JP5992515B2 - Manufacturing method of roll with pattern - Google Patents
Manufacturing method of roll with pattern Download PDFInfo
- Publication number
- JP5992515B2 JP5992515B2 JP2014516772A JP2014516772A JP5992515B2 JP 5992515 B2 JP5992515 B2 JP 5992515B2 JP 2014516772 A JP2014516772 A JP 2014516772A JP 2014516772 A JP2014516772 A JP 2014516772A JP 5992515 B2 JP5992515 B2 JP 5992515B2
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- pattern
- roll
- coating film
- substrate
- dlc
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000463 material Substances 0.000 claims description 46
- 239000011248 coating agent Substances 0.000 claims description 38
- 238000000576 coating method Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 229920001971 elastomer Polymers 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000005060 rubber Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 description 30
- 239000010410 layer Substances 0.000 description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 19
- 239000010949 copper Substances 0.000 description 11
- 238000007646 gravure printing Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000004049 embossing Methods 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/01—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/046—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material with at least one amorphous inorganic material layer, e.g. DLC, a-C:H, a-C:Me, the layer being doped or not
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
本発明は、DLC(ダイヤモンドライクカーボン)によってパターニングを施したパターン付ロールの製造方法に関する。 The present invention relates to a method for producing a patterned roll which has been subjected to patterning by DLC (diamond-like carbon).
パターン付ロールとしてグラビア印刷用ロールがある。グラビア印刷では、グラビア製版ロール(グラビアシリンダー)に対し、製版情報に応じた微小な凹部(グラビアセル)を形成して版面を製作し当該グラビアセルにインキを充填して被印刷物に転写するものである。一般的なグラビア製版ロールにおいては、アルミニウムや鉄などの版母材の表面に版面形成用の銅メッキ層(版材)を設け、該銅メッキ層にエッチングによって製版情報に応じ多数の微小な凹部(グラビアセル)を形成し、次いでグラビア製版ロールの耐刷力を増すためのクロムメッキによって硬質のクロム層を形成して表面強化被覆層とし、製版(版面の製作)が完了する。本願出願人は、例えば、特許文献1に記載されたグラビア製版ロールを提案している。 There is a roll for gravure printing as a roll with a pattern. In gravure printing, for a gravure printing roll (gravure cylinder), a micro concave portion (gravure cell) corresponding to the plate making information is formed to produce a plate surface, and the gravure cell is filled with ink and transferred to a printing material. is there. In a general gravure plate-making roll, a copper plating layer (plate material) for forming a plate surface is provided on the surface of a plate base material such as aluminum or iron, and a number of minute concave portions are formed on the copper plating layer according to plate making information by etching. (Gravure cell) is formed, and then a hard chromium layer is formed by chromium plating for increasing the printing durability of the gravure plate making roll to form a surface-enhanced coating layer, and plate making (plate surface production) is completed. The applicant of the present application has proposed, for example, a gravure printing roll described in Patent Document 1.
また、パターン付ロールとして成形用エンボスロールがある。熱可塑性樹脂フィルムにエンボス加工を施し、LCD用バックライトやリヤプロジェクションスクリーン等に用いられるプリズムシート、レンチキュラーシート、フレネルシート、反射防止フィルムなどの電子部品を作製したり、金属プレートにエンボス加工を施して意匠性を高めたり、滑り防止機能を持たせたりすることが行われている。本願出願人は、例えば、特許文献2に記載されたエンボスロールを提案している。 Moreover, there exists an embossing roll for shaping | molding as a roll with a pattern. Embossing thermoplastic film to produce electronic parts such as prism sheet, lenticular sheet, Fresnel sheet, anti-reflection film used for LCD backlights and rear projection screens, and embossing metal plate For example, it is possible to improve the design and to provide an anti-slip function. The applicant of the present application has proposed an embossing roll described in Patent Document 2, for example.
