TWI761603B - Manufacturing method of seamless sleeve for gravure printing - Google Patents
Manufacturing method of seamless sleeve for gravure printing Download PDFInfo
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- TWI761603B TWI761603B TW107133990A TW107133990A TWI761603B TW I761603 B TWI761603 B TW I761603B TW 107133990 A TW107133990 A TW 107133990A TW 107133990 A TW107133990 A TW 107133990A TW I761603 B TWI761603 B TW I761603B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/16—Curved printing plates, especially cylinders
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/05—Preparation or purification of carbon not covered by groups C01B32/15, C01B32/20, C01B32/25, C01B32/30
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
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- Printing Plates And Materials Therefor (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
為了提供一種凹版印刷用無接縫套筒,可進行無接縫的連續印刷且能在短時間內實施版更換,而且加工容易。 In order to provide a seamless sleeve for gravure printing, which can perform continuous printing without a seam, can perform plate change in a short time, and is easy to process.
凹版印刷用無接縫套筒係包含:由可鍍敷的圓筒狀金屬基材所構成且在表面形成有凹槽之無接縫套筒主體、及用於被覆該套筒主體的表面之表面強化被覆層。前述可鍍敷的圓筒狀金屬基材較佳為銅。前述表面強化被覆層宜為DLC被覆層、二氧化矽被覆層或鍍鉻被覆層。 The seamless sleeve for gravure printing includes: a seamless sleeve body composed of a platable cylindrical metal base material and having grooves formed on the surface, and a sleeve body for covering the surface of the sleeve body. Surface strengthening coating. The platable cylindrical metal substrate is preferably copper. The aforementioned surface strengthening coating layer is preferably a DLC coating layer, a silicon dioxide coating layer or a chrome plating coating layer.
Description
本發明是關於藉由套設於印刷用基底滾筒而構成凹版製版輥之無接縫套筒,特別是關於用於凹版印刷之沒有接縫的凹版印刷用無接縫套筒。 The present invention relates to a seamless sleeve for forming a gravure plate-making roll by being sleeved on a printing base cylinder, and more particularly, to a seamless sleeve for gravure printing without a seam for gravure printing.
凹版印刷,是在凹版製版輥(凹版滾筒)上形成與製版資訊對應之微小凹部(凹槽(gravure cell))而製作版面,在該凹槽填充油墨並轉印於被印刷物。一般的凹版製版輥,作為版母材是準備由鋁、鐵等的金屬所形成之具有重量之金屬製中空輥,在該金屬製中空輥的表面藉由鍍銅來形成版面形成用的鍍銅層(版材),在該鍍銅層藉由蝕刻來形成與製版資訊對應之多數個微小凹部(凹槽),然後為了增加凹版製版輥的耐刷力而藉由鍍鉻來形成硬質的鉻層作為表面強化被覆層,如此完成製版(版面的製作)。 In gravure printing, tiny recesses (gravure cells) corresponding to the plate-making information are formed on a gravure plate-making roller (gravure cylinder) to make a layout, and the grooves are filled with ink and transferred to the printed matter. A general gravure plate-making roll is prepared by preparing a heavy metal hollow roll formed of a metal such as aluminum or iron as a plate base material, and copper plating for plate formation is formed on the surface of the metal hollow roll by copper plating. Layer (plate material), in the copper-plated layer by etching to form a number of tiny recesses (grooves) corresponding to the plate-making information, and then in order to increase the brush resistance of the gravure plate-making roller, a hard chrome layer is formed by chrome plating As the surface strengthening coating layer, plate making (preparation of the layout) is completed in this way.
另一方面,近年,逐漸要求更大的製版,而使凹版製版輥往大型化進展。隨著凹版製版輥往大型化進 展,凹版製版輥的重量日益增大,隨之而來是造成版更換耗費時間,變得越來越麻煩而造成問題。此外,版母材是與加熱處理裝置等的處理裝置連接,在鍍銅或鍍鉻時將版母材浸漬於電鍍槽並不理想,因此還存在加工處理不容易的問題。 On the other hand, in recent years, a larger plate making is gradually required, and the gravure plate making roll has been increased in size. As gravure plate-making rolls become larger With the development, the weight of the gravure plate-making roller is increasing day by day, and the subsequent change of the plate is time-consuming, becoming more and more troublesome and causing problems. In addition, since the plate base material is connected to a processing device such as a heat treatment device, it is not ideal to immerse the plate base material in an electroplating bath during copper or chrome plating, and therefore there is a problem that processing is not easy.
