TWI738533B - Display panel and manufacturing method thereof - Google Patents

Abstract

A display panel is provided and includes: a substrate, a first wiring pattern, a connecting wire, a first printing pattern layer, and a second printing pattern layer. The substrate has a front surface and a back surface arranged oppositely, a side surface connecting the front surface and the back surface, and a first chamfered surface located between the front surface and the side surface. The first wiring pattern is arranged on the front surface. The connecting wire covers the first wiring pattern and extends at least from the front surface to the side surface via the first chamfered surface. The first printing pattern layer covers the connecting wire and extends at least from the front surface to the first chamfered surface. The second printing pattern layer covers at least a part of the first printing pattern layer and extends at least from the front surface to the first chamfered surface.

Description

Display panel and manufacturing method thereof

The present invention relates to a display panel and a manufacturing method thereof, and more particularly to a display panel capable of protecting connecting wires located on a side surface of a substrate and a manufacturing method thereof.

In a tiling display (tiling display), each display panel used for splicing must have a narrow frame; moreover, it is necessary to provide a connection line with a large enough area in the narrow frame to achieve low contact resistance.

However, it is not easy to wind the connecting wire around the border of the display panel. After the process of winding the connecting wire, the connecting wire will usually be broken or scratched at the chamfer. Therefore, the circuit of the display panel will have defects or function failures.

The present invention provides a display panel and a manufacturing method thereof, which can protect connection lines located at the border of the display panel, avoid the connection lines from being broken, and ensure the normal operation of the display panel.

The invention provides a display panel and a manufacturing method thereof, which can reduce the joints between a plurality of display panels in a spliced display, and improve the image display quality of the spliced display.

Based on the foregoing, an embodiment of the present invention provides a display panel including: a substrate, a first wiring pattern, a connecting line, a first printed pattern layer, and a second printed pattern layer. The substrate has a front surface and a back surface arranged oppositely, a side surface connecting the front surface and the back surface, and a first chamfered surface located between the front surface and the side surface. The first wiring pattern is arranged on the front side. The connecting wire covers the first wiring pattern and extends from the front to the side surface at least through the first chamfered surface. The first printed pattern layer covers the connecting lines and extends at least from the front surface to the first chamfered surface. The second printing pattern layer covers at least a part of the first printing pattern layer and extends at least from the front surface to the first chamfered surface.

In an embodiment of the present invention, a distance a is set between an end of the first printed pattern layer away from the side surface and the side surface. A distance b is set between the end of the second printed pattern layer away from the side surface and the side surface. A distance c is set between an end of the first wiring pattern close to the side surface and the side surface. A distance d is set between the end of the first chamfered surface away from the side surface and the side surface; and the following relationship is satisfied: a ≥ b ＞ c ≥ d, 30 μm ≤ a, 5 μm ≤ b, 0 ≤ d ≤ 65 μm.

In an embodiment of the present invention, the first printed pattern layer has a thickness f. The first printed pattern layer and the second printed pattern layer on the front surface have a total thickness g. The first printed pattern layer and the second printed pattern layer on the first chamfered surface have a total thickness h; and the following relationship is satisfied: g ＞ f ＞ 0, g ＞ h ＞ 0. In an embodiment of the present invention, the first printed pattern layer and the second printed pattern layer extend from the front surface to the side surface via the first chamfered surface. The first printed pattern layer and the second printed pattern layer on the side have a total thickness i; and the following relationship is satisfied: i ＞ g ＞ f ＞ 0, i ＞ g ＞ h ＞ 0, 5 μm ≤ i.

In an embodiment of the present invention, the materials of the first printed pattern layer and the second printed pattern layer are insulating glue; the first printed pattern layer and the second printed pattern layer extend from the front to the first chamfered surface, and Expose the connecting wires on the side. In an embodiment of the present invention, the display panel further includes: an electrical connection layer disposed on the connection line; and an external wiring layer of the glass disposed on the electrical connection layer.

In an embodiment of the present invention, the materials of the first printed pattern layer and the second printed pattern layer are conductive glue; the first printed pattern layer and the second printed pattern layer extend from the front side through the first chamfered surface to the side surface , And cover the connecting line on the side. In an embodiment of the present invention, the display panel further includes: an electrical connection layer disposed on the connection line; and an external wiring layer of the glass disposed on the electrical connection layer.

In an embodiment of the present invention, the shapes of the first printed pattern layer and the second printed pattern layer are: L shape or C shape.

In an embodiment of the present invention, the substrate further has: a second chamfered surface located between the side surface and the back surface. The connecting line, the first printed pattern layer and the second printed pattern layer extend from the front to the side via the first chamfered surface, and extend from the side to the back via the second chamfered surface.

In an embodiment of the present invention, the display panel further includes: a second wiring pattern disposed on the back surface. The connecting wires extending to the back cover the second wiring pattern and electrically connect the first wiring pattern and the second wiring pattern.

