TWI792475B - Immersion-cooled heat-dissipation structure with macroscopic-scale fin structure and immersion-cooled heat-dissipation structure with fin structure - Google Patents

Abstract

An immersion-cooled heat-dissipation structure with macroscopic-scale fin structure and an immersion-cooled heat-dissipation structure with fin structure are provided. The immersion-cooled heat-dissipation structure with a macroscopic-scale fin structure has a surface with at least two contact angles. At least one portion of the surface has a first contact angle with the immersion liquid of greater than 90°. At least another portion of the surface has a second contact angle with the immersion liquid of between 0° and 90°.

Description

Immersion heat dissipation structure with giant fin structure and immersion heat dissipation structure with fin structure

The invention relates to a heat dissipation structure, in particular to an immersion heat dissipation structure with a macroscopic fin structure and an immersion heat dissipation structure with a fin structure.

The immersion cooling technology is to immerse the heating element (such as server, disk array, etc.) directly in the non-conductive cooling liquid, so as to take away the heat energy generated by the heating element through the heat absorption and vaporization of the cooling liquid. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem to be solved in the industry.

In view of this, the inventor has been engaged in the development and design of related products for many years, and felt that the above-mentioned defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide an immersion heat dissipation structure with a macroscopic fin structure and an immersion heat dissipation structure with a fin structure in view of the deficiencies in the prior art.

In order to solve the above-mentioned technical problems, the first embodiment of the present invention provides an immersion heat dissipation structure with a macroscopic fin structure, which has at least two surfaces with more than two contact angles; wherein at least one part of the surface is submerged Type coolant with a contact angle >90° and at least Another part of the surface has a contact angle of immersion cooling liquid between 0° and 90°.

In a preferred embodiment, the macroscopic fin structure refers to a fin structure in which the fin is at least 100 um higher than the surface from which the fin grows.

In order to solve the above-mentioned technical problems, the second embodiment of the present invention provides an immersion heat dissipation structure with a fin structure, which has a heat dissipation base, at least one hydrophobic layer, and at least one fin, and at least one of the fins and at least one hydrophobic layer is formed on the heat dissipation base, and at least one hydrophobic layer is formed on a region of the heat dissipation base other than the fins, and the surface of at least one hydrophobic layer is submerged The contact angle of the coolant is >90°.

In a preferred embodiment, the hydrophobic layer is formed by one of physical deposition, chemical deposition, and spraying on the area of the heat dissipation base other than the fins, and the fins are pin posts Type fins, sheet fins, or a composite fin structure composed of the above two.

In order to solve the above-mentioned technical problems, the third embodiment of the present invention provides an immersion heat dissipation structure with a fin structure, which has a heat dissipation base, at least one hydrophilic layer, and at least one fin, and at least one of the fins It is formed on the heat dissipation base, and at least one of the hydrophilic layers is formed on at least one of the fins, and the contact angle of the surface of at least one of the hydrophilic layers to the immersion cooling liquid is between 0° and 90°. Between, and at least one of the hydrophilic layer, at least one of the fins, and the heat dissipation base are formed of heterogeneous materials.

In a preferred embodiment, the hydrophilic layer is formed on at least one of the fins by immersion plating, and the fins are pin-pillar fins, sheet fins, or a composite of the two. fin structure.

In order to solve the above technical problems, the fourth embodiment of the present invention provides an immersion heat dissipation structure with a fin structure, which has a heat dissipation base, at least one hydrophobic layer, at least one hydrophilic layer, and at least one fin, and at least One of the fins is formed on the heat dissipation base, and at least one of the hydrophilic layers is formed on at least one of the fins, and at least one of the hydrophobic layers is formed on the The area of the heat dissipation base that is not the fin, and the contact angle of the surface of at least one of the hydrophobic layers to the immersion cooling liquid>90°, and the contact angle of the surface of at least one of the hydrophilic layer to the immersion cooling liquid between 0° and 90°.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

10: heat dissipation base

11: Hydrophobic layer

12: Hydrophilic layer

20a: Giant Fins

20b: Fins

20c: fins

20d: fins

θ1: contact angle

θ2: contact angle

Fig. 1 is a schematic side view of the structure of the first embodiment of the present invention.

