TWI584389B - Semiconductor device manufacturing method and manufacturing device - Google Patents

Description

Semiconductor device manufacturing method and manufacturing device

The present invention relates to a method and a device for manufacturing a semiconductor device in which a semiconductor device such as an optical glass or a lens is mounted on a semiconductor device such as a solid-state image sensor.

In recent years, with the advancement of miniaturization and high performance of electronic devices represented by smart phones or tablet terminals, the use of devices at these terminals has been reduced in size and the trend of high density has been accelerated. Among such devices, the distance between the optical component and the semiconductor component, that is, the gap, greatly affects the characteristics of the device.

As an example of such a device, there is an imaging device. The packaging method of the image pickup device is shifting from a conventional packaging method to a wafer size package that can be miniaturized. Here, the conventional packaging method is a method of hermetically sealing an optical glass and a solid-state image sensor by a package such as ceramic. In the image-capturing device of the chip-size package type, a bonding member, that is, a resin, is applied directly to the outer peripheral portion of the light-receiving portion or the outer peripheral portion of the light-receiving portion, and the optical glass is bonded to the adhesive resin. It becomes a structure which seals a light-receiving part.

In terms of an imaging device, in order to match the focal length, the distance between the optical glass and the solid-state imaging element must be constant. In the conventional imaging device, the distance between the optical glass and the solid-state imaging element is corrected by using a ceramic multilayer substrate, a relay substrate having a hollow structure made of glass or resin, or the like. However, in the wafer size package, since bonding is performed by an adhesive, there is no member for correcting the distance between the optical glass and the solid-state image sensor. Therefore, it is necessary to mount a gap between an optical component such as an optical glass and a semiconductor element such as a solid-state image sensor with high precision.

As a method for solving the problem of high-precision mounting, it is proposed to provide a displacement sensor for measuring the length of the interval between the optical component and the semiconductor element, and to bond the optical component and the semiconductor component so that the interval between the optical component and the semiconductor component becomes a correct expectation. A semiconductor bonding method of values (for example, refer to Patent Document 1).

FIG. 6 is a configuration diagram of a semiconductor bonding apparatus proposed in Patent Document 1. A method of manufacturing a semiconductor device using the semiconductor bonding apparatus of FIG. 6 will be described. The optical component 101 is held on the platform 104 to hold the semiconductor component 102 in the tool 105. Thereafter, the platform 104 is moved in a horizontal orientation such that the optical component 101 and the semiconductor component 102 are positioned at a specified relative position. Next, when the tool 105 for fixing the semiconductor element 102 is lowered, the semiconductor element 102 comes into contact with the adhesive 103 provided on the optical component 101. Further, after the tool 105 is lowered to the designated position, the adhesive 103 is hardened by irradiation with ultraviolet light. Here, a displacement sensor 106 is provided on the platform 104, and the gap between the measuring tool 105 and the platform 104 is controlled to control the pressing force so that it becomes a designated gap. For this reason, it is possible to accurately Install the gap between the components.

FIG. 7 is a cross-sectional view conceptually illustrating a structure of a semiconductor device manufactured by the semiconductor bonding method proposed in Patent Document 1. The optical component 101 mounted on the stage 104 and the semiconductor component 102 held by the tool 105 are connected by the adhesive 103. This structure is produced by crushing and spreading the adhesive 103 applied to the central portion of the optical component 101 at one point by the semiconductor element 102. Since the gap between the semiconductor element 102 and the optical component 101 is constant while the gap between the control tool 105 and the stage 104 is attached, a semiconductor device having a constant gap is obtained.

Here, in the process of crushing the adhesive 103 by the semiconductor element 102, the adhesive 103 is wetted and spread from the center of the semiconductor element 102 toward the outer peripheral portion. When the coating amount of the adhesive 103 is small and the gap between the semiconductor element 102 and the optical component 101 is large, the adhesive 103 does not wet and spread to the vicinity of the corner portion of the semiconductor element 102 in the planar direction.

The imaging device mounted on a mobile phone such as a smart phone or a tablet is required to have high reliability such as drop impact resistance and moisture resistance in a use environment. If the adhesive 103 is not wetted and spread over the entire surface of the semiconductor element 102, the bonding strength cannot be ensured, and peeling occurs at the interface between the semiconductor element 102 and the adhesive 103 due to a drop impact or a temperature change during use of the mobile device. Or it may become bad after being immersed in the surrounding environment. For this reason, it is necessary for the adhesive 103 to be wet-covered to cover the entire surface of the semiconductor element 102, and from the viewpoint of the manufacturing process at the mass production site, it is required to have a bad inspection.

As a method of detecting a defective defect, it is proposed to move the laser light while obliquely illuminating the adhesive product using an adhesive, and to determine whether or not to follow the defective portion detection method based on the amount of reflected light (for example, See Patent Document 2). FIG. 8 is an explanatory diagram showing an embodiment of the defect detection method proposed in Patent Document 2. As shown in FIG. 8, in the article 114, the optical component 113 such as glass is followed by the substrate 111 by the adhesive 112. The adhesive defect detecting device 115 of the adhesive article 114 is provided with a laser oscillator 118 at one of the upper portions of the article 114, and a power meter 120 for receiving reflected light at the other end. Further, the laser oscillator 118 and the power meter 120 are respectively fixed to the frame 116, and the angle θ formed by the interface 124 between the optical component 113 and the adhesive 112 is always a predetermined value.

A method of detecting the failure of the detection device 115 will be described. First, the product 114 is moved in a certain moving direction, and the inspection device 115 is reciprocated in the direction orthogonal to the moving direction to inspect the adhesive 112. The laser light 117 from the laser oscillator 118 is irradiated at a predetermined angle θ with respect to the adhesive 112, and is transmitted while being refracted by the refractive index of the adhesive 112, and is reflected at the interface 124 between the optical component 113 and the adhesive 112. The reflected light is emitted from the subsequent product 114 at a predetermined angle θ. The reflected light that is emitted is received by the power meter 120. If it is good next, the output value of the amount of reflected light received by the power meter 120 is output as a threshold value or more. If the value is not good, the reflection angle becomes irregular, and the amount of reflected light received by the power meter 120 is lower than the threshold. . Through this, it is possible to detect the subsequent failure.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-252008

[Patent Document 2] Japanese Patent Publication No. 7-113609

The miniaturization and high functionality of the device have evolved significantly, and the trend toward miniaturization of optical components and semiconductor components has been accelerated. In order to secure the adhesion strength and ensure high reliability, it is required to extend the thickness of the adhesive agent to the small optical component without excessively or excessively expanding the adhesive, and to control the adhesive more accurately than ever.

