TW201910088A - Transport mechanism of resin molded product, resin molding device, and method of manufacturing resin molded article - Google Patents

Abstract

This invention provides a resin molded product transportation mechanism capable of suppressing the increase in the occupied area for a resin molding device and the increase in cost. The resin molded product transportation mechanism (300) of this invention is characterized in having a resin molded product holding mechanism (302) and a resin molded product suction mechanism (301). The resin molded product (1b) can be held in a molding mold (1000) by the resin molded product holding mechanism (302), and in that state, the resin molded product (1b) and the useless resin part (20d) after resin molding can be separated. The resin molded product (1b) can be sucked and transported by the resin molded product suction mechanism (301).

Description

   Resin molding product conveying mechanism, resin molding device, and method for manufacturing resin molded product   

The present invention relates to a resin-molded article conveying mechanism, a resin-molding apparatus, and a method for manufacturing a resin-molded article.

As a method for manufacturing a resin molded article, for example, compression molding, transfer molding, and the like are used. In addition, a resin molding apparatus corresponding to a method for manufacturing various resin molded products is used.

In a resin molding apparatus, for example, an unnecessary resin removal part (a gate part) is provided, and an unnecessary resin part (excess resin) is removed from the resin molded product after resin molding (patent document 1).

[Prior technical literature]

[Patent Literature]

Patent Document 1: Japanese Unexamined Patent Publication No. 05-285977.

However, the resin molding apparatus such as Patent Document 1 has problems in that an occupied area (occupied area) increases and costs increase because an unnecessary resin removal portion is provided.

Accordingly, an object of the present invention is to provide a resin-molded product transport mechanism, a resin-molded device, and a resin-molded product that can separate a resin-molded product from an unnecessary resin portion, and can suppress an increase in the occupied area and cost of the resin-molded device. Manufacturing method.

In order to achieve the above object, the resin-molded article transport mechanism of the present invention includes a resin-molded article holding mechanism; and a resin-molded article adsorption mechanism capable of holding the resin-molded article at the resin-molded article holding mechanism. In the molding die, in this state, the molded product and the unnecessary resin portion after the resin molding can be separated, and the resin molded product can be adsorbed and transported by the resin molded product adsorption mechanism.

The resin molding apparatus of this invention is equipped with the said conveyance mechanism of the resin molded product of this invention, and a molding die, It is characterized by the above-mentioned.

The method for producing a resin molded article according to the present invention includes a resin molding step for resin molding by a molding die; an unnecessary resin section separating step for separating the resin molded article and the unnecessary resin section; and a transporting step for removing the resin. The molded product and the useless resin part are conveyed to the outside of the molding die.

According to the present invention, it is possible to provide a resin-molded product transport mechanism, a resin-molded device, and a method for manufacturing a resin-molded product that can separate a resin-molded product from an unnecessary resin portion and suppress an increase in the occupied area and cost of the resin-molded device. .

1‧‧‧ substrate

1b‧‧‧Resin molding (packaged substrate)

20‧‧‧cured resin

20a‧‧‧ plate (resin material)

20b‧‧‧ molten resin (fluid resin)

20d‧‧‧Residual resin (unwanted resin department)

100‧‧‧ Upper mold (one mold)

110‧‧‧Upper cavity block

111‧‧‧ Cavity

111B‧‧‧Lower model cavity

112‧‧‧ runner (resin channel)

113‧‧‧Residual material section (residual resin storage section)

113B‧‧‧Residual material section (residual resin storage section)

114‧‧‧Adjustment member (plate height adjustment member)

115‧‧‧ Elastic member for adjusting member

120‧‧‧ Upper mold base block

200‧‧‧ lower mold (another mold)

210‧‧‧ lower model cavity block

210a‧‧‧ Lower mold base block

210b‧‧‧Transfer driving source

210B‧‧‧ Lower mold base block

211‧‧‧ substrate mounting section

Room 212‧‧‧ (resin material storage section)

213‧‧‧Plunger

213a‧‧‧ convex

214‧‧‧Ring (ring-shaped member)

215‧‧‧ flange

216‧‧‧Residual resin separation member

217‧‧‧Elastic member for residual resin separation member

218‧‧‧through hole (residual resin leak)

220‧‧‧ Closed mold department

221‧‧‧Cage A (Cage Block)

222‧‧‧Cage Block B (Cage Block)

223‧‧‧ Lower mold mounting block (molding mold mounting member)

224‧‧‧elastic member

228‧‧‧Hydraulic mechanism

230‧‧‧ cage

231‧‧‧Cage Block A (Cage Block)

232‧‧‧Cage Block B (Cage Block)

233‧‧‧Eject board mounting block

234‧‧‧Elastic member

235‧‧‧ pop-up board

236‧‧‧ Pop-up lever

300‧‧‧Unloader (conveying mechanism for resin molded products)

301‧‧‧Sucker (resin molding mechanism)

302‧‧‧Resin molded product (packaged substrate) holding member (resin molded product holding mechanism)

400‧‧‧ intermediate mold

411‧‧‧ substrate mounting section

412‧‧‧Intermediate model cavity

413‧‧‧Mold mold resin material receiving section (Middle mold resin channel)

1000‧‧‧forming mold

1100‧‧‧Fixed platen (the first platen)

1110‧‧‧Fixed platen

1111‧‧‧Heater

1120‧‧‧movable table

1200‧‧‧ movable platen (second platen)

1210‧‧‧ movable table

1211‧‧‧Heater

1212‧‧‧heating station

1220‧‧‧movable table

a1‧‧‧ an arrow indicating the entering direction of the unloader 300

b1‧‧‧ an arrow indicating the exit direction of the unloader 300

c1‧‧‧ an arrow indicating the downward direction of the resin molded product holding member 302

d1‧‧‧ an arrow indicating the downward direction of the suction cup 301

e1‧‧‧ an arrow indicating the upward direction of the suction cup 301

V1‧‧‧ an arrow indicating the upward direction of the movable table 1200

W1‧‧‧ an arrow indicating the downward direction of the movable table 1200

T1 ~ T2‧‧‧ Arrows indicating the rising direction of plunger 213

U1‧‧‧ an arrow indicating the downward direction of the plunger 213

A1‧‧‧ an arrow indicating the entering direction of the unloader 300

B1‧‧‧ an arrow indicating the downward direction of the suction cup 301

C1 ~ C2 ‧‧‧ arrows indicating the upward direction of the suction cup 301

D1‧‧‧ an arrow indicating the exit direction of the unloader 300

E1 ~ E2‧‧‧ Arrows indicating the moving direction of the molding die 1000

F1 ~ F4‧‧‧‧ Arrows indicating the upward direction of the movable table 1220

G1 ~ G3‧‧‧ Arrows indicating the downward direction of the movable table 1220

H1‧‧‧ an arrow indicating the entering direction of the unloader 300

I1‧‧‧ an arrow indicating the downward direction of the resin molded product holding member 302

J1‧‧‧ an arrow indicating the downward direction of the suction cup 301

K1 ~ K2 ‧‧‧ arrows indicating the upward direction of the suction cup 301

L1‧‧‧ an arrow indicating the exit direction of the unloader 300

M1‧‧‧ an arrow indicating the exit direction of the molding die 1000

X1 ~ X3‧‧‧‧ Arrows indicating the upward direction of the movable table 1200

Y1 ~ Y3‧‧‧‧ Arrows indicating the downward direction of the movable table 1200

S1‧‧‧Heating section

S2‧‧‧Resin molding section

S3‧‧‧curing section

S4‧‧‧ Popup

FIG. 1 is a cross-sectional view schematically showing one step of a method for manufacturing a resin molded article of Example 1. FIG.

FIG. 2 is a cross-sectional view schematically showing another step of the method for manufacturing a resin molded article similar to FIG. 1.

FIG. 3 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to that of FIG. 1.

FIG. 4 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to FIG. 1.

FIG. 5 is a cross-sectional view schematically showing still another step of the manufacturing method of the resin molded article similar to FIG. 1.

FIG. 6 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to that of FIG. 1.

FIG. 7 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to FIG. 1.

FIG. 8 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to FIG. 1.

FIG. 9 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to FIG. 1.

Fig. 10 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to that shown in Fig. 1.

FIG. 11 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to FIG. 1.

FIG. 12 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to that of FIG. 1.

FIG. 13 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 1.

FIG. 14 is a cross-sectional view schematically showing a structure of a resin molding apparatus of Example 2. FIG.

FIG. 15 is a cross-sectional view schematically showing one step of a method of manufacturing a resin molded article using the resin molding apparatus of FIG. 14.

FIG. 16 is a cross-sectional view schematically showing another step of the method of manufacturing a resin molded article similar to that of FIG. 15.

FIG. 17 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 15.

FIG. 18 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 15.

FIG. 19 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 15.

FIG. 20 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 15.

FIG. 21 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 15.

Fig. 22 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to that of Fig. 15.

FIG. 23 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 15.

FIG. 24 is a cross-sectional view schematically showing still another step of the manufacturing method of the resin molded article similar to that of FIG. 15.

FIG. 25 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 15.

FIG. 26 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 15.

FIG. 27 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 15.

FIG. 28A is a cross-sectional view schematically showing one step of a method of manufacturing a resin molded article using a modification example of the resin molding apparatus of FIG. 14. FIG.

FIG. 28B is a cross-sectional view schematically showing another step of the method of manufacturing a resin molded article similar to that of FIG. 28A.

FIG. 28C is a cross-sectional view schematically showing still another step of the manufacturing method of the resin molded article similar to that of FIG. 28A.

FIG. 29 (a) is a sectional view schematically showing another modification example of the resin molding apparatus of FIG. 14. FIG. 29 (b) and (c) are views each schematically showing a part of the resin molding apparatus of FIG. 29 (a).

