TWI801998B - Probe card - Google Patents

Abstract

The present invention provides a probe card comprising a probe base, at least one impedance-matching probe, and a plurality of first probes. The probe base has a probing side and a tester side opposite to the probing side. Each impedance-matching probe has a probing part and a signal transmission part electrically coupled to the probing part, wherein one end of the signal transmission part is arranged at tester side, and the signal transmission part has a probing axis. Each first probe has a probing tip and a cantilever part coupled to the probing tip, wherein the cantilever part is coupled to the probe base and has a first central axis such that an included angle is formed between the probing axis and the first central axis.

Description

probe card

The present invention relates to a probe card, in particular to a probe card with layouts of impedance matching probes and cantilever probes.

Due to the miniaturization of electronic components, after the semiconductor manufacturing process, it is necessary to test whether there is any problem in signal transmission through testing to determine the quality of electronic components. Generally speaking, to test whether the electrical connection between the various electronic components in an electronic product is correct, or whether there is a problem with signal transmission, the probe card is usually used as the test interface between the test device and the electronic device under test, by Signal transmission and electrical signal analysis to obtain the test results of the electronic device under test.

With the improvement of communication technology, conventional probe cards to test single electrical characteristics of electronic components, such as: signal characteristics, such as: DC or AC, etc., or radio frequency (RF) characteristic testing, are no longer sufficient to cope with current communication components or RF components testing needs. Although there is equipment for testing communication components or radio frequency components in the conventional technology, the electrical test of the equipment for communication components or radio frequency components still separates the signal characteristic test from the radio frequency characteristic test, for example, the first probe is used for the signal characteristic test The second probe card is used for RF characteristic testing, so two probe cards must be used interchangeably, which increases the test time and affects the test efficiency of the production line.

In order to solve the above-mentioned problems, the present invention conceives a probe card, which has an impedance matching probe for testing radio frequency characteristics and a cantilever probe for supplying other signals to test the radio frequency characteristics of the object under test or simultaneously test the radio frequency characteristics and signal characteristics. However, if the signal characteristic test and the radio frequency characteristic test are to be performed at the same time, the probes for the radio frequency characteristic test and the signal characteristic test probes must be placed in the test area of the probe card corresponding to the electronic components. Because the size of probes for general radio frequency characteristic testing is larger than that of signal characteristic testing probes, it is easy to cause the density of pendulum needles to drop, or the probes for radio frequency characteristic testing and signal characteristic testing probes interfere with each other in the placement position And the problem of not being able to swing the needle.

The invention provides a probe card, which has impedance matching probes for testing radio frequency characteristics and cantilever probes for supplying other signals, so as to test the radio frequency characteristics of the object to be tested or simultaneously test the radio frequency characteristics and signal characteristics. It should be noted that the signal characteristic test can be a DC or AC signal test, but it is not limited thereto. In one embodiment of the present invention, the central axis of the impedance matching probe and the central axis of the cantilever probe have an included angle or the setting feature of the included angle and the height difference. The needles interfere with each other and cannot swing the needles. It also enables the probe card of the present invention to test the electrical and radio frequency signal contacts on the same side of the object under test, so as to speed up the test and improve the efficiency of testing the object under test.

In one embodiment, the present invention provides a probe card for testing the electrical properties of the object under test. The probe card includes a probe base, at least one impedance matching probe and a plurality of first probes. Wherein, the probe base has a side of the object under test and a side of the testing machine corresponding to the side of the object under test. Each impedance matching probe has a probe part and a signal transmission part connected with the probe part. One end of the signal transmission part is arranged on the side of the testing machine, and the signal transmission part passes through the through hole on the probe base, so that the probe part is arranged on the side of the object to be tested on the probe base, and the signal transmission part has a central axis of the probe. Each first probe has a tip segment and a cantilever connected to the tip segment One end of the cantilever section of each first probe is electrically connected to the probe seat, the tip section is arranged on the side of the through hole to be tested, and the cantilever section has a first central axis. Wherein, the central axis of the probe and the first central axis of the at least one first probe have a first angle greater than zero. In one embodiment, the height of the cantilever section of the first probe on at least one side of each impedance-matching probe is greater than the probe portion of the impedance-matching probe, so that adjacent cantilever probes can straddle the corresponding Impedance-matched probes are inserted obliquely into the vias.

In another embodiment, the present invention provides a probe card, including a probe base, a first probe module and a second probe module. The probe base has an object side to be tested and a testing machine side corresponding to the object side to be tested. The first probe module is arranged on the probe base. The first probe module has at least one impedance matching probe and a plurality of first cantilever probes. Each impedance matching probe has a probe part and a signal transmission part. Each impedance matching probe has a probe part and a signal transmission part. The signal transmission part is connected with the probe part. Each first cantilever probe has a tip section and a cantilever section. The cantilever section of the first cantilever probe is connected to the tip section. Wherein, at least one impedance matching probe and the tip segments of the plurality of first cantilever probes form a first survey area. The second probe module is arranged on the probe base and is located at one side of the first probe module. The second probe module has a plurality of second cantilever probes. Each second cantilever probe has a tip section and a cantilever section. The cantilever section of the second cantilever probe is connected to the tip section. Wherein, the tip segments of the plurality of second cantilever probes form a second survey area. The distance between the first survey area and the second survey area is greater than the distance between any two tip segments of the second cantilever probe.

2, 2a: probe card

20: Probe seat

200: fixed substrate

200a: first surface

200b: second surface

200c: First piercing

200d~200f: bearing seat

200g~200i: Positioning plate

2001: First fixed through hole

201: circuit substrate

201a: Second perforation

201b~201d: notch

201e: Third Surface

201f: The Fourth Surface

202: Positioning structure

202a: through hole

202b: connecting surface

202c: fixed surface

21a~21c: impedance matching probe

210, 210a: probe part

210a, 210b, 210c: subprobes

2100, 2100a: needle tip segment

2101: Connection section

211, 211a: Signal transmission department

2110: Outer conductor

212: Structural ontology

2120: Second fixing through hole

2121: Signal connection connector

22~22g: the first probe

220: needle point segment

;221: cantilever section

222: Turning point

23~23f: the second probe

230: needle point segment

231: Cantilever section

24: Sealing layer

25a~25n: the third probe

250: needle point segment

251: Cantilever section

26a~26f: the fourth probe

260: needle point segment

261: Cantilever section

90:Signal wire

91: fixed element

A: Test machine side

B: The side of the object to be tested

S0: The object to be tested

PAD _RF : the first electrical contact

PAD: the second electrical contact

L1~L4: side

L5~L8: slotting

C1: first probe set

C2: second probe set

CL1: Central axis of the probe

CL2: the first central axis

CL3: Second central axis

CL4: Third central axis

CL5: Fourth central axis

H1~H3: Height

DA~DD: Height

PC1: The first probe module

PC2: The second probe module

S1~Sn: The object to be tested

θ1~θ9: included angle

FIG. 1A is an exploded perspective view of an embodiment of a probe card of the present invention.

FIG. 1B is a schematic top view of an embodiment of the probe card of the present invention.

Figure 1C and Figure 1D are schematic diagrams of different impedance matching probe embodiments of the present invention

FIG. 2A is a schematic top view of the arrangement relationship between the impedance matching probe and the first probe.

FIG. 2B is a perspective schematic diagram of the configuration of the impedance matching probe and the first probe.

2C is a schematic bottom view of the probe card embodiment of the present invention viewed from the side of the object to be tested.

2D and 2E are schematic diagrams of different layout embodiments of the first and second probes for signal testing according to the present invention.

FIG. 3A is a schematic diagram of an embodiment of the needle arrangement method of the first probe of the present invention.

FIG. 3B is a schematic diagram of an embodiment of the needle arrangement method of the second probe of the present invention.

4A to 4C are schematic diagrams of another embodiment of the probe card swing needle of the present invention.

FIG. 4D is a schematic top view of another embodiment of the probe card of the present invention.

FIG. 4E and FIG. 4F are schematic diagrams of an embodiment of the layout of the cantilever probe pin layer on the fourth side of the positioning structure when one object under test performs a radio frequency characteristic test and another object under test performs a signal characteristic test in the present invention.

FIG. 5 is a schematic diagram of an embodiment of an array of objects to be tested according to the present invention.

Various exemplary embodiments will be described more fully hereinafter with reference to the accompanying drawings, in which some exemplary embodiments are shown. However, inventive concepts may be embodied in many different forms and should not be construed as limited to the illustrative embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Like numbers indicate like elements throughout. The probe card of the present invention will be described below with various embodiments together with the drawings, however, the following embodiments are not intended to limit the present invention.

