TWI732089B - Display panel and manufacturing method thereof - Google Patents

Abstract

A display panel and a manufacturing method thereof are provided. The display panel includes a first substrate, a plurality of light-emitting diodes, a second substrate and a circuit wiring. The first substrate includes a plurality of sub-substrates joined to one another. The first substrate is disposed on the second substrate. The light-emitting diodes are disposed on each sub-substrate. The circuit wiring is located on the second substrate rather than the first substrate. Each light-emitting diode is electrically connected to the circuit wiring.

Description

Display panel and manufacturing method thereof

The present invention relates to a display panel and a manufacturing method thereof, and more particularly to a display panel having a light-emitting diode and a manufacturing method thereof.

With the maturity of optoelectronic technology, display technology continues to develop towards miniaturization. One type of display is a micro-LED display or an organic light-emitting diode (OLED) display. This type of display adopts active light-emitting display technology and does not need to be equipped with an additional backlight light source, so the display can be further thinned .

Taking a micro light emitting diode display as an example, due to the extremely small size of the micro light emitting diode, the transfer technology of the micro light emitting diode is facing challenges. For example, when the micro light emitting diode is transferred from the carrier board to the array substrate, it is easy to cause misalignment. If it is applied to a large-size display panel, it is impossible to ensure that all the miniature light-emitting diodes can be successfully transferred, and there may even be damage or poor bonding, which affects the quality of the display panel produced.

The present invention relates to a display panel and a manufacturing method thereof. Within the capability of the device, a plurality of light-emitting diodes are fabricated on a plurality of sub-substrates, and these sub-substrates are combined on a second substrate to avoid the above-mentioned problems.

According to one aspect of the present invention, a display panel is provided. The display panel includes a first substrate, a plurality of light emitting diodes, a second substrate and a circuit wiring. The first substrate includes a plurality of sub-substrates spliced with each other, and the first substrate is disposed on the second substrate. Several light-emitting diodes are arranged on each sub-substrate. The circuit wiring is located on the second substrate but not on the first substrate, and each light emitting diode system is electrically connected to the circuit wiring.

According to another aspect of the present invention, a method for manufacturing a display panel is provided. The manufacturing method includes the following steps. A plurality of light-emitting diodes are arranged on the plurality of sub-substrates. A circuit wiring is arranged on a second substrate but not on these sub-substrates. The sub-substrates are combined on the second substrate so that the light-emitting diodes are electrically connected to the circuit wiring.

In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows:

1, 2, 3, 3’, 4, 4’: display panel

10: The first substrate

100: Sub-substrate

101: second groove

20: second substrate

201: Fourth Groove

22: circuit wiring

221: Gate Line

222: Data Line

223: The first signal line

224: second signal line

225: first electrode contact

226: second electrode contact

30: LED

301: first electrode

302: second electrode

40: Insulation layer

401: first piercing

402: second perforation

50: Color filter layer

501, 502, 503: color conversion area

60: first insulating layer

601: first groove

70: second insulating layer

701: third groove

80: insulating layer

801: first piercing

802: second piercing

D1, D2: distance

P1: Sub-pixel structure

FIG. 1 is a schematic diagram of a sub-substrate according to an embodiment of the present invention, and several light-emitting diodes are arranged on the sub-substrate.

FIG. 2 is a schematic diagram of a first substrate according to an embodiment of the present invention. The first substrate is formed by splicing several sub-substrates with each other.

FIG. 3 is a schematic diagram of the first substrate being disposed on the second substrate in an embodiment of the present invention.

FIG. 4 is a partial cross-sectional view of a display panel according to an embodiment of the invention.

FIG. 5 is a partial cross-sectional view of a display panel according to another embodiment of the invention.

6A and 6B show partial cross-sectional views of display panels according to some embodiments of the present invention.

7A and 7B are partial cross-sectional views of display panels according to other embodiments of the present invention.

Various embodiments are proposed below for detailed description. The present invention does not show all possible embodiments, and other embodiments not proposed by the present invention can also be applied. Furthermore, the size ratios in the drawings are not drawn in proportion to the actual products. Therefore, the contents of the description and illustrations are only used to describe the embodiments, rather than to limit the scope of protection of the present invention. In addition, some elements are omitted from the drawings in the embodiments to clearly show the technical features of the present invention. In the following, the same/similar symbols represent the same/similar elements or steps for description.

Please refer to FIG. 1, which shows a schematic diagram of a sub-substrate 100 according to an embodiment of the present invention. The plurality of light emitting diodes 30 are disposed on the sub-substrate 100, for example, arranged in an array on the sub-substrate 100. In one embodiment, the light-emitting diode 30 is a miniature light-emitting diode, which can be transferred from a carrier to the sub-substrate 100, such as by adhesion, electrostatic adsorption, vacuum attraction, etc., to the sub-substrate 100. Here, 9×9 light-emitting diodes 30 are arranged on a sub-substrate 100 as an example. However, it should be understood that the light-emitting diodes of the present invention The number of bodies 30 is not limited to this, and the number of sub-substrates 100 of suitable size and the number of light-emitting diodes 30 arranged on it can be selected according to the equipment capacity of the actual transfer machine.

Next, please refer to FIG. 2, which shows a schematic diagram of a first substrate 10 according to an embodiment of the present invention. After the light emitting diodes 30 are transferred to the sub-substrates 100 according to the example in FIG. 1, the sub-substrates 100 are joined to each other to form the first substrate 10 with a large area. The size of the first substrate 10 can be determined by the size and number of the sub-substrates 100 to be spliced. For example, the sub-substrates 100 of suitable size and number can be selected according to the display screen ratio of the manufactured display panel, and then the sub-substrates 100 can be connected to each other. Stitched together. Here, the distance D1 between two adjacent light-emitting diodes 30 at the junction of two adjacent sub-substrates 100 is substantially equal to the distance D2 between two adjacent light-emitting diodes 30 in one sub-substrate 100.

It should be particularly noted that the first substrate 10 completed in this step does not include any circuit wiring, that is, there is no circuit wiring between the light-emitting diodes 30 connected to each other.

Next, please refer to FIG. 3, which illustrates a schematic diagram of the first substrate 10 being disposed on the second substrate 20 in an embodiment of the present invention. A circuit wiring 22 is provided on the second substrate 20, but not on the first substrate 10, and each light-emitting diode 30 is electrically connected to the circuit wiring 22.

In detail, please refer to the enlarged view of a sub-pixel structure P1 in FIG. 3. Each sub-pixel structure P1 corresponds to a light emitting diode 30. The circuit wiring 22 includes a plurality of gate lines 221, a plurality of data lines 222, a plurality of first signal lines 223, and a plurality of second signal lines 224. The first signal line 223 is electrically connected to the first electrode contact 225, and the second signal line 224 is electrically connected to the second electrode contact 226. When the first substrate 10 is placed on the second substrate 20 At this time, the first electrode (for example, an N-type electrode) of each light-emitting diode 30 is connected to a corresponding first electrode contact 225, and the second electrode (for example, a P-type electrode) of each light-emitting diode 30 It is connected to a corresponding second electrode contact 226 so that each light-emitting diode 30 is electrically connected to the circuit wiring 22. In other words, each light emitting diode 30 can be individually controlled via the circuit wiring 22.

In one embodiment, the first substrate 10 is, for example, in an inverted manner, so that the first electrode 301 and the second electrode 302 (marked in FIG. 4) of each light-emitting diode 30 face the corresponding first electrode contacts 225 and the second electrode contact 226. Here, the first electrode 301 and the second electrode 302 of the light-emitting diode 30 can be electrically connected to the corresponding first electrode contact 225 and the second electrode contact 226 through an anisotropic conductive film or solder contact. , It is electrically connected to the circuit wiring 22.

Please refer to FIG. 4, which shows a partial cross-sectional view of the display panel 1 according to an embodiment of the present invention. The first signal line 223 and the second signal line 224 are formed on the second substrate 20. The display panel 1 further includes an insulating layer 40 disposed on the second substrate 20, the first signal line 223 and the second signal line 224, and the first electrode contact 225 and the second electrode contact 226 are disposed on the insulating layer 40 . The insulating layer 40 has a plurality of first through holes 401 and a plurality of second through holes 402. The first electrode contacts 225 are electrically connected to the corresponding first signal lines 223 through the corresponding first through holes 401, and the second electrode contacts 226 is electrically connected to the corresponding second signal line 224 through the corresponding second through hole 402.