在專利文獻1,作為凹版印刷版套筒,是將長方形的板片彎曲成中空圓筒形並利用熔接等進行結合而構成凹版印刷版套筒。然而,依據專利文獻1所載的方法,會產生熔接等的結合部之接縫,而有無法進行連續印刷之問題。 In Patent Document 1, as a gravure printing plate sleeve, a rectangular plate piece is bent into a hollow cylindrical shape and joined by welding or the like to form a gravure printing plate sleeve. However, according to the method described in Patent Document 1, there is a problem in that a seam at a joint such as welding occurs, and continuous printing cannot be performed.
[專利文獻1]日本特表2009-514697號公報 [Patent Document 1] Japanese Patent Publication No. 2009-514697
本發明是有鑑於上述習知技術的問題點而開發完成的,其目的是為了提供一種凹版印刷用無接縫套筒,可進行無接縫的連續印刷且能在短時間內實施版更換,而且加工容易。 The present invention has been developed in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide a seamless sleeve for gravure printing, which can perform seamless continuous printing and can perform plate replacement in a short time. And it is easy to process.
為了解決上述問題,凹版印刷用無接縫套筒係包含:由可鍍敷的圓筒狀金屬基材所構成且在表面形成有凹槽之無接縫套筒主體、及用於被覆該套筒主體的表面之表面強化被覆層。In order to solve the above-mentioned problems, a seamless sleeve for gravure printing includes a seamless sleeve body composed of a platable cylindrical metal base material and having grooves formed on the surface thereof, and a sleeve for covering the sleeve. The surface reinforcement coating layer on the surface of the barrel main body.
前述可鍍敷的圓筒狀金屬基材較佳為銅。The platable cylindrical metal substrate is preferably copper.
前述表面強化被覆層宜為類鑽碳(DLC)被覆層、二氧化矽被覆層或鍍鉻被覆層。The aforementioned surface-strengthening coating layer is preferably a diamond-like carbon (DLC) coating layer, a silicon dioxide coating layer or a chrome-plated coating layer.
依據本發明能夠提供一種凹版印刷用無接縫套筒,可進行無接縫的連續印刷且能在短時間內實施版更換而且加工容易,因此具有顯著的效果。According to the present invention, a seamless sleeve for gravure printing can be provided, which can perform continuous printing without a seam, can perform plate change in a short time, and is easy to process, which has a remarkable effect.
以下將本發明的實施形態和所附圖式一起做說明,該等實施形態僅為例示,在不脫離本發明的技術思想之範圍內當然可進行各種的變形。Hereinafter, the embodiments of the present invention will be described together with the accompanying drawings, but these embodiments are merely illustrative, and various modifications can be made without departing from the technical spirit of the present invention.
針對本發明的凹版印刷用無接縫套筒之實施形態,使用圖1做說明。圖中,符號10代表本發明的凹版印刷用無接縫套筒。本發明的凹版印刷用無接縫套筒10,如圖1所示般係包含:由可鍍敷的圓筒狀金屬基材所構成且在表面形成有凹槽14之無接縫套筒主體12、及被覆該套筒主體的表面之表面強化被覆層16。An embodiment of the seamless sleeve for gravure printing of the present invention will be described with reference to FIG. 1 . In the figure,
針對本發明的凹版印刷用無接縫套筒的製造方法之態樣的一例,說明如下。首先,準備圓柱或圓筒狀的基底輥,在該基底輥上藉由金屬鍍敷而形成圓筒狀金屬基材所構成之版面形成用的金屬鍍層後,在該金屬鍍層的表面形成多數個微細的凹部(凹槽)14,如此製作出無接縫套筒主體12。An example of the aspect of the manufacturing method of the seamless sleeve for gravure printing of this invention is demonstrated below. First, a cylindrical or cylindrical base roll is prepared, and a metal plating layer for forming a layout composed of a cylindrical metal base material is formed on the base roll by metal plating, and then a plurality of metal plating layers are formed on the surface of the metal plating layer. The fine concave portion (groove) 14 produces the
作為用於前述圓筒狀金屬基材之金屬材,只要是可鍍敷的金屬材即可,沒有特別的限制,例如為銅、鎳、鐵、錫、鋅及其等的合金等,較佳為銅、鎳,特佳為銅。鍍敷方法沒有特別的限制,可採用公知的方法,較佳為電鍍。 金屬鍍層的厚度沒有特別的限制,較佳為1μm~1mm左右,更佳為20μm~1mm左右。The metal material used for the cylindrical metal base material is not particularly limited as long as it is a metal material that can be plated. For example, copper, nickel, iron, tin, zinc, and alloys thereof are preferred. For copper, nickel, copper is particularly preferred. The plating method is not particularly limited, and a known method can be used, and electroplating is preferred. The thickness of the metal plating layer is not particularly limited, preferably about 1 μm to 1 mm, more preferably about 20 μm to 1 mm.
