TWI851080B - Substrate processing equipment - Google Patents

Abstract

The substrate processing device comprises: a conveying device (20) capable of conveying the substrate in two directions, one direction and a reverse direction, along a conveying path; and a water jet (40) disposed above the conveying path of the substrate, with the long side direction being arranged along a direction intersecting the conveying path in a horizontal plane, and spraying a processing liquid from a slit-shaped opening toward the conveying path. The water jet (40) comprises: a storage portion (41) having an opening on the side of the conveying path, capable of storing the processing liquid; a spray direction guide plate (42) disposed in a manner such that one end protrudes from the opening and the other end enters the interior of the storage portion, and guides the spray direction of the processing liquid; and a spray direction changing portion, which rotates the spray direction guide plate to change the spray direction of the processing liquid.

Description

Substrate processing equipment

The implementation method of the present invention relates to a substrate processing device.

In the manufacturing process of liquid crystal display devices or semiconductor devices, there is a processing step of supplying a processing liquid to a substrate such as a glass substrate or a semiconductor chip for cleaning or chemical treatment. In the processing step, a sheet-by-sheet method is sometimes adopted, that is, pure water or chemical solution is used as the processing liquid, and the processing liquid is sprayed on each substrate to perform the processing.

When processing substrates piece by piece, the following operation is performed: a water jet (slit nozzle) having a slit-shaped opening is arranged above or below the substrate conveying path, and a processing liquid is supplied from the opening to the conveyed substrate as a curtain-shaped processing liquid film. Compared with a shower nozzle, a water jet can supply the processing liquid evenly to the substrate, so it is suitable for substrates or processing steps that are prone to processing spots (uneven processing).

[Prior art literature]

[Patent Literature]

[Patent document 1] Japanese Patent Publication No. 2004-305930

The substrate needs to be supplied with processing liquid multiple times during its processing steps, but each processing requires a processing liquid supply mechanism such as a water jet and a chamber to install it. Therefore, the substrate processing line as a whole becomes large, resulting in the enlargement of the overall substrate processing equipment or an increase in manufacturing costs.

Therefore, the object of the present invention is to provide a substrate processing device that can prevent the processing line of the substrate from becoming too large.

The substrate processing device of the embodiment includes: a conveying device capable of conveying a substrate in two directions, one direction and a reverse direction, along a conveying path; and an aqua knife, which is arranged above the conveying path of the substrate and has a long side direction along a direction intersecting the conveying path in a horizontal plane, and sprays a processing liquid from a slit-shaped opening toward the conveying path. The aqua knife includes: a storage part having an opening on the side of the conveying path and capable of storing the processing liquid; an ejection direction guide plate, which is arranged in a manner that one end protrudes from the opening and the other end enters the interior of the storage part, and guides the ejection direction of the processing liquid; and an ejection direction changing part, which rotates the ejection direction guide plate to change the ejection direction of the processing liquid.

According to the implementation method of the present invention, it is possible to prevent the processing line of the substrate from becoming too large.

1: Substrate processing equipment

10: Processing room

11: Move in entrance

12: Move out

20: Transport device

21: Transport roller

21a: Roller

21b: Axis

30: Detection device

30a, 30b, 30c: Detection unit

30c1: pendulum component

30c2: Axle

30c3: Testing roller

30c4: Counterweight

30c5: Magnet

30c6: Detection sensor

40, 140, 240: Water jet

41, 141, 241: Storage Department

42, 142, 242: Spray direction guide plate

42a, 242a: front end

42b, 242b: rear end

43, 143, 243: Rotation axis

50: Control device

61: First treatment liquid supply source

62: Second processing liquid supply source

63: First valve

64: Second valve

A1, A2: Transport direction

C:Central

H1: Transport path

P1: Initial position

P2, P3: Detection position

R: Rotation direction

R1: Reverse direction

S: Center of the rotation axis

W: Substrate

FIG1 is a side view showing the schematic structure of a substrate processing device according to the first embodiment.

FIG2 is a plan view showing the schematic structure of the substrate processing device of the first embodiment.

FIG3 is a side view showing a state in which the ejection direction guide plate of the water jet is located at the second rotation position in the substrate processing device of the first embodiment.

FIG4 is a side view showing the schematic structure of the substrate processing device of the second embodiment.

Figure 5 (a) and Figure 5 (b) are side views showing the schematic structure of the water jet according to the third embodiment.

Figure 6 (a) to Figure 6 (c) are side views showing the schematic structure of the water jet according to the fourth embodiment.

FIG7 is a side view showing a state in which the water jet is located at the first rotation position and the detection unit is positioned at the initial position in the substrate processing device of the fifth embodiment.

FIG8 is a side view showing a state in which the water jet is located at the first rotation position and the detection part is positioned at the detection position in the substrate processing device of the fifth embodiment.

FIG9 is a side view showing a state in which the ejection direction guide plate of the water jet is located at the second rotation position and the detection part is positioned at the initial position in the substrate processing device of the fifth embodiment.

FIG. 10 is a side view showing a state in which the ejection direction guide plate of the water jet is located at the second rotation position and the detection part is positioned at the detection position in the substrate processing device of the fifth embodiment.

<First implementation method>

The first embodiment is described with reference to FIGS. 1 to 3. The substrate processing device 1 in the embodiment can be, for example, a substrate cleaning device, or a device for forming a photoresist coating on the surface of the substrate, an exposure device, a development device, an etching device, a stripping device, etc.

(Basic structure)

As shown in FIG. 1 and FIG. 2 , the substrate processing device 1 of the first embodiment includes a processing chamber 10, a conveying device 20, a detection unit 30a, a detection unit 30b, a water jet 40, and a control device 50. As a substrate W to be processed, a rectangular substrate such as a glass substrate, a liquid crystal substrate, or a semiconductor substrate is used.

The processing chamber 10 is a frame (chamber) having a transport path H1 for transporting substrates W therein, and is formed so that the substrates W can move along the transport path H1 in the processing chamber 10. The processing chamber 10 functions as a room for processing the substrates W moving on the transport path H1. In the processing chamber 10, on one side of the transport path H1 for transporting substrates W, there is an opening, i.e., a transport port 11, for transporting substrates W into the processing chamber 10. In addition, on the other side of the transport path H1 for transporting substrates W, there is an opening, i.e., a transport port 12, for transporting substrates W out of the processing chamber 10. In addition, on the bottom surface of the processing chamber 10, there is a discharge port (not shown) for discharging liquid.