In an embodiment of the present invention, the substrate further has: a second chamfered surface located between the side surface and the back surface. The connecting line and the first printed pattern layer extend from the front to the side via the first chamfered surface, and extend from the side to the back via the second chamfered surface. The second printed pattern layer extends from the front surface to the first chamfered surface, and extends from the rear surface to the second chamfered surface.

In an embodiment of the present invention, a distance a is set between an end of the first printed pattern layer away from the side surface and the side surface. A distance b is set between the end of the second printed pattern layer away from the side surface and the side surface. A distance c is set between an end of the first wiring pattern close to the side surface and the side surface. A distance d is set between the end of the first chamfered surface away from the side surface and the side surface; and the following relationship is satisfied: a ＞ b ＞ c ≥ d, 30 μm ≤ a, 5 μm ≤ b, 0 ≤ d ≤ 65 μm. In an embodiment of the present invention, the first printed pattern layer has a first thickness f. The first printed pattern layer and the second printed layer on the front surface have a total thickness g. The first printed pattern layer and the second printed layer on the first chamfered surface have a total thickness h. The first printed pattern layer on the side has a thickness i'; and, the following relationship is satisfied: g ＞ i’ ＞ f ＞ 0, g ＞ i’ ＞ h ＞ 0.

In an embodiment of the present invention, the first wiring pattern includes: a plurality of first functional blocks and at least one second functional block; wherein, the pattern of the first printed pattern layer and the pattern of the second printed pattern layer They are stacked in a staggered manner, and are arranged above the plurality of first functional blocks. The pattern of the first printing pattern layer and the pattern of the second printing pattern layer overlap each other and are arranged above the second functional block. In an embodiment of the present invention, the first printed pattern layer has a thickness f. The first printed pattern layer and the second printed pattern layer on the front surface have a total thickness g. The first printed pattern layer and the second printed pattern layer overlapping each other on the side surface have a total thickness i. The first printed pattern layer and the second printed pattern layer stacked alternately on the side surface have a total thickness i''; and satisfy the following relationship: i ＞ i’’ ＞ 0, and i ＞ g ＞ f ＞ 0.

In an embodiment of the present invention, the above-mentioned display panel further includes: a plurality of pixel units arranged on the front surface of the substrate. Each pixel unit includes a red light emitting diode, a green light emitting diode, and a blue light emitting diode.

An embodiment of the present invention also provides a method for manufacturing a display panel, including: providing a substrate, the substrate having: a front surface and a back surface disposed oppositely, a side surface connecting the front surface and the back surface, and a first chamfer located between the front surface and the side surface Surface; forming a first wiring pattern on the front surface of the substrate; and forming a connection line on the substrate; wherein the method of forming the connection line includes: forming a film on the substrate to cover the first wiring pattern, and At least extend from the front to the side via the first chamfered surface; form a first printed pattern layer on the substrate, cover the film layer, and extend at least from the front to the first chamfered surface; and form a second printed pattern layer on the substrate , Covering at least a part of the first printing pattern layer and extending from the front to the first chamfered surface at least; and using the first printing layer and the second printing pattern layer as an etching mask to etch the film layer, and The connecting line is formed at least from the front surface to the side surface via the first chamfered surface.

Based on the above, the display panel and the manufacturing method thereof according to the embodiments of the present invention, by forming at least two printed pattern layers on the connecting line located on the border of the display panel, the connecting line can be protected well and avoiding the generation of the connecting line. To ensure the normal operation of the display panel. In addition, the first printed pattern layer covering the connecting line can be used as a topography buffer layer, and a flatter second printed pattern layer can be formed on the first printed pattern layer. Furthermore, when multiple display panels are spliced to form a spliced display, by controlling the thickness of the printed pattern layer on the side of the display panel, the seam between two adjacent display panels can be reduced, thereby improving the spliced display The quality of the image display.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

FIG. 1 is a three-dimensional schematic diagram of a display panel 100 according to an embodiment of the invention. 1, the display panel 100 includes a substrate 110, a first wiring pattern 120, a connection line 130, a first printing pattern layer 140, and a second printing pattern layer 150. The substrate 110 has a front surface 112 and a back surface 114 opposed to each other, a side surface 116 connecting the front surface 112 and the back surface 114, and a first chamfered surface 118 located between the front surface 112 and the side surface 116. The first wiring pattern 120 is disposed on the front surface 112. The connecting wire 130 covers the first wiring pattern 120 and extends at least from the front surface 112 to the side surface 116 via the first chamfered surface 118. The first printed pattern layer 140 covers the connecting line 130 and extends from the front surface 112 to the first chamfered surface 118 at least. The second printed pattern layer 150 covers at least a part of the first printed pattern layer 140 and extends at least from the front surface 112 to the first chamfered surface 118.