金屬鍍敷所使用之基底輥的材料沒有特別的限制,例如為不鏽鋼、鋁、鐵、鈦等。此外,在基底輥上設置剝離層再進行金屬鍍敷亦可。The material of the base roll used for metal plating is not particularly limited, and for example, it is stainless steel, aluminum, iron, titanium, and the like. In addition, a release layer may be provided on the base roll, and then metal plating may be performed.
關於凹槽14的形成,可採用蝕刻法、電子雕刻法等的公知方法。蝕刻法,是在金屬鍍層的表面塗布感光液並進行直接烘烤後,藉由蝕刻來形成凹槽14。電子雕刻法,是依據數位信號讓鑽石雕刻針機械性地作動,藉此在金屬鍍層的表面雕刻凹槽14。前述凹槽的深度沒有特別的限制,宜為5~150μm。For the formation of the
進一步,在形成有前述凹槽14之金屬鍍層(包含凹槽14部分)的表面形成表面強化被覆層16。然後,從無接縫套筒主體12將基底輥移除,而完成本發明的凹版印刷用無接縫套筒10。Further, a surface strengthening
又在上述例中,雖是在表面強化被覆層16的形成後才進行基底輥的移除,但基底輥之移除時期只要是在版面形成用之金屬鍍層形成後即可,沒有特別的限制。Also in the above example, although the removal of the base roll is performed after the surface strengthening
作為表面強化被覆層16可採用:DLC被覆層、使用全氫聚矽氮烷溶液為原料而形成之二氧化矽被膜等,此外,作為凹版製版輥之表面強化被覆層也能採用以往周知的鍍鉻被覆層。在鍍鉻被覆層的形成,只要採用常用的鍍鉻法即可。前述表面強化被覆層16的厚度沒有特別的限制,宜為0.1~10μm。As the surface strengthening
作為DLC被覆層的形成方法可採用:濺鍍法、真空蒸鍍法(電子束法)、離子鍍法、MBE法(分子束磊晶法)、雷射剝蝕法、離子輔助法、電漿CVD法等之公知方法,較佳為濺鍍法。As a method of forming the DLC coating layer, sputtering method, vacuum evaporation method (electron beam method), ion plating method, MBE method (molecular beam epitaxy method), laser ablation method, ion-assisted method, plasma CVD method can be used A known method such as a method is preferably a sputtering method.
此外,使用全氫聚矽氮烷溶液為原料而形成的二氧化矽被膜之形成方法,首先是在套筒主體12的表面形成全氫聚矽氮烷塗布層。作為全氫聚矽氮烷塗布層的形成方法,是將全氫聚矽氮烷如前述般溶解於公知的溶劑而作成全氫聚矽氮烷溶液,將該全氫聚矽氮烷溶液利用噴塗、噴墨塗布、半月形塗布(meniscus coat)、擠出塗布(fountain coat)、浸塗、旋轉塗布、輥塗、線棒式(wire bar)塗布、氣動刮刀塗布、刮塗、簾塗等進行塗布即可。In addition, in the method of forming the silicon dioxide film formed using the perhydropolysilazane solution as a raw material, firstly, a perhydropolysilazane coating layer is formed on the surface of the
接著,對於前述全氫聚矽氮烷塗布層進行利用過熱水蒸氣之加熱處理。藉由該加熱處理,使前述全氫聚矽氮烷塗布層變成二氧化矽被膜。該過熱水蒸氣的溫度雖是100℃~300℃,但當採用CFRP製基底輥等的情況,超過200℃的加熱有導致該基底輥劣化的疑慮,因此宜為100℃~200℃。Next, the above-mentioned perhydropolysilazane coating layer is subjected to heat treatment with superheated steam. By this heat treatment, the above-mentioned perhydropolysilazane coating layer is turned into a silicon dioxide film. Although the temperature of the superheated steam is 100°C to 300°C, when a base roll made of CFRP is used, heating over 200°C may cause deterioration of the base roll, so 100°C to 200°C is preferable.