The transport device 20 is formed so as to transport the substrate W in a reciprocating manner along the transport path H1 in one direction and in a reverse direction thereof. The transport device 20 has a plurality of transport rollers 21, and the substrate W is transported by these transport rollers 21. The transport rollers 21 are positioned in a manner such that their respective long side directions are orthogonal to the transport direction A1 of the substrate W in the horizontal plane, and are arranged at prescribed intervals to form the transport path H1. These transport rollers 21 are arranged in the processing chamber 10 so as to be rotatable forward and reverse, and are configured to rotate synchronously with each other through a driving source (not shown). The transport rollers 21 each have a plurality of rollers 21a and a shaft 21b. Each roller 21a is mounted on the shaft 21b at prescribed intervals. When the shaft 21b rotates, each roller 21a mounted on the shaft 21b rotates. The substrate W placed on each of the conveying rollers 21 is conveyed along the conveying path H1 by the rotating conveying rollers 21.

In order to grasp the arrival and conveying position of the substrate W, the detection unit 30a and the detection unit 30b detect the substrate W and output a detection signal indicating the detection of the substrate W to the control device 50. The detection unit 30a is located in the processing chamber 10, above the conveying path H1 on the upstream side of the conveying direction A1 of the substrate. The detection unit 30b is located in the processing chamber 10, above the conveying path H1 on the downstream side of the conveying direction A1. The detection unit 30a and the detection unit 30b are, for example, photo sensors, each of which includes a light projecting unit that irradiates light (such as laser) toward the conveying path H1 and a light receiving unit that detects the reflected light reflected by the substrate W.

When the detection parts 30a and 30b are arranged near the water jet 40 described later, the detection of the substrate W may be hindered by the processing liquid ejected from the water jet 40. Therefore, it is preferable that the detection parts 30a and 30b are arranged at a position where the processing liquid ejected from the water jet 40 cannot reach.

The water jet 40 is disposed above the transport path H1 to supply a processing liquid to the substrate W transported along the transport path H1. The water jet 40 has a slit-shaped opening at the bottom, and its long side direction is disposed along a direction intersecting the transport path H1 in a horizontal plane (a direction orthogonal in the present embodiment). In a direction orthogonal to the transport direction A1 in the horizontal plane, the length of the slit-shaped opening of the water jet 40 is greater than the length of the substrate W being transported. Details of the water jet 40 will be described later. In addition, the water jet 40 is connected to a processing liquid supply source such as a processing liquid supply storage tank (not shown) and a liquid delivery mechanism such as a pump. The liquid infusion mechanism can adjust the spray volume (spray volume per unit time) of the treatment liquid from the water jet 40 by changing the output of the pump, for example.

The control device 50 has a microcomputer that centrally controls each part, and a storage part that stores processing information or various programs related to substrate processing. The control device 50 controls each part such as the conveying device 20 or the water jet 40 based on the substrate processing information or various programs. In addition, the control device 50 receives the detection signal output from the detection part 30a and the detection part 30b. For example, the control device 50 determines the conveying position of the substrate W based on the received detection signal and changes the rotation direction of the conveying roller 21.

(Water jet)

Next, the structure of the water jet 40 is described. The water jet 40 includes a storage portion 41, a spray direction guide plate 42, and a rotating shaft 43 (spray direction changing portion).

The storage section 41 has an opening on the conveying path H1 side. The opening is set in a manner that the opening area becomes larger as it approaches the conveying path H1. In addition, the processing liquid can be stored through the ejection direction guide plate 42 described later, and the opening is formed into a slit shape.

The ejection direction guide plate 42 is a plate-shaped member provided below the storage section 41 in such a manner that one end protrudes from the opening of the storage section 41 and the other end enters the interior of the storage section 41. In the direction perpendicular to the conveying direction A1 in the horizontal plane, the length of the ejection direction guide plate 42 is substantially the same as the opening of the storage section 41. In the following, for the sake of convenience, the side of the ejection direction guide plate 42 close to the conveying path H1 is set as the front end 42a, and the part away from the conveying path H1 and entering the interior of the storage section 41 is set as the rear end 42b.

In the direction orthogonal to the conveying direction A1 in the horizontal plane of the ejection direction guide plate 42, the end portions of the ejection direction guide plate 42 are respectively provided with rotation shafts 43. The ejection direction guide plate 42 is fixed to the rotation shafts 43, and the ejection direction guide plate 42 rotates by the rotation of the rotation shafts 43. Moreover, the rear end portion 42b of the ejection direction guide plate 42 abuts against the inside of the storage portion 41, and its rotation is restricted. The treatment liquid transported from the treatment liquid supply source and stored in the storage portion 41 is ejected from the slit-shaped opening formed by the opening of the storage portion 41 and the front end portion 42a of the ejection direction guide plate 42 in a manner guided along the front end portion 42a. The direction of spraying the treatment liquid can be changed by the rotation position of the spraying direction guide plate 42. That is, the spraying direction guide plate 42 guides the spraying direction of the treatment liquid.

(Substrate processing steps)

Next, an example of a substrate processing step performed by the aforementioned substrate processing device 1 is described. In this example, the substrate W reciprocates 1.5 times in the processing chamber and receives the processing liquid supply 3 times by means of the water jet 40.

In the substrate processing device 1 shown in FIG. 1 and FIG. 2 , each transport roller 21 of the transport device 20 rotates forward. When the substrate W is carried in from the carrying port 11, it moves along the transport path H1 by the rotation of the transport roller 21. The carried-in substrate W is, for example, a substrate that receives a processing liquid (such as a stripping liquid or a developer) from a shower head or the like in an upstream step of the substrate processing device 1 of the first embodiment and forms a liquid film on the surface.

When the substrate W is detected by the detection unit 30a, a detection signal is sent to the control device 50. The control device 50 that receives the detection signal starts to eject the processing liquid (e.g., pure water or cleaning liquid such as CO2 water) from the water jet 40. At this time, the ejection direction guide plate 42 is positioned at a rotation position (hereinafter referred to as the first rotation position) where the front end 42a is further upstream than the rear end 42b in the conveying direction A1. Thus, the processing liquid is ejected from the water jet 40 toward the upstream side of the conveying direction A1 to the conveyed substrate W. When the processing liquid is ejected toward the upstream side of the conveying direction of the substrate, the relative speed of the processing liquid ejected from the water jet 40 and the conveyed substrate increases, so that the liquid (liquid film) on the substrate can be efficiently removed and replaced by the processing liquid ejected from the water jet 40.

In addition, the detection of the substrate W by the detection unit 30a means that the detection unit 30a detects the end of the substrate W on the downstream side in the conveying direction, or the detection unit 30a detects the end of the substrate W on the upstream side in the conveying direction. The detection unit 30a may send a detection signal to the control device 50 by detecting the end of the substrate W on the downstream side in the conveying direction, or may send a detection signal to the control device 50 by detecting the end of the substrate W on the upstream side in the conveying direction. When the detection unit 30a detects the end of the substrate W on the downstream side in the conveying direction, the detection unit 30a sends a detection signal to the control device 50 by detecting the reflected light reflected by the end of the substrate W on the downstream side in the conveying direction. Furthermore, when the detection unit 30a detects the end portion of the substrate W on the upstream side in the conveying direction, after detecting the reflected light from the substrate W, if the detection unit 30a can no longer detect the reflected light, it sends a detection signal to the control device 50.

When the substrate W passes through a position facing the water jet 40 while the processing liquid is being sprayed from the water jet 40, the processing liquid is supplied to the surface of the substrate W and the substrate W is processed by the processing liquid. At this time, the processing liquid falling from the surface of the substrate W is discharged from the discharge port provided on the bottom surface of the processing chamber 10.

The substrate W supplied with the processing liquid through the water jet 40 is transported to the downstream side of the processing chamber 10 in the transport direction A1. When the detection unit 30b detects the end of the substrate W on the downstream side in the transport direction, a detection signal is sent to the control device 50. The control device 50 that receives this detection signal temporarily stops the drive of the transport device 20, and the ejection of the processing liquid from the water jet 40 is also temporarily stopped. Furthermore, the rotation shaft 43 of the water jet 40 is rotated (counterclockwise in Figure 1), thereby changing the rotation position of the ejection direction guide plate 42.

The state at this time is shown in FIG3. As shown in FIG3, the ejection direction guide plate 42 is positioned at a rotation position (hereinafter referred to as the second rotation position) where the front end 42a is further upstream than the rear end 42b in the conveying direction A2. In addition, the conveying direction A2 is the direction opposite to the conveying direction A1. Moreover, the conveying position of the substrate W when the supply of the processing liquid is stopped is the position where the end of the substrate W on the upstream side in the conveying direction passes directly below the water jet 40.

When the change of the rotation position of the ejection direction guide plate 42 is completed, the control device 50 starts ejecting the processing liquid from the water jet 40 again. Moreover, the transport roller 21 of the transport device 20 is driven in reverse. As a result, the substrate W is transported along the transport direction A2 and receives the supply of the processing liquid from the water jet 40 again. At this time, the processing liquid from the water jet 40 will also be ejected toward the upstream side of the substrate W in the transport direction (the upstream side in the transport direction A2). And, it is transported to the downstream side of the transport direction A2 of the processing chamber 10 (that is, the upstream side in the transport direction A1).

When the detection unit 30a detects the end of the downstream side of the substrate W in the conveying direction A2 that is conveyed to the processing chamber 10, a detection signal is sent to the control device 50. The control device 50 that receives this detection signal temporarily stops the driving of the conveying device 20, and the ejection of the processing liquid from the water jet 40 is also temporarily stopped. Furthermore, the rotation shaft 43 of the water jet 40 is rotated (clockwise in FIG. 3), thereby changing the rotation position of the ejection direction guide plate 42 to the first rotation position again. When the change of the rotation position of the ejection direction guide plate 42 is completed, the control device 50 starts the ejection of the processing liquid from the water jet 40 again, and the conveying roller 21 is also driven in the forward direction.

The substrate W is transported to the downstream side of the transport direction A1 as described above, while receiving the supply of the processing liquid from the water jet 40. Then, the substrate W transported to the downstream side of the transport direction A1 is carried out from the carrying port 12.

As described above, according to the first embodiment, the substrate W is transported in two directions along the transport path H1 in one direction (transport direction A1) and in the reverse direction (transport direction A2) by the transport roller 21 that can rotate forward and reverse. By transporting the substrate W in a reciprocating manner on the transport path H1 in the processing chamber 10, the processing liquid can be supplied to the substrate W from the water jet 40 multiple times. Thus, even if there is only one water jet 40, the processing liquid can be supplied to the substrate W multiple times. Alternatively, even if there is only one water jet 40, the processing liquid can be supplied to the substrate W for a long time or in large quantities. Therefore, the processing line can be prevented from becoming longer and the overall device can be enlarged.

Furthermore, the water jet 40 that supplies the processing liquid to the substrate W can change the direction of spraying the processing liquid. More specifically, by rotating the spray direction guide plate 42 of the water jet 40, the processing liquid can be supplied toward the upstream side of the substrate transport direction regardless of the direction in which the substrate W is transported. Thus, even if the substrate W is transported and processed in a reciprocating manner in the processing chamber 10, the liquid (liquid film) on the substrate W can be efficiently removed and replaced with the processing liquid newly supplied from the water jet 40 regardless of the transport direction of the substrate.

Here, the reduction of the length of the substrate W in the transport direction in the processing chamber 10 is discussed. When the upstream end of the substrate W in the transport direction is detected by the detection unit 30a or the detection unit 30b, the detection unit 30a and the detection unit 30b must be set near the water jet 40. However, if the detection unit 30a and the detection unit 30b are set near the water jet 40 as described above, the detection of the substrate W may be hindered by the processing liquid ejected from the water jet 40.

If the end of the substrate W on the downstream side in the conveying direction is detected by the detection unit 30a or the detection unit 30b, the detection unit 30a and the detection unit 30b can be set at a position far from the water jet 40. At this time, in order to allow the substrate W to reciprocate in the processing chamber 10 and receive the supply of the processing liquid, the substrate W is transported along the conveying direction A1 to the position where the water jet 40, whose ejection direction guide plate 42 is at the second rotation position, supplies the processing liquid to the end of the substrate W on the downstream side in the conveying direction that is conveyed along the conveying direction A2.

Therefore, it is preferable to detect the presence of the substrate W at the position where the processing liquid is supplied from the water jet 40 to the end portion of the substrate W on the downstream side in the transport direction by the detection unit 30b or the detection unit 30a. Furthermore, transporting the substrate W to a position further downstream in the transport direction than the position where the processing liquid is supplied from the water jet 40 to the end portion of the substrate W on the downstream side in the transport direction will increase the length of the substrate W in the transport direction in the processing chamber 10.

