TWI744088B - Manufacturing method of resin molded product and resin molding device - Google Patents

Abstract

The invention provides a method for manufacturing a resin molded product and a resin molding device, which can improve the positioning accuracy of a lead frame. The method of manufacturing a resin molded product of the present invention includes: a carrying-in step of holding a support member supporting a lead frame and carrying it into a molding die; and a resin molding step of resin-forming the lead frame, and in the carrying-in step, The lead frame separates the support member and positions the lead frame relative to the forming die.

Description

Manufacturing method of resin molded product and resin molding device

The present invention relates to a method of manufacturing a resin molded product and a technology of a resin molding device.

Patent Document 1 discloses a technique related to a resin molding device that resin seals a lead frame. The resin molding device includes: a carrier on which a plurality of lead frames are arranged and mounted; and a lower mold for positioning the carrier by inserting a flat surface into the carrier. In the resin molding apparatus, the positioning of the carrier plate with respect to the lower mold is performed to indirectly perform the positioning of the lead frame with respect to the lower mold. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 5-21440

[The problem to be solved by the invention] In the resin molding apparatus disclosed in Patent Document 1, positioning is performed with respect to the lower mold in a state where the lead frame and the carrier plate are integrated. Therefore, an alignment error may occur between the lead frame and the carrier, and it may be difficult to position with high accuracy. That is, in this structure, the positioning error of the carrier plate with respect to the lower mold and the positioning error of the lead frame with respect to the carrier plate respectively occur, and it is difficult to accurately position the lead frame with respect to the lower mold.

The present invention is made in view of the above-mentioned situation, and the problem to be solved is to provide a method of manufacturing a resin molded product and a resin molding apparatus that can improve the positioning accuracy of the lead frame. [Technical means to solve the problem]

The problem to be solved by the present invention is as described above. In order to solve the problem, the method of manufacturing a resin molded article of the present invention includes: a carrying-in step of holding a support member supporting the lead frame and carrying it into a molding die; and a resin molding step, The lead frame is resin-molded, and in the carrying-in step, the support member is separated from the lead frame, and the lead frame is positioned relative to the forming mold.

Furthermore, the resin molding apparatus of the present invention includes: a molding die; and a carry-in mechanism for holding a support member supporting the lead frame and carrying it into the molding die, the molding die includes: a first placing portion for placing the lead wire Frame; and a second placing portion for placing the supporting member separated from the lead frame. [Effects of the invention]

According to the present invention, the positioning accuracy of the lead frame can be improved.

First, the structure of the resin molding apparatus 1 of this embodiment is demonstrated using FIGS. 1-4 (a) and 4 (b). The resin molding apparatus 1 resin-encapsulates electronic parts such as semiconductor wafers to produce a resin molded product. Particularly in this embodiment, a resin molding apparatus 1 that performs resin molding by a transfer mould method is exemplified.

The resin molding apparatus 1 shown in FIG. 1 includes a supply module 100, a resin molding module 200, and a carry-out module 300 as structural elements. Each structural element is detachable and replaceable relative to other structural elements.

The supply module 100 supplies the lead frame 10 and the resin ingot T to the resin molding module 200, and the lead frame 10 is a kind of substrate on which electronic components are mounted. In addition, the lead frame 10 is exemplified in the present embodiment, but in addition to the lead frame 10, other various substrates (glass epoxy substrate, ceramic substrate, resin substrate, metal substrate, etc.) can also be used. In addition, as will be described later, in this embodiment, the lead frame 10 is moved (carried in, carried out, etc.) in a state supported by the carrier plate 20. The supply module 100 mainly includes a frame delivery unit 110, a frame supply unit 120, a resin delivery unit 130, a resin supply unit 140, a loader 150, and a control unit 160. In addition, the details will be described below, but the tray 20 is an embodiment of the supporting member of the present invention.

The frame delivery unit 110 delivers the lead frame 10 that is not resin-sealed and accommodated in a cassette unit (not shown) to the frame supply unit 120. The frame supply part 120 receives the lead frames 10 from the frame delivery part 110, arranges the received lead frames 10 appropriately, and delivers them to the loader 150.

The resin delivery unit 130 receives the resin ingot T from a stocker (not shown), and sends the resin ingot T to the resin supply unit 140. The resin supply unit 140 receives the resin ingots T from the resin delivery unit 130, arranges the received resin ingots T appropriately, and delivers them to the loader 150.

The loader 150 transports the lead frame 10 and the resin ingot T received from the frame supply unit 120 and the resin supply unit 140 to the resin molding module 200. In addition, the loader 150 is an embodiment of the carry-in mechanism of the present invention.

The control unit 160 controls the operation of each module of the resin molding apparatus 1. The control unit 160 controls the operations of the supply module 100, the resin molding module 200, and the unloading module 300. Furthermore, the operation of each module can be arbitrarily changed (adjusted) using the control unit 160.

In addition, in this embodiment, the example in which the control part 160 is provided in the supply module 100 is shown, but the control part 160 may be provided in another module. Moreover, a plurality of control units 160 may be provided. For example, the control unit 160 may be provided for each module or each device, and the operations of the modules and the like may be individually controlled while interlocking with each other.

The resin molding module 200 resin-encapsulates the electronic components mounted on the lead frame 10. In this embodiment, two resin molding modules 200 are arranged side by side. By using the two resin molding modules 200 to simultaneously perform resin sealing of the lead frame 10, the manufacturing efficiency of the resin molded product can be improved. The resin molding module 200 mainly includes a molding die 210 and a mold clamping mechanism 220 (refer to FIG. 4(a) and FIG. 4(b)).

The molding die 210 shown in FIG. 1 uses a molten resin material to resin-seal the electronic components mounted on the lead frame 10. The forming mold 210 includes a pair of upper and lower molds, that is, an upper mold (not shown) and a lower mold 210U (refer to FIGS. 2 to 4(a) and 4(b), etc.). The forming mold 210 is provided with a heating unit (not shown) such as a heater.

The mold clamping mechanism 220 shown in FIGS. 4(a) and 4(b) moves the lower mold 210U up and down, thereby clamping or opening the forming mold 210 (upper mold and lower mold 210U). In addition, for the sake of convenience, illustration of the mold clamping mechanism 220 is omitted in figures other than FIGS. 4(a) and 4(b).

