201116834 、發明說明： 特别是指一種垂直式探針卡。 【發明所屬之技術領域】 本發明是關於一種探針卡， 【先前技術】 在半導體產業當中，晶s 在進行晶片的封裝工程之前，201116834, invention description: especially refers to a vertical probe card. [Technical Field] The present invention relates to a probe card, [Prior Art] In the semiconductor industry, before the wafer is packaged,
0¾乃货乂切月匕/只丨J兩，以淘 汰不良品’避免將有缺_晶片繼續加卫而造成不必要的成本浪 費與相失。而探針卡的存在’即是作為測賴台與㈣間的一個 介面’提供從戦機台以_訊鱗遞雜，以制在晶圓級 晶圓的封襞測試乃是非常重要的 刖’乾先對這些晶片做功能測試 的測試工程當中。 因此如何盡可能的提聽針卡的戦品該鱗，乃是本領 域不斷追求的目標。畢餅於產品成本她數百萬至上千萬的半 導體廠商而言，無論是多細微的良率改善，其造成的影響亦絕對 不可忽視。 目前而言，垂直式探針卡結構基本上包括了印刷電路板 (Printed Circuit Board，PCB)、空間轉換器以及探針三個部份。印刷 電路板上會佈滿許多的電子元件，電源與信號由印刷電路板上的 線路傳遞至其下的空間轉換器，接著再傳遞至空間轉換器下方的 探針’而由探針和下方的測試晶圓作接觸。這樣長的訊號傳輸路 徑’會對訊號造成干擾、並使訊號雜訊增加、電壓不穩定等等。 如此一來，將會大大影響到探針卡的測試品質’也破壞了整體測 試訊號傳輸的完整性。 而垂直式探針卡的種類則^區分為人工拉線(Hand Wire， 201116834 HW)、多層陶瓷/多層有機(Multi-Layer Ceramic/Multi-Layer* Oganie, MLC/ML0)以及整合式電路板㈣略加以pcb，INT PCB)等三種架 構。 、 在人工拉線的架構下，空間轉換器是由一具有多個通孔的基 板，或稱孔板來達成空間轉換之功能。自印刷電路板連接順應性 的導線經由通孔貫穿孔板的上下表面，而連接至孔板下方的探 針；而在多層陶瓷/多層有機的架構下，則是藉由多層陶瓷基板或 是多層有機基絲作為㈣轉換^多層喊基板或是多層有機 基板的基板内部具有複雜的線路佈局與走線，使得基板上下表面 的接點得以電性導通。 以人工拉線的架構而言，其中的孔板是内部不具線路佈局， 孔板上的多個通孔係貫穿孔板的上下表面，各孔板之間的間距小 於印刷電路板上各電路結構的接點之_間距，是以藉由順應性 的導線-猶接印刷電路板上的接點，另―端穿設絲上的通孔 並使導線m定並針，可以達到空哺換的目的。而多層陶解 層有機的架構肢透過多層喊基板或多層有機基板^卩的線= 佈局’使基板的上表面連制印刷電路板大_ 轉換成下表面的小間距。然而，多層陶糾層有機的架 需花賴大的成本與時間，而人魂線_]以外接順 式，制㈣單的純㈣料線，因此設計與製 敕整合錢路__，贱好制紛層有機的概念直接 路板上，也就是說，將印刷電路板與空間轉換器整 。起形成-整合式電路板’故整合式電路板本身即具有空間 201116834 轉換的功ι。傳統的印刷電路板’並無法直接將大驗轉換成晶 圓'’及= 小間距’但整合式電路板則能夠做到這樣的轉換功能。 一夕°斤述目如驾用的這些技術，都是在印刷電路板上放置 許多的電子元件’訊號傳遞路徑過長，容易帶來許多的缺點。 在美國專利公開第20_085593財，揭露了一種探針結 構，其中複數個彈簧探針腦、lp〇w、1GND被配置在一 座3的各個導孔5中，各導孔5内壁則塗佈導電層ι〇，探針们 上則，有-電容9，如此一來各彈簧探針被導電層1〇所包覆，並 得乂#電谷9進行電性連接。然而以上結構僅適用於彈 ，結構，並不適用本案_直式探針，或者，與彈簧探針結構作 本案的垂直式探針可稱為挫屈柱(Budding Beam)探針。若 以上結構以麵_針結構取僻簧探針，則麵試時， =^_于接觸，在待測物作用在探針上的力，將使探針】 ^挫屈的側向變形’導致探針與導孔5内壁的摩擦，故長期使用 ^使^電層10逐漸受損、剝落’使接觸電阻提高。因此這樣的 、、。果2使探針卡電特性不佳、不利於產業上的使用。 犮是之故’申請人有鑑於習知技術之缺失， =’創作出本發明「探針卡之結構」，以克也： 為本案之簡要說明。 B A卜 【發明内容】 本發狀主要目的顺供—種_柯直雜針 =善習用方法所造成的缺失與不足，來達到節省成本:二 不良率以及提升應用領域等功效。 _ 201116834 根據本發_構想，提出-種探針卡，包括—印刷電路板，其 具有-第-接點與-第二接點；-、空間轉換器，其具有一孔板與 順應性的-第-導線、-第二導線、—第三導線及—第四導線了 該孔板具有多個孔洞，在該孔板的下表面上包括一第一導電層、 -第二導電層、一第—接觸墊及—第二接觸塾，該第—導線的兩 端分別電性連接該第-接點及該第—導電層，該第二導線的兩端 分別電性連接該第二接點及該第二導電層，該第三導線分別連接 該第-導電層及該第-接砸’該第四導線分別連接該第二導電 層及該第二接雜，該第三導線及該第四導線储由穿設該些孔 洞分別連接該接驗及鱗二接觸墊；錢―電子元件了其 位於該孔板的下表面，並電性連接該第一導電層及該第二導電層、。 較佳地’本發明所提出之探針卡，更包括一探針座，其配日 該空間轉換器下’並包括-第—探針與—第二探針，巧該第一 探針與該第二探針分別電性連接該第一接觸塾與該第二接·。 較佳地，本發騎提出之探針卡，其中該第—探針為電源 及訊號探針其巾之-，該第二探針為—接地探針。 、 較佳地，本發明所提出之探針卡，其中該第— 針為挫屈柱探針。 乐一亨木 較佳地’本發騎提出之探針卡，其中該電子 元件、祕元件、及躲_元件射之… v為主動 板，1本右發一Γ另一一構想’提出—種探針卡’包括一印刷電路 第-導線及第點二空間轉換器’其具有一孔板與順應性的-^，線及1—導線’該孔板具有多個孔洞，在該孔板的下表 兩山弟—導電層、—第二導電層及—接觸墊，該第-導線 兩μ別電性連接該接點及該第—導縣，該第二導線的兩端分 201116834 別電性連接該第二導電層及該接觸塾，該第 孔洞中連接該接觸墊，·以及—電子元 該該 並電性連接該第-導電層及該第二導電芦。4板的下表面， ，嫩—她，其配置在 電:門轉換◎下，並包括，，其中該探針電性連接該第二導 較佳地，本發明所提出之探針卡，1 號探針及接地探針的其中之—。，、中执針為電源探針、訊 較本發明所提出之探針卡，其中該二探針為挫屈柱探針。 杈佳地，本發赌提此探針卡，其找電 元件、被航件、及無齡航件射之—。 f y為主動 根據本發明的又-構想，提出—種探針卡，包括—印刷電路 板’其具有一第一接點與一第二接點；一探針座，在其内部設置 一第-導電層及-第二導電層’並分別電性連接該第—接點與該 第二接點；—第—探針及—第二探針，其技該探針座，並分別 電性連接該第-導電層及該第二導電層；以及—電子耕，其位 於該探針座内部。 較佳地’本發明所提出之探針卡，更包括一空間轉換器，其位 於該印刷電路板與該探針座之間。 較佳地’本發明所提出之探針卡，其中該空間轉換器為一孔 板，並具有多個孔洞以使複數條導線穿設其中，藉由該複數條導 線使該第-接點電性連接該第-探針，該第二接點電性連接該第 二探針。 較佳地，本發明所提出之探針卡，該空間轉換器為一多層陶瓷 結構的基板或一多層有機結構的基板，並且内部具有一電路結 201116834 ，，藉由_部具有—電路結構，使該第-接點m連接該第一 探針，該第一接點電性連接該第二探針。 5 較佳地，本發明所提出之探斜+ 式電路板。 ，十卡，其令該印刷電路板為-整合 較佳=本_職出之騎卡，其㈣ =地，且該電子元件至少位於該下導板及該 較佳地，本發明所提出之探針卡，i :=數：觸墊’其中當該第第二= 探二生::該二=板:由藉由該複數個假探針使該第-電性連接該第二導電層。由該複數個接使該第二探針 本！Γ提出之探針卡’其_針座更包含複數個 从針，射找第-導電収鹤二導電層錄該 層域連m導電層，該第二探針電性連接該第二導電 接觸較Π ==出之探針卡，其中該探針座更包含複數個 /:虽該該第-導電層及該第二導電層位於該上導板 接該第，，該第 較佳地，本發明所提出之探針卡，其中該第一探針或該第二探 201116834 針為電源探針、訊雜針及接_針的至少其中之一。 較佳地，本發騎提红探針卡，其中料子元件至少為主動 π件、被動元件、及無線射頻元件其中之一。 根據本發_再-構想，提出—麵針卡，包括—印刷電路 板，其具有—接點；—探針座，其具有—第―導電層及—第二導 電層，該第-導電層電性逹接該接點；—探針，其穿設該探針座， :電性連接該第二導電層；以及—電子耕，其位於該探針座内 雛地’本發明所提出之探針卡，更包括一空間轉換器，其位 於該印刷電路板與該探針座之間。 較佳地’本發騎提出之探針卡，射該空間轉料為 板’並具有多個孔洞以使複數條導線穿設其中 性連接該撫及該騎。 w 較佳地’本發明所提出之探針卡，其中該空間轉麵為一多声 陶光結構板或-多層有機結構的基板，並且内部且有 結構，使該接點電性連接該探針。 /、 电岭 較佳地，本侧所提出之探針卡，其中該印刷電路板為一整合 式電路板。 較佳地，本發明所提出之探針卡，其中該探針座更包含 導板’且該電子元件至少位於該下導板及該上導板其中 較佳地，本發衝提出之探針卡，其巾該探針座更包含一 針及-接觸墊，其中當該第—導電層及該第二導電層分別設 該下導板及該上導㈣，藉由該假探針使該探針電性連接ς 導電層，藉由該接觸墊使該接點電性連接該第二導電層。^ 201116834 較佳地，树賴辦德針卡，財練針 假探針，其中當該第-導電層及該第二導電層位於該下 ==該複數個假探針的其中之-’以使該探針電性連 u 導電層位於該上導板時， t針透過上導板上的複數個接的其中之—電性連接該第二 ♦电增。 較佳地，本發明所提出之探針卡，其+ 針為挫屈柱騎。 較佳地，本㈣所提出之探針卡，其中雜針為電 號探針及接地探針的其中之一。 十訊 較佳地，本發明所提出之探針卡，其中該電子元件至少為主動 疋件、被動兀件、及無線射頻元件其中之一。 【實施方式】 本案將可由以下的實施例說明而得到充分了解，使得熟習本 蟄之人士可Μ據以完成之’穌案之實施麟可 而被限制其實施型態。 j貝她1幻 =下說明本案的第-實施例，請參閱第一圖⑻、⑼，其為本 ”所提出之探針卡結構示意圖。如第—圖⑻所示，探針卡】旦有 :印刷電路板K)，其上具有—第—接點收與一第二接點1〇2, 在使用探針卡測試待測物時，接點1〇1、1〇2係電性連接測試機， 以接收測試機傳送的信號。該印刷電路板1〇中間有一開口，其下 201116834 為一空間轉換器，也就是一孔板11，孔板11具有一上表面及一下 表面111以及複數個孔洞(未顯示）’各孔洞係貫穿孔板11的上下 表面，以利順應性的一第一導線181、一第二導線182、一第三導 線183以及一第四導線184垂直穿設其中。於該下表面in上則 具有一凹槽12,在凹槽12上具有一第一導電層141及一第二導電 層142,且該下表面111上更具有一第一接觸墊191及一第二接觸 墊I92。第一導線181的兩端分別電性連接第一接點1〇1及第一導 電層141 ’弟一導線182的兩端分別電性連接第二接點1〇2及第二 導電層142’第三導線183分別連接第一導電層14ι及第一接觸墊鲁 191，第四導線184分別連接第二導電層142及第二接觸墊192， 第二導線183及第四導線184係藉由穿設該些孔洞分別連接第一 接觸墊191及第二接觸墊192。凹槽12中則配置一電子元件13， 例如電容，使電子元件13的兩接點分別電性連接第一導電層 及第二導電層142。在第一圖⑻的實施例中’探針卡1的電路連 接方式為並聯的形式。 而探針卡1更包括一探針座15，其位於該孔板n的下方。 探針座I5包括-第一探針10與一第二探針n，其分別連接第—· 接觸墊191及第二接觸墊192。因此’完整的電路路徑乃自第一接 點如連接第-導線181，經由第一導電層⑷、第三導線183及 接輕m，最後至第一探針16;而另—條找的電路路徑 弟一接點102連接第二導線182，經由第二導電層142、第四導 杜4及第一接觸塾192 ’最後至第二探針P。同時透過電子元 ^3的兩接點電性連接第一導電層⑷以及第二導電層⑷而使 元件13設置在兩並聯路徑之間。 12 201116834 在本實施例中’穿設於孔板u的各導線屬於一 1 支其具有所謂順應性的特徵。也就是說，相較於傳統的印刷電路 板内部設置的蚊線路，其有較大的_以及變 度。另外，孔㈣的下表賴可_設置_12，而是ς 針座15地卜孔洞151 ’如第—_所示用以容納電子元件 13所突出的《。第—導⑷及第二導電層142依舊設置在 下表面111上。 第—圖⑷所示為第―®⑻、_仰顧(不包含探針座15)， k這個角度可以更β楚的了解本實施例中元件的配置關係。在本 發曰月中，電子το件13的數量並無限制，這一點由第一圖⑹可清楚 的獲得轉，且其設置的方式當可根據需求或電路設計而做調整。 基本上，從第一圖(a)、（b)的角度而言，電子元件15設置在 孔板11的下方時，維修或者替換元件會較為容易。畢竟孔板u 上方滿佈無數條的線路，無論是檢查或是更換元件都會受到許多 的阻礙。但若電子元件13位在孔板11 τ方時，僅需要將探針座 Φ 15卸下，即可方便的進行作業。 在本實施例中’第一探針16乃是一電源探針及一訊號探針其 中之一，第二探針17則為一接地探針。當第一探針16是電源探 針4，第一接點101係作為電源接點，用以接收測試機傳送的電 源，而當第一探針16是訊號探針時，第一接點101係作為訊號接 點’用以接收測試機傳送的測試訊號；第二接點1〇2則作為接地 y_第—圖(a)、（b)所展示的實施樣態’為在探針卡結構的並聯路 從上設置電子元件，但其實施方式當不限於此。03⁄4 is the goods 乂 匕 匕 匕 丨 丨 丨 丨 匕 匕 以 以 以 淘 淘 ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ The presence of the probe card is an interface between the measuring platform and the (4). It is very important to provide the sealing test from the wafer to the wafer level wafer. In the test project for functional testing of these wafers. Therefore, how to listen to the scale of the needle card as much as possible is the goal that the field is constantly pursuing. For the semi-conductor manufacturers whose product cost is from millions to tens of millions of dollars, no matter how much the improvement of the yield is, the impact will not be neglected. At present, the vertical probe card structure basically includes three parts: a printed circuit board (PCB), a space converter, and a probe. The printed circuit board is covered with a number of electronic components. The power and signals are transmitted by the lines on the printed circuit board to the space converter below it, and then passed to the probe below the space converter's by the probe and below. Test the wafer for contact. Such a long signal transmission path will cause interference to the signal, increase signal noise, voltage instability, and the like. As a result, the test quality of the probe card will be greatly affected, which also destroys the integrity of the overall test signal transmission. The type of vertical probe card is divided into manual wire (Hand Wire, 201116834 HW), multilayer ceramic / multilayer organic (Multi-Layer Ceramic / Multi-Layer * Oganie, MLC / ML0) and integrated circuit board (four) Slightly add pcb, INT PCB) and other three architectures. Under the structure of the manual cable, the space converter is a function of a space conversion by a substrate having a plurality of through holes, or an orifice plate. The wires connecting the compliant printed circuit board through the through holes penetrate the upper and lower surfaces of the orifice plate and are connected to the probes under the orifice plate; and in the multilayer ceramic/multilayer organic structure, the multilayer ceramic substrate or the multilayer The organic base wire has a complicated circuit layout and routing inside the substrate as a (four) conversion layer or a multi-layer organic substrate, so that the contacts on the upper and lower surfaces of the substrate are electrically connected. In terms of the structure of the manual cable, the orifice plate has no internal layout, and a plurality of through holes on the orifice plate penetrate the upper