また、パターン付ロールとして連続めっき用ロールがある。連続めっき用ロールは、連続めっき装置に用いられるもので、例えば、リールに巻き付けた鋼板等の帯状のワークを連続的に巻き取りながらめっき浴中を通すことで、連続的にめっきを行うものである。連続めっき用ロールの例としては、例えば、特許文献3や特許文献4に開示されたシンクロール等のロールがある。 Moreover, there exists a roll for continuous plating as a roll with a pattern. The roll for continuous plating is used for a continuous plating apparatus. For example, a continuous plating is performed by continuously winding a strip-shaped workpiece such as a steel sheet wound around a reel through a plating bath. is there. As an example of the roll for continuous plating, there exist rolls, such as a sink roll disclosed by patent document 3 or patent document 4, for example.
上述したようなパターン付ロールを製作する場合、基材に感光材を塗布して露光・現像・バーニングしてエッチングすると、いわゆるサイドエッチングと呼ばれるオーバーエッチングが発生する問題があった。そして、パターニングが微細になる程、サイドエッチングの問題がより一層顕在化する。 When manufacturing a roll with a pattern as described above, if a photosensitive material is applied to a substrate and exposed, developed, burned, and etched, there is a problem that over etching called so-called side etching occurs. As the patterning becomes finer, the problem of side etching becomes more obvious.
本発明は、上記した従来技術の問題点に鑑みなされたもので、サイドエッチングの問題を解消し、耐薬品性・離型性に優れたパターン付ロールの製造方法を提供することを目的とする。 The present invention has been made in view of the problems of the prior art described above, to eliminate the side etching problem, and an object thereof is to provide a method of manufacturing a patterned roll having excellent chemical resistance, releasability .
上記課題を解決するため、本パターン付ロールは、基材の表面に感光材を塗布し、露光・現像せしめてレジストパターンを形成し、該基材及びレジストパターンの表面に第一DLC被覆膜を形成し、該レジストパターン上に形成された第一DLC被覆膜を該レジストパターンごと剥離せしめ、基材の表面にDLCパターンを形成し、前記基材及びDLCパターンの表面に第二DLC被覆膜を形成してなることを特徴とする。 To solve the above problems, with the pattern roll, a photosensitive material is applied to the surface of the substrate, to form a resist pattern caused to exposure and development, first DLC coating film on the surface of the substrate and the resist pattern The first DLC coating film formed on the resist pattern is peeled off together with the resist pattern to form a DLC pattern on the surface of the substrate, and the second DLC coating is formed on the surface of the substrate and the DLC pattern. It is characterized by forming a covering film.
このようにして、レジストパターン上に形成された第一DLC被覆膜を該レジストパターンごと剥離せしめるため、サイドエッチングの問題が解消される利点がある。すなわち、本発明では、エッチングではなくいわゆるリフトオフとよばれる手法を用いているため、従来のようなサイドエッチングの問題が生じないのである。 Thus, since the first DLC coating film formed on the resist pattern is peeled off together with the resist pattern, there is an advantage that the problem of side etching is solved. That is, in the present invention, since a technique called so-called lift-off is used instead of etching, the conventional side etching problem does not occur.
また、前記基材及びDLCパターンの表面に第二DLC被覆膜を形成するため、耐薬品性に優れ、さらに、離型性にも優れるという利点がある。 Moreover, since the 2nd DLC coating film is formed in the surface of the said base material and a DLC pattern, there exists an advantage that it is excellent in chemical-resistance and also excellent in mold release property.
前記感光材が塗布される基材が、Ni、ステンレス鋼、Ti、Cu、Alからなる群から選ばれた少なくとも一種の材料からなるのが好適である。 The substrate to which the photosensitive material is applied is preferably made of at least one material selected from the group consisting of Ni, stainless steel, Ti, Cu, and Al.