Therefore, the detection unit 30a is preferably provided on the inner wall of the processing chamber 10 provided with the carrying port 11 or in the vicinity thereof. The detection unit 30b is preferably provided on the inner wall of the processing chamber 10 provided with the carrying port 12 or in the vicinity thereof. By providing the detection units 30a and 30b as described above, the length of the substrate W in the conveying direction in the processing chamber 10 can be minimized. Therefore, the processing line of the substrate W can be prevented from becoming too large.

In addition, by setting the detection unit 30a (detection unit 30b) at the loading port 11 (unloading port 12), the processing line of the substrate W can be prevented from becoming too large, and the length from the loading port 11 to the water jet 40 is equal to the length from the water jet 40 to the unloading port 12. Moreover, the length from the loading port 11 to the water jet 40 and the length from the water jet 40 to the unloading port 12 are slightly longer than the length of the substrate W in the transport direction.

Furthermore, it is preferred that the end of the substrate W on the downstream side in the conveying direction is detected by the detection unit 30a or the detection unit 30b, thereby stopping the supply of the processing liquid. Furthermore, it is preferred that the rotation shaft 43 of the water jet 40 is rotated when the end of the substrate W on the downstream side in the conveying direction is detected by the detection unit 30a or the detection unit 30b. Furthermore, it is preferred that when the rotation position of the ejection direction guide plate 42 is changed, the ejection of the processing liquid from the water jet 40 is restarted, and the rotation direction of the conveying roller 21 is switched.

In addition, the above description lists an example in which the substrate W reciprocates 1.5 times in the processing chamber and receives the processing liquid from the water jet 40 three times, but it is not limited to this. By changing the number of reciprocations, the number of times the processing liquid is supplied to the substrate W can be changed. The amount of processing liquid supplied or the processing time can also be adjusted according to this number. Moreover, the handling port 12 can be omitted from the processing chamber 10, and the handling port and the handling port can be shared. That is, the substrate W that is carried in from the opening provided in the processing chamber 10 and has been processed a specified number of times can also be carried out from the same opening.

<Second implementation method>

Next, the second embodiment is described with reference to FIG. 4. In addition, in the second embodiment, the difference from the first embodiment (switching the processing liquid) is described, and other descriptions are omitted.

The water jet 40 of the second embodiment is different from the first embodiment in that a plurality of processing liquid supply sources such as a processing liquid supply tank are provided. The plurality of processing liquid supply sources are connected to the water jet 40 via a valve for switching. This arrangement enables the type of processing liquid ejected from the water jet 40 to be changed. In the second embodiment, an example of processing a substrate using two processing liquids, a first processing liquid (e.g., a stripping liquid or a developer) and a second processing liquid (e.g., a cleaning liquid such as pure water or CO2 water) is described. The processing object substrate can be, for example, a substrate having an RGB anti-etching agent film formed on the surface, a film-forming substrate for a color filter step or a circuit pattern, or a substrate for a thin film transistor (TFT) array step. In addition, the types of substrates and processing liquids are not limited thereto.

The water jet 40 is connected to a first processing liquid supply source 61 and a second processing liquid supply source 62 via a pipe branching in the middle. A first valve 63 is provided between the water jet 40 and the first processing liquid supply source 61. A second valve 64 is provided between the water jet 40 and the second processing liquid supply source 62. The opening and closing of the first valve 63 and the second valve 64 are controlled by the control device 50. The control device 50 sprays any processing liquid from the water jet 40 by controlling the opening and closing of the first valve 63 and the second valve 64 and a liquid delivery mechanism such as a pump not shown in the figure.

When the detection unit 30a detects the substrate W carried in from the carrying port 11, a detection signal is sent to the control device 50. The control device 50 that receives the detection signal sets the first valve 63 to an open state and the second valve 64 to a closed state, and starts the ejection of the first processing liquid (e.g., stripping liquid) from the water jet 40. At this time, the ejection direction guide plate 42 is in the first rotation position. The substrate W is transported along the transport direction A1 while receiving the supply of the first processing liquid from the water jet 40.

When the substrate W supplied with the first processing liquid is transported to the downstream side of the processing chamber 10 in the transport direction A1, the end of the substrate W on the downstream side in the transport direction is detected by the detection unit 30b, and a detection signal is sent to the control device 50. The control device 50 that receives the detection signal temporarily stops the driving of the transport device 20.

Next, the control device 50 sets the first valve 63 to a closed state to stop the ejection of the first processing liquid. After the ejection of the first processing liquid stops, the rotating shaft 43 is rotated to change the ejection direction guide plate 42 to the second rotation position. In addition, the second valve 64 is set to an open state to eject the second processing liquid (e.g., pure water) from the water jet 40. That is, when the substrate W is transported in one direction and when the substrate W is transported in a direction opposite to the one direction, the processing liquid ejected from the water jet 40 is switched. After the first processing liquid located inside the storage unit 41 is replaced with the second processing liquid, the driving of the transport device 20 is started again to transport the substrate W along the transport direction A2. The substrate W is transported along the transport direction A2 while receiving the supply of the second processing liquid from the water jet 40. In addition, as long as the specified time until the liquid inside the storage unit 41 is completely replaced is obtained in advance through experiments, after the specified time has passed since the start of the second processing liquid spraying, it is considered that it has been replaced with the second processing liquid, and the driving of the conveying device 20 can be started again.

When the detection unit 30a detects that the substrate W has been supplied with the second processing liquid and has been transported to the downstream side in the transport direction A2, the second valve 64 is set to a closed state to stop the spraying of the processing liquid from the water jet 40. In addition, the transport roller 21 is rotated forward to transport the substrate W along the transport direction A1. The substrate W transported to the downstream side in the transport direction A1 is carried out from the transport port 12.

As described above, according to the second embodiment, as in the first embodiment, the processing line can be prevented from becoming longer and the overall size of the device can be prevented from becoming larger. Moreover, by having the ejection direction guide plate 42, the processing liquid can be supplied toward the upstream side of the substrate's transport direction regardless of the direction in which the substrate W is transported, thereby efficiently replacing the liquid on the substrate W.

Furthermore, according to the second embodiment, a plurality of processing liquid supply sources are connected to the water jet 40, so that the sprayed processing liquid can be switched, so that processing using different processing liquids can be performed in one processing chamber. Therefore, even when the substrate W is processed by a plurality of processing liquids, a plurality of processing chambers do not need to be provided, so that the processing line can be prevented from becoming longer and the device larger.