However, in the semiconductor bonding method proposed in Patent Document 1, even if the gap between the control tool 105 and the stage 104 is small, the thickness of the optical component or the semiconductor element is scattered, which is a problem in that the thickness of the adhesive is scattered.

In addition, the semiconductor device produced by the semiconductor bonding method proposed in Patent Document 1 has a problem that it is cured by ultraviolet rays regardless of the state of wet deposition of the adhesive 103, and the defective product flows out in the subsequent process.

However, when the inspection is performed by the defect detection method proposed in Patent Document 2, the amount of light transmitted by the light is reduced in the outer peripheral portion or the corner portion of the optical component, and even if it is Then the quality product is also judged to be a problem that is bad. In addition, in the case of the defect detection device proposed in the patent document 2, the manufacturing device of the semiconductor device proposed in Patent Document 1 is an independent mechanism, and it is necessary to separately prepare the semiconductor manufacturing device and the subsequent defect detecting device. The cost of introducing the equipment on the site becomes high, and it takes time from the detection of the defective defect to the reflection of the semiconductor manufacturing conditions, and there is a problem that the defective product continues to flow out during the period.

In view of the above, an object of the present invention is to provide a method and a device for manufacturing a semiconductor device, which are capable of accurately detecting a gap between an optical component and a substrate such as a semiconductor element in a semiconductor device mounting process, and further detecting After the expansion of the component is poor, the defective product is prevented from flowing out to the subsequent process.

In order to achieve the above object, the present invention is constituted as follows.

According to one aspect of the present invention, there is provided a method of manufacturing a semiconductor device, which is a method of manufacturing a semiconductor device in which a rectangular mounting member is mounted to a substrate via a bonding member, and is characterized in that: an adsorption fixing process is provided After the bonding member is supplied to any one of the mounting member or the substrate, the adsorption tool is moved in the vertical direction and the mounting member is adsorbed and fixed to the adsorption tool; and the position information acquisition process is performed after the adsorption fixing process The position information acquisition device measures the position in the lateral direction of the mounting member that is sucked by the suction tool and intersects the vertical direction, and acquires the position. The information processing process is configured to control the lateral movement of the adsorption tool by the control device according to the position information obtained by the position information acquisition process after the position information acquisition process, so that the mounting member faces the substrate The position in the horizontal direction is the same as the position in the lateral direction, and the distance between the mounting member and the substrate is measured by the distance measuring device after the alignment detecting process passes through the mounting member and the bonding member. The distance in the vertical direction is controlled by the control device to control the driving of the adsorption tool, and the adsorption tool is moved until the measurement value measured by the distance measuring device reaches a predetermined distance, and the mounting member is close to the substrate. And the state inspection process, after the proximity process, irradiating the detection light transmitted through the mounting member, and then inspecting the bonding state of the bonding member by the state inspection device; and the curing process is performed after the proximity process Hardening device before hardening In the bonding state inspection process of the bonding member, the detection light is irradiated to the vicinity of at least one corner portion of the mounting member in the vertical direction, and the amount of the reflected light is checked by the subsequent state inspection device. The status is good.

According to another aspect of the present invention, a semiconductor device manufacturing apparatus includes: an adsorption tool that feeds a bonding member to a rectangular mounting member or a substrate, and moves up and down Positioning and fixing the mounting member; the position information acquiring device measures the position in the lateral direction of the mounting member that is attracted by the suction tool and intersects with the vertical direction, and acquires position information; and the control device is based on the position information Acquiring the position information acquired by the device, controlling the movement of the suction tool in the lateral direction such that the mounting member faces the substrate, and aligning the position in the lateral direction; and the distance measuring device is in the position of the horizontal direction In a state where the irradiation detecting light passes through the mounting member and the bonding member, the distance between the mounting member and the substrate in the vertical direction is measured. Next, the state inspection device controls the adsorption by the control device. The driving of the tool moves the adsorption tool to a position where the measured value measured by the distance measuring device is a predetermined distance, and the mounting member is brought close to the substrate, and then the detection light is transmitted through the mounting member to inspect the bonding. Follow-up of the member And a curing device that cures the bonding member, and the bonding state inspection device irradiates the detection light to the vicinity of at least one corner portion of the mounting member in the vertical direction, and checks the state of the state by the waveform of the reflected light. Is it good?

According to the foregoing aspect of the invention, it is possible to ensure high precision between the mounting member and the substrate in the mounting process of the substrate of the mounting member. The gap, while discriminating the subsequent failure, can prevent the outflow of the subsequent process of the defective product.

1, 21‧‧‧ mounting head

1A, 21a‧‧‧ side wall

1b‧‧‧ Ontology

2, 22‧‧‧ transparent adsorption board

2a, 22a‧‧‧Adsorption holes

3, 23‧‧‧ vacuum chamber

4, 24‧‧‧ Non-contact distance measuring mechanism

5‧‧‧Vacuum pump

6, 26‧‧‧Laser light

7, 27‧‧‧ platform

8, 28‧‧ ‧ transparent board

11, 31, 41‧‧‧ Installation components

11a, 11c‧‧‧ corner

11b‧‧‧ diagonal

12, 32, 42‧‧‧ substrates

13, 33, 43‧‧‧ joint components

14‧‧‧ID camera

24a‧‧‧Non-contact distance measurement department

31a, 31c‧‧‧ 隅 隅

31b‧‧‧ diagonal

41a‧‧‧central location

41b, 41c, 41d, 41e‧‧‧ corner

44‧‧‧ Calculation Department

90‧‧‧Installing the head drive mechanism

91‧‧‧Measurement mechanism drive mechanism

92‧‧‧Location information acquisition device

95‧‧‧Drive lens drive mechanism

97‧‧‧Semiconductor device

98‧‧‧ Hardening device

100‧‧‧Control device

FIG. 1A is a schematic cross-sectional view showing a configuration of a manufacturing apparatus of a semiconductor device according to a first embodiment of the present invention.

FIG. 1B is a plan view showing a semiconductor device having a configuration of a manufacturing apparatus of a semiconductor device according to the first embodiment of the present invention.

FIG. 2A is a schematic cross-sectional view showing a method of manufacturing the semiconductor device according to the first embodiment of the present invention.

FIG. 2B is a schematic cross-sectional view showing a method of manufacturing the semiconductor device according to the first embodiment of the present invention.

FIG. 2C is a schematic cross-sectional view showing a method of manufacturing the semiconductor device according to the first embodiment of the present invention.

FIG. 2D is a schematic cross-sectional view showing a method of manufacturing the semiconductor device according to the first embodiment of the present invention.

FIG. 2E is a schematic cross-sectional view showing a method of manufacturing the semiconductor device according to the first embodiment of the present invention.

FIG. 2F is a schematic cross-sectional view showing a method of manufacturing the semiconductor device according to the first embodiment of the present invention.

(Fig. 3A) is a correlation diagram for explaining the transition of the gap between the optical component and the semiconductor element in the first embodiment of the present invention.

FIG. 3B is an illustration of optical zero in the first embodiment of the present invention. Correlation of the transition of the gap between the component and the semiconductor component.

FIG. 4A is a schematic cross-sectional view showing a method of manufacturing the semiconductor device according to the second embodiment of the present invention.

FIG. 4B is a plan view of the semiconductor device in the state of FIG. 4A.

FIG. 4C is a schematic cross-sectional view showing a method of manufacturing the semiconductor device according to the second embodiment of the present invention.

FIG. 4D is a plan view of the semiconductor device in the state of FIG. 4C.

FIG. 4E is a schematic cross-sectional view showing a method of manufacturing the semiconductor device according to the second embodiment of the present invention.

FIG. 4F is a plan view of the semiconductor device in the state of FIG. 4E.

FIG. 5A is a schematic cross-sectional view showing a configuration of a manufacturing apparatus of a semiconductor device according to a third embodiment of the present invention.

FIG. 5B is a schematic cross-sectional view showing a configuration of a manufacturing apparatus of a semiconductor device according to a third embodiment of the present invention.

FIG. 5C is a plan view of the semiconductor device according to the third embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view showing a method of mounting a conventional semiconductor device.

FIG. 7 is a schematic cross-sectional view showing a structure of a semiconductor device obtained by a mounting method of a conventional semiconductor device.

FIG. 8 is a schematic cross-sectional view showing a conventional method for detecting defective defects. Figure.

Hereinafter, the form of the embodiment of the present invention will be described with reference to the drawings.

[First embodiment]

1A and 1B are a schematic cross-sectional view showing a configuration of a manufacturing apparatus of a semiconductor device 97 according to a first embodiment of the present invention, and a plan view of the semiconductor device 97.

The manufacturing apparatus of the semiconductor device of the first embodiment shown in FIG. 1A includes a stage 7, a mounting head 1 that functions as an example of an adsorption tool, a mounting head driving mechanism 90, and an example of the distance measuring device. Next, the non-contact distance measuring mechanism 4, the measuring mechanism drive mechanism 91, the position information acquisition device 92, and the control device 100 function as one of the state inspection devices.

The platform 7 is fixed to form the substrate 12 of the joint member 13.

The mounting head 1 includes a box-shaped body 1b having a rectangular parallelepiped shape, a transparent adsorption plate 2, a transparent plate 8, and a vacuum chamber 3. The body 1b forms an internal space inside. The transparent adsorption plate 2 constitutes a lower end surface (bottom portion) of the main body 1b, and an adsorption hole 2a through which the attachment member 11 can be adsorbed is formed in the center portion. The transparent plate 8 is fixed in parallel with the transparent adsorption plate 2 at the intermediate portion of the inner space of the body 1b. The vacuum chamber 3 is attached to the lower portion of the inner space of the body 1b by the transparent adsorption plate 2 and the transparent plate 8 and the side wall 1a. And formed. The vacuum chamber 3 is connected to the vacuum pump 5, and when the vacuum chamber 3 is vacuumed, the mounting member 11 can be adsorbed to the lower surface of the transparent suction plate 2 through the adsorption holes 2a.

The head driving mechanism 90 is mounted such that the mounting head 1 can be moved in a vertical direction (upward and downward direction in FIG. 1A) opposite to the surface (upper surface) of the tray 9 and the stage 7, and in a lateral direction orthogonal to the vertical direction (in Fig. 1A is the left and right direction).

The mounting member 11 is made of, for example, optical glass, and has, for example, a refractive index of 1.63, a light transmittance of 96%, a square of 0.95 to 1.05 mm on one side, and a thickness of 380 to 420 μm. Further, the substrate 12 is a semiconductor element such as a solid-state image sensor, and has a square shape of 1.2 to 1.6 mm on one side and a thickness of 230 to 270 μm. Further, the joining member 13 is, for example, an ultraviolet curing adhesive, for example, having a refractive index of 1.49 and a light transmittance of 90%. As an example, as shown in a plan view of FIG. 1B, a rectangular or square joint member 13 smaller than the substrate 12 is disposed on the rectangular or square substrate 12. A rectangular or square mounting member 11 that is smaller than the joining member 13 is disposed on the joining member 13.

Further, the non-contact distance measuring mechanism 4 is an upper portion of the mounting head 1 and is disposed outside the vacuum chamber 3 and at a position separated from the transparent plate 8 by a predetermined distance in the vertical direction, and is disposed in the horizontal direction. It can be moved in the direction. The measurement mechanism drive mechanism 91 is disposed in the mounting head 1 and moves the non-contact distance measuring mechanism 4 on the mounting head 1 in a lateral direction orthogonal to the vertical direction with respect to the tray 9 and the stage 7. Non-contact distance The measuring mechanism 4 is movable between at least a central portion of the mounting member 11 and a position near one corner portion 11a by the measuring mechanism driving mechanism 91. The non-contact distance measuring mechanism 4 is, for example, a spectral interference type laser displacement meter that emits laser light 6 and transmits the transparent mounting member 11 and the bonding member 13 to detect the surface of the substrate 12. The distance G between the mounting member 11 and the substrate 12 can be measured by the reflected light. The spectral interference type laser displacement meter can be converted into a distance by performing spectral analysis on the interference light of the reflected light at each interface of the substance traveling by the laser light 6, and can be measured by at least one spectral interference type laser displacement meter. Distance G. The measurement result of the non-contact distance measuring means 4 is output to the control device 100, and the control device 100 determines whether or not the engaged state is good.

