[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

TWI625989B - 印刷配線板用銅箔及覆銅積層板 - Google Patents

印刷配線板用銅箔及覆銅積層板 Download PDF

Info

Publication number
TWI625989B
TWI625989B TW104112547A TW104112547A TWI625989B TW I625989 B TWI625989 B TW I625989B TW 104112547 A TW104112547 A TW 104112547A TW 104112547 A TW104112547 A TW 104112547A TW I625989 B TWI625989 B TW I625989B
Authority
TW
Taiwan
Prior art keywords
copper
copper foil
roughened
plating
visibility
Prior art date
Application number
TW104112547A
Other languages
English (en)
Chinese (zh)
Other versions
TW201611672A (zh
Inventor
Ryota Fujita
Hirofumi Kawanaka
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW201611672A publication Critical patent/TW201611672A/zh
Application granted granted Critical
Publication of TWI625989B publication Critical patent/TWI625989B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
TW104112547A 2014-09-09 2015-04-20 印刷配線板用銅箔及覆銅積層板 TWI625989B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014183358 2014-09-09

Publications (2)

Publication Number Publication Date
TW201611672A TW201611672A (zh) 2016-03-16
TWI625989B true TWI625989B (zh) 2018-06-01

Family

ID=55458686

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104112547A TWI625989B (zh) 2014-09-09 2015-04-20 印刷配線板用銅箔及覆銅積層板

Country Status (4)

Country Link
KR (1) KR101988778B1 (ja)
CN (1) CN106795644B (ja)
TW (1) TWI625989B (ja)
WO (1) WO2016038923A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102639577B1 (ko) * 2016-11-21 2024-02-21 에스케이넥실리스 주식회사 금속 적층체 및 그 제조방법
JP7492807B2 (ja) * 2016-12-06 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7492808B2 (ja) * 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
KR102100016B1 (ko) * 2017-11-20 2020-04-10 주식회사 엘지화학 폴리이미드 필름의 모노머 정량분석법
EP3786316A4 (en) * 2018-04-27 2022-04-27 JX Nippon Mining & Metals Corporation SURFACE TREATED COPPER FOIL, COPPER COATED LAMINATE AND CIRCUIT BOARD
JP7251928B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP6733971B1 (ja) * 2019-04-23 2020-08-05 株式会社シミズ 銅害防止膜、銅害防止膜付き銅部材の製造方法および銅害防止方法
CN114008250B (zh) 2019-06-12 2024-04-16 东洋钢钣株式会社 粗糙化镀板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004098659A (ja) * 2002-07-19 2004-04-02 Ube Ind Ltd 銅張積層板及びその製造方法
JP2009019132A (ja) * 2007-07-12 2009-01-29 Reika O ポリアミック酸樹脂組成物及びフレキシブル銅張積層板
TW201422422A (zh) * 2012-09-10 2014-06-16 Jx Nippon Mining & Metals Corp 表面處理銅箔及使用其之積層板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340596A (ja) 1998-05-21 1999-12-10 Furukawa Electric Co Ltd:The 印刷回路基板用の銅箔、および樹脂付き銅箔
US6984456B2 (en) 2002-05-13 2006-01-10 Mitsui Mining & Smelting Co., Ltd. Flexible printed wiring board for chip-on flexibles
TWI298988B (en) 2002-07-19 2008-07-11 Ube Industries Copper-clad laminate
JP2004269959A (ja) * 2003-03-07 2004-09-30 Asahi Kasei Corp プリント回路形成等に使用される銅箔を備えた複合体とその製造方法
JP4907580B2 (ja) * 2008-03-25 2012-03-28 新日鐵化学株式会社 フレキシブル銅張積層板
JP5115527B2 (ja) * 2009-08-20 2013-01-09 日立電線株式会社 プリント配線板用銅箔およびその製造方法
JP4927963B2 (ja) * 2010-01-22 2012-05-09 古河電気工業株式会社 表面処理銅箔、その製造方法及び銅張積層基板
JP5242710B2 (ja) * 2010-01-22 2013-07-24 古河電気工業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
CN103483816A (zh) * 2013-07-31 2014-01-01 宁波泛龙塑料新材料有限公司 一种碳纤增强聚酰亚胺复合材料及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004098659A (ja) * 2002-07-19 2004-04-02 Ube Ind Ltd 銅張積層板及びその製造方法
JP2009019132A (ja) * 2007-07-12 2009-01-29 Reika O ポリアミック酸樹脂組成物及びフレキシブル銅張積層板
TW201422422A (zh) * 2012-09-10 2014-06-16 Jx Nippon Mining & Metals Corp 表面處理銅箔及使用其之積層板

Also Published As

Publication number Publication date
WO2016038923A1 (ja) 2016-03-17
CN106795644A (zh) 2017-05-31
KR101988778B1 (ko) 2019-06-12
TW201611672A (zh) 2016-03-16
KR20170052577A (ko) 2017-05-12
CN106795644B (zh) 2019-10-01

Similar Documents

Publication Publication Date Title
TWI625989B (zh) 印刷配線板用銅箔及覆銅積層板
US8624125B2 (en) Metal foil laminated polyimide resin substrate
JP4927963B2 (ja) 表面処理銅箔、その製造方法及び銅張積層基板
JP6426290B2 (ja) 樹脂付銅箔、銅張積層板及びプリント配線板
JP5651811B1 (ja) キャリア付銅箔、銅張積層板、プリント配線板、電子機器、及び、プリント配線板の製造方法
JP3768104B2 (ja) フレキシブルプリント基板
US20140057123A1 (en) Copper foil for printed circuit
JP2006289959A (ja) 銅張り積層板
JPWO2019073891A1 (ja) プリント配線板用樹脂組成物、樹脂付銅箔、銅張積層板、及びプリント配線板
TWI503456B (zh) Attached copper foil
KR20090102633A (ko) 플렉시블 동장 적층판
JP2015201658A (ja) フレキシブルプリント基板の製法
JP2006142514A (ja) 銅張り積層板
JP2009021351A (ja) カバーレイ
JP5877282B1 (ja) プリント配線板用銅箔及び銅張積層板
JP6427454B2 (ja) 銅張積層板及びプリント配線板
JP2009021350A (ja) カバーレイ
KR20120112216A (ko) 금속장 적층판
JP5171690B2 (ja) 銅張積層板及びその製造方法
JP5042728B2 (ja) ポリイミド樹脂層の表面改質方法及び金属張積層板の製造方法
JP2014070085A (ja) 熱可塑性ポリイミド、金属張積層体、回路基板、その使用方法、金属張積層体の製造方法及び回路基板の製造方法
JP5126735B2 (ja) フレキシブルプリント配線板
JP5191367B2 (ja) ポリイミド金属箔積層板、並びにその製造方法
JP5073801B2 (ja) 銅張り積層板の製造方法
CN106062895B (zh) 形成导体层的方法及使用导电层制备多层布线基板的方法