In this embodiment, the first substrate 10 (or each sub-substrate 100) may be a plain glass substrate or a flexible substrate. In some embodiments, the light-emitting diode 30 may be a blue light-emitting diode, a red light-emitting diode, a green light-emitting diode, a white light-emitting diode, etc. Or a combination. Each light emitting diode 30 displaying different colors is arranged corresponding to a set of first electrode contacts 225 and second electrode contacts 226, so that the display panel 1 can display various colors.

After the above-mentioned pairing of the first substrate 10 and the second substrate 20 is completed, the electrical inspection procedure can be performed on the display panel 1 or the second substrate 20, or before the pairing of the first substrate 10 and the second substrate 20 , Perform an electrical inspection program on the first substrate 10 or the sub-substrate 100, and then detect whether any light-emitting diode 30 is damaged and cannot emit light normally. Here, if a defective light emitting diode 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

Please refer to FIG. 5, which shows a partial cross-sectional view of a display panel 2 according to another embodiment of the present invention. Different from the embodiment in FIG. 4, the display panel 2 further includes a color filter layer 50 disposed on each sub-substrate 100. During the production, a color filter layer 50 is provided on each sub-substrate 100 first. Then, several light-emitting diodes 30 are disposed on the color filter layer 50 of each sub-substrate 100. Then, the pairing of the first substrate 10 and the second substrate 20 is performed.

The color filter layer 50 may include a plurality of color conversion regions 501, 502, and 503, and the color conversion regions 501, 502, and 503 are respectively correspondingly disposed between each light-emitting diode 30 and each sub-substrate 100. In one embodiment, the color conversion areas 501, 502, 503 can be, for example, quantum dot layers, color resist layers, or other suitable materials or a combination of the above, and the color conversion areas 501, 502, 503 can adopt different colors for color conversion. The material is, for example, red, green, and blue color conversion materials, and the light-emitting diode 30 may be a white light-emitting diode. In this way, the display panel 2 can display various colors.

After the above-mentioned pairing of the first substrate 10 and the second substrate 20 is completed, an electrical inspection procedure can be performed on the display panel 2 or the second substrate 20, or on the first substrate 10 and the second substrate 20. Before the pairing of the second substrate 20, an electrical inspection procedure is performed on the first substrate 10 or the sub-substrate 100 to detect whether any light-emitting diode 30 is damaged and cannot emit light normally. Here, if a defective light emitting diode 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

Please refer to FIGS. 6A and 6B, which illustrate partial cross-sectional views of the display panels 3, 3'according to some embodiments of the present invention. Please refer to FIG. 6A. The difference from the embodiment in FIG. 4 is that the display panel 3 further includes a first insulating layer 60 disposed on each of the sub-substrates 100. During production, a first insulating layer 60 is provided on each sub-substrate 100 first. Next, a plurality of first grooves 601 are formed in the first insulating layer 60, and then a plurality of light-emitting diodes 30 are disposed in the corresponding first grooves 601 to improve the transfer accuracy of the light-emitting diodes 30. Then, the pairing of the first substrate 10 and the second substrate 20 is performed.

The first insulating layer 60 may include a color conversion material or a photoresist material, and the first groove 601 may be formed by exposing and developing the color conversion material or the photoresist material. Furthermore, the first insulating layer 60 may further include a black matrix to reduce the occurrence of light mixing.

In another embodiment, please refer to FIG. 6B. The difference from the embodiment in FIG. 6A is that the display panel 3'does not have the first insulating layer 60. On the contrary, during production, a plurality of second grooves 101 are formed in each sub-substrate 100, for example, a plurality of second grooves 101 are formed by etching the sub-substrate 100, and then a plurality of light-emitting diodes 30 are arranged In the corresponding second groove 101 to improve the transfer accuracy of the light-emitting diode 30. Then, the pairing of the first substrate 10 and the second substrate 20 is performed.