and lower surfaces of the orifice plate, and the spacing between the orifice plates is smaller than that of the circuit board on the printed circuit board. The spacing of the contacts is based on the compliant wires - still connected to the contacts on the printed circuit board, and the other ends are pierced through the through holes on the wires and the wires are fixed and pinned. purpose. The multi-layered organic layer of the organic layer passes through the multilayer shouting substrate or the multilayer organic substrate. The layout = the layout of the upper surface of the substrate to the printed circuit board is large _ converted into a small pitch of the lower surface. However, the organic frame of the multi-layer ceramic layer requires a lot of cost and time, while the human soul line _] is connected to the cis, the system (four) single pure (four) material line, so the design and production of the integration of money road __, 贱The concept of organic layers is well formed on the direct board, that is, the printed circuit board and the space converter are integrated. As a result of the integrated-integrated circuit board, the integrated circuit board itself has the function of the space 201116834 conversion. The traditional printed circuit board 'can't directly convert the big test into a crystal '' and = small pitch', but the integrated circuit board can do this conversion function. These technologies, such as driving, are all placed on the printed circuit board. Many signal components are too long, which is easy to bring many disadvantages. In the U.S. Patent No. 20-085,593, a probe structure is disclosed in which a plurality of spring probe brains, lp〇w, and 1 GND are disposed in respective via holes 5 of a strip 3, and a conductive layer is coated on the inner wall of each via hole 5. Ι〇, on the probes, there is a capacitor 9, so that the spring probes are covered by the conductive layer 1〇, and the electric grid 9 is electrically connected. However, the above structure is only applicable to the bomb, the structure, and is not applicable to the present invention. Alternatively, the vertical probe with the spring probe structure may be referred to as a Budding Beam probe. If the above structure uses a face-needle structure to take the reed probe, then at the time of interview, =^_ is in contact, and the force acting on the probe on the probe will cause the probe to deform laterally. Since the probe is rubbed against the inner wall of the guide hole 5, the contact resistance is improved by long-term use of the electric layer 10 to be gradually damaged and peeled off. So such a,. As a result, the probe has poor electrical characteristics and is not suitable for industrial use. The reason is that the applicant has created the "structure of the probe card" of the present invention in view of the lack of the prior art, and Yike also: a brief description of the case. B A Bu [Summary of the Invention] The main purpose of this hair style is to provide the cost and cost of the problem: the non-performing rate and the application field. _ 201116834 According to the present invention, a probe card is provided, comprising a printed circuit board having a - contact and a second contact; a spatial converter having an orifice plate and compliance a first wire, a second wire, a third wire, and a fourth wire, the hole plate having a plurality of holes, and a first conductive layer, a second conductive layer, and a second surface of the hole plate a first contact pad and a second contact pad, wherein the two ends of the second wire are electrically connected to the first contact and the first conductive layer, and the two ends of the second wire are electrically connected to the second contact And the second conductive layer, the third conductive wire and the first conductive wire are respectively connected to the second conductive layer and the second conductive wire, the third conductive wire and the second conductive wire The four-wire storage is respectively connected to the receiving and the scaly two contact pads; the money-electronic component is located on the lower surface of the orifice plate, and is electrically connected to the first conductive layer and the second conductive layer, . Preferably, the probe card of the present invention further includes a probe holder that is coupled to the space converter and includes a first probe and a second probe. The second probe is electrically connected to the first contact and the second. Preferably, the present invention provides a probe card, wherein the first probe is a power source and a signal probe, and the second probe is a ground probe. Preferably, the probe card of the present invention, wherein the first needle is a frustum probe. Le Yihengmu is better to use the probe card proposed by the hairpin, in which the electronic component, the secret component, and the hiding component are shot... v is the active board, and one is right-handed and the other one is proposed. The probe card 'includes a printed circuit first-conductor and a second-point space converter' having an orifice plate and compliance--, a wire and a 1-wire'. The orifice plate has a plurality of holes in the orifice plate The following table is the two brothers—the conductive layer, the second conductive layer, and the contact pad. The first wire is electrically connected to the contact and the first guiding county. The two ends of the second wire are divided into 201116834. Electrically connecting the second conductive layer and the contact pad, the first hole is connected to the contact pad, and the electron element is electrically connected to the first conductive layer and the second conductive reed. 4, the lower surface of the board, the tender-she, which is disposed under the electric: door switch ◎, and includes, wherein the probe is electrically connected to the second guide, preferably, the probe card of the present invention, 1 Among the probes and grounding probes. , the middle needle is a power probe, and the probe card proposed by the present invention is used, wherein the two probes are frustum probes.杈佳地, this bet is the probe card, which is used to find the electrical components, the voyage, and the ageless voyage. Fy is active in accordance with the present invention, a probe card comprising a printed circuit board having a first contact and a second contact; a probe holder having a first therein - The conductive layer and the second conductive layer are electrically connected to the first contact and the second contact respectively; the first probe and the second probe are electrically connected to the probe holder The first conductive layer and the second conductive layer; and the electronic ploughing, which is located inside the probe holder. Preferably, the probe card of the present invention further includes a space transformer between the printed circuit board and the probe holder. Preferably, the probe card of the present invention is characterized in that the space converter is an aperture plate and has a plurality of holes for allowing a plurality of wires to pass through, and the first contact is electrically connected by the plurality of wires The first probe is connected to the second probe, and the second contact is electrically connected to the second probe. Preferably, the probe card of the present invention is a multi-layer ceramic structure substrate or a multi-layer organic structure substrate, and has a circuit junction 201116834 internally, and has a circuit The first contact is connected to the first probe, and the first contact is electrically connected to the second probe. 