前記基材が、ゴム又はクッション性を有する樹脂からなるクッション層を備えるのが好ましい。前記クッション層としては、シリコンゴム等の合成ゴムやポリウレタン、ポリスチレン等の弾力性のある合成樹脂を使用することができる。このクッション層の厚さはクッション性即ち弾力性を付与できる厚さであればよく、特別の限定はないが、例えば、1mm〜10cm程度の厚さがあれば充分であり、1cm〜5cmの厚さが好適である。ゴム又はクッション性を有する樹脂からなるクッション層を備えたグラビア版の例としては、例えば特許文献5などがある。 It is preferable that the base material includes a cushion layer made of rubber or a resin having cushioning properties. As the cushion layer, a synthetic rubber such as silicone rubber, or a synthetic resin having elasticity such as polyurethane or polystyrene can be used. The thickness of the cushion layer is not particularly limited as long as it is a thickness capable of imparting cushioning properties, that is, elasticity. For example, a thickness of about 1 mm to 10 cm is sufficient, and a thickness of 1 cm to 5 cm is sufficient. Is preferable. As an example of a gravure plate provided with a cushion layer made of rubber or a resin having cushioning properties, there is, for example, Patent Document 5.
前記感光材が塗布される基材が、ゴム又はクッション性を有する樹脂からなるクッション性を有する材料からなるように構成してもよい。より具体的には、シリコンゴム等の合成ゴムやポリウレタン、ポリスチレン等の弾力性のある合成樹脂を基材として使用することができる。 You may comprise so that the base material with which the said photosensitive material is apply | coated may consist of the material which has cushioning properties which consist of rubber | gum or resin which has cushioning properties. More specifically, a synthetic rubber such as silicon rubber, or an elastic synthetic resin such as polyurethane or polystyrene can be used as the base material.
前記感光材としては、ポジ型感光性組成物又はネガ型感光性組成物のいずれも適用可能であるが、ネガ型感光性組成物が好ましい。 As the photosensitive material, either a positive photosensitive composition or a negative photosensitive composition is applicable, but a negative photosensitive composition is preferable.
前記第一DLC被覆膜及び第二DLC被覆膜の厚さが、0.1μm〜数10μmであるのが好ましい。より具体的には、0.1μm〜20μmが好ましく、0.1μm〜5μmがさらに好ましい。 The first DLC coating film and the second DLC coating film preferably have a thickness of 0.1 μm to several tens of μm. More specifically, 0.1 μm to 20 μm is preferable, and 0.1 μm to 5 μm is more preferable.
前記パターン付ロールが、グラビア印刷用ロールであるのが好適である。サイドエッチングの問題がないため、従来よりも濃度範囲を広げることが可能であるからである。 It is preferable that the roll with a pattern is a roll for gravure printing. This is because there is no problem of side etching, so that the concentration range can be expanded as compared with the conventional case.
本製品は、前記グラビア印刷用ロールによって印刷されたことを特徴とする。 This product is printed by the gravure roll.
前記パターン付ロールが、成形用エンボスロールであるのが好ましい。 The patterned roll is preferably an embossing roll for molding.
本製品は、前記成形用エンボスロールによって成形されたことを特徴とする。 This product is characterized by being molded by the molding embossing roll.
前記パターン付ロールが、連続めっき用ロールであるのが好ましい。 It is preferable that the roll with a pattern is a roll for continuous plating.
本製品は、前記連続めっき用ロールによってめっきされたことを特徴とする。 This product is characterized by being plated by the roll for continuous plating.
本発明のパターン付ロールの製造方法は、基材を準備する工程と、該基材の表面に感光材を塗布し、露光・現像せしめてレジストパターンを形成する工程と、該基材及びレジストパターンの表面に第一DLC被覆膜を形成する工程と、該レジストパターン上に形成された第一DLC被覆膜を該レジストパターンごと剥離せしめて基材の表面にDLCパターンを形成する工程と、前記基材及びDLCパターンの表面に第二DLC被覆膜を形成する工程と、を含むことを特徴とする。 The method for producing a patterned roll of the present invention includes a step of preparing a substrate, a step of applying a photosensitive material to the surface of the substrate, exposing and developing the resist pattern, and forming the resist pattern. Forming a first DLC coating film on the surface of the substrate, peeling the first DLC coating film formed on the resist pattern together with the resist pattern, and forming a DLC pattern on the surface of the substrate, Forming a second DLC coating film on the surface of the substrate and the DLC pattern.
前記感光材が塗布される基材が、Ni、ステンレス鋼、Ti、Cu、Alからなる群から選ばれた少なくとも一種の材料からなるのが好適である。 The substrate to which the photosensitive material is applied is preferably made of at least one material selected from the group consisting of Ni, stainless steel, Ti, Cu, and Al.
前記基材が、上述したゴム又はクッション性を有する樹脂からなるクッション層を備えるのが好ましい。 It is preferable that the base material includes a cushion layer made of the above-described rubber or a resin having cushioning properties.
前記感光材が塗布される基材が、ゴム又はクッション性を有する樹脂からなるクッション性を有する材料からなる構成としてもよい。 The base material to which the photosensitive material is applied may be made of a cushioning material made of rubber or a cushioning resin.
前記感光材としては、ポジ型感光性組成物又はネガ型感光性組成物のいずれも適用可能であるが、ネガ型感光性組成物が好ましい。 As the photosensitive material, either a positive photosensitive composition or a negative photosensitive composition is applicable, but a negative photosensitive composition is preferable.
前記第一DLC被覆膜及び第二DLC被覆膜の厚さが、0.1μm〜数10μmであるのが好ましい。 The first DLC coating film and the second DLC coating film preferably have a thickness of 0.1 μm to several tens of μm.
本発明によれば、サイドエッチングの問題を解消し、耐薬品性・離型性に優れたパターン付ロールの製造方法を提供することができるという著大な効果を有する。 ADVANTAGE OF THE INVENTION According to this invention, it has the remarkable effect that the problem of a side etching can be eliminated and the manufacturing method of the roll with a pattern excellent in chemical resistance and mold release property can be provided.
以下に本発明の実施の形態を説明するが、これら実施の形態は例示的に示されるもので、本発明の技術思想から逸脱しない限り種々の変形が可能なことはいうまでもない。 Embodiments of the present invention will be described below, but these embodiments are exemplarily shown, and it goes without saying that various modifications can be made without departing from the technical idea of the present invention.
図1において、符号10はパターン付ロールを示す。符号12は基材を示し、Ni、ステンレス鋼、Ti、Cu、Alからなる群から選ばれた少なくとも一種の材料からなるものを用いることができる。また、ゴム又はクッション性を有する樹脂からなるクッション層を備えるようにしてもよい。さらに、基材が、ゴム又はクッション性を有する樹脂からなるクッション性を有する材料からなるように構成することもできる。該クッション層は、ゴム又はクッション性を有する樹脂からなり、1mm〜10cm程度、好ましくは1cm〜5cmの均一な厚さで表面の平滑度が高いシート状のものを、継ぎ目に隙間が開かないように基材12に強固に接着し、その後精密円筒研削、鏡面研磨される。 In FIG. 1, the code | symbol 10 shows a roll with a pattern. The code | symbol 12 shows a base material and what consists of at least 1 type of material chosen from the group which consists of Ni, stainless steel, Ti, Cu, and Al can be used. Moreover, you may make it provide the cushion layer which consists of resin which has rubber | gum or cushioning properties. Furthermore, it can also comprise so that a base material may consist of the material which has cushioning properties which consist of rubber | gum or resin which has cushioning properties. The cushion layer is made of rubber or a resin having a cushioning property, and a sheet-like material having a uniform thickness of about 1 mm to 10 cm, preferably 1 cm to 5 cm and having high surface smoothness, does not open a gap at the seam. The substrate 12 is firmly bonded to the substrate 12, and then precision cylindrical grinding and mirror polishing are performed.
まず、基材12の表面に感光材14を塗布する(図1(a)及び図2のステップ100)。露光・現像せしめてレジストパターン16を形成する(図1(b)及び図2のステップ102)。感光材として用いる感光性組成物はネガ型及びポジ型のいずれでも使用可能であるが、ネガ型感光性組成物を用いるのが好ましい。 First, the photosensitive material 14 is applied to the surface of the substrate 12 (step 100 in FIG. 1A and FIG. 2). The resist pattern 16 is formed by exposure and development (step 102 in FIG. 1B and FIG. 2). The photosensitive composition used as the photosensitive material can be either a negative type or a positive type, but it is preferable to use a negative photosensitive composition.