The carry-out module 300 shown in FIG. 1 receives the resin-sealed lead frame 10 from the resin-molded module 200 and carries it out. The unloading module 300 mainly includes an unloader 310 and a substrate accommodating part 320.

The unloader 310 supports the resin-sealed lead frame 10 and carries it out to the substrate storage part 320. In addition, the unloader 310 is an embodiment of the unloading mechanism of the present invention. The substrate accommodating part 320 accommodates the lead frame 10 sealed with resin.

Next, the outline of the operation of the resin molding apparatus 1 configured as described above (the method of manufacturing a resin molded product using the resin molding apparatus 1) will be described using FIGS. 1 and 5.

The manufacturing method of the resin molded product of this embodiment mainly includes the carrying-in step S10, the resin molding step S20, and the carrying-out step S30.

The carrying-in step S10 is a step of carrying the lead frame 10 and the resin ingot T into the resin molding module 200.

In the carrying-in step S10, the frame delivery part 110 delivers the lead frame 10 (more specifically, the carrier tray 20 which supports the lead frame 10) accommodated in the cassette unit (not shown) to the frame supply part 120. The frame supply unit 120 arranges the received lead frames 10 appropriately and delivers them to the loader 150.

In addition, the resin delivery unit 130 delivers the resin ingot T received from the stocker (not shown) to the resin supply unit 140. The resin supply unit 140 delivers the required number of received resin ingots T to the loader 150.

The loader 150 transports the received lead frame 10 and the resin ingot T to the molding die 210 of the resin molding module 200. After the lead frame 10 and the resin ingot T are transported to the molding die 210, the process proceeds from the loading step S10 to the resin molding step S20.

The resin molding step S20 is a step of resin-sealing the electronic components mounted on the lead frame 10.

In the resin molding step S20, the mold clamping mechanism 220 (refer to FIGS. 4(a) and 4(b)) clamps the molding mold 210. Next, the resin ingot T is heated and melted by the heating part (not shown) of the molding die 210, and the lead frame 10 is resin-sealed using the generated fluid resin. After the lead frame 10 is resin-sealed, the process proceeds from the resin molding step S20 to the unloading step S30.

The unloading step S30 is a step of receiving the resin-sealed lead frame 10 from the resin molding module 200 and unloading it.

In the unloading step S30, the mold clamping mechanism 220 (refer to FIG. 4(a) and FIG. 4(b)) opens the forming mold 210. Next, the resin-sealed lead frame 10 is demolded. Then, the unloader 310 unloads the lead frame 10 from the forming mold 210 and accommodates it in the board accommodating part 320 of the unloading module 300. At this time, unnecessary parts (sluggish material, runner, etc.) of the resin-molded lead frame 10 are appropriately removed.

Next, using FIGS. 2 to 4(a) and 4(b) and FIG. 11, the loading of the resin molding apparatus 1 and the lead frame 10 to the resin molding module 200, and the transfer from the resin molding module 200 Move out the relevant structure for more detailed explanation. Specifically, the structures of the forming mold 210 (lower mold 210U), the loader 150 and the unloader 310, and the lead frame 10 and the carrier plate 20 will be described. In addition, in this embodiment, the outline of each member described below is illustrated (illustrated), and the specific shape, arrangement, number, etc. of each member are not limited.

The lower mold 210U shown in FIGS. 2 to 4(a) and 4(b) mainly includes a lower mold body 211, a set block 212, a cavity block 213, and a barrel block ( pot block) 214, frame positioning pins 215, lower mold side carrier positioning pins 216, and ejector pins 217.

The lower mold body 211 is a member that forms the main part of the lower mold 210U. In addition, the lower mold body 211 is an embodiment of the second placement part of the present invention. The lower mold body 211 is formed in a substantially rectangular shape in plan view. The lower mold body 211 is formed to have appropriate upper and lower thicknesses.

The installation block 212 is a substantially rectangular parallelepiped member. The setting block 212 is provided on the upper surface of the lower mold body 211. The installation blocks 212 are respectively arranged in the vicinity (outer peripheral portion) of the four sides of the lower mold main body 211 formed in a substantially rectangular shape in a plan view.

The cavity block 213 is a member that forms a cavity 213a to which a resin material is supplied. In addition, the cavity block 213 is an embodiment of the first placement part of the present invention. The cavity block 213 is formed to have a substantially horizontal upper surface. The cavity block 213 is formed to have an appropriate height (width in the vertical direction). More specifically, the height of the cavity block 213 is formed so as to be larger than the thickness (width in the vertical direction) of the carrier plate 20 described later. On the upper surface of the cavity block 213, a cavity 213a having a shape corresponding to the product (resin molded product) is formed. The cavity block 213 is appropriately disposed on the upper surface of the lower mold body 211. In this embodiment, as shown in FIG. 2, the six cavity blocks 213 are arranged at appropriate intervals from each other.

The cylinder block 214 shown in FIGS. 2 and 3 is a member that forms a cylinder 214 a that contains the resin ingot T supplied from the supply module 100. The cartridge block 214 is formed to have a substantially horizontal upper surface. The cylinder block 214 is formed to have approximately the same height (width in the vertical direction) as the cavity block 213. The cylinder block 214 is appropriately arranged so as to be adjacent to the cavity block 213. In the present embodiment, as shown in FIG. 2, the barrel block 214 is arranged approximately in the center of the plurality of arranged cavity blocks 213. In the cylinder block 214, a cylinder 214a is formed so as to open on the upper surface. A plurality of the cylinders 214a are formed at a suitable interval from each other.

The frame positioning pins 215 shown in FIGS. 2 to 4(a) and 4(b) are members for positioning the lead frame 10 (positioning with respect to the lower mold 210U). In addition, the frame positioning pin 215 is an embodiment of the molding die side positioning member of the present invention. The frame positioning pin 215 is formed in a substantially cylindrical shape. The frame positioning pin 215 is arranged so that the axial direction thereof faces the vertical direction (vertical direction). The frame positioning pin 215 is fixed on the upper surface of the lower mold body 211. A plurality of frame positioning pins 215 are arranged around the cavity block 213. The height of the frame positioning pin 215 (the position of the upper end) is formed to be higher than the height of the cavity block 213 (the position of the upper surface). The upper end of the frame positioning pin 215 is formed in a shape (tapered) with a tapered tip.

