TWI553425B - Gui device for pattern drawing device, pattern drawing system, method for updating job ticket and recording medium - Google Patents
Gui device for pattern drawing device, pattern drawing system, method for updating job ticket and recording medium Download PDFInfo
- Publication number
- TWI553425B TWI553425B TW104105415A TW104105415A TWI553425B TW I553425 B TWI553425 B TW I553425B TW 104105415 A TW104105415 A TW 104105415A TW 104105415 A TW104105415 A TW 104105415A TW I553425 B TWI553425 B TW I553425B
- Authority
- TW
- Taiwan
- Prior art keywords
- information
- design data
- work
- screen
- unit
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 32
- 238000013461 design Methods 0.000 claims description 183
- 239000000758 substrate Substances 0.000 claims description 82
- 238000012545 processing Methods 0.000 claims description 57
- 230000006870 function Effects 0.000 claims description 53
- 229920002120 photoresistant polymer Polymers 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 description 64
- 230000007246 mechanism Effects 0.000 description 37
- 239000000463 material Substances 0.000 description 34
- 230000008569 process Effects 0.000 description 19
- 235000012431 wafers Nutrition 0.000 description 19
- 238000005286 illumination Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 16
- 238000011960 computer-aided design Methods 0.000 description 11
- 238000012790 confirmation Methods 0.000 description 9
- 238000012546 transfer Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000009877 rendering Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/44—Arrangements for executing specific programs
- G06F9/451—Execution arrangements for user interfaces
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Human Computer Interaction (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- User Interface Of Digital Computer (AREA)
- Processing Or Creating Images (AREA)
Description
本發明係關於一種於形成有光阻膜之基板等描繪配線圖案等圖案之圖案描繪裝置所使用之圖形使用者介面(Graphical User Interface)裝置(GUI裝置)。 The present invention relates to a graphical user interface device (GUI device) used in a pattern drawing device that draws a pattern such as a wiring pattern on a substrate on which a photoresist film is formed.
自先前以來,於半導體基板、印刷配線基板、玻璃基板等各種基板,藉由照射經由光罩之光,而進行圖案之形成。近年來,為了對應於各種圖案之形成,利用如下一種技術:不使用光罩,將經空間調變之光直接照射至基板而描繪圖案進行曝光處理。 Conventionally, various substrates such as a semiconductor substrate, a printed wiring board, and a glass substrate have been patterned by irradiating light through the mask. In recent years, in order to cope with the formation of various patterns, a technique is employed in which a spatially modulated light is directly irradiated onto a substrate without using a photomask, and a pattern is drawn to perform exposure processing.
如上述般進行曝光處理之圖案描繪裝置係稱作直接描繪裝置,於例如專利文獻1中,記載有一種使用於直接描繪裝置之圖形使用者介面裝置(例如,專利文獻1之段落0043及圖1)。該圖形使用者介面裝置係於更新工作通知單時等使用。所謂工作通知單係定義用以將由CAD(Computer Aided Design:電腦輔助設計)等設計之矢量形式之設計資料進行RIP(Raster Image Processing:光柵圖像處理)展開而產生描繪資料即光柵資料的一系列動作者。 The pattern drawing device that performs the exposure processing as described above is called a direct drawing device. For example, Patent Document 1 describes a graphic user interface device used in a direct drawing device (for example, paragraph 0043 of Patent Document 1 and FIG. 1). ). The graphical user interface device is used when updating the work notice. The work notification is a series of raster data that is used to generate RIP (Raster Image Processing) design data in a vector form designed by CAD (Computer Aided Design). The author.
[專利文獻1]日本特開2013-77718號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-77718
於隨著設計資料之更新而更新工作通知單時,存在複數個關係到該設計資料之工作通知單之情形時,會產生對無須更新之工作通知單亦更新設計資料之問題。為了避免產生該問題,亦可考慮於更新設計資料時製作新的工作通知單之對應方法,但根據該方法會增加工作通知單數。為了減少工作通知單數,考慮削除無用之工作通知單之對應方法,但會產生該削除處理之作業增大之其他問題。 When a work order is updated as the design information is updated, there are a number of work notices relating to the design information, which may result in updating the design information for work notifications that do not need to be updated. In order to avoid this problem, it is also possible to consider the corresponding method of making a new work notice when updating the design data, but according to this method, the number of work notices will be increased. In order to reduce the number of work notices, consider the corresponding method of eliminating the useless work notice, but there will be other problems that increase the work of the cut processing.
本發明之目的係鑑於如上所述之方面,提供一種可於隨著設計資料之更新而更新工作通知單時簡易地選擇所需之工作通知單而執行更新作業的圖案描繪裝置用之圖形使用者介面裝置、圖案描繪系統、工作通知單更新方法及記錄媒體。 The object of the present invention is to provide a graphic user for a pattern drawing device that can perform an update job by simply selecting a desired work ticket when the work notice is updated as the design data is updated as the above is described. Interface device, pattern drawing system, work order update method, and recording medium.