The position information acquisition device 92 is composed of a measurement device and an arithmetic unit 44 that calculates data measured by the measurement device. The identification camera 14 as an example of the measuring device is disposed opposite to the mounting member 11 in the opposite direction. The arrangement is relatively disposed below the mounting member 11, for example, it means that the mounting head 1 can be moved in the lateral direction by the mounting head driving mechanism 90, and moved to the position above the identification camera 14, or First, the mounting head 1 is stopped, and the identification camera 14 is moved in the lateral direction up to the position below the mounting head 1. The identification member 14 that has been attached to the mounting head 1 is recognized by the identification camera 14, and based on the identification result, the calculation unit 44 calculates the positional deviation of the mounting member 11 facing the mounting head 1. Offset the calculated position The message is output to the control device 100 as location information. The control device 100 drives and controls the mounting head driving mechanism 90 based on the position information, and can position the mounting member 11 adsorbed on the mounting head 1 and the substrate 12.

The control device 100 inputs the position information acquired by the position information acquisition device 92 and the measurement value measured by the non-contact distance measuring unit 4. Then, based on the input information and the information of the manufacturing engineering stored in advance, the driving of the mounting head driving mechanism 90, the driving of the measuring mechanism driving mechanism 91, the driving of the position information acquiring device 92, and the non-contact distance measuring mechanism 4 are independently controlled. The drive and the operation of the vacuum pump 5 (or the opening and closing operation of the control valve provided between the vacuum pump 5 and the vacuum chamber 3). In addition, the connection relationship between the control device 100 and each device is a part of the drawing, and the illustration is omitted because of the simplicity of the drawing.

2A to 2F are schematic cross-sectional views showing a method of manufacturing the semiconductor device according to the first embodiment of the present invention. The processes of the following manufacturing methods are all performed under the control of the control device 100.

First, under the control of the control device 100, as shown in FIG. 2A, after the mounting head 1 is moved by the mounting head driving mechanism 90 to a position opposed to the mounting member 11 mounted on the tray 9, the mounting head is used. The portion drive mechanism 90 lowers the mounting head 1 to the mounting member 11.

Next, under the control of the control device 100, as shown in FIG. 2B, the mounting member 11 is suction-fixed to the transparent suction plate 2 of the mounting head 1 via a vacuum suction operation by the driving of the vacuum pump 5. Still, When a vacuum suction operation is performed, when there is a gap between the mounting member 11 and the transparent suction plate 2, the mounting member 11 that is floated in the air is sucked by the negative pressure, or the surrounding air flow or the mounting member 11 The inclination angle in the air causes shaking, and a positional deviation occurs between the center coordinates of the adsorption hole 2a and the center coordinates of the mounting member 11.

Next, under the control of the control device 100, after the mounting member 11 is vacuum-adsorbed by the mounting head 1, the mounting head 1 is moved upward by the mounting head driving mechanism 90, and the identification camera 14 is disposed opposite to the mounting member 11 Below. For example, the mounting head 1 is moved in the lateral direction by the mounting head driving mechanism 90 so as to move until the position above the recognition camera 14 is moved. Alternatively, the mounting head 1 is first brought to a standstill so that the identification camera 14 is moved in the lateral direction up to the position below the mounting head 1.

Next, under the control of the control device 100, the position of the mounting member 11 in the planar direction (the position in the plane perpendicular to the vertical direction of the mounting member 11) is measured by the identification camera 14, and is calculated by the calculation unit 44 and transparently adsorbed. The relative coordinates of the center of the adsorption hole 2a of the plate 2 with respect to the center coordinate of the mounting member 11, that is, the positional deviation amount. For example, the center coordinates are obtained from the coordinates of three points on the outer peripheral portion of the adsorption hole 2a by the calculation of the calculation unit 44 based on the identification and identification result of the identification camera 14, and then the identification camera 14 measures the center of the mounting member 11. The position of the two vertices having the point symmetry is obtained by the calculation unit 44, and the coordinate unit 44 subtracts the coordinates of the center coordinates of the adsorption hole 2a from the center coordinates of the attachment member 11 as the relative coordinates. good. The relative coordinates calculated by the calculation unit 44 are output from the calculation unit 44 to the control device 100 as position information.

Further, under the control of the control device 100, as shown in FIG. 2C, after the substrate 12 is mounted on the stage 7, the coordinates in the plane direction of the identification mark (not shown) provided on the substrate 12 are measured by an identification camera (not shown). The bonding member supply device (not shown) supplies the bonding member 13 to a predetermined position on the substrate 12 with reference to the coordinates. The supply method of the joint member 13 by the joint member supply means is supplied, for example, by a dispenser, a screen mark, or a transfer. Thereafter, under the control of the control device 100, the mounting head 1 is moved in the planar direction by the mounting head driving mechanism 90 based on the position information input to the control device 100, so that the designated position of the substrate 12 is set. The center coordinates of the identification marks (not shown) at the two points of the substrate 12 coincide with the center coordinates of the mounting member 11. Thereafter, under the control of the control device 100, the mounting head 1 to which the mounting member 11 is attracted is brought close to the substrate 12 by the mounting head driving mechanism 90 based on the relative coordinates input from the calculating unit 44 as position information to the control device 100. . That is, as shown in FIG. 2D, under the control of the control device 100, the mounting member 11 is brought close to the substrate 12 by the mounting head driving mechanism 90 so that the engaging member 13 is in close contact with the mounting member 11. In this approach state, the distance G between the mounting member 11 and the substrate 12 is measured by the non-contact distance measuring mechanism 4 under the control of the control device 100. The measured value measured by the non-contact distance measuring means 4 is output to the control device 100, and is used to determine whether the distance G is controlled or not. That is, for example, The center portion of the mounting member 11 measures the distance G between the mounting member 11 and the substrate 12, and the control device 100 controls the amount of lowering of the mounting head 1 through the mounting head driving mechanism 90 based on the measured value. That is, under the control of the control device 100, the mounting head 1 is brought close to the substrate 12 by the mounting head driving mechanism 90, so that the measured value measured by the non-contact distance measuring means 4 becomes a desired value. While the mounting head 1 is approaching the substrate 12, the joint member 13 is crushed between the mounting member 11 and the substrate 12, and is wetted and spread toward the periphery of the mounting member 11 along the surface of the mounting member 11. Here, the non-contact distance measuring mechanism 4 is less likely to be affected by the slope of the substrate 12 of the mounting member 11, and the non-contact distance measuring mechanism 4 is moved by the measuring mechanism drive mechanism 91 so as to be placed in the adsorption hole 2a or mounted. The center position of the member 11 is optimal. The laser light 6 emitted from the non-contact distance measuring means 4 passes through the transparent mounting member 11 and the bonding member 13, detects the light reflected on the surface of the substrate 12, and analyzes the mounting member 11 and directly. The distance between the substrates 12. Further, in order to prevent the occurrence of peeling and breakage between the mounting member 11 and the joining member 13 in the use environment, it is necessary to secure a sufficient bonding strength at the interface between the mounting member 11 and the joining member 13. For this reason, the joint member 13 is desirably wetted so as to be in close contact with the entire lower surface of the mounting member 11, as shown in Fig. 1B, and the joint member 13 may overflow beyond the edge of the mounting member 11, and may be.