Please refer to FIG. 1, the display panel 100 may further include: a plurality of pixel units 160 disposed on the front surface 112 of the substrate 110. Each pixel unit 160 includes a red micro light emitting diode 162, a green micro light emitting diode 164, and a blue micro light emitting diode 166. Micro Light Emitting Diode (Micro Light Emitting Diode) has: self-luminescence, short response time, high luminous efficiency, low power consumption, high contrast, wide operating temperature range, high water and oxygen barrier, and long life. advantage. In another embodiment, the pixel unit 160 may also use a sub-millimeter light emitting diode (mini LED), and the present invention does not limit the type of light source.

Referring to FIG. 1, in the display panel 100, at least two printed pattern layers (that is, the first The printed pattern layer 140 and the second printed pattern layer 150); in the embodiment of FIG. 1, the first printed pattern layer 140 and the second printed pattern layer 150 pass from the front surface 112 of the substrate 110 through the first chamfered surface 118, Extends to the side 116; therefore, the connecting wire 130 can be well protected, avoiding breakage or damage of the connecting wire 130, and ensuring the normal operation of the display panel 100. Moreover, when a plurality of display panels 100 are spliced together, since the thickness of at least two printed pattern layers (ie, the first printed pattern layer 140 and the second printed pattern layer 150) is relatively thick, the operation margin of the splicing operation is ( handling margin) can become larger.

FIG. 2 is a schematic cross-sectional view of a display panel 100A according to an embodiment of the invention. In the following multiple embodiments, the size and thickness of each film layer can be set to obtain a film layer structure with better strength, and thus a better protection effect for the connecting line 130 can be produced.

2, in the display panel 100A, a distance a (that is, the length of the first printed pattern layer 140) is set between an end of the first printed pattern layer 140 away from the side surface 116 and the side surface 116. A distance b (that is, the length of the second printed pattern layer 150) is set between an end of the second printed pattern layer 150 away from the side surface 116 and the side surface 116. A distance c is set between an end of the first wiring pattern 120 close to the side surface 116 and the side surface 116 (that is, the shortest distance between the first wiring pattern 120 and the side surface 116). A distance d is set between the end of the first chamfered surface 118 away from the side surface 116 and the side surface 116 (that is, the chamfer width of the first chamfered surface 118); and the following relationship is satisfied: a ≥ b ＞ c ≥ d, 30 μm ≤ a, 5 μm ≤ b, 0 ≤ d ≤ 65 μm.

In Fig. 2 only the distance a is shown to be greater than the distance b. However, according to the relational expression set above, it can be known that the distance a may also be equal to the distance b; that is, the length of the first printed pattern layer 140 may be greater than or equal to the length of the second printed pattern layer 150.

Please continue to refer to FIG. 2, the first printed pattern layer 140 has a thickness f. The first printing pattern layer 140 and the second printing pattern layer 150 located on the front surface 112 have a total thickness g. The first printing pattern layer 140 and the second printing pattern layer 150 located on the first chamfered surface 118 have a total thickness h; and the following relationship is satisfied: g ＞ f ＞ 0, g ＞ h ＞ 0.

It can be noted that in the embodiment of FIG. 2, the first printed pattern layer 140 and the second printed pattern layer 150 extend from the front surface 112 to the first chamfered surface 118. On the connecting line of the side 116, the first printed pattern layer 140 and the second printed pattern layer 150 are not provided. It can be seen from FIG. 2 that by simultaneously disposing the first printed pattern layer 140 and the second printed pattern layer 150 on the first chamfered surface 118, the boundary of the display panel 100A (ie, the first The connecting wire 130 of the chamfered surface 118) is to prevent the connecting wire 130 from being broken.

Please refer to FIG. 2, the materials of the first printed pattern layer 140 and the second printed pattern layer 150 are insulating glue; the first printed pattern layer 140 and the second printed pattern layer 150 extend from the front surface 112 to the first chamfered surface 118 , And the connecting line 130 on the side 116 is exposed. The display panel 100A may further include: an electrical connection layer 170 disposed on the connection line 130; and a glass outer wiring layer 180 disposed on the electrical connection layer 170. Accordingly, the first printed pattern layer 140 and the second printed pattern layer 150 can be used to protect the connection line 130, and the connection line 130 is electrically connected to the glass outer wiring layer 180 via the electrical connection layer 170 Wherein, the electrical connection layer 170 is, for example, an anisotropic conductive film (Anisotropic Conductive Film, ACF), and the glass outer wiring layer 180 is, for example, a chip on film (COF).

FIG. 3 is a schematic cross-sectional view of a display panel 100B according to an embodiment of the invention. 3, in the display panel 100B, the first printed pattern layer 140 and the second printed pattern layer 150 extend from the front surface 112 to the side surface 116 through the first chamfered surface 118. The first printed pattern layer 140 and the second printed pattern layer 150 located on the side 116 have a total thickness i; and satisfy the following relationship: i ＞ g ＞ f ＞ 0, i ＞ g ＞ h ＞ 0, 5 μm ≤ i.