Fig. 2 is a schematic diagram of the contact angle of a part of the structure surface of the present invention to the immersion cooling liquid.

Fig. 3 is a schematic diagram of the contact angle of another part of the structured surface of the present invention to the immersion cooling liquid.

Fig. 4 is a schematic side view of the structure of the second embodiment of the present invention.

Fig. 5 is a schematic side view of the structure of the third embodiment of the present invention.

Fig. 6 is a schematic side view of the structure of the fourth embodiment of the present invention.

The following are specific examples to illustrate the implementation methods disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used in this article may include any or all of the associated listed items depending on the actual situation. or multiple combinations.

[first embodiment]

Please refer to FIG. 1 , which is the first embodiment of the present invention. The embodiment of the present invention provides an immersion heat dissipation structure with a macroscopic fin structure, which can be used to contact heating elements. As shown in FIG. 1 , an immersion heat dissipation structure with a macroscopic fin structure (hereinafter referred to as an immersion heat dissipation structure) provided according to an embodiment of the present invention has at least two surfaces with more than two contact angles.

Furthermore, the immersion heat dissipation structure of this embodiment can have a heat dissipation base 10 and one or more macroscopic fins 20a located thereon, and can be immersed in a two-phase immersion cooling liquid (such as electronic fluorinated liquid) . Moreover, the heat dissipation base 10 and the macroscopic fins 20 a of this embodiment may be integrally formed by Metal Injection Molding (MIM). In this embodiment, the macroscopic fin 20 a means that the fin is at least 100 um higher than the surface from which the fin grows. In addition, the macroscopic fins 20a may also be pin-fins, sheet fins or other similar composite fin structures.

It is worth mentioning that, in the immersion heat dissipation structure of this embodiment, at least one part of the surface has a contact angle to the immersion cooling liquid > 90°, and at least another part of the surface has a contact angle to the immersion cooling liquid between 0 ° to 90°.

Further speaking, at least one hydrophobic layer 11 is formed on the platform area where the non-macroscopic fins 20a grow on the surface of the heat dissipation base 10 of this embodiment, and the surface of the hydrophobic layer 11 has a contact angle θ1>90°( For example, as shown in FIG. 2 ), the contact angle of at least a part of the surface of the immersion heat dissipation structure of this embodiment to the immersion cooling liquid is >90°. Moreover, the macroscopic fin 20a of this embodiment is a porous metal fin, and the contact angle θ2 of its surface to the immersion cooling liquid is between 0° and 90° (such as shown in FIG. 3 ), so that this embodiment The immersion heat dissipation structure has at least another partial surface whose contact angle to the immersion cooling liquid is between 0° and 90°.

Therefore, the contact angle of the surface of the macroscopic fin 20a of this embodiment to the immersion cooling liquid is between 0° and 90°, and has the characteristics of high critical heat flux (CHF) and few nucleation points of air bubbles, On the other hand, the surface of the hydrophobic layer 11 formed in the platform area of the heat dissipation substrate 10 has a contact angle of >90° to the immersion cooling liquid and has the characteristics of many nucleation points of bubbles and low critical heat flux (CHF). Due to the low critical heat flux (CHF), it is easy to cause nucleate boiling to quickly turn into film boiling, forming a gas film and causing air thermal resistance, but more nucleation points can increase the heat transfer coefficient (HTC). Because the giant fin 20a is the main heat dissipation area, its area is large, the number of holes is large, the nucleation block is many, and the heat transfer coefficient (HTC) itself is high, so the platform area outside the fin area is suitable for forming an effective cooling area. The hydrophobic layer 11 increases the nucleation point of the air bubbles, and even if the nucleate boiling turns into film boiling and causes air thermal resistance, the heat can be conducted out through the fin area by heat conduction.

Furthermore, the hydrophobic layer 11 of the platform area of the heat dissipation base 10 in this embodiment can be formed on the platform area of the heat dissipation base 10 by physical deposition, chemical deposition, or spraying, and can be through the material itself or the surface microstructure To change the contact angle of the material surface to the immersion coolant.