FIG. 30 is a schematic diagram showing an outline of a resin molding apparatus and a method for manufacturing a resin molded product using the resin molding apparatus of Example 2. FIG.

31 (a) to (e) are cross-sectional views schematically showing a part of the resin molding apparatus and a method of manufacturing a resin molded product of FIG. 30.

32 (a) to (h) are schematic cross-sectional views showing steps of another part of the resin molding apparatus and the method for manufacturing a resin molded product of FIG. 30.

33 (a) to (f) are schematic cross-sectional views showing steps of still another part of the resin molding apparatus and the method for manufacturing a resin molded product of FIG. 30.

FIG. 34 is a cross-sectional view schematically showing a modification example of the molding die of the resin molding apparatus of Examples 1 and 2. FIG.

FIG. 35 is a cross-sectional view schematically showing one step of a method of manufacturing a resin molded article using the molding die of FIG. 34.

FIG. 36 is a cross-sectional view schematically showing another step of the method for manufacturing a resin molded article using the molding die of FIG. 34.

FIG. 37 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article using the molding die of FIG. 34.

FIG. 38 is a cross-sectional view schematically showing another modification example of the molding die of the resin molding apparatus of Examples 1 and 2. FIG.

FIG. 39 is a cross-sectional view schematically showing still another modification example of the molding die of the resin molding apparatus of Examples 1 and 2. FIG.

FIG. 40 is a plan view of the molding die of FIG. 39.

41 (a) and (b) are step cross-sectional views showing the outline of a method for manufacturing a resin molded article using the molding die of FIGS. 39 and 40.

FIG. 42 is a cross-sectional view schematically showing one step of the method for manufacturing a resin molded article of Example 2. FIG.

FIG. 43 is a cross-sectional view schematically showing another step of the method for manufacturing a resin molded article similar to that of FIG. 42. FIG.

Fig. 44 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to that shown in Fig. 42.

FIG. 45 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 42.

FIG. 46 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to FIG. 42.

FIG. 47 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 42.

FIG. 48 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 42.

FIG. 49 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 42.

FIG. 50 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 42.

FIG. 51 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 42.

FIG. 52 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 42.

FIG. 53 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 42.

FIG. 54 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 42.

FIG. 55 is a cross-sectional view schematically showing still another step of the method of manufacturing a resin molded article similar to that of FIG. 42.

Fig. 56 is a cross-sectional view schematically showing still another step of the method for manufacturing a resin molded article similar to that shown in Fig. 42.

Next, the present invention will be described in further detail by way of examples. However, the present invention is not limited to the following description.

The resin molding device of the present invention can hold the resin molded product in the molding die by pressing the resin molded product to the molding die by the molded product holding mechanism, for example.

In the resin molding apparatus of the present invention, for example, the molding die may include a plunger, and the resin molding may be held in the molding die by the resin molding holding mechanism, and the resin molding may be performed by A plunger can separate the resin molded article and the unnecessary resin portion by applying a force to the unnecessary resin portion.

The resin molding apparatus of the present invention may be, for example, that the resin molding apparatus further includes a first platen and a second platen, the molding die includes one mold and another mold, and the one mold is mounted on the first table. On the board, the other mold is mounted on the second platen.

The resin molding device of the present invention may be, for example, that the resin molding device includes a heating section, a resin molding section, a curing section, and an eject section, and the molding die can be attached to and detached from the sections, and can be installed in the sections Moving between, the heating section heats the molding die, the resin molding section performs resin molding, the curing section solidifies the resin in the molding mold, and the ejection section makes the resin molded product from the molding. Mold release.

The method for manufacturing a resin molded product of the present invention may be, for example, using the conveying mechanism of the present invention, and holding the resin molded product in the molding by the resin molded product holding mechanism in the unnecessary resin part separation step. In the mold, in this state, the resin molded product and the useless resin portion are separated, and in the transporting step, the resin molded product is adsorbed and transported by the adsorption mechanism.

The method for manufacturing a resin molded article of the present invention may be, for example, using the resin molding apparatus of the present invention, in the resin molding step, resin molding is performed by the molding die provided in the resin molding apparatus, and In the unnecessary resin part separation step, the resin molded product is held in the molding die by the resin molded product holding mechanism, and in this state, the resin molded product and the unnecessary resin part are separated, and In the conveying step, the resin molded product is adsorbed and transported by the adsorption mechanism.

The method for manufacturing a resin molded article of the present invention may be, for example, using the resin molding apparatus of the present invention, and in the unnecessary resin part separation step, the resin molded article is pressed to the resin molded article holding mechanism by The molding die, and the resin molded article is held in the molding die.

The method for manufacturing a resin molded article of the present invention may be, for example, using the resin molding apparatus of the present invention, wherein the molding die of the resin molding apparatus is provided with a plunger, and in the step of separating the useless resin, The resin molded product holding mechanism holds the resin molded product in the mold, and separates the resin molded product from the useless resin by applying a force to the useless resin portion using the plunger. Resin department.

The method for manufacturing a resin molded article of the present invention may be, for example, using the resin molding apparatus of the present invention, the resin molding apparatus further including a first platen and a second platen, and the molding die includes one mold and the other One mold is mounted on the first platen, and the other mold is mounted on the second platen.

The method for manufacturing a resin molded article of the present invention may be, for example, that the resin molding apparatus of the present invention includes a temperature rising section, a resin molding section, a curing section, and an ejecting section, and the molding die can be attached to and detached from the sections, and Capable of moving between the sections, the heating section warms the molding die, the resin molding section performs resin molding, the curing section hardens the resin in the molding die, and the ejection section makes the resin The molded article is released from the molding die.

The resin molding method further includes a resin material accommodating step of accommodating the resin material in a resin material accommodating portion of the molding die; a molding die temperature increasing step of heating the molding die in the temperature increasing section; a resin curing step, Curing the resin in the molding die in the curing section; and a demolding step, in which the resin molded article is demolded from the molding die in the ejecting section, and the resin material accommodating step is performed in the resin molding In the paragraph.

In the present invention, the resin molded product is not particularly limited, and may be, for example, a resin molded product in which only resin is molded, or a resin molded product in which components such as a wafer are resin-encapsulated. In the present invention, the resin molded article may be, for example, an electronic component.

In the present invention, "resin molding" or "resin encapsulation" means, for example, a state where the resin is hardened (cured).

In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin and a silicone resin, or a thermoplastic resin. Furthermore, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. In the present invention, examples of the form of the resin material before molding include particulate resins, flowable resins, sheet resins, plate resins, and powder resins. In the present invention, the fluid resin is not particularly limited as long as it is a fluid resin, and examples thereof include a liquid resin and a molten resin. In the present invention, the liquid state means, for example, a resin that is liquid at room temperature or has fluidity. In the present invention, the molten resin refers to, for example, a resin which becomes liquid or has a fluid state by melting. The form of the molten resin may be any form as long as it can be supplied to a cavity, a chamber, or the like of a molding die.

In addition, in general, the "electronic component" includes a case where the wafer is resin-sealed and a state where the wafer has been resin-sealed. However, in the present invention, when it is simply referred to as an "electronic component", unless otherwise specified, , It means that the chip is a resin-encapsulated electronic component (a finished electronic component). In the present invention, the "wafer" refers to a wafer before resin encapsulation, and specifically, for example, a chip such as an integrated circuit (IC), a semiconductor wafer, or a semiconductor element for power control can be used. In the present invention, a wafer before resin encapsulation is referred to as a "wafer" for convenience in order to distinguish it from electronic components after resin encapsulation. However, the "wafer" of the present invention is not particularly limited as long as it is a wafer before resin encapsulation, and may not be a wafer shape.

In the present invention, the "flip-chip" refers to an IC wafer having a bump-shaped bump electrode called a pad on an electrode (pad) on the surface portion of the IC wafer, or the form of the wafer. This wafer is mounted downward (facing downward) on a wiring portion such as a printed circuit board. The flip chip can be used, for example, as a wafer for a wireless bonding method or as a mounting method.

In the present invention, for example, one or both sides of the substrate may be resin-molded to produce a resin-molded product. In addition, components (for example, wafers, flip-chips, and the like) mounted on one or both sides of the substrate may be resin-encapsulated (resin-molded) to produce a resin-molded product. In the present invention, the substrate (also referred to as an insert) is not particularly limited, and examples thereof include a lead frame, a wiring substrate, a wafer, and a ceramic substrate. The substrate may be a mounting substrate having a wafer mounted on one or both sides thereof, as described above, for example. The method for mounting the wafer is not particularly limited, and examples thereof include wire bonding and flip-chip bonding. In the present invention, an electronic component in which the wafer is resin-sealed can be manufactured by resin-sealing one or both sides of the mounting substrate. In addition, the use of the resin-encapsulated substrate by the resin-encapsulating device of the present invention is not particularly limited, and examples thereof include high-frequency module substrates for mobile communication terminals, module substrates for power control, and substrates for machine control.

Further, in the present invention, "mounting" includes "mounting" or "fixing". Further, in the present invention, "mounting" includes "fixing".

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For convenience of description, the drawings are appropriately omitted, exaggerated, and the like are schematically described.

[Example 1]

In this embodiment, an example of a resin-molded article transport mechanism and a resin-molding device, and an example of a method of manufacturing a resin-molded article using the same will be described.

In the cross-sectional view of FIG. 1, the structures of a molding die, a first platen, and a second platen of the resin molding device of this embodiment are schematically shown. As described later, the resin molding apparatus further includes a resin molded product transport mechanism (not shown in FIG. 1).

As shown in FIG. 1, the molding die 1000 includes an upper die (one die) 100 and a lower die (another die) 200. The upper mold 100 and the lower mold 200 are opposed to each other.