<Third implementation method>

Next, the third embodiment is described with reference to FIG. 5 (a) and FIG. 5 (b). The third embodiment is a variation of the first embodiment or the second embodiment, so the difference from the first embodiment or the second embodiment (the difference in the ejection pressure according to the ejection direction of the treatment liquid from the water jet) is described, and other descriptions are omitted.

In the water jet 140 of the third embodiment, the center S (rotation axis) of the rotation axis 143 is set at a position offset toward the downstream side of the conveying direction A1 relative to the center C of the width of the opening of the storage section 141 (the length in the direction perpendicular to the direction in which the water jet 140 extends and the length in the left-right direction in FIG. 5 (a) and FIG. 5 (b)). As a result, when the ejection direction guide plate 142 fixed to the rotation axis 143 is in the second rotation position (FIG. 5 (b)), the width of the slit formed by the opening of the storage section 141 and the ejection direction guide plate 142 becomes narrower than when the ejection direction guide plate 142 fixed to the rotation axis 143 is in the first rotation position (FIG. 5 (a)). That is, the water jet 140 can change the width of the slit-shaped opening of the storage portion 141. When the slit width becomes narrower, the ejection pressure of the processing liquid on the substrate W can be increased even if the ejection amount per unit time is the same.

As described above, according to the third embodiment, when the processing liquid is sprayed toward the upstream side of the conveying direction A2, the spraying pressure on the substrate W can be increased compared to when the processing liquid is sprayed toward the upstream side of the conveying direction A1.

For example, after roughly cleaning the substrate with weak ejection pressure while transporting it in the transport direction A1, fine cleaning can be performed with strong ejection pressure while transporting it in the transport direction A2. Thus, even in substrates that are prone to processing spots (uneven processing), the generation of processing spots can be suppressed, thereby improving the quality of the substrate.

Furthermore, if a plurality of processing liquids can be switched as described in the second embodiment, the ejection pressure can be selected according to the type of processing liquid. More specifically, the ejection pressure can be changed by selecting the transport direction of the substrate W and the rotation position of the ejection direction guide plate 142 according to the type of the ejected processing liquid (i.e., according to the processing step). Thus, the ejection pressure can be set to be suitable for the processing step.

For example, in the treatment of a substrate with an RGB anti-etching agent film formed on the surface or an anti-etching agent substrate after various etching steps, after supplying the stripping liquid with a weak ejection pressure while conveying along the conveying direction A1, the processing liquid (such as pure water) is supplied with a strong ejection pressure while conveying along the conveying direction A2. When the stripping liquid is supplied to the liquid crystal substrate, the ejection pressure on the substrate is weakened, so that a thick liquid film can be formed and the film on the substrate surface can be fully swollen. Subsequently, when supplying the processing liquid, the ejection pressure on the substrate is increased compared to when supplying the stripping liquid, thereby increasing the liquid flow on the substrate surface, thereby enabling the swollen film to be removed uniformly.

<Fourth Implementation Method>

Next, the fourth embodiment is described with reference to FIG. 6 (a) to FIG. 6 (c). The fourth embodiment is a variation of the first embodiment or the second embodiment, so the difference from the first embodiment or the second embodiment (the adjustable ejection pressure of the treatment liquid from the water jet) is described, and other descriptions are omitted.

The rear end 242b of the ejection direction guide plate 242 of the water jet 240 of the fourth embodiment is formed by an elastic member, and bends (curves) when pressed. The elastic member is, for example, resin.

When the rotating shaft 243 of the water jet 240 shown in FIG6(a) is rotated, the rear end portion 242b of the ejection direction guide plate 242 abuts against the inside of the storage portion 241. As a result, as shown in FIG6(b), the processing liquid can be ejected toward the upstream side in the conveying direction (the left side in FIG6(a) to FIG6(c)), and a slit is formed on the front end portion 242a side. Here, when the rotating shaft 243 is further rotated, as shown in FIG6(c), the ejection direction guide plate 242 also rotates, but because the rear end portion 242b abuts against the inside of the storage portion 241, the deflection becomes larger. In this way, by bending the rear end portion 242b, the width of the narrow slit for spraying the processing liquid can be reduced.

Thus, according to the fourth embodiment, the rear end portion 242b of the water jet 240 is formed by an elastic member, so that the slit width of the sprayed processing liquid can be adjusted by the rotation amount of the spray direction guide plate 242. By adjusting the slit width, the spray pressure can be adjusted to the preferred type according to the type of substrate W as the processing object or the type of processing liquid and the processing step, thereby improving the quality of the substrate.

<Fifth Implementation Method>

Next, the fifth embodiment is described with reference to Figures 7 to 10. In addition, in the fifth embodiment, the difference from the first embodiment (the provision of a detector for stopping the supply of the treatment liquid) is described, and other descriptions are omitted.

The detection unit 30c of the fifth embodiment detects the presence of the substrate W so that the control device 50 can grasp the timing of stopping the supply of the processing liquid. When the detection unit 30c detects the presence of the substrate W, a detection signal indicating the presence of the substrate W is sent to the control device 50. That is, the detection unit 30c detects the presence of the substrate W and sends a detection signal to the control device 50 for the control device 50 to grasp the timing of stopping the supply of the processing liquid.

As shown in FIG. 7 , the detection unit 30c is disposed between two adjacent conveying rollers 21. The detection unit 30c is preferably disposed at a position such that the detection signal sent to the control device 50 changes at the moment when the processing liquid is no longer sprayed onto the substrate W. For example, the detection unit 30c is preferably disposed between two conveying rollers 21 adjacent to each other near the water jet 40. The detection unit 30c has a pendulum member 30c1, a support shaft 30c2, a detection roller 30c3, a counterweight 30c4, a magnet 30c5, and a detection sensor 30c6.

The pendulum member 30c1 is swingably mounted on a mounting portion (not shown) provided on the inner wall of the processing chamber 10 with the support shaft 30c2 as the fulcrum. The pendulum member 30c1 is a straight plate member having one end and the other end. The pendulum member 30c1 can swing in the rotation direction R and the reverse direction R1 along the mounting portion (not shown) with the support shaft 30c2 as the center, in the plane formed by the direction perpendicular to the conveying direction of the substrate W and the conveying direction of the substrate W.

The detection roller 30c3 is rotatably mounted on one end of the pendulum member 30c1 using a mounting shaft not shown. A metal counterweight 30c4 is fixed to the other end of the pendulum member 30c1. The counterweight 30c4 is provided to achieve a weight balance with the detection roller 30c3. A magnet 30c5 is mounted in the counterweight 30c4.