Please refer to FIG. 1A and FIG. 1B , wherein FIG. 1A is an exploded perspective view of an embodiment of the probe card of the present invention, and FIG. 1B is a schematic top view of an embodiment of the probe card of the present invention. In this embodiment, the probe card 2 includes a probe base 20 , a plurality of impedance matching probes 21 a - 21 c and a plurality of first probes 22 . The probe base 20 has a testing machine side A and a DUT side B. In this embodiment, the testing machine side A is located above the probe base 20 , and the DUT side B is located below the probe base 20 . The probe base 20 includes a fixed substrate 200 , a circuit substrate 201 and a positioning structure 202 . The fixing substrate 200 is a substrate made of a metal material in this embodiment, but not limited to the metal material. The fixed substrate 200 has a first surface 200a on the side B of the test object, a second surface 200b on the side A of the testing machine, and a first through hole 200c passing through the first and second surfaces 200a and 200b.

In an embodiment of the fixed substrate 200 , the fixed substrate 200 further has a plurality of bearing seats 200 d - 200 f , and each bearing seat 200 d - 200 f has a first fixing through hole 2001 . There are a plurality of positioning plates 200g-200i around each of the bearing seats 200d-200f. In this embodiment, the plurality of positioning plates 200g-200i are disposed on both sides and rear sides of the bearing seats 200d-200f. The circuit substrate 201 is disposed on the second surface 200b, and the circuit substrate 201 has a second through hole 201a corresponding to the first through hole 200c. In this embodiment, there are a plurality of notches 201b~201d around the second through hole 201a corresponding to the bearing seats 200d~200f respectively. When the circuit substrate 201 is assembled on the fixed substrate 200, the bearing seats 200d~200f and the corresponding positioning The plates 200g~200i pass through the corresponding notches 201b~201d, respectively.

The positioning structure 202 is disposed on the side B of the object to be tested and connected to the first surface 200 a of the fixed substrate 200 , and the positioning structure 202 has a through hole 202 a. In this embodiment, the positioning structure 202 is a structure formed of an insulating material, such as a ceramic material. The through hole 202a is in the shape of a cross, which is determined according to the needs of users, and is not limited to the shape shown in the figure. When the positioning structure 202 is assembled on the first surface 200a of the fixed substrate 200, the through hole 202a corresponds to the second through hole 201a and the first through hole 200c. A plurality of impedance matching probes 21a~21c are respectively arranged on the bearing bases 200d~200f, wherein the impedance matching probes 21a are arranged on the bearing base 200f, the impedance matching probes 21b are arranged on the bearing base 200e, and the impedance matching probes 21c is disposed on the bearing seat 200d.

In this embodiment, each impedance matching probe 21 a - 21 c has a probe part 210 , a signal transmission part 211 and a structural body 212 . Taking the impedance matching probe 21a as an example, the structural body 212 has a plurality of second fixing through holes 2120 corresponding to the first fixing through holes 2001 on the bearing base 200f. The fixing elements 91, such as screws or bolts, can pass through the first and second fixing holes 2001 and 2120 to lock the structural body 212 on the corresponding bearing seat 200f. The structural body 212 has a signal connection connector 2121 electrically connected to the signal transmission part 211 . One end of the external signal wire 90 is connected to the signal connection connector 2121, and the other end of the signal wire 90 is used to connect to the testing machine for one-way transmission, that is, from the testing machine to the probe part 210 or back from the probe part 210 to the test machine. During the test, the testing machine transmits the test signal to the signal connector 2121 through the external signal wire 90 , then transmits the test signal to the probe part 210 through the signal transmission part 211 , and then outputs the test signal to the object under test from the probe part 210 . In addition, in other embodiments, when testing, the testing machine outputs signals to the object under test through probes other than the impedance matching probes 21a-21c (for example, the first probe 22), and then the test results are output through impedance matching. The probes 21a~21c are analyzed by the testing machine.

The probe part 210 is a structure formed by semiconductor manufacturing process, and is coupled to the signal transmission part 211 . In this embodiment, the probe part 210 has three sub-probes 210a, 210b and 210c. Each sub-probe 210a, 210b, and 210c has a tip section 2100 and a connection section 2101, wherein one end of the tip section 2100 is used to make electrical contact with the electrical contact of the object to be tested, and the other end of the tip section 2100 is connected to the connection section 2101. The segment 2101 is connected, and the connecting segment 2101 is coupled with the signal transmission part 211 . The tip segment 2100 is a structure formed by using a microelectromechanical systems (MEMS) process. In this embodiment, the signal transmission part 211 includes an inner conductor, a dielectric layer covering the inner conductor, and an outer conductor 2110 covering the dielectric layer, wherein the signal transmission part 211 is a semi-rigid coaxial cable. The inner conductor and the outer conductor 2110 are respectively coupled to the connection section 2101 . The signal transmission part 211 passes through the second through hole 201a of the circuit substrate 201, the first through hole 200c of the fixed substrate 200 and the through hole 202a of the positioning structure 202 from the testing machine side A, so that the probe part 210 is disposed on the object-to-be-measured side B of the probe base 20 . The tip segment 2100 can be divided into one signal and one ground SG tip, one signal and two grounds GSG tip, two signal and two grounds GSSG tip or two signal and three grounds GSGSG tip.

Please refer to FIG. 1C and FIG. 1D , which are schematic diagrams of different impedance matching probes of the present invention. In FIG. 1C , the difference from the above is that the signal transmission part 211a is not a coaxial cable structure, but a structure composed of a circuit board (PCB) with impedance matching and signal transmission functions, and its front end has a probe part 210a. In FIG. 1D , the difference from the foregoing is that the probe portion 210 a includes a plurality of probes, each probe has a bending angle θ, and one end of each probe has a tip segment 2100 a. The probe part 210a has at least two tip segments 2100a. In this embodiment, the number of tip segments 2100a is 17, that is to say, the number of tip segments 2100 may be more than the aforementioned impedance matching probe of FIG. 1A. The signal transmission part 211a has a probe central axis CL1.

Please refer to FIG. 1A and FIG. 1B , the signal transmission part 211 of the impedance matching probes 21 a - 21 c is axisymmetric with the probe central axis CL1 as the center. In addition, the signal transmission part 211 a of the impedance matching probe shown in FIG. 1C is also bilaterally symmetrical with the probe central axis CL1 as the center. Specifically, in this embodiment, when the signal transmission portion 211 a of the impedance matching probe shown in FIG. 1C has an axisymmetric shape, its symmetric axis is used as the central axis CL1 of the probe.

Please refer to Figure 1A and Figure 1B and Figure 2A to Figure 2C, wherein Figure 2A is a schematic top view of the configuration relationship between the impedance matching probe and the first probe; Figure 2B is a perspective schematic diagram of the configuration of the impedance matching probe and the first probe ; FIG. 2C is a schematic bottom view of the probe card embodiment of the present invention viewed from the side of the object to be tested. In this embodiment, the signal transmission part 211 of the impedance matching probes 21 a - 21 c is inserted straight into the needle. The manner in which the impedance matching probes 21 a - 21 c are inserted straight into the needle will be described below. In this embodiment, viewed from the perspective of the XY plane, the positioning structure 202 has a slot L5 and a slot L7 on the first axis X, and has a slot L6 on the second axis Y. and slotted L8. The impedance matching probe 21a is arranged on the second surface 200b of the fixed substrate 200, and its signal transmission part 211 passes through the circuit substrate 201, the fixed substrate 200 from the second surface 200b along the Y axis, and then passes through the slot L8, and Insert the needle straight along the Y axis on the XY plane. The impedance matching probe 21b is arranged on the second surface 200b of the fixed substrate 200, and its signal transmission part 211 passes through the circuit substrate 201, the fixed substrate 200 from the second surface 200b, and then passes through the slot L6, along the XY plane. -Y-axis advances the needle straight. The impedance matching probe 21c is arranged on the second surface 200b of the fixed substrate 200, and its signal transmission part 211 passes through the circuit substrate 201 and the fixed substrate 200 from the second surface 200b, and then opens the groove L5, and on the XY plane along the - The X-axis goes straight into the needle. It should be noted that the slots corresponding to the impedance matching probes are determined according to the number and positions of the impedance matching probes 21 a - 21 c , and are not limited to three slots in this embodiment. It should be noted that the first axis X has a positive first axis (+X axis) and a negative first axis (−X axis). The second axis Y has a positive second axis (+Y axis) and a negative second axis (−Y axis).

At least one side of the impedance matching probes 21a to 21c has a cantilever probe. In the embodiment shown in FIGS. 2A-2C , there are first probes 22 - 22g on both sides of the impedance matching probes 21 a - 21 c respectively. In this embodiment, the first probes 22-22g are cantilever probes. Each first probe 22~22g has a tip section 220 and a cantilever section 221 connected to the tip section 220, a part of the cantilever section 221 of each first probe 22~22g is arranged on the positioning structure 202, and The two ends of the cantilever section 221 are respectively extended toward the circuit substrate 201 and the direction of the needle tip section. In this embodiment, each of the first probes 22 - 22g further includes a knee 222 located between the tip section 220 and the cantilever section 221 . The needle tip section 220 extends along the Z-axis direction from a knee section (knee) 222 . In this embodiment, one end of the cantilever section 221 is electrically connected to the contact of the circuit substrate 201 , and the needle tip section 220 is correspondingly disposed in the through hole 202 a. The contact between one end of the cantilever section 221 and the circuit substrate 201 can be electrically connected by soldering, or the two ends of an intermediary (such as a coaxial cable) are respectively welded to one end of the cantilever section 221 and the contact of the circuit substrate 201 . Please refer to FIG. 1A at the same time. Further, the circuit substrate 201 is located on the side B of the object to be tested and has a third surface. 201e, located on the testing machine side A, has a fourth surface 201f, and one end of the cantilever section 221 is electrically connected to the contact point on the third surface 201e of the circuit substrate 201 . In addition, the fixed substrate 200 is disposed on the third surface 201 e of the circuit substrate 201 . In one embodiment, since the impedance matching probes 21a~21c have a certain volume and will occupy a certain space in the through hole 202a, in order to prevent the first probes 22~22g from interfering with the impedance matching probes 21a~21c Or the needle insertion area of the impedance matching probes 21a~21c must be kept away, and the first probes 22~22g will not directly follow the X-axis or along the direction of the slot L5~L7 corresponding to each impedance matching probe 21a~21c. The needle is inserted in the direction of the Y axis, but obliquely inserted below the through hole 202a along a direction that has an included angle with the needle insertion direction of the impedance matching probes 21a-21c, so as to avoid the impedance matching probes 21a-21c.

For example: for the impedance matching probe 21a, its corresponding slot L8 has sidewalls W1 and W2 corresponding to the two sides of the signal transmission part 211 on the XY plane; for the impedance matching probe 21b, its corresponding slot L6 is in There are sidewalls W3 and W4 corresponding to two sides of the signal transmission part 211 on the XY plane, and for the impedance matching probe 21c, the corresponding slot L5 has sidewalls W5 and W6 corresponding to both sides of the signal transmission part 211 on the XY plane. As shown in FIG. 2A, in this embodiment, the first probes 22a or 22b-22d on at least one side of the impedance matching probe 21a are located on the side walls W5 and W8 of the X-axis from the slots L5 and L7 of the positioning structure 202. The lower sealant layer 24 exits and enters obliquely toward the direction below the through hole 202a. For the impedance matching probe 21b, the first probes 22 or 22e~22g on at least one side thereof are from the slots L5 and L7 of the positioning structure 202 to the sealant layer 24 below the side walls W6 and W7 of the X-axis. The needle exits and enters obliquely toward the direction below the through hole 202a. For the impedance matching probe 21c, the first probe 22d or 22e on at least one side of it exits the slot L5 of the positioning structure 202 from the sealant layer 24 below the side walls W5 and W6 of the X-axis to the through hole. Insert the needle obliquely from the direction below the hole 202a.

Furthermore, in this embodiment, the insertion direction of the first probe 22a next to the impedance matching probe 21a is to move the cantilever section 221 toward the through hole along the +X axis and the +Y axis. 202a direction into The needle, that is, the central axis CL2 of the cantilever section 221 and the central axis CL1 of the impedance matching probe 21a have an included angle θ1 greater than zero, so that the cantilever section 221 of the first probe 22a can pass through the sealant layer below the side wall W8 24 and insert the needle obliquely toward the through hole 202a. The needle insertion direction of the first probes 22b~22c next to the impedance matching probe 21a is to insert the cantilever section 221 obliquely along the -X and +Y axes toward the through hole 202a, and the first probes The central axis CL2 of the cantilever section 221 of 22b and 22c and the central axis CL1 of the impedance matching probe 21a have an included angle θ2 and θ3 greater than zero degrees, so that the cantilever section 221 of the first probes 22b~22c is below the side wall W5 The sealant layer 24 is obliquely inserted into the direction below the through hole 202a.

For the impedance-matching probe 21b, the first probes 22, 22e~22g on both sides are to insert the cantilever section 221 into the direction below the through hole 202a along the +X axis and the -Y axis, so that The cantilever section 221 of the first probe 22 is inserted obliquely from the sealant layer 24 below the side wall W7 to the direction below the through hole 202a, and the first probes 22e~22g move the cantilever section 221 along the -X axis to - The Y-axis inserts the needle obliquely toward the bottom of the through hole 202a, so that the cantilever section 221 of the first probes 22e-22g passes obliquely from the sealant layer 24 below the side wall W6 toward the bottom of the through hole 202a. For the impedance matching probe 21c, the first probes 22e on both sides of the cantilever section 221 are inserted into the direction below the through hole 202a along the -X axis and the -Y axis, so that the first probe The cantilever section 221 of the needle 22e enters the needle obliquely from the sealant layer 24 below the side wall W6 to the direction below the through hole 202a, and the first probe 22d inserts the cantilever section 221 between the -X axis and the +Y axis. The needle is inserted obliquely under the through hole 202a, and then the cantilever section 221 of the first probe 22d is inserted obliquely under the through hole 202a from the sealant layer 24 below the side wall W5.

It should be noted that, in one embodiment, because the needle tips of the probe part 210 of the impedance matching probes 21a-21c are short, considering the angle and cross-needle issues, the first probes 22-22g can be inserted obliquely In addition, in the projected area below the through hole 202 a , the height in the -Z axis is compared so that the cantilever section 221 is higher than at least a part of the corresponding signal transmission part 211 , so as not to interfere with the signal transmission part 211 . Further, it is possible to In order to avoid contact between the cantilever section 221 and the signal transmission part 211 or the probe part 210 . In this embodiment, the positioning structure 202 has a connecting surface 202b and a fixing surface 202c, the connecting surface 202b is connected to the first surface 200a, and the fixing surface 202c further has a sealant layer 24, wherein the plurality of first probes The cantilever section 221 corresponding to the needles 22-22g and the fixed surface 202c is coated with a sealant layer 24. It should be noted that the part of the cantilever section 221 of the first probes 22~22g from the sealant layer 24 to the tip section 220 is arranged on the side B of the object to be tested, that is, it is not arranged under the through hole 202a. Inside 202a.

Please refer to FIG. 2A , the object under test S0 is a radio frequency component and has four sides L1-L4. In this embodiment, the impedance matching probes 21a-21c correspond to the sides L1-L3 respectively, each side There are a plurality of first electrical contacts Pad _RF on L1~L3 and a plurality of second electrical contacts Pad arranged on at least one side of the first electrical contacts, so that at least one side can simultaneously make the impedance matching probe The needle and the first probe simultaneously detect the electrical contact. For example, in this embodiment, each of the impedance matching probes 21a-21c is used to test the first electrical contact Pad _RF on one side, and the number of the first electrical contact Pad _RF is at least two, The plurality of first probes 22 - 22 d on both sides of the impedance matching probes 21 a - 21 c are used to test the second electrical contact Pad on the same side. Under the arrangement of the electrical contacts of the object under test, the central axis CL1 of each impedance-matching probe 21a-21c and the first central axis CL2 of the first probes 22-22g on both sides have an angle greater than zero. . In addition, the included angles between the probe central axis CL1 of each impedance matching probe 21 a - 21 c and the first central axes CL2 of any two first probes 22 - 22 g on both sides or on the same side may be the same or different. For example, the included angle θ1 and the included angle θ2 located on both sides of the impedance matching probe 21a in FIG. 2A may be the same or different included angles, or the included angle θ2 and the included angle θ3 located on the same side of the impedance matching probe 21a may be the same angle or different angles.

In addition to the impedance matching probes 21a-21c and the first probes 22-22g in the slots L5-L7, there are a plurality of second probes 23-23f below the slot L8 of the through hole 202a. X Y Insert the needle straight along +X toward the through hole 202a on the plane. The second probes 23 - 23 f are cantilever probes, which also have a tip section 230 and a cantilever section 231 . In this embodiment, each of the second probes 23 - 23f has a second central axis CL3 parallel to each other. In another embodiment, there may also be an included angle between the second central axes CL3 of any two second probes 23 - 23 f , which is determined according to the layout and is not limited to the parallel arrangement as shown in the figure. In this embodiment, the first probes 22 and 22a are respectively provided on both sides of the second probes 23~23f, wherein, because the second probes 23~23f advance along the +X direction on the XY plane, the second probes The second central axis CL3 of the second probe 23f has an included angle θ4 greater than zero with the first central axis CL2 of the adjacent first probe 22a that is inserted from between the +X axis and the +Y axis. Similarly, therefore, the second central axis CL3 of the second probe 23 has an included angle greater than zero with the first central axis CL2 of the adjacent first probe 22 that enters from between the +X axis and the -Y axis. . It should be noted that the second probe 23 is configured according to usage requirements, and is not a necessary element for realizing the present invention, so the presence or absence of the second probe 23 is not a limitation.

It should be noted that the configuration relationship between the first probes 22 , 22 a and the second probes 23 - 23 f is not limited by the foregoing embodiments. It is mainly determined according to the layout position of the second electrical contact Pad of the object under test S0 projected below between the impedance matching probes 21 a and 21 b and the slot L7 . For example, the object under test S0 in FIG. 2A corresponds to the second electrical contact Pad between the anti-match probes 21a and 21b and the slot L7, which is arranged on the side L4 of the object under test S0 along the Y axis. A row of electrical contacts, so under this layout, the cantilever probe can be configured in combination with the first and second probes as shown in Figure 2A, or as shown in Figure 2D, all of which are composed of the second probe 23~ 23h to test. In addition, as shown in FIG. 2E, if the object under test S0 is correspondingly located between the impedance matching probes 21a and 21b and the slot L7, in addition to a row of second electrical contacts Pad along the side L4, there is also a row along the X At least one second electrical contact Pad axially arranged on the sides L1 and L3 of the object under test S0, as shown in FIG. 2E , must have a probe layout in which the second and third probes coexist. .

Please refer to FIG. 3A , which is an example of the arrangement of needles of the first probe of the present invention. intention. What is shown in this embodiment is that the height distribution of the tip segments of each first probe is different. For example, taking the first probes 22b-22d as an example, the tip segment 220 of the first probe 22b has a height H1, The tip section 220 of the first probe 22c has a height H2, and the tip section 220 of the first probe 22d has a height H3, wherein H2<H1<H3. Similarly, the tip segments 230 of the plurality of second probes 23 also have different height differences. In an embodiment of the second probe arrangement method shown in FIG. 3B, the second probes 23 and 23a of the first probe group C1 and the second probes 23b and 23c of the second probe group C2 are For example, the heights DA and DB of the needle tip section 230 between the second probes 23 and 23a have a height difference, and the heights DC and DD of the needle tip section 230 between the second probes 23b and 23c have a height difference. In addition, the cantilever section 231 and the needle tip section 230 of each second probe 23~23c respectively have included angles θ5~θ8, wherein, in this embodiment, θ5 is equal to θ6, θ7 is equal to θ8, θ5 is not equal to θ7, and θ6 is not equal to θ8. Through the difference between the angles of the plurality of second probes 23-23f and the heights of the tip segments, the density of the arrangement of the second probes can be increased, so as to cope with the analytes with high-density electrical connection points. It should be noted that the height difference of different needle layers of the second probe in this embodiment is determined according to requirements, and is not limited by the height difference and included angle mentioned in this embodiment.

Returning back to FIG. 2A , the probe layout setting method of this embodiment is to perform a separate radio frequency characteristic test for a single object under test S0 or perform a radio frequency characteristic test and a signal characteristic test at the same time, and at least one of the impedance matching probes A cantilever probe with a needle-entry direction different from that of the impedance-matching probe on one side is used to perform a post-contact test on electrical contacts on the same side of the object under test at the same time. In another embodiment, the pendulum method of the present invention is not limited to a single DUT. For example, as shown in FIG. 4A to FIG. 4D , the pendulum layout in this embodiment can simultaneously test a plurality of DUTs. thing. Wherein, the probe card 2a is basically similar to the aforementioned probe card 2 for a single object to be tested, the difference is the arrangement of the swing pins. The setting of the swing needle in this embodiment can test a plurality of objects under test at the same time, for example, test objects S1 and S4 at the same time. The probe card 2a has a first probe module PC1 and a second probe module PC2, wherein the first probe module PC1 may include There are impedance matching probes for RF characteristics testing or both impedance matching probes and cantilever probes for RF characteristics testing and signal characteristics testing, such as: AC or DC signal characteristics testing, but this is not limited, and the second probe The pin module PC2 uses a cantilever probe to test the signal characteristics.

In this embodiment, there are multiple objects under test, for example, a wafer with multiple objects under test. For the convenience of description, four objects under test S1 - S4 are used for illustration below. The object to be measured moves from the side of the second probe module PC2 to the side of the first probe module PC1. For each object to be tested S1~S4, the signal characteristics of the second probe module PC2 are performed first. test, and then the radio frequency characteristic test is performed by the first probe module. During the testing process, as shown in FIG. 4A , the object under test S1 enters the second probe module PC2 for signal characteristic testing. However, the objects under test S2-S3 are arranged behind and have not yet entered the testing area of the second probe module PC2. At this time, the first probe module PC1 has no object under test entering the corresponding testing area. After the test of the object under test S1 is completed, the second probe module PC2 relatively moves to the object under test S2 for signal characteristic testing. In this embodiment, the probe card 2a corresponds to the test area of the object to be tested, and there is an interval of two objects to be tested between the first probe module PC1 and the second probe module PC2. When the object to be tested S4 moves relatively When arriving at the test area of the second probe module PC2, the object under test S1 will relatively move to the test area of the first probe module PC1, as shown in FIG. 4B. At this time, the first probe module PC1 and the second probe module PC1 The test area corresponding to the object under test between the two probe modules PC2 is the space between the objects under test S2 and S3. Although in this embodiment, there are two objects under test S2-S3 between the first probe module PC1 and the second probe module PC2, the number is not limited to two as shown in the figure, and more than one is acceptable. . In another embodiment, the test area corresponding to the object under test between the first probe module and the second probe module is that the first object under test is adjacent to the second object under test, and there is no object under test exists in between. In this embodiment, the first probe module PC1 is a combination of a plurality of impedance matching probes 21a-21c and first and second probes 22-22g and 23-23f, and its characteristics are as described above. I won't go into details here.

The second probe module PC2 in this embodiment is composed of a plurality of third probes 25a~25i and Composed of a plurality of fourth probes 26-26f. The third probes 25 a - 25 i go straight along the +X axis on the XY plane from the sealant layer 24 below the side wall W9 of the slot L7 toward the direction below the through hole 202 a. In this embodiment, each of the third probes 25a-25i is a cantilever probe, and each of the third probes 25a-25i has a tip section 250 and a cantilever section 251, wherein the tip section 250 is correspondingly arranged under the through hole 202a, and One end of the cantilever section 251 is electrically connected to the circuit substrate 201 . As shown in FIGS. 4B and 4D , the fourth probes 26 a - 26 f may be located on at least one side or both sides of the third probe, and this embodiment is an implementation of both sides. The fourth probes 26a to 26f are cantilever probes, wherein the fourth probes 26a to 26c are arranged on one side of the third probe 25a, and the fourth probes 26d to 26f are arranged on one side of the probe 25i. In this embodiment, the cantilever section 261 of the fourth probes 26a~26c is inserted obliquely toward the through hole 202a along the X axis and the -Y axis. Further, the fourth probes 26a~26c The cantilever section 221 enters the needle obliquely from the sealing layer 24 below the side wall W7 to the direction below the through hole 202a, so that there is an angle θ9 between the third central axis CL4 and the fourth central axis CL5. Similarly, the fourth probe 26d~ 26f is to insert the cantilever section 261 obliquely into the direction below the through hole 202a along the X-axis and the Y-axis. The adhesive layer 24 is obliquely inserted into the direction below the through hole 202a, so that there is an included angle between the third central axis CL4 and the fourth central axis CL5 of the fourth probes 26d-26f. It should be noted that the part of the cantilever section 251 of the third probes 25a~25i from the sealant layer 24 to the tip section 250 and the cantilever section 261 of the fourth probes 26~26f from the sealant layer 24 to the tip section 260 are set On the side B of the object to be tested, that is, under the through hole 202a, it is not disposed in the through hole 202a.

Please refer to FIG. 4E and FIG. 4F. This embodiment is basically similar to FIG. 4A to FIG. The third probe performs signal detection. In FIG. 4E , the first probe module PC1 is used to touch the object under test S1 , and the second probe module PC2 is used to touch the object under test S4 . From the side view, it can be seen that the layout relationship between the second probes 23~23f and the third probes 25a~25n, the tip section 230 of the second probes 23~23f has a height H4, and the third probes 23~23f 25j~25n are used to touch the electrical contacts on the first side SL1 of the object under test S4 close to the object under test S3, and the needle tip section 250 thereof has a height H5, while the needle tip section 250 of the third probes 25a~25i is used for To detect the electrical contact on a second side SL2 opposite to the first side SL1 of the object under test S4, and it has a height H6. In order not to interfere with each other between the probes, the height of the tip section has H4> H5>H6. In addition, the second probes 23-23f have a length LC1 from the end surface of the sealant layer 24 along the X-axis to the cantilever section of the tip section, and the third probes 25j-25n have a length LC1 from the end surface of the sealant layer 24 along the X-axis The cantilever section to the tip section has a length LC2, and the cantilever section from the end surface of the sealing layer 24 along the X-axis to the tip section of the third probes 25a-25i has a length LC3, wherein LC1>LC2>LC3. The second probes 23~23f, the third probes 25j~25n, and the third probes 25a~25i are cantilevered from the end surface of the sealing layer 24 along the X axis to the tip section from the side A of the testing machine to the object under test. Stacked arrangement of side B.

To sum up the above, the probe card of the present invention can provide the radio frequency characteristic test of the object to be tested, and realize the pendulum structure with the impedance matching probe and the cantilever probe at the same time through the oblique insertion of the cantilever probe. In addition to inserting the needle obliquely through the cantilever probe, further, the tip section height of the cantilever probe is greater than that of the impedance matching probe, which can avoid the problem of mutual interference between the impedance matching probe and the cantilever probe. In addition, the present invention can detect two DUTs at the same time, for example: one DUT is tested for signal characteristics, and the other DUT is tested for RF characteristics or RF characteristics plus signal characteristics test, so as to speed up the test. , to improve the efficiency of testing the analytes.

It should be noted that the "needle entry" in the present invention refers to the direction of the signal transmission part of the impedance matching probe towards the tip section of the probe part, or the cantilever of the cantilever probe such as the first probe to the fourth probe. The direction of the segment from the sealant layer 24 toward the needle tip segment does not refer to the movement. Both the impedance matching probe and the tip section of the cantilever probe are arranged on the side of the object to be tested on the probe base.

As shown in Figures 2A-2E, the probe card 2 of the present invention is used to test the electrical properties of the object under test. The probe card 2 includes a probe base 20, at least one impedance matching probe 21a-21c, and a plurality of first A probe is 22~22g. The probe holder 20 has a side B of the object under test and a side A of the testing machine corresponding to the side B of the object under test. Each impedance matching probe 21 a - 21 c has a probe part 210 and a signal transmission part 211 connected to the probe part 210 . One end of the signal transmission part 211 is disposed on the testing machine side A, and the signal transmission part 211 passes through the through hole 202 a on the probe base 20 , so that the probe part 210 is disposed on the DUT side B of the probe base 20 . The signal transmission part 211 has a probe central axis CL1. The plurality of first probes 22 - 22g each have a tip segment 220 and a cantilever segment 221 connected to the tip segment 220 . One end of the cantilever section 221 of each first probe 22 - 22g is electrically connected to the probe base 20 . Please also refer to FIG. 2C , further speaking, one end of the cantilever section 221 of each first probe 22 - 22g is electrically connected to the contact point of the third surface 201e of the circuit substrate 201 of the probe base 20 . The needle tip segment 220 is disposed on the side B of the through hole 202 a to be tested. The cantilever section 221 has a first central axis CL2. Wherein, at least one side of each impedance matching probe 21a-21c has at least one first probe 22-22g, and the central axis CL1 of the probe and the first central axis CL2 of the at least one first probe 22-22g have an angle greater than zero. The first included angle (the included angle θ1~θ3, the included angle between the probe central axis CL1 of the impedance matching probe 21c and the first central axis CL2 of at least one first probe 22b~22g), and the first included angle is less than 90 degrees. More specifically, the first included angle (the included angle θ1~θ3, the included angle between the probe center axis CL1 of the impedance matching probe 21c and the first center axis CL2 of at least one first probe 22b~22g) is preferably 35 degrees Between ~55 degrees.

The probe holder 20 further has a fixed substrate 200 , a circuit substrate 201 , a plurality of bearing seats 200 d - 200 f and a positioning structure 202 . Wherein, the fixed substrate 200 has a first surface 200a facing the side B of the object to be tested, a second surface 200b facing the side A of the testing machine, and a first through hole 200c passing through the first and second surfaces 200a and 200c, so that the through hole 202a Corresponding to the first through hole 200c. The circuit substrate 201 is disposed on the second surface 200b. The circuit substrate 201 has a second through hole 201a corresponding to the first through hole 200c. One end of the cantilever section 221 of the plurality of first probes 22-22g is electrically connected to the circuit substrate 201. A plurality of bearing seats 200d~200f are arranged in the second through hole 201a and fixed on the second surface 200b, each bearing seat 200d~200f correspond to one of the impedance matching probes 21a~21c, and each impedance matching probe 21a~21c has a signal connection connector 2121 electrically connected to one end of the signal transmission part 211 of the corresponding impedance matching probe 21a~21c . There are a plurality of positioning plates 200g-200i around each bearing seat 200d-200f, and at least one positioning plate 200g-200i is used to limit the position of the bearing seat 200d-200f. The positioning structure 202 is disposed on the first surface 200 a of the fixed substrate 200 , and the positioning structure 202 has a through hole 202 a for the signal transmission part 211 to pass through.

The probe portion 210 of each impedance matching probe 21 a - 21 c further has a tip section 2100 and a connection section 2101 connected to the tip section 2100 . The connection section 2101 is coupled to the signal transmission part 211 , and the height of the tip section 2100 of each impedance matching probe 21 a - 21 c is smaller than the height of the tip section 220 of the adjacent first probes 22 - 22 g .

The through hole 202a has a plurality of slots L5~L8, wherein each impedance matching probe 21a~21c corresponds to one of the slots L5, L6, L8, and the signal transmission part 211 of each impedance matching probe 21a~21c is respectively Pass through one of the slots L5 , L6 , L8 corresponding to the through hole 202 a, and insert the needle straight along the first axis X or the second axis Y into one of the slots L5 , L6 , L8 . One of the slots L5, L6, L8 has two sidewalls W5, W6 parallel to the first axis X, wherein at least one first probe 22b~22g is from the sidewalls W5, W6 along the first axis X, and The needle is inserted obliquely toward the side of the through hole 202 a that has an included angle greater than zero with the side walls W5 and W6 .

In addition, the probe card 2 further has a plurality of second probes 23-23f corresponding to the other slot L7, and the plurality of second probes 23-23f are directed along the first axis X to the side of the through hole 202a to be tested. direction, wherein the probe center axis CL1 of the impedance matching probe 21c in the slot L5 opposite to the other slot L7 corresponding to the plurality of second probes 23~23f and the plurality of second probes The second central axes CL3 of the needles 23-23f are parallel to each other.

The slot L7 has two sidewalls W7 and W8 parallel to the first axis X. As shown in FIG. One of the slots L6, L8 has two sidewalls parallel to the second axis Y, so that the signal transmission portion 211 of one of the impedance matching probes 21a, 21b passes through the corresponding slot L6, L8 of the through hole 202a. At least one of the first probes 22 , 22 a is inserted obliquely from the sidewalls W7 , W8 along the first axis X toward the object-to-be-measured side of the through hole 202 a. Furthermore, the at least one first probe 22 , 22 a extends from the end surface of the sealant layer 24 to the cantilever section 221 of the tip section 220 obliquely toward the adjacent impedance matching probe 21 a , 21 b. For example, the cantilever section 221 of the first probe 22 from the end surface of the sealant layer 24 to the tip section 220 is obliquely inserted into the adjacent impedance matching probe 21b. The cantilever section 221 of the first probe 22 a from the end surface of the sealant layer 24 to the needle tip section 220 obliquely enters the adjacent impedance matching probe 21 a.

In addition, the slot L7 further has a sidewall located between the two sidewalls W7 and W8 and perpendicular to the first axis X. As shown in FIG. The side wall of the slot L7 perpendicular to the first axis X is the side wall of the needle insertion of the second probes 23-23f.