Next, under the control of the control device 100, as shown in FIG. 2E, the designated gap is maintained, and the non-contact distance measuring mechanism 4 is moved from the center position of the mounting member 11 to the corner by the mounting head driving mechanism 90. The position near the crotch 11a. Then, the laser light 6 is emitted at a position near the corner portion 11a, and the state in the vicinity of the corner portion 11a is inspected, and the inspection result is output from the non-contact distance measuring unit 4 to the control device 100, and the control device 100 determines whether or not the state is next. good. The engaging member 13 is attached to the concentric circle from the central portion after the mounting member 11 contacts the center portion, as shown in Fig. 1B, at least aligned on the two intersecting diagonals 11b of the rectangular mounting member 11. It is preferable that the position near the corner portion 11a is one point measurement.

Further, when the subsequent state is a good product, the predetermined gap is maintained, and ultraviolet rays are irradiated from the curing device 98 such as an ultraviolet irradiation device to cure the bonding member 13. Also, the hardening process can be performed before and after the inspection process.

Finally, under the control of the control device 100, as shown in FIG. 2F, the vacuum suction operation is stopped, and the mounting head 1 is separated from the mounting member 11 to complete the semiconductor device 97.

Next, an inspection method using the following state of the non-contact distance measuring mechanism 4 will be described. 3A and 3B are diagrams for explaining the transition of the gap (distance) G between the optical component and the semiconductor element in the first embodiment of the present invention. As shown in FIG. 3A, in the case of using the spectral interference type laser displacement meter in the non-contact distance measuring mechanism 4, the detection waveform can be output to the control device 100 in accordance with the relationship between the gap G and the amount of light. When the bonding member 13 is filled to the position where the laser light 6 is irradiated without any gap, the length of the light path that the light penetrates through the material is caused by multiplying the refractive index by the length of the optical path length in the air, respectively. Installation structure The thickness of the member 11 and the value of the refractive index of the bonding member 13 multiplied by each are output to the control device 100 as the gap G.

As shown in FIG. 3A, the thickness g1 of the mounting member 11 is output as a waveform having a light amount peak p1. On the other hand, the mounting member 11 is close to the substrate 12, and the gap G between the mounting member 11 and the substrate 12 when the mounting member 11 and the bonding member 13 are in close contact with each other, that is, the thickness g20 of the bonding member 13 is taken as having a light amount peak p2 The waveform is output from the non-contact distance measuring mechanism 4. Thereafter, the mounting member 11 is further brought closer to the substrate 12, and as the bonding member 13 is crushed between the mounting member 11 and the substrate 12, the value of the gap having the waveform of the light amount peak p2 is moved in the decreasing direction until the desired gap g21 . Here, the light amount peak is increased or decreased as the transmittance of the member through which the light passes. For example, when the light transmittance is large depending on the order of the air, the attachment member 11, and the joint member 13, the light amount peaks also become larger in this order. Further, in the case where the joint member 13 is not filled with the gap between the mounting member 11 and the substrate 12 and air is present, the peak value of the waveform in the desired gap g21 is the peak of the light amount in the case where the joint member is filled. The light amount peak p22 of p2 large value is output.

Therefore, the amount of light peak p2 of the case where the bonding member 13 is filled in the gap between the mounting member 11 and the substrate 12 (in the case of a good product) is measured in advance, and if the amount of light in the specified gap exceeds p2, it is possible to use The control device 100 determines that the joint member 13 is not filled in the gap between the mounting member 11 and the substrate 12, that is, the joint failure.

Further, the thickness g1 of the mounted mounting member 11 is a value obtained by multiplying the thickness of the actual mounting member 11 by the refractive index of the mounting member 11, and the thicknesses g20, g21 of the joining member 13 are the thicknesses of the actual joining member 13. The value of the refractive index of the joint member 13 is multiplied.

A process for checking whether the joint state is good or not will be described using FIG. 3B. First, at time t0, the mounting member 11 is in contact with the joint member 13, and the gap is detected as g20. As the mounting member 11 approaches the gap of the engaging member 13, the gap becomes small, and after the desired gap g21 is reached in time t1, it is maintained until time t2. Between the time t1 and the time t2, the non-contact distance measuring mechanism 4 is moved to a position near the corner portion 11a of the mounting member 11, and the laser light 6 is irradiated to a position near the corner portion 11a, and the position near the corner portion 11a is measured. The amount of light and the gap. Through the inspection process, when the control device 100 determines that the bonding member 13 is filled in the gap between the mounting member 11 and the substrate 12 in the vicinity of the corner portion 11a, the bonding member 13 is cured by irradiation of ultraviolet rays or heat energy, but When it is determined by the control device 100 that there is no filling, the classification is performed as a defective product. Through this process, it is possible to suppress the poor outflow of the post process, and it is possible to ensure the gap between the mounting member 11 and the substrate 12 with high precision.

According to the manufacturing method of the first embodiment, a semiconductor device is fabricated using the above-described members. The gap between the mounting member 11 and the substrate 12 was set to 15 μm, that is, g21 = 22.4 μm, and was produced by the above method. The inspection of the joining member 13 was carried out on the diagonal 11b of the mounting member 11, and the laser light 6 having a diameter of 50 μm was used to measure one point apart from the two sides perpendicular to each other by 150 μm. Adsorption in the mounting member 11 When the diameter of the hole 2a is 500 μm and the maximum adsorption position deviation amount is ±200 μm, it is confirmed that even if the joint member 13 is displaced from the center of the adsorption hole 2a, the control device 100 can check whether the joint state is determined or not. good. Moreover, the joint gap G between the mounting member 11 and the substrate 12 is 15 ± 2 μm.