The detection sensor 30c6 is mounted on a mounting portion (not shown) in such a manner that it is opposed to the magnet 30c5 with a small gap therebetween when the pendulum member 30c1 is at an initial position P1 (to be described later). The detection sensor 30c6 is connected to the control device 50 via an unillustrated electrical wiring. The detection sensor 30c6 detects changes in the magnetic field generated by the magnet 30c5 when the pendulum member 30c1 is at a detection position P2 (to be described later) or a detection position P3 (to be described later), that is, when the detection roller 30c3 is pressed under the substrate W. By detecting the change in the magnetic field of the magnet 30c5 generated when the detection roller 30c3 is pressed under the substrate W, the detection sensor 30c6 sends a signal of the detected substrate W to the control device 50.

The pendulum member 30c1 is positioned at the initial position P1 as shown in FIG7 without contacting the substrate W. The pendulum member 30c1 is positioned at the initial position P1, and the long side direction of the pendulum member 30c1 is parallel to the direction perpendicular to the conveying direction of the substrate W. At the initial position P1, the detection roller 30c3 is located at the height of the substrate W conveyed by the conveying device 20. In addition, when the substrate W moves along the conveying direction A1, it contacts the detection roller 30c3, and the pendulum member 30c1 rotates in the rotation direction R with the support shaft 30c2 as the center. The pendulum member 30c1 rotating in the rotation direction R is set at the detection position P2 as shown in FIG8.

The detection position P2 is the position of the detection unit 30c when the substrate W conveyed along the conveying direction A1 is pressed against the detection roller 30c3. As shown in FIG8 , when the pendulum member 30c1 rotates to the detection position P2, that is, when the substrate W is pressed against the detection roller 30c3, the long side direction of the pendulum member 30c1 rotates a predetermined angle in the rotation direction R with the support shaft 30c2 as the center relative to the direction perpendicular to the conveying direction of the substrate W. As a result, the magnet 30c5 leaves the detection sensor 30c6 in the rotation direction R.

Moreover, the detection position P3 is the position of the detection part 30c when the detection roller 30c3 is pressed down by the substrate W transported along the transport direction A2. When the substrate W moving along the transport direction A2 contacts the detection roller 30c3, the pendulum member 30c1 rotates a predetermined angle in the reverse direction R1 with the support shaft 30c2 as the center. And, the pendulum member 30c1 rotates to the detection position P3 as shown in FIG. 10. As a result, the magnet 30c5 moves away from the detection sensor 30c6 in the reverse direction R1.

Preferably, the distance between the detection roller 30c3 (mounting shaft not shown) and the support shaft 30c2 is set shorter than the distance between the support shaft 30c2 and the magnet 30c5 (counterweight 30c4). As a result, the pendulum member 30c1 can rotate from the detection position P2 (detection position P3) in the reverse direction R1 (rotation direction R) and return to the initial position P1.

First, a method for stopping the supply of the processing liquid from the water jet 40 when the ejection direction guide plate 42 of the water jet 40 is at the first rotation position is described. As shown in FIG7 , when the ejection direction guide plate 42 of the water jet 40 is at the first rotation position, the detection roller 30c3 is pressed by the back side of the substrate W while the substrate W is being transported along the transport direction A1. Therefore, the pendulum member 30c1 rotates from the initial position P1 shown in FIG7 to the detection position P2 shown in FIG8 in the rotation direction R with the support shaft 30c2 as the center.

By rotating the pendulum member 30c1 in the rotation direction R with the support shaft 30c2 as the center, the magnet 30c5 also rotates in the rotation direction R with the support shaft 30c2 as the center. When the magnet 30c5 rotates, the magnet 30c5 moves from the state facing the detection sensor 30c6 shown in FIG7 to the position away from the detection sensor 30c6 shown in FIG8. Therefore, the magnetic field generated by the magnet 30c5 can no longer be detected by the detection sensor 30c6. The detection sensor 30c6 sends a detection signal indicating that the magnetic field can no longer be detected to the control device 50. The control device 50 that receives the detection signal determines that the substrate W has been detected.

The control device 50 confirms the conveying direction of the substrate W. When the control device 50 confirms that the substrate W is conveyed along the conveying direction A1, it determines that the conveying position of the substrate W is not the position where the end of the substrate W on the downstream side in the conveying direction passes directly under the water jet 40. At this time, the control device 50 maintains the control of each part such as the conveying device 20 or the water jet 40 in the same manner as before the judgment related to the conveying position of the substrate W.

When the substrate W is further transported in the transport direction A1 and the substrate W leaves the detection roller 30c3, the pendulum member 30c1 rotates in the reverse direction R1 by the force of gravity and returns to the initial position P1 from the detection position P2. When the pendulum member 30c1 returns to the initial position P1, the magnet 30c5 returns from the state of being away from the detection sensor 30c6 to the state of facing the detection sensor 30c6. When the magnet 30c5 returns to the state of facing the detection sensor 30c6, the magnetic field of the magnet 30c5 is detected by the detection sensor 30c6. When the detection sensor 30c6 detects the magnetic field of the magnet 30c5, the detection sensor 30c6 stops sending a detection signal to the control device 50 indicating that the magnetic field can no longer be detected. Therefore, the control device 50 recognizes that the magnetic field of the magnet 30c5 has been detected, and determines that the substrate W has not been detected.

The control device 50 confirms the conveying direction of the substrate W. When the control device 50 confirms that the substrate W is conveyed along the conveying direction A1, it determines that the conveying position of the substrate W is the position where the end of the substrate W on the downstream side in the conveying direction passes directly under the water jet 40. At this time, the control device 50 stops the supply of the processing liquid from the water jet 40 after a few seconds from the time when it is determined that the conveying position of the substrate W is the position where the end of the substrate W on the downstream side in the conveying direction passes directly under the water jet 40. In this way, compared with the case where the supply of the processing liquid is stopped after the detection unit 30b detects the substrate W, the supply of the processing liquid can be stopped immediately after the processing liquid is no longer sprayed onto the substrate W. Therefore, the consumption of the processing liquid can be suppressed.

