TWI632429B - Photosensitive resin composition - Google Patents
Photosensitive resin composition Download PDFInfo
- Publication number
- TWI632429B TWI632429B TW104105075A TW104105075A TWI632429B TW I632429 B TWI632429 B TW I632429B TW 104105075 A TW104105075 A TW 104105075A TW 104105075 A TW104105075 A TW 104105075A TW I632429 B TWI632429 B TW I632429B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- meth
- resin composition
- structural unit
- photosensitive resin
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-038516 | 2014-02-28 | ||
JP2014038516A JP5644970B1 (ja) | 2014-02-28 | 2014-02-28 | 感光性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201546556A TW201546556A (zh) | 2015-12-16 |
TWI632429B true TWI632429B (zh) | 2018-08-11 |
Family
ID=52139204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104105075A TWI632429B (zh) | 2014-02-28 | 2015-02-13 | Photosensitive resin composition |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5644970B1 (ko) |
KR (1) | KR101559692B1 (ko) |
CN (1) | CN105992974B (ko) |
TW (1) | TWI632429B (ko) |
WO (1) | WO2015129058A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106444283B (zh) * | 2015-08-05 | 2021-04-16 | 住友化学株式会社 | 感光性树脂组合物 |
KR102129277B1 (ko) * | 2016-03-30 | 2020-07-02 | 후지필름 가부시키가이샤 | 보호막 형성용 조성물, 보호막 형성용 조성물의 제조 방법, 패턴 형성 방법, 및 전자 디바이스의 제조 방법 |
WO2018008610A1 (ja) * | 2016-07-08 | 2018-01-11 | 旭硝子株式会社 | 感光性組成物、重合体の製造方法、感光性組成物の製造方法、積層体の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004286809A (ja) * | 2003-03-19 | 2004-10-14 | Fuji Photo Film Co Ltd | 染料含有硬化性組成物、並びに、これを用いたカラーフィルターおよびその製造方法 |
JP2007245648A (ja) * | 2006-03-17 | 2007-09-27 | Fujifilm Corp | 平版印刷版原版および平版印刷方法 |
JP2011165396A (ja) * | 2010-02-05 | 2011-08-25 | Mitsubishi Chemicals Corp | アクティブ駆動型有機電界発光素子の隔壁用感光性組成物およびアクティブ駆動型有機電界発光表示装置 |
TW201224654A (en) * | 2010-09-01 | 2012-06-16 | Sumitomo Chemical Co | Photosensitive resin composition |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004042474A1 (ja) * | 2002-11-06 | 2004-05-21 | Asahi Glass Company, Limited | ネガ型感光性樹脂組成物 |
JP2009098193A (ja) * | 2007-10-12 | 2009-05-07 | Fujifilm Corp | 着色硬化性組成物、着色パターン、カラーフィルタ、その製造方法、及び液晶表示素子 |
JP2009300642A (ja) * | 2008-06-12 | 2009-12-24 | Tokyo Ohka Kogyo Co Ltd | 着色感光性樹脂組成物 |
JP2011242664A (ja) * | 2010-05-20 | 2011-12-01 | Jsr Corp | 隔壁形成用感光性組成物、電子ペーパー用隔壁の形成方法、電子ペーパー用隔壁及び電子ペーパー。 |
-
2014
- 2014-02-28 JP JP2014038516A patent/JP5644970B1/ja not_active Expired - Fee Related
- 2014-06-06 CN CN201480075564.XA patent/CN105992974B/zh not_active Expired - Fee Related
- 2014-06-06 WO PCT/JP2014/065660 patent/WO2015129058A1/ja active Application Filing
- 2014-06-06 KR KR1020147033070A patent/KR101559692B1/ko active IP Right Grant
-
2015
- 2015-02-13 TW TW104105075A patent/TWI632429B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004286809A (ja) * | 2003-03-19 | 2004-10-14 | Fuji Photo Film Co Ltd | 染料含有硬化性組成物、並びに、これを用いたカラーフィルターおよびその製造方法 |
JP2007245648A (ja) * | 2006-03-17 | 2007-09-27 | Fujifilm Corp | 平版印刷版原版および平版印刷方法 |
JP2011165396A (ja) * | 2010-02-05 | 2011-08-25 | Mitsubishi Chemicals Corp | アクティブ駆動型有機電界発光素子の隔壁用感光性組成物およびアクティブ駆動型有機電界発光表示装置 |
TW201224654A (en) * | 2010-09-01 | 2012-06-16 | Sumitomo Chemical Co | Photosensitive resin composition |
Also Published As
Publication number | Publication date |
---|---|
JP2015161894A (ja) | 2015-09-07 |
JP5644970B1 (ja) | 2014-12-24 |
CN105992974B (zh) | 2020-03-13 |
WO2015129058A1 (ja) | 2015-09-03 |
TW201546556A (zh) | 2015-12-16 |
CN105992974A (zh) | 2016-10-05 |
KR101559692B1 (ko) | 2015-10-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |