable liquid.
在一些實施例中,反應型稀釋劑可以具有一種或一種以上的官能度。反應型稀釋劑的實例可包括但不限於1,3-丙二醇二丙烯酸酸酯和1,3-丙二醇二甲基丙烯酸酯、1,4-丁二醇二丙烯酸酯和1,4-丁二醇二甲基丙烯酸酯、1,5-戊二醇二丙烯酸酯和1,5-戊二醇二甲基丙烯酸酯、1,6-己二醇二丙烯酸酯和1,6-己二醇二甲基丙烯酸酯、1,7-庚二醇二丙烯酸酯和1,7-庚二醇二甲基丙烯酸酯、1,8-辛二醇二丙烯酸酯和1,8-辛二醇二甲基丙烯酸酯、三羥甲基丙烷三醇三丙烯酸酯和三羥甲基丙烷三醇三甲基丙烯酸酯、乙氧基化三羥甲基丙烷三醇三丙烯酸酯和乙氧基化三羥甲基丙烷三醇三甲基丙烯酸酯、新戊二醇二丙烯酸酯和新戊二醇二甲基丙烯酸酯、三丙二醇二丙烯酸酯和三丙二醇二甲基丙烯酸酯、季戊四醇三丙烯酸酯和季戊四醇三甲基丙烯酸酯,及類似化合物。在一些實施方案中,選擇某些反應型稀釋劑或反應型稀釋劑的某些組合可以增加本申請使用的光引發劑的溶解度。在優選的實施方案中,具有低官能度的單體適用於增加具有粉末形式的光引發劑的溶解度。 In some embodiments, a reactive diluent may have one or more functionalities. Examples of reactive diluents may include, but are not limited to, 1,3-propanediol diacrylate and 1,3-propanediol dimethacrylate, 1,4-butanediol diacrylate and 1,4-butanediol Dimethacrylate, 1,5-pentanediol diacrylate and 1,5-pentanediol dimethacrylate, 1,6-hexanediol diacrylate and 1,6-hexanediol dimethyl acrylate, 1,7-heptanediol diacrylate and 1,7-heptanediol dimethacrylate, 1,8-octanediol diacrylate and 1,8-octanediol dimethacrylate Esters, trimethylolpropane triol triacrylate and trimethylolpropane triol trimethacrylate, ethoxylated trimethylolpropane triol triacrylate and ethoxylated trimethylolpropane Triol trimethacrylate, neopentyl glycol diacrylate and neopentyl glycol dimethacrylate, tripropylene glycol diacrylate and tripropylene glycol dimethacrylate, pentaerythritol triacrylate and pentaerythritol trimethacrylate Esters, and similar compounds. In some embodiments, the selection of certain reactive diluents or certain combinations of reactive diluents can increase the solubility of the photoinitiators used herein. In a preferred embodiment, monomers with low functionality are suitable for increasing the solubility of the photoinitiator in powder form.
可聚合液體:光引發劑Polymerizable liquid: photoinitiator
光引發劑可以是任何能與用於引發光固化反應的光源一起引發光固化反應的光引發劑。在一些實施例中,用於引發光固化反應的光的波長為405nm,在另一些實施例中,用於引發光固化反應的光的波長為385nm。光引發劑的實例包括但不限於安息香醚()、二烷基苯乙酮 ()、羥烷基酮()、醯基氧化膦 ()、氨基酮()、二苯甲酮 ()、噻噸酮()、1,2二酮 ()、1,7,7-三甲基-二環〔2.2.1〕庚烷-2,3-二酮 ()、雙2,6-二氟-3-吡咯苯基二茂鈦(),其中R1、R2、R3、R4是任意數目的包括H、O、C、N、S在內的其它原子。在一些優選實施例中,本申請使用的光引發劑為苯甲醯基膦氧化物,包括TPO()、819()、TEPO ()、819DW()。 The photoinitiator may be any photoinitiator capable of initiating a photocuring reaction together with the light source used to initiate the photocuring reaction. In some embodiments, the wavelength of the light used to initiate the photocuring reaction is 405 nm, and in other embodiments, the wavelength of the light used to initiate the photocuring reaction is 385 nm. Examples of photoinitiators include, but are not limited to, benzoin ether ( ), dialkyl acetophenone ( ), hydroxyalkyl ketone ( ), acylphosphine oxide ( ), aminoketone ( ),Benzophenone( ), thioxanthone ( ), 1,2 dione ( ), 1,7,7-trimethyl-bicyclo[2.2.1]heptane-2,3-dione ( ), bis-2,6-difluoro-3-pyrrophenyl titanocene ( ), where R 1 , R 2 , R 3 , and R 4 are any number of other atoms including H, O, C, N, and S. In some preferred embodiments, the photoinitiator used in this application is benzylphosphine oxide, including TPO ( ), 819( ), TEPO ( ), 819DW( ).
可聚合液體:封閉或反應型封閉的二異氰酸酯Polymerizable liquids: blocked or reactive blocked diisocyanates
在一些實施例中,可聚合液體可選的可以包含封閉或反應型封閉的二異氰酸酯。在一些實施例中,封閉或反應型封閉的二異氰酸酯可包含下述化合物:,其中R為烴基,Z為封閉基團,封閉基團Z的實例可包括但不限於酚、壬基酚、吡啶醇、肟、硫代酚、硫醇、醯胺、環醯胺、醯亞胺、咪唑、咪唑啉、甲基乙基酮肟(MEKO)、醇、ε-己內醯胺、吡唑、三唑、脒、羥酸酯或類似物。封閉基團Z與異氰酸酯(-NCO)基團之間的連接鍵是熱不穩定或其他方式不穩定的,因此在不穩定的條件下,此類連接鍵會發生斷裂從而暴露出異氰酸酯基團(-NCO),從而使其自由的與其它組分發生後 續反應。在一些實施例中,NCO封閉基團Z可選的可以包含一個反應型端基,使二異氰酸酯被反應型封閉。Z包含的反應型端基的實例包括但不限於環氧、烯烴、炔烴、硫代、乙烯基基團。在一個實施例方案中,封閉基團Z為2-甲基-2-丙烯酸-2-〔(1,1-二甲基乙基)氨〕乙酯(t-BAEMA),具有下列分子式:。在這個實例中,大叔丁基的空間位阻造成封閉基團與異氰酸酯(-NCO)基團之間的連接鍵不穩定,加熱時可能會發生斷裂,因此在加熱條件下該連接鍵的斷裂使異氰酸酯(-NCO)基團可以與可聚合液體中的固化劑發生反應。在其它的一些實例中,封閉基團Z有可能為甲基丙烯酸叔戊基氨基乙基酯(TPAEMA)、甲基丙烯酸叔己基氨基乙基乙酯(THAEMA)、甲基丙烯酸叔丁基氨基丙基酯(TBAPMA)及其混合物。本領域具有通常知識者可以將(甲基)丙烯酸酯基團偶聯至上述已知的NCO封閉基團之上。 In some embodiments, the polymerizable liquid may optionally comprise a blocked or reactive blocked diisocyanate. In some embodiments, blocked or reactive blocked diisocyanates may include the following compounds: , where R is a hydrocarbyl group and Z is a blocking group. Examples of the blocking group Z may include but are not limited to phenol, nonylphenol, pyridinol, oxime, thiophenol, thiol, amide, cycloamide, amide Amine, imidazole, imidazoline, methyl ethyl ketoxime (MEKO), alcohol, ε-caprolactam, pyrazole, triazole, amidine, hydroxy acid ester or the like. The bond between the blocking group Z and the isocyanate (-NCO) group is thermally or otherwise unstable, so under unstable conditions, such bond will break and expose the isocyanate group ( -NCO), leaving it free for subsequent reactions with other components. In some embodiments, the NCO blocking group Z may optionally include a reactive end group so that the diisocyanate is reactively blocked. Examples of reactive end groups included by Z include, but are not limited to, epoxy, olefin, alkyne, thio, and vinyl groups. In one embodiment, the blocking group Z is 2-methyl-2-acrylic acid-2-[(1,1-dimethylethyl)amino]ethyl ester (t-BAEMA), which has the following molecular formula: . In this example, the steric hindrance of the tert-butyl group causes the bond between the blocking group and the isocyanate (-NCO) group to be unstable and may break when heated. Therefore, the bond breaks under heating conditions. Isocyanate (-NCO) groups can react with curing agents in polymerizable liquids. In other examples, the blocking group Z may be tert-pentylaminoethyl methacrylate (TPAEMA), tert-hexylaminoethyl methacrylate (THAEMA), tert-butylaminopropyl methacrylate ester (TBAPMA) and its mixtures. One of ordinary skill in the art can couple (meth)acrylate groups to the known NCO blocking groups described above.