利用前述過熱水蒸氣之加熱處理可為一段處理,但宜為包含第1次及第2次加熱處理之複數段的加熱處理,較佳為將第1次加熱處理的條件設為105℃~170℃、1分~30分,將第2次加熱處理的條件設為140℃~200℃、1分~30分,且將第2次加熱處理的溫度設定成比第1次加熱處理的溫度更高。The heat treatment with the superheated steam can be performed in one stage, but it is preferably a plurality of stages of heat treatment including the first and second heat treatments, and the conditions of the first heat treatment are preferably 105°C to 170°C °C, 1 minute to 30 minutes, the conditions of the second heat treatment are set to 140°C to 200°C, 1 minute to 30 minutes, and the temperature of the second heat treatment is set to be higher than the temperature of the first heat treatment. high.
圖2係顯示將本發明的凹版印刷用無接縫套筒可裝卸地套設於印刷用基底滾筒的樣子之示意圖。藉由將本發明的凹版印刷用無接縫套筒10套設於用於進行凹版印刷之印刷用基底滾筒(中空輥)20,可製作成凹版製版輥22。作為該印刷用基底滾筒20,可使用公知的版母材等之中空輥作為印刷用基底滾筒。本發明的凹版印刷用無接縫套筒,因為是可裝卸地套設於凹版印刷裝置之印刷用基底滾筒,版更換及加工極為容易,又因為沒有接縫,而具有能進行無接縫的連續印刷之極大優點。Fig. 2 is a schematic view showing a state in which the seamless sleeve for gravure printing of the present invention is detachably fitted to a printing base cylinder. The gravure plate-
10‧‧‧凹版印刷用無接縫套筒12‧‧‧無接縫套筒主體14‧‧‧凹槽16‧‧‧表面強化被覆層20‧‧‧印刷用基底滾筒22‧‧‧凹版製版輥10‧‧‧Seamless Sleeve for Gravure
圖1係本發明的凹版印刷用無接縫套筒之主要部分之放大剖面說明圖。 圖2係將本發明的凹版印刷用無接縫套筒可裝卸地套設於印刷用基底滾筒的樣子之示意圖,(a)顯示套設前的狀態,(b)顯示套設而構成凹版製版輥後的狀態。Fig. 1 is an enlarged cross-sectional explanatory view of a main part of a seamless sleeve for gravure printing of the present invention. Fig. 2 is a schematic diagram of the state in which the seamless sleeve for gravure printing of the present invention is detachably sleeved on the base cylinder for printing, (a) shows the state before sleeve installation, and (b) shows the sleeve to form a gravure plate making state after roll.
10:凹版印刷用無接縫套筒 10: Seamless sleeve for gravure printing
12:無接縫套筒主體 12:Seamless sleeve body
14:凹槽 14: Groove
16:表面強化被覆層 16: Surface strengthening coating
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US20010042471A1 (en) * | 1999-06-16 | 2001-11-22 | Randazzo Jeffrey A. | Shock absorber cushion and method of use |
US20090044713A1 (en) * | 2005-11-02 | 2009-02-19 | Man Roland Druckmaschinen Ag | Gravure Printing-Form Sleeve and Production Thereof |
US20090140468A1 (en) * | 2006-08-03 | 2009-06-04 | Asahi Glass Company, Limited | Process for producing mold |
JP2010247375A (en) * | 2009-04-13 | 2010-11-04 | Think Laboratory Co Ltd | Gravure plate making roll and method for manufacturing the same |
US20130341823A1 (en) * | 2011-03-11 | 2013-12-26 | Sharp Kabushiki Kaisha | Mold, method for producing mold, and method for producing nanoimprint film |
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