5 Preferably, the probe + type circuit board proposed by the present invention. , a ten card, which makes the printed circuit board a better integrated card, a (four) = ground, and the electronic component is at least located in the lower guide and preferably, the present invention Probe card, i := number: touch pad 'where when the second = second generation:: the second = plate: the first electrically connected to the second conductive layer by the plurality of dummy probes . The second probe is connected by the plurality of! The probe card of the present invention has a plurality of slave pins, and the second conductive layer of the conductive layer is connected to the conductive layer, and the second probe is electrically connected to the second conductive contact. The probe card of the Π ==, wherein the probe holder further comprises a plurality of /: although the first conductive layer and the second conductive layer are located at the upper guide, the first preferred The probe card of the present invention, wherein the first probe or the second probe 201116834 is at least one of a power probe, a signal probe and a pin. Preferably, the present invention rides a red probe card, wherein the material element is at least one of an active π component, a passive component, and a radio frequency component. According to the present invention, a face pin card is provided, comprising: a printed circuit board having a contact; a probe holder having a first conductive layer and a second conductive layer, the first conductive layer Electrically splicing the contact; a probe penetrating the probe holder: electrically connecting the second conductive layer; and - an electronic ploughing, the nesting in the probe holder' is proposed by the present invention The probe card further includes a space converter between the printed circuit board and the probe holder. Preferably, the probe card of the present invention is used to shoot the space into a plate and has a plurality of holes to allow the plurality of wires to pass through the neutral connection to the ride. Preferably, the probe card of the present invention is characterized in that the spatial rotating surface is a multi-tone terracotta structural board or a multi-layer organic structure substrate, and has an internal structure, so that the contact is electrically connected to the probe. needle. Preferably, the probe card of the present aspect, wherein the printed circuit board is an integrated circuit board. Preferably, the probe card of the present invention, wherein the probe holder further comprises a guide plate' and the electronic component is located at least in the lower guide plate and the upper guide plate. Preferably, the probe of the present invention is provided. The probe base further includes a needle and a contact pad, wherein when the first conductive layer and the second conductive layer are respectively provided with the lower guide and the upper guide (four), the dummy probe is used to make the probe The probe is electrically connected to the conductive layer, and the contact is electrically connected to the second conductive layer by the contact pad. ^ 201116834 Preferably, the tree needle, the needle probe, wherein the first conductive layer and the second conductive layer are located under the == the plurality of false probes - When the probe is electrically connected to the conductive layer, the t-pin is transmitted through a plurality of connections on the upper conductive plate to electrically connect the second ♦. Preferably, the probe card of the present invention has a + pin for a setback. Preferably, the probe card of the present invention (4), wherein the magnetic needle is one of an electric signal probe and a grounding probe. Preferably, the probe card of the present invention, wherein the electronic component is at least one of an active component, a passive component, and a radio frequency component. [Embodiment] The present invention will be fully understood by the following examples, so that those skilled in the art can be limited in their implementation according to the implementation of the implementation of the case. j 贝她1幻=下下 The first embodiment of the case, please refer to the first figure (8), (9), which is the schematic diagram of the proposed probe card structure. As shown in the figure - (8), the probe card There is: printed circuit board K), which has a - first contact and a second contact 1 〇 2, when using the probe card to test the object to be tested, the contact 1 〇 1, 1 〇 2 electrical Connecting the test machine to receive the signal transmitted by the test machine. The printed circuit board has an opening in the middle thereof, and the lower layer 201116834 is a space converter, that is, an orifice plate 11 having an upper surface and a lower surface 111 and A plurality of holes (not shown) are formed through the upper and lower surfaces of the hole plate 11, so that a first wire 181, a second wire 182, a third wire 183, and a fourth wire 184 are compliantly disposed. The lower surface in is provided with a recess 12, the recess 12 has a first conductive layer 141 and a second conductive layer 142, and the lower surface 111 further has a first contact pad 191 and a second contact pad I92. The two ends of the first wire 181 are electrically connected to the first contact 1〇1 and the first conductive layer 141, respectively. The two ends of the wire 182 are electrically connected to the second contact 1 〇 2 and the second conductive layer 142 ′. The third wire 183 is respectively connected to the first conductive layer 14 ι and the first contact pad 191, and the fourth wire 184 is respectively connected. The second conductive layer 142 and the second contact pad 192, the second wire 183 and the fourth wire 184 are respectively connected to the first contact pad 191 and the second contact pad 192 through the holes. The electronic component 13, such as a capacitor, electrically connects the two contacts of the electronic component 13 to the first conductive layer and the second conductive layer 142. In the embodiment of the first figure (8), the circuit connection mode of the probe card 1 is parallel. The probe card 1 further includes a probe holder 15 located below the aperture plate n. The probe holder I5 includes a first probe 10 and a second probe n, which are respectively connected to the first-- Contact pad 191 and second contact pad 192. Therefore, the 'complete circuit path is from the first contact, such as connecting the first wire 181, via the first conductive layer (4), the third wire 183, and the light m, and finally to the first probe a pin 16; and another circuit path to find a contact 102 to connect the second wire 182, via the second guide The layer 142, the fourth guide 4 and the first contact 塾 192 ′ are finally connected to the second probe P. The first conductive layer ( 4 ) and the second conductive layer ( 4 ) are electrically connected through the two contacts of the electronic component 3 to make the component 13 is disposed between two parallel paths. 12 201116834 In the present embodiment, each of the wires that are passed through the orifice plate u belongs to a one that has a so-called compliance characteristic, that is, compared to a conventional printed circuit board. The mosquito line provided internally has a large _ and a variable degree. In addition, the lower table of the hole (4) can be set to _12, but the hole 151 of the yoke seat 15 is shown as the first _ to accommodate "The electronic component 13 is highlighted." The first (4) and second conductive layers 142 are still disposed on the lower surface 111. The first figure (4) shows the first - (8), _ (without the probe holder 15), and the angle k can more accurately understand the arrangement relationship of the components in this embodiment. In the present month, there is no limit to the number of electronic components, which can be clearly obtained by the first figure (6), and the manner of setting can be adjusted according to requirements or circuit design. Basically, from the viewpoint of the first drawings (a) and (b), when the electronic component 15 is disposed below the orifice plate 11, it is relatively easy to repair or replace the component. After all, there are a myriad of lines above the orifice plate u, which can be hindered by many checks or replacements. However, if the electronic component 13 is positioned on the orifice 11 τ side, it is only necessary to remove the probe holder Φ 15 to facilitate the work. In the present embodiment, the first probe 16 is one of a power probe and a signal probe, and the second probe 17 is a ground probe. When the first probe 16 is the power probe 4, the first contact 101 serves as a power contact for receiving power transmitted by the test machine, and when the first probe 16 is a signal probe, the first contact 101 It is used as a signal contact 'to receive the test signal transmitted by the test machine; the second contact 1 〇 2 is used as the ground y_--(a), (b) shows the implementation state as the probe card The parallel path of the structure is provided with electronic components from above, but the embodiment thereof is not limited thereto.