After the above-mentioned pairing of the first substrate 10 and the second substrate 20 is completed, the electrical inspection process can be performed on the display panel 3, 3'or the second substrate 20, or on the first substrate Before the pairing of 10 and the second substrate 20, an electrical inspection procedure is performed on the first substrate 10 or the sub-substrate 100 to detect whether any light-emitting diode 30 is damaged and cannot emit light normally. Here, if a defective light emitting diode 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

Please refer to FIGS. 7A and 7B, which show partial cross-sectional views of display panels 4, 4'according to other embodiments of the present invention. Please refer to FIG. 7A. The difference from the embodiment in FIG. 4 is that the display panel 4 further includes a second insulating layer 70 disposed on the second substrate 20. In detail, the second insulating layer 70 is disposed on the insulating layer 40. The second insulating layer 70 can include a color conversion material or a photoresist material, and can be formed in the color conversion material or photoresist material by exposure and development. The third groove 701, and the first electrode contact 225 and the second electrode contact 226 of the circuit wiring 22 are respectively exposed from each third groove 701. When the first substrate 10 and the second substrate 20 are paired, each light-emitting diode 30 is substantially aligned with the first electrode contact 225 and the second electrode contact 226 in the corresponding third groove 701 to improve The accuracy of the group. That is to say, in this embodiment, the display panel 4 can be manufactured with the technology of manufacturing a color filter layer (Color filter On Array, COA) on the array substrate (ie, the second substrate 20). Although FIG. 7A shows the insulating layer 40 and the second insulating layer 70 as a two-layer structure, those skilled in the art will understand that the insulating layer 40 and the second insulating layer 70 can be a single layer or a two-layer structure.

In another embodiment, please refer to FIG. 7B. The difference from the embodiment in FIG. 7A is that the display panel 4'does not have the second insulating layer 70. On the contrary, during production, a plurality of fourth grooves 201 are formed in the second substrate 20, for example, a plurality of fourth grooves 201 are formed by etching the second substrate 20, and then the circuit wiring 22 is fabricated on the fourth groove 201. In the groove 201.

In detail, the first signal line 223 and the second signal line 224 are formed in the fourth groove 201. The display panel 4'further includes an insulating layer 80 disposed in the fourth groove 201 and covering the first signal line 223 and the second signal line 224. The first electrode contact 225 and the second electrode contact 226 are disposed in On the insulating layer 80. The insulating layer 80 has a plurality of first through holes 801 and a plurality of second through holes 802. The first electrode contacts 225 are electrically connected to the corresponding first signal lines 223 through the corresponding first through holes 801, and the second electrode contacts 226 is electrically connected to the corresponding second signal line 224 through the corresponding second through hole 802. Thereby, the first electrode contact 225 and the second electrode contact 226 of the circuit wiring 22 are exposed from the respective fourth grooves 201, respectively. When the first substrate 10 and the second substrate 20 are paired together, each light-emitting diode 30 is substantially aligned with the first electrode contact 225 and the second electrode contact 226 in the corresponding fourth groove 201 to enhance The accuracy of the group.

After the above-mentioned pairing of the first substrate 10 and the second substrate 20 is completed, electrical inspection procedures can be performed on the display panels 4, 4'or the second substrate 20, or on the first substrate 10 and the second substrate 20. Before grouping, an electrical inspection procedure is performed on the first substrate 10 or the sub-substrate 100 to detect whether any light-emitting diode 30 is damaged and cannot emit light normally. Here, if a defective light emitting diode 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

In summary, according to the above-mentioned embodiment, a number of light-emitting diodes (for example, miniature light-emitting diodes) are first arranged on a number of sub-substrates. On the other hand, a circuit wiring is arranged on a second substrate but not on these sub-substrates. Then, the sub-substrates are disposed on the second substrate, for example, the sub-substrates are joined to each other to form a first substrate, and the first substrate is disposed on the second substrate to electrically connect the light-emitting diodes In the circuit Wiring. In this way, each light emitting diode on the first substrate can be individually controlled by the circuit wiring on the second substrate. At the same time, the first substrate produced in this way is not limited by the equipment capacity of the transfer machine, so it can meet the needs of today's large-size display screen. Furthermore, after the pairing of the first substrate and the second substrate is completed, the electrical inspection procedure can be performed on the display panel or the second substrate, or before the pairing of the first substrate and the second substrate, the first substrate Or the sub-substrate undergoes an electrical inspection program to detect whether any light-emitting diodes are damaged. The damaged light-emitting diodes can be replaced or repaired immediately without affecting the circuit wiring.