可聚合液體:封閉或反應型封閉的固化劑Polymerizable liquids: blocked or reactive blocked curing agents
在一些實施例中,封閉或反應型封閉的固化劑可包含公式(A1)、公式(A2)或公式(A3)的結構:
氨基保護基團Y1及/或Y2的實例可包括但不限於苄氧羰基(Cbz,)、叔丁氧羰基(Boc)、笏甲氧羰基(Fmoc, )、烯丙氧羰基(Alloc,)、三甲基矽乙氧羰基(Teoc, )、甲(或乙)氧羰基()及其組合。在一些實施例 中,醯基基團可以包含鄰苯二甲醯基(Pht,)、對甲苯磺醯基、 (Tos,)、三氟乙醯基(Tfa,)及其組合。在一些實施例 中,烷基基團可以包含三苯甲基(Trt,)、2,4-二甲氧基苄基(Dmb, )、對甲氧基苄基(PMB,)、苄基(Bn,)及其組合。在一些實施例中,氨基保護基團Y1及/或Y2也可以包含1-氯乙基氨基甲酸酯、4-甲氧基苯磺醯胺、乙醯胺、苄胺、苄氧基氨基甲酸酯、甲醯胺、氨基甲酸甲酯、三氟乙醯胺及其組合。氨基保護基團的更多實例可以在Protective Groups in Organic Chemistry,J.McOmie,Springer Science & Business Media,declaration 2012中獲得。 Examples of amino protecting groups Y 1 and/or Y 2 may include but are not limited to benzyloxycarbonyl (Cbz, ), tert-butoxycarbonyl (Boc ), Wat methoxycarbonyl (Fmoc, ), allyloxycarbonyl (Alloc, ), trimethylsilyl ethoxycarbonyl (Teoc, ), methyl (or ethyl)oxycarbonyl ( ) and their combinations. In some embodiments, the acyl group can comprise phthalyl (Pht, ), p-toluenesulfonyl group, (Tos, ), trifluoroacetyl (Tfa, ) and their combinations. In some embodiments, the alkyl group may include trityl (Trt, ), 2,4-dimethoxybenzyl (Dmb, ), p-methoxybenzyl (PMB, ), benzyl (Bn, ) and their combinations. In some embodiments, the amino protecting groups Y 1 and/or Y 2 may also include 1-chloroethyl carbamate, 4-methoxybenzenesulfonamide, acetylamine, benzylamine, benzyloxy Carbamate, formamide, methyl carbamate, trifluoroacetamide and combinations thereof. More examples of amino protecting groups can be found in Protective Groups in Organic Chemistry, J. McOmie, Springer Science & Business Media, declaration 2012.
羥基保護基團Y1及/或Y2的實例可包括但不限於矽醚、苄醚、取代苄醚、取代甲基醚、烷氧基甲基醚、烯丙基醚、芳基醚及其組合。在一些實施例中,矽醚可以包含三甲基矽(trimethylsilyl,TMS)醚、叔丁基甲基矽基(t-Butyldimethylsilyl,TBDMS)醚、叔丁基二笨矽(tert-butyldiphenylsilyl,TBDPS)醚、三異丙基矽(tri-isopropylsilyl,TIPS)醚及其組合。在一些實施例中,苄(benzyl,Bn)醚可以包含烷基羥基的苄基醚、對甲氧基苄基(p-methoxybenzyl,PMB)醚、三苯甲基醚及其組合。在一些實施例中,烷氧基甲 基醚可以包含2-四氫呋喃(tetrahydropyran,THP)醚、甲氧基甲基(methoxymethyl,MOM)醚、a 2-乙氧基乙基(ethoxyethyl,EE)醚、2-三甲基矽烷基乙氧甲基((Trimethylsilyl)ethoxy]methyl,SEM)醚及其組合。在一些實施例中,羥基保護基團Y1及/或Y2可以包含乙醯基、苯甲醯基、新戊醯基、乙酸鹽、苯甲酸酯、新戊酸酯及其組合。在一些實施例中,羥基保護基團Y1及/或Y2還可以包含2,2,2-三氯乙基碳酸酯、2-甲氧基乙氧基甲基醚、2-萘甲基甲醚、4-甲氧基苄基醚、乙酸鹽、苯甲酸酯、苄基醚、苄氧基甲基縮醛、乙氧基乙基縮醛、甲氧基甲基縮醛、甲氧基丙基縮醛、甲基醚、四氫吡喃基縮醛、三乙基甲矽烷基醚、三異丙基甲矽烷基醚、三甲基甲矽烷基醚、叔丁基二苯基甲矽烷基醚、乙炔化物、苯甲醛乙縮醛、碳酸酯、苯甲醛乙縮醛、二叔丁基二氧雜環丁烷及其組合。羥基保護基團的更多實例可以在保護的組在Protective Groups in Organic Chemistry,J.McOmie,Springer Science & Business Media,declaration 2012中獲得。 Examples of hydroxyl protecting groups Y 1 and/or Y 2 may include, but are not limited to, silicon ethers, benzyl ethers, substituted benzyl ethers, substituted methyl ethers, alkoxy methyl ethers, allyl ethers, aryl ethers, and the like. combination. In some embodiments, silicon ethers may include trimethylsilyl (TMS) ether, t-Butyldimethylsilyl (TBDMS) ether, tert-butyldiphenylsilyl (TBDPS) ether, Tri-isopropylsilyl (TIPS) ether and combinations thereof. In some embodiments, benzyl (Bn) ethers may include benzyl ethers of alkylhydroxyl groups, p-methoxybenzyl (PMB) ethers, trityl ethers, and combinations thereof. In some embodiments, alkoxymethyl ethers may include 2-tetrahydropyran (THP) ether, methoxymethyl (MOM) ether, a 2-ethoxyethyl (EE) ether , 2-Trimethylsilylethoxymethyl ((Trimethylsilyl)ethoxy]methyl, SEM) ether and combinations thereof. In some embodiments, the hydroxyl protecting groups Y 1 and/or Y 2 may include acetyl, benzyl, pivalyl, acetate, benzoate, pivalate, and combinations thereof. In some embodiments, the hydroxyl protecting groups Y 1 and/or Y 2 may also include 2,2,2-trichloroethyl carbonate, 2-methoxyethoxymethyl ether, 2-naphthylmethyl Methyl ether, 4-methoxybenzyl ether, acetate, benzoate, benzyl ether, benzyloxymethyl acetal, ethoxyethyl acetal, methoxymethyl acetal, methoxy Propyl acetal, methyl ether, tetrahydropyranyl acetal, triethylsilyl ether, triisopropylsilyl ether, trimethylsilyl ether, tert-butyldiphenylmethyl Silyl ethers, acetylides, benzaldehyde acetals, carbonates, benzaldehyde acetals, di-tert-butyldioxetane and combinations thereof. More examples of hydroxyl protecting groups can be found in Protective Groups in Organic Chemistry, J. McOmie, Springer Science & Business Media, declaration 2012.
在一些實施例中,當固化劑為被保護的胺或亞胺時,保護基團Y1及/或Y2可以包含羧酸或酸酐基團(其中的一個酸酐實例為二碳酸二叔丁酯(Boc2O))、醯氯基團(實例在美國專利號5,231,147、3,639,657、4,430,489中有所描述,其揭露內容以引用方式併入本申請)、醛基或酮基(實例在美國專利3,932,357中有所描述,其揭露內容以引用方式併入本申請)、金屬鹽的絡合物(在美國專利申請US 20070213497A1中描述了這種金屬鹽的實例,二氨基二苯甲烷-NaCl,該文獻的揭露內容以引用方式併入本申請)。 In some embodiments, when the curing agent is a protected amine or imine, the protecting groups Y 1 and/or Y 2 may include carboxylic acid or anhydride groups (an example of an anhydride is di-tert-butyl dicarbonate (Boc 2 O)), a chloride group (examples are described in U.S. Patent Nos. 5,231,147, 3,639,657, and 4,430,489, the disclosures of which are incorporated herein by reference), aldehyde or ketone groups (examples are described in U.S. Patent Nos. 3,932,357 Described in , the disclosure of which is incorporated herein by reference), complexes of metal salts (examples of such metal salts are described in US patent application US 20070213497A1, diaminodiphenylmethane-NaCl, which The disclosures of are incorporated into this application by reference).
在一些實施例中,保護基團Y1及/或Y2可以進一步的包含可光固化基團,該可光固化基團的實例可以包括但不限於丙烯酸酯、甲基丙烯酸酯、烯烴、N-乙烯基、丙烯醯胺、甲基丙烯醯胺、苯乙烯、環氧、硫代、1,3-二烯、鹵乙烯、丙烯腈、乙烯基酯、馬來醯亞胺、乙烯基醚以及前述中的兩種或 更多種的組合。在一些實施例中,可光固化基團可以包含環氧/胺、環氧/羥基、氧雜環丁烷/胺、氧雜環丁烷/醇。在一些實施例中,Y1及/或Y2獨立選擇並具備不同的結構,例如,其中一個保護基團包含可光固化的端基而另一個保護基團不包含此類端基。 In some embodiments, the protecting groups Y 1 and/or Y 2 may further include a photocurable group. Examples of the photocurable group may include but are not limited to acrylate, methacrylate, olefin, N - Vinyl, acrylamide, methacrylamide, styrene, epoxy, thio, 1,3-diene, vinyl halide, acrylonitrile, vinyl ester, maleimide, vinyl ether and A combination of two or more of the foregoing. In some embodiments, the photocurable groups may include epoxy/amine, epoxy/hydroxy, oxetane/amine, oxetane/alcohol. In some embodiments, Y 1 and/or Y 2 are independently selected and have different structures, for example, one protecting group includes a photocurable end group and the other protecting group does not include such an end group.
在一些實施例中,保護基團Y1及/或Y2可以包含一個可光固化的甲基丙烯酸酯基團。在一些實施例中,保護基團Y1及/或Y2獨立選擇並具備相同的或不同的結構。本領域具有通常知識者可以將(甲基)丙烯酸酯基團偶聯至上述已知的保護基團之上。 In some embodiments, the protecting groups Y 1 and/or Y 2 may include a photocurable methacrylate group. In some embodiments, the protecting groups Y 1 and/or Y 2 are independently selected and have the same or different structures. One of ordinary skill in the art can couple (meth)acrylate groups to the above-mentioned known protecting groups.