It can be noted that in the embodiment of FIG. 3, the first printed pattern layer 140 and the second printed pattern layer 150 extend from the front surface 112 to the side surface 116 via the first chamfered surface 118; therefore, on the connecting line of the side surface 116 , A first printing pattern layer 140 and a second printing pattern layer 150 are also provided. It can be seen from FIG. 3 that by simultaneously disposing the first printed pattern layer 140 and the second printed pattern layer 150 on the first chamfered surface 118, the boundary (ie, the side surface 116) of the display panel 100B can be well protected. , The connecting line 130 of the first chamfered surface 118) to avoid the connecting line 130 from being broken.

Referring to FIG. 3, the materials of the first printed pattern layer 140 and the second printed pattern layer 150 are conductive glue. The first printing pattern layer 140 and the second printing pattern layer 150 extend from the front surface 112 through the first chamfered surface 118 to the side surface 116 and cover the connecting lines 130 on the side surface 116. The display panel 100B may further include: an electrical connection layer 170 disposed on the connection line 130; and a glass outer wiring layer 180 disposed on the electrical connection layer 170. Accordingly, the first printed pattern layer 140 and the second printed pattern layer 150 can be used to protect the connecting line 130, and the first printed pattern layer 140, the second printed pattern layer 150, and the connecting line 130 can be used to pass through the electrical connection layer. 170, and is electrically connected to the glass external wiring layer 180; wherein, the electrical connection layer 170 is, for example, an anisotropic conductive film, and the glass external wiring layer 180 is, for example, a flip chip film.

In the embodiment of FIGS. 2 and 3, the shape of the first printing pattern layer 140 and the second printing pattern layer 150 is an L shape. In the following embodiments of FIGS. 4 and 5, the shape of the first printed pattern layer 140 and the second printed pattern layer 150 is a C shape. The present invention does not limit the shape of the first printed pattern layer 140 and the second printed pattern layer 150, as long as it is a shape that can cover the connecting line 130 appropriately.

4 is a schematic cross-sectional view of a display panel 100C according to an embodiment of the invention. 4, in addition to the first chamfered surface 118a, the substrate 110 also has a second chamfered surface 118b located between the side surface 116 and the back surface 114. The connecting line 130, the first printed pattern layer 140 and the second printed pattern layer 150 extend from the front surface 112 to the side surface 116 via the first chamfered surface 118a, and extend from the side surface 116 to the back surface 114 via the second chamfered surface 118b. .

Please refer to FIG. 4, the display panel 100C further includes: a second wiring pattern 120 b disposed on the back side 114. The connection line 130 extending to the back surface 114 covers the second wiring pattern 120b, and electrically connects the first wiring pattern 120a and the second wiring pattern 120b.

In the display panel 100C of FIG. 4, the distance a, the distance b, the distance c, and the distance d satisfy the following relationship: a ≥ b ＞ c ≥ d, 30 μm ≤ a, 5 μm ≤ b, 0 ≤ d ≤ 65 μm.

And, among the thickness f, the total thickness g, the total thickness h, and the total thickness i, the following relationship is satisfied: i ＞ g ＞ f ＞ 0, i ＞ g ＞ h ＞ 0, 5 μm ≤ i.

It can be noted that in the embodiment of FIG. 4, in addition to protecting the connection line 130 at the first chamfered surface 118a, the connection at the point indicated by arrow A in FIG. 4 (ie, the second chamfered surface 118b) The line 130 is also protected by the first printed pattern layer 140 and the second printed pattern layer 150, which can avoid the problem of fracture; and the first printed pattern layer 140 covering the connecting line 130 can be used as a terrain buffer layer ( topography buffer layer), and a flat second printed pattern layer 150 can be formed on the first printed pattern layer 140 to better cover the connecting lines 130.

FIG. 5 is a schematic cross-sectional view of a display panel 100D according to an embodiment of the invention. Referring to FIG. 5, in the display panel 100D, the distance a, the distance b, the distance c, and the distance d satisfy the following relationship: a ≥ b ＞ c ≥ d, 30 μm ≤ a, 5 μm ≤ b, 0 ≤ d ≤ 65 μm.

And, among the thickness f, the total thickness g, the total thickness h, and the total thickness i, the following relationship is satisfied: i ＞ g ＞ f ＞ 0, i ＞ g ＞ h ＞ 0, 5 μm ≤ i.

FIG. 6 is a schematic cross-sectional view of a display panel 100E according to an embodiment of the invention. Please refer to FIG. 6, in addition to the first chamfered surface 118 a, the substrate 110 also has a second chamfered surface 118 b located between the side surface 116 and the back surface 114. The connecting line 130 and the first printed pattern layer 140 extend from the front surface 112 to the side surface 116 via the first chamfered surface 118a, and extend from the side surface 116 to the back surface 114 via the second chamfered surface 118b. The second printed pattern layer 150 extends from the front surface 112 to the first chamfered surface 118a, and extends from the rear surface 114 to the second chamfered surface 118b.

It can be noted that in the display panel 100E of FIG. 6, on the connecting line 130 located on the side surface 116, only the first printed pattern layer 140 with a thickness i'is formed.