第1發明係一種圖案描繪裝置用之圖形使用者介面裝置,其特徵在於:其係更新定義自設計資料產生描繪資料之一系列處理之工作通知單時所使用者,且包含:顯示部,其具有畫面;操作部,其操作上述顯示部之上述畫面;及顯示控制部,其控制上述顯示部之畫面顯示;且上述顯示控制部包含:設計資料資訊輸入部,其係將用以輸入關於經更新之更新設計資料之資訊之輸入部顯示於上述畫面;工作通知單資訊顯示部,其係將關於關係到藉由上述操作部輸入至上述設計資料資訊輸入部之資訊之工作通知單的資訊顯示於上述畫面;工作通知單強調顯示部,其係自關於藉由上述工作通知單資訊顯示部所顯示之工作通知單之資訊中,將關於作為執行將設計資料置換成上述更新設計資料之工作通知單而藉由上述操作部所選擇之工作通知單之資訊 強調顯示於上述畫面上;及置換指示輸入顯示部,其係將用以對與藉由上述工作通知單強調顯示部強調顯示於上述畫面上之資訊對應之工作通知單輸入將上述設計資料置換成上述更新設計資料之指示的輸入部顯示於畫面。 A first aspect of the invention is a graphical user interface device for a pattern drawing device, characterized in that it is a user who updates a work order defining a series of processing data from a design data generation drawing, and includes: a display portion, a screen; an operation unit that operates the screen of the display unit; and a display control unit that controls display of the screen of the display unit; and the display control unit includes: a design data information input unit that is used to input The input unit for updating the information of the updated design information is displayed on the above screen; the work notice information display unit displays information about the work notice relating to the information input to the design data information input unit by the operation unit. In the above-mentioned screen, the work notice emphasizing display unit is notified of the work notification for replacing the design data with the updated design data as information on the work notice displayed by the work notice information display unit. Information on the work order selected by the above operation unit And the replacement instruction input display unit is configured to replace the design data with the work notification input corresponding to the information highlighted on the screen by the work notice highlighting display unit. The input unit for updating the instruction of the design data described above is displayed on the screen.
第2發明係如第1發明,其中上述顯示控制部進而包含:更新候補顯示部,其係根據與藉由上述工作通知單強調顯示部強調顯示於上述畫面上之資訊對應之工作通知單,將關於可更新之更新設計資料即更新候補設計資料之資訊顯示於上述畫面。 According to a second aspect of the invention, the display control unit further includes: an update candidate display unit that is based on a work notification corresponding to the information highlighted on the screen by the work notice highlighting display unit; Information on the updateable design information, that is, the update candidate design data, is displayed on the above screen.
第3發明係如第2發明,其中上述顯示控制部進而包含:鎖定資訊輸入顯示部,其係將用以鎖定上述更新候補設計資料之鎖定資訊輸入部顯示於畫面。 According to a third aspect of the invention, the display control unit further includes: a lock information input display unit that displays a lock information input unit for locking the update candidate design data on the screen.
第4發明(圖案描繪系統)包含:如第1發明至第3發明中任一項之圖案描繪裝置用之圖形使用者介面裝置;及圖案描繪裝置,其係基於根據藉由上述圖形使用者介面裝置所更新之工作通知單自更新設計資料產生之描繪資料而於基板描繪圖案。 The fourth invention (pattern drawing system) includes: a graphic user interface device for a pattern drawing device according to any one of the first to third inventions; and a pattern drawing device based on the user interface by using the graphic The work notification updated by the device draws the pattern on the substrate by updating the drawing data generated by the design data.
第5發明係如第4發明,其中上述圖案描繪裝置係於形成於基板上之光阻膜掃描經空間調變之光束而描繪圖案之直接描繪裝置。 According to a fourth aspect of the invention, the pattern drawing device is a direct drawing device for drawing a pattern by scanning a spatially modulated light beam on a photoresist film formed on a substrate.
第6發明係一種工作通知單更新方法,其係更新定義自設計資料產生描繪資料之一系列處理之工作通知單者,且包含:更新設計資料輸入步驟,其係於顯示於圖形使用者介面裝置所具備之顯示部之畫面之設計資料資訊輸入部,藉由圖形使用者介面裝置所具備之操作部而輸入關於經更新之更新設計資料之資訊;工作通知單選擇步驟,其係自與根據藉由上述更新設計資料輸入步驟所輸入之資訊而顯示於上述畫面之資訊對應之工作通知單中,藉由操作部而選擇用以將設計資料置換成更新設計資料之工作通知單;及置換步驟,其係對藉由上述工作通知單選擇步驟所選擇之工作通知單,藉由上述操作部將上述設計 資料置換成上述更新設計資料。 The sixth invention is a work notice update method, which is a work notice for updating a series of processing data from a design data generation drawing, and includes: an update design data input step, which is displayed on the graphic user interface device. The design data input unit of the screen of the display unit inputs information about the updated updated design data by the operation unit provided in the graphical user interface device; the work order selection step is based on And displaying, by the operation unit, a work notice for replacing the design data with the updated design data; and the replacing step, by displaying the information input by the step of updating the design data and displaying the information corresponding to the information of the screen; The work notification is selected by the above operation notice selection step, and the above design is performed by the operation unit The data is replaced with the above updated design information.