The lower mold side disc carrier positioning pin 216 is a member for positioning the disc carrier 20 (positioning with respect to the lower mold 210U) described later. The lower mold side carrier positioning pin 216 is formed in a substantially cylindrical shape. The lower mold side carrier positioning pin 216 is arranged such that the axial direction thereof faces the vertical direction (vertical direction). The lower mold side carrier positioning pin 216 is fixed to the upper surface of the lower mold body 211. A plurality of positioning pins 216 on the lower mold side carrier are arranged around the cavity block 213. The upper end portion of the lower mold side carrier positioning pin 216 is formed in a shape (taper shape) with a tapered tip.

The ejector pin 217 shown in FIGS. 2 and 4(a) and 4(b) is a member for demolding the carrier plate 20 and the lower mold 210U described later. The ejector pin 217 is formed in a substantially cylindrical shape. The ejector pin 217 is arranged so that the axial direction thereof faces the vertical direction (vertical direction). A plurality of ejector pins 217 are arranged around the cavity block 213. The ejector pin 217 is configured to be inserted into a through hole formed in the lower mold main body 211 so as to be relatively movable up and down with respect to the lower mold main body 211.

The loader 150 shown in FIGS. 4( a) and 4 (b) mainly includes a loader body 151, a positioning rod 152, a chuck 153, a loader-side tray positioning pin 154, and an elastic member 155.

The loader body 151 is a member forming the main part of the loader 150. The loader body 151 is formed to have appropriate upper and lower thicknesses. The loader main body 151 is formed with a receiving hole 151a that can accommodate a loader-side disk positioning pin 154 and an elastic member 155 described later. The receiving hole 151a is formed in such a way that it opens on the lower surface of the loader body 151. A plurality of accommodating holes 151a are formed at appropriate intervals with each other. The loader body 151 can be moved in the horizontal direction and the vertical direction (vertical direction) by an appropriate moving mechanism.

The positioning rod 152 is a member for positioning the loader 150 (positioning with respect to the lower mold 210U). The positioning rod 152 is provided on the lower surface of the loader body 151. A plurality of positioning rods 152 are arranged on the outer peripheral portion of the loader body 151.

The chuck 153 holds the carrier disk 20 described later. The chuck 153 is provided on the lower surface of the loader body 151. A plurality of chucks 153 are provided at appropriate intervals with each other. The chuck 153 is formed in a substantially L-shape in a side view. More specifically, the chuck 153 is formed such that the lower end portion extends inward (the center side of the loader body 151). The upper end of the chuck 153 is rotatably connected with the loader body 151. The chuck 153 is rotated by the driving force of a driving source (for example, a motor, a cylinder, etc.) not shown.

The loader-side tray positioning pin 154 is a member for performing positioning (positioning with respect to the loader 150) of the tray 20 described later. In addition, the loader-side tray positioning pin 154 is an embodiment of the loading mechanism-side positioning member of the present invention. The loader-side tray positioning pin 154 is formed in an elongated shape with the axial direction directed in the vertical direction (vertical direction). The loader-side tray positioning pin 154 mainly includes a body portion 154a and a taper portion 154b.

The main body 154a is a part that forms the upper part of the loader-side disc loading pin 154. In addition, the main body 154a is an embodiment of the first part of the present invention. The main body 154a is formed in a substantially cylindrical shape. The main body 154a is formed in such a way that the diameter is substantially constant in the entire length direction.

The tapered portion 154b is a portion that forms the lower portion of the loader-side tray positioning pin 154. In addition, the taper portion 154b is an embodiment of the second part of the present invention. The tapered portion 154b is formed in a shape (tapered) with a tapered tip. That is, the diameter of the upper end of the tapered portion 154b is formed in the same manner as the diameter of the main body portion 154a. In addition, the tapered portion 154b is formed such that the diameter gradually decreases from the upper end to the front end (lower end).

The upper portion (body portion 154 a) of the loader-side disc positioning pin 154 is accommodated in the accommodating hole 151 a of the loader body 151. The loader side tray positioning pin 154 is arranged to be movable up and down in the receiving hole 151a. The loader-side tray positioning pin 154 is at a predetermined position, and its downward movement is restricted so as not to fall off from the accommodating hole 151a.

The elastic member 155 is a member for pressing the positioning pin 154 of the loader side tray. The elastic member 155 is accommodated in the accommodating hole 151a of the loader body 151 (upper side of the loader-side disc positioning pin 154). As the elastic member 155, for example, a compression coil spring or the like can be used. The elastic member 155 presses the loader-side tray positioning pin 154 downward (in the direction protruding from the accommodating hole 151a).

The unloader 310 shown in FIG. 11 mainly includes an unloader body 311 and a chuck 313. In addition, the chuck 313 is an embodiment of the support part of the present invention. The structure of the unloader 310 (the unloader body 311 and the chuck 313) is substantially the same as the structure of the loader 150 (the loader body 151 and the chuck 153), so a detailed description is omitted.

The lead frame 10 shown in FIGS. 3 and 4 (a) and FIG. 4 (b) mainly includes a first positioning hole 11 and a second positioning hole 12.

The first positioning hole 11 is a hole for positioning the lead frame 10 relative to the carrier 20. The first positioning hole 11 is formed to penetrate the lead frame 10 up and down. A plurality of first positioning holes 11 are formed at intervals.

The inner diameter of the first positioning hole 11 is formed to be slightly larger than the outer diameter of the holding pin 21 of the carrier disk 20. In addition, the interval (clearance) between the first positioning hole 11 and the holding pin 21 is appropriately set so that the positioning can be performed with sufficient accuracy.

The second positioning hole 12 is a hole for positioning the lead frame 10 relative to the lower mold 210U. The second positioning hole 12 is formed to penetrate the lead frame 10 up and down. A plurality of second positioning holes 12 are formed at intervals. The second positioning hole 12 is arranged at a position corresponding to the frame positioning pin 215 of the lower mold 210U.

The inner diameter of the second positioning hole 12 is formed to be slightly larger than the outer diameter of the frame positioning pin 215 of the lower mold 210U. In addition, the interval (clearance) between the second positioning hole 12 and the frame positioning pin 215 is appropriately set so that the positioning can be performed with sufficient accuracy.

The tray 20 is a member used when the lead frame 10 is transported. In addition, the tray 20 is an embodiment of the supporting member of the present invention. The tray 20 can support a plurality of lead frames 10 from below. The loader 150 or the unloader 310 holds and transports the carrier tray 20, so that a plurality of lead frames 10 can be easily transported. The tray 20 is formed in a plate shape having an appropriate shape. The tray 20 mainly includes a holding pin 21, a first positioning hole 22, a second positioning hole 23 and a third positioning hole 24.

The holding pin 21 is a member for positioning the lead frame 10 (positioning with respect to the carrier disk 20) and holding the lead frame 10 with respect to the carrier disk 20. The holding pin 21 is formed in a substantially cylindrical shape. The holding pin 21 is arranged so that the axial direction faces the vertical direction (vertical direction). The upper end of the holding pin 21 is formed in a shape (tapered) with a tapered tip. The holding pin 21 is fixed to the upper surface of the tray 20. A plurality of holding pins 21 are provided at intervals. The holding pin 21 is arranged at a position corresponding to the first positioning hole 11 of the supported lead frame 10.

The first positioning hole 22 is a hole for positioning the tray 20 relative to the loader 150. In addition, the first positioning hole 22 is an embodiment of the first through hole and the through hole of the present invention. The first positioning hole 22 is formed to penetrate the tray 20 up and down. A plurality of first positioning holes 22 are formed at intervals. The first positioning hole 22 is arranged at a position corresponding to the positioning pin 154 on the loader side of the loader 150.

The inner diameter of the first positioning hole 22 is formed to be slightly larger than the outer diameter of the loader-side disc positioning pin 154 (more specifically, the body portion 154a) of the loader 150. In addition, the interval (clearance) between the first positioning hole 22 and the main body portion 154a of the loader-side disc carrier positioning pin 154 is appropriately set so that the positioning can be performed with sufficient accuracy.

The second positioning hole 23 is a hole for positioning the tray 20 relative to the lower mold 210U. In addition, the second positioning hole 23 is an embodiment of the second through hole of the present invention. The second positioning hole 23 is formed to penetrate the carrier disk 20 up and down. A plurality of second positioning holes 23 are formed at intervals. The second positioning hole 23 is arranged at a position corresponding to the frame positioning pin 215 of the lower mold 210U.

The inner diameter of the second positioning hole 23 is formed to be slightly larger than the outer diameter of the frame positioning pin 215 of the lower mold 210U.

The third positioning hole 24 is a hole for positioning the tray 20 relative to the lower mold 210U. The third positioning hole 24 is formed to penetrate the tray 20 up and down. A plurality of third positioning holes 24 are formed at intervals. The third positioning hole 24 is arranged at a position corresponding to the positioning pin 216 of the lower mold side tray carrier of the lower mold 210U.

The inner diameter of the third positioning hole 24 is formed so as to be slightly larger than the outer diameter of the lower mold side carrier positioning pin 216 of the lower mold 210U. In addition, the interval (clearance) between the third positioning hole 24 and the lower mold-side carrier positioning pin 216 is appropriately set so that the positioning can be performed with sufficient accuracy.

In this embodiment, the carrier plate 20 can be used to support the lead frame 10. Specifically, as shown in FIGS. 4( a) and 4 (b ), by placing the lead frame 10 on the carrier tray 20, the carrier tray 20 can support the lead frame 10 from below. At this time, by inserting the holding pin 21 of the carrier disk 20 into the first positioning hole 11 of the lead frame 10, the positioning of the lead frame 10 with respect to the carrier disk 20 is performed.

In addition, in the present embodiment, as shown in FIG. 3, three lead frames 10 are each placed on two carrier trays 20 arranged on the left and right sides of the paper. In this embodiment, such two carrier plates 20 (that is, the six-piece lead frame 10) can be transported at the same time.

Next, using Figure 1, Figure 4 (a) and Figure 4 (b), Figure 6 to Figure 9 (a) and Figure 9 (b), the loading step S10 to the forming mold 210 (bottom The mold 210U) is carried into the lead frame 10 for a specific description.

In the carrying-in step S10, first, the carrier tray 20 on which the lead frame 10 is mounted is delivered to the loader 150 from the frame supply part 120 (refer to FIG. 1), and is held by the loader 150. Specifically, the chuck 153 of the loader 150 is appropriately rotated, and as shown in FIGS. 4( a) and 4 (b ), the tray 20 is placed on the lower end of the chuck 153. At this time, the body portion 154a of the loader-side disc carrier positioning pin 154 is inserted into the first positioning hole 22 of the disc carrier 20. In this way, the positioning of the tray 20 with respect to the loader 150 is performed. In this way, the tray 20 (and thus the lead frame 10) is held by the loader 150. After the tray 20 is held by the loader 150, the loader 150 is moved above the lower mold 210U.

Next, as shown in FIG. 6, the loader 150 is lowered to a predetermined position. At this time, the loader side tray positioning pin 154 of the loader 150 approaches the upper surface of the lower mold 210U (the lower mold body 211), but does not touch.

Next, as shown in FIG. 7(a), the lower mold 210U is raised. As the lower mold 210U rises, the loader-side tray positioning pin 154 of the loader 150 contacts the upper surface of the lower mold body 211. As the lower mold 210U further rises, the loader-side tray positioning pin 154 resists the pressing force of the elastic member 155 and rises. If the loader-side disc loading positioning pin 154 rises to a certain degree with respect to the disc loading 20, the body portion 154a of the loader-side loading disc positioning pin 154 completely comes out of the first positioning hole 22 of the loading disc 20, and the loader side loading The tapered portion 154b of the disk positioning pin 154 is located inside the first positioning hole 22. In this way, the taper portion 154b having a smaller diameter than the main body portion 154a is located in the first positioning hole 22, so that the positioning of the disc carrier 20 by the disc carrier positioning pin 154 on the loader side is released. In addition, at the point in time when the taper portion 154b reaches the first positioning hole 22, the lower mold side carrier positioning pin 216 of the lower mold 210U is not inserted into the third positioning hole 24 of the carrier 20 (refer to FIG. 7(b)) .