Please refer to FIG. 6, a distance a is set between an end of the first printed pattern layer 140 away from the side surface 116 and the side surface 116. A distance b is set between an end of the second printed pattern layer 150 away from the side surface 116 and the side surface 116. A distance c is set between an end of the first wiring pattern 130 close to the side surface 116 and the side surface 116. A distance d is set between an end of the first chamfered surface 118a away from the side surface 116 and the side surface 116; and the following relationship is satisfied: a ＞ b ＞ c ≥ d, 30 μm ≤ a, 5 μm ≤ b, 0 ≤ d ≤ 65 μm.

Please refer to FIG. 6, the first printed pattern layer 140 has a first thickness f. The first printing pattern layer 140 and the second printing pattern layer 150 located on the front surface 112 have a total thickness g. The first printed pattern layer 140 and the second printed pattern layer 150 located on the first chamfered surface 118a have a total thickness h. The first printed pattern layer 140 located on the side 116 has a thickness i'; and satisfies the following relationship: g ＞ i’ ＞ f ＞ 0, g ＞ i’ ＞ h ＞ 0.

FIG. 7 is a schematic diagram of the manufacturing process of the first printed pattern layer 140 and the second printed pattern layer 150 as viewed from the arrow B of FIG. 4 on the side 116 of the display panel 100C. 4 and 7 at the same time, in the manufacturing step 210 of the first printed pattern layer 140, the front surface 112, the first chamfered surface 118a, the side surface 116, the second chamfered surface 118b, and the back surface 114 of the substrate 110 are formed The first printed pattern layer 140; and, in the manufacturing step 220 of the second printed pattern layer 150, on the front 112, the first chamfered surface 118a, the side 116, the second chamfered surface 118b, and the back 114 of the substrate 110, The second printed pattern layer 150 is formed; that is, in the display panel 100C of the embodiment of FIGS. 4 and 7, the first printed pattern layer 140 and the second printed pattern layer 150 are formed on the side surface 116.

FIG. 8 is a schematic diagram of the manufacturing process of the first printing pattern layer 140 and the second printing pattern layer 150 as viewed from the arrow C of FIG. 6 on the side 116 of the display panel 100E. 6 and 8 at the same time, in the manufacturing step 210 of the first printed pattern layer 140, the front surface 112, the first chamfered surface 118a, the side surface 116, the second chamfered surface 118b, and the back surface 114 of the substrate 110 are formed了first printed pattern layer 140. In the manufacturing step 222 of the second printed pattern layer 150, only the front surface 112, the first chamfered surface 118a, the second chamfered surface 118b and the back side 114 of the substrate 110 are formed with the second printed pattern layer 150, that is, The second printing pattern layer 150 is not formed on the side 116.

In the display panel 100E, only the first printed pattern layer 140 is formed on the side 116, and the thickness of the printed pattern layer on the side 116 can be reduced. As a result, when a plurality of display panels 100E are spliced to form a spliced display, the thickness of the printed pattern layer on the side 116 of the display panel 100E can be reduced, and the seam between two adjacent display panels 100E can be reduced. In this way, multiple display panels 100E can be seamlessly spliced to form a large-sized display device, and the gap between adjacent display panels 100E is small, which helps to improve the display quality.

FIG. 9 is a top view and a side view of a display panel 100F according to an embodiment of the invention. Referring to FIG. 9, in the display panel 100F, the first wiring pattern 120 includes: a plurality of first functional blocks 122 and at least one second functional block 124; wherein, the pattern of the first printed pattern layer 140, and the The patterns of the two printed pattern layers 150 are stacked alternately with each other and are arranged above the plurality of first functional blocks 122. The pattern of the first printing pattern layer 140 and the pattern of the second printing pattern layer 150 overlap each other and are arranged above the second functional block 124.

Referring to FIG. 9, in the display panel 100F, the first printed pattern layer 140 has a thickness f. The first printing pattern layer 140 and the second printing pattern layer 150 located on the front surface 112 have a total thickness g. The first printed pattern layer 140 and the second printed pattern layer 150 overlapping each other on the side surface 116 have a total thickness i. The first printing pattern layer 140 and the second printing pattern layer 150, which are stacked on the side 116 in a staggered manner, have a total thickness i''; and satisfy the following relationship: i ＞ i’’ ＞ 0, and i ＞ g ＞ f ＞ 0.

FIG. 10 is a schematic diagram of the manufacturing process of the first printed pattern layer 140 and the second printed pattern layer 150 while observing the side surface 116 of the display panel 100F of FIG. 9. 9 and 10 at the same time, in the manufacturing step 310 of the first printed pattern layer 140, the front 112, the first chamfered surface 118a, the side 116, the second chamfered surface 118b, and the back 114 of the substrate 110 are formed了first printed pattern layer 140.