13 201116834 如第一圖所示’其為本案的第二實施例，在探針卡結構的串 聯路徑上設置電子元件。探針卡2具有—印刷電路板2G，其上具 有-接點2(n。該印刷f路板20中間有一開口，其下為一空間轉 換器，也就是一孔板21，孔板21具有一上表面及一下表面211以 及複數個孔洞(未齡），各細係貫穿孔板21的上下表面，以利 順應性的一第一導線28卜一第二導線282垂直穿設其中。於該下 表面211上具有一第一導電層241及一第二導電層242，且該下表 面211上更具有一接觸塾29。第一導線281的兩端分別電性連接 接點201及第-導電層M’第二導線282的兩端分別電性連接第 二導電層24·2及接觸塾29，第二導線脱係藉由穿設該孔洞而連 接該接觸塾2 9。該下表面211上則配置一電子元件2 3，例如電阻、 積體電路(1(：)4二極體，魏子元件23 #兩接點分別電性連接第 一導電層241及第二導電層242。 而探針卡2更包括一探針座25，其位於該孔板21的下方。 探針座25包括一探針26，其連接該接觸墊29，以及一孔洞μ】， 用以容納電子元件23所突出的空間。因此，完整的電路路徑乃自 接點2〇1連接第-導線Μ卜經由第一導電層⑷透過電子元件 23連接第二導電層242，再由第二導線282至接觸塾29,最後連 接探針26而形成一串聯路徑。 在本第二實施例中’雑展現在探針座25上輯-孔洞251 以谷納電子το件23之型態。然而其實施方式當可如第_圖⑻般做 變化，也就是在下表面211設計一凹槽(未顯示)取代，而使電子元 件23配置在該凹槽中。當然’亦可如前所述具有多個電子元件的 配置以及包括合併串、並聯路徑的實施方式。 201116834 此外探針26可為—電源探針、-訊號探針或是-接地探 _ 〇1貝濟應探針26所使用的種類而作為相應的電源接 ”、，占 '訊號接點以及接地接點。 在本發明的第—及第二實施例中，為了避免電子元件因外力 碰撞而損壞，可以左带7 、 Λ在電子元件之外塗佈保護層，例如保護的膠體， 保護層也有m定電子元件的功能。13 201116834 As shown in the first figure, which is the second embodiment of the present invention, electronic components are disposed on the series path of the probe card structure. The probe card 2 has a printed circuit board 2G having a contact 2 (n. There is an opening in the middle of the printed circuit board 20, below which is a space converter, that is, an orifice plate 21 having an orifice plate 21 An upper surface and a lower surface 211 and a plurality of holes (not aged), each of which penetrates the upper and lower surfaces of the orifice plate 21, so that a first wire 28 and a second wire 282 of the compliance are vertically penetrated therein. The lower surface 211 has a first conductive layer 241 and a second conductive layer 242, and the lower surface 211 further has a contact 塾 29. The two ends of the first wire 281 are electrically connected to the contact 201 and the first conductive The two ends of the second wire 282 of the layer M' are respectively electrically connected to the second conductive layer 24·2 and the contact 塾29, and the second wire is disconnected by connecting the contact 塾2. The lower surface 211 is connected. Then, an electronic component 23 is disposed, for example, a resistor, an integrated circuit (1 (:) 4 diode, and a Wei sub-element 23 # two contacts are electrically connected to the first conductive layer 241 and the second conductive layer 242, respectively. The needle card 2 further includes a probe holder 25 located below the aperture plate 21. The probe holder 25 includes a probe 26 that connects the connection The contact pad 29, and a hole μ for receiving the space protruded by the electronic component 23. Therefore, the complete circuit path is connected from the contact point 2〇1 to the first wire via the first conductive layer (4) through the electronic component 23 Connecting the second conductive layer 242, the second wire 282 to the contact port 29, and finally connecting the probe 26 to form a series path. In the second embodiment, '雑 is shown on the probe holder 25 - the hole 251 is The type of the nanoelectronics τ is 23. However, the embodiment can be changed as in the first embodiment (8), that is, a recess (not shown) is provided on the lower surface 211, and the electronic component 23 is disposed in the recess. Of course, it is also possible to have a configuration of a plurality of electronic components and an embodiment including a merged string and a parallel path as described above. 201116834 In addition, the probe 26 can be a power probe, a signal probe or a ground probe. In the first and second embodiments of the present invention, in order to avoid the external force of the electronic component, the first and second embodiments of the present invention are used as the corresponding power supply connection. Damaged by collision, can be left with 7 , Λ Applying a protective layer outside the electronic device, such as a protective colloid, the protective layer also has functions of a given electronic component m.
接魏明本案的第三實施例，請參閱第三圖⑻、⑻、⑹，其 為本案所提出之探針卡結構示意圖，與第—實施例相同，均是在 探針卡結構的並聯路徑上設置電子元件，但與第—實施例的差里 之處在於第-實施例是將電子元件設置在孔㈣下表面，而第三 實施例是將電子元件設置在探針座内部。探針卡3具有-印刷電 板〇 〃上具有一第一接點3〇1與一第二接點3犯。探針卡3 更包括-探針座32，其内部設置一第一導電層371及一第二導電 曰372並刀別電性連接第一接點3〇1及第二接點如。該探針座 32包括-第一探針34以及一第二探針％，其穿設該探針座^， 並，別電性連接第-導電層奶與第二導電層奶。聰針座％ ^部則具有-電子S件33,該電子元件33_分別電性連接 广導電層功與第二導電層372。因此，藉由空間轉換器的設 置’即孔板31及各導線38卜382、383及384的設置，使第一探 ϋ 34與第-接點3〇1及第一導電層371 連接而形成一電路路 L ’而第二探針35與第二接點302及第二導電層372電性連接形 ^另一電路路徑’同時透過電子元件33連接第一導電層371以及 第二導電層372而使電子元件33設置麵並聯路徑之間。而這種 電路連接的表财式並抑限，其可分難以下幾種朗來間釋。 15 201116834 如第二圖⑻〜(C)所示，探針卡3於印刷電路板30與探針座32 之間更具有-空間轉換器，該空間轉換器為—孔板3卜孔板31 具有複數個孔洞(未顯示）’各孔洞係貫穿孔板31的上下表面，以 利具順應性的-第-導線％卜一第二導線382、一第三導線如 及一第四導線384垂直穿設其中。該孔板31包括複數個接觸墊 39卜392、393、394、395、396。而第一導線381係分別電性連 接第一接點301及第三接觸墊393,第二導線382分別電性連接第 二接點302及第四接觸墊394，第三導線383分別電性連接第五接 觸墊奶及第-接觸墊391，第四導線384分別電性連接第六接觸 墊396及第二接觸塾392。即藉由複數條導線381〜384的佈設，可 使第一接點301電性連接探針座32的一第一探針％，使 3〇2電性連接探針座32的一第二探針％。 ” 如第三圖⑻所示，該探針座32更包括一上導板322及一下 導板32!，以及與第—導電層371和第二導電層372電性連接 數個假探針36卜362、363、364，電子元件33則位於下導板321 上。而第-導電層371及第二導電層372係設置在下導板边上。 而第-探針34與第-接點301，以及第二探針％與第二接點地 彼此之間的電性連接乃藉由孔板31及探針座32之間的佈局來每 現。也就是說，第-接點301到第一探針34的電路路徑乃自第: 接點3CU經由第一導線381到第三接觸塾地，再經由第一 3396Γ再第^導電層371，之後經由一第二假探針362到第五接觸塾 395，再攸第三導線383、第一接觸塾391至第 望 接麵到第二探針35的電路路徑自第二接請經由第而g 382到第四接觸墊394，再經由一第三假探針泌到第二導電層 201116834 372，之後經由一第四假探針364到第六接觸墊396，再從第四導 線384、第二接觸墊392至第二探針35。同時透過電子元件33的 兩接點電性連接第一導電層371以及第二導電層372而使電子元 件33設置在兩並聯路徑之間。換句話說，該第一探針34與該第 二探針35分別電性連接對應的假探針361〜364，以使該第一探針 34電性連接該第一導電層371，該第二探針35電性連接該第二導 電層372。 另外如第三圖(b)所示’電子元件33可設置在上導板322上， 當然兩導電層371、372也是設置在上導板322上◊此處兩導電層 371、372與複數個接觸墊393、394、395、396之間並非透過假探 針進行電性連接，而是藉由上導板3D設計多個貫穿的通孔，並 填滿導電之金屬材料或其他可傳遞訊號的導電材料形成導孔，同 時其上則為複數個接觸墊397、398、399及391〇，以分別和複數 個接觸塾393、394、395、396之間進行電性連接。第一接點3〇1 到第一振針34的電路路徑乃自第一接點3〇1經由第一導線381到 • 第三接觸墊393’再經由第七接觸墊397、導孔到第一導電層371， 之後經由導孔、第九接觸墊399到第五接觸墊395，再從第三導線 383、第一接觸墊391至第一探針34;而第二接點3〇2到第二探針 %的電路路徑自第二接點3〇2經由第二導線382到第四接觸墊 ^94，再經由第八接觸墊398、導孔到第二導電層372，之後經由 冷孔、第十接觸墊3910到第六接觸墊396，再從第四導線384、 第接觸墊392至弟二探針35。同時透過電子元件33的兩接點電 性連接第一導電層371以及第二導電層372而使電子元件％設置 在兩並聯路徑之間。換句話說，該第—探針34與該第二探針％ 17 201116834 :====:連· 第-導電層371 ’該第二_5電性連接該第二導電㈣ 或者亦如第二圖(C)所示，電子元件33可為兩端橫跨上下導板 322、切的設置方式，則兩導電層371、π分別設置在下 32卜322。第-接點3()1到第一探針％的電路路徑乃 3Γ1!：導線381到第三接觸整393,再經由-第五假探㈣Referring to the third embodiment of Wei Ming, please refer to the third figure (8), (8), (6), which is a schematic diagram of the probe card structure proposed in the present case, which is the same as the first embodiment, and is a parallel path of the probe card structure. The electronic component is disposed above, but the difference from the first embodiment is that the first embodiment is to place the electronic component on the lower surface of the hole (four), and the third embodiment is to place the electronic component inside the probe holder. The probe card 3 has a printed circuit board 具有 which has a first contact 3〇1 and a second contact 3. The probe card 3 further includes a probe holder 32, and a first conductive layer 371 and a second conductive layer 372 are disposed inside and electrically connected to the first contact 3〇1 and the second contact. The probe holder 32 includes a first probe 34 and a second probe %, which are disposed through the probe holder and electrically connected to the first conductive layer milk and the second conductive layer milk. The C-pin portion has an electro-electronic S piece 33, and the electronic component 33_ is electrically connected to the wide conductive layer and the second conductive layer 372, respectively. Therefore, the first probe 34 is connected to the first contact 3〇1 and the first conductive layer 371 by the arrangement of the space converter, that is, the arrangement of the orifice plate 31 and the wires 38, 383, 383 and 384. The second probe 35 is electrically connected to the second contact 302 and the second conductive layer 372, and the other circuit path is connected to the first conductive layer 371 and the second conductive layer 372 through the electronic component 33. The electronic components 33 are placed between the planes in parallel. The circuit type of this kind of circuit connection is limited, and it can be difficult to distinguish between several types. 15 201116834 As shown in the second diagrams (8) to (C), the probe card 3 further has a space transformer between the printed circuit board 30 and the probe holder 32, and the space converter is an orifice plate 3 orifice plate 31. Having a plurality of holes (not shown) 'the holes are through the upper and lower surfaces of the orifice plate 31 to facilitate compliance - the first wire %b a second wire 382, a third wire such as a fourth wire 384 vertical Wear it. The orifice plate 31 includes a plurality of contact pads 39, 392, 393, 394, 395, 396. The first wire 381 is electrically connected to the first contact 301 and the third contact pad 393, respectively, and the second wire 382 is electrically connected to the second contact 302 and the fourth contact pad 394, respectively, and the third wire 383 is electrically connected. The fifth contact pad and the first contact pad 391, the fourth wire 384 is electrically connected to the sixth contact pad 396 and the second contact pad 392, respectively. That is, by the arrangement of the plurality of wires 381 384 384, the first contact 301 can be electrically connected to a first probe % of the probe holder 32, and the third probe can be electrically connected to a second probe of the probe holder 32. needle%. As shown in the third figure (8), the probe base 32 further includes an upper guide plate 322 and a lower guide plate 32!, and electrically connected to the first conductive layer 371 and the second conductive layer 372 by a plurality of dummy probes 36. 362, 363, 364, the electronic component 33 is located on the lower guiding plate 321, and the first conductive layer 371 and the second conductive layer 372 are disposed on the side of the lower guiding plate. The first probe 34 and the first contact 301 And the electrical connection between the second probe % and the second contact is performed by the layout between the orifice plate 31 and the probe holder 32. That is, the first contact 301 to the first The circuit path of a probe 34 is from the first: the contact 3CU via the first wire 381 to the third contact, and then via the first 3396 Γ conductive layer 371, and then via a second dummy probe 362 to the fifth Contacting the crucible 395, and then the third lead 383, the first contact 塾391 to the second junction 35, the circuit path from the second access via the first g 382 to the fourth contact pad 394, and then through a The third dummy probe is adhered to the second conductive layer 201116834 372, and then passes through a fourth dummy probe 364 to the sixth contact pad 396, and then from the fourth wire 384 and the second contact pad 392. The second probe 35 is simultaneously electrically connected to the first conductive layer 371 and the second conductive layer 372 through the two contacts of the electronic component 33 to set the electronic component 33 between the two parallel paths. In other words, the first probe The first probe 34 is electrically connected to the first conductive layer 371, and the second probe 35 is electrically connected to the second probe 35. The second conductive layer 372. In addition, as shown in the third figure (b), the electronic component 33 can be disposed on the upper conductive plate 322. Of course, the two conductive layers 371 and 372 are also disposed on the upper conductive plate 322, where the two conductive layers are disposed. 371, 372 and a plurality of contact pads 393, 394, 395, 396 are not electrically connected through a dummy probe, but a plurality of through holes are designed by the upper guide 3D and filled with a conductive metal material. Or other conductive material capable of transmitting signals to form a via hole, and at the same time, a plurality of contact pads 397, 398, 399 and 391 〇 are electrically connected between the plurality of contact pads 393, 394, 395 and 396 respectively. The circuit path from the first contact 3〇1 to the first vibrating pin 34 is from the first contact point 3〇1 The wire 381 to the third contact pad 393' is further passed through the seventh contact pad 397, the via hole to the first conductive layer 371, and then via the via hole, the ninth contact pad 399 to the fifth contact pad 395, and then from the third wire 383. The first contact pad 391 to the first probe 34; and the circuit path of the second contact 3〇2 to the second probe % from the second contact 3〇2 via the second wire 382 to the fourth contact pad 94 And then through the eighth contact pad 398, the via hole to the second conductive layer 372, and then through the cold hole, the tenth contact pad 3910 to the sixth contact pad 396, and then from the fourth wire 384, the contact pad 392 to the second Needle 35. At the same time, the first conductive layer 371 and the second conductive layer 372 are electrically connected through the two contacts of the electronic component 33 to set the electronic component % between the two parallel paths. In other words, the first probe 34 and the second probe % 17 201116834 :====: the first conductive layer 371 'the second _5 is electrically connected to the second conductive (four) or as the first As shown in FIG. 2C, the electronic component 33 can be disposed at two ends across the upper and lower guide plates 322, and the two conductive layers 371 and π are respectively disposed on the lower 32b. The circuit path of the first contact 3 () 1 to the first probe % is 3Γ1!: the wire 381 to the third contact is 393, and then via the - fifth dummy (4)
至弟導电層371 ’之後經由一第六假探針施到第五接觸塾 395，再從第三導線383、第一接觸塾391至第一探針％ ;而第二 接點302到第二探針35的電路路徑自第二接·點3〇2經由第二導線 382到第四接觸塾394，再經由一第十二接觸塾3912、導孔到第二 導電層372，之後經由導孔、第十一接觸墊3911到第六接觸塾 396，再從第四導線384、第二接觸墊392至第二探針％。同時透The second conductive layer 371 ′ is applied to the fifth contact 塾 395 via a sixth dummy probe, and then from the third wire 383 , the first contact 塾 391 to the first probe %; and the second contact 302 to the second The circuit path of the two probes 35 is from the second connection point 3〇2 via the second wire 382 to the fourth contact port 394, and then via a twelfth contact port 3912, the via hole to the second conductive layer 372, and then via the lead The holes, the eleventh contact pads 3911 to the sixth contact pads 396, and then from the fourth wire 384, the second contact pad 392 to the second probe%. At the same time
過電子元件33的兩接點電性連接第一導電層371以及第二導電層 372而使電子元件33設置在兩並聯路徑之間。換句話說，藉由複 數個假探針365、366可使第一探針34電性連接該第一導電層 371 ’藉由複數個接觸墊3911、3912及其對應的導孔使該第二探 針35電性連接該第二導電層372。 簡而言之’上述的幾種方式基本上在於隨著電子元件33至少 位於上導板322或下導板311其中之一上的設置，來做出相應的 電路路徑設計以及元件配置。也可說是看第一導電層371及第二 導電層372位於上導板322或下導板311其中之一上的設置，來 做出相應的電路路徑設計以及元件配置。 在本實施例中，第一探針34乃是一電源探針或是一訊號探 18 201116834 H二探針35則為—接地探針。當第一探針34是電源探針時， 弟一接點301係作為電源接點，用以接收測試The two contacts of the electronic component 33 are electrically connected to the first conductive layer 371 and the second conductive layer 372 such that the electronic component 33 is disposed between the two parallel paths. In other words, the first probe 34 is electrically connected to the first conductive layer 371' by a plurality of dummy probes 365, 366. The second contact pad 3911, 3912 and its corresponding via hole enable the second The probe 35 is electrically connected to the second conductive layer 372. In short, the above several ways basically consist in that the corresponding circuit path design and component configuration are made as the electronic component 33 is placed at least on one of the upper and lower guide plates 322, 311. It can also be said that the first conductive layer 371 and the second conductive layer 372 are disposed on one of the upper conductive plate 322 or the lower conductive plate 311 to make a corresponding circuit path design and component configuration. In this embodiment, the first probe 34 is a power probe or a signal probe 18 201116834 H two probe 35 is a ground probe. When the first probe 34 is a power supply probe, a contact 301 is used as a power contact for receiving the test.