在一些實施例中,未被取代的保護基團Y1及/或Y2可以包含下式的化合物:(當偶聯至氨基或羥基起保護作用時酮基中的氧原子被取代),其中Ry可以是: In some embodiments, the unsubstituted protecting groups Y 1 and/or Y 2 may include compounds of the following formula: (The oxygen atom in the ketone group is substituted when coupled to the amino or hydroxyl group for protection), where Ry can be:
(1)直鏈或支鏈烴基。在一些實施例中,烴基中的碳原子數目可以在1-10的範圍內;在一個實例中,未被取代的保護基團Y1及/或Y2可以包含下式的化 合物:;在另一個實例中,未被取代的保護基團Y1及/或Y2 可以包含下式的化合物:,其中n為範圍在1-10內的整數。 (1) Straight chain or branched hydrocarbon group. In some embodiments, the number of carbon atoms in the hydrocarbon group may be in the range of 1-10; in one example, the unsubstituted protecting groups Y 1 and/or Y 2 may include compounds of the following formula: ; In another example, the unsubstituted protecting groups Y 1 and/or Y 2 may include compounds of the following formula: , where n is an integer in the range 1-10.
(2)包含烷氧基的重複單元,在一些實施例中,重複單元的數目可以在1-10範圍內。在一個實例中,未被取代的保護基團Y1及/或Y2可以包含下式的化合物:,其中n為範圍在1-10內的整數,R為直鏈或支鏈的烴基。 (2) Repeating units containing alkoxy groups. In some embodiments, the number of repeating units may range from 1 to 10. In one example, the unsubstituted protecting groups Y 1 and/or Y 2 may include compounds of the following formula: , where n is an integer in the range of 1-10, and R is a linear or branched hydrocarbon group.
(3)包含酯基的重複單元; (3) Repeating units containing ester groups;
(4)包含矽氧烷基的重複單元;或 (4) Repeating units containing siloxane groups; or
(5)包含硫醚基的重複單元。 (5) Repeating units containing thioether groups.
下面的反應式顯示了一些上述保護基團Y1及/或Y2的製備方法的實例:
在一些實施例中,未被取代的保護基團Y1及/或Y2可以是甲基異丁基酮(Methyl Isobutyl Ketone,MIBK),其中的氧原子當偶聯至氨基或羥基起保護作用時被取代。 In some embodiments, the unsubstituted protecting groups Y 1 and/or Y 2 can be methyl isobutyl ketone (MIBK), in which the oxygen atom plays a protective role when coupled to the amino or hydroxyl group. time to be replaced.
在一些實施例中,封閉或反應型封閉的固化劑為公式(A4),公式(A5)或公式(A6)的結構:
在一些實施例中,固化劑可以具備下式的結構:
,作為一個公式(A5)的實例,R5為二乙氨基,X為甲基丙烯酸2-羥丙酯,Y1和Y2為甲基異丁基酮(MIBK)(其中的氧原子當偶聯至氨基起保護作用時被取代)。在這個實例中,該固化劑可以由下式所示的反應機制產生:
本申請的一些實施例提供了一種使用本申請所述的可聚合液體產生三維物體的方法,該方法包含以下步驟: Some embodiments of the present application provide a method for producing a three-dimensional object using the polymerizable liquid described in the present application, the method comprising the following steps:
(1)提供一個列印範圍,該列印範圍由一個構建平臺和一個包含成型表面的樹脂容器所定義; (1) Provide a printing range defined by a build platform and a resin container containing the molding surface;
(2)用一種可聚合的液體填充該列印範圍,該液體包含;(a)一種封閉或反應型封閉的聚氨酯預聚體;(b)(可選的)一種反應型稀釋劑;(c)一種封閉或反應型封閉的固化劑;(d)光引發劑;和(e)(可選的)一種封閉或反應型封閉的二異氰酸酯。 (2) Fill the printing range with a polymerizable liquid, which liquid contains: (a) a blocked or reactive blocked polyurethane prepolymer; (b) (optional) a reactive diluent; (c) ) a blocked or reactive blocked curing agent; (d) a photoinitiator; and (e) (optional) a blocked or reactive blocked diisocyanate.
(3)將該列印範圍曝光以形成與所述三維物體形狀基本相同的固體列印中間體;在一些實施例中,封閉或反應型封閉的固化劑以未固化的形式包含在列印中間體中;在另一些實施例中,封閉或反應型封閉的固化劑可通過可光固化的端基在曝光流程中參與光固化反應,因此所述固化劑以固化的形式包含在列印中間體中。 (3) Expose the printing range to form a solid printing intermediate that is substantially the same shape as the three-dimensional object; in some embodiments, a blocked or reactive blocked curing agent is included in the printing intermediate in an uncured form In other embodiments, the blocked or reactive blocked curing agent can participate in the photocuring reaction during the exposure process through the photocurable end group, so the curing agent is included in the printing intermediate in a cured form. middle.
(4)(可選的)清洗所述列印中間體; (4) (Optional) Clean the printing intermediate;
(5)加熱、微波輻射,暴露於水蒸氣中或使用其它方法向所述列印中間體提供能量通過第二固化步驟以形成所述三維物體。在加熱、微波輻射、濕潤條件或其它已知條件下,聚氨酯預聚體的封閉基團以及固化劑的保護基團發生裂解,這意味著封閉/保護基團與其被封閉/保護的部分之間的連結發生斷裂,使被封閉/保護的部位暴露出來以進行進一步固化。取決於本申請所述固化劑的不同設計,本申請可以有不同的固化機制。這些固化機制的非限制性實例在下文中做進一步描述。 (5) Heating, microwave radiation, exposure to water vapor or using other methods to provide energy to the printing intermediate through the second curing step to form the three-dimensional object. Under heating, microwave radiation, humid conditions or other known conditions, the blocking group of the polyurethane prepolymer and the protecting group of the curing agent are cleaved, which means that the blocking/protecting group and its blocked/protected part The bonds break, exposing the enclosed/protected area for further solidification. Depending on the different designs of the curing agents described in this application, this application may have different curing mechanisms. Non-limiting examples of these curing mechanisms are described further below.
A.採用不參與光固化反應的固化劑的雙重固化樹脂材料A. Dual-curing resin materials using curing agents that do not participate in the light-curing reaction
在一些實施例中,保護基團Y1和Y2是獨立選擇的氨基或羥基保護基團,不包含可光固化基團。在這些實施例中,當包含這種固化劑的可聚合液體暴露於光下以形成列印中間體時,列印中間體包含以未固化形式存在的固化劑。光固化之後,在加熱、微波輻射、濕潤條件或其它已知的合適條件下,保護基團Y1和Y2被裂解從而暴露出被保護的氨基或羥基以進一步固化。這種固化機制的一個實例如圖1所示。 In some embodiments, protecting groups Y 1 and Y 2 are independently selected amino or hydroxyl protecting groups and do not contain a photocurable group. In these embodiments, the printing intermediate includes the curing agent in an uncured form when the polymerizable liquid containing such curing agent is exposed to light to form the printing intermediate. After photocuring, under heating, microwave radiation, humid conditions or other known suitable conditions, the protecting groups Y 1 and Y 2 are cleaved to expose the protected amino or hydroxyl groups for further curing. An example of this solidification mechanism is shown in Figure 1.
在圖1所示的實例中,被烯鍵式不飽和封閉基團封閉的聚氨酯預聚體與(可選的)反應型稀釋劑一起進行光固化反應,從而形成交聯網路(即固體的列印中間體),其中含有以未固化形式存在的被保護的固化劑。在圖1所示的固化機制中,固化劑為二胺化合物。光固化反應後,在加熱、微波輻射、濕潤條件或其它已知的合適條件下,封閉異氰酸酯基團的封閉基團發生裂解將其暴露以進行進一步固化。同樣在相同條件下,保護氨基的保護基團也發生裂解使氨基暴露與異氰酸酯基團反應形成網路結構,該網路結構包含下述組成部分:(a)線性熱塑性聚氨酯,聚脲及/或其共聚物;(b)交聯的熱固性聚氨酯,聚脲及/或其共聚物;(c)UV-固化的聚丙烯酸酯(線性或交聯); (d)前述組分組合。所述網路可以是互穿聚合物網路(IPN)、半互穿或偽IPN、順序IPN。但是,在這些實施例中,網路中的聚氨酯部分與網路中的聚丙烯酸酯部分沒有發生共價鍵合。在一些實施例中,網路中還包含其它組分,例如脫保護的固化劑與反應型稀釋劑形成的共聚物,以及未反應的光引發劑或類似物。 In the example shown in Figure 1, a polyurethane prepolymer blocked with ethylenically unsaturated blocking groups undergoes a photocuring reaction together with an (optional) reactive diluent to form cross-linked networks (i.e., solid arrays). printing intermediate) containing a protected curing agent in an uncured form. In the curing mechanism shown in Figure 1, the curing agent is a diamine compound. After the photocuring reaction, under heating, microwave radiation, moist conditions or other known suitable conditions, the blocking group blocking the isocyanate group is cleaved to expose it for further curing. Also under the same conditions, the protecting group protecting the amino group is also cleaved, exposing the amino group and reacting with the isocyanate group to form a network structure. The network structure includes the following components: (a) linear thermoplastic polyurethane, polyurea and/or Copolymers thereof; (b) cross-linked thermosetting polyurethanes, polyureas and/or copolymers thereof; (c) UV-cured polyacrylates (linear or cross-linked); (d) Combination of the aforementioned components. The network may be an interpenetrating polymer network (IPN), semi-interpenetrating or pseudo IPN, or sequential IPN. However, in these examples, the polyurethane portion of the network is not covalently bonded to the polyacrylate portion of the network. In some embodiments, the network also includes other components, such as a copolymer of a deprotected curing agent and a reactive diluent, as well as unreacted photoinitiator or the like.
