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TWI702684B - 具備夾鉗機構的基板保持裝置 - Google Patents

具備夾鉗機構的基板保持裝置 Download PDF

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Publication number
TWI702684B
TWI702684B TW108109092A TW108109092A TWI702684B TW I702684 B TWI702684 B TW I702684B TW 108109092 A TW108109092 A TW 108109092A TW 108109092 A TW108109092 A TW 108109092A TW I702684 B TWI702684 B TW I702684B
Authority
TW
Taiwan
Prior art keywords
substrate
mounting table
clamp
pin
push
Prior art date
Application number
TW108109092A
Other languages
English (en)
Chinese (zh)
Other versions
TW201941359A (zh
Inventor
入澤一彦
Original Assignee
日商日新電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日新電機股份有限公司 filed Critical 日商日新電機股份有限公司
Publication of TW201941359A publication Critical patent/TW201941359A/zh
Application granted granted Critical
Publication of TWI702684B publication Critical patent/TWI702684B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW108109092A 2018-03-20 2019-03-18 具備夾鉗機構的基板保持裝置 TWI702684B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-052633 2018-03-20
JP2018052633A JP7255078B2 (ja) 2018-03-20 2018-03-20 クランプ機構及び当該クランプ機構を備える基板保持装置

Publications (2)

Publication Number Publication Date
TW201941359A TW201941359A (zh) 2019-10-16
TWI702684B true TWI702684B (zh) 2020-08-21

Family

ID=67987828

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109092A TWI702684B (zh) 2018-03-20 2019-03-18 具備夾鉗機構的基板保持裝置

Country Status (3)

Country Link
JP (1) JP7255078B2 (ja)
TW (1) TWI702684B (ja)
WO (1) WO2019181775A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5590279B2 (ja) * 2008-03-31 2014-09-17 株式会社三洋物産 遊技機
JP5590278B2 (ja) * 2008-03-31 2014-09-17 株式会社三洋物産 遊技機
JP5590280B2 (ja) * 2008-04-11 2014-09-17 株式会社三洋物産 遊技機

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58126978A (ja) * 1982-01-22 1983-07-28 Hitachi Ltd 基板の保持装置
TW200937568A (en) * 2008-02-22 2009-09-01 Au Optronics Corp Clamp for reducing film deposition
JP2012222222A (ja) * 2011-04-12 2012-11-12 Toppan Printing Co Ltd 基板クランプ装置
TW201729334A (zh) * 2015-11-19 2017-08-16 荏原製作所股份有限公司 基板保持裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0718756Y2 (ja) * 1989-12-01 1995-05-01 日新電機株式会社 基板保持装置
JP2539376Y2 (ja) * 1991-03-06 1997-06-25 日新電機株式会社 基板保持装置
JP2011026624A (ja) * 2007-10-10 2011-02-10 Canon Anelva Corp プラズマ処理装置
JP2013093279A (ja) * 2011-10-27 2013-05-16 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58126978A (ja) * 1982-01-22 1983-07-28 Hitachi Ltd 基板の保持装置
TW200937568A (en) * 2008-02-22 2009-09-01 Au Optronics Corp Clamp for reducing film deposition
JP2012222222A (ja) * 2011-04-12 2012-11-12 Toppan Printing Co Ltd 基板クランプ装置
TW201729334A (zh) * 2015-11-19 2017-08-16 荏原製作所股份有限公司 基板保持裝置

Also Published As

Publication number Publication date
JP7255078B2 (ja) 2023-04-11
TW201941359A (zh) 2019-10-16
JP2019165140A (ja) 2019-09-26
WO2019181775A1 (ja) 2019-09-26

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