當第一探針34是訊號探針時，第一接點3〇1係作為訊 以接收職機傳送的測試訊號；第二接點3〇2則作為躺接接點用 如别所述’傳統的探針卡之電子元件係配置在印刷電路板 ，讀會造成峨傳輸路㈣長，而對訊號造成干擾，並導致 =雜訊增加、電壓不穩定。因此，如第三_〜_t示，本發明 、’子7L件33 ’乃是配置在探針座32之中。由於探針座32的下 因此透過這種結構，電子元件與待測物間的 :有效的驗，同時也提高了電源或是訊 雜由於第一探針34與第二探針35之間，必須維持-固定_ 此Γ來才能夠有效的維持訊號阻抗匹配的特性，以及傳遞 间4的純峨。目此假探針361〜366的存在，得以允許第一 探針34與第二探針35彼此間保持固定距離時，亦可連接至電子 元件33 ’並再透過導線連接至印刷電路板如上。 %再者’本發明所使㈣探針均為麵減針，藉由假探針的 设置或者第三_)〜第三陶的結構，使各探針可以與電子元件 33電性連接’故探針座的導孔内壁並不需要塗佈導電層。因此， ^以避免美國專利公開第2_祕593號所產生的缺點，例如探 辟導制壁S塗佈導電層，在長期錢下，探針與導孔内 ^摩擦，將使各導孔内壁導電層逐漸受損、剝落，使接觸電阻 故本發明所提出之結構，不但拉近了電子元件^與待測物之 間的距離’同時假探針361〜366更能保護高頻訊號的阻抗匹配之When the first probe 34 is a signal probe, the first contact 3〇1 is used as a test signal transmitted by the receiving machine; the second contact 3〇2 is used as a lying contact as described above. The electronic components of the conventional probe card are arranged on the printed circuit board, and the reading causes the transmission path (4) to be long, which causes interference to the signal, and causes an increase in noise and voltage instability. Therefore, the present invention, the 'sub 7L member 33', is disposed in the probe holder 32 as shown in the third to _t. Since the lower portion of the probe holder 32 passes through the structure, an effective test between the electronic component and the object to be tested, and also improves the power source or the signal due to the difference between the first probe 34 and the second probe 35. It must be maintained - fixed _ this time to be able to effectively maintain the characteristics of the signal impedance matching, as well as the pure 峨 of the transfer. The presence of the dummy probes 361 to 366 allows the first probe 34 and the second probe 35 to be connected to the electronic component 33' while being held at a fixed distance from each other, and is further connected to the printed circuit board by wires. In addition, the probes of the present invention are all surface-reduced needles, and the probes can be electrically connected to the electronic components 33 by the arrangement of the dummy probes or the structure of the third to third ceramics. The inner wall of the guide hole of the probe holder does not need to be coated with a conductive layer. Therefore, to avoid the disadvantages caused by the US Patent Publication No. 2 519, for example, to probe the conductive layer S coated conductive layer, in the long-term money, the probe and the guide hole within the friction, will make each guide hole The conductive layer on the inner wall is gradually damaged and peeled off to make contact resistance. Therefore, the structure proposed by the present invention not only narrows the distance between the electronic component and the object to be tested, but also the dummy probes 361 to 366 can protect the high frequency signal. Impedance matching
19 201116834 特性，如此一來大幅提升了探針卡3的品質與穩定性。 在前述第三實施例的内容與圖式中，係以並聯電路路徑的方 式配置電子元件。而同樣的，其亦可以串聯電路的方式來連接電 子元件，如第四圖(a)〜(c)所示，其為本案的第四實施例。探針卡4 具有一印刷電路板40，其上具有一接點4〇1。探針卡4更包括一 探針座42，其具有一第一導電層471及一第二導電層4?2，該第 一導電層471電性連接接點401。該探針座42包括一探針44，其 穿設該探針座42，並錄連接該第二導電層472。該探針座似内、 部則具有一電子元件43’該電子元件43的兩端則分別電性連接第 -導電層471與第二導電層472。因此，透過前述的電路連接關係 可夫在本第四實施例中’係表示探針卡4中串聯電路的實施方 如第四圖⑻所示，探針卡4於印刷電路板4G以及探針座42 有—觸換器，也就是—孔板41，孔板41具有複數個 41的上下表面’以利具順應性 的電路路徑乃自接詞Γ触卜因此，完整 第，_ nm—第二接觸塾 連接第二_& 導電層471 ’之後透過電子元件43 493、第二導錄曰472 ’再透過一第二假探針462、一第三接觸墊 串聯路徑。換句4^，t—接糖491 ’最後連接探針44而形成一 該探針44電况綺座42更包含複數個假探針46卜462 ’ 啦，以使探個假探針的其中之一，即第二假探針 44電性連接第二導電層472。 〜域電路連接的表現方式亦同樣沒有侷限，也就是說， 20 201116834 電子兀件43的設置除了如第四圖($所示位於下導板421上之外， 亦可《又置在上導板422之上’或是橫跨兩導板421、422的配置方 式。也可說是看苐-導電層奶及第二導電層472位於上導板奶 或下導板421 *中之-上的設置，來做出相應的電路路徑設計以 及元件配置。如第四_所示，其所展示的乃是將電子元件43設 置在上導板422之上。此處兩導電層471、472與複數個接觸墊 视、493之間並非透過假探針進行電性連接，而是藉由上導板奶 設計多個貫㈣通孔，並填滿導電之金屬㈣或其他可傳遞訊號 的導電材料形成導孔，同時其上則為複數個接觸塾·、奶，以 分別和複數個接觸墊492、493之間進行電性連接。因此，完整的 電路路徑乃自接點連接第一導線撕至第二接觸塾视，再瘦 由第四接觸墊透過導孔連接卿_導電層471，之後透過電子 讀43連接第二導電層472，再經由導孔、第五接觸塾495連接 第三接觸墊493，並經由第二導線482至第一接難491，最後連 接探針44而形成-串聯路徑。換句話說，該接點彻透過複數個 接觸墊492、494電性連接該第一導電層471，該探針44透過複數 個接觸墊493、495電性連接該第二導電層仍，並經由電子元件 43以使整個電路路徑串聯在一起。 -另外’如弟四圖⑹所示，雷+畀料. 4千το件43可為兩端橫跨上下導 板422、421的設置方式，則兩導電層471、们2分別設置在下上 導板42卜422。因此，完整的電路路徑乃自接點彻連 線481至第二接觸墊492,再纟里由坌丄杜她此 工由弟六接觸墊496透過導孔連接到 第二導電層472，之後透過電子元株 卞兀件43連接第一導電層471，再 經由假探針463連接第三接觸墊493 纪外3 ’並經由第二導線482至第一 21 201116834 接觸墊49卜最後連接探針44而形成一串聯路徑。換句話說，藉 由假探針463可使探針44電性連接該第一導電層471，藉由接觸 塾496及其對應的導孔使接點4〇1電性連接該第二導電層仍，並 經由電子元件43以使整個電路路徑串聯在—起。 探針44可為-電源探針、一訊號探針或是一接地探針，而接 點則對應探針44所使用的義而作為相應的電源接點、訊號 接點以及接地接點。 當然在第三、第四實施例中，電子元件的配置方式亦同樣不 二；僅為| ’夕個電子元件的配置以及包括合併串、並聯的實鲁 施方式亦為可能。當然如此一來，導電層、各種探針以及導線的 配置亦需增加，但只要電路的設計具有存在的可雛，即可應用 於本發明所提出的探針卡之結構當中。 接著說明本案的第五實施例，請參閱第五圖，其為本案所提 出之探針卡結構示意圖。與第三、第四實施例不同處，在於空間 轉換器的部麵-錢_編ti_Layer c_ie, mlc)或是多層 有機陶ti_Layei· 胤_餘&取航板及導線形式= 人工拉線的架構。基板51内部具有—電路結構％，可使印刷電路· 板5〇上的一第一接點501電性連接探針座53的-第-探針55， 使印刷電路板50上的一第二接點5〇2電性連接探針座％的一第 二探針56。第一接點5〇1到苐一探針％的電路路徑乃自第一接點 鼠經由印刷電路板50的内部線路，經過基板51内部的電路結構 =探針座53中的苐-導電層571 ,而第一導電層57ι再藉由基 =内部的電路結構52電性連接至第一探針55 ;第二接點5〇2 ，】弟—抵針56的電路路徑是自第二接點5〇2經由印刷電路板％ 22 201116834 的内部線路，經過基板51内電路結構52卿針㈣ 572 ’第二導電層572再經由基板51内部的電路結構a 接至第二探針56。_透過電子元件54的兩接點電性連接 t 71以及第二_ 572 _子元件54設置在兩並 聯路彳坐之間。 同樣的，在本第五實_中，電路_徑亦可為並聯、串聯 ，疋合併串、並聯的實施方式。若以串聯電路的路徑為例時 籲刷電路板5〇上僅會有一個接點，例如第一接點5〇1，而探針座53 上也僅會有一個對應的探針，例如第一探針55，當印刷電路板5〇 的接點在經過印刷電路板5〇的電路結構，基板51内部具有一電 2結構52後’可以使該接點電性連接該探針，即是串聯電路的路 !。此外’多個電子元件的配置同樣可應用於本實施例中，且電 子，件54除了设置於下導板531上之外，亦可設置於上導板$幻， 或疋跨兩導板531、532的設置方式。並且，在並聯路徑上，第一 來針55乃疋一電源探針或是一訊號探針，第二探針弘則為一接 _地探針。當第一探針55是電源探針時’第一接點5〇1係作為電源 ^點:用以接收測試機傳送的電源；而當第一探針55是訊號探針 時，第-接·點501係、作為訊號接·點，用以接收測試機傳送的測試 訊號，第二接點502則作為接地接點。而串聯時，單=的探針則 可為一電源探針' 一訊號探針或是一接地探針，而接點則對應探 針所使用的麵而作為相應的電源接點、訊號接點以及接地接點。 接著說明本案的第六實施例，請參閱第六圖，其為本案所提 出之探針卡結構示意圖。與第三到第五實施例不同處，在於空間 轉換益的部分由一整合式電路板6〇取代MLC/ML⑽板以及人工 23 201116834 拉線的架構。因此，並聯電路的 -接謂輯接輸62的第路 =上的第 60上的第二接點602電性連接探針座 整口式電路板 第一接請到第-探針64的電路路=探=接 經由整合式電路板6〇内部的電路結構 二6^1 661，再經由整a式雪改把如* 电注連接至弟一導電層 °電板6〇内。卩的電路結構61 探針64 ;第二接點602到第 再職連接至第一 :由整合式電内部的電路結構 “ 的兩接點電性連接第-導雷屏 661以及第二導電層662而使電子元件63 % 曰 同樣的，在本第技關t，魏魏徑之間。 併串刺的實施方式。若以串聯電路的路徑為例時整合 式電路板60上僅會有-個接點，例如第—接點晰，而探針座以 上也僅會有-個對應的探針，例如第一探針64，當整 6〇的接點在經過整合式電路板6〇内部的電路結構61後，可以使 該接點電性連接該探針，即是串聯電路的路徑n多個電子 疋件的配置亦同樣可應用於本實施例中，且電子元件63除了設置 於下導板624上之外’亦可設置於上導板必，或是跨下、上^ 621、622的設置方式。並且，在並聯路徑時，第一探針&乃是一 電源探針或是-訊號探針，第二探針65則為―接地探針。當第一 探針64是電源探針時，第一接點6〇H系作為電源接點，用以接收 測試機傳送的電源；而當第一探針64是訊號探針時，第—接點撕 係作為訊號接點，用以接收測試機傳送的測試訊號；第二接點· 24 201116834 則作為接地接點。而串聯時，單一的探針則可為一電源探針、一 訊號探針或是一接地探針，而接點則對應探針所使用的種類而作 為相應的電源接點、訊號接點以及接地接點。 本發明的主要目的在於改善習知技術中，過長的傳輸路徑造 成訊號的干擾與雜訊的增加等問題。因此，藉由拉近電子元件與 待測物的距離，也就是將電子元件設置在探針座之中或其上表 面、或是探針座上方的基板，本發明所提出的探針卡之結構具有 限流、去耦合、穩定電壓、優秀的阻抗匹配特性、提高 性以及降低電磁干擾等優點。 此外電子元件亦可包含主動元件、被動元件或是無線射頻 元件等。絲元件可為IC晶#、二鋪、電晶财；被動元件可 包含電容、電阻、電感錢"等；而無線射頻元件可包含_ 器、平衡·不平衡轉換器或是雙工器等。 本案實為-難得-見、值得珍惜的罕見發明，惟以上所述者， 僅為本發明之較佳實施列，當不能以之限定本發 圍，大凡依本發”請專利範_作之均㈣化與修饰，= 仍屬於本發明專利涵蓋之範圍。 [S 1 25 201116834 【圖式簡單說明】 第一圖(a):本案第一實施例之探針卡结構示意圖。 第一圖(b):本案第一實施例之探針卡結構示意圖。 第一圖(c):第一圖(a)、（b)之仰視圖。 第二圖：本案第二實施例之探針卡結構示意圖。 第三圖(a):本案第三實施例之探針卡結構示意圖》 第三圖(b):本案第三實施例之探針卡結構示意圖。 第三圖(c) :本案第三實施例之探針卡結構示意圖。 第四圖⑻：本案第四實施例之探針卡結構示意圖。 第四圖(b):本案第四實施例之探針卡結構示意圖。 第四圖(c):本案第四實施例之探針卡結構示意圖。 第五圖：本案第五實施例之探針卡結構示意圖。 第六圖：本案第六實施例之探針卡結構示意圖。 【主要元件符號說明】 1探針卡 141第一導電層 10印刷電路板 142第二導電層 101第一接點 15探針座 102第二接點 1 5 1孔洞 11孔板 16電源探針 111下表面 17接地探針 112上表面 181第一導線 12凹槽 182第二導線 13電子元件 183第三導線 26 201116834 184 第四導線 322 上導板 191 第一接觸墊 33 電子元件 192 第二接觸墊 34 第一探針 2探針卡 35 第二探針 20 印刷電路板 361 第一假探針 201 接點 362 第二假探針 21 孔板 363 第三假探針 211 下表面 364 第四假探針 23 電子元件 365 第五假探針 241 第一導電層 366 第六假探針 242 第二導電層 371 第一導電層 25 探針座 372 第二導電層 251 孔洞 381 第一導線 26 假探針 382 第二導線 281 第一導線 383 第三導線 282 第二導線 384 第四導線 29 接觸墊 391 第一接觸墊 3探針卡 392 第二接觸墊 30 印刷電路板 393 第三接觸墊 301 第一接點 394 第四接觸墊 302 第二接點 395 第五接觸墊 31 孔板 396 第六接觸墊 32 探針座 397 第七接觸墊 321 下導板 398 第八接觸墊19 201116834 Features, which greatly improve the quality and stability of the probe card 3. In the content and drawings of the foregoing third embodiment, the electronic components are arranged in a parallel circuit path. Similarly, it is also possible to connect electronic components in a series circuit, as shown in Figures 4(a) to (c), which is the fourth embodiment of the present invention. The probe card 4 has a printed circuit board 40 with a contact 4〇1 thereon. The probe card 4 further includes a probe holder 42 having a first conductive layer 471 and a second conductive layer 4?2. The first conductive layer 471 is electrically connected to the contacts 401. The probe holder 42 includes a probe 44 that passes through the probe holder 42 and is coupled to the second conductive layer 472. The probe holder has an electronic component 43' as shown