B.採用參與光固化反應的固化劑的雙重固化樹脂材料B. Dual-curing resin materials using curing agents that participate in photocuring reactions
在一些實施例中,保護基團Y1和Y2獨立選擇的氨基或羥基保護基團,同時包含可光固化基團。在這些實施例中,當包含這種固化劑的可聚合液體暴露於光下以形成列印中間體時,列印中間體包含以固化形式存在的固化劑。這種固化機制的一個實例如圖2所示。 In some embodiments, protecting groups Y 1 and Y 2 are independently selected amino or hydroxyl protecting groups and also include photocurable groups. In these embodiments, the printing intermediate includes the curing agent in a cured form when the polymerizable liquid containing such curing agent is exposed to light to form the printing intermediate. An example of this solidification mechanism is shown in Figure 2.
在圖2所示的實例中,被烯鍵式不飽和封閉基團封閉的聚氨酯預聚體與同樣被烯鍵式不飽和基團保護的固化劑,以及(可選的)反應型稀釋劑一起進行光固化反應,從而形成交聯網路(即固體的列印中間體),其中含有以固化形式存在的被保護的固化劑。在圖2所示的固化機制中,固化劑為二胺化合物,兩端均被可光固化基團保護。在這些實施例中,因為列印中間體中的固化劑以固化形式存在,所以列印中間體具備更佳的機械性能,以及更加容易操作的後處理流程。光固化反應後,在加熱、微波輻射、濕潤條件或其它已知的合適條件下,封閉異氰酸酯基團的封閉基團發生裂解將其暴露以進行進一步固化。同樣在相同條件下,保護氨基的保護基團也發生裂解使氨基暴露與異氰酸酯基團反應形成網路結構,該網路結構包含下述組成部分:(a)線性熱塑性聚氨酯,聚脲及/或其共聚物;(b)交聯的熱固性聚氨酯,聚脲及/或其共聚物;(c)UV-固化的聚丙烯酸酯(線性或交聯);(d)前述組分組合。所述網路可以是互穿聚合物網路(IPN)、半互穿或偽IPN、順序IPN。但是,在這些實施例中,網路中的聚氨酯部分與網路中的聚丙烯酸酯部分沒有發生共價鍵 合。在一些實施例中,網路中還包含其它組分,例如脫保護的固化劑與反應型稀釋劑形成的共聚物,以及未反應的光引發劑或類似物。 In the example shown in Figure 2, a polyurethane prepolymer blocked with ethylenically unsaturated blocking groups is used together with a curing agent also blocked with ethylenically unsaturated groups, and (optionally) a reactive diluent. A photocuring reaction is carried out to form a cross-linked network (i.e., a solid printing intermediate), which contains a protected curing agent in a cured form. In the curing mechanism shown in Figure 2, the curing agent is a diamine compound, and both ends are protected by photocurable groups. In these embodiments, because the curing agent in the printing intermediate exists in a cured form, the printing intermediate has better mechanical properties and a post-processing process that is easier to operate. After the photocuring reaction, under heating, microwave radiation, moist conditions or other known suitable conditions, the blocking group blocking the isocyanate group is cleaved to expose it for further curing. Also under the same conditions, the protecting group protecting the amino group is also cleaved, exposing the amino group and reacting with the isocyanate group to form a network structure. The network structure includes the following components: (a) linear thermoplastic polyurethane, polyurea and/or Copolymers thereof; (b) cross-linked thermosetting polyurethane, polyurea and/or copolymers thereof; (c) UV-cured polyacrylate (linear or cross-linked); (d) combinations of the aforementioned components. The network may be an interpenetrating polymer network (IPN), semi-interpenetrating or pseudo IPN, or sequential IPN. However, in these examples, the polyurethane portion of the network is not covalently bonded to the polyacrylate portion of the network. combine. In some embodiments, the network also includes other components, such as a copolymer of a deprotected curing agent and a reactive diluent, as well as unreacted photoinitiator or the like.
C.採用具有不對稱保護基團的固化劑的雙重固化樹脂材料C. Dual-cure resin materials using curing agents with asymmetric protective groups
在一些實施例中,保護基團Y1和Y2是獨立選擇的氨基或羥基保護基團,具備不同的結構。在一些實例中,其中一個保護基團包含可光固化端基而另一個保護基團不包含可光固化端基。在這些實施例中,當包含這種固化劑的可聚合液體暴露於光下以形成列印中間體時,列印中間體包含以固化形式存在的固化劑。這種固化機制的一個實例如圖3所示。 In some embodiments, the protecting groups Y 1 and Y 2 are independently selected amino or hydroxyl protecting groups and have different structures. In some examples, one of the protecting groups includes a photocurable end group and the other protecting group does not include a photocurable end group. In these embodiments, the printing intermediate includes the curing agent in a cured form when the polymerizable liquid containing such curing agent is exposed to light to form the printing intermediate. An example of this solidification mechanism is shown in Figure 3.
在圖3所示的實例中,被烯鍵式不飽和封閉基團封閉的聚氨酯預聚體與只有一端同樣被烯鍵式不飽和基團保護的固化劑,以及(可選的)反應型稀釋劑一起進行光固化反應,從而形成交聯網路(即固體的列印中間體),其中含有以固化形式存在的被保護的固化劑。在圖3所示的固化機制中,固化劑為二胺化合物,僅一端被可光固化基團保護。在這些實施例中,因為列印中間體中的固化劑以固化形式存在,所以列印中間體具備更佳的機械性能,以及更加容易操作的後處理流程。光固化反應後,在加熱、微波輻射、濕潤條件或其它已知的合適條件下,封閉異氰酸酯基團的封閉基團發生裂解將其暴露以進行進一步固化。同樣在相同條件下,保護氨基的保護基團也發生裂解使氨基暴露與異氰酸酯基團反應形成網路結構,該網路結構包含下述組成部分:(a)線性熱塑性聚氨酯,聚脲及/或其共聚物;(b)交聯的熱固性聚氨酯,聚脲及/或其共聚物;(c)UV-固化的聚丙烯酸酯(線性或交聯);(d)前述組分組合。所述網路可以是互穿聚合物網路(IPN)、半互穿或偽IPN、順序IPN。但是,在這些實施例中,網路中的聚氨酯部分與網路中的聚丙烯酸酯部分沒有發生共價鍵合。與上述固化機制B相比,固化機制C提供了另外一種可以調節三維物體組成的可能選擇,從而達到調整三維列印物體的物理性能的目的。在一些 實施例中,網路中還包含其它組分,例如脫保護的固化劑與反應型稀釋劑形成的共聚物,以及未反應的光引發劑或類似物。 In the example shown in Figure 3, a polyurethane prepolymer blocked by an ethylenically unsaturated blocking group is combined with a curing agent that is also blocked by an ethylenically unsaturated group on only one end, and (optional) reactive dilution The photocuring reaction is carried out together with the printing agent to form a cross-linked network (i.e., a solid printing intermediate), which contains a protected curing agent in a cured form. In the curing mechanism shown in Figure 3, the curing agent is a diamine compound with only one end protected by a photocurable group. In these embodiments, because the curing agent in the printing intermediate exists in a cured form, the printing intermediate has better mechanical properties and a post-processing process that is easier to operate. After the photocuring reaction, under heating, microwave radiation, moist conditions or other known suitable conditions, the blocking group blocking the isocyanate group is cleaved to expose it for further curing. Also under the same conditions, the protecting group protecting the amino group is also cleaved, exposing the amino group and reacting with the isocyanate group to form a network structure. The network structure includes the following components: (a) linear thermoplastic polyurethane, polyurea and/or Copolymers thereof; (b) cross-linked thermosetting polyurethane, polyurea and/or copolymers thereof; (c) UV-cured polyacrylate (linear or cross-linked); (d) combinations of the aforementioned components. The network may be an interpenetrating polymer network (IPN), semi-interpenetrating or pseudo IPN, or sequential IPN. However, in these examples, the polyurethane portion of the network is not covalently bonded to the polyacrylate portion of the network. Compared with the above-mentioned curing mechanism B, curing mechanism C provides another possible option for adjusting the composition of three-dimensional objects, thereby achieving the purpose of adjusting the physical properties of three-dimensional printed objects. in some In embodiments, the network also includes other components, such as a copolymer formed by a deprotected curing agent and a reactive diluent, as well as unreacted photoinitiator or the like.
D.採用具有交聯固化部位的固化劑的雙重固化樹脂材料D. Dual-cured resin materials using curing agents with cross-linked curing sites
在一些實施例中,保護基團Y1和Y2是獨立選擇的氨基或羥基保護基團,但不包含可光固化基團。固化劑同時還包含一個交聯固化部位,X,使其能夠在雙重固化流程中使熱塑性聚氨酯鏈段與UV-固化的交聯聚丙烯酸酯部分交聯,以形成丙烯酸酯-氨基甲酸酯共聚物。在這些實施例中,當包含這種固化劑的可聚合液體暴露於光下以形成列印中間體時,列印中間體包含以固化形式存在的固化劑。這種固化機制的一個實例如圖4所示。 In some embodiments, protecting groups Y 1 and Y 2 are independently selected amino or hydroxyl protecting groups but do not contain a photocurable group. The curing agent also contains a cross - linking cure site, things. In these embodiments, the printing intermediate includes the curing agent in a cured form when the polymerizable liquid containing such curing agent is exposed to light to form the printing intermediate. An example of this solidification mechanism is shown in Figure 4.
在圖4所示的實例中,被烯鍵式不飽和封閉基團封閉的聚氨酯預聚體與在交聯固化部位同樣被烯鍵式不飽和基團保護的固化劑,以及(可選的)反應型稀釋劑一起進行光固化反應,從而形成交聯網路(即固體的列印中間體),其中含有以固化形式存在的被保護的固化劑。除去能夠使固化劑參與光固化反應的交聯固化部位之外,該固化劑還包含一個或多個被保護的氨基或羥基,所述氨基或羥基一旦脫離保護之後,即可以與脫離封閉的聚氨酯預聚體發生反應產生聚氨酯。在圖4所示的固化機制中,固化劑為包含兩個被保護的氨基和一個烯鍵式不飽和交聯固化部位的二胺化合物。在這些實施例中,因為列印中間體中的固化劑以固化形式存在,所以列印中間體具備更佳的機械性能,以及更加容易操作的後處理流程。光固化反應後,在加熱、微波輻射、濕潤條件或其它已知的合適條件下,封閉異氰酸酯基團的封閉基團發生裂解將其暴露以進行進一步固化。同樣在相同條件下,保護氨基的保護基團也發生裂解使氨基暴露與異氰酸酯基團反應形成網路結構,該網路結構包含下述組成部分:(a)線性熱塑性聚氨酯、聚脲及/或其共聚物;(b)交聯的熱固性聚氨酯、聚脲及/或其共聚物;(c)UV-固化的聚丙烯酸酯(線性或交聯);(d) 聚氨酯、聚脲及/或其共聚物與UV-固化的聚丙烯酸酯的共聚物和(e)前述組分組合。與前述固化機制相比,此固化機制共價鍵結合了網路中的聚氨酯部分和網路中的聚丙烯酸酯部分,因此所形成的三維物體不僅保持了良好的伸長性,而且提供了更佳的強度和耐久性。在一些實施例中,網路中還包含其它組分,例如脫保護的固化劑與反應型稀釋劑形成的共聚物,以及未反應的光引發劑或類似物。 In the example shown in Figure 4, a polyurethane prepolymer blocked by ethylenically unsaturated blocking groups is combined with a curing agent that is also blocked by ethylenically unsaturated groups at the crosslinking cure site, and (optionally) The reactive diluent undergoes a photocuring reaction together to form a cross-linked network (i.e., a solid printing intermediate), which contains the protected curing agent in a cured form. In addition to the cross-linked curing site that enables the curing agent to participate in the photocuring reaction, the curing agent also contains one or more protected amino groups or hydroxyl groups. Once the amino groups or hydroxyl groups are deprotected, they can be combined with the deblocked polyurethane. The prepolymers react to produce polyurethane. In the curing mechanism shown in Figure 4, the curing agent is a diamine compound containing two protected amino groups and an ethylenically unsaturated cross-linking curing site. In these embodiments, because the curing agent in the printing intermediate exists in a cured form, the printing intermediate has better mechanical properties and a post-processing process that is easier to operate. After the photocuring reaction, under heating, microwave radiation, moist conditions or other known suitable conditions, the blocking group blocking the isocyanate group is cleaved to expose it for further curing. Also under the same conditions, the protecting group protecting the amino group is also cleaved, exposing the amino group and reacting with the isocyanate group to form a network structure. The network structure includes the following components: (a) linear thermoplastic polyurethane, polyurea and/or Copolymers thereof; (b) Cross-linked thermosetting polyurethanes, polyureas and/or copolymers thereof; (c) UV-cured polyacrylates (linear or cross-linked); (d) Copolymers of polyurethanes, polyureas and/or copolymers thereof with UV-cured polyacrylates and (e) the aforementioned components in combination. Compared with the previous curing mechanism, this curing mechanism covalently combines the polyurethane part of the network and the polyacrylate part of the network, so the three-dimensional object formed not only maintains good extensibility, but also provides better strength and durability. In some embodiments, the network also includes other components, such as a copolymer of a deprotected curing agent and a reactive diluent, as well as unreacted photoinitiator or the like.
使用常用已知的光固化3D列印技術,例如立體光刻(stereolithography,SLA)、數位化光處理(DLP)以及材料噴射(Material Jetting,MJ)可以將本申請所揭露的可聚合液體的實施例用於製造三維物體。在一些實施例中,本申請的一種形成三維物體的增材製造方法,包含下列步驟:(a)提供一個列印範圍,該列印範圍由一個構建平臺和一個包含成型表面的樹脂容器所定義;(b)用本申請所述的可聚合的液體填充該列印範圍;(c)將該列印範圍曝露於能量以形成與所述三維物體形狀基本相同的固體列印中間體;(d)(可選的)清洗所述列印中間體;(e)加熱、微波輻射,或使用其它方法向所述列印中間體提供能量以形成所述三維物體。 The polymerizable liquid disclosed in the present application can be implemented using commonly known light-curing 3D printing technologies, such as stereolithography (SLA), digital light processing (DLP) and material jetting (MJ). Examples are used to create three-dimensional objects. In some embodiments, an additive manufacturing method for forming a three-dimensional object of the present application includes the following steps: (a) providing a printing range defined by a building platform and a resin container containing a molding surface ; (b) filling the printing range with the polymerizable liquid described in the present application; (c) exposing the printing range to energy to form a solid printing intermediate that is substantially the same shape as the three-dimensional object; (d) ) (optional) cleaning the printing intermediate; (e) heating, microwave radiation, or using other methods to provide energy to the printing intermediate to form the three-dimensional object.
在一些實施例中,本申請所述的方法中,可聚合液體包含重量百分比為1%-99%範圍內的封閉或反應型封閉的聚氨酯預聚體以及重量百分比為1%-99%範圍內的封閉或反應型封閉的固化劑。 In some embodiments, in the methods described herein, the polymerizable liquid includes a blocked or reactive blocked polyurethane prepolymer in a range of 1% to 99% by weight and a blocked or reactive blocked polyurethane prepolymer in a range of 1% to 99% by weight. Blocking or reactive blocking curing agent.
在一些實施例中,首先使用DLP列印機通過第一固化步驟的光固化產生列印中間體。在一些實施例中,用於引發光固化的波長為405nm,在另一些實施例中,用於引發光固化的波長為385nm。任何能與用於引發光固化 反應的光源一起引發光固化反應的光引發劑均可以被使用。在一些優選實施例中,波長超過400nm的光用於引發光固化,特別的會使用405nm波長。在這些優選實施例中,光引發劑819用於引發波長超過400nm的光,因為819光引發劑在氧化膦光引發劑家族中對長波長UV範圍具有更強的吸收。 In some embodiments, the printing intermediate is first produced by photocuring in a first curing step using a DLP printer. In some embodiments, the wavelength used to initiate photocuring is 405 nm, and in other embodiments, the wavelength used to initiate photocuring is 385 nm. Anything that can be used to initiate photocuring Photoinitiators that initiate the photocuring reaction together with the reactive light source can be used. In some preferred embodiments, light with a wavelength exceeding 400 nm is used to initiate photocuring, with a wavelength of 405 nm being particularly used. In these preferred embodiments, photoinitiator 819 is used to initiate light with wavelengths in excess of 400 nm because 819 photoinitiator has stronger absorption in the long wavelength UV range within the phosphine oxide photoinitiator family.
在列印中間體形成之後,可選的可以對列印中間體進行清洗及乾燥。在一些實施例中,清洗液可以是水性的,包含水和表面活性劑。在一些實施例中,水可以為去離子水。表面活性劑的實例可以包括但不限於陰離子表面活性劑(例如,硫酸鹽、磺酸鹽、羧酸鹽和磷酸酯)、陽離子表面活性劑、兩性離子表面活性劑、非離子表面活性劑或類似物,及其組合。常見實例包括但不限於硬脂酸鈉、直鏈烷基苯磺酸鹽、木質素磺酸鹽、脂肪醇乙氧基化物、烷基酚乙氧基化物或類似物,及其組合。 After the printing intermediate is formed, the printing intermediate may optionally be cleaned and dried. In some embodiments, the cleaning solution may be aqueous, containing water and surfactants. In some embodiments, the water can be deionized water. Examples of surfactants may include, but are not limited to, anionic surfactants (e.g., sulfates, sulfonates, carboxylates, and phosphates), cationic surfactants, zwitterionic surfactants, nonionic surfactants, or the like Objects, and their combinations. Common examples include, but are not limited to, sodium stearate, linear alkylbenzene sulfonate, lignosulfonate, fatty alcohol ethoxylate, alkylphenol ethoxylate or the like, and combinations thereof.
在可選的清洗步驟之後,列印中間體進行進一步固化以形成最終的列印三維物體。第二步固化可以通過加熱、加濕、微波輻射,或其它合適的能量源進行,所述能量源可以使可聚合液體中的封閉及保護基團發生裂解從而引發第二步固化。在一些實施例中,第二步固化為熱固化。在一些實施例中,熱固化的溫度為室溫至200 C的範圍內,熱固化的時間可以在0.5至200h的範圍內。在一些實施例中,第二步固化可以是在加濕條件下進行加熱。 After an optional cleaning step, the printed intermediate is further cured to form the final printed 3D object. The second-step curing can be performed by heating, humidification, microwave radiation, or other suitable energy sources, which can cause the blocking and protecting groups in the polymerizable liquid to cleave to initiate the second-step curing. In some embodiments, the second step of curing is thermal curing. In some embodiments, the thermal curing temperature ranges from room temperature to 200 C, and the thermal curing time ranges from 0.5 to 200 h. In some embodiments, the second step of curing may be heating under humidified conditions.