[Second Embodiment]

Please refer to FIG. 4, which is the second embodiment of the present invention. This embodiment is substantially the same as the first embodiment. This embodiment provides an immersion heat dissipation structure with a fin structure, which has a heat dissipation base 10, At least one hydrophobic layer 11 and at least one fin 20 b are formed on the heat dissipation base 10 . The fins 20b in this embodiment are made of hydrophilic metal, and may be pin-fins, but may also be sheet fins or other similar composite fin structures. Moreover, the hydrophobic layer 11 of this embodiment is formed on the non-fin 20b region on the heat dissipation substrate 10, such as the peripheral region of the non-fin 20b, and the contact angle of the surface of the hydrophobic layer 11 to the immersion cooling liquid is >90°.

[Third embodiment]

Please refer to FIG. 5, which is the third embodiment of the present invention. This embodiment is substantially the same as the first embodiment. This embodiment provides an immersion heat dissipation structure with a fin structure, which has a heat dissipation base 10, At least one hydrophilic layer 12, and at least one fin 20c, and the fin 20c is formed on the heat dissipation base 10, and the hydrophilic layer 12 is formed on at least one fin 20c, and the surface of the hydrophilic layer 12 is in contact with the immersion cooling liquid The angle is between 0° and 90°.

Furthermore, the hydrophilic layer 12 of this embodiment can be formed on at least one fin 20c by immersion plating, and can change the contact angle of the material surface to the immersion cooling liquid through the material itself or the surface microstructure. It is worth noting that the hydrophilic layer 12 and the fins 20c of this embodiment are heterogeneous materials, and also the heat dissipation substrate 10 is a heterogeneous material, that is to say, the fins 20c or the heat dissipation substrate 10 of this embodiment can be made of non-hydrophilic materials. form.

[Fourth embodiment]

Please refer to FIG. 6, which is the fourth embodiment of the present invention. This embodiment is substantially the same as the first embodiment. This embodiment provides an immersion heat dissipation structure with a fin structure, which has a heat dissipation base 10, At least one hydrophobic layer 11, at least one hydrophilic layer 12, and at least one fin 20d. In this embodiment, the fins 20d are formed on the heat dissipation base 10 , the hydrophilic layer 12 is formed on at least one fin 20d , and the hydrophobic layer 11 is formed on the area of the heat dissipation base 10 that is not the fin 20d. Wherein, the contact angle of the surface of the hydrophobic layer 11 to the immersion cooling liquid is >90°, while the contact angle of the surface of the hydrophilic layer 12 to the immersion cooling liquid is between 0° and 90°.

The hydrophobic layer 11 of this embodiment can be formed on the non-fin 20d area on the heat dissipation substrate 10 by physical deposition, chemical deposition, or spraying, and the hydrophilic layer 12 can be formed on at least one fin by immersion plating. 20d on.

Based on the above, the immersion heat dissipation structure provided by the embodiment of the present invention can pass "surfaces with at least two or more contact angles" and "at least one part of the surface has a contact angle of >90° to the immersion cooling liquid." , and there is at least one other partial of said surface to the submerged The contact angle of the cooling liquid is between 0° and 90°"; "has a heat dissipation base, at least one hydrophobic layer, and at least one fin", "at least one of the fins and at least one of the hydrophobic layer are formed on the On the heat dissipation base", "at least one of the hydrophobic layers is formed on the area of the heat dissipation base other than the fins, and the contact angle of the surface of at least one of the hydrophobic layers to the immersion cooling liquid is >90° "; "has a heat dissipation base, at least one hydrophilic layer, and at least one fin", "at least one of said hydrophilic layer is formed on at least one of said fins", "the surface of at least one of said hydrophilic layer is submerged The contact angle of the cooling liquid is between 0° and 90°, and at least one of the hydrophilic layer, at least one of the fins, and the heat dissipation base are formed of heterogeneous materials”; “has a heat dissipation base, at least one hydrophobic layer, at least one hydrophilic layer, and at least one fin", "at least one of the fins is formed on the heat dissipation base, and at least one of the hydrophilic layers is formed on at least one of the fins, and at least one of the The hydrophobic layer is formed on the area of the heat dissipation base other than the fins", "the contact angle of the surface of at least one of the hydrophobic layers to the immersion cooling liquid is >90°, and the surface of at least one of the hydrophilic layers is to the submerged The technical solution that the contact angle of the cooling liquid is between 0° and 90°" makes the submerged heat dissipation structure provided by the embodiment of the present invention have hydrophilic and hydrophobic characteristics, so that the main heat dissipation area has a critical heat flux (CHF) The auxiliary heat dissipation area has the characteristics of many nucleation points and low critical heat flux (CHF), which further enhances the immersion heat dissipation effect.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: heat dissipation base