In addition, in the step 320 of manufacturing the second printed pattern layer 150, the second printed pattern layer 150 is formed on the front 112, the first chamfered surface 118a, the side 116, the second chamfered surface 118b, and the back 114 of the substrate 110. . It can be noted that the multiple patterns of the second printed pattern layer 150 are aligned with the spacing P between the multiple patterns of the first printed pattern layer 140, and are stacked in a staggered manner, as shown in the top plan view of FIG. 9 As shown, a part of the first printed pattern layer 140 and the second printed pattern layer 150 located on the side 116 has a total thickness i, and the other part of the first printed pattern layer 140 and the second printed pattern layer 150 have a total thickness i' '.

In addition, through the manufacturing step 310 of the first printing pattern layer 140 and the manufacturing step 320 of the second printing pattern layer 150 described in FIG. 10, and using conductive glue as the first printing pattern layer 140 and the second printing pattern layer 150 material, it is easy to print a large area for multiple first functional blocks 122 with the same function, and these first functional blocks 122 can be electrically connected; and it can also be used for different functions. The second functional block 124 is printed to achieve the protection effect, and the first functional block 122 and the first functional block 122 are electrically separated from each other.

FIG. 11 is a schematic cross-sectional view of the display panel 100F taken along the section line D-D' of FIG. 9. Referring to FIG. 11, it can be seen that the multiple patterns of the second printed pattern layer 150 are aligned with the interval P between the multiple patterns of the first printed pattern layer 140, and are stacked in a staggered manner. In the display panel 100F of FIG. 11, the thickness f of the first printed pattern layer 140 and the total thickness g of the first printed pattern layer 140 and the second printed pattern layer 150 on the front surface 112 are also shown.

Hereinafter, the display panel 100 of the embodiment of FIG. 1 of the present invention is taken as an example to illustrate: the manufacturing method of the display panel of the present invention.

Please refer to FIG. 1. First, a substrate 110 is provided. The substrate 110 has a front surface 112 and a back surface 114 opposed to each other, a side surface 116 connecting the front surface 112 and the back surface 114, and a first chamfered surface 118 located between the front surface 112 and the side surface 116. The material of the substrate 110 may be glass; and the edge between the front 112 and the side 116 of the substrate 110 and the edge between the back 114 and the side 116 of the substrate 110 may be chamfering process.

Next, a first wiring pattern 120 is formed on the front surface 112 of the substrate 110. The first wiring pattern 120 can be formed by using thin film deposition combined with a photolithographic etching process. In addition, a printing process of conductive materials may also be used to form the first wiring pattern 120.

Then, a connection line 130 is formed on the substrate 110. The method of forming the connecting line 130 is further described as follows.

First, a film layer (not shown) is formed on the substrate 110, for example, the film layer is formed by a thin film deposition method to cover the first wiring pattern 120 and extend at least from the front surface 112 through the first chamfered surface 118 To the side 116.

Next, a first printed pattern layer 140 is formed on the substrate 110 to cover the film layer and extend at least from the front surface 112 to the first chamfered surface 118. The first printed pattern layer 140 may be formed by printing patterns of conductive materials.

Subsequently, a second printed pattern layer 150 is formed on the substrate 110 to cover at least a part of the first printed pattern layer 140 and extend at least from the front surface 112 to the first chamfered surface 118. The second printed pattern layer 150 may be formed by printing patterns of conductive materials. The above-mentioned process of forming the first printed pattern layer 140 and the second printed pattern layer 150 is called a pattern definition process, that is, a pattern is formed on the film layer (ie, the first printed pattern layer 140 and the second printed pattern layer 150) is used as an etching mask to define the connecting line 130.

After that, using the first printed pattern layer 140 and the second printed pattern layer 150 as an etching mask, the film layer is etched to form at least the connection extending from the front surface 112 to the side surface 116 through the first chamfered surface 118 Line 130.

According to the above-mentioned basic steps, the display panels 100A, 100B, 100C, 100D, 100E, 100F of the embodiments of the present invention can be manufactured according to the arrangement positions and relevant dimensions of the first printed pattern layer 140 and the second printed pattern layer 150. .

In the above-mentioned multiple embodiments, it is described that at least two printed pattern layers (ie, the first printed pattern layer 140 and the second printed pattern layer 150) are formed to protect the connecting lines 130 formed on the side surface 116 and avoid The disconnection problem caused by the large stress at the chamfered surface (118, 118a, 118b). In other embodiments, more than two printed pattern layers may be formed to provide a better protection effect for the connecting lines 130. The present invention does not limit the number of printed pattern layers.

The materials of the first printed pattern layer 140 and the second printed pattern layer 150 may be conductive glue or insulating glue, and may be the same or different from each other.

In summary, the display panel and the manufacturing method thereof of the present invention form at least two printed pattern layers on the connecting line located on the border of the display panel, so the connecting line can be well protected and the connecting line is prevented from being broken. , And ensure that the display panel can operate normally. In addition, the first printed pattern layer covering the connecting line can be used as a terrain buffer layer, and a flatter second printed pattern layer can be formed on the first printed pattern layer. Furthermore, when splicing multiple display panels to form a spliced display, the thickness of the printed pattern layer on the side of the display panel can be controlled to reduce the seam between two adjacent display panels to improve the splicing The image display quality of the monitor.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be subject to those defined by the attached patent application scope.