Next, a method for stopping the supply of the processing liquid from the water jet 40 when the ejection direction guide plate 42 of the water jet 40 is at the second rotation position is described. As shown in FIG9 , when the ejection direction guide plate 42 of the water jet 40 is at the second rotation position, the detection roller 30c3 is pressed by the back side of the substrate W while the substrate W is being transported along the transport direction A2. Therefore, the pendulum member 30c1 rotates from the initial position P1 shown in FIG9 to the detection position P3 shown in FIG10 in the reverse direction R1 with the support shaft 30c2 as the center.

By rotating the pendulum member 30c1 in the reverse direction R1 with the support shaft 30c2 as the center, the magnet 30c5 also rotates in the reverse direction R1 with the support shaft 30c2 as the center. When the magnet 30c5 rotates, the magnet 30c5 moves from the state facing the detection sensor 30c6 shown in FIG9 to the position away from the detection sensor 30c6 shown in FIG10. Therefore, the magnetic field generated by the magnet 30c5 can no longer be detected by the detection sensor 30c6. The detection sensor 30c6 sends a detection signal indicating that the magnetic field can no longer be detected to the control device 50. The control device 50 that receives the detection signal determines that the substrate W has been detected.

The control device 50 confirms the conveying direction of the substrate W. When the control device 50 confirms that the substrate W is conveyed along the conveying direction A2, it determines that the conveying position of the substrate W is the position where the end of the substrate W on the downstream side in the conveying direction passes directly under the water jet 40. At this time, the control device 50 stops the supply of the processing liquid from the water jet 40 after a few seconds from the time when it is determined that the conveying position of the substrate W is the position where the end of the substrate W on the downstream side in the conveying direction passes directly under the water jet 40. In this way, compared with the case where the supply of the processing liquid is stopped after the detection unit 30a detects the substrate W, the supply of the processing liquid can be stopped immediately after the processing liquid is no longer sprayed onto the substrate W. Therefore, the consumption of the processing liquid can be suppressed.

As described above, according to the fifth embodiment, as in the first embodiment, it is possible to prevent the processing line from becoming longer and the overall size of the device from becoming larger. Furthermore, it is possible to suppress the consumption of the processing liquid.

The substrate processing device 1 supplies the processing liquid from one end of the substrate W to the other end while the substrate W is reciprocating on the transport path H1. Therefore, the position of the end of the substrate W on the downstream side in the transport direction where the processing liquid is sprayed is different when the transport roller 21 rotates forward and reversely. Corresponding to the difference in the position where the processing liquid is initially sprayed on the substrate W when the transport roller 21 rotates forward and reversely, the length of the processing chamber 10 in the transport direction must be lengthened. Therefore, it takes time from when the processing liquid is no longer sprayed on the substrate W until the end of the substrate W on the downstream side in the transport direction is detected by the detection unit 30a or the detection unit 30b.

Therefore, by using the detection unit 30c to detect the presence or absence of the substrate W, the time for supplying the processing liquid in vain can be reduced. As a result, the consumption of the processing liquid can be suppressed. In order to reduce the time for supplying the processing liquid in vain, the detection unit 30c is preferably located at the following position, that is, the moment the processing liquid is no longer sprayed onto the substrate W, the detection signal sent to the control device 50 changes. For example, the detection unit 30c is preferably located near the water jet 40 and between two adjacent conveying rollers 21. In addition, as to how many seconds after the control device 50 determines that the substrate W is detected, the supply of the processing liquid from the water jet 40 is stopped, it can be obtained in advance through experiments or simulations.

Furthermore, stopping the ejection of the processing liquid by the detection unit 30c is preferred when the substrate processing device 1 cleans a plurality of substrates W having different lengths in the direction parallel to the conveying direction. For example, the substrate processing device 1 is formed so that the length of the substrate W in the conveying direction in the processing chamber 10 is the smallest for the substrate W having the longest length in the direction parallel to the conveying direction. In this case, for the substrate W having the longest length in the direction parallel to the conveying direction, the processing line of the substrate W can be prevented from becoming enlarged.

However, for other types of substrates W, the processing line of the substrate W becomes large. In this case, the ejection of the processing liquid is stopped by the detection unit 30c, thereby reducing the time for supplying the processing liquid in vain. As a result, the consumption of the processing liquid can be suppressed.

In addition, the fifth embodiment has been described with respect to the differences from the first embodiment, but at least one of the second to fourth embodiments may be combined and implemented.

<Other implementation methods>

In the above description, the water jet 40 (140, 240) is arranged with its long side direction along a direction perpendicular to the conveying direction A1 in the horizontal plane, but the present invention is not limited thereto. The long side direction of the water jet 40 (140, 240) may also be arranged in a direction obliquely intersecting the conveying direction A1 in the horizontal plane.

Furthermore, the above description explains that the processing liquid is supplied toward the upstream side of the conveying direction of the substrate W by rotating the ejection direction guide plate 42 (142, 242), but the present invention is not limited thereto. For example, the processing liquid may be supplied toward the downstream side of the conveying direction by rotating the ejection direction guide plate 42. If the processing liquid is supplied toward the downstream side of the conveying direction, the processing liquid supplied to the substrate W can be suppressed from flowing toward the upstream side of the conveying direction on the substrate W. Thus, when processing a substrate W with a dry surface, the processing liquid supplied from the water jet 40 (140, 240) can be suppressed from flowing to the dry surface on the upstream side of the conveying direction on the substrate W. The processing liquid ejected from the water jet 40 (140, 240) is sequentially supplied to the dry surface of the substrate W as the substrate W is transported, so that the processing can be performed uniformly.

Furthermore, in the above description, the following is explained, that is, the substrate W is detected by the detection unit 30a or the detection unit 30b, but the substrate W can also be detected by the detection unit 30c instead of the detection unit 30a or the detection unit 30b.

Furthermore, the above description explains that, when there is a substrate W on the downstream side of the transport path H1 in the transport direction, when the end of the substrate W on the downstream side of the transport direction is detected by the detection unit 30a or the detection unit 30b, a detection signal is sent to the control device 50 to temporarily stop the ejection of the processing liquid from the water jet 40, but the present invention is not limited thereto. Alternatively, when there is a substrate W on the upstream side of the transport path H1 in the transport direction, the ejection of the processing liquid from the water jet 40 is temporarily stopped after a predetermined time has passed since the end of the substrate W on the downstream side of the transport direction is detected by the detection unit 30a or the detection unit 30b.