以下非限制性示例中詳細解釋了本申請的實施例: Embodiments of the present application are explained in detail in the following non-limiting examples:
將200g無水聚丁二醇(polybutylene glycol,PTMG 1000)添加到帶有頂置攪拌器、氮氣保護和溫度計的500mL三頸燒瓶中。然後將67.2g六亞甲基二異氰酸酯(HDI)添加到該燒瓶中並攪拌成與PTMG的均勻溶液10min,
接著添加140μL催化劑二月桂酸二丁基錫(dibutyltindilaurate,DBTL)在70℃下反應3h。在3h後,逐漸添加75g 2-甲基-2-丙烯酸-2-〔(1,1-二甲基乙基)氨〕乙酯(tertiary-butylaminoethyl methacrylate,TBAEMA)。然後將溫度設定為50℃並加入100ppm對苯二酚。使該反應繼續10h,得到透明液體產物A。反應式為下述所示:
將88.9g異佛爾酮二異氰酸酯(IPDI)添加到帶有頂置攪拌器、氮氣保護和溫度計的500mL三頸燒瓶中,添加140μL催化劑DBTL和75g TBAEMA、100ppm對苯二酚在70℃下反應3h,得到透明液體產物B。反應式為下述所示:
將200g無水聚丁二醇(PTMG 1000)添加到帶有頂置攪拌器、氮氣保護和溫度計的500mL三頸燒瓶中。然後將134.4g HDI添加到該燒瓶中並攪拌成與PTMG的均勻溶液10min,接著添加240μL催化劑DBTL在70℃下反應3 h。在3h後,逐漸添加255g TBAEMA。然後將溫度設定為50℃並加入100ppm對苯二酚。使該反應繼續10h,得到透明液體產物C,為反應型封閉聚氨酯預聚體和反應型封閉二異氰酸酯的混合物。 200 g of anhydrous polybutylene glycol (PTMG 1000) was added to a 500 mL three-neck flask equipped with an overhead stirrer, nitrogen protection, and a thermometer. Then 134.4g HDI was added to the flask and stirred into a homogeneous solution with PTMG for 10 min, then 240 μL of catalyst DBTL was added and reacted at 70°C 3 h. After 3h, 255g TBAEMA was gradually added. The temperature was then set to 50°C and 100 ppm hydroquinone was added. The reaction was continued for 10 hours to obtain a transparent liquid product C, which was a mixture of reactive blocked polyurethane prepolymer and reactive blocked diisocyanate.
在氮氣包含下,將裝入504.6g 2-甲基五亞甲基二胺與295.4g癸二酸混合並逐漸加熱到245℃。反應溫度保持在230℃以上,大約10h。抽真空去除微量水分後,熔融的產物D被排出,並在乾燥器中的氮氣下冷卻。一旦完全冷卻和固化,樹脂就被破碎成中等大小的碎片,並使用離心式粉碎機碾成粉末。然後將研磨好的聚醯胺通過250μ的篩網去除粗顆粒。然後將粉末狀樹脂在氮氣中包裝以備將來使用或進一步使用。 Under nitrogen, 504.6g of 2-methylpentamethylenediamine and 295.4g of sebacic acid were charged and gradually heated to 245°C. The reaction temperature was kept above 230°C for about 10 hours. After vacuuming to remove traces of moisture, the molten product D was discharged and cooled under nitrogen in a desiccator. Once completely cooled and solidified, the resin is broken into medium-sized pieces and ground into a powder using a centrifugal mill. The ground polyamide was then passed through a 250 μ screen to remove coarse particles. The powdered resin is then packaged under nitrogen for future use or further use.
將室溫下將聚乙二醇(600)丙烯酸酯、1,4-丁二醇二丙烯酸酯與光引發劑(photoinitiator,TPO)混合,使用轉子攪拌機攪拌30min,轉速500r/min,得到透明液體。在上述混合物中,加入產物A、B和D,使用轉子攪拌機攪拌40min,轉速1500r/min,直到得到透明液體。加入藍色漿,使用轉子攪拌機攪拌30min,轉速2000r/min,得到所需3D列印材料。該光固化3D列印材料在室溫下粘度為4400cps。室溫下儲存3個月後,粘度為4500cps,僅增加2%,證明其長期儲存穩定性良好。下表中列出了用於生產最終列印材料的每種反應物的具體用量。使用Form 1+SLA 3D列印機列印該3D列印材料,鐳射功率為5mw,掃描速率為3m/s,得到列印樣條。將該樣條置於140℃烘箱中加熱10 h,使其完成熱固化。按照ASTM D412標準做拉伸測試,抗拉強度為36.7±1.3MPa,斷裂伸長率為352±25%。 Mix polyethylene glycol (600) acrylate, 1,4-butanediol diacrylate and photoinitiator (TPO) at room temperature, stir for 30 minutes using a rotor mixer, rotate at 500r/min, to obtain a transparent liquid . To the above mixture, add products A, B and D, stir for 40 minutes using a rotor mixer at a rotation speed of 1500 r/min until a transparent liquid is obtained. Add the blue slurry and use a rotor mixer to stir for 30 minutes at a speed of 2000r/min to obtain the required 3D printing material. The viscosity of this light-curing 3D printing material is 4400cps at room temperature. After 3 months of storage at room temperature, the viscosity was 4500cps, an increase of only 2%, proving its good long-term storage stability. The exact amounts of each reactant used to produce the final printed material are listed in the table below. Use a Form 1+SLA 3D printer to print the 3D printing material, with a laser power of 5mw and a scanning speed of 3m/s to obtain a printed spline. The sample was placed in an oven at 140°C and heated for 10 h to complete thermal curing. The tensile test was conducted in accordance with the ASTM D412 standard. The tensile strength was 36.7±1.3MPa and the elongation at break was 352±25%.
將3,3-二甲基-4,4-二氨基二環己基甲烷(diaminodicyclohexylmethane,DMDC)和過量的甲基異丁基酮(MIBK)(摩爾比1:4),放入反應器中,在油浴中升溫攪拌反應。首先升溫至130℃形成回流反應,反應2h後,升溫至150-160℃繼續回流反應,反應時長約4h。反應完成後,120℃減壓蒸餾2-3h提純,去除產物水、和過量的甲基異丁基酮,得到淺黃色透明液體E,收率95%左右。反應式為下述所示:
將光引發劑TPO溶解在1,6-己二醇二甲基丙烯酸酯和聚乙二醇 (600)二甲基丙烯酸酯(polyethylene glycol(600)dimethacrylate,PEG(600)DMA)中,再將產物C、MIBK封端的酮亞胺固化劑DMDC-MIBK,加到該溶液中,然後進一步混合均勻製備列印液體。將混合均勻的列印液體,倒入料盒中,通過LEAP技術,按ASTM D412模具C,列印狗骨形的測試樣條,經清洗液清洗後,將樣條放置在25℃、65%濕度的環境下,放置12h,接著再120℃下熱固化8h。用CTM拉力機,根據ASTM標準D412,測試固化後彈性體樣條的機械性能。按照ASTM D412標準做拉伸測試,抗拉強度為20MPa,斷裂伸長率為310%。 Dissolve photoinitiator TPO in 1,6-hexanediol dimethacrylate and polyethylene glycol (600) dimethacrylate (polyethylene glycol (600) dimethacrylate, PEG (600) DMA), then add product C and MIBK-terminated ketimine curing agent DMDC-MIBK to the solution, and then mix further Prepare the printing liquid evenly. Pour the evenly mixed printing liquid into the material box, and use LEAP technology to print a dog-bone-shaped test sample according to ASTM D412 mold C. After cleaning with the cleaning solution, place the sample at 25°C and 65% Leave it in a humid environment for 12 hours, then heat cure at 120°C for 8 hours. Use a CTM tensile machine to test the mechanical properties of the cured elastomer splines according to ASTM standard D412. According to the ASTM D412 standard, the tensile strength is 20MPa and the elongation at break is 310%.
向250mL單口燒瓶中加入120g水和9.14g(0.0435mol)4,4-二氨基二環己基甲烷(PACM),攪拌20min,加入20.9g二碳酸二叔丁酯(Boc2O)(0.0957mol),室溫下反應(30-35℃),燒瓶中反應物變成白色乳液,瓶璧處有少許氣泡產生,反應3h後,出現大量白色沉澱,表明反應基本完成。使用減壓漏斗過濾反應產物,除去水相,濾出的固體使用200ml蒸餾水清洗三次並過濾,得到的白色固體物質在90℃下真空乾燥4h,得到白色粉末狀固體產物F,收率50%左右。反應式如下述所示:
將光引發劑TPO溶解在甲基丙烯酸月桂酯(lauryl methacrylate,LMA)和聚乙二醇(600)二甲基丙烯酸酯(PEG(600)DMA)中,再將產物C加到該溶液中,然後進一步混合均勻製備列印液體。將混合均勻的列印液體倒入料盒中,通過LEAP技術,按ASTM D412模具C,列印狗骨形的測試樣條,經清洗液清洗後,將樣條放置在120℃下熱固化8h。用CTM拉力機,根據ASTM標準D412,測試固化後彈性體樣條的機械性能。按照ASTM D412標準做拉伸測試,抗拉強度為18MPa,斷裂伸長率為280%。 Dissolve the photoinitiator TPO in lauryl methacrylate (LMA) and polyethylene glycol (600) dimethacrylate (PEG (600) DMA), and then add product C to the solution. Then further mix evenly to prepare the printing liquid. Pour the evenly mixed printing liquid into the material box, and use LEAP technology to print a dog-bone-shaped test sample according to ASTM D412 mold C. After cleaning with the cleaning solution, place the sample at 120°C for heat curing for 8 hours. . Use a CTM tensile machine to test the mechanical properties of the cured elastomer splines according to ASTM standard D412. According to the ASTM D412 standard, the tensile strength is 18MPa and the elongation at break is 280%.
