TWI678713B - Method for assembling electronic device - Google Patents

Abstract

An electronic device assembling method, wherein a plurality of coil modules are electrically connected and mounted on a plurality of base modules, and the method comprises: placing the base module on a first carrier, and placing the coils After the module is installed on a second carrier, the second carrier is driven to rotate around a rotation center, and the first carrier and the second carrier are relatively moved, and each coil module is connected to one of the bases. The base module is corresponding, and the coil module is transferred to the corresponding base module by a suction element. The cooperation of the foregoing steps can quickly and stably assemble the coil modules on the base module.

Description

Method for assembling electronic device

The invention relates to an assembling method, in particular to an assembling method of an electronic device in which a coil module is mounted on a base module by automated production.

Generally, when an electronic device having a coil module is manufactured, a plurality of wires are wound around two iron cores to form a coil module by a machine or manually, and then the coil modules are manually installed on a base. In the module, after the installation, the wires of each coil module are manually tied to several pins of the base module to complete the installation of the electronic device.

It is known that the coil modules are manually installed in the base module, and the method of manually binding the wires is feasible, but manual assembly is not only costly, but the quality of the assembly is also difficult to control due to the unevenness of the operator. .

An object of the present invention is to provide an assembling method of an electronic device capable of improving assembling speed and assembling quality.

In the assembly method of the present invention, a plurality of coil modules are electrically connected and mounted on a plurality of base modules, and the steps of the method include: (A) placing the base module on a first carrier (B) the coil module is mounted on a second carrier; (C) the second carrier is driven to rotate around a rotation center, and the first carrier and the second carrier are relatively moved , Let each coil module correspond to one of the base modules; and (D) move the coil module to the corresponding base module by a suction element.

The beneficial effect of the present invention is that each coil module can correspond to one of the base modules by using the rotation of the second carrier and the relative movement between the first carrier and the second carrier. By using the cooperation of the suction element, the coil modules are quickly and stably mounted on the base module.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

Referring to FIGS. 1, 2 and 3, an embodiment of an assembling method of the present invention can be automated, and a plurality of coil modules 1 are mounted on a plurality of base modules 2 to form a plurality of electronic devices. There is no particular limitation on the correspondence between the coil modules 1 and the base modules 2. They can be one-to-one or many-to-one. In this embodiment, each base module 2 is Assemble three coil modules 1 spaced apart along one assembly direction 20.

Each coil module 1 has two iron cores 11 with magnetic properties, and a plurality of wires 12 wound around the iron cores 11, respectively. Each wire 12 has two wire ends 121. In this embodiment, Each coil module 1 has four wires 12, and the wires 12 are wound on one of the iron cores 121 in pairs, and the ends 121 of the two wires 12 are tied together. Since the wires 12 wound around the different iron cores 11 are tied together as a conventional structure, which is not the focus of the improvement of the present invention, they will not be described in detail.

Each base module 2 has a base 21 made of a non-conductive material, and a plurality of pin units 22 mounted on the base 21 at intervals along the assembly direction 20. The base 21 has two side walls 211 spaced apart and extending along the assembling direction 20, and a receiving space 212 interposed between the side walls 211. Each pin unit 22 has two rows of left and right contacts. Each of the pins 221 has a clamping slot 222 with an opening facing upward, and the clamping slot 222 of each of the pins 221 is used for clamping and fixing one of the wire ends 121 of one of the coil modules 1.

In this embodiment, the assembly method includes steps (A), (B), (C), and (D). In step (A), the base modules 2 are placed on a first carrier 3. The first carrier 3 is an elongated base, and has a top surface 31 and a sliding groove 32 recessed downward from the top surface 31. The sliding groove 32 extends along the assembly direction 20. The bottoms of the base modules 2 extend into the sliding groove 32 and are linearly displaced by the sliding groove 32.

In this step (B), a plurality of the coil modules 1 are equiangularly mounted in a second carrier 4. The second carrier 4 is a disc-shaped structure and can be rotated around a rotation center 40. The second carrier 4 has a plurality of assembling portions 41 arranged at equal angles around the rotation center 40. Each assembling portion 41 has two left and right spaced groove walls 411, and one is interposed between the groove walls 411. And a groove 413 on the opposite side of the protrusion 412 and adjacent to one of the groove walls 411 respectively.

Each slot wall 411 has an outer peripheral surface 414 and a plurality of thread fixing grooves 415 recessed from the outer surface 414. The thread fixing grooves 415 are respectively used to clamp one of the coil modules 1. The wire head 121, and the projection 412 has a placement surface 416 for placing the core 11 of one of the coil modules 1, the placement surface 416 does not protrude from the outer peripheral surface 414 of the groove wall 411, and The grooves 413 correspond to the pins 221 of the base modules 2, respectively, and can be extended by the aforementioned pins 221. In this embodiment, the assembling portions 41 of the second carrier 4 are closely connected, that is, the groove walls 411 on the same side of the assembling portions 41 are integrally connected, and the protrusions of each assembling portion 41 are integrally connected. The stage 412 is also integrally connected, and the grooves 413 on the same side are also connected and surround the rotation center 40. It is further explained that the coil modules 1 of this embodiment are wound by using a mechanized operation. After the winding is completed, they are hung one by one on each assembly portion 41 of the second carrier 4, and then, The second carrier 4 is installed above the first carrier 3, and after the coil module 1 hung on the second carrier 4 is used, the coil module 1 filled with the coil module 1 can be replaced. Another the second carrier 4. Of course, in practice, the coil modules 1 after the winding can also be directly hung on the empty assembly portion 41. In addition, there is no sequence between this step (A) and this step (B) in this embodiment. limits.

In step (C), the second carrier 4 is driven to rotate along a feeding direction 42 by a power mechanism. The purpose is to make each assembly portion 41 correspond to one of the base modules 2 due to rotation. At the same time, the first The carrier 3 can also drive the base module 2 to advance along the assembly direction 20, and there are many ways to drive the base module 2 to move linearly along the assembly direction 20, for example, it can be pushed by a pressure cylinder The base module 2 moves, or the aforementioned base module 2 is moved by a conveyor belt. The inclined conveying surface can also be used to make the base module 2 slide down by its own gravity, etc. The intermittent advancement of the base module 2 is a conventional technique and will not be described further. When one of the assembly parts 41 of the second carrier 4 corresponds to one of the base modules 2, the preparation operation is completed. At this time, the coil module 1 installed in one of the assembly parts 41 will be located in one of them. Directly above the receiving space 212 of the base module 2.

When the preparation operation is completed, the coil module 1 installed in the assembly portion 41 is located directly above the corresponding base module 2, and because the coil module 1 is due to the second carrier 4 , And gradually lowered and approached the corresponding base module 2. Therefore, during the gradual decrease of the height of the coil module 1, a pair of left and right corresponding to the base module 2 corresponded. The pins 221 are respectively extended into the grooves 413 of one of the assembling portions 41 of the second carrier 4, and the original pins 221 are supported on the iron cores 11 and the second carrier 4. The thread heads 121 between the thread head fixing grooves 415 are transferred and locked one by one into the clamping grooves 222 of the corresponding pins 221. In order to increase the smoothness of the aforementioned transfer process of the wire head 121, in this embodiment, after the second carrier 4 is rotated and positioned, the second carrier 4 is moved down to allow the coil module 1 The thread head 121 is snapped into the clamping groove 222 of the corresponding pins 221 from top to bottom. Of course, the first carrier 3 can also be relatively moved up, so that the thread head 121 can be smoothly moved. Move into the clamping grooves 222 of the corresponding pins 221.

In step (D), the coil module 1 located above is sucked down into the containing space 212 of the base module 2 by a suction element 5 installed in the first carrier 3, That is, this embodiment uses the magnetic characteristics of the core 11 of the coil modules 1 to suck the coil modules 1 into the accommodation space 212 of the base 21, and thus completes the assembly operation of the electronic device .

When the second carrier 4 rotates to drive the next assembly portion 41 corresponding to the base module 2 located below, the base module 2 will also move linearly for a distance to prepare to accommodate the next coil module 1, When the preparation operation is completed again in this embodiment, the suction element 5 is magnetically sucked again, and the next coil module 1 is sucked into the receiving space 212 of the base 21. By analogy, each coil module 1 can be intermittently transferred to each base module 2 and electrically connected to the corresponding pin unit 22 on the base module 2. Since in this embodiment, as long as the first carrier 3 is moved relative to the second carrier 4 and the second carrier 4 is rotated, the coil modules 1 can be electrically connected and installed on the base. In the module 2, the aforementioned assembling method of the present invention is not only innovative, but also improves the assembling speed and assembling quality of the electronic device.

When the first carrier 3 and the second carrier 4 in this embodiment of the present invention are in operation, the second carrier 4 is rotated in place, and the first carrier 3 will drive the base modules 2 along In the assembly direction 20, the first carrier 3 can also be simply placed by the base modules 2 on the component transfer, and the second carrier 4 can rotate around the rotation center 40. In addition, it can also move linearly along the assembly direction 20 so that the coil modules 1 loaded in the assembly sections 41 can move and should wait for the base module 2 through rotation and linear movement.

Incidentally, in the coil module 1 disclosed in the embodiment of the present invention, the arrangement of the iron cores 11 is lying flat and leaning against each other, that is, the axes of the iron cores 11 are parallel. The cores 11 can also be coaxial and lean against each other, or one level and one vertical, that is, no matter how the iron cores 11 are placed, it will not affect the assembly operation of the present invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited in this way, any simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the patent specification of the present invention are still Within the scope of the invention patent.

1‧‧‧coil module

11‧‧‧ iron core

12‧‧‧ Lead

121‧‧‧ thread

2‧‧‧ base module

20‧‧‧ Assembly direction

21‧‧‧ base

211‧‧‧ sidewall

212‧‧‧Capacity space

22‧‧‧pin unit

221‧‧‧pin

222‧‧‧Groove

3‧‧‧ the first vehicle

31‧‧‧Top

32‧‧‧chute

4‧‧‧ second vehicle

40‧‧‧ rotation center

41‧‧‧Assembly Department

411‧‧‧Slot wall

412‧‧‧burst

413‧‧‧groove

414‧‧‧outer surface

415‧‧‧Thread fixing slot

416‧‧‧Placement surface

42‧‧‧feeding direction

5‧‧‧ Suction element

Other features and effects of the present invention will be clearly presented in the embodiment with reference to the drawings, in which: FIG. 1 is an assembly schematic diagram of an embodiment of the assembly method of the present invention; FIG. 2 is an incomplete perspective exploded view, Describes the process of assembling an electronic device in this embodiment; and FIG. 3 is a schematic cross-sectional view taken along line 3-3 in FIG. 1.

Claims (8)

An electronic device assembling method, wherein a plurality of coil modules are electrically connected and mounted on a plurality of base modules, the steps of the method include: (A) placing the base module on a first carrier (B) the coil module is mounted on a second carrier; (C) the second carrier is driven to rotate around a rotation center, and the first carrier and the second carrier are relatively moved , Each coil module corresponds to one of the base modules; and (D) the coil module is transferred to the corresponding base module by a suction element; wherein, in step (C) , The first carrier will drive the base modules to advance along an assembly direction, and corresponds to one of the coil modules loaded on the second carrier; wherein the second carrier includes a plurality of surrounding The assembly part of the rotation center, each assembly part has two spaced groove walls, and a protrusion located between the groove walls, each groove wall has a plurality of thread-fixing grooves, and each The coil module has two iron cores, and a plurality of wires wound around the iron core, each wire has two Wire ends, and in this step (B), the cores of each coil module are respectively placed on the projections of the assembly portion corresponding to the second carrier, and The thread ends are respectively installed in the thread end fixing grooves of the corresponding assembly portion. The method for assembling an electronic device according to claim 1, wherein each base module has a base, and at least one connector installed on the base and electrically connected to the wires of the coil module. The foot unit has a plurality of pins each having a clamping slot, and the base has two spaced apart side walls parallel to the assembly direction, and a receiving space interposed between the side walls. In this step (C), the wire head of one of the coil modules is moved from the wire head fixing groove of the second carrier to the corresponding clamping grooves of the base module, and in the In step (D), the iron core of the coil module is sucked into the containing space of the corresponding base module. The method for assembling an electronic device according to claim 2, wherein each assembling part of the second carrier further has two grooves located on opposite sides of the protrusion, and in step (C), the first The two carriers are relatively moved closer to the first carrier, so that a pair of pins of the base module respectively protrude into corresponding grooves. The method for assembling an electronic device according to claim 3, wherein the first carrier has a chute facing the second carrier, and in this step (A), the base module is limited to the chute. Inside the slot. An electronic device assembling method, wherein a plurality of coil modules are electrically connected and mounted on a plurality of base modules, the steps of the method include: (A) placing the base module on a first carrier (B) the coil module is mounted on a second carrier; (C) the second carrier is driven to rotate around a rotation center, and the first carrier and the second carrier are relatively moved , Each coil module corresponds to one of the base modules; and (D) the coil module is transferred to the corresponding base module by a suction element; wherein, in step (C) The base modules are arranged along an assembly direction, and the second carrier will move along an assembly direction, so that each coil module corresponds to one of the base modules; wherein the second carrier includes Several assembling parts surrounding the rotation center, each assembling part has two spaced groove walls, and a protrusion located between the groove walls, each groove wall has several thread-fixing grooves, Each coil module has two iron cores, and several wires wound around the iron core. Both have two wire ends, and in this step (B), the core of each coil module is respectively placed on the protrusion of the assembly part corresponding to the second carrier, and each The wire heads of the coil module are respectively installed in the wire head fixing grooves of the corresponding assembly portion. The method for assembling an electronic device according to claim 5, wherein each base module has a base, and at least one connector installed on the base and capable of being electrically connected to the wires of the coil module. The foot unit has a plurality of pins each having a clamping slot, and the base has two spaced apart side walls parallel to the assembly direction, and a receiving space interposed between the side walls. In this step (C), the wire head of one of the coil modules is moved from the wire head fixing groove of the second carrier to the corresponding clamping grooves of the base module, and in the In step (D), the iron core of the coil module is sucked into the containing space of the corresponding base module. The method for assembling an electronic device according to claim 6, wherein each assembling part of the second carrier further has two grooves located on opposite sides of the protrusion, and in step (C), the first The two carriers are relatively moved closer to the first carrier, so that a pair of pins of the base module respectively protrude into corresponding grooves. The method for assembling an electronic device according to claim 7, wherein the first carrier has a chute facing the second carrier, and in the step (A), the base module is limited to the chute. Inside the slot.