As shown in FIGS. 4A-4E and FIG. 5 , the probe card 2 a of the present invention includes a probe base 20 , a first probe module PC1 and a second probe module PC2 . The probe holder 20 has a side B of the object under test and a side A of the testing machine corresponding to the side B of the object under test. The first probe module PC1 is disposed on the probe base 20 . The first probe module PC1 has at least one impedance matching probe 21a-21c and a plurality of first cantilever probes (for example, a plurality of first probes 22-22g). Each impedance matching probe 21 a - 21 c has a probe part 210 and a signal transmission part 211 . The probe part 210 has at least two needle tip segments 2100 . In this embodiment, as shown in FIG. 4C , the probe part 210 has three tip segments 2100 , which are respectively one signal and two ground GSG tips. But the tip segment 2100 can also be a SG tip with one signal and one ground, a GSSG tip with two signals and two grounds, or a GSGSG tip with two signals and three grounds. Therefore, the minimum number of tip segments of the probe part 210 is two, which is used for radio frequency (RF) characteristic testing, for example. The signal transmission part 211 is connected with the probe part 210 . Each first cantilever probe has a tip section 220 and a cantilever section 221 . The cantilever section 221 is connected to the needle tip section 220 . at least one The tip segments 2100 of the impedance matching probes 21 a - 21 c and the tip segments 220 of the plurality of first cantilever probes form a first survey area. In this embodiment, as shown in FIG. 4B and FIG. 4C, the first survey area is the tip section 2100 of the impedance matching probes 21a-21c of the first probe module PC1 and the tip section 220 of the first cantilever probe. Corresponding to the area surrounded by the electrical contacts (Pad) of the object under test S1. The second probe module PC2 is disposed on the probe base 20 and located at one side of the first probe module PC1 . In this embodiment, as shown in FIG. 4A , the second probe module PC2 is located on the −X-axis side of the first probe module PC1 on the XY plane. The second probe module PC2 has a plurality of second cantilever probes (for example, third probes 25 a - 25 i , fourth probes 26 a - 26 f ). Each second cantilever probe has a tip section 250, 260 and a cantilever section 251, 261 respectively. The cantilever sections 251 , 261 are connected to the needle tip sections 250 , 260 . The tip segments 250, 260 of the plurality of second cantilever probes form a second survey area. In this embodiment, as shown in FIG. 4B and FIG. 4C , the second survey area is the tip section 250 of the third probes 25a-25i and the tip of the fourth probes 26a-26f of the second probe module PC2. The section 260 corresponds to the area surrounded by the electrical contacts (Pads) of the object under test S4. The distance between the first survey area and the second survey area is greater than the distance between any two tip segments 250 , 260 of the second cantilever probe. More specifically, on the XY plane, the distance between the first survey area and the second survey area on the X axis is greater than any two second cantilever probes (such as the fourth probe 26a and the fourth probe 26f) The distance of the tip segment 260.

At least one impedance-matching probe 21a-21c of the first probe module PC1 and the tip segments 2100, 220 of the plurality of first cantilever probes are used to point test an electrical contact of an object under test, as shown in FIG. 4B , as shown in FIG. 4C , in this embodiment, it is an electrical contact used for spot testing the object under test S1. The needle tip segments 250, 260 of the plurality of second cantilever probes of the second probe module PC2 are used to spot-test the electrical contacts of another object to be tested, as shown in Fig. 4B and Fig. 4C. In the example, it is used for spot testing the electrical contacts of the object under test S4. The definition of the distance between the first surveying area and the second surveying area, as shown in Figure 4B, Figure 4C, in this embodiment, It means that on the first axis X, the side of the first survey area adjacent to the second survey area (that is, the side of the first survey area close to the -X axis) and the second survey area adjacent to the first survey area The distance between the sides of the area (that is, the side of the second point measurement area close to the X-axis). More specifically, in this embodiment, the probe card 2a is used to test a plurality of DUTs (such as crystal grains) on the wafer, as shown in FIG. 4B and FIG. 4C, only the DUTs S1~ S4 as a representative. The size of each object to be tested and the relative position of the electrical contacts are the same. When the probe card 2a is used to measure the object to be tested, each needle tip segment in the first point measurement area or the second point measurement area must be able to Point measurement to the electrical contact corresponding to the object to be tested. Therefore, the first coverage area is roughly equivalent to the second coverage area. Here, "substantially equal" refers to a structure that considers the possible processing accuracy error of each probe in the first survey area and the second survey area, and the maintenance and adjustment of the position of the needle tip section of the probe card 2a. In this embodiment, the distance between the first surveying area and the second surveying area is greater than the width distance of an object under test on the first axis X. As shown in Figure 4B, Figure 4C, and Figure 4E, the distance between the first survey area and the second survey area is greater than the width distance of the object to be measured S2 and the object to be measured S3 on the first axis X, that is, the first The distance between the surveying area and the second surveying area is greater than the width distance of the two objects to be measured on the first axis X. Taking the object S4 as an example, the width distance of the object on the first axis X refers to the width between the first side SL1 and the second side SL2 of the object S4 on the first axis X distance. There are cutting lines between the objects S1-S4 to be tested (not shown in the figure). In this embodiment, as shown in FIG. 4B , FIG. 4C , and FIG. 4E , the width distance of the second survey area is less than or equal to the width distance of the corresponding object S4 on the first axis X. Therefore, the distance between the first survey area and the second survey area is greater than the width distance of a second survey area on the first axis X. The width distance of the second survey area on the first axis X refers to the width distance of the two opposite sides of the second survey area on the first axis X, that is, the second survey area is adjacent to the first survey area. The width distance from the side of the region to the side away from the first hit region. As shown in FIG. 4B , FIG. 4C , and FIG. 4E , the two opposite sides of the second survey area are respectively adjacent to the first side SL1 and the second side SL2 of the object under test S4 .

In the embodiment shown in FIGS. 4B-4E , one end of the signal transmission part 211 is arranged on the side A of the testing machine, and the signal transmission part 211 passes through the through hole 202a on the probe base 20, so that the probe part 210 is disposed on the probe base 20. The side B of the object to be measured, please refer to Fig. 2A~2E together, the parts corresponding to the impedance matching probes 21a~21c and the first probes 22~22g, the signal transmission part 211 has a probe central axis CL1, and a plurality of first probes The cantilever probe includes a plurality of first probes 22-22g, and one end of the cantilever section 221 of each first probe 22-22g is electrically connected to the probe base 20. Please refer to FIG. 1A at the same time. More specifically, one end of the cantilever section 221 of each first probe 22 to 22g is electrically connected to a contact point on the third surface 201e of the circuit substrate 201 of the probe holder 20 . The tip segment 220 of each first probe 22~22g is arranged on the side B of the through hole 202a, the cantilever segment 221 of each first probe 22~22g has a first central axis CL2, wherein each impedance At least one side of the matching probes 21a-21c has at least one first probe 22-22g, and the central axis CL1 of the probes and the first central axis CL2 of the at least one first probes 22-22g have a first included angle ( The included angles θ1˜θ3, the included angles between the probe central axis CL1 of the impedance matching probe 21c and the first central axis CL2 of at least one first probe 22b˜22g), and the first included angle is less than 90 degrees. More specifically, the first included angle (the included angle θ1~θ3, the included angle between the probe center axis CL1 of the impedance matching probe 21c and the first center axis CL2 of at least one first probe 22b~22g) is preferably 35 degrees Between ~55 degrees.

4B~4E, the through hole 202a has a plurality of slots L5~L8, wherein each impedance matching probe 21a~21c corresponds to one of the slots L5, L6, L8, each impedance matching probe The signal transmission parts 211 of the needles 21a~21c respectively pass through one of the slots L5, L6, L8 corresponding to the through hole 202a, and in one of the slots L5, L6, L8 along the first axis X or the second axis X. Two-axis Y advances the needle straight. One of the slots L5 has two sidewalls W5, W6 parallel to the first axis X, wherein at least one first probe 22b-22g is from the sidewalls W5, W6 along the first axis X to the through hole 202a. Insert the needle obliquely in direction B on the object side.

In addition, in one embodiment, the plurality of first cantilever probes of the probe card 2a include a plurality of One of the second probes 23~23f corresponds to the other slot L7, and the plurality of second probes 23~23f are inserted from the first axis X to the direction B of the object side of the through hole 202a, each One end of the cantilever section 231 of the second probes 23 - 23f is electrically connected to the probe base 20 . Please refer to FIG. 1A at the same time. More specifically, one end of the cantilever section 231 of each second probe 23 - 23f is electrically connected to the contact point on the third surface 201e of the circuit substrate 201 of the probe base 20 . Among them, the probe central axis CL1 of the impedance matching probe 21c in the slot L5 opposite to the other slot L7 corresponding to the plurality of second probes 23~23f is the same as the second probe axis CL1 of the plurality of second probes 23~23f. The two central axes CL3 are parallel to each other.

The plurality of second cantilever probes of the probe card 2a have a plurality of third probes 25a~25n, which are inserted along the first axis X toward the side of the through hole 202a to be tested, and are inserted into the plurality of third probes 25a~25n. A plurality of fourth probes 26a~26f are arranged on both sides of 25n, the cantilever section 251 of each third probe 25a~25n has a third central axis CL4, and the cantilever section 261 of each fourth probe 26a~26f It has a fourth central axis CL5, wherein at least one third central axis CL4 and at least one fourth central axis CL5 have a second included angle (angle θ9) greater than zero, and the second included angle is less than 90 degrees. More specifically, the second included angle (the included angle θ9) is preferably between 35 degrees and 55 degrees.

In the embodiment of Figures 4B-4E, the probe base 20 as shown in Figure 1A and Figure 1B, the probe base 20 further has a fixed substrate 200, a circuit substrate 201, a plurality of bearing bases 200d-200f and positioning Structure 202. Wherein, the fixed substrate 200 has a first surface 200a facing the side B of the object to be tested, a second surface 200b facing the side A of the testing machine, and a first through hole 200c passing through the first and second surfaces 200a and 200b, so that the through hole 202a Corresponding to the first through hole 200c. The circuit substrate 201 is disposed on the second surface 200b. The circuit substrate 201 has a second through hole 201a corresponding to the first through hole 200c. One end of the cantilever section 221 of the plurality of first probes 22-22g is electrically connected to the circuit substrate 201. A plurality of bearing seats 200d~200f are arranged in the second through hole 201a and fixed on the second surface 200b, each bearing seat 200d~200f corresponds to one of the impedance matching The probes 21a-21c are provided, and each impedance-matching probe 21a-21c has a signal connection connector 2121 electrically connected to one end of the corresponding signal transmission part 211 of the impedance-matching probe 21a-21c. The positioning structure 202 is disposed on the first surface 200 a of the fixed substrate 200 , and the positioning structure 202 has a through hole 202 a for the signal transmission part 211 to pass through. Please also refer to the part shown in FIG. 2C, which corresponds to the positioning structure 202 and the first probes 22-22g. In one embodiment, the positioning structure 202 has a connecting surface 202b and a fixing surface 202c, and the connecting surface 202b and the first surface 200a In connection, the fixing surface 202c further has a sealant layer 24 , wherein a part of the cantilever segments 221 of the plurality of first probes 22 - 22g is covered by the sealant layer 24 .

The first central axis CL2 described in the present invention is based on the cantilever section 221 of the first probe 22 - 22g from the end face of the sealant layer 24 to the tip section 220 . The second central axis CL3 is based on the cantilever section 231 of the second probes 23 - 23 f from the end surface of the sealant layer 24 to the tip section 230 . The third central axis CL4 is determined based on the cantilever section 251 of the third probes 25 a - 25 n from the end surface of the sealant layer 24 to the tip section 250 . The fourth central axis CL5 is determined based on the cantilever section 261 of the fourth probe 26 a - 26 f from the end surface of the sealant layer 24 to the tip section 260 .

In one embodiment, there are a plurality of positioning plates 200g-200i around each bearing seat 200d-200f, at least one positioning plate 200g-200i is used to limit the position of the bearing seat 200d-200f, and fix the bearing seat 200d-200f on the second surface 200b.

In the embodiment shown in FIGS. 4B-4F , the tip segment 230 of each second probe 23 - 23f has a first height H4. Some of the tip segments 250 of the third probes 25 a - 25 n have the second height H5 , for example, the tip segments 250 of the third probes 25 j - 25 n have the second height H5 . The tip segments 250 of another part of the plurality of third probes 25 a - 25 n have a third height H6 , for example, the tip segments 250 of the third probes 25 a - 25 i have a third height H6 . Each tip segment 250 with the second height H5 is used to touch an electrical contact on the first side of the object under test. In the embodiment of Figures 4B-4F, each of the third probes 25j-25n having the second height H5 The needle tip segment 250 is used to touch the electrical contact on the first side SL1 of the object under test S4. Each tip segment 250 with the third height H6 is used to touch an electrical contact on a second side opposite to the first side of the object under test. In the embodiment shown in FIGS. 4B-4F , each tip segment 250 of the third probes 25a-25i having a third height H6 is used to touch the second side opposite to the first side SL1 on the object under test S4. Electrical contact on SL2. Wherein the first height H4 is greater than the second height H5 and greater than the third height H6.

In the embodiment shown in FIGS. 4B-4F , referring to the part corresponding to the positioning structure 202 in FIG. 2A , the probe base 20 is located on the side B of the object to be tested and further has a sealant layer 24 . Parts of the cantilever sections 221 of the plurality of first probes 22 - 22 g are covered by the sealant layer 24 . In addition, a part of the cantilever section 231 of the plurality of second probes 23-23f, a part of the cantilever section 251 of the plurality of third probes 25a-25n, and a part of the cantilever section 261 of the plurality of fourth probes 26a-26f are all Covered by the sealant layer 24 . Each of the second probes 23 - 23 f has a first length LC1 from the end surface of the sealant layer 24 to the cantilever segment 231 of the tip segment 230 along the first axis X. A part of the plurality of third probes 25a~25n has a second length LC2 from the end face of the sealant layer 24 along the cantilever section 251 of the first axis X, for example, the third probes 25j~25n extend from the end face of the sealant layer 24 The cantilever section 251 along the first axis X has a second length LC2. Another part of the plurality of third probes 25 a - 25 n has a third length LC3 along the cantilever section 251 of the first axis X from the end surface of the sealant layer 24 . For example, the cantilever section 251 of the third probes 25 a - 25 i from the end surface of the sealant layer 24 along the first axis X has a third length LC3 . Each cantilever section 251 with the second length LC2 is respectively connected to each tip section 250 with the second height H5 for touching an electrical contact on the first side of an object under test. For example, in the embodiment shown in FIGS. 4B-4F , each cantilever section 251 of the third probe 25j-25n having the second length LC2 is respectively connected to each needle tip section 250 having the second height H5, so as to touch the probe to be tested. An electrical contact on the first side SL1 on the object S4. Each cantilever segment 251 having a third length LC3 is connected to each tip segment 250 having a third height H6 for touching an electrical contact on a second side opposite to the first side on the object under test. For example, in the embodiment of FIGS. 4B-4F , each of the third probes 25a-25i having a third height H6 The cantilever segment 251 is connected to each tip segment 250 having a third height H6 for touching an electrical contact on the second side SL2 opposite to the first side SL1 on the object under test S4 . Wherein the first length LC1 is greater than the second length LC2 and is greater than the third length LC3.

The first included angle and the second included angle in the present invention are greater than 0 degrees and less than 90 degrees, preferably between 35 degrees and 55 degrees. Mainly for the first central axis CL2 of the first probes 22b~22g corresponds to the shape and spatial arrangement of the electrical contacts of the object to be tested, so that the needle tip section 220 of the first probes 22b~22g contacts the electrical properties of the object to be tested. The needle mark caused by the contact can be within the preset range of the electrical contact.

The above description is only a description of the preferred implementation or examples of the technical means used to solve the problems in the present invention, and is not intended to limit the scope of the patent implementation of the present invention. That is, all equivalent changes and modifications that are consistent with the scope of the patent application of the present invention, or made according to the scope of the patent of the present invention, are covered by the scope of the patent of the present invention. In the present invention, the object to be tested is not a necessary condition for defining the distance between the first survey area and the second survey area, and the first survey area can also be defined without the test object (S1-S4). The distance between the hit area and the second hit area. For example, in this embodiment, the distance between the first survey area and the second survey area can also be any tip section of the first probe module PC1 (such as the tip section 230 of the second probe 23 ). The distance from any tip segment of the second probe module PC2 (for example, the tip segment 260 of the fourth probe 26 ).