After the positioning of the disk carrier 20 by the disk carrier positioning pins 154 on the loader side is released, the lower mold 210U is further raised, whereby the lower mold side disk carrier positioning pins 216 of the lower mold 210U are inserted into the third positioning hole 24 of the carrier 20 (Refer to the two-dot chain line in 7(b)). Thereby, the tray 20 is positioned with respect to the lower mold 210U. In this way, even if the positioning (positioning with respect to the loader 150) of the tray 20 by the loader-side tray positioning pins 154 is released, the positioning of the tray 20 (with respect to the lower mold) is performed by the lower mold-side tray positioning pins 216. 210U positioning), so that the position of the tray 20 can be prevented from shifting.

In addition, at the time point shown in FIGS. 7(a) and 7(b) (that is, the positioning of the tray 20 by the loader-side tray positioning pin 154 is released, and the lower mold-side tray positioning pin 216 When the positioning of the carrier plate 20 is performed), the frame positioning pins 215 of the lower mold 210U (in more detail, parts other than the tapered portion at the tip) have not been inserted into the second positioning holes 12 of the lead frame 10.

Next, as shown in FIG. 8, the lower mold 210U is further raised. Thereby, the frame positioning pin 215 of the lower mold 210U (more specifically, the part other than the tapered portion at the tip) is inserted into the second positioning hole 12 of the lead frame 10. Thus, the lead frame 10 is positioned relative to the lower mold 210U. In addition, the lower mold 210U rises until the upper surface of the cavity block 213 contacts the lower surface of the lead frame 10 (that is, until the lead frame 10 is placed on the cavity block 213).

In this way, after the positioning of the tray 20 with respect to the loader 150 is released (the tapered portion 154b of the tray positioning pin 154 on the loader side is located inside the first positioning hole 22 (see FIG. 7(a))), proceed Positioning of the lead frame 10 with respect to the lower mold 210U (the frame positioning pin 215 is inserted into the second positioning hole 12 of the lead frame 10 (refer to FIG. 8)). As a result, the positioning accuracy of the tray 20 and the lead frame 10, or the positioning accuracy of the tray 20 and the loader 150 can be used to suppress the situation that it is difficult to position the lead frame 10 with respect to the lower mold 210U (for example, , Due to the accumulation of positioning errors, the frame positioning pin 215 cannot be inserted into the second positioning hole 12 of the lead frame 10, etc.). That is, the positioning accuracy of the lead frame 10 can be improved, and the accuracy of the product (resin molded product) can be improved.

Next, as shown in FIG. 9(a) and FIG. 9(b), the lower end of the chuck 153 is rotated outward. As a result, the support of the chuck 153 to the tray 20 is released, and the tray 20 moves downward (falls). In addition, the carrier disk 20 is formed in a shape that does not overlap with the cavity block 213 in a plan view, so the carrier disk 20 is not placed on the cavity block 213.

At this time, the frame positioning pins 215 for positioning the lead frame 10 are inserted into the second positioning holes 23 of the carrier disk 20, so that the position of the lead frame 10 and the carrier disk 20 can be prevented from greatly shifting. Furthermore, in the third positioning hole 24 of the disc carrier 20, the lower mold side disc carrier positioning pins 216 of the lower mold 210U are inserted, so that the positioning of the disc carrier 20 with respect to the lower mold 210U is maintained. Furthermore, by appropriately adjusting the length of the holding pin 21 of the tray 20, the holding pin 21 can be inserted into the first positioning hole 11 of the lead frame 10 even when the tray 20 is dropped. Thereby, the positional deviation of the lead frame 10 and the carrier disk 20 can be effectively suppressed.

The height of the cavity block 213 on which the lead frame 10 is placed is formed to be greater than the thickness of the carrier plate 20 (in other words, the cavity block 213 is formed with a groove deeper than the thickness of the carrier plate 20), Therefore, the carrier plate 20 drops to the upper surface of the lower mold body 211, and thereby the carrier plate 20 and the lead frame 10 are in a state of spaced up and down (separated state).

In this way, when the lead frame 10 is placed on the upper surface of the cavity block 213 and the carrier plate 20 is placed on the upper surface of the lower mold body 211, the loader 150 is withdrawn from the lower mold 210U (resin molding module 200). In this way, the carry-in step S10 is completed.

After the carrying-in step S10 is completed, in the resin molding step S20, the lead frame 10 is resin-sealed. At this time, the lead frame 10 is positioned by inserting the frame positioning pins 215 of the lower mold 210U into the second positioning hole 12 of the lead frame 10. Therefore, the accuracy of the product (resin molded product) can be improved. Also at this time, the lead frame 10 is separated from the carrier disk 20, so that the resin can be prevented from adhering to the carrier disk 20. Thereby, even if the work of removing the resin adhering to the carrier disk 20 is not performed, the carrier disk 20 can be reused.

Next, using FIG. 10 and FIG. 11, the state which unloads the lead frame 10 from the shaping|molding die 210 (lower mold 210U) in the unloading step S30 is demonstrated concretely. In addition, in FIGS. 10 and 11, for the sake of convenience, illustration of the resin molded on the lead frame 10 is omitted.

In the unloading step S30, first, as shown in FIG. 10, the lower mold main body 211 is lowered only by a predetermined amount. Thereby, the ejector pin 217 moves relatively upward with respect to the lower mold main body 211, and the upper end portion of the ejector pin 217 protrudes upward from the upper surface of the lower mold main body 211. In this way, by protruding the ejector pin 217 from the lower mold body 211, the carrier disk 20 placed on the upper surface of the lower mold body 211 can be pushed up from below, and the carrier disk 20 can be lifted from the lower mold body 211 (de-molding). ). As a result, a space is formed between the carrier plate 20 and the upper surface of the lower mold body 211.

Next, as shown in FIG. 10, the unloader 310 is moved to the upper part of the lower mold 210U, and it lowers to a predetermined position.