100, 100A, 100B, 100C, 100D, 100E, 100F: display panel

110: substrate

112: positive

114: back

116: side

118, 118a: the first chamfered surface

118b: second chamfered surface

120, 120a: the first wiring pattern

120b: The second wiring pattern

122: The first functional block

124: Second functional block

130: connection line

140: The first printed pattern layer

150: The second printing pattern layer

160: pixel unit

162: red light emitting diode

164: Green light emitting diode

166: blue light emitting diode

170: electrical connection layer

180: glass external wiring layer

210, 310: Production steps of the first printed pattern layer

220, 222, 320: manufacturing steps of the second printed pattern layer

a, b, c, d: distance

f, i’: thickness

g, h, i, i’’: total thickness

FIG. 1 is a three-dimensional schematic diagram of a display panel 100 according to an embodiment of the invention. FIG. 2 is a schematic cross-sectional view of a display panel 100A according to an embodiment of the invention. FIG. 3 is a schematic cross-sectional view of a display panel 100B according to an embodiment of the invention. 4 is a schematic cross-sectional view of a display panel 100C according to an embodiment of the invention. FIG. 5 is a schematic cross-sectional view of a display panel 100D according to an embodiment of the invention. FIG. 6 is a schematic cross-sectional view of a display panel 100E according to an embodiment of the invention. FIG. 7 is a schematic diagram of the manufacturing process of the first printed pattern layer 140 and the second printed pattern layer 150 as viewed from the arrow B of FIG. 4 on the side 116 of the display panel 100C. FIG. 8 is a schematic diagram of the manufacturing process of the first printing pattern layer 140 and the second printing pattern layer 150 as viewed from the arrow C of FIG. 6 on the side 116 of the display panel 100E. FIG. 9 is a top view and a side view of a display panel 100F according to an embodiment of the invention. FIG. 10 is a schematic diagram of the manufacturing process of the first printed pattern layer 140 and the second printed pattern layer 150 while observing the side surface 116 of the display panel 100F of FIG. 9. FIG. 11 is a schematic cross-sectional view of the display panel 100F taken along the section line D-D' of FIG. 9.

100: display panel

110: substrate

112: positive

114: back

116: side

118: The first chamfered surface

120: The first wiring pattern

130: connection line

140: The first printed pattern layer

150: The second printing pattern layer

160: pixel unit

162: red light emitting diode

164: Green light emitting diode

166: blue light emitting diode

Claims (18)

A display panel includes: a substrate having: a front surface and a back surface disposed oppositely, a side surface connecting the front surface and the back surface, and a first chamfered surface located between the front surface and the side surface; a first The wiring pattern is arranged on the front surface; a connecting wire covering the first wiring pattern and extending from the front surface to the side surface through the first chamfered surface at least; a first printed pattern layer covering the connecting wire , And at least extend from the front surface to the first chamfered surface; and a second printed pattern layer covering at least a part of the first printed pattern layer, and at least extend from the front surface to the first chamfered surface, Wherein, a distance a is set between an end of the first printed pattern layer away from the side surface and the side surface; a distance b is set between an end of the second printed pattern layer away from the side surface and the side surface; A distance c is set between an end of the first wiring pattern close to the side surface and the side surface; a distance d is set between an end of the first chamfered surface away from the side surface and the side surface; and, Meet the following relationships: a

b>c

d, 30μm

a, 5μm

b, 0

d

65μm. A display panel includes: a substrate having: a front surface and a back surface disposed oppositely, a side surface connecting the front surface and the back surface, and a first chamfered surface located between the front surface and the side surface; a first The wiring pattern is arranged on the front surface; a connecting wire covering the first wiring pattern and extending from the front surface to the side surface through the first chamfered surface at least; a first printed pattern layer covering the connecting wire , And at least extend from the front surface to the first chamfered surface; and a second printed pattern layer covering at least a part of the first printed pattern layer, and at least extend from the front surface to the first chamfered surface, Wherein, the first printed pattern layer has a thickness f; the first printed pattern layer and the second printed pattern layer located on the front surface have a total thickness g; the first printed pattern layer located on the first chamfered surface The printed pattern layer and the second printed pattern layer have a total thickness h; and the following relationship is satisfied: g>f>0, g>h>0. The display panel according to claim 2, wherein the first printed pattern layer and the second printed pattern layer extend from the front to the side surface via the first chamfered surface, and the first printed pattern layer located on the side surface The printed pattern layer and the second printed pattern layer have a total thickness i; and satisfy the following relationship: i>g>f>0, i>g>h>0,5μm