The mold cavity block 110 above the upper mold 100 is a main constituent element. A cavity 111, a runner (resin channel) 112, and a residual material portion (residual resin accommodation portion) 113 are provided on a mold surface (surface on the side opposite to the lower mold 200) of the upper mold cavity block 110. The cavity 111 is plural. The mutually adjacent cavities 111 communicate with each other through a flow channel 112. One residual material portion 113 is provided at each end of the upper mold cavity block 110. Each of the remaining material portions 113 communicates with the cavity 111 and the flow path 112 through the adjacent cavity 111. Then, as described later, the residual material portion 113 can accommodate at least a portion of the remaining resin that is not contained in the cavity 111 when the mold is closed.

The lower mold cavity block 210 and the lower mold base block 210a are the main constituent elements. The lower mold cavity block 210 has a lower mold base block 210a fixed on a surface opposite to the mold surface (surface opposite to the upper mold 100). The lower mold cavity block 210 includes a substrate mounting portion 211. The substrate mounting portion 211 is provided on the mold surface of the lower mold cavity block 210 at a position opposed to the cavity 111 of the upper mold 100. The lower mold 200 further includes a chamber (resin material storage portion) 212 and a plunger 213. The chamber 212 is provided at a position of the mold surface of the lower mold cavity block 210 facing the residual material portion 113 of the upper mold 100. The plunger 213 penetrates from the inside of the chamber 212 to the side opposite to the mold surface of the lower mold cavity block 210. A transmission driving source 210b is provided inside the lower mold base 210a. The transmission driving source 210 b is disposed directly below the plunger 213 and is connected to the plunger 213. Then, by driving the plunger 213 with the transmission driving source 210b, the plunger 213 can be moved in the opening and closing direction of the molding die 1000 (the upper die 100 and the lower die 200) with respect to the chamber 212.

The resin molding apparatus of FIG. 1 further includes a fixed platen (first platen) 1100 and a movable platen (second platen) 1200. The upper mold 100 is mounted on the lower surface of the fixed platen 1100, and the lower mold 200 is mounted on the upper surface of the movable platen 1200.

The manufacturing method of the resin molded article using the resin molding apparatus of FIG. 1 can be performed as shown in FIG. 2-13, for example. Hereinafter, it will be specifically described.

First, as shown in FIG. 2, the substrate 1 is supplied (mounted) to the substrate mounting portion 211 of the lower mold 200, and a plate (resin material) 20 a is supplied to the chamber 212 at the same time. At this time, the lower mold 200 and the upper mold 100 are heated by a heater (not shown) in advance. The plate 20a is not particularly limited, and may be a thermoplastic resin or a thermosetting resin. For example, a thermosetting resin such as an epoxy resin and a silicone resin can be used.

Next, as shown in Figs. 3 to 5, mold closing and resin molding are performed.

First, as shown in FIG. 3, the movable platen 1200 is raised in the direction of the arrow V1. Thereby, the lower mold 200 and the movable platen 1200 are raised together, and as shown in the figure, the mold surface of the lower mold 200 and the mold surface of the upper mold 100 are brought into contact. At this time, the plate 20a is melted by the heat of the lower mold 200, and becomes a molten resin (flowable resin) 20b as shown in the figure.

Next, as shown in FIG. 4, the plunger 213 is raised in the direction of the arrow T1 using the transmission drive source 210b. Thereby, as shown in the figure, the plunger 213 is pushed (upwardly) into the chamber 212, and the molten resin 20b is filled into the residual material portion 113, the flow path 112, and the cavity 111.

Thereafter, as shown in FIG. 5, the flowable resin 20 b in the residual material portion 113, the flow path 112, and the cavity 111 is cured into a cured resin by the heat of the upper mold 100 and the lower mold 200. In FIG. 5, the cured resin in the runner 112 and the cavity 111 (hereinafter simply referred to as “cured resin”) is denoted by the symbol 20 d, and the cured resin (hereinafter referred to as “residual resin”) in the residue portion 113 is denoted by the symbol 20 d Or "unwanted resin section"). As a result, a resin molded product (packaged substrate) 1 b on which one surface of the substrate 1 is resin-molded with the cured resin 20 is formed. Then, after the flowable resin 20b is cured into the cured resin 20 and the surplus resin (unwanted resin portion) 20d, the resin molded article 1b and the unwanted resin portion 20d are released from the upper mold 100 as shown in FIG. 5. The method of demolding from the upper mold 100 is not particularly limited, and for example, a pop-up pin (not shown) can be used. The ejection pin may be disposed inside the upper mold cavity block 110, for example. Then, the movable platen 1200 is lowered in the direction of the arrow W1 in FIG. 5. Accordingly, as shown in the figure, the resin mold 1b and the unnecessary resin portion 20d placed on the lower mold 200 are lowered together with the lower mold 200 and the movable platen 1200 while the upper mold 100 and the lower mold 200 are opened.

Next, as shown in FIGS. 6 to 13, the resin molded product 1 b is unloaded (conveyed to the outside of the mold).

First, starting from the state of FIG. 5, as shown in FIGS. 6 and 7, the unloader 300 is moved in the direction of the arrow a1 (from the outside of the molding die 1000 toward the direction between the upper die 100 and the lower die 200), and The unloader 300 is caused to enter between the upper mold 100 and the lower mold 200. The unloader 300 corresponds to the "resin conveying mechanism" of the present invention. As shown in the figure, the unloader 300 includes a chuck 301 for adsorbing the cured resin 20 and the remaining resin 20d, and a packaged substrate holding member (resin molded product holding member) 302. The chuck 301 corresponds to a “resin molded product holding mechanism”, and the packaged substrate holding member (resin molded product holding member) 302 corresponds to a “resin molded product holding mechanism”.

Next, as shown in FIG. 8, the resin molded product holding member 302 is lowered in the direction of the arrow c1, and the resin molded product (packaged substrate) 1 b is held. As shown in the figure, the resin molded product holding member 302 presses and cures the resin molded product 1 b to the lower mold 200 by pressing a portion of the cured resin 20 cured in the flow channel 112 from above. In addition, for example, instead of the portion cured in the flow path 112 among the cured resins 20, a portion where the resin molded product holding member 302 is pressed from the top and cured in the cavity 111 may be used.

Next, as shown in FIG. 9, the plunger 213 is raised in the direction of the arrow T2 by the transmission drive source 210 b. Thereby, an upward force is applied to the useless resin part 20d by the plunger 213, and the useless resin part 20d is pushed up. Thereby, as shown in the figure, the unnecessary resin portion 20d and the resin molded product (packaged substrate) 1b are separated.

Thereafter, as shown in FIG. 10, the plunger 213 is lowered again in the direction of the arrow U1 by the transmission drive source 210. Thereby, the unnecessary resin portion 20d separated from the resin molded product 1b is placed on the lower mold 200 again.

Next, as shown in FIG. 11, the suction cup 301 is lowered in the direction of the arrow d1, and the cured resin 20 of the resin molded product (the packaged substrate) 1b and the unnecessary resin portion 20d separated from the resin molded product 1b are adsorbed.

Further, as shown in FIG. 12, the sucker 301 is caused to adsorb the resin molded product 1 b and the remaining resin 20 d and rise in the direction of the arrow e1. Thereby, as shown in the figure, the resin molded product 1 b and the surplus resin 20 d are released from the mold surface of the lower mold 200.

Then, as shown in FIG. 13, the unloader 300 is moved together with the resin molded product 1 b and the remaining resin 20 d in the direction of the arrow b1 (outward of the molding die 1000), and exits from the molding die 1000. After that, the resin molded product 1b and the remaining resin 20d (not shown) are separated from the unloader 300. In this way, a resin molded product 1b can be manufactured.

The examples of the resin-molded article transport mechanism, the resin-molding apparatus, and the resin-molding method using the same according to the present invention have been shown in FIGS. 1 to 13. However, the resin-molded article carrying mechanism, the resin-molding apparatus, and the resin-molding method of the present invention are not limited to the examples shown in FIGS. 1 to 13 and can be variously modified. For example, in FIGS. 1 to 13, only the unloader 300 is used as the resin molded product conveyance mechanism. However, the present invention is not limited to this, and various modifications can be made.

For example, in the present invention, the resin conveying mechanism (unloader) may serve as a substrate conveying mechanism (loader). Specifically, for example, as a method of setting (mounting) the substrate 1 on the substrate mounting portion 211 as shown in FIG. 2, the substrate 1 may be sucked onto the chuck 301 of the unloader 300 and transferred to the position. In addition, the present invention is not limited to this, and for example, the substrate 1 may be transferred to the position of the substrate mounting portion 211 using a loader (substrate transfer mechanism) different from the unloader 300.

In the present invention, the molding die is not limited to the configuration of the molding die 1000 shown in FIGS. 1 to 13, and any molding die can be used. For example, in the molding die 1000 shown in FIGS. 1 to 13, although the example in which the substrate 1 is provided (mounted) on the substrate mounting portion 211 of the lower die 200 is shown, the present invention is not limited to this, and may be provided on the upper die. Substrate. In addition, in the molding die 1000 of FIGS. 1 to 13, although only the upper die is provided with the cavity 111, the present invention is not limited to this. The lower die may be provided only with the cavity, and both the upper and lower die may be provided with the cavity. .

According to the present invention, for example, as described with reference to FIGS. 1 to 13 in this embodiment, it is possible to use a molding die and an unloader (resin conveying mechanism) to remove an unnecessary resin portion from the resin molded article inside the molding die. . Therefore, in the resin molding apparatus, it is not necessary to additionally provide an unnecessary resin portion removing portion outside the molding die. This makes it possible to suppress an increase in the occupied area (occupied area) of the resin molding apparatus and increase in cost. Furthermore, according to the present invention, for example, as described in this embodiment using FIGS. 1 to 13, it is not necessary to perform a step of removing unnecessary resin portions (gate removal) in other sections (areas) outside the molding die. As a result, the steps of the method for manufacturing a resin molded product can be reduced and simplified, so that the manufacturing efficiency of the resin molded product can be improved and the cost can be suppressed.