Next, the lower end of the chuck 313 is rotated inward. Thus, the lower end of the chuck 313 is inserted into the space between the carrier plate 20 and the upper surface of the lower mold body 211. Next, as shown in FIG. 11, the unloader 310 is raised, so that the chuck 313 can be used to support the tray 20 from below and be raised. At this time, the lead frame 10 is placed on the carrier plate 20, and the lead frame 10 is lifted together with the carrier plate 20. Furthermore, by inserting the holding pins 21 of the carrier disk 20 into the first positioning hole 11 of the lead frame 10, the lead frame 10 is positioned with respect to the carrier disk 20.

In addition, although illustration is omitted in this embodiment, the unloader 310 not only supports the carrier plate 20 by the chuck 313, but also attracts the resin part (for example, stagnant part) formed by the lead frame 10 to directly support the lead frame 10.

In this way, the tray 20 (and thus the lead frame 10) is held by the unloader 310. After the tray 20 is held by the unloader 310, the unloader 310 is moved to carry the tray 20 out of the forming mold 210. Then, the unloader 310 is moved to the unloading module 300, and the carrier disk 20 (lead frame 10) is accommodated in the board|substrate accommodating part 320 (refer FIG. 1). In this way, the unloading step S30 is completed.

As described above, the method of manufacturing a resin molded product of this embodiment includes: Carrying in step S10, holding the carrier plate 20 (supporting member) supporting the lead frame 10 and carrying it into the forming mold 210; and Resin molding step S20, resin molding the lead frame 10, In the carrying-in step S10, the carrier plate 20 is separated from the lead frame 10, and the lead frame 10 is positioned relative to the forming die 210.

With this configuration, the positioning accuracy of the lead frame 10 can be improved. That is, by positioning with respect to the lead frame 10 separated from the carrier plate 20 in the carrying-in step S10, the lead frame 10 can be positioned without being affected by the positioning accuracy (error) of the carrier plate 20 and the lead frame 10. As a result, the positioning accuracy of the lead frame 10 can be improved.

In addition, the loader 150 (carry-in mechanism) for loading the lead frame 10 into the forming die 210 is provided with a loader-side tray positioning pin 154 (carry-in mechanism-side positioning member), and the loader side carries The disc positioning pin 154 (positioning member on the loading mechanism side) is inserted into the first positioning hole 22 (first through hole) of the disc carrier 20, so that the disc carrier 20 can be positioned. The positioning pin 154 of the side loading plate of the loader includes: The main body 154a (first part) has a predetermined outer diameter, and is positioned in the first positioning hole 22 to enable the positioning of the tray 20; and The taper portion 154b (the second part) has an outer diameter smaller than that of the main body portion 154a, and is located in the first positioning hole 22 to release the positioning of the carrier 20, In the carrying-in step S10, the loader-side disc carrier positioning pin 154 is brought into contact with the forming mold 210 and moved, so that the taper portion 154b is located in the first positioning hole 22, and the disc carrier 20 is released. Relative to the positioning of the loader 150.

With this configuration, the positioning of the tray 20 with respect to the loader 150 can be easily released. That is, the positioning of the disk carrier 20 can be released by contacting the positioning pin 154 of the loader side disk carrier to the molding die 210, and therefore, there is no need to provide a complicated mechanism for releasing the positioning. Particularly in this embodiment, the action of the loader 150 (the action of bringing the loader 150 close to (lowering) the lower mold 210U) required for arranging the lead frame 10 on the lower mold 210U can be used to load the tray on the loader side. The positioning pin 154 contacts the forming mold 210. Therefore, the positioning of the tray 20 with respect to the loader 150 can be released more easily.

Furthermore, in the carrying-in step S10, in a state where the lead frame 10 is brought into contact with the upper surface of the lower mold 210U (cavity block 213) of the forming mold 210, the holding of the carrier plate 20 is released, and The carrier plate 20 is dropped to the lower mold 210U, thereby separating the carrier plate 20 from the lead frame 10.

With this configuration, the lead frame 10 and the carrier disk 20 can be easily separated. That is, by using gravity to separate the tray 20 from the lead frame 10, there is no need to provide a complicated mechanism for separating the tray 20.

Furthermore, in the method of manufacturing a resin molded article of this embodiment, After the resin molding step S20, it further includes: an unloading step S30, inserting the chuck 313 (supporting part) of the unloader 310 (carrying out mechanism) used to carry out the lead frame 10 into the carrier plate 20 In the space formed by rising from the forming mold 210, the carrier plate 20 is supported from below by the chuck 313, and the lead frame 10 is carried out from the forming mold 210 together with the carrier plate 20.

With this configuration, the carrier disk 20 (and the lead frame 10) can be easily carried out. That is, by raising the tray 20 to form an interval, the tray 20 can be easily supported by the chuck 313 from below.

Furthermore, in the resin molding step S20, a state is set in which the frame positioning pins 215 (molding mold side positioning members) for positioning the lead frame 10 with respect to the molding die 210 are inserted into the carrier The second positioning hole 23 (second through hole) of the disk 20.

With this configuration, even after the lead frame 10 and the carrier disk 20 are separated, the positions of the lead frame 10 and the carrier disk 20 can be suppressed from greatly shifting.

Furthermore, the resin molding apparatus 1 of this embodiment includes: Forming mold 210; The loader 150 (carry-in mechanism) holds the carrier plate 20 (supporting member) supporting the lead frame 10 and carries it into the forming mold 210, The forming mold 210 includes: A cavity block 213 (first placing part) for placing the lead frame 10; and The lower mold main body 211 (second placing portion) is used for placing the carrier plate 20 separated from the lead frame 10.

With this configuration, the positioning accuracy of the lead frame 10 can be improved. That is, the carrier disk 20 can be separated from the lead frame 10 in the forming die 210, so that it is not affected by the carrier disk 20 (for example, the positioning error of the lead frame 10 with respect to the carrier disk 20) can be performed relative to the lead frame 10 position. As a result, the positioning accuracy of the lead frame 10 can be improved. Furthermore, by separating the carrier disk 20 from the lead frame 10, it is possible to prevent the resin from adhering to the carrier disk 20 during resin molding.

In addition, the forming mold 210 includes frame positioning pins 215 (forming mold side positioning members) that can position the lead frame 10 separated from the carrier plate 20. .

With this configuration, the positioning accuracy of the lead frame 10 can be improved. That is, by positioning the lead frame 10 separated from the carrier plate 20, the lead frame 10 can be positioned without being affected by the positioning error of the lead frame 10 with respect to the carrier plate 20.

Furthermore, the loader 150 is provided with a loader-side tray positioning pin 154 (carry-in mechanism-side positioning member), and the loader-side tray positioning pin 154 (carry-in mechanism-side positioning member) is inserted into the carrier The first positioning hole 22 (through hole) of the disk 20, so that the positioning of the carrier disk 20 can be performed, The positioning pin 154 of the side loading plate of the loader includes: The main body 154a (first part) has a predetermined outer diameter, and is positioned in the first positioning hole 22 to enable the positioning of the tray 20; and The taper portion 154b (the second part) has an outer diameter smaller than that of the main body portion 154a, and is located in the first positioning hole 22 to release the positioning of the carrier 20, The loader 150 makes the loader-side disc carrier positioning pin 154 contact the forming mold 210 and move, so that the taper portion 154b is located in the first positioning hole 22, and the disc carrier 20 can be released from being opposed to each other. In the positioning of the loader 150.

With this configuration, the positioning of the tray 20 with respect to the loader 150 can be easily released. That is, the positioning of the disk carrier 20 can be released by contacting the positioning pin 154 of the loader side disk carrier to the molding die 210, and therefore, there is no need to provide a complicated mechanism for releasing the positioning.

The embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments, and can be appropriately changed within the scope of the technical idea of the invention described in the claims.

For example, in the present embodiment, a resin molding apparatus 1 using a transfer mold method (a resin molding apparatus 1 of a transfer method) is exemplified, but the present invention is not limited to this, and other methods (for example, a compression method, etc.) may be adopted.

In addition, the structural elements (supply module 100 etc.) used in the resin molding apparatus 1 of this embodiment are just an example, and can be attached and detached or replaced as appropriate. For example, the number of resin molding modules 200 can be changed. In addition, the structure or operation of the structural elements (supply module 100 etc.) used in the resin molding apparatus 1 of this embodiment is an example, and can be changed suitably.

In addition, in the present embodiment, the structure in which two carrier plates 20 (six lead frames 10) are simultaneously transported (carried in and out) and resin-sealed is exemplified, but the present invention is not limited to this. That is, the number of the carrier disk 20 or the lead frame 10 can be changed suitably.

Moreover, in this embodiment, the example which used the ingot-shaped resin material (resin ingot T) was shown, but this invention is not limited to this. That is, as the resin material, not only ingot-shaped resin materials but also resin materials in any form such as pellets, powders, and liquids can be used.

Furthermore, the shapes of the lead frame 10 and the carrier plate 20 shown in this embodiment are just an example, but the present invention is not limited to this. That is, the lead frame 10 and the carrier plate 20 only need to have a shape that can be separated from each other when the lead frame 10 is resin-molded (specifically, only the lead frame 10 can be placed on the cavity block 213, and the carrier plate 20 can be separated and combined. The shape falling downwards).

Furthermore, the arrangement or number of various positioning members (for example, frame positioning pins 215, etc.) and through holes for positioning (for example, the second positioning holes 12 of the lead frame 10, etc.) shown in this embodiment are just an example, and may be Change arbitrarily.

Furthermore, in the present embodiment, the loader-side tray positioning pin 154 includes a tapered portion 154b formed in a tapered shape with a tapered tip, but the present invention is not limited to this. That is, it is not limited to the tapered shape, and what is necessary is just to form so that an outer diameter may become small compared with the main body part 154a. For example, it may be formed in a cylindrical shape with an outer diameter smaller than that of the main body 154a (the outer diameter becomes a constant shape).

In addition, the structure of the loader 150 and the unloader 310 shown in this embodiment is an example, and can be changed suitably. For example, the loader 150 uses the chuck 153 to support the tray 20, but the tray 20 may also be supported by other various methods (such as adsorption, etc.).

In addition, in the present embodiment, an example is shown in which the positioning pin 154 on the loader side is moved in contact with the molding die 210 to release the positioning of the tray 20. However, the present invention is not limited to this. For example, an appropriate The driving force of the driving source moves the disk loading pin 154 on the loader side, and the positioning of the disk loading 20 is released.

Moreover, in this embodiment, an example is shown in which the rotating chuck 313 supports the carrier plate 20 from below, but in order to support the carrier plate 20 more easily, a clamp may be provided on the lower mold 210U (the upper surface of the lower mold body 211). Slot into which the head 313 can enter. Thereby, the chuck 313 can be easily inserted under the tray 20, and the tray 20 can be easily supported.

Furthermore, in this embodiment, the cross-sectional shapes of the holding pin 21, the loader-side tray positioning pin 154, the frame positioning pin 215, the lower mold-side tray positioning pin 216, and the ejector pin 217 are substantially circular. However, the present invention is not limited to this, and the cross-sectional shape of these pins may be, for example, a substantially elliptical shape, or a substantially polygonal shape such as a substantially triangular shape or a substantially quadrangular shape.

1: Resin molding device 10: Wire frame 11, 22: the first positioning hole 12, 23: second positioning hole 20: loading plate 21: Keep pin 24: The third positioning hole 100: supply module 110: Frame Delivery Department 120: Frame Supply Department 130: Resin delivery department 140: Resin Supply Department 150: Loader 151: Loader body 151a: Containment hole 152: positioning bar 153: Chuck 154: Loader side loading plate positioning pin 154a: body part 154b: Cone 155: Elastic member 160: Control Department 200: Resin molding module 210: forming die 210U: Lower die 211: Lower die body 212: Setting Block 213: Cavity Block 213a: Mould cavity 214: Barrel Block 214a: Barrel 215: Frame positioning pin 216: Positioning pin of lower mold side carrier plate 217: ejector pin 220: Clamping mechanism 300: move out the module 310: Unloader 311: Unloader body 313: Chuck 320: substrate storage section S10: Moving in steps S20: Resin molding steps S30: Moving out steps T: resin ingot

FIG. 1 is a schematic plan view showing the overall structure of a resin molding apparatus according to an embodiment of the present invention. Fig. 2 is a schematic plan view showing the structure of a lower mold. Fig. 3 is a schematic plan view showing the structure of a lower mold loaded with a lead frame and a carrier plate. Fig. 4(a) is a schematic side cross-sectional view showing the structure of a loader and a lower mold in an A-A cross-sectional view. Fig. 4(b) is a schematic side cross-sectional view showing the structure of the loader and the lower mold in a B-B cross-sectional view. Fig. 5 is a flowchart showing a method of manufacturing a resin molded product of the present embodiment. Fig. 6 is a schematic side cross-sectional view showing a state in which the loader is lowered when viewed in cross-section A-A. Fig. 7(a) is a schematic side cross-sectional view showing a state in which the lower mold is raised when viewed in A-A cross-section. Fig. 7(b) is a schematic side cross-sectional view showing a state in which the lower mold is raised when viewed in a B-B cross-sectional view. Fig. 8 is a schematic side cross-sectional view showing a state where the lower mold is further raised when viewed in the A-A cross-section. Fig. 9(a) is a schematic side cross-sectional view showing a state in which the tray is dropped when viewed in cross-section A-A. Fig. 9(b) is a schematic side cross-sectional view showing a state in which the carrier plate is dropped when viewed in cross-section B-B. Fig. 10 is a schematic side cross-sectional view showing a situation in which the tray is pushed up and the unloader is lowered when viewed in cross-section A-A. Fig. 11 is a schematic side cross-sectional view showing a state in which the unloader holds the tray and carries it out when viewed in cross-section A-A.

10: Wire frame 11, 22: the first positioning hole 12, 23: second positioning hole 20: loading plate 21: Keep pin 24: The third positioning hole 150: Loader 151: Loader body 151a: Containment hole 152: positioning bar 153: Chuck 154: Loader side loading plate positioning pin 154a: body part 154b: Cone 155: Elastic member 210U: Lower die 211: Lower die body 212: Setting Block 213: Cavity Block 213a: Mould cavity 215: Frame positioning pin 216: Positioning pin of lower mold side carrier plate 217: ejector pin

Claims (9)

A method of manufacturing a resin molded product includes: a carrying-in step of holding a support member supporting a lead frame and carrying it into a molding die; and a resin molding step of resin-forming the lead frame. In the carrying step, the lead The frame separates the support member and positions the lead frame with respect to the forming die. A loading mechanism for loading the lead frame into the forming die is provided with a loading mechanism side positioning member, and the loading mechanism The side positioning member is inserted into the first through hole of the support member to enable positioning of the support member. The loading mechanism side positioning member includes: a first part having a predetermined outer diameter, The through hole can thereby enable positioning of the support member; and a second part having an outer diameter smaller than the outer diameter of the first part, and the positioning of the support member can be released by being located in the first through hole, In the carrying-in step, the positioning member on the carrying-in mechanism side is brought into contact with the forming mold and moved so that the second part is located in the first through hole, and the support member is released from the carrying-in mechanism. position. The method of manufacturing a resin molded product according to claim 1, wherein, in the carrying-in step, the holding of the supporting member is released while the lead frame is brought into contact with the upper surface of the lower mold of the forming mold , The support member is dropped to the lower mold, thereby separating the support member from the lead frame. The method for manufacturing a resin molded product as described in claim 1 or claim 2, wherein after the resin molding step, the method further includes: an unloading step of inserting a support portion of an unloading mechanism for unloading the lead frame into Up to the interval formed by raising the supporting member from the forming mold, the supporting member is supported from below by the supporting portion, and the lead frame is carried out from the forming mold together with the supporting member. A method of manufacturing a resin molded product includes: a carrying-in step of holding a support member supporting a lead frame and carrying it into a molding die; and a resin molding step of resin-forming the lead frame. In the carrying step, the lead The frame is separated from the supporting member, the lead frame is positioned relative to the forming mold, and in the carrying-in step, the lead frame is brought into contact with the upper surface of the lower mold of the forming mold, and the lead frame is released. The holding of the support member drops the support member to the lower mold, thereby separating the support member from the lead frame. The method for manufacturing a resin molded product according to claim 4, wherein after the resin molding step, the method further includes: an unloading step of inserting the support portion of the unloading mechanism for unloading the lead frame until the The support member rises from the forming mold at an interval formed, the support member is supported from below by the support portion, and the lead frame is carried out from the forming mold together with the support member. A method for manufacturing a resin molded product includes: a carrying-in step of holding a supporting member supporting a lead frame and carrying it into a forming mold; And a resin molding step of performing resin molding on the lead frame, in the carrying-in step, separating the support member from the lead frame, positioning the lead frame relative to the molding die, and the resin molding step Here, a state is set in which a molding die side positioning member for positioning the lead frame with respect to the molding die is inserted into the second through hole of the support member. The method for manufacturing a resin molded product according to claim 6, wherein after the resin molding step, the method further includes: an unloading step of inserting the support portion of the unloading mechanism for unloading the lead frame until the The support member rises from the forming mold at an interval formed, the support member is supported from below by the support portion, and the lead frame is carried out from the forming mold together with the support member. A resin molding device includes: a molding die; and a carry-in mechanism for holding a support member supporting a lead frame and carrying it into the molding die, the molding die includes a first placing part for placing the lead frame; and The second placing portion is configured to place the supporting member separated from the lead frame, and the forming mold includes a forming mold-side positioning member capable of positioning the lead frame separated from the supporting member. A resin molding device includes: A forming die; and a loading mechanism for holding a supporting member supporting the lead frame and loading it into the forming die, the forming die includes: a first placing portion for placing the lead frame; and a second placing portion for The supporting member separated from the lead frame is placed, and the carrying-in mechanism is provided with a carrying-in mechanism-side positioning member, and the carrying-in mechanism-side positioning member is inserted into the through hole of the supporting member, thereby enabling the loading In the positioning of the supporting member, the positioning member on the carry-in mechanism side includes: a first part having a predetermined outer diameter, and positioning of the supporting member can be performed by being located in the through hole; A part of a smaller outer diameter can release the positioning of the support member by being located in the through hole, and the carry-in mechanism moves the positioning member on the carry-in mechanism side by contacting and moving the molding die, thereby moving the supporting member. The second part is located in the through hole and can release the positioning of the supporting member with respect to the carrying-in mechanism.

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