第7發明係一種記錄有程式之記錄媒體,其特徵在於:其係記錄有更新定義自設計資料產生描繪資料之一系列處理之工作通知單時所使用的圖案描繪裝置用之圖形使用者介面裝置所具備之電腦可讀取之程式的記錄媒體,且使電腦發揮以下功能:設計資料資訊輸入部顯示功能,其係於上述圖形使用者介面裝置所具備之顯示部之畫面,顯示用以輸入關於經更新之更新設計資料之資訊之設計資料資訊輸入部;工作通知單資訊顯示功能,其係將關於關係到藉由上述圖形使用者介面裝置所具備之操作部而輸入至上述設計資料資訊輸入部之資訊之工作通知單的資訊顯示於上述畫面;工作通知單強調顯示功能,其係自關於藉由上述工作通知單資訊顯示功能而顯示於畫面之工作通知單之資訊中,將關於作為執行將藉由上述操作部所選擇之設計資料置換成上述更新設計資料之工作通知單而藉由操作部所選擇之工作通知單之資訊強調顯示於畫面上;及置換指示輸入顯示功能,其係將用以對與藉由上述工作通知單強調顯示功能而強調顯示於上述畫面上之資訊對應之工作通知單輸入將上述設計資料置換成上述更新設計資料之指示的輸入部顯示於畫面。 A seventh aspect of the invention is a recording medium on which a program is recorded, characterized in that it is a graphic user interface device for pattern drawing device used when updating a work order for defining a series of processing data from a design data generation drawing data. The recording medium of the computer readable program, and the computer functions as follows: the design data information input unit display function is displayed on the display unit of the graphic user interface device, and is displayed for inputting about The design information information input unit of the updated update design information; the work notice information display function is input to the design data information input unit by the operation unit provided by the graphic user interface device; The information of the work notice of the information is displayed on the above screen; the work notice emphasizes the display function, which is related to the information of the work notice displayed on the screen by the above-mentioned work notice information display function, Replaced by the design data selected by the above operation unit into the above updated design The work notice of the data is highlighted on the screen by the information of the work notice selected by the operation unit; and the replacement instruction input display function is used to emphasize the display with the emphasis on the display function by the above work notice An input unit for inputting an instruction to replace the design data with the updated design data on the work notification corresponding to the information on the screen is displayed on the screen.
第8發明係如第7發明,其使電腦進而發揮更新候補顯示功能,該更新候補顯示功能係根據與藉由工作通知單強調顯示功能而強調顯示於上述畫面之資訊對應之工作通知單,將關於可更新之更新設計資料即更新候補設計資料之資訊顯示於畫面。 According to a seventh aspect of the present invention, in the seventh aspect of the invention, the update candidate display function is further provided by the computer, and the update candidate display function is based on a work notice corresponding to the information displayed on the screen by the work notice highlight display function. Information on the updateable design information, ie, update candidate design information, is displayed on the screen.
第9發明係如第8發明,其使電腦進而發揮鎖定資訊輸入顯示功能,該鎖定資訊輸入顯示功能係將用以鎖定上述更新候補設計資料之鎖定資訊輸入部顯示於畫面。 According to a ninth aspect of the invention, the computer further provides a lock information input display function for displaying a lock information input unit for locking the update candidate design data on the screen.
根據第1發明至第9發明之任一項,可提供一種可於隨著設計資 料之更新而更新工作通知單時簡易地選擇所需之工作通知單而執行更新作業的圖案描繪裝置用之圖形使用者介面裝置、圖案描繪系統、工作通知單更新方法及記錄媒體。 According to any one of the first invention to the ninth invention, it is possible to provide a design The graphical user interface device, the pattern drawing system, the work order update method, and the recording medium for the pattern drawing device that simply selects the required work notice and updates the work order when updating the work order.