[Example 2]

Next, other embodiments of the present invention will be described.

In this embodiment, an example will be described in which the resin molding apparatus is provided with a segment different from the resin molding segment, and the mold can be conveyed into the different segment. In this embodiment, in the different stages, the resin molded product after the molding and the unnecessary resin portion after the resin molding are separated.

More specifically, as described later in FIG. 30, the resin molding apparatus of this embodiment includes a temperature rising section S1, a resin molding section S2, a curing section S3, and an ejecting section S4. Then, in the ejection section S4, the resin molded product carrying mechanism of the present invention is used to hold the molded resin molded product in the molding die, and in this state, the resin molded product and the uselessness after the resin molding are separated. Resin department.

First, an example of the resin molding section and an example of a method for manufacturing a resin molded product using the same will be described with reference to Figs. 14 to 19. As described above, in this embodiment, in order to separate the resin molded product and the unnecessary resin part after the resin molding in the ejection section, the resin molded product and the resin are not separated in the resin molding section of FIGS. 14 to 19. Useless resin part after molding.

In the cross-sectional view of FIG. 14, the structure of the resin molding section of this embodiment is schematically shown. As shown in the figure, the resin molding section mainly includes a molding die 1000 and a mold closing section 220. The molding die 1000 includes an upper die (one die) 100 and a lower die (another die) 200. The upper mold 100 and the lower mold 200 are opposed to each other.

The upper mold 100 includes an upper mold cavity block 110 and an upper mold base block 120. In the upper mold cavity block 110, the upper mold base block 120 is fixed on a surface opposite to the mold surface (the surface on the side opposite to the lower mold 200). On the mold surface of the upper mold cavity block 110 (the surface opposite to the lower mold 200), a cavity 111, a flow channel 112 (resin channel), and a residual material portion (residual resin storage portion) 113 are provided. The cavity 111 is plural. The mutually adjacent cavities 111 communicate with each other through a flow channel 112. One residual material portion 113 is provided at each end of the upper mold cavity block 110. Each of the remaining material portions 113 communicates with the cavity 111 and the flow path 112 through the adjacent cavity 111. Then, as will be described later, the residual material portion 113 can accommodate at least a portion of the remaining resin that is not contained in the cavity 111 when the mold is closed. The upper mold 100 further includes an adjustment member (plate height adjustment member) 114 and an elastic member 115 for the adjustment member that elastically supports the adjustment member 114. The adjustment member 114 is partially disposed inside the residual material portion 113, and is fixed to the upper mold base block 120 by the adjustment member elastic member 115. The adjustment member 114 can be moved in the opening and closing direction of the molding die 1000 by expansion and contraction of the adjustment member elastic member 115. Then, the resin pressure in the cavity 111 can be adjusted by adjusting the capacity of the residual material portion 113 by the movement of the adjustment member 114.

The resin material (plate) contained in the chamber 212 usually has a deviation in height (weight). Therefore, the amount of resin supplied into the cavity 111 and the residual material portion 113 differs every time the molding is performed. Therefore, in order to adjust the volume and injection pressure (resin pressure) of the resin material injection portion (cavity 111 and residual material portion 113) during resin molding, the adjustment member (plate height adjustment member) 114 is movable as described above. In addition, the residual material portion 113 may have a structure that communicates with the residual material portion (the left and right residual material portions 113 are directly connected). By communicating the residual material portion 113 in this manner, it is possible to suppress variations in the injection pressure (injection speed) of the local resin material due to the difference in the height of the resin material (plate).

The mold cavity block 210 below the lower mold 200 is a main constituent element.

The lower mold cavity block 210 includes a substrate mounting portion 211. The substrate mounting portion 211 is provided at a position of the mold surface (surface on the side opposite to the upper mold 100) of the lower mold cavity block 210 facing the cavity 111 of the upper mold 100. The lower mold 200 further includes a chamber (resin material storage portion) 212 and a plunger 213. The chamber 212 is provided at a position of the mold surface of the lower mold cavity block 210 facing the residual material portion 113 of the upper mold 100. The plunger 213 penetrates from the inside of the chamber 212 to the opposite side of the mold surface of the lower mold cavity block 210. The plunger 213 is movable with respect to the chamber 212 in the opening / closing direction of the molding die 1000 (the upper die 100 and the lower die 200).

In addition, in FIG. 14, the plunger 213 further includes a ring (annular member) 214 and a flange portion 215. The ring 214 is provided on a part of the outer periphery of the plunger 213 (two places in the figure) at a position in contact with the lower mold cavity block 210. More specifically, a groove is provided at two places on the outer periphery of the plunger 213, and a ring 214 is mounted on the groove, and the plunger 213 is held vertically by two points of the ring 214 support. The flange portion 215 is provided at a lower end portion of the plunger 213.

As shown in FIG. 14, wear of the plunger 213 can be suppressed by supporting the plunger 213 with the ring 214, and wear can be handled by replacing the ring 214. The ring 214 is not particularly limited, and for example, a fluororesin such as polytetrafluoroethylene, an engineering plastic, or the like can be used. The material for forming the plunger 213 is also not particularly limited. As a material for forming the plunger 213, for example, an ultra-steel alloy that is not easily worn can be used. However, since the ring 214 can support and suppress wear, steel can be used as the material of the plunger 213 instead of the super steel alloy. In the case where the superalloy alloy forming the plunger 213 contains cobalt, the cleaning sheet may chemically react with cobalt and cause the plunger 213 to be corroded. However, if cobalt-free steel is used as a material for forming the plunger 213, the corrosion of the plunger 213 caused by the cleaning sheet can be suppressed or prevented. In addition, if steel is used instead of the super steel alloy, the cost of the plunger 213 itself can be reduced.

The mold closing section 220 includes a holder A block 221, a holder B block 222, a lower mold mounting block (molding die mounting member) 223, and an elastic member 224. The holder block A 221 and the holder B block 222 constitute a holder block. The elastic member 224 is disposed on the opposite side of the lower mold mounting block 223 from the surface facing the upper mold 100. The lower mold mounting block 223 is elastically supported on the upper surface of the holder B block 222 by the elastic member 224. The lower portion of the lower die mounting block 223 constitutes a flange portion protruding from the peripheral portion. The holder A block 221 is fixed to a peripheral portion of the upper surface of the holder B block 222. The outer surface of the flange portion and the upper surface peripheral portion of the lower mold mounting block 223 and the outer surface of the elastic member 224 are surrounded by the holder A block 221. In this way, the lower mold mounting block 223 and the elastic member 224 are held by the holder blocks (the holder A block 221 and the holder B block 222). Portions other than the flange portion of the lower mold mounting block 223 protrude from the upper surface of the holder A block 221. The lower mold 200 is mounted on a lower mold mounting block (mold mold mounting member) 223 as a part of the mold closing portion 220 on the side opposite to the surface opposite to the upper mold 100. Then, as described later, the mold closing part 220 is moved in the mold closing direction of the molding die 1000 (the upper die 100 and the lower die 200) to close the molding die 1000 and simultaneously push the plunger 213 toward the upper die 100. Then, the resin material accommodated in the resin material accommodating portion 212 is extruded to the mold surface of the mold 1000 using the plunger 213. As described later, when the mold is closed, the holder A block 221 is used to press the plunger 213, so the holder A block 221 corresponds to a “plunger pressing member”.

The resin molding apparatus of FIG. 14 further includes a fixed platen (first platen) 1100 and a movable platen (second platen) 1200. The upper mold 100 is mounted on the lower surface of the fixed platen 1100, and the mold closing portion 220 is mounted on the upper surface of the movable platen 1200 on the lower surface of the holder B block 222.

A method for manufacturing a resin molded article using the resin molding apparatus of FIG. 14 can be performed, for example, as shown in FIGS. 15 to 19. Hereinafter, it will be specifically described.

First, as shown in FIG. 15, the substrate 1 is supplied (mounted) to the substrate mounting portion 211 of the lower mold 200, and a plate (resin material) 20 a is supplied to the chamber 212 at the same time. At this time, the lower mold 200 and the upper mold 100 are heated in advance using a heater (not shown). The plate 20a is not particularly limited, and may be a thermoplastic resin or a thermosetting resin. For example, a thermosetting resin such as an epoxy resin and a silicone resin can be used.

Next, as shown in Figs. 16 to 19, mold closing and resin molding are performed.

First, as shown in FIG. 16, the movable platen 1200 is raised in the direction of the arrow X1. Thereby, the mold closing part 220 and the lower mold 200 are raised together with the movable platen 1200, and as shown in the figure, the mold surface of the lower mold 200 and the mold surface of the upper mold 100 are brought into contact. At this time, the plate 20a is melted by the heat of the lower mold 200, and as shown in the figure, it becomes a molten resin (fluid resin) 20b.

Next, as shown in FIG. 17, the movable platen 1200 is further raised in the direction of the arrow X2. Thereby, the mold closing part 220 and the lower mold 200 are raised with the movable platen 1200, and as shown in the figure, the plunger 213 and the holder A block (holder block) 221 are brought into contact.

Next, as shown in FIG. 18, the movable platen 1200 is further raised in the direction of the arrow X3. At this time, as shown in the figure, as the elastic member 224 contracts, the lower mold mounting block 223 and the lower mold 200 are maintained in their original positions, and the holder blocks (the holder A block 221 and the holder B block 222) are raised. As a result, as shown in the figure, the plunger 213 is pushed into (upwardly) the chamber 212 using the holder A block (cage block) 221, and the molten resin 20b is filled in the residual material portion 113, the flow path 112, and the cavity. 111 in.