次に、該基材12及びレジストパターン16の表面に第一DLC被覆膜18を形成する(図1(c)及び図2のステップ104)。第一DLC被覆膜はCVD(Chemical Vapor Deposition)法やスパッタ法によって形成すればよい。 Next, a first DLC coating film 18 is formed on the surface of the substrate 12 and the resist pattern 16 (step 104 in FIG. 1C and FIG. 2). The first DLC coating film may be formed by a CVD (Chemical Vapor Deposition) method or a sputtering method.
次いで、該レジストパターン上に形成された第一DLC被覆膜を該レジストパターンごと剥離せしめ、基材の表面にDLCパターン20を形成する(図1(d)及び図2のステップ106)。 Next, the first DLC coating film formed on the resist pattern is peeled off together with the resist pattern to form the DLC pattern 20 on the surface of the base material (step 106 in FIGS. 1D and 2).
次に、該基材12及びDLCパターン20の表面に第二DLC被覆膜24を形成する(図1(e)及び図2のステップ108)。第二DLC被覆膜24はCVD(Chemical Vapor Deposition)法やスパッタ法によって形成すればよい。 Next, a second DLC coating film 24 is formed on the surface of the substrate 12 and the DLC pattern 20 (step 108 in FIGS. 1E and 2). The second DLC coating film 24 may be formed by a CVD (Chemical Vapor Deposition) method or a sputtering method.
以下に実施例をあげて本発明をさらに具体的に説明するが、これらの実施例は例示的に示されるもので限定的に解釈されるべきでないことはいうまでもない。 The present invention will be described more specifically with reference to the following examples. However, it is needless to say that these examples are shown by way of illustration and should not be construed in a limited manner.
(実施例1)
円周600mm、面長1100mmの版母材(アルミ中空ロール)を準備し、ブーメランライン(株式会社シンク・ラボラトリー製全自動レーザーグラビア製版ロール製造装置)を用いて下記する銅メッキ層及びニッケルメッキ層の形成までを行った。まず、版母材(アルミ中空ロール)を銅メッキ槽に装着し、中空ロールをメッキ液に全没させて20A/dm2、6.0Vで80μmの銅メッキ層を形成した。メッキ表面はブツやピットの発生がなく、均一な銅メッキ層を得た。この銅メッキ層の表面を4ヘッド型研磨機(株式会社シンク・ラボラトリー製研磨機)を用いて研磨して当該銅メッキ層の表面を均一な研磨面とした。次いで、ニッケルメッキ槽に装着し、メッキ液に半没させて2A/dm2、7.0Vで3μmのニッケルメッキ層を形成した。メッキ表面はブツやピットの発生がなく、均一なニッケルメッキ層を得た。上記形成したニッケルメッキ層を基材としてその表面に感光膜(サーマルレジスト:TSER−NS(株式会社シンク・ラボラトリー製))を塗布(ファウンテンコーター)、乾燥した。得られた感光膜の膜厚は膜厚計(FILLMETRICS社製F20、松下テクノトレーデイング社販売)で計ったところ、7μmであった。ついで、画像をレーザー露光し現像した。上記レーザー露光は、Laser Stream FXを用い露光条件300mJ/cm2で所定のパターン露光を行った。また、上記現像は、TLD現像液(株式会社シンク・ラボラトリー製現像液)を用い、現像液希釈比率(原液1:水7)で、24℃90秒間行い、所定のレジストパターンを形成した。Example 1
A plate base material (aluminum hollow roll) having a circumference of 600 mm and a surface length of 1100 mm is prepared, and a copper plating layer and a nickel plating layer described below using a boomerang line (a fully automatic laser gravure plate making apparatus manufactured by Sink Laboratory Co., Ltd.) To the formation of. First, a plate base material (aluminum hollow roll) was mounted on a copper plating tank, and the hollow roll was completely immersed in a plating solution to form a copper plating layer of 80 μm at 20 A / dm 2 and 6.0 V. The plating surface was free of bumps and pits, and a uniform copper plating layer was obtained. The surface of the copper plating layer was polished using a 4-head type polishing machine (Sink Laboratory Co., Ltd. polishing machine) to make the surface of the copper plating layer a uniform polishing surface. Next, it was mounted in a nickel plating tank and immersed in a plating solution to form a 3 μm nickel plating layer at 2 A / dm 2 and 7.0 V. The plating surface was free of bumps and pits, and a uniform nickel plating layer was obtained. Using the formed nickel plating layer as a base material, a photosensitive film (thermal resist: TSER-NS (manufactured by Sink Laboratories)) was applied to the surface (fountain coater) and dried. The film thickness of the obtained photosensitive film was 7 μm as measured by a film thickness meter (F20 manufactured by FILLMETRICS, sold by Matsushita Techno Trading). The image was then developed with laser exposure. In the laser exposure, a laser stream FX was used and a predetermined pattern exposure was performed under an exposure condition of 300 mJ / cm 2 . The development was performed at 24 ° C. for 90 seconds at a developer dilution ratio (stock solution 1: water 7) using a TLD developer (Sink Laboratory Co., Ltd. developer) to form a predetermined resist pattern.