1‧‧‧設計資料製作裝置 1‧‧‧Design data production device
2‧‧‧圖形使用者介面裝置 2‧‧‧Graphic user interface device
3‧‧‧圖像處理裝置 3‧‧‧Image processing device
4‧‧‧圖案描繪系統 4‧‧‧patterning system
5‧‧‧電腦 5‧‧‧ computer
10‧‧‧載物台 10‧‧‧stage
10a‧‧‧第1部位 10a‧‧‧Part 1
10b‧‧‧第2部位 10b‧‧‧Part 2
20‧‧‧載物台移動機構 20‧‧‧stage moving mechanism
21‧‧‧旋轉機構 21‧‧‧Rotating mechanism
22‧‧‧支持板 22‧‧‧Support board
23‧‧‧副掃描機構 23‧‧‧Sub Scanning Mechanism
23a‧‧‧線性馬達 23a‧‧‧Linear motor
23b‧‧‧導軌 23b‧‧‧rails
24‧‧‧底板 24‧‧‧floor
25‧‧‧主掃描機構 25‧‧‧Main scanning mechanism
25a‧‧‧線性馬達 25a‧‧‧linear motor
25b‧‧‧導軌 25b‧‧‧rail
30‧‧‧位置參數計測機構 30‧‧‧ position parameter measuring mechanism
31‧‧‧雷射光出射部 31‧‧‧Laser light exit
32‧‧‧光束分光器 32‧‧‧ Beam splitter
33‧‧‧光束彎曲機 33‧‧‧beam bending machine
34‧‧‧第1干涉計 34‧‧‧1st interferometer
35‧‧‧第2干涉計 35‧‧‧2nd interferometer
50‧‧‧光學頭部 50‧‧‧ Optical head
53‧‧‧照明光學系統 53‧‧‧Lighting optical system
54‧‧‧雷射振盪器 54‧‧‧Laser oscillator
55‧‧‧雷射驅動部 55‧‧‧Laser drive
60‧‧‧對準攝影機 60‧‧‧Aligning camera
70‧‧‧控制部 70‧‧‧Control Department
71‧‧‧電腦 71‧‧‧ computer
72‧‧‧記憶體 72‧‧‧ memory
73‧‧‧光柵處理部 73‧‧‧Raster Processing Department
75‧‧‧資料產生部 75‧‧‧Data Generation Department
76‧‧‧配線圖案資料 76‧‧‧Wiring pattern information
77‧‧‧光柵資料 77‧‧‧Grating data
81‧‧‧類型輸入部 81‧‧‧ Type Input Department
82‧‧‧資料名輸入部 82‧‧‧Information Name Input Department
83‧‧‧通知單列表顯示部 83‧‧‧Notice list display
84‧‧‧After輸入部 84‧‧‧After Input Department
85‧‧‧Before輸入部 85‧‧‧Before input department
86‧‧‧Upper輸入部 86‧‧‧Upper Input Department
87‧‧‧Under輸入部 87‧‧‧Under Input Department
88‧‧‧Search按鈕 88‧‧‧Search button
89‧‧‧類型變更部 89‧‧‧Type Change Department
90‧‧‧歷史顯示部 90‧‧‧History Display Department
91‧‧‧更新按鈕 91‧‧‧Update button
92‧‧‧確認顯示部 92‧‧‧Confirmation display
93‧‧‧OK按鈕 93‧‧‧OK button
94‧‧‧Cancel按鈕 94‧‧‧Cancel button
95‧‧‧基板外形 95‧‧‧Substrate shape
96‧‧‧晶片(區塊) 96‧‧‧ wafer (block)
97‧‧‧區域 97‧‧‧Area
100‧‧‧直接描繪裝置(圖案描繪裝置) 100‧‧‧Direct drawing device (pattern drawing device)
101‧‧‧本體框架 101‧‧‧ ontology framework
102‧‧‧外罩 102‧‧‧ Cover
110‧‧‧基板收納盒 110‧‧‧Substrate storage box
120‧‧‧搬送機器人 120‧‧‧Transfer robot
130‧‧‧基台 130‧‧‧Abutment
140‧‧‧頭支持部 140‧‧‧ head support
141‧‧‧腳構件 141‧‧‧foot members
142‧‧‧腳構件 142‧‧‧ foot members
143‧‧‧樑構件 143‧‧ ‧ beam components
144‧‧‧樑構件 144‧‧‧ beam members
172‧‧‧盒 172‧‧‧ box
200‧‧‧顯示部 200‧‧‧Display Department
230‧‧‧CPU 230‧‧‧CPU
231‧‧‧ROM 231‧‧‧ROM
232‧‧‧記憶體 232‧‧‧ memory
233‧‧‧媒體驅動器 233‧‧‧Media Drive
234‧‧‧操作部 234‧‧‧Operation Department
235‧‧‧匯流排線 235‧‧‧ bus line
240‧‧‧顯示控制部 240‧‧‧Display Control Department
241‧‧‧設計資料資訊輸入部 241‧‧‧Design Information Information Input Department
242‧‧‧工作通知單資訊顯示部 242‧‧‧Work Notice Information Display Department
243‧‧‧工作通知單強調顯示部 243‧‧‧ work notice highlights the display department
244‧‧‧置換指示輸入顯示部 244‧‧‧ Replacement instruction input display section
245‧‧‧更新候補顯示部 245‧‧‧Update candidate display
246‧‧‧鎖定資訊輸入顯示部 246‧‧‧Lock information input display