Thereafter, as shown in FIG. 19, the fluid resin 20b in the residual material portion 113, the flow path 112, and the cavity 111 is cured into a cured resin by the heat of the upper mold 100 and the lower mold 200. In FIG. 19, the cured resin in the runner 112 and the cavity 111 (hereinafter simply referred to as “cured resin”) is denoted by the symbol 20, and the cured resin (hereinafter referred to as “residual resin”) in the residue portion 113 is denoted by the symbol 20 d. Or "unwanted resin section"). As a result, a resin molded product (packaged substrate) 1 b on which one surface of the substrate 1 is resin-molded with the cured resin 20 is formed. Then, after the flowable resin 20b is cured into the cured resin 20 and the remaining resin (unwanted resin portion) 20d, as shown in FIG. 19, the movable platen 1200 is lowered in the direction of the arrow Y1. At this time, as shown in the figure, the upward force applied to the elastic member 224 is released, and the elastic member 224 is extended again. Thereby, the lower mold mounting block 223 and the lower mold 200 are maintained in place, and the holder blocks (the holder A block 221 and the holder B block 222) are lowered.

After that, the molding die 1000 is transported to the outside of the resin molding section together with the resin molded product 1b and the remaining resin 20d inside the molding die 1000 using a mold transfer mechanism (not shown). In this way, a resin molded product 1b can be manufactured. Then, as described later, the resin molded product after molding and the unnecessary resin part after resin molding are separated in a segment different from the resin molding segment.

In addition, as a modification, FIGS. 20 to 27 show that after the resin molded product manufacturing method of FIGS. 14 to 19 is performed, the resin molded product 1b is demolded (taken out of the mold) in the resin molding stage, and Example of unloading (conveyance to the outside of the mold).

First, as shown in FIG. 20, the movable platen 1200 is further lowered in the direction of the arrow Y2. Thereby, as shown in the figure, the mold closing section 220 and the lower mold 200 are lowered together with the movable platen, and the upper mold 100 and the lower mold 200 are opened. As a result, as shown in the figure, the resin molded product 1 b (the substrate 1 and the cured resin 20) and the remaining resin 20 d are lowered together with the lower mold 200 and released from the upper mold 100. In addition, the resin molded article 1b and the remaining resin 20d may be released from the upper mold 100 by pressing the remaining resin 20d of the adjusting member 114 due to the restoring force (elongation force) of the elastic member 115 for the adjusting member.

Thereafter, as shown in Fig. 21, the lower die 200 is further lowered by lowering the movable platen 1200 in the direction of arrow Y3. In this state, as shown in FIGS. 22 and 23, the unloader 300 is moved in the direction of the arrow A1 (from the outside of the molding die 1000 to the direction between the upper die 100 and the lower die 200), and the unloading is performed. The machine 300 enters between the upper mold 100 and the lower mold 200. As shown in the figure, the unloader 300 includes a suction cup 301 for adsorbing the cured resin 20 and the remaining resin 20d. In the examples of FIGS. 20 to 27, since the resin molded product 1 b and the surplus resin (unwanted resin portion) 20 d are not separated in the resin molding stage, the packaged substrate holding member (resin molded product holding member) 302 may not be provided. However, instead of the same, the unloader 300 including the suction cup 301 and the packaged substrate holding member (resin molded product holding member) 302 may be used in the same manner as in the first embodiment.

Next, as shown in FIG. 24, the chuck 301 is lowered in the direction of the arrow B1, and the cured resin 20 of the resin molded product (packaged substrate) 1b and the remaining resin (unwanted resin portion) 20d connected to the cured resin 20 are adsorbed.

Further, as shown in FIG. 25, the sucker 301 is made to adsorb the resin molded article 1b and the remaining resin 20d in the direction of the arrow C1. Thereby, as shown in the figure, the resin molded product 1 b and the surplus resin 20 d are released from the mold surface of the lower mold 200. At this time, when the remaining resin 20d and the plunger 213 are not separated, the plunger 213 and the remaining resin 20d are raised together. However, as shown in the figure, since the flange portion 215 of the plunger 213 is caught on the lower mold cavity block 210, the plunger 213 cannot be raised to a predetermined height or more. Then, as shown in FIG. 26, if the remaining resin 20d and the suction cup 301 are further raised in the direction of the arrow C2, the remaining resin 20d and the plunger 213 are separated.

Then, as shown in FIG. 27, the unloader 300 is moved together with the resin molded product 1b and the remaining resin 20d in the direction of the arrow D1 (outward of the molding die 1000), and is withdrawn from the molding die 1000. After that, the resin molded product 1b and the surplus resin 20d are separated from the unloader 300, and the surplus resin 20d is separated from the resin molded product 1b (not shown).

In addition, the resin molding stage and the resin molding method using the same are not limited to the examples of FIGS. 14 to 27, and can be variously modified. For example, instead of the resin molding section of FIGS. 14 to 27, a resin molding apparatus capable of separating the resin molded product 1b and the remaining resin (unwanted resin portion) 20d can be used as in Example 1 (FIGS. 1 to 13). Resin molding section. In addition, for example, as in the resin molding apparatus shown in FIGS. 28A to 28C, a resin molding apparatus including a hydraulic mechanism 228 can be used in the resin molding section instead of the elastic member 224. The resin molding apparatus of FIGS. 28A to 28C is the same as the resin molding section (resin molding apparatus) of FIGS. 14 to 27 except that the mold closing section 220 includes a hydraulic mechanism 228 instead of the elastic member 224. The manufacturing method of the resin molded product using the resin molding apparatus of FIGS. 28A to 28C can be performed in the same manner as in FIGS. 15 to 19 or 15 to 27, for example. FIG. 28A is a state diagram of the substrate 1 and the plate (resin material) 20a being supplied to the lower mold 200, which corresponds to the step of FIG. 15. FIG. 28B is a view showing a state where the plate 20a is melted into a molten resin (fluid resin) 20b while the movable platen 1200, the mold closing portion 220, and the lower mold 200 are raised to bring the lower mold 200 and the upper mold 100 into contact. FIG. 28B corresponds to the step of FIG. 16. FIG. 28C is a view showing a state where molten resin (fluid resin) is injected into the cavity 111, the flow path 112, and the residue portion 113 using the plunger 213, and corresponds to the step of FIG. 18.

In addition, for example, in the molding die 1000 of the resin molding stage of FIGS. 14 to 27, the lower die 200 may have a structure shown in FIGS. 29 (a) to (c), for example. FIG. 29 (a) shows the structure of the lower mold 200, the mold closing portion 220, and the movable platen 1200 together. The lower mold 200 of FIG. 29A is the same as the lower mold 200 of FIGS. 14 to 27 except that the lower mold cavity block 210 includes a through hole (residual resin leakage hole) 218. As shown in the figure, the through hole 218 communicates with the chamber 212 and penetrates from the chamber 212 to the opposite side of the lower mold cavity block 210 from the opposite surface of the upper mold 100. With this structure, after the resin is molded, the residual resin in the chamber 212 can be dropped and discharged from the through hole 218.

29 (b) is an enlarged view of a part of the plunger 213 and the through hole (residual resin leakage hole) 218 of FIG. 29 (a). As shown in the figure, there are a plurality of through holes 218 and they are arranged so as to surround the plunger 213. By providing the through hole 218 only in a part of the periphery of the plunger 213 and the upper end portion (flange-shaped portion) of the plunger 213 is caught in a portion where the through hole 218 is not provided, the plunger 213 does not fall.

29 (c) is a schematic diagram showing a modified example of the plunger 213. This figure shows only the lower portion of the plunger 213 in an enlarged manner. In Figs. 14 to 27, as shown in the diagram on the left side of Fig. 29 (c), an example in which the lower end of the plunger 213 (the portion in contact with the holder A block 221) is flat is shown. However, as shown in the figure on the right side of FIG. 29 (c), the plunger 213 can be made as small as possible by making the lower end a convex portion 213a with a circular shape (for example, only one point on the front end of the convex portion 213a). The area in contact with the cage A block 221. By doing so, for example, the dependence on the flatness (flatness) of the upper surface of the cage A block 221 and the lower surface of the plunger 213 can be reduced, and the plunger 213 can rise vertically in the direction of gravity.

According to the resin molding stage as shown in this embodiment, for example, the structure of a resin molding apparatus for transfer molding can be simplified. Specifically, for example, as shown in the embodiment, the plunger is moved up and down by the clamping force of the press (die closing portion) to perform resin injection. In this way, the mold closing mechanism doubles as a transmission driving mechanism (a mechanism for injecting a resin material into the mold surface of the molding die), and it is possible to perform resin molding without providing a transmission driving mechanism different from the mold closing mechanism, thereby simplifying the resin molding apparatus. structure.

The resin molding section has been described above. In this embodiment, as described above, the resin molding apparatus includes a temperature rising section, a resin molding section, a curing section, and an ejecting section. The schematic diagram of FIG. 30 shows the outline of the resin molding apparatus of the present embodiment and a method of manufacturing a resin molded product using the same. As shown in the figure, this resin molding apparatus includes a temperature rising section S1, a resin molding section S2, a curing section S3, and an ejecting section S4. The molding die 1000 can be mounted and disassembled with respect to each of the sections S1 to S4, and can be moved between the various sections of the S1 to S4. The temperature rise section S1 raises the temperature of the mold 1000. The resin molding section S2 includes a molding die 1000 and a mold closing section, and performs resin molding. The curing section S3 cures the resin in the molding die 1000. The ejecting section S4 releases the resin molded product 1b from the mold 1000. The molding die 1000 is not particularly limited, and may be the same as the molding die 1000 of Embodiment 1 (FIGS. 1 to 13) or FIGS. 14 to 29 of this embodiment, for example. The mold closing section is not particularly limited, and may be the same as the mold closing section 220 of FIGS. 14 to 29, for example.