i. The display panel according to claim 1 or 2, wherein the materials of the first printed pattern layer and the second printed pattern layer are insulating glue; the first printed pattern layer and the second printed pattern layer are viewed from the front side It extends to the first chamfered surface, and exposes the connecting line on the side surface. The display panel according to claim 4, further comprising: an electrical connection layer disposed on the connection line; and a glass outer wiring layer disposed on the electrical connection layer. The display panel according to claim 1 or 2, wherein the materials of the first printed pattern layer and the second printed pattern layer are conductive adhesive; the first printed pattern layer and the second printed pattern layer are viewed from the front It extends through the first chamfered surface to reach the side surface and covers the connecting line on the side surface. The display panel according to claim 6, further comprising: an electrical connection layer disposed on the connection line; and a glass external wiring layer disposed on the electrical connection layer. The display panel according to claim 1 or 2, wherein the shapes of the first printed pattern layer and the second printed pattern layer are: L shape or C shape. The display panel according to claim 1 or 2, wherein the substrate further has: a second chamfered surface located between the side surface and the back surface, the connecting line, the first printing pattern layer, and the second printing The pattern layer extends from the front surface to the side surface via the first chamfered surface, and extends from the side surface to the back surface via the second chamfered surface. The display panel according to claim 9, further comprising: a second wiring pattern arranged on the back surface, the connecting wire extending to the back surface, covering the second wiring pattern, and electrically connecting the first wiring pattern The wiring pattern and the second wiring pattern. The display panel according to claim 1 or 2, wherein the substrate further has: a second chamfered surface located between the side surface and the back surface, and the connecting line and the first printed pattern layer pass from the front surface The first chamfered surface extends to the side surface, and from the side surface to the back surface through the second chamfered surface, the second printed pattern layer extends from the front surface to the first chamfered surface, and It extends from the back to the second chamfered surface. The display panel according to claim 11, wherein a distance a is set between an end of the first printed pattern layer away from the side surface and the side surface; and a distance a is set between the end of the second printed pattern layer away from the side surface and A distance b is set between the side surfaces; a distance c is set between an end of the first wiring pattern close to the side surface and the side surface; and an end away from the side surface of the first chamfered surface to the side surface Between, set a distance d; and satisfy the following relationship: a>b>c

d, 30μm

a, 5μm

b, 0

d

65μm. The display panel according to claim 11, wherein the first printed pattern layer has a first thickness f; the first printed pattern layer and the second printed pattern layer on the front surface have a total thickness g; The first printed pattern layer and the second printed pattern layer on the first chamfered surface have a total thickness h; the first printed pattern layer on the side surface has a thickness i'; and The following relationship: g>i'>f>0, g>i'>h>0. The display panel according to claim 1 or 2, wherein The first wiring pattern includes a plurality of first functional blocks and at least one second functional block, wherein the patterns of the first printed pattern layer and the patterns of the second printed pattern layer are stacked alternately with each other, and are arranged Above the plurality of first functional blocks; the pattern of the first printed pattern layer and the pattern of the second printed pattern layer overlap each other and are arranged above the second functional block. The display panel according to claim 14, wherein the first printed pattern layer has a thickness f; the first printed pattern layer and the second printed pattern layer on the front surface have a total thickness g; The first printed pattern layer and the second printed pattern layer overlapping each other on the side surface have a total thickness i; the first printed pattern layer and the second printed pattern layer that are stacked alternately on the side surface have A total thickness i"; and the following relationship is satisfied: i>i">0, and i>g>f>0. The display panel according to claim 1 or 2, further comprising: a plurality of pixel units arranged on the front surface of the substrate, and each of the pixel units includes: a red light emitting diode and a green light emitting diode Diode, and a blue light emitting diode. A manufacturing method of a display panel includes: A substrate is provided, the substrate having: a front surface and a back surface disposed opposite to each other, a side surface connecting the front surface and the back surface, and a first chamfered surface located between the front surface and the side surface; on the front surface of the substrate Forming a first wiring pattern on the substrate; and forming a connecting line on the substrate, wherein the method of forming the connecting line includes: forming a film on the substrate to cover the first wiring pattern, and at least Extend from the front surface to the side surface via the first chamfered surface; form a first printed pattern layer on the substrate, cover the film layer, and extend at least from the front surface to the first chamfered surface; on the substrate A second printed pattern layer is formed on top, covering at least a part of the first printed pattern layer, and at least extends from the front surface to the first chamfered surface; and the first printed layer and the second printed pattern layer As an etching mask, the film layer is etched to form at least the connecting line extending from the front surface to the side surface via the first chamfered surface. A display panel includes: a substrate having: a front surface and a back surface disposed oppositely, a side surface connecting the front surface and the back surface, and a first chamfered surface located between the front surface and the side surface; a first The wiring pattern is arranged on the front surface; a connecting wire covering the first wiring pattern and extending from the front surface to the side surface through the first chamfered surface at least; a first printed pattern layer covering the connecting wire , And at least extend from the front to The first chamfered surface; and a second printed pattern layer covering at least a part of the first printed pattern layer and at least extending from the front surface to the first chamfered surface, wherein the first printed pattern layer The shape of the second printed pattern layer is: L shape.

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