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TWI632429B - Photosensitive resin composition - Google Patents

Photosensitive resin composition Download PDF

Info

Publication number
TWI632429B
TWI632429B TW104105075A TW104105075A TWI632429B TW I632429 B TWI632429 B TW I632429B TW 104105075 A TW104105075 A TW 104105075A TW 104105075 A TW104105075 A TW 104105075A TW I632429 B TWI632429 B TW I632429B
Authority
TW
Taiwan
Prior art keywords
resin
meth
resin composition
structural unit
photosensitive resin
Prior art date
Application number
TW104105075A
Other languages
English (en)
Chinese (zh)
Other versions
TW201546556A (zh
Inventor
河西裕
井上裕康
山下和貴
Original Assignee
住友化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友化學股份有限公司 filed Critical 住友化學股份有限公司
Publication of TW201546556A publication Critical patent/TW201546556A/zh
Application granted granted Critical
Publication of TWI632429B publication Critical patent/TWI632429B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007Filters, e.g. additive colour filters; Components for display devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
TW104105075A 2014-02-28 2015-02-13 Photosensitive resin composition TWI632429B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-038516 2014-02-28
JP2014038516A JP5644970B1 (ja) 2014-02-28 2014-02-28 感光性樹脂組成物

Publications (2)

Publication Number Publication Date
TW201546556A TW201546556A (zh) 2015-12-16
TWI632429B true TWI632429B (zh) 2018-08-11

Family

ID=52139204

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104105075A TWI632429B (zh) 2014-02-28 2015-02-13 Photosensitive resin composition

Country Status (5)

Country Link
JP (1) JP5644970B1 (ko)
KR (1) KR101559692B1 (ko)
CN (1) CN105992974B (ko)
TW (1) TWI632429B (ko)
WO (1) WO2015129058A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106444283B (zh) * 2015-08-05 2021-04-16 住友化学株式会社 感光性树脂组合物
KR102129277B1 (ko) * 2016-03-30 2020-07-02 후지필름 가부시키가이샤 보호막 형성용 조성물, 보호막 형성용 조성물의 제조 방법, 패턴 형성 방법, 및 전자 디바이스의 제조 방법
WO2018008610A1 (ja) * 2016-07-08 2018-01-11 旭硝子株式会社 感光性組成物、重合体の製造方法、感光性組成物の製造方法、積層体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004286809A (ja) * 2003-03-19 2004-10-14 Fuji Photo Film Co Ltd 染料含有硬化性組成物、並びに、これを用いたカラーフィルターおよびその製造方法
JP2007245648A (ja) * 2006-03-17 2007-09-27 Fujifilm Corp 平版印刷版原版および平版印刷方法
JP2011165396A (ja) * 2010-02-05 2011-08-25 Mitsubishi Chemicals Corp アクティブ駆動型有機電界発光素子の隔壁用感光性組成物およびアクティブ駆動型有機電界発光表示装置
TW201224654A (en) * 2010-09-01 2012-06-16 Sumitomo Chemical Co Photosensitive resin composition

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004042474A1 (ja) * 2002-11-06 2004-05-21 Asahi Glass Company, Limited ネガ型感光性樹脂組成物
JP2009098193A (ja) * 2007-10-12 2009-05-07 Fujifilm Corp 着色硬化性組成物、着色パターン、カラーフィルタ、その製造方法、及び液晶表示素子
JP2009300642A (ja) * 2008-06-12 2009-12-24 Tokyo Ohka Kogyo Co Ltd 着色感光性樹脂組成物
JP2011242664A (ja) * 2010-05-20 2011-12-01 Jsr Corp 隔壁形成用感光性組成物、電子ペーパー用隔壁の形成方法、電子ペーパー用隔壁及び電子ペーパー。

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004286809A (ja) * 2003-03-19 2004-10-14 Fuji Photo Film Co Ltd 染料含有硬化性組成物、並びに、これを用いたカラーフィルターおよびその製造方法
JP2007245648A (ja) * 2006-03-17 2007-09-27 Fujifilm Corp 平版印刷版原版および平版印刷方法
JP2011165396A (ja) * 2010-02-05 2011-08-25 Mitsubishi Chemicals Corp アクティブ駆動型有機電界発光素子の隔壁用感光性組成物およびアクティブ駆動型有機電界発光表示装置
TW201224654A (en) * 2010-09-01 2012-06-16 Sumitomo Chemical Co Photosensitive resin composition

Also Published As

Publication number Publication date
JP2015161894A (ja) 2015-09-07
JP5644970B1 (ja) 2014-12-24
CN105992974B (zh) 2020-03-13
WO2015129058A1 (ja) 2015-09-03
TW201546556A (zh) 2015-12-16
CN105992974A (zh) 2016-10-05
KR101559692B1 (ko) 2015-10-12

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