When the method for manufacturing a resin molded product is implemented, for example, as shown in FIG. 30, the molding die 1000 may be circulated between the stages S1 to S4. Specifically, for example, as shown in the figure, the molding 1000 is moved in the order of the temperature rising section S1, the resin molding section S2, the curing section S3, and the ejecting section S4 to manufacture a resin molded product 1b. Then, after the resin molded product 1b is recovered in the ejecting section S4, the molding die 1000 is returned to the temperature increasing section S1, and the method for manufacturing a resin molded product is performed again. The mechanism and method for moving (conveying) the molding die 1000 are not particularly limited. For example, the molding die 1000 can be transferred using a known technique such as a robot arm and a turntable.

In addition, in the manufacturing method of the resin molded article shown in FIGS. 14 to 27 described above, one stage of the resin molding apparatus has all functions of a temperature rising stage, a resin molding stage, a curing stage, and an ejection stage. In other words, in the example of FIGS. 14 to 27, the resin molding section (FIG. 14) including the molding die 1000 and the mold closing section is provided with the function of the temperature rising section of the temperature rising molding die 1000, as shown in FIGS. 15 to 27. The function of the curing section for curing the resin in the mold 1000 and the function of the ejection section for releasing the resin molded product 1 b from the molding mold 1000.

On the other hand, as shown in FIG. 30, by providing the resin molding apparatus with a segment different from a resin molding segment and having a function different from a resin molding segment, the following effects can be obtained, for example. For example, by ejecting the resin molded product from the molding die in the ejection section different from the molding section, an ejection mechanism (for example, a pin, an ejection lever, etc.) may not be provided in the molding mold. That is, the structure of a molding die can be simplified. Further, for example, by heating the molding die in a curing section different from the molding section and curing the resin, during this period, different resin molding can be performed in the molding section. In this way, since it is not necessary to wait for the time until the resin is cured in the molding section, the operation efficiency of the molding section will be improved, so it is expected to shorten the molding cycle.

In addition, in the curing section, for example, the molding die may be heated and heated, and the resin in the molding die may be cured at the temperature. In this case, the function of the curing section to raise the temperature of the molding die is the same as that of the heating section. Therefore, in this case, the temperature increasing section can also serve as the curing section.

The manufacturing method of the resin molded article using the resin molding apparatus shown in the schematic diagram of FIG. 30 can be performed specifically, for example as shown in FIGS. 31-33.

First, as shown in the step cross-sectional views in (a) to (d) of FIG. 31, the molding die is heated in the temperature rising section. As shown in the figure, the heating stage includes a fixed platen 1110 and a movable platen 1210. The fixed platen 1110 includes a heater 1111, and the movable platen 1210 includes a heater 1211. The heater 1111 and the heater 1211 are not particularly limited, and may not be, for example, a cartridge heater or the like. The movable platen 1210 is arranged below the fixed platen 1110, and the molding die 1000 can be clamped using the fixed platen 1110 and the movable platen 1210.

First, as shown in FIG. 31 (a), a molding die 1000 is prepared. The molding 1000 may be the same as the molding die 1000 of FIGS. 14 to 27. In addition, in FIGS. 32 and 33 described later, the same molding die 1000 can be used. On the one hand, the fixed platen 1110 and the movable platen 1210 are heated in advance with the heater 1111 and the heater 1211 in advance. Next, as shown in FIG. 31 (b), the molding die 1000 is transported to a temperature-raising section in which the temperature is increased in advance, and is placed and fixed on the movable platen 1210. The method of fixing the molding die 1000 to the movable platen 1210 is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used. Next, as shown in FIG. 31 (c), the movable platen 1210 is raised, the molding die 1000 is clamped (clamped) between the fixed platen 1110 and the movable platen 1210, and the molding die 1000 is heated. After the temperature rise of the molding die is completed, as shown in FIG. 31 (d), the movable platen 1210 is lowered. After that, the molding die 1000 is taken out from the temperature rising section and moved to the molding section.

First, for example, the heating section can replace the structure shown in Figs. 31 (a) to (d) and has the structure shown in Fig. 31 (e). As shown in FIG. 31 (e), the heating stage is the same as the heating stage of FIGS. 31 (a) to (d), except that the fixed platen 1110 and the heater 1111 are not provided instead of the movable platen 1210. . The warming plate 1212 and the movable platen 1210 also include a heater 1211. In this case, instead of the steps of FIGS. 31 (b) to (d), as shown in FIG. 31 (e), the molding die 1000 is placed and fixed on a temperature riser 1212 that has been heated in advance by a heater 1211. Then, after the molding die 1000 is heated, it is taken out from the temperature rising section and moved to the molding section.

Next, resin molding is performed in a resin molding section. The resin molding in this resin molding stage can be performed, for example, as described with reference to Figs. 14 to 19, and different examples are shown in the sectional views of the steps in Figs. 32 (a) to (h). In FIGS. 32 (a) to (h), the same components as those in FIGS. 14 to 27 are shown with the same symbols. As shown in FIGS. 32 (a) to (h), the resin molding section includes a mold closing section 220, a fixed platen (first platen) 1100, and a movable platen (second platen) 1200. The mold closing section 220, the fixed platen 1100, and the movable platen 1200 may be the same as those in FIGS. 14 to 27. In addition, for example, a heater (for example, a cartridge heater) can be provided on the mold closing section 220, the fixed platen 1100, the movable platen 1200, and the like to heat the molding die 1000 in the same manner as in the temperature rise section.

First, as shown in FIG. 32 (a), the molding die 1000 is transported from the temperature rising section to the resin molding section, and is placed on the mold closing section 220.

Next, as shown in FIG. 32 (b), the movable platen 1200 is raised and the upper mold 100 contacts the fixed platen 1100. In this state, the upper mold 100 is fixed to the fixed platen 1100, and the lower mold 200 is fixed to the mold closing portion 220. At this time, the method of fixing the upper mold 100 and the lower mold 200 is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used.

Next, as shown in FIG. 32 (c), a substrate and a plate (resin material) are supplied to the lower mold 200. This step may be the same as, for example, FIG. 15.

Next, the plate (resin material) is melted into a molten resin (fluid resin). Thereafter, as shown in FIG. 32 (d), the mold is closed by raising the mold closing section 220, and the plunger of the lower mold 200 is pushed in (up), and the molten resin is supplied to the mold surface of the molding mold 1000. (Fluid resin). This step may be the same as, for example, FIGS. 16 to 18.

Next, as shown in FIGS. 32 (e) to (h), the mold is opened and the molding die 1000 is taken out. In these steps, unlike FIGs. 19 to 27, curing of the molten resin (fluid resin), demolding of the resin molded product, and transportation of the resin molded product out of the mold are not performed. This is because the curing of the molten resin (flowable resin) is performed in a curing section described later, and the release of the resin molded product and the transfer of the resin molded product out of the molding mold are performed in an ejection section described later.

First, as shown in FIG. 32 (e), the movable platen 1200 is lowered together with the mold closing portion 220 and the mold 1000. Thereby, as shown in the figure, the upper mold 100 is separated from the fixed platen 1100.

Next, as shown in FIG. 32 (f), the movable platen 1200, the mold closing portion 220, and the molding die 1000 are further lowered together.

Thereafter, as shown in Figs. 32 (g) to (h), the molding die 1000 is moved outside the molding section, and is transferred into the curing section (not shown).

Thereafter, the molding die 1000 is heated and heated in a curing section (not shown), and the flowable resin in the molding die 1000 is cured. Thereby, a resin molded article is manufactured. The curing section may have, for example, the same structure as the temperature increasing section shown in FIGS. 31 (a) to (e). In addition, for example, the temperature increasing section shown in Figs. 31 (a) to (e) may double as the curing section. The step of curing the flowable resin in the molding die 1000 by the curing section is not particularly limited. For example, except that the flowable resin is filled in the molding die 1000, the same steps as those shown in FIGS. 31 (a) to (e) may be performed. .

After that, as shown in the step cross-sectional views in FIGS. 33 (a) to (f), the resin molded article is released from the molding die 1000 in the ejection section. As shown in the figure, the eject section includes a holder 230, a movable platen 1120, and a movable platen 1220. Both the movable platen 1120 and the movable platen 1220 can move up and down. The movable platen 1120 can fix the upper mold 100 on the lower surface thereof. The movable platen 1220 can mount and fix the holder 230 on the upper surface thereof. The holder 230 includes a holder A block 231, a holder B block 232, an ejection plate mounting block 233, an elastic member 234, an ejection plate 235, and an ejection lever 236. The holder A block 231, the holder B block 232, the pop-up plate mounting block 233, and the elastic member 234 each have a holder A block 221, a holder B block 222, and a lower mold carrier that are the same as those of the mold closing section 220 of Figs. The block (mold mounting member) 223 and the elastic member 224 have the same structure. The ejection plate 235 is fixed to the upper surface of the ejection plate mounting block 233. The ejection plate 235 includes an ejection lever 236, and the upper surface of the ejection plate 235 can be in overall contact with the lower surface of the lower mold 200. The ejection lever 236 is arranged at a position corresponding to the plunger of the lower die 200 and can move up and down in the ejection plate 235. As described later, a part of the ejection lever 236 can be pushed out from the upper surface of the ejection plate 235 by raising the holder A block 231. By doing so, a part of the plunger of the lower mold 200 can be pushed out from the upper surface of the lower mold 200 by the ejection lever 236, and the cured residual resin can be separated from the resin molded product.

The demolding step of the resin molded article shown in Figs. 33 (a) to (f) can be performed as follows.

First, as shown in FIG. 33 (a), the molding die 1000 is placed and fixed on the ejection plate 235. The fixing method is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used. In this case, for example, the mold release can be assisted by applying vibration, heat (thermal expansion due to temperature rise), and the like to the mold 1000.

Next, as shown in FIG. 33 (b), the movable platen 1220 is raised together with the holder 230 and the molding die 1000, and the upper die 100 is fixed to the lower surface of the movable platen 1120. The fixing method is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used.