11: Hydrophobic layer

20a: Giant Fins

Claims (7)

An immersion heat dissipation structure with a macroscopic fin structure, which has a heat dissipation base, at least one hydrophobic layer, and at least one macroscopic fin, and at least one of the macroscopic fins and at least one of the hydrophobic layer are used for Submerged in the immersion cooling liquid and formed on the heat dissipation base respectively, and at least one of the hydrophobic layers is formed on the area of the heat dissipation base that is not the macroscopic fin, and at least one of the hydrophobic layers The contact angle of the surface to the immersion cooling liquid is >90°, so that at least one of the macroscopic fins is the main heat dissipation area and has the characteristics of high critical heat flux to enhance boiling heat transfer, and the formation of the The area of the hydrophobic layer is an auxiliary heat dissipation area and can be used to increase the nucleation points of the bubbles and promote the detachment of the bubbles. The submerged heat dissipation structure with a macroscopic fin structure according to claim 1, wherein the hydrophobic layer is formed on the heat dissipation substrate by one of physical deposition, chemical deposition, and spraying. The region of the macroscopic fins, and the macroscopic fins are pin-pillar fins, sheet fins, or a composite fin structure composed of the above two. An immersion heat dissipation structure with a fin structure, which has a heat dissipation base, at least one hydrophilic layer, and at least one fin, at least one of the hydrophilic layer and at least one of the fins are used for immersion in the immersion cooling liquid , and at least one of the fins is formed on the heat dissipation base, and at least one of the hydrophilic layers is formed on at least one of the fins, and the surface of at least one of the hydrophilic layers is opposite to the immersion cooling liquid The contact angle is between 0° and 90°, and the contact angle of at least one surface of the hydrophilic layer to the immersion cooling liquid is smaller than that of at least one of the fins and the heat dissipation base to the immersion cooling liquid contact angle, so that the fins formed with the hydrophilic layer are the main heat dissipation area and have the characteristics of high critical heat flux to enhance boiling heat transfer. The submerged heat dissipation structure with fin structure according to claim 3, wherein the hydrophilic layer is formed on at least one of the fins by immersion plating, and the fins are pin-pillar fins, fins shaped fins, or a composite fin structure composed of the above two. A submerged heat dissipation structure with a fin structure, which has a heat dissipation base, at least one hydrophobic layer, at least one hydrophilic layer, and at least one fin, at least one hydrophobic layer, at least one hydrophilic layer, and at least one The fins are used to be immersed in the immersion cooling liquid, and at least one of the fins is formed on the heat dissipation base, and at least one of the hydrophilic layers is formed on at least one of the fins, and at least one of the fins is formed on the heat dissipation base. The hydrophobic layer is formed on the area of the heat dissipation base other than the fins, and the contact angle of at least one surface of the hydrophobic layer to the immersion cooling liquid is >90°, and the surface of at least one hydrophilic layer is opposite to The contact angle of the immersion cooling liquid is between 0° and 90°, so that the fins formed with the hydrophilic layer are the main heat dissipation areas and have the characteristics of high critical heat flux to enhance boiling heat transfer , and make the area where the hydrophobic layer is formed an auxiliary heat dissipation area, which can be used to increase bubble nucleation points and promote bubble detachment. The submerged heat dissipation structure with fin structure according to claim 5, wherein the hydrophobic layer is formed on the heat dissipation base other than the fins by one of physical deposition, chemical deposition and spraying In the area of the sheet, the hydrophilic layer is formed on at least one of the fins by immersion plating. The submerged heat dissipation structure with a fin structure according to claim 5, wherein the fins are pin-pillar fins, sheet-like fins, or a composite fin structure composed of the above two.

Images