將室溫下將聚乙二醇(600)甲基丙烯酸酯、2-乙基己基丙烯酸酯、二氨基二苯基甲烷氯化鈉絡合物固化劑與光引發劑TPO混合,使用轉子攪拌機攪拌30min,轉速500r/min,得到透明液體。在上述混合物中,加入產物C,使用轉子攪拌機攪拌40min,轉速1500r/min,直到得到透明液體。加入紅色漿,使用轉子攪拌機攪拌30min,轉速2000r/min,得到所需3D列印材料。該光固化3D列印材料在室溫下粘度為3400cps。室溫下儲存三個月後,粘度為 3700cps,僅增加8%,證明其長期儲存穩定性良好。下表中列出了用於生產最終列印材料的每種反應物的具體用量。使用Form 1+SLA 3D列印機列印該三維列印材料,鐳射功率為3.5mw,掃描速率為3.5m/s,得到列印樣條。將該樣條置於140℃烘箱中加熱10h,使其完成熱固化。按照ASTM D412標準做拉伸測試,抗拉強度為25.3±2.7MPa,斷裂伸長率為452±15%。 Mix polyethylene glycol (600) methacrylate, 2-ethylhexyl acrylate, diaminodiphenylmethane sodium chloride complex curing agent and photoinitiator TPO at room temperature, and stir using a rotor mixer. 30min, rotating speed 500r/min, to obtain a transparent liquid. To the above mixture, add product C and stir for 40 minutes using a rotor mixer at a rotation speed of 1500 r/min until a transparent liquid is obtained. Add the red slurry and use a rotor mixer to stir for 30 minutes at a speed of 2000r/min to obtain the required 3D printing material. The viscosity of this light-curing 3D printing material is 3400cps at room temperature. After three months of storage at room temperature, the viscosity is 3700cps, an increase of only 8%, proving its good long-term storage stability. The exact amounts of each reactant used to produce the final printed material are listed in the table below. Use a Form 1+SLA 3D printer to print the 3D printing material, with a laser power of 3.5mw and a scanning rate of 3.5m/s to obtain a printed spline. The sample was placed in a 140°C oven and heated for 10 hours to complete thermal curing. The tensile test was conducted in accordance with the ASTM D412 standard. The tensile strength was 25.3±2.7MPa and the elongation at break was 452±15%.
將3,3-二甲基-4,4-二氨基二環己基甲烷(DMDC)和過量的甲基丙烯酸-3,3-二甲基-4-氧代戊酯(物質的摩爾比1:2),放入反應器中,在油浴中升溫攪拌反應。升溫至150-160℃保持回流反應,反應時長約8h。反應完成後,120℃減壓蒸餾2-3h提純,去除產物水和過量的甲基丙烯酸-3,3-二甲基-4-氧代戊酯,得到淺黃色透明液體H,收率85%左右。反應式如下所示:
將室溫下將聚乙二醇(600)甲基丙烯酸酯、1,6-己二醇二丙 烯酸酯與光引發劑819混合,使用轉子攪拌機攪拌30min,轉速500r/min,得到透明液體。在上述混合物中,加入產物C、D,使用轉子攪拌機攪拌40min,轉速1500r/min,直到得到透明液體。加入白色漿,使用轉子攪拌機攪拌30min,轉速2000r/min,得到所需3D列印材料。該光固化3D列印材料在室溫下粘度為3500cps。室溫下儲存三個月後,粘度為3800cps,僅增加8%,證明其長期儲存穩定性良好。下表中列出了用於生產最終列印材料的每種反應物的具體用量。使用Form 1+SLA 3D列印機列印該3D列印材料,鐳射功率為8mw,掃描速率為2.5m/s,得到列印樣條。將該樣條置於120℃烘箱中加熱15h,使其完成熱固化。按照ASTM D412標準做拉伸測試,抗拉強度為22.2±3.3MPa,斷裂伸長率為283±12%。 Mix polyethylene glycol (600) methacrylate and 1,6-hexanediol dipropylene at room temperature. Mix the acrylic acid ester and photoinitiator 819, stir for 30 minutes using a rotor mixer, and rotate at 500 r/min to obtain a transparent liquid. To the above mixture, add products C and D, and stir for 40 minutes using a rotor mixer at a rotation speed of 1500 r/min until a transparent liquid is obtained. Add the white slurry and use a rotor mixer to stir for 30 minutes at a speed of 2000r/min to obtain the required 3D printing material. The viscosity of this light-curing 3D printing material is 3500cps at room temperature. After three months of storage at room temperature, the viscosity was 3800cps, an increase of only 8%, proving its good long-term storage stability. The exact amounts of each reactant used to produce the final printed material are listed in the table below. Use a Form 1+SLA 3D printer to print the 3D printing material, with a laser power of 8mw and a scanning speed of 2.5m/s to obtain a printed spline. The sample was placed in a 120°C oven and heated for 15 hours to complete thermal curing. The tensile test was conducted in accordance with the ASTM D412 standard. The tensile strength was 22.2±3.3MPa and the elongation at break was 283±12%.
向反應器皿中加入120g水和9.14g(0.0435mol)4,4-二氨基二環己基甲烷(PACM),攪拌20min,加入30.5g((雙氧(羰基)雙(氧基))雙(2-甲基丙烷-2,1-取代基)雙(2-甲基丙烯酸),室溫下反應(30-35℃),燒瓶中反應物變成白色乳液,瓶璧處有少許氣泡產生,反應5h後,出現大量白色沉澱,表明反應基本完成。使用減壓漏斗過濾反應產物,除去水
相,濾出的固體使用200mL蒸餾水清洗三次並過濾,得到的白色固體物質在90℃下真空乾燥4h,得到白色粉末狀固體產物G,收率60%左右。反應式如下所示:
將室溫下將異冰片基甲基丙烯酸酯、2-乙基己基丙烯酸酯、產物G與光引發劑TPO混合,使用轉子攪拌機攪拌30min,轉速500r/min,得到透明液體。在上述混合物中,加入產物A,使用轉子攪拌機攪拌40min,轉速1500r/min,直到得到透明液體。加入紅色漿,使用轉子攪拌機攪拌30min,轉速2000r/min,得到所需3D列印材料。該光固化3D列印材料在室溫下粘度為2200cps。室溫下儲存三個月後,粘度為2400cps,僅增加9%,證明其長期儲存穩定性良好。下表中列出了用於生產最終列印材料的每種反應物的具體用量。使用Form 1+SLA 3D列印機列印該三維列印材料,鐳射功率為3.5mw,掃描速率為3.5m/s,得到列印樣條。將該樣條置於140℃烘箱中加熱10h,使其完成熱固化。按照ASTM D412標準做拉伸測試,抗拉強度為55.3±2.7MPa,斷裂伸長率為102±11%。 Mix isobornyl methacrylate, 2-ethylhexyl acrylate, product G and photoinitiator TPO at room temperature, and stir for 30 minutes using a rotor mixer at a rotation speed of 500 r/min to obtain a transparent liquid. To the above mixture, add product A and stir for 40 minutes using a rotor mixer at a rotation speed of 1500 r/min until a transparent liquid is obtained. Add the red slurry and use a rotor mixer to stir for 30 minutes at a speed of 2000r/min to obtain the required 3D printing material. The viscosity of this light-curing 3D printing material is 2200cps at room temperature. After three months of storage at room temperature, the viscosity was 2400cps, an increase of only 9%, proving its good long-term storage stability. The exact amounts of each reactant used to produce the final printed material are listed in the table below. Use a Form 1+SLA 3D printer to print the 3D printing material, with a laser power of 3.5mw and a scanning rate of 3.5m/s to obtain a printed spline. The sample was placed in a 140°C oven and heated for 10 hours to complete thermal curing. The tensile test was conducted in accordance with the ASTM D412 standard. The tensile strength was 55.3±2.7MPa and the elongation at break was 102±11%.
將3,3-二甲基-4,4-二氨基二環己基甲烷(DMDC)和過量的甲基丙烯酸乙醯正丙酯(摩爾比1:2),放入反應器中,在油浴中升溫攪拌反應。升溫至150-160℃保持回流反應,反應時長約8h。反應完成後,120℃減壓蒸餾2-3h提純,去除產物水、和過量的甲基丙烯酸乙醯正丙酯,得到淺黃色透明液體我,收率85%左右。反應式為下述所示:
在ThinkyTM混合器上將光引發劑TPO、光穩定劑292、抗氧劑1135,溶解在甲基丙烯酸月桂酯(LMA)和聚乙二醇(600)二甲基丙烯酸酯(PEG(600)DMA)中,再將甲基丙烯酸叔丁基氨基乙酯(TBAEMA)封端的聚氨酯預聚體(TBAEMA-IPDI-PTMO2000-IPDI-TBAEMA)、實施例15得到的產物我,加到該溶液中,然後用ThinkyTM混合器進一步混合均勻製備列印液體。將用ThinkyTM混合器混合均勻的列印液體,倒入料盒中,通過LEAP技 術,按ASTM D412模具C,列印狗骨形的測試樣條,經清洗液清洗後,將樣條放置在60℃水中浸泡30min,接著再120℃下熱固化8h。用CTM拉力機,根據ASTM標準D412,測試固化後彈性體樣條的機械性能。下表中列出了用於生產最終列印材料的每種反應物的具體用量以及測試樣條的力學性能。 Dissolve the photoinitiator TPO, light stabilizer 292, and antioxidant 1135 in lauryl methacrylate (LMA) and polyethylene glycol (600) dimethacrylate (PEG (600)) on a Thinky TM mixer. DMA), and then add the tert-butylaminoethyl methacrylate (TBAEMA)-terminated polyurethane prepolymer (TBAEMA-IPDI-PTMO2000-IPDI-TBAEMA) and the product I obtained in Example 15 to the solution, Then use a Thinky TM mixer to further mix evenly to prepare the printing liquid. Use the Thinky TM mixer to mix the printing liquid evenly, pour it into the material box, and use LEAP technology to print the dog bone-shaped test sample according to ASTM D412 mold C. After cleaning with the cleaning solution, place the sample in Soak in water at 60°C for 30 minutes, then heat cure at 120°C for 8 hours. Use a CTM tensile machine to test the mechanical properties of the cured elastomer splines according to ASTM standard D412. The exact amounts of each reactant used to produce the final printed material are listed in the table below along with the mechanical properties of the test specimens.