Next, as shown in FIG. 33 (c), the movable platen 1120 is raised together with the upper die 100, and the movable platen 1220 is lowered together with the holder 230 and the lower die 200. Thereby, the upper mold 100 and the lower mold 200 are opened. In this state, as shown in the figure, the unloader 300 is caused to enter between the upper mold 100 and the lower mold 200. As shown in the figure, the unloader 300 is similar to the unloader 300 of FIGS. 6 to 13 in Example 1 and includes a suction cup 301 for adsorbing the cured resin 20 and the remaining resin 20d, and a package holding member (resin molding holding Component) 302. The chuck 301 corresponds to a “resin molded product holding mechanism”, and the packaged substrate holding member (resin molded product holding member) 302 corresponds to a “resin molded product holding mechanism”.

Next, as shown in FIG. 33 (d), the movable platen 1120 is lowered together with the upper mold 100, and the movable platen 1220 is raised together with the holder 230 and the lower mold 200. Thereby, as shown in the figure, the unloader is clamped and fixed using the upper mold 100 and the lower mold 200. Further, as shown in the figure, the resin molded product holding member 302 is lowered in the direction of the arrow I1, and the resin molded product (packaged substrate) 1b is held. As shown in the figure, the resin molded product holding member 302 holds the resin molded product 1 b by pressing a portion of the cured resin 20 that is cured in the flow path 112 from above. In addition, for example, instead of the portion cured in the runner 112 in the cured resin 20, a portion molded in the cavity 111 and pressed and cured by the resin molded product holding member 302 from above may be used. Further, the movable platen 1220 is raised together with the holder 230 and the lower mold 200. At this time, as shown in the figure, as the holder A block 231 is raised, a part of the ejection lever 236 is pushed out from the upper surface of the ejection plate 235. Thereby, a part of the plunger of the lower mold 200 is pushed out from the upper surface of the lower mold 200 by the ejection lever 236, and as shown in the figure, the cured residual resin is separated from the resin molded product.

Thereafter, as shown in FIG. 33 (e), the resin molded product (the packaged substrate) and the remaining resin separated from the resin molded product are adsorbed by the suction cup of the unloader. After that, the unloader is conveyed to the outside of the ejection section (not shown) together with the resin molded product and the remaining resin. These steps can be performed according to, for example, FIGS. 24 to 27.

Further, as shown in FIG. 33 (f), the molding die 1000 is separated from the movable platen 1120. After that, the molding die 1000 is separated from the holder 230 and conveyed to the outside of the ejection section. This molding die 1000 can be transported again to the temperature-raising stage of FIG. 31, and the manufacturing method of the resin molded article demonstrated in FIGS. 31-33 can be performed again, for example.

In addition, in the present invention, the structure of the molding die of the resin molding apparatus is not limited to the molding die 1000 shown in FIGS. 1 to 33. Several modifications of the molding die are shown in FIGS. 34 to 41.

Fig. 34 is a sectional view schematically showing a modified example of the molding die. As shown in the figure, the molding die 1000 is provided with the remaining resin separation member (residual resin separation block) 216, the remaining resin separation member elastic member 217, and the lower mold base block 210B, and does not include the ring 214. It is the same as the mold 1000 shown in FIGS. 14 to 33. In this figure, the lower mold cavity block 210 is fixed to the upper surface of the lower mold base block 210B. The plunger 213 penetrates the lower die base block 210B. The remaining resin separation member 216 is arranged so as to surround the outer periphery and the lower surface of the chamber 212, and is elastically supported on the lower mold base block 210B by an elastic member 217 for the remaining resin separation member. The remaining resin separating member 216 can be moved up and down by the expansion and contraction of the elastic member 217 for the remaining resin separating member. The plunger 213 penetrates the remaining resin separating member 216 and the elastic member 217 for the remaining resin separating member. The remaining resin separating member 216 is disposed directly below the remaining material portion (remaining resin accommodating portion) 113, and the remaining resin in the remaining material portion 113 can be pressed by the remaining resin separating member 216. As shown in the figure, a substrate-side end portion of the upper portion of the remaining resin separation member 216 is formed with a protruding portion that protrudes in the horizontal direction. As a result, when the upper mold 100 and the lower mold 200 are closed, the end portions on the remaining portion (residual resin accommodating portion) 113 side of the substrate are clamped by the mold surface of the lower mold 200 and the ends of the remaining resin separation member 216 hold.

The manufacturing method of the resin molded product using the molding die 1000 of FIG. 34 can be performed similarly to FIGS. 14-27, for example. The molding die 1000 shown in FIG. 34 can separate the cured resin of the resin molded product and the remaining resin in the residue portion 113 by opening the mold after the resin is cured. The outline of the manufacturing method of the resin molded product using the molding die 1000 of FIG. 34 can be shown, for example specifically, in the sectional drawing of the step of FIG. 35-37. First, as shown in FIG. 35, the substrate 1 is supplied (mounted) to the substrate mounting portion 211 of the lower mold 200, and a plate (resin material) 20a is supplied to the chamber 212 at the same time. Next, the mold is heated and the mold is closed in the same manner as in FIGS. 15 to 18. Accordingly, as shown in FIG. 36, the plunger 213 is pushed into the chamber 212 in a state where the mold surface of the lower mold 200 and the mold surface of the upper mold 100 are in contact (closed). In this way, as shown in FIG. 36, the molten resin 20 b obtained by melting the resin material 20 a is filled into the residual material portion 113, the flow path 112, and the cavity 111. After that, as in FIGS. 19 to 21, after the resin in the cavity 111 and the remaining resin in the residual material portion 113 are cured, the mold is released by mold opening. When demolding is performed by this mold opening, as shown in FIG. 37, in a state where the resin molded product 1b is fixed to the lower mold 200, the elastic resin member 217 for the residual resin separation member is stretched, and the residual resin separation member 216 faces each other. It rises at the lower mold 200. Thereby, since the remaining resin 20d solidified in the residual material portion 113 can be pushed up by the residual resin separating member 216, as shown in the figure, the cured resin 20 in the cavity 111 and the solidified material in the residual material portion 113 can be separated. Of the remaining resin 20d.

Another embodiment of the molding die is schematically shown in the sectional view of FIG. 38. As shown in the figure, in the molding die 1000, the upper die 100 does not include the residual material portion 113. Further, a residual material portion 113B in which the upper portion of the chamber 212 of the lower mold 200 and the flow path 112 of the upper mold 100 communicate is formed. Further, regarding the lower surface of the substrate mounting portion 211 of the lower mold 200, the position corresponding to the cavity 111 of the upper mold is concave, and a lower mold cavity 111B is formed. Except for these and without the ring 214, the molding die 1000 shown in FIG. 38 is the same as the molding die 1000 shown in FIGS. 14 to 33.

The manufacturing method of the resin molded article using the molding die 1000 of FIG. 38 can be performed similarly to FIGS. 14-27, for example. The molding die 1000 shown in FIG. 38 can, for example, use a perforated substrate to inject a fluid resin injected into the cavity 111 of the upper mold into the lower mold cavity 111B from the hole of the substrate.

Another cross-sectional view of FIG. 39 schematically illustrates another modification of the molding die. As shown in the figure, the molding die 1000 is provided with an intermediate die 400 between the upper die 100 and the lower die 200. The intermediate mold 400 includes an intermediate mold resin material storage portion 413 at a position directly above the chamber (resin material storage portion) 212. The intermediate mold resin material accommodating portion 413 can accommodate the resin material (plate) 20a, and at the same time communicates with the residual material portion 113 when the mold is closed, and can inject the molten (fluidized) resin material (fluid resin) into the residual material portion 113 . That is, the intermediate mold resin material accommodating portion 413 doubles as the intermediate mold resin passage. In addition, the lower mold 200 of FIG. 39 does not include the substrate mounting portion 211. Instead, in FIG. 39, the intermediate mold 400 includes a substrate mounting portion 411 on a surface opposite to the upper mold 100. The lower surface of the substrate mounting portion 411 of the intermediate mold 400 is concave at a position corresponding to the cavity 111 of the upper mold, and an intermediate mold cavity 412 is formed. Except for these and without the ring 214, the molding die 1000 of FIG. 39 is the same as the molding die 1000 of FIGS. 13 to 33.

40 is a plan view of the upper mold cavity block 110 and the intermediate mold 400 of FIG. 39 as viewed from the mold surface side. As described above, the positions of the intermediate mold resin material accommodating portion (intermediate mold resin channel) 413 and the residual material portion 113 of the upper mold cavity block 110 correspond to the positions of the intermediate mold cavity 412 and the mold cavity 111 of the upper mold cavity block 110, respectively.

The manufacturing method of the resin molding apparatus using the molding die 1000 of FIG. 39 can be performed similarly to FIGS. 14-27, for example. 41 (a) to (b) are schematic cross-sectional views. FIG. 41 (a) shows a state where the plate 20a is contained in the chamber 212. From this state, after further placing the substrate on the substrate placing portion 411 of the intermediate mold, the plate 20a is melted (fluidized) as in 16 to 18, and the mold is closed to inject the residual material portion 113, the flow channel 112, and the mold. Cavity 111. Furthermore, in the case of the molding die 1000 shown in FIG. 39, for example, by using a perforated substrate, the fluid resin injected into the cavity 111 of the upper mold can be injected into the intermediate mold cavity 412 from the hole of the substrate. Thereafter, if the fluid resin is cured, the fluid resin becomes the cured resin 20 and the residual resin (unwanted resin portion) 20d as shown in FIG. 41 (b). The other steps can be performed in the same manner as in FIGS. 14 to 27 as described above.

In addition, the molding die 1000 of FIGS. 34 to 41 can be further arbitrarily deformed. For example, although the ring 214 is omitted in FIGS. 34 to 41, the ring 214 may be provided in the same manner as in FIGS. 14 to 33. Further, for example, as shown in FIGS. 29 (a) to (c), the lower mold may be provided with a through hole (residual resin leakage hole) 218, and the lower end of the plunger 213 (the portion contacting the holder A block 221) may be rounded. .