該ニッケルメッキ層及びレジストパターンの表面に第一DLC被覆膜をCVD法で形成した。雰囲気アルゴン/水素ガス雰囲気、原料ガスにヘキサメチルジシロキサン、成膜温度80−120℃、成膜時間60分で膜厚0.1μmの中間層を成膜した。次に、原料ガスにトルエン、成膜温度80−120℃、成膜時間180分で膜厚5μmの第一DLC被覆膜を成膜した。 A first DLC coating film was formed on the surface of the nickel plating layer and the resist pattern by a CVD method. An intermediate layer having a film thickness of 0.1 μm was formed in an argon / hydrogen gas atmosphere, hexamethyldisiloxane as a source gas, a film formation temperature of 80 to 120 ° C., and a film formation time of 60 minutes. Next, a first DLC coating film having a film thickness of 5 μm was formed on the source gas using toluene, a film formation temperature of 80 to 120 ° C., and a film formation time of 180 minutes.
次いで、該中空ロールを水酸化ナトリウム水溶液中で超音波処理を30分行った。そして、該レジストパターン上に形成された第一DLC被覆膜を該レジストパターンごと剥離せしめ、基材の表面にDLCパターンが形成された。 Next, the hollow roll was sonicated in an aqueous sodium hydroxide solution for 30 minutes. And the 1st DLC coating film formed on this resist pattern was peeled with this resist pattern, and the DLC pattern was formed in the surface of a base material.
さらに、該ニッケルメッキ層及びDLCパターンの表面に第二DLC被覆膜をCVD法で形成した。雰囲気アルゴン/水素ガス雰囲気、原料ガスにヘキサメチルジシロキサン、成膜温度80−120℃、成膜時間60分で膜厚0.1μmの中間層を成膜した。次に、原料ガスにトルエン、成膜温度80−120℃、成膜時間180分で膜厚5μmの第二DLC被覆膜を成膜した。このようにして、グラビア印刷用ロールを得た。 Further, a second DLC coating film was formed on the surface of the nickel plating layer and the DLC pattern by a CVD method. An intermediate layer having a film thickness of 0.1 μm was formed in an argon / hydrogen gas atmosphere, hexamethyldisiloxane as a source gas, a film formation temperature of 80 to 120 ° C., and a film formation time of 60 minutes. Next, a second DLC coating film having a thickness of 5 μm was formed on the source gas with toluene, a film formation temperature of 80 to 120 ° C., and a film formation time of 180 minutes. In this way, a roll for gravure printing was obtained.
このグラビア印刷用ロールの表面を光学顕微鏡で観察したところ、図3に示す高精細なグラビア版が観察された。図3において、第二DLC被覆膜24が形成されたDLCパターン20の線幅は10μmであり、グラビアセル22は、一辺が145μmであった。また、グラビアセル22の深度は5.1μmであった。 When the surface of this gravure printing roll was observed with an optical microscope, a high-definition gravure plate shown in FIG. 3 was observed. In FIG. 3, the line width of the DLC pattern 20 on which the second DLC coating film 24 is formed is 10 μm, and the gravure cell 22 has a side of 145 μm. The depth of the gravure cell 22 was 5.1 μm.