As described above, according to the first embodiment, in the attaching process of the mounting member 11, it is possible to suppress the poor outflow of the backward process, and it is possible to ensure the gap between the mounting member 11 and the substrate 12 with high precision.

[Second embodiment]

In the second embodiment of the present invention, the mounting member 31 that is smaller than the mounting member 11 of the first embodiment is used, and a non-contact distance that functions as an example of the distance measuring device and one of the following state detecting devices is fixed. The non-contact distance measuring unit 24a of the measuring mechanism 24 is different from the first embodiment in that the lens is moved and the measurement of the laser light 26 in the inspection process is two.

4A to 4F are a schematic cross-sectional view showing a method of manufacturing a semiconductor device according to a second embodiment of the present invention, and a plan view of the semiconductor device, respectively.

The configuration of the manufacturing apparatus of the semiconductor device according to the second embodiment shown in FIGS. 4A and 4B will be described. The manufacturing apparatus of the semiconductor device of the second embodiment includes a stage 27, a mounting head 21 that functions as an example of an adsorption tool, a mounting head driving mechanism 90, and a non-contact function that functions as an example of the distance measuring device. distance The measurement mechanism 24, the measurement mechanism drive mechanism 91, the position information acquisition device 92, and the control device 100 are provided.

In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

The stage 27 corresponds to the stage 7 of the first embodiment, and the substrate 32 on which the joint member 33 is formed is fixed.

The mounting head 21 corresponds to the mounting head 1 of the first embodiment, but has a different shape and configuration. That is, the mounting head 21 includes a transparent suction plate 22 having a suction hole 22a capable of adsorbing the attachment member 31, a transparent plate 28, a side wall 21a, and a vacuum chamber 3. The transparent adsorption plate 22 constitutes a lower end surface (bottom portion) of the side wall 21a of the rectangular cylindrical shape, and an adsorption hole 2a through which the attachment member 11 can be adsorbed is formed in the center portion. The transparent plate 8 is fixed to the upper end of the side wall 21a so as to be parallel to the transparent adsorption plate 22. Thereby, the vacuum chamber 23 is formed by the transparent adsorption plate 22 and the transparent plate 28 and the side wall 21a. The vacuum chamber 23 is connected to the vacuum pump 5, and when the vacuum chamber 3 is vacuumed, the mounting member 31 can be attracted to the lower surface of the transparent suction plate 22 through the adsorption hole 22a.

The head driving mechanism 90 is attached, and the mounting head 21 can be moved in a vertical direction (upward and downward direction in FIG. 4A) and a horizontal direction orthogonal to the vertical direction (in the vertical direction in FIG. 4A) as in the first embodiment. Fig. 4A is the left and right direction).

The mounting member 31 is made of, for example, optical glass, and has a refractive index of 1.51, a light transmittance of 98%, a square of 0.45 to 0.55 mm on one side, and a thickness of 380 to 420 μm. Moreover, the substrate 32 is a semiconductor element such as a solid-state image sensor, and has a size of 0.7 mm × 1.0 mm and a thickness of 280 to 320 μm. Further, the bonding member 33 is, for example, an ultraviolet curing adhesive, for example, having a refractive index of 1.49 and a light transmittance of 90%.

Further, the non-contact distance measuring mechanism 24 is configured as follows. The fixed non-contact distance measuring portion 24a is adjacent to one of the side faces 21c of the outside of the vacuum chamber 23. A fixed lens 34a having a slope of 45° with respect to the non-contact distance measuring unit 24a is provided on the optical axis of the laser light 26 outputted downward from the non-contact distance measuring unit 24a in the vertical direction. Further, a drive lens 34b having a reflection angle of 45 is provided at a position equal to the height of the fixed lens 34a and at a constant distance from the transparent plate 28 in the vertical direction. The driving lens 34b is movable in the lateral direction by the driving lens driving mechanism 95 on the optical axis in the lateral direction from the fixed lens 34a. The non-contact distance measuring unit 24a is, for example, a spectral interference type laser displacement meter, and the distance G between the mounting member 31 and the substrate 32 can be measured by the laser light 26 reflected by the fixed lens 34a and the driving lens 34b.

The control device 100 is input with the position information acquired by the position information acquiring device 92 and the measured value measured by the non-contact distance measuring unit 24, and independently controls the mounting head driving mechanism 90 based on the input information. Driving, driving of the measuring mechanism drive mechanism 91, driving of the position information acquiring device 92, driving of the driving lens driving mechanism 95, driving of the vacuum pump 5 (or opening and closing of a control valve provided between the vacuum pump 5 and the vacuum chamber 23) ) the action of each.

Next, the semiconductor package in the second embodiment will be described. The manufacturing method. The processes of the following manufacturing methods are also all performed under the control of the control device 100.

First, in the same manner as the first embodiment, the mounting head 21 is moved by the mounting head driving mechanism 90, and the vacuum suction mounting head 21 is used to attach and attach the mounting member mounted on the tray (not shown). 31.

After that, under the control of the control device 100, the identification position of the mounting member 31 (the position in the plane perpendicular to the vertical direction of the mounting head 21) is measured by the identification camera 14 (see the first embodiment), and the calculation is performed. The portion 44 calculates the relative coordinates of the center coordinates of the mounting member 31 opposed to the center of the adsorption hole 22a of the transparent adsorption plate 22, that is, the positional deviation amount.

Next, under the control of the control device 100, the mounting head 21 is moved by the mounting head driving mechanism 90 so that the mounting member 31 fixed to the mounting head 21 faces the substrate 32, and the mounting head 21 is lowered to approach the substrate. 32. As shown in FIG. 4A and FIG. 4B, when the joining member 33 is in contact with the mounting member 31, the distance G between the mounting member 31 and the substrate 32 is measured by the non-contact distance measuring mechanism 24 under the control of the control device 100. The measured value measured by the non-contact distance measuring means 24 is output from the non-contact distance measuring means 24 to the control device 100, and is used for the control of the distance G. That is, for example, the distance G between the mounting member 31 and the substrate 32 is measured at the center of the mounting member 31, and the control device 100 controls the amount of lowering of the mounting head 21 by the mounting head driving mechanism 90 based on the measured value. . That is, the control of the control device 100 By the mounting head driving mechanism 90, the mounting head 21 is brought close to the substrate 32, so that the measured value measured by the non-contact distance measuring means 24 becomes a desired value. As a result, the joint member 33 is crushed between the mounting member 31 and the substrate 32, and is wetted toward the periphery of the mounting member 31 along the surface of the mounting member 31. Here, the laser light 26 emitted from the non-contact distance measuring unit 24a is reflected by the fixed lens 34a and the driving lens 34b at the center, and then sequentially passes through the transparent plate 28 and the adsorption hole 22a and the mounting member 31 on the substrate. The surface reflection of 32 is returned to the non-contact distance measuring portion 24a in the reverse order, and the distance G between the mounting member 31 and the substrate 32 can be directly measured. Further, the position of the driving lens 34b in the lateral direction may be at a position where the laser light 26 passes through the central portion of the inner side of the adsorption hole 22a. When the laser light 26 hits the outer peripheral portion of the adsorption hole 22a or the positional displacement occurs at the time of adsorption and hits the peripheral edge portion of the attachment member 31, the measurement precision of the distance G is lowered due to the disordered reflection.