200: fixed substrate

21a~21c: Impedance matching probe

210: Probe Department

210a, 210b, 210c: subprobes

2101: Connection segment

211: Signal transmission department

2110: Outer conductor

22~22g: the first probe

23~23f: the second probe

S0: The object to be tested

PAD _RF : the first electrical contact

PAD: the second electrical contact

L1~L4: side

L5~L8: slotting

CL1: Central axis of the probe

CL2: the first central axis

θ1~θ4: included angle

Claims (20)

A probe card for testing the electrical properties of an object to be tested. The probe card includes: a probe base having a side of the object to be tested and a testing machine side corresponding to the side of the object to be tested; at least An impedance matching probe, each impedance matching probe has a probe portion and a signal transmission portion connected to the probe portion, one end of the signal transmission portion is arranged on the testing machine side, and the signal transmission portion passes through the A through hole on the probe base, the signal transmission part has a central axis of the probe; and a plurality of first probes, each having a tip segment and a cantilever segment connected to the tip segment, each of the first probes One end of the cantilever section is electrically connected to the probe base, the tip section is arranged on the side of the through hole to be tested, and the cantilever section has a first central axis; wherein, at least one of each impedance matching probe The side has at least one first probe, and the central axis of the probe has a first angle greater than zero with the first central axis of the at least one first probe. The probe card as described in claim 1, wherein the probe base further has: a fixed substrate with a first surface facing the object-to-be-tested side, a second surface facing the testing machine side, and penetrating through the A first through hole on the first and second surfaces, so that the through hole corresponds to the first through hole; a circuit substrate is arranged on the second surface, and the circuit substrate has a second through hole corresponding to the first through hole Correspondingly, one end of the cantilever section of the plurality of first probes is electrically connected to the circuit substrate; a plurality of bearing seats are arranged in the second through hole and fixed on the second surface, and each bearing seat corresponds to One of the impedance matching probes, each of the impedance matching probes has a signal connection connector electrically connected to one end of the signal transmission part of the corresponding impedance matching probe; and a positioning structure is arranged on the fixed substrate On the first surface of the positioning structure, the through hole is provided for the signal transmission part to pass through. The probe card according to claim 2, wherein a plurality of positioning plates are arranged around each of the bearing seats, and at least one of the positioning plates is used to limit the position of the bearing seat. The probe card as described in claim 1, wherein the probe portion of each of the impedance matching probes further has a needle tip section, and a connection section connected to the needle tip section, and the connection section is connected to the signal transmission part coupling, the height of the tip segment of each impedance-matching probe is smaller than the height of the tip segment of the adjacent first probe. The probe card as described in claim 1, wherein the through hole has a plurality of slots, wherein each of the impedance matching probes corresponds to one of the slots, and the signal transmission part of each of the impedance matching probes Don't pass through one of the slots corresponding to the through hole, and insert the needle straight along a first axis or a second axis in the one of the slots. As the probe card described in claim 5, one of the slots has two side walls parallel to the first axis, wherein at least one of the first probes is from the side wall along the first axis, And in a direction having an included angle greater than zero with the side wall, the needle is obliquely inserted toward the side of the through-hole to be tested. The probe card as described in claim 5 further has a plurality of second probes corresponding to the other slot, and the plurality of second probes are directed toward the through hole along the first axis. The needle is inserted straight from the side of the test object, wherein the probe central axis of the impedance matching probe in the slot opposite to the other slot corresponding to the plurality of second probes is aligned with the plurality of second probes. The second central axis of one of the two probes is parallel. The probe card according to claim 1, wherein the first included angle is between 35 degrees and 55 degrees. A probe card, comprising: a probe base having a side of an object to be tested and a testing machine side corresponding to the side of the object to be tested; a first probe module set on the probe base, the The first probe module has: at least one impedance matching probe, and each of the impedance matching probes has: A probe part with at least two tip segments; and a signal transmission part connected to the probe part; a plurality of first cantilever probes, each of which has: a tip segment; and a cantilever segment , connected to the tip segment of the first cantilever probe; wherein, the tip segments of the at least one impedance matching probe and the tip segments of the plurality of first cantilever probes form a first surveying area and a second probe module set on the probe base and located on one side of the first probe module, the second probe module has: a plurality of second cantilever probes, each of the The second cantilever probe has: a tip section; and a cantilever section connected to the tip section of the second cantilever probe; wherein, the tip sections of the plurality of second cantilever probes form a second point measurement area; the distance between the first survey area and the second survey area is greater than the distance between any two tip segments of the second cantilever probe. The probe card as described in claim item 9, wherein one end of the signal transmission part is arranged on the side of the testing machine, and the signal transmission part passes through a through hole on the probe base, so that the probe part is arranged on the probe On the side of the object under test of the seat, the signal transmission part has a probe central axis, the plurality of first cantilever probes include a plurality of first probes, and one end of a cantilever section of each first probe is connected to the probe The needle seat is electrically connected, and a tip section of each first probe is arranged on the side of the through hole to be tested, and the cantilever section of each first probe has a first central axis, wherein each At least one side of the impedance matching probe has at least one of the For the first probe, the central axis of the probe and the first central axis of the at least one first probe have a first angle greater than zero. The probe card as described in claim 10, wherein the through hole has a plurality of slots, each of the impedance matching probes corresponds to one of the slots, and the signal transmission part of each impedance matching probe Don't pass through one of the slots corresponding to the through hole, and insert the needle straight along a first axis or a second axis in one of the slots. The probe card as claimed in item 11, wherein one of the slots has two side walls parallel to the first axis, wherein the at least one first probe is from the side wall along the first axis Insert the needle obliquely toward the side of the through hole to which the object to be tested is directed. The probe card as claimed in claim 11, wherein the plurality of first cantilever probes include a plurality of second probes corresponding to the other slot, and the plurality of second probes are formed by the first shaft The needle is inserted straight toward the side of the test object of the through hole, and one end of a cantilever section of each second probe is electrically connected to the probe base, wherein the one corresponding to the plurality of second probes The probe central axis of the impedance matching probe in the slot opposite to the other slot is parallel to the second central axis of one of the plurality of second probes. The probe card as described in claim item 13, wherein the plurality of second cantilever probes have a plurality of third probes, which are inserted along the first axis toward the side of the through-hole to be tested. A plurality of fourth probes are respectively arranged on both sides of each third probe, each cantilever section of the third probe has a third central axis, and each cantilever section of the fourth probe has a first Four central axes, wherein at least one of the third central axes and at least one of the fourth central axes have a second angle greater than zero. The probe card as described in claim item 10, wherein the probe base further has: A fixed substrate has a first surface facing the object to be tested, a second surface facing the testing machine, and a first through hole passing through the first and second surfaces, so that the through hole and the first Corresponding to a through hole; a circuit substrate is arranged on the second surface, the circuit substrate has a second through hole corresponding to the first through hole, one end of the cantilever section of the plurality of first probes is electrically connected to the circuit substrate Sexual connection; a plurality of bearing seats are arranged in the second through hole and fixed on the second surface, each of the bearing seats corresponds to one of the impedance matching probes, and each of the impedance matching probes has a The signal connector is electrically connected to one end of the corresponding signal transmission part of the impedance matching probe; and a positioning structure is arranged on the first surface of the fixed substrate, and the positioning structure has the through hole for the signal transmission part to pass through. Pass. The probe card according to claim 15, wherein the positioning structure has a connecting surface and a fixing surface, the connecting surface is connected to the first surface, and the fixing surface is further provided with a sealant layer, wherein the plurality of first surfaces A part of the cantilever section of a probe is covered by the sealant layer. The probe card according to claim 15, wherein a plurality of positioning plates are arranged around each of the bearing seats, and at least one of the positioning plates is used to limit the position of the bearing seat. The probe card as described in claim 14, wherein the tip section of each of the second probes has a first height, and the tip sections of a part of the plurality of third probes have a second height, The needle tip segments of the plurality of third probes in another part have a third height, and each of the needle tip segments with the second height is used to touch an electric pole on a first side of an object under test. Each of the needle tip segments having the third height is used to touch an electrical contact on a second side opposite to the first side on the object under test, wherein the first height is greater than the first side The second height is greater than the third height. The probe card as described in claim 14, wherein the probe seat is located on the side of the object to be tested There is a sealant layer, wherein a part of the cantilever section of the plurality of second probes and the plurality of third probes is covered by the sealant layer, each of the second probes from the sealant layer The cantilever section of the end surface along the first axis has a first length, a part of the plurality of third probes has a second length of the cantilever section along the first axis from the end surface of the sealant layer, and A part of the plurality of third probes has a third length along the cantilever section along the first axis from the end surface of the sealant layer, and each of the cantilever sections with the second length is respectively connected with a second Each of the needle tip sections with a height is used to touch an electrical contact on a first side of an object under test, and each of the cantilever sections with the third length is respectively connected with each of the cantilever sections with a third height. The needle tip segment is used to touch the electrical contact on a second side opposite to the first side of the object under test, wherein the first length is greater than the second length and greater than the third length. The probe card according to claim 10, wherein the first included angle is between 35 degrees and 55 degrees.

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