in the inner portion, and the two ends of the electronic component 43 are electrically connected to the first conductive layer 471 and the second conductive layer 472, respectively. Therefore, through the foregoing circuit connection relationship, in the fourth embodiment, the embodiment of the series circuit in the probe card 4 is shown as shown in the fourth figure (8), and the probe card 4 is on the printed circuit board 4G and the probe. The seat 42 has a - a contactor, that is, an orifice plate 41, and the orifice plate 41 has a plurality of upper and lower surfaces of 41' to facilitate the compliant circuit path, which is a self-sufficient, so complete, _ nm - After the second contact 塾 is connected to the second _& conductive layer 471 ′, the electronic component 43 493 , the second guide 曰 472 ′ is further transmitted through a second dummy probe 462 and a third contact pad in series. In other words, 4^, t-together 491' is finally connected to the probe 44 to form a probe 44. The electric squat 42 further includes a plurality of dummy probes 46 462', so that a probe can be probed. One of the second dummy probes 44 is electrically connected to the second conductive layer 472. The representation of the domain circuit connection is also not limited. That is to say, the setting of the 20 201116834 electronic component 43 can be placed on the upper guide in addition to the fourth figure (the $ is shown on the lower guide plate 421). Above the board 422' or the arrangement of the two guide plates 421, 422. It can also be said that the conductive layer of the conductive layer and the second conductive layer 472 are located on the upper guide plate milk or the lower guide plate 421*. The arrangement is made to make the corresponding circuit path design and component configuration. As shown in the fourth_, it is shown that the electronic component 43 is disposed on the upper guiding plate 422. Here, the two conductive layers 471, 472 and A plurality of contact pads and 493 are not electrically connected through a dummy probe, but a plurality of through holes are designed by the upper guide plate and filled with conductive metal (4) or other conductive material capable of transmitting signals. A via hole is formed, and at the same time, a plurality of contact electrodes and milk are electrically connected to each other and a plurality of contact pads 492 and 493. Therefore, the complete circuit path is torn from the first wire to the contact point. The second contact is contemptuous, and then thinned by the fourth contact pad through the guide hole to connect with the _ The electrical layer 471 is connected to the second conductive layer 472 through the electronic read 43 and then connected to the third contact pad 493 via the via hole and the fifth contact pad 495, and connected to the first connection 491 via the second wire 482, and finally connected to the probe. And forming a series-connected path. In other words, the contact is electrically connected to the first conductive layer 471 through a plurality of contact pads 492, 494. The probe 44 is electrically connected to the first through the plurality of contact pads 493, 495. The two conductive layers are still, and the entire circuit path is connected in series via the electronic component 43. - In addition, as shown in the fourth figure (6), the lightning + 畀 material. 4 thousand το member 43 can be both ends across the upper and lower guides 422 421, the two conductive layers 471, 2 are respectively disposed on the lower upper guide 42 422. Therefore, the complete circuit path is from the contact 447 to the second contact pad 492, and then The second conductive layer 472 is connected to the second conductive layer 472 through the via hole, and then connected to the first conductive layer 471 through the electron element member 43 and then connected to the third contact pad 493 via the dummy probe 463. Extraterrestrial 3 'and via the second wire 482 to the first 21 201116834 contact pad 49 Finally, the probe 44 is connected to form a series path. In other words, the probe 44 can be electrically connected to the first conductive layer 471 by the dummy probe 463, and the contact is made by contacting the 塾 496 and its corresponding via hole. 4〇1 is electrically connected to the second conductive layer, and is connected in series via the electronic component 43. The probe 44 can be a power probe, a signal probe or a ground probe. The contacts correspond to the meanings of the probes 44 and serve as corresponding power contacts, signal contacts, and ground contacts. Of course, in the third and fourth embodiments, the electronic components are also configured in the same manner; | It is also possible to configure the electronic components and the method of integrating the strings and parallels. Of course, the arrangement of the conductive layer, the various probes, and the wires also needs to be increased, but as long as the design of the circuit has the existence, it can be applied to the structure of the probe card proposed by the present invention. Next, a fifth embodiment of the present invention will be described. Please refer to the fifth figure, which is a schematic diagram of the structure of the probe card proposed in the present application. Different from the third and fourth embodiments, in the face of the space converter - money _ ti_Layer c_ie, mlc) or multi-layer organic ti_Layei · 胤 _ _ & take off board and wire form = manual cable Architecture. The inside of the substrate 51 has a circuit structure %, so that a first contact 501 on the printed circuit board 5 is electrically connected to the - probe 55 of the probe holder 53 to make a second on the printed circuit board 50. The contact 5〇2 is electrically connected to a second probe 56 of the probe holder %. The circuit path of the first contact 5〇1 to the first probe % is from the first contact mouse through the internal circuit of the printed circuit board 50, the circuit structure inside the substrate 51 = the conductive layer in the probe holder 53 571, and the first conductive layer 571 is electrically connected to the first probe 55 by the base=internal circuit structure 52; the second contact 5〇2, the circuit path of the second pin 56 is from the second connection Point 5〇2 is connected to the second probe 56 via the internal structure of the printed circuit board % 22 201116834 through the circuit structure 52 in the substrate 51 (4) 572 'the second conductive layer 572 is further connected to the second probe 56 via the circuit structure a inside the substrate 51. The two-contact electrical connection t 71 and the second _ 572 _ sub-element 54 through the electronic component 54 are disposed between the two parallel squats. Similarly, in the fifth embodiment, the circuit_path can also be a parallel, series, 疋 merged, parallel implementation. If the path of the series circuit is taken as an example, there will be only one contact on the circuit board 5, for example, the first contact 5〇1, and there is only one corresponding probe on the probe base 53, for example, A probe 55, when the contact point of the printed circuit board 5 is in the circuit structure passing through the printed circuit board 5, and the inside of the substrate 51 has an electric 2 structure 52, the contact can be electrically connected to the probe, that is, The circuit of the series circuit!. In addition, the configuration of the plurality of electronic components can also be applied to the present embodiment, and the electronic component 54 can be disposed on the upper guide plate 531 in addition to the lower guide plate 531, or can be disposed across the two guide plates 531. , 532 settings. Moreover, in the parallel path, the first pin 55 is a power probe or a signal probe, and the second probe is a ground probe. When the first probe 55 is a power supply probe, 'the first contact 5〇1 is used as the power supply point: for receiving the power transmitted by the test machine; and when the first probe 55 is the signal probe, the first connection Point 501 is used as a signal connection point to receive the test signal transmitted by the test machine, and the second contact 502 is used as a ground contact. In series, the single = probe can be a power probe 'a signal probe or a ground probe, and the contact