247‧‧‧佈局顯示部 247‧‧‧Layout display department
400‧‧‧圖形描繪系統 400‧‧‧Graphic drawing system
511‧‧‧空間光調變器 511‧‧‧Space light modulator
512‧‧‧光調變單元 512‧‧‧Light modulation unit
513‧‧‧描繪信號處理部 513‧‧‧Drawing Signal Processing Department
514‧‧‧曝光控制部 514‧‧‧Exposure Control Department
515‧‧‧描繪控制部 515‧‧‧Drawing Control Department
516‧‧‧鏡面 516‧‧‧Mirror
517‧‧‧投影光學系統 517‧‧‧Projection optical system
518‧‧‧透鏡 518‧‧‧ lens
519‧‧‧透鏡 519‧‧‧ lens
520‧‧‧透鏡 520‧‧‧ lens
521‧‧‧遮蔽板(光圈構件) 521‧‧‧shading plate (aperture member)
522‧‧‧透鏡 522‧‧‧ lens
523‧‧‧變焦透鏡 523‧‧‧ zoom lens
524‧‧‧聚焦透鏡 524‧‧‧focus lens
530a‧‧‧可動帶 530a‧‧‧ movable belt
531b‧‧‧固定帶 531b‧‧‧Fixed tape
535‧‧‧帶對之集合 535‧‧‧With the collection of pairs
536‧‧‧驅動器電路單元 536‧‧‧Drive circuit unit
540‧‧‧望遠鏡 540‧‧ ‧ Telescope
541‧‧‧聚光透鏡 541‧‧‧ Concentrating lens
542‧‧‧衰減器 542‧‧‧Attenuator
543‧‧‧聚焦透鏡 543‧‧ ‧focus lens
D0‧‧‧設計資料 D0‧‧‧Design materials
D1‧‧‧更新設計資料 D1‧‧‧ updated design information
D2‧‧‧更新設計資料 D2‧‧‧Update design information
JT‧‧‧工作通知單 JT‧‧‧ work notice
M‧‧‧記錄媒體 M‧‧ Record Media
N‧‧‧網路 N‧‧‧Network
P‧‧‧程式 P‧‧‧ program
S1~S5‧‧‧步驟 S1~S5‧‧‧Steps
S10~S40‧‧‧步驟 S10~S40‧‧‧Steps
S210~S240‧‧‧步驟 S210~S240‧‧‧Steps
W‧‧‧基板 W‧‧‧Substrate
X‧‧‧方向 X‧‧‧ direction
Y‧‧‧方向 Y‧‧‧ direction
Z‧‧‧方向 Z‧‧‧ direction
θ‧‧‧方向 Θ‧‧‧ direction
θ1‧‧‧最大角度 θ1‧‧‧Maximum angle
θ2‧‧‧最大角度 θ2‧‧‧Maximum angle
圖1係顯示包含圖案描繪系統之圖形描繪系統之圖。 Figure 1 is a diagram showing a graphical depiction system including a patterning system.
圖2係顯示圖形使用者介面裝置之硬體構成之方塊圖。 Figure 2 is a block diagram showing the hardware configuration of the graphical user interface device.
圖3係顯示圖形使用者介面裝置之功能構成之方塊圖。 Figure 3 is a block diagram showing the functional composition of the graphical user interface device.
圖4係顯示自設計資料更新至描繪執行之流程之流程圖。 Figure 4 is a flow chart showing the flow from the design data update to the depiction execution.
圖5係顯示工作通知單之更新作業之流程之流程圖。 Figure 5 is a flow chart showing the flow of an update operation of a work order.
圖6係用以說明初始畫面之圖。 Fig. 6 is a diagram for explaining an initial screen.
圖7係顯示工作通知單選擇時之圖形使用者介面畫面之圖。 Figure 7 is a diagram showing the graphical user interface screen when the work order is selected.
圖8係顯示工作通知單更新時之圖形使用者介面畫面之圖。 Figure 8 is a diagram showing the graphical user interface screen when the work order is updated.
圖9係直接描繪裝置之側視圖。 Figure 9 is a side elevational view of the device directly depicted.
圖10係直接描繪裝置之俯視圖。 Figure 10 is a top plan view of the device directly depicted.
圖11係顯示照明光學系統及投影光學系統之圖。 Fig. 11 is a view showing an illumination optical system and a projection optical system.
圖12係放大顯示空間光調變器之圖。 Figure 12 is a diagram showing an enlarged view of a spatial light modulator.
圖13係顯示直接描繪裝置之各部與控制部之連接構成之方塊圖。 Fig. 13 is a block diagram showing the connection structure between the respective portions of the direct drawing device and the control unit.