Next, under the control of the control device 100, as shown in FIG. 4C and FIG. 4D, the designated gap G is held, and the driving lens driving mechanism 95 is used to move the driving lens 34b from the central portion to the mounting member 31. Near the corner portion 31a. Then, the laser light 26 is emitted from the non-contact distance measuring unit 24a, and the state of the inspection in the corner portion 31a is checked, and the inspection result is output from the non-contact distance measuring unit 24a to the control device 100, and the control device 100 determines whether or not the subsequent state is good.

Here, the attachment member 31 of the second embodiment is a member of about half of the attachment member 11 of the first embodiment, and is small. The difference in size between the mounting member 31 and the substrate 32 in the short-side direction is small, and in order to prevent the bonding member 33 from exceeding the substrate 32, the amount of application of the bonding member 33 must be supplied in a small amount. However, when the joint member 33 is in a small amount, it is often affected by the supply direction, and the coating shape does not become point-symmetric. It is desirable to inspect the corner portions 31a and 31c on the diagonal 31b of the mounting member 31. At least 2 places in the vicinity.

Further, as shown in FIG. 4E and FIG. 4F, the predetermined gap G is held, and the driving lens 34b is moved to the vicinity of the vicinity of the corner portion 31a of the mounting member 31 and the vicinity of the other corner portion 31c which is point-symmetric. The laser light 26 is emitted to the respective corner portions 31a and 31c to check the next state, and the control device 100 determines whether or not the subsequent state is good. When the control device 100 determines that both of the two inspections are qualified products, the control device 100 determines that it is a good product.

According to the manufacturing method of the second embodiment, the semiconductor device is fabricated using the above-described members. The gap between the mounting member 31 and the substrate 32 was set to 20 μm, that is, g21 = 22.4 μm, and was produced by the above method. The inspection of the joint member 33 is carried out on the diagonal line 31b of the attachment member 31, and the laser light 26 having a diameter of 50 μm is used to measure two points 31a and 31c which are respectively 100 μm away from the two sides which are perpendicularly intersected and are point-symmetric. In the case where the diameter of the adsorption hole 22a of the attachment member 31 is 300 μm and the maximum adsorption position deviation amount is ±100 μm, it is confirmed that the engagement state can be checked even if the engagement member 33 is displaced from the center of the adsorption hole 22a. . Moreover, the joint gap G between the mounting member 31 and the substrate 32 is 20 ± 1 μm. Moreover, two corners intersecting the short sides of the mounting member 31 In the vicinity of the portions 31a and 31c, the control device 100 can determine that the semiconductor device that has not been filled with the bonding member 33 is defective.

As described above, according to the second embodiment, even in the small attachment member 31, in the attachment process of the attachment member 31, it is possible to suppress the poor flow out of the backward process, and it is possible to ensure the gap between the attachment member 31 and the substrate 32 with high precision.

[Third embodiment]

The third embodiment of the present invention is the same as the configuration of the manufacturing apparatus of the semiconductor device according to the first embodiment, but the mounting member 41 having a large warpage and the measurement position of the laser light 6 in the inspection process are 4 This point is different from the first embodiment and the second embodiment. In the third embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

The inspection process of the semiconductor device in the third embodiment will be described. 5A to 5C are a schematic cross-sectional view showing a method of manufacturing a semiconductor device according to a third embodiment of the present invention, and a plan view of the semiconductor device, respectively. The processes of the following manufacturing methods are also all performed under the control of the control device 100.

First, under the control of the control device 100, as shown in FIG. 5A, the mounting head 41 is attached to the substrate 42 by the mounting head driving mechanism 90, and the mounting member 41 is attracted downwardly to the lower side, and the mounting member 41 is in close contact with the mounting member 41. The joint member 43. Next, the mounting member 41 and the substrate 42 are measured by the non-contact distance measuring mechanism 4 under the control of the control device 100. In order to achieve a desired gap between the gaps G, the mounting head 1 is lowered by the mounting head driving mechanism 90. The mounting member 41 is warped downward, and when the amount of the joining member 43 is small, the gap with the substrate 42 is maximized in the vicinity of the corner portion of the mounting member 41 having the largest warpage. The filling failure of the joint member 43 is most likely to occur. However, the warp of the mounting member 41 is the largest corner portion, which is inconsistent for each mounting member. For this reason, it is preferable to check each of the following states at positions near the four corner portions 41b, 41c, 41d, and 41e.

Here, as shown in FIG. 5B, the constant distance measuring means 4 is sequentially moved to the vicinity of each of the corner portions 41b, 41c, 41d, and 41e by the measuring mechanism drive mechanism 91, and the laser light 6 is measured and mounted. The gap G between the member 41 and the substrate 42 is checked for the next state.

The measurement position of the laser light 6 will be described using a plan view shown in FIG. 5C. First, the laser beam 6 is irradiated to the center position 41a of the adsorption hole 2a to measure the gap, and the subsequent state is checked. Then, the position of the individual irradiation laser light 6 in the vicinity of each of the first corner portions 41b, the position near the second corner portion 41c, the position near the third corner portion 41d, and the position near the fourth corner portion 41e are examined. The subsequent state of the position is determined. The result of each inspection is output from the non-contact distance measuring means 4 to the control device 100, and the control device 100 determines whether or not the subsequent state is good. When all the measurement positions are determined by the control device 100 to be filled with the joint member 43, the measurement position is a good product in the joined state.