Next, another example of the step of demolding the resin molded article from the molding die 1000 in the ejection section will be described using FIGS. 42 to 56. In FIGS. 42 to 56, the same components as those in FIGS. 33 (a) to (f) are denoted by the same symbols. In addition, the pop-up section of FIGS. 42 to 56 includes a fixed platen 1100 instead of the movable platen 1120.

First, as shown in FIG. 42, the mold 1000 holding the resin molded product 1 b and the remaining resin 20 d after the resin molding are carried into the ejection section. Specifically, first, as shown in the figure, the molding die 1000 is transported (moved) in the direction of the arrow E1 (direction from the outside of the eject section to the inside), and is positioned between the fixed platen 1100 and the holder 230. . After that, the molding die 1000 is moved in the direction of the arrow E2 (downward), and is placed and fixed on the ejection plate 235. The fixing method is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used. In this case, for example, demolding can be assisted by applying vibration, heat (thermal expansion due to temperature rise), and the like to the molding die 1000.

Next, as shown in FIG. 43, the movable platen 1220 is raised together with the holder 230 and the molding die 1000 in the direction of the arrow F1, and the upper mold 100 is fixed to the lower surface of the movable platen 1120. The fixing method is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used.

Next, as shown in FIG. 44, the movable platen 1220 is lowered together with the holder 230 and the lower mold 200 in the direction of the arrow G1. Thereby, the upper mold 100 and the lower mold 200 are opened. Accordingly, as shown in the figure, the resin molded product 1b (cured resin 20) and the remaining resin (unwanted resin portion) 20d are released from the mold surface of the upper mold 100 while being held on one surface of the lower mold 200.

Next, in a state where the upper mold 100 and the lower mold 200 are opened as shown in FIG. 44, as shown in FIG. 45, the unloader 300 is moved in the direction of the arrow H1 (from the outside of the molding die 1000 toward the inside). ) Carry (move). Accordingly, as shown in FIG. 46, the unloader 300 is caused to enter between the upper mold 100 and the lower mold 200. As shown in FIGS. 45 and 46, the unloader 300 is similar to the unloader 300 of FIGS. 6 to 13 of Example 1 and includes a suction cup 301 for adsorbing the cured resin 20 and the remaining resin 20 d and a packaged substrate holding member ( Resin molded product holding member) 302. The chuck 301 corresponds to a “resin molded product holding mechanism”, and the packaged substrate holding member (resin molded product holding member) 302 corresponds to a “resin molded product holding mechanism”.

Next, as shown in FIG. 47, the movable platen 1220 is raised with the holder 230 and the lower mold 200 in the direction of arrow F2. Thereby, as shown in the figure, the unloader is clamped and fixed (clamped) by the upper mold 100 and the lower mold 200.

Next, as shown in FIG. 48, the resin molded product holding member 302 is lowered in the direction of the arrow I1, and the resin molded product (packaged substrate) 1b is held. As shown in the figure, the resin molded product holding member 302 holds the resin molded product 1 b by pressing a portion of the cured resin 20 that is cured in the flow path 112 from above. In addition, for example, instead of the portion cured in the runner 112 in the cured resin 20, the portion cured in the cavity 111 may be pressed by the resin molded product holding member 302 from above.

Next, as shown in FIG. 49, the movable platen 1220 and the holder blocks (the holder A block 231 and the holder B block 232) are raised together in the direction of arrow F3. At this time, as shown in the figure, as the holder A block 231 is raised, a part of the ejection lever 236 is pushed out from the upper surface of the ejection plate 235. Thereby, a part of the plunger 213 of the lower mold 200 is pushed out from the upper surface of the lower mold 200 by the ejection lever 236, and the cured remaining resin 20d is separated from the resin molded product 1b as shown in the figure.

Next, as shown in FIG. 50, the movable platen 1220 is lowered together with the holder 230 and the lower mold 200 in the direction of the arrow G2. Thereby, the clamp of the unloader 300 is cancelled | released.

Next, as shown in FIG. 51, the suction cup 301 of the unloader 300 is lowered in the direction of arrow J1. Thereby, as shown in the figure, the sucker 301 is brought into contact with and adsorbs the solidified portion in the cavity 111 of the cured resin 20 and the remaining resin 20d separated from the resin molded product 1b.

Next, as shown in FIG. 52, the suction cup 301 is raised in the direction of the arrow K1. Then, as shown in Fig. 53, the suction cup 301 is further raised in the direction of the arrow K2. Thereby, as shown in the figure, the resin molded product 1 b and the surplus resin 20 d adsorbed on the chuck 301 are separated from the lower mold 200.

Thereafter, as shown in FIG. 54, the unloader 300 is moved (conveyed) in the direction of the arrow L1 (direction from the inside of the ejection section to the outside) together with the resin molded product 1b and the remaining resin 20d, and exits outside the ejection section .

Thereafter, as shown in FIG. 55, the movable platen 1220 is raised in the direction of arrow F4 together with the holder 230 and the lower mold 200 to close the mold 1000. Then, in this state, the fixing of the fixed platen 1100 and the mold 1000 is released.

Further, as shown in FIG. 56, the movable platen 1220 is lowered together with the holder 230 and the molding die 1000 in the direction of the arrow G3 to separate the molding die 1000 from the fixed platen 1100. After that, the molding die 1000 is separated from the holder 230, moved (conveyed) in the direction of the arrow M1 (direction from the inside to the outside of the ejection section), and exits out of the ejection section. For example, the molding die 1000 can be transported to the temperature rising section again, and the method for manufacturing a resin molded product can be performed again.

In addition, in this embodiment, an example of a resin molding apparatus having each of a temperature rising section, a resin molding section, a curing section, and an ejecting section has been described. However, the present invention is not limited to this. For example, the resin molding apparatus of the present invention may include a segment having at least one function among a plurality of temperature rising segments, a resin molding segment, a curing segment, and an ejecting segment. In this way, for example, the manufacturing efficiency of a resin molded article can be improved. In addition, for example, a specific one segment may have two or more functions in each of the segments. For example, in the examples shown in Figs. 14 to 27, as described above, one stage of the resin molding apparatus has all four functions of a heating stage, a resin molding stage, a curing stage, and an ejection stage. In addition, the resin molding apparatus of the present invention is not limited to this, and for example, a specific one segment may have functions of two or three of the four segments, and a segment different from the specific one segment may have other Features. For example, as described above, the same stage may serve as both a temperature increasing stage and a curing stage.

Further, the present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately combined, changed, or selectively adopted as needed within a range not departing from the spirit of the present invention.

This application claims priority based on Japanese application Japanese Patent Application No. 2017-155866 filed on August 10, 2017, the entire disclosure of which is incorporated herein.

Claims (10)

    A resin-molded product conveying mechanism includes: a resin-molded product holding mechanism; and a resin-molded product adsorption mechanism. The resin-molded product holding mechanism can hold the resin-molded product in a mold, and can be separated in this state. The molded article and the unnecessary resin portion after the resin molding can adsorb and transport the resin molded article by the resin molded article adsorption mechanism.         A resin molding apparatus includes the conveyance mechanism and the molding die described in claim 1.         The resin molding device according to claim 2, wherein the resin molded product can be held in the molding mold by pressing the resin molded product against the molding mold with the resin molded product holding mechanism.         The resin molding device according to claim 2 or 3, wherein the molding die includes a plunger, and the resin molding is held in the molding die by the resin molding holding mechanism, and the resin molding The plunger can separate the resin molded article and the unnecessary resin portion by applying a force to the unnecessary resin portion.         The resin molding apparatus according to any one of claims 1 to 3, wherein the resin molding apparatus further includes a first platen and a second platen, the molding die includes one mold and the other mold, and the one mold is mounted On the first platen, the other mold is mounted on the second platen.         The resin molding device according to claim 2 or 3, wherein the resin molding device includes a temperature rising section, a resin molding section, a curing section, and an ejecting section, and the molding die can be attached to and detached from the sections, and can be attached to the sections. Moving between sections, the heating section heats the molding die, the resin molding section performs resin molding, the curing section solidifies the resin in the molding die, and the ejecting section releases the resin molded product from the molding die.         A method for manufacturing a resin molded product includes the following steps: a resin molding step for resin molding by a molding die; an unnecessary resin part separation step for separating a resin molded product and an unnecessary resin part; and a conveying step for separating the resin molded product and the foregoing The unnecessary resin part is carried out of the molding die.         The method for manufacturing a resin molded article according to claim 7, wherein the resin molded product is held by the resin molded product holding mechanism in the useless resin part separating step in the useless resin part separation step using the conveyance mechanism described in claim 1. In the molding die, in this state, the resin molded product and the useless resin portion are separated, and in the transporting step, the resin molded product is adsorbed and transported by the adsorption mechanism.         The method for manufacturing a resin molded article according to claim 7, wherein the resin molding device according to any one of claims 2 to 6 is used, and in the resin molding step, the resin molding device includes the resin molding device provided in the resin molding device. The molding die performs resin molding, and in the useless resin separation step, the resin molded product is held in the molding die by the resin molded product holding mechanism, and in this state, the resin molded product and the useless resin portion are separated, In the transporting step, the resin molded product is adsorbed and transported by the adsorption mechanism.         The method for manufacturing a resin molded article according to claim 9, wherein the resin molding device is the resin molding device according to claim 6, and the method for manufacturing the resin molded article further includes a resin material accommodating step, in the molding die. A resin material accommodating part is contained in the resin material; a step of heating the mold, in which the mold is heated in the temperature rising section; a resin curing step, in which the resin in the mold is cured in the curing section; and a demolding step, in In the ejecting section, the resin molded article is demolded from the molding die, and the resin material accommodating step is performed in the resin molding section.