圖14係顯示控制描繪動作之控制部之方塊圖。 Fig. 14 is a block diagram showing a control unit for controlling the drawing operation.
圖15係直接描繪裝置之動作之流程圖。 Figure 15 is a flow chart showing the action of the device directly.
以下,參照附加圖式對本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
圖1係顯示包含本發明之一實施形態之圖案描繪系統4之圖形描繪系統400之圖。該圖形描繪系統400係藉由選擇性曝光例如圓形狀之半導體基板(以下簡稱為「基板」)上之光阻膜,而將相當於電路圖案 之圖形直接描繪於光阻膜之系統。 1 is a diagram showing a graphics rendering system 400 including a pattern rendering system 4 in accordance with an embodiment of the present invention. The graphic drawing system 400 is equivalent to a circuit pattern by selectively exposing, for example, a photoresist film on a circular semiconductor substrate (hereinafter simply referred to as a "substrate"). The graphic is directly depicted in the system of the photoresist film.
圖形描繪系統400具備經由LAN等網路N而相互連接之設計資料製作裝置1、圖像處理裝置3及直接描繪裝置100。圖像處理裝置3具備圖形使用者介面裝置2。 The graphic drawing system 400 includes a design data creating device 1, an image processing device 3, and a direct drawing device 100 that are connected to each other via a network N such as a LAN. The image processing device 3 includes a graphic user interface device 2.
設計資料製作裝置1係進行記述有應描繪於描繪對象物即基板之圖案區域的資料之製作及編集之裝置。具體而言,資料係製作為藉由CAD(Computer Aided Design:電腦輔助設計)以矢量形式記述之圖形資料。設計資料製作裝置1所製作之設計資料D0係經由網路N而分別發送至圖像處理裝置3及直接描繪裝置100。又,設計資料製作裝置1係變更初始之設計資料D0所示之圖案之形狀或線寬尺寸而製作更新設計資料D1(D2...)。設計資料製作裝置1亦有進而更新已經存在更新歷史之更新設計資料而製作更新設計資料之情形。另,於本說明書中亦有將設計資料D0或更新設計資料D1等簡單總稱為「設計資料」之情形。設計資料製作裝置1所製作之設計資料D0、D1等係經由網路N而分別發送至圖像處理裝置3及直接描繪裝置100。 The design data creation device 1 is a device that creates and compiles data on a pattern region to be drawn on a substrate to be drawn. Specifically, the data is produced as graphic data described in a vector form by CAD (Computer Aided Design). The design data D0 created by the design data creation device 1 is transmitted to the image processing device 3 and the direct drawing device 100 via the network N. Further, the design data creating apparatus 1 creates the updated design data D1 (D2...) by changing the shape or the line width size of the pattern indicated by the initial design data D0. The design data creating apparatus 1 also has a case where the updated design data in which the update history already exists is updated to create the updated design data. In addition, in the present specification, the case where the design data D0 or the updated design data D1 is simply referred to as "design data" is also referred to. The design data D0, D1, and the like created by the design data creation device 1 are transmitted to the image processing device 3 and the direct drawing device 100 via the network N, respectively.
圖像處理裝置3係對經由網路N發送之設計資料D0或更新設計資料D1等製作工作通知單JT。所謂工作通知單JT係定義用以將設計資料D0或更新設計資料D1等進行RIP(Raster Image Processing)展開而產生描繪資料即光柵資料的一系列動作者。例如,於RIP展開時將圖案之線寬等之尺寸進行變粗處理或變細處理而變更,從而產生描繪資料之情形時,存在複數個根據處理而異之RIP展開處理。藉由該複數個RIP展開處理之任一個RIP展開處理,將是否對設計資料D0或更新設計資料D1等進行RIP展開建立關聯而定義者係工作通知單JT。藉由圖像處理裝置3製作之工作通知單JT係經由網路N而發送至直接描繪裝置100。 The image processing apparatus 3 creates a work order JT for the design material D0 or the update design material D1 transmitted via the network N. The work notification JT defines a series of actor for generating RUR (Raster Image Processing), such as design data D0 or updated design data D1, to generate raster data. For example, when RIP is expanded, the size of the line width of the pattern is changed to a thickening process or a thinning process, and when the drawing data is generated, there are a plurality of RIP expansion processes that differ depending on the processing. By any one of the plurality of RIP expansion processes, whether or not the RIP development of the design data D0 or the updated design data D1 is associated is established, and the work order notification JT is defined. The work notification JT created by the image processing device 3 is transmitted to the direct drawing device 100 via the network N.
圖形使用者介面裝置2係設置於圖像處理裝置3,作為針對操作者之圖形使用者介面(Graphical User Interface)發揮功能。圖2係顯示圖形使用者介面裝置2之硬體構成之方塊圖。 The graphic user interface device 2 is provided in the image processing device 3 and functions as a graphical user interface for the operator. 2 is a block diagram showing the hardware configuration of the graphical user interface device 2.