For example, the mounting member 41 is constructed, for example, using optical glass. For example, the refractive index is 1.63, the light transmittance is 96%, the size is a square of 2.0 to 2.1 mm on one side, the thickness is 180 to 200 μm, and the warpage amount is 10 μm. Further, the substrate 42 is a semiconductor element such as a solid-state image sensor, and has a size of 2.8 mm × 3.5 mm and a thickness of 180 to 200 μm. Further, the joining member 43 is made of, for example, an adhesive which is also used for both ultraviolet curing and heat curing, and has, for example, a refractive index of 1.49 and a light transmittance of 92%.

A semiconductor device is produced by the method of manufacturing a semiconductor device according to the third embodiment. As a result of controlling the gap G = 50 μm, the warpage of the central portion of the mounting member 41 can be suppressed to 50 ± 5 μm. In addition, the semiconductor device in which the bonding member 13 is not filled in the vicinity of the corner portion of at least one portion can be excluded as a defective product, and it is possible to ensure a high-precision securing of the gap in the attaching process while suppressing the defect in the backward process. Flow out.

As described above, according to the third embodiment, even in the attaching member 11 having a large warpage, in the attaching process of the mounting member 11, it is possible to suppress the poor flow out of the backward process, and it is possible to ensure the gap between the mounting member 11 and the substrate 12 with high precision.

In the first embodiment to the third embodiment, the position of the mounting head 1 is higher than the platform 7 of the adsorption substrate 12, but the present invention is not limited thereto. Alternatively, the stage 7 on which the adsorption substrate 12 is placed may be disposed above, and the mounting head of the adsorption mounting member 11 may be disposed below, and the mounting head may be raised.

Furthermore, it is possible to combine any of the above-described various embodiments or modifications in any of the above embodiments or modifications. Wave each with its own effects. Furthermore, combinations of the embodiments or combinations of the embodiments or combinations of the embodiments and the embodiments may be used, and also different embodiments or combinations of the features in the embodiments.

[Industrial Availability]

The manufacturing method and the manufacturing apparatus of the semiconductor device according to the present invention have an effect of ensuring a gap between the mounting member and the substrate with high precision, and an effect of preventing the subsequent discharge of the defective product to the subsequent process after the failure is determined, and the mounting is small. It is particularly useful for semiconductor mounting of optical glass, lenses, or germanium.

1‧‧‧Installation head

1a‧‧‧ side wall

1b‧‧‧ Ontology

2‧‧‧Transparent adsorption plate

2a‧‧‧Adsorption holes

3‧‧‧vacuum room

4‧‧‧ Non-contact distance measuring mechanism

5‧‧‧Vacuum pump

6‧‧‧Laser light

7‧‧‧ platform

8‧‧‧Transparent board

11‧‧‧Installation components

12‧‧‧Substrate

13‧‧‧Joining members

90‧‧‧Installing the head drive mechanism

91‧‧‧Measurement mechanism drive mechanism

97‧‧‧Semiconductor device

100‧‧‧Control device

G‧‧‧Distance

Claims (5)

A method of manufacturing a semiconductor device, wherein a rectangular mounting member is mounted to a substrate via a bonding member; and is characterized in that: an adsorption fixing process is provided, and the bonding member is supplied to the mounting member or any of the substrates Thereafter, the adsorption tool is moved in the up and down direction and the mounting member is adsorbed and fixed to the adsorption tool; and the position information acquisition process is performed by the position information acquisition device after the adsorption fixation process, and the aforementioned adsorption by the adsorption tool is measured. Position information is acquired at a position in the lateral direction of the mounting member that intersects the vertical direction; and the registration process controls the adsorption by the control device based on the position information acquired by the position information acquisition process after the position information acquisition process The movement in the lateral direction of the tool causes the mounting member to face the substrate to face the position in the lateral direction; and the proximity process is performed by the irradiation detecting light through the mounting member and the bonding member after the alignment process Distance measuring device The distance between the mounting member and the substrate in the vertical direction is determined, and the driving device controls the driving of the adsorption tool to move the adsorption tool to a position at which the measured value measured by the distance measuring device is a predetermined distance. And the state inspecting process is performed, and after the approaching process, the detection light transmitted through the mounting member is irradiated, and the bonding state of the bonding member is inspected by the state inspection device; The curing process is to cure the bonding member by a curing device after the approaching process, and to irradiate the detection light to the vicinity of at least one corner of the mounting member in the vertical direction in the bonding state inspection process of the bonding member The amount of light of the reflected light is checked by the above-described state inspection device to see if the state is good. The method of manufacturing a semiconductor device according to claim 1, wherein the position information acquisition device in the lateral direction of the mounting member calculates a positional deviation amount from the adsorption tool of the mounting member by the position information acquisition device, In the state inspection process, the plurality of positions of the mounting member including the vicinity of the one corner portion are sequentially irradiated with the detection light, and the bonding state of the bonding member is inspected by the bonding state inspection device. The method of manufacturing a semiconductor device according to claim 2, wherein in the subsequent state inspection process, the plurality of positions are two corners of a position on the diagonal line of the mounting member and including a position near the one corner portion Location near the department. The method of manufacturing a semiconductor device according to any one of claims 1 to 3, wherein, in the approaching process, the detection light passes through a vacuum adsorption hole provided inside the adsorption tool. A manufacturing apparatus for a semiconductor device comprising: an adsorption tool for supplying a bonding member to a rectangular mounting member or After the substrate is moved in the vertical direction, the mounting member is adsorbed and fixed; and the position information acquiring device measures the position in the lateral direction of the mounting member that is attracted by the suction tool in the vertical direction, and acquires the position. The control device controls the movement of the suction tool in the lateral direction based on the position information acquired by the position information acquisition device such that the mounting member faces the substrate to face the lateral position; and the distance measuring device In a state in which the position in the lateral direction is aligned, the distance between the mounting member and the substrate in the vertical direction is measured by transmitting the detection light through the mounting member and the bonding member; In the inspection device, the driving device controls the driving of the adsorption tool, and the adsorption tool is moved until the measurement value measured by the distance measuring device reaches a predetermined distance, and the mounting member is brought close to the substrate and then irradiated. Through the aforementioned mounting members The inspection light examines the bonding state of the bonding member; and the curing device cures the bonding member; and the bonding state inspection device irradiates the detection light to the vicinity of at least one corner portion of the mounting member in the vertical direction The waveform of the reflected light is used to check whether the state is good.