In addition, the above-mentioned step of disposing a plurality of light-emitting diodes on a plurality of sub-substrates may further include the following various embodiments and their modifications. In one embodiment, a color filter layer can be provided on each sub-substrate first, and then a plurality of light-emitting diodes can be provided on the color filter layer of each sub-substrate, so that the display panel can display various colors. In some embodiments, a first insulating layer may be provided on each sub-substrate first, and a plurality of first grooves may be formed in the first insulating layer. Alternatively, several second grooves can also be directly formed in each sub-substrate. Then, several light-emitting diodes are arranged in the corresponding first grooves or second grooves to improve the transfer accuracy of the light-emitting diodes.

Furthermore, the above steps of disposing the circuit wiring on the second substrate but not on the sub-substrates may further include the following various embodiments and their modifications. In one embodiment, a second insulating layer may be disposed on the second substrate. The second insulating layer has a plurality of third grooves, and the plurality of electrode contacts of the circuit wiring are respectively exposed in the third grooves. Then, each light-emitting diode can be substantially aligned with each electrode contact in the corresponding third groove to improve the accuracy of the pairing. In another embodiment, several fourth grooves can be directly formed in the second substrate, Then, the circuit wiring is fabricated in the fourth groove, and several electrode contacts are exposed. Then, each light-emitting diode can be substantially aligned with each electrode contact in the corresponding fourth groove to improve the accuracy of the pairing.

In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

10: The first substrate

20: second substrate

22: circuit wiring

221: Gate Line

222: Data Line

223: The first signal line

224: second signal line

225: first electrode contact

226: second electrode contact

30: LED

P1: Sub-pixel structure

Claims (10)

A display panel includes: a first substrate including a plurality of sub-substrates spliced with each other; a plurality of light-emitting diodes, a plurality of the light-emitting diodes are arranged on each of the sub-substrates A second substrate, the first substrate is set on the second substrate, and each of the light-emitting diodes on the sub-substrates substantially face the second substrate; and a circuit wiring located on the second substrate On the substrate but not on the first substrate, each of the light-emitting diode systems is directly electrically connected to the circuit wiring. The display panel described in item 1 of the scope of patent application, wherein each of the light-emitting diodes includes a first electrode and a second electrode, and the circuit wiring includes a plurality of first electrode contacts and a plurality of second electrode contacts , The first electrode of each light emitting diode is connected to the corresponding first electrode contacts, and the second electrode of each light emitting diode is connected to the corresponding second electrode contacts. According to the display panel described in claim 2, wherein the first electrode substantially faces the corresponding first electrode contacts, and the second electrode substantially faces the corresponding second electrode contacts . The display panel described in item 1 of the scope of patent application includes: A color filter layer is disposed on each of the sub-substrates. The color filter layer includes a plurality of color conversion regions, and the color conversion regions are respectively correspondingly disposed between each of the light-emitting diodes and each of the sub-substrates. The display panel described in item 1 of the scope of patent application further includes: a first insulating layer disposed on each of the sub-substrates, the first insulating layer has a plurality of first grooves, and each of the light-emitting diode systems is disposed In the corresponding first grooves. According to the display panel described in item 1 of the scope of patent application, each of the sub-substrates has a plurality of second grooves, and each of the light-emitting diode systems is disposed in the corresponding second grooves. The display panel described in item 1 of the scope of patent application further includes: a second insulating layer disposed on the second substrate, the second insulating layer having a plurality of third grooves, and a plurality of electrodes of the circuit wiring The contacts are respectively exposed in the third grooves, and the light-emitting diodes are substantially aligned with the electrode contacts in the corresponding third grooves. As for the display panel described in claim 1, wherein the second substrate has a fourth groove, the circuit wiring is arranged in the fourth groove, and a plurality of electrode contacts are exposed, each of the two light-emitting The pole bodies are substantially aligned with the corresponding electrode contacts. A method for manufacturing a display panel includes: arranging a plurality of light-emitting diodes on each of the plurality of sub-substrates; arranging a circuit wiring on a second substrate but not on the sub-substrates; and Combine the sub-substrates on the second substrate so that each of the light-emitting diodes is directly electrically connected to the circuit wiring, and each of the light-emitting diodes on the sub-substrates substantially faces the second substrate . According to the manufacturing method described in claim 9, wherein the step of combining the sub-substrates on the second substrate includes: joining the sub-substrates to each other to form a first substrate; and combining the first substrate with On the second substrate.

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