圖形使用者介面裝置2係例如電腦5,具備CPU230、ROM231、記憶體232、媒體驅動器233、顯示部200、操作部234等。該等硬體係分別藉由匯流排線235而電性連接。 The graphic user interface device 2 is, for example, a computer 5, and includes a CPU 230, a ROM 231, a memory 232, a media drive 233, a display unit 200, an operation unit 234, and the like. The hard systems are electrically connected by bus bars 235, respectively.
CPU230係基於記憶於ROM231之程式(或藉由媒體驅動器233讀入之程式)P,控制上述硬體各部,而實現電腦5(圖形使用者介面裝置2)之功能。程式P係可由電腦5讀取,且使電腦5發揮各功能者。 The CPU 230 controls the hardware components based on the program stored in the ROM 231 (or the program read by the media driver 233) P to realize the function of the computer 5 (the graphic user interface device 2). The program P can be read by the computer 5, and the computer 5 can be used for each function.
ROM231係預先儲存有圖形使用者介面裝置2之控制所必要之程式P或資料之讀取專用之記憶裝置。記憶體232係可讀取與寫入之記憶裝置,暫時記憶利用CPU230進行之運算處理時所產生之資料等。記憶體232包含SRAM、DRAM等。於記憶體232保存有關於設計資料D0、更新設計資料D1等及工作通知單JT之資訊。 The ROM 231 is a memory device for storing the program P or the data necessary for the control of the graphic user interface device 2 in advance. The memory 232 is a memory device that can be read and written, and temporarily stores data generated by the arithmetic processing performed by the CPU 230. The memory 232 includes SRAM, DRAM, and the like. The memory 232 stores information about the design data D0, the updated design data D1, and the work notice JT.
媒體驅動器233具有讀取記憶於記錄媒體M之資訊之功能。記錄媒體M係例如CD-ROM、DVD(Digital Versatile Disk:數位多功能光碟)、可撓性磁碟等可攜性記錄媒體。例如,於記錄媒體M預先記錄有程式P之情形時,電腦5通過記錄媒體M而讀取程式P。 The media drive 233 has a function of reading information stored in the recording medium M. The recording medium M is a portable recording medium such as a CD-ROM, a DVD (Digital Versatile Disk), or a flexible disk. For example, when the recording medium M has a program P recorded in advance, the computer 5 reads the program P through the recording medium M.
顯示部200具備如彩色LCD之顯示器等,且於其畫面可變顯示圖形使用者介面操作用之圖像、各種資料及動作狀態等。 The display unit 200 includes a display such as a color LCD, and displays an image, a variety of materials, an operation state, and the like for the operation of the graphic user interface on the screen.
操作部234係具有鍵盤及滑鼠之輸入裝置,受理指令或各種資料之輸入之類之使用者操作。使用該操作部234,操作者對顯示於顯示部200之圖形使用者介面操作畫面輸入各種資訊,而操作顯示部200之畫面。 The operation unit 234 is provided with a keyboard and a mouse input device, and accepts user operations such as input of commands or various materials. Using the operation unit 234, the operator inputs various information to the graphic user interface operation screen displayed on the display unit 200, and operates the screen of the display unit 200.
圖3係顯示圖形使用者介面裝置2之功能構成之方塊圖。該圖3係以方塊圖顯示圖形使用者介面裝置2之硬體構成藉由上述圖2所示之程 式P發揮之各功能,該等功能區塊可藉由硬體、軟體之組合而以各種形式實現。 3 is a block diagram showing the functional configuration of the graphical user interface device 2. FIG. 3 is a block diagram showing the hardware composition of the graphical user interface device 2 by the process shown in FIG. 2 above. Each function of the formula P can be realized in various forms by a combination of hardware and software.
如圖3所示,圖形使用者介面裝置2具備顯示控制部240。該顯示控制部240係控制顯示部200之畫面顯示者,具有設計資料資訊輸入部241、工作通知單資訊顯示部242、工作通知單強調顯示部243、置換指示輸入顯示部244、更新候補顯示部245、鎖定資訊輸入顯示部246及佈局顯示部247。顯示控制部240係藉由操作者利用操作部234對顯示部200進行之操作而實現各部之功能,其細節將於動作之說明中予以後述。 As shown in FIG. 3, the graphic user interface device 2 includes a display control unit 240. The display control unit 240 controls the screen display person of the display unit 200, and includes a design material information input unit 241, a work notice information display unit 242, a work order highlight display unit 243, a replacement instruction input display unit 244, and an update candidate display unit. 245. The information input display unit 246 and the layout display unit 247 are locked. The display control unit 240 realizes the functions of the respective units by the operation of the display unit 200 by the operator using the operation unit 234, and the details thereof will be described later in the description of the operation.