(実施例2)
パターニング形状を変えた以外は実施例1と同様にして、成形用エンボスロールを得た。得られた成形用エンボスロールを光学顕微鏡で観察したところ、高精細なDLCパターンが観察された。第二DLC被覆膜24が形成されたDLCパターン20の線幅は30μmであった。(Example 2)
An embossing roll for molding was obtained in the same manner as in Example 1 except that the patterning shape was changed. When the obtained embossing roll for molding was observed with an optical microscope, a high-definition DLC pattern was observed. The line width of the DLC pattern 20 on which the second DLC coating film 24 was formed was 30 μm.
(実施例3)
パターニング形状を変えた以外は実施例1と同様にして、連続めっき用ロールを得た。得られた連続めっき用ロールを電子顕微鏡で観察したところ、高精細なDLCパターンが観察された。第二DLC被覆膜24が形成されたDLCパターン20の線幅は8μmであった。(Example 3)
A roll for continuous plating was obtained in the same manner as in Example 1 except that the patterning shape was changed. When the obtained roll for continuous plating was observed with an electron microscope, a high-definition DLC pattern was observed. The line width of the DLC pattern 20 on which the second DLC coating film 24 was formed was 8 μm.
(実施例4)
レジストパターン形成の表面の基材をステンレス鋼とした以外は実施例1と同様にして、グラビア印刷用ロールを得た。得られたグラビア印刷用ロールを電子顕微鏡で観察したところ、第二DLC被覆膜が形成された高精細なDLCパターンが観察された。Example 4
A gravure printing roll was obtained in the same manner as in Example 1 except that the base material on the surface on which the resist pattern was formed was stainless steel. When the obtained gravure printing roll was observed with an electron microscope, a high-definition DLC pattern on which the second DLC coating film was formed was observed.
(実施例5)
レジストパターン形成の表面の基材をチタンとした以外は実施例1と同様にして、グラビア印刷用ロールを得た。得られたグラビア印刷用ロールを電子顕微鏡で観察したところ、第二DLC被覆膜が形成された高精細なDLCパターンが観察された。(Example 5)
A gravure printing roll was obtained in the same manner as in Example 1 except that the substrate on the surface of resist pattern formation was titanium. When the obtained gravure printing roll was observed with an electron microscope, a high-definition DLC pattern on which the second DLC coating film was formed was observed.
基材として、シリコンゴム上に板厚0.4mmのニッケルスリーブを嵌着せしめたロールを使用した以外は実施例1〜3と同様にしてパターン付ロールを作製した。得られたパターン付ロールを電子顕微鏡で観察したところ、第二DLC被覆膜が形成された高精細なDLCパターンが観察された。 A patterned roll was produced in the same manner as in Examples 1 to 3 except that a roll in which a nickel sleeve having a thickness of 0.4 mm was fitted on silicon rubber was used as the base material. When the obtained roll with a pattern was observed with the electron microscope, the high-definition DLC pattern in which the 2nd DLC coating film was formed was observed.
基材として、シリコンゴムを用いたロールを使用した以外は実施例1と同様にしてパターン付ロールを作製した。得られたパターン付ロールを電子顕微鏡で観察したところ、第二DLC被覆膜が形成された高精細なDLCパターンが観察された。 A patterned roll was produced in the same manner as in Example 1 except that a roll using silicon rubber was used as the substrate. When the obtained roll with a pattern was observed with the electron microscope, the high-definition DLC pattern in which the 2nd DLC coating film was formed was observed.
10:パターン付ロール、12:基材、14:感光材、16:レジストパターン、18:第一DLC被覆膜、20:DLCパターン、22:グラビアセル、24:第二DLC被覆膜。 10: roll with pattern, 12: substrate, 14: photosensitive material, 16: resist pattern, 18: first DLC coating film, 20: DLC pattern, 22: gravure cell, 24: second DLC coating film.
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