corresponds to the surface used by the probe as the corresponding power contact, signal contact And grounding contacts. Next, a sixth embodiment of the present invention will be described. Please refer to the sixth figure, which is a schematic diagram of the structure of the probe card proposed in the present application. In contrast to the third to fifth embodiments, the portion of the space conversion benefit is replaced by an integrated circuit board 6 ML replacing the MLC/ML (10) board and the manual 23 201116834 cable. Therefore, the second contact 602 on the 60th of the parallel circuit of the parallel circuit 62 is electrically connected to the circuit of the probe holder full-board circuit board first to the first probe 64. Road = Detect = Connected through the integrated circuit board 6 〇 internal circuit structure 2 6 ^ 1 661, and then through the whole a-type snow change, such as * electric injection is connected to the first conductive layer ° electric plate 6 。. The circuit structure 61 of the cymbal 61; the second contact 602 to the second relocation is connected to the first: the two-contact point of the integrated electrical internal circuit structure is electrically connected to the first-guide ray screen 661 and the second conductive layer 662, the electronic component 63% 曰 the same, in the first technical t, Wei Wei diameter. And the implementation of the string. If the path of the series circuit is taken as an example, there will only be one on the integrated circuit board 60. The contact, for example, the first contact is clear, and there is only one corresponding probe above the probe holder, such as the first probe 64, when the entire 6-inch contact is inside the integrated circuit board 6〇 After the circuit structure 61, the contact point can be electrically connected to the probe, that is, the path of the series circuit. The configuration of the plurality of electronic components is also applicable to the embodiment, and the electronic component 63 is disposed in the lower guide. The outer surface of the board 624 can also be set on the upper guide plate, or the way of the upper and lower 621, 622. Moreover, in the parallel path, the first probe & is a power supply probe or - the signal probe, the second probe 65 is a "grounding probe." When the first probe 64 is a power supply probe, the first contact 6〇H is used as a power contact to receive the power transmitted by the test machine; and when the first probe 64 is a signal probe, the first contact is used as a signal contact for receiving the test transmitted by the test machine. Signal; second contact · 24 201116834 as a ground contact. When connected in series, a single probe can be a power probe, a signal probe or a ground probe, and the contact corresponds to the probe The main purpose of the present invention is to improve the interference of signals and the increase of noise caused by an excessively long transmission path, etc., as a corresponding power supply contact, signal contact, and ground contact. The structure of the probe card proposed by the present invention is obtained by pulling the distance between the electronic component and the object to be tested, that is, placing the electronic component in the probe holder or the upper surface thereof or the substrate above the probe holder. Finite current, decoupling, stable voltage, excellent impedance matching, improved performance, and reduced electromagnetic interference. In addition, electronic components can also include active components, passive components or wireless RF components. IC crystal #, 二铺,电晶财; Passive components can include capacitors, resistors, inductors, etc.; and radio frequency components can include _, balance / unbalance converter or duplexer, etc. - rare - see, rare inventions that are worth cherishing, but the above is only a better implementation of the present invention, when it is not possible to limit the hairline, the majority of the "issuance of the patent" And modifications, = still fall within the scope of the invention patent. [S 1 25 201116834 [Simplified description of the drawings] First figure (a): Schematic diagram of the probe card of the first embodiment of the present invention. First figure (b): Schematic diagram of the probe card of the first embodiment of the present invention. First figure (c): bottom view of the first figure (a), (b). Second figure: Schematic diagram of the probe card of the second embodiment of the present invention. Fig. 3(a) is a schematic view showing the structure of a probe card according to a third embodiment of the present invention. Fig. 3(b) is a schematic view showing the structure of a probe card according to a third embodiment of the present invention. Figure 3 (c) is a schematic view showing the structure of the probe card of the third embodiment of the present invention. Fourth figure (8): Schematic diagram of the probe card of the fourth embodiment of the present invention. Figure 4 (b) is a schematic view showing the structure of the probe card of the fourth embodiment of the present invention. Figure 4 (c) is a schematic view showing the structure of the probe card of the fourth embodiment of the present invention. Figure 5 is a schematic view showing the structure of the probe card of the fifth embodiment of the present invention. Figure 6 is a schematic view showing the structure of the probe card of the sixth embodiment of the present invention. [Main component symbol description] 1 probe card 141 first conductive layer 10 printed circuit board 142 second conductive layer 101 first contact 15 probe holder 102 second contact 1 5 1 hole 11 hole plate 16 power supply probe 111 Lower surface 17 grounding probe 112 upper surface 181 first wire 12 recess 182 second wire 13 electronic component 183 third wire 26 201116834 184 fourth wire 322 upper guide plate 191 first contact pad 33 electronic component 192 second contact pad 34 First probe 2 probe card 35 Second probe 20 Printed circuit board 361 First dummy probe 201 Contact 362 Second dummy probe 21 Orifice plate 363 Third dummy probe 211 Lower surface 364 Fourth dummy Needle 23 Electronic component 365 Fifth dummy probe 241 First conductive layer 366 Sixth dummy probe 242 Second conductive layer 371 First conductive layer 25 Probe holder 372 Second conductive layer 251 Hole 381 First wire 26 False probe 382 second wire 281 first wire 383 third wire 282 second wire 384 fourth wire 29 contact pad 391 first contact pad 3 probe card 392 second contact pad 30 printed circuit board 393 third contact pad 301 first connection Point 394 fourth Contact pad 302 second contact 395 fifth contact pad 31 orifice plate 396 sixth contact pad 32 probe holder 397 seventh contact pad 321 lower guide plate 398 eighth contact pad
[S I 27 201116834 399第九接觸墊 3910第十接觸墊 3911第十一接觸墊 3912第十二接觸墊 4探針卡 40印刷電路板 401接點 41孔板 42探針座 421下導板 422上導板 43電子元件 44探針 461第一假探針 462第二假探針 463假探針 471第一導電層 472第二導電層 481第一導線 482第二導線 491第一接觸墊 492第二接觸墊 493第三接觸墊 494第四接觸墊 495第五接觸墊 496第六接觸墊 5探針卡 50印刷電路板 501第一接點 502 第二接點 51 MLO/MLC 基板 52電路結構 53探針座 531下導板 532上導板 54電子元件 55第一探針 56第二探針 571第一導電層 572第二導電層 6探針卡 60整合式電路板 601第一搔點 602第二接點 61電路結構 62探針座 621下導板 622上導板 28 201116834 一導電層 二導電層 63電子元件 661第 64第一探針 662第 65第二探針 [S] 29[SI 27 201116834 399 ninth contact pad 3910 tenth contact pad 3911 eleventh contact pad 3912 twelfth contact pad 4 probe card 40 printed circuit board 401 contact 41 hole plate 42 probe holder 421 lower guide plate 422 Guide 43 electronic component 44 probe 461 first dummy probe 462 second dummy probe 463 dummy probe 471 first conductive layer 472 second conductive layer 481 first wire 482 second wire 491 first contact pad 492 second Contact pad 493 third contact pad 494 fourth contact pad 495 fifth contact pad 496 sixth contact pad 5 probe card 50 printed circuit board 501 first contact 502 second contact 51 MLO / MLC substrate 52 circuit structure 53 Needle holder 531 lower guide 532 upper guide 54 electronic component 55 first probe 56 second probe 571 first conductive layer 572 second conductive layer 6 probe card 60 integrated circuit board 601 first point 602 second Contact 61 circuit structure 62 probe holder 621 lower guide 622 upper guide plate 28 201116834 one conductive layer two conductive layer 63 electronic component 661 64th first probe 662 65th second probe [S] 29