As mentioned above, it takes time from when the processing liquid stops being sprayed onto the substrate W until the end of the substrate W on the downstream side in the transport direction is detected by the detection unit 30a or the detection unit 30b. Therefore, when there is a substrate W on the upstream side in the transport direction in the transport path H1, the time from when the end of the substrate W on the downstream side in the transport direction is detected by the detection unit 30a or the detection unit 30b until the processing liquid stops being sprayed onto the substrate W is calculated in advance, and this time is stored in the control device 50 as the specified time. In this way, the time for supplying the processing liquid in vain can be reduced. As a result, the consumption of the processing liquid can be suppressed. In addition, the specified time can be calculated in advance by experiments or simulations.

Moreover, when there is a substrate W on the upstream side of the transport direction in the transport path H1, the ejection of the processing liquid is stopped after a predetermined time has passed since the end of the substrate W on the downstream side of the transport direction is detected by the detection unit 30a or the detection unit 30b. Similar to the detection unit 30c, it is preferred when the substrate processing apparatus 1 cleans a plurality of substrates W having different lengths in a direction parallel to the transport direction.

Moreover, in the above description, the detection unit 30a, the detection unit 30b, and the detection unit 30c detect a specified portion of the substrate W (for example, the end portion of the substrate W on the downstream side in the conveying direction), but it is not limited to this. For example, the control device 50 that determines the conveying position of the substrate W based on the time point when the detection unit 30a, the detection unit 30b, and the detection unit 30c detect the substrate W is also included in the detection unit. That is, the control device 50 detects the conveying position of the substrate W based on the time when the detection unit 30a, the detection unit 30b, and the detection unit 30c detect the substrate W or the conveying speed of the substrate W.

Furthermore, in the description of the second embodiment, the substrate W is transported along the transport direction A1 while being supplied with the first processing liquid, and transported along the transport direction A2 while being supplied with the second processing liquid, but the present invention is not limited thereto. For example, the substrate W may be transported along the transport direction A1 and the transport direction A2 while being supplied with the first processing liquid two or more times, and then switched to the second processing liquid. Similarly, the second processing liquid may be supplied two or more times.

Furthermore, although the first treatment liquid and the second treatment liquid are used as examples for explanation, three or more treatment liquid supply sources may be connected to the water jet 40 so that treatment with three or more treatment liquids can be performed. In this case, the treatment with each treatment liquid may be performed once or multiple times.

Furthermore, in the description of the third embodiment, the center S (rotation axis) of the rotation axis 143 is set at a position offset toward the downstream side of the conveying direction A1 relative to the center C of the width of the opening of the storage section 141, but it may also be set at a position offset toward the upstream side of the conveying direction A1. In this case, when the processing liquid is sprayed toward the upstream side of the conveying direction A1, the slit width becomes narrower than when the processing liquid is sprayed toward the upstream side of the conveying direction A2, so the spraying pressure becomes stronger.

Furthermore, in the description of the fourth embodiment, the rear end portion 242b is formed by an elastic member, but the ejection direction guide plate 242 may be formed of the same elastic material as a whole, and the front end portion 242a and the rear end portion 242b may be formed of different materials. As long as at least the rear end portion 242b is formed by an elastic member, the slit width can be adjusted. Furthermore, if the front end portion 242a is formed by a rigid material (a material with higher rigidity than the rear end portion 242b), the phenomenon that the slit width changes due to the weight of the ejected treatment liquid can be suppressed.

Furthermore, in the description of the fifth embodiment, the supply of the processing liquid is stopped by a detection sensor 30c6, but a plurality of detection sensors 30c6 may be provided in the processing chamber 10. For example, the detection sensor 30c6 may be provided between the water jet 40 and the outlet 12.

Furthermore, in the description of the fifth embodiment, the detection sensor 30c6 detects the magnetic field generated by the magnet 30c5, but it can also detect detection light or load, and can also detect the situation where the pendulum component 30c1 and the detection sensor 30c6 are in contact and conductive.

Several embodiments of the present invention have been described above, but these embodiments are provided as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms and can be omitted, replaced, and modified in various ways without departing from the scope of the invention. These embodiments or their variations are included in the scope or subject matter of the invention and are included in the invention described in the claim form and its equivalent scope.

1: Substrate processing equipment

10: Processing room

11: Move in entrance

12: Move out

20: Transport device

21: Transport roller

21a: Roller

21b: Axis

30a, 30b: Detection unit

40: Water jet

41: Storage Department

42: Spray direction guide plate

42a: Front end

42b: rear end

43: Rotation axis

50: Control device

A1: Transportation direction

H1: Transport path

W: Substrate

Claims (8)

A substrate processing device includes: a conveying device capable of conveying a substrate in two directions, one direction and a reverse direction, along a conveying path; and a water jet disposed above the conveying path of the substrate, with the long side direction disposed along a direction intersecting the conveying path in a horizontal plane, and spraying a processing liquid from a slit-shaped opening toward the conveying path, wherein the water jet includes: a storage portion having an opening on the side of the conveying path and capable of storing the processing liquid; a spray direction guide plate disposed in a manner such that one end protrudes from the opening and the other end enters the interior of the storage portion, and guides the spray direction of the processing liquid; and a spray direction changing portion, which rotates the spray direction guide plate to change the spray direction of the processing liquid. The substrate processing device as described in claim 1 further includes: a detection unit for detecting the conveying position of the substrate, and based on the conveying position detected by the detection unit, the ejection direction guide plate is rotated by the ejection direction changing unit to eject the processing liquid from the water jet toward the upstream of the conveying direction of the substrate. The substrate processing device as described in claim 2, wherein the water jet is connected to a plurality of processing liquid supply sources, and the spraying direction of the processing liquid sprayed from the water jet is switched when the substrate is transported in the one direction and when the substrate is transported in the reverse direction. A substrate processing device as described in any one of claims 1 to 3, wherein the water jet is capable of changing the width of the slit-shaped opening. A substrate processing device as described in claim 4, wherein the ejection direction changing portion is a rotation axis to which the ejection direction guide plate is fixed, and the rotation axis is arranged at a position offset from the center in the width direction of the opening. A substrate processing device as described in claim 4, wherein the rear end portion of the ejection direction guide plate that abuts against the interior of the storage portion is provided using an elastic member. A substrate processing device as described in claim 2 or 3, wherein the transport position of the substrate when the supply of the processing liquid is stopped is a position where the upstream end of the substrate in the transport direction passes directly below the water jet. The substrate processing device as described in any one of claims 1 to 3 further includes: a control device that controls the conveying device or the water jet; and a detection unit that detects the presence of the substrate and sends a detection signal to the control device for the control device to grasp the timing of stopping the supply of the processing liquid.