在裝有攪拌器、冷凝器及溫度計的三口燒瓶中,加入乾燥的甲基丙烯酸鈉鹽1mol、阻聚劑(0.1%-0.3%品質)、溶劑3-6mol、相轉移催化劑(0.1%-0.5%品質)和含氯基團的酮類物質2-6mol,例如,,其中n=3,攪拌加熱,反應溫度控制在80-120℃之間。4-8h後停止反應,過濾除去 NaCl,所得濾液,30-60℃減壓蒸餾蒸出未反應原料及溶劑,然後在80-130℃溫度下精餾得到無色透明產物。這個實施例中,阻聚劑可以是受阻酚類、芳胺類、醌類或類似物。溶劑可以是苯類(苯、甲苯)烷烴類(環己烷、正庚烷、石油醚或類似物)。相轉移催化劑可以是苄基三乙基氯化銨(TEBA)。 In a three-necked flask equipped with a stirrer, condenser and thermometer, add 1 mol of dry methacrylic acid sodium salt, polymerization inhibitor (0.1%-0.3% quality), 3-6 mol of solvent, and phase transfer catalyst (0.1%-0.5 % quality) and 2-6 mol of ketones containing chlorine groups, for example, , where n=3, stir and heat, and the reaction temperature is controlled between 80-120°C. The reaction was stopped after 4-8 hours, and NaCl was removed by filtration. The resulting filtrate was distilled under reduced pressure at 30-60°C to evaporate the unreacted raw materials and solvent, and then rectified at 80-130°C to obtain a colorless and transparent product. In this embodiment, the polymerization inhibitor may be hindered phenols, aromatic amines, quinones or the like. Solvents may be benzene (benzene, toluene) alkanes (cyclohexane, n-heptane, petroleum ether or the like). The phase transfer catalyst may be benzyltriethylammonium chloride (TEBA).
向反應器中加入帶羰基的醇1.1-3.5mol,例如:,其中n=3,甲基丙烯酸1mol,溶劑二氯甲烷8-10mol,催化劑0.03-0.1mol 4-二甲氨基吡啶(dimethylaminopyridine,DMAP),攪拌均勻,降低溫度至0-20℃,加入二環己基碳二亞胺(dicyclohexylcarbodiimide,DCC),控制反應溫度不超過40℃,反應4-10h,停止反應。產物過濾除去產生的不溶物二環己基脲,濾液使用1mol/L酸清洗分液;分出油相,使用飽和碳酸氫鈉清洗分液;分出油相,減壓蒸餾除去溶劑,得淡黃色澄清粗產品,粗產品經減壓精餾得到無色透明餾分,即為產物。 Add 1.1-3.5 mol of alcohol with carbonyl group into the reactor, for example: , where n=3, 1 mol of methacrylic acid, 8-10 mol of solvent dichloromethane, 0.03-0.1 mol of catalyst 4-dimethylaminopyridine (DMAP), stir evenly, lower the temperature to 0-20°C, and add bicyclic For dicyclohexylcarbodiimide (DCC), control the reaction temperature not to exceed 40°C, react for 4-10 hours, and then stop the reaction. The product is filtered to remove the insoluble substance dicyclohexylurea produced. The filtrate is washed and separated using 1mol/L acid. The oil phase is separated and washed and separated with saturated sodium bicarbonate. The oil phase is separated and the solvent is distilled under reduced pressure to obtain a light yellow color. The crude product is clarified, and the crude product is distilled under reduced pressure to obtain a colorless and transparent fraction, which is the product.
反應器中加入1mol二亞乙基三胺(DETA)和1-3mol甲基異丁基酮混合,在溶劑(如:苯、甲苯、二甲苯或者烷烴類溶劑)中,共沸除去產生的水進行反應,待分水器中的水達到計算值後,降溫減壓除去溶劑和過量的酮,得到二亞乙基三胺的酮亞胺;向產物中加入100-500ppm阻聚劑,再加入1mol環氧丙烯酸酯化合物,如甲基丙烯酸縮水甘油酯(glycidyl methacrylate,GMA),升溫至60-100℃反應,制得改性UV反應型酮亞胺產物J。反應式如下
述所示:
在ThinkyTM混合器上將光引發劑TPO、光穩定劑292、抗氧劑1135溶解在甲基丙烯酸月桂酯(LMA)和聚乙二醇(600)二甲基丙烯酸酯(PEG(600)DMA)中,再將甲基丙烯酸叔丁基氨基乙酯(TBAEMA)封端的聚氨酯預聚體(TBAEMA-IPDI-PTMO2000-IPDI-TBAEMA)、實施例19得到的產物J,加到該混合物中,然後用ThinkyTM混合器進一步混合均勻製備列印液體。將用ThinkyTM混合器混合均勻的列印液體,倒入料盒中,通過LEAP技術,按ASTM D412模具C,列印狗骨形的測試樣條,經清洗液清洗後,將樣條放置在60℃水中浸泡30min,接著再120℃下熱固化8h。用Instron拉力機,根據ASTM標準D412,測試固化後彈性體樣條的機械性能。按照ASTM D412標準做拉伸測試,抗拉強度為22MPa,斷裂伸長率為340%。 Dissolve the photoinitiator TPO, light stabilizer 292, and antioxidant 1135 in lauryl methacrylate (LMA) and polyethylene glycol (600) dimethacrylate (PEG (600) DMA) on a Thinky TM mixer. ), then add the tert-butylaminoethyl methacrylate (TBAEMA)-terminated polyurethane prepolymer (TBAEMA-IPDI-PTMO2000-IPDI-TBAEMA) and the product J obtained in Example 19 to the mixture, and then Use a Thinky TM mixer to further mix and prepare the printing liquid. Use the Thinky TM mixer to mix the printing liquid evenly, pour it into the material box, and use LEAP technology to print the dog bone-shaped test sample according to ASTM D412 mold C. After cleaning with the cleaning solution, place the sample in Soak in water at 60°C for 30 minutes, then heat cure at 120°C for 8 hours. The mechanical properties of the cured elastomer splines were tested using an Instron tensile machine according to ASTM standard D412. According to the ASTM D412 standard, the tensile strength is 22MPa and the elongation at break is 340%.
向反應器中加入1mol 3,3-二甲基-4,4-二氨基二環己基甲烷(DMDC)、1mol的甲基異丁基酮,在溶劑(苯、甲苯、二甲苯或者烷烴類溶劑)中,共沸除去產生的水,產生計算量水後,得到一端MIBK保護的胺DMDC;向體系中加入1mol實施例17得到的產物,繼續共沸帶水反應;產生計算量的水後,減壓蒸餾除去溶劑,得到產物K。 Add 1 mol of 3,3-dimethyl-4,4-diaminodicyclohexylmethane (DMDC) and 1 mol of methyl isobutyl ketone to the reactor, and add 1 mol of methyl isobutyl ketone to the reactor. ), remove the produced water azeotropically, and after generating the calculated amount of water, obtain the MIBK-protected amine DMDC at one end; add 1 mol of the product obtained in Example 17 to the system, and continue the azeotropic reaction with water; after generating the calculated amount of water, The solvent was distilled off under reduced pressure to obtain product K.
在ThinkyTM混合器上將光引發劑TPO、光穩定劑292、抗氧劑1135溶解在甲基丙烯酸月桂酯(LMA)和聚乙二醇(600)二甲基丙烯酸酯(PEG(600)DMA)中,再將甲基丙烯酸叔丁基氨基乙酯(TBAEMA)封端的聚氨酯預聚體(TBAEMA-IPDI-PTMO2000-IPDI-TBAEMA)、實施例21得到的產物K,加到該混合物中,然後用ThinkyTM混合器進一步混合均勻製備列印液體。將用ThinkyTM混合器混合均勻的列印液體,倒入料盒中,通過LEAP技術,按ASTM D412模具C,列印狗骨形的測試樣條,經清洗液清洗後,將樣條放置在60℃水中浸泡30min,接著再120℃下熱固化8h。用Instron拉力機,根據ASTM標準D412,測試固化後彈性體樣條的機械性能。按照ASTM D412標準做拉伸測試,抗拉強度為28MPa,斷裂伸長率為640%。 Dissolve the photoinitiator TPO, light stabilizer 292, and antioxidant 1135 in lauryl methacrylate (LMA) and polyethylene glycol (600) dimethacrylate (PEG (600) DMA) on a Thinky TM mixer. ), then add the tert-butylaminoethyl methacrylate (TBAEMA)-terminated polyurethane prepolymer (TBAEMA-IPDI-PTMO2000-IPDI-TBAEMA) and the product K obtained in Example 21 to the mixture, and then Use a Thinky TM mixer to further mix and prepare the printing liquid. Use the Thinky TM mixer to mix the printing liquid evenly, pour it into the material box, and use LEAP technology to print the dog bone-shaped test sample according to ASTM D412 mold C. After cleaning with the cleaning solution, place the sample in Soak in water at 60°C for 30 minutes, then heat cure at 120°C for 8 hours. The mechanical properties of the cured elastomer splines were tested using an Instron tensile machine according to ASTM standard D412. According to the ASTM D412 standard, the tensile strength is 28MPa and the elongation at break is 640%.
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