圖4係顯示自設計資料更新至描繪執行之流程之流程圖。首先,於步驟S10,操作者於更新設計資料D0時,使用設計資料製作裝置1修正設計資料D0,而製作更新設計資料D1等(設計資料更新步驟)。亦有如上述般進而更新更新設計資料而製作更新設計資料之情形。所製作之更新設計資料D1等係經由網路N,自設計資料製作裝置1分別發送至圖像處理裝置3及直接描繪裝置100。 Figure 4 is a flow chart showing the flow from the design data update to the depiction execution. First, in step S10, when updating the design data D0, the operator uses the design material creation device 1 to correct the design data D0, and creates the update design data D1 or the like (design data update step). There are also cases where the design information is updated and updated to create updated design materials as described above. The created update design data D1 and the like are transmitted from the design material creation device 1 to the image processing device 3 and the direct drawing device 100 via the network N.
接著,於步驟S20之工作通知單更新步驟,操作者使用圖形使用者介面裝置2選擇應用發送至圖像處理裝置3之更新設計資料D1等之工作通知單JT,且將工作通知單中之設計資料置換成更新設計資料D1等而更新工作通知單JT。該工作通知單更新步驟之細節將予以後述。經更新之工作通知單JT係經由網路N而自圖像處理裝置3發送至直接描繪裝置100。 Next, in the work order update step of step S20, the operator selects the work notice JT sent by the application to the updated design material D1 of the image processing apparatus 3, and the design of the work notice, using the graphical user interface device 2. The work order is replaced with the updated design data D1 and the like, and the work notice JT is updated. The details of the update step of the work order will be described later. The updated work order JT is transmitted from the image processing apparatus 3 to the direct drawing apparatus 100 via the network N.
接著,於步驟S30之描繪資料產生步驟,直接描繪裝置100係對更新設計資料D1等執行工作通知單JT所定義之RIP展開處理等而產生描繪資料。使用該描繪資料,直接描繪裝置100執行針對描繪對象物即基板之描繪動作(步驟S40描繪執行步驟)。關於直接描繪裝置100 之構成及動作將予以後述。另,亦可不以直接描繪裝置100,而以圖像處理裝置3執行步驟S30之描繪資料產生步驟。該情形時,將圖像處理裝置3所產生之描繪資料經由網路N而發送至直接描繪裝置100。 Next, in the drawing data generating step of step S30, the direct drawing device 100 generates drawing data by performing RIP development processing or the like defined by the execution work order J1 such as the update design data D1. Using the drawing data, the direct drawing device 100 performs a drawing operation on the substrate that is the object to be drawn (step S40 depicts the execution step). About the direct drawing device 100 The configuration and operation will be described later. Alternatively, the drawing data generating step of step S30 may be executed by the image processing apparatus 3 without directly drawing the apparatus 100. In this case, the drawing material generated by the image processing apparatus 3 is transmitted to the direct drawing apparatus 100 via the network N.
參照圖5對上述之圖4所示之工作通知單更新步驟(步驟S20)之細節進行說明。圖5係顯示工作通知單之更新作業之流程之流程圖。 The details of the work order update step (step S20) shown in Fig. 4 described above will be described with reference to Fig. 5 . Figure 5 is a flow chart showing the flow of an update operation of a work order.
首先,於圖5所示之步驟S210,圖形使用者介面裝置2於顯示部200之畫面顯示初始畫面(初始畫面顯示步驟)。初始畫面係例如圖6所示之畫面。如圖6所示,初始畫面包含類型輸入部81、資料名輸入部82、通知單列表顯示部83、After輸入部84、Before輸入部85、Upper輸入部86、Under輸入部87、Search(搜索)按鈕88、類型變更部89、歷史顯示部90、更新按鈕91、確認顯示部92、OK(確認)按鈕93及Cancel(取消)按鈕94等。 First, in step S210 shown in FIG. 5, the graphic user interface device 2 displays an initial screen (initial screen display step) on the screen of the display unit 200. The initial screen is, for example, the screen shown in FIG. As shown in FIG. 6, the initial screen inclusion type input unit 81, the material name input unit 82, the notice list display unit 83, the After input unit 84, the Before input unit 85, the Upper input unit 86, the Under input unit 87, and Search (search) The button 88, the type changing unit 89, the history display unit 90, the update button 91, the confirmation display unit 92, the OK (confirmation) button 93, the Cancel button 94, and the like.
初始畫面係藉由圖3所示之顯示控制部240之各功能部顯示,例如,藉由設計資料資訊輸入部241之功能,將圖6之類型輸入部81及資料名輸入部82顯示於畫面。又,藉由工作通知單資訊顯示部242之功能將通知單列表顯示部83顯示於畫面。 The initial screen is displayed by each functional unit of the display control unit 240 shown in FIG. 3. For example, by the function of the design material information input unit 241, the type input unit 81 and the material name input unit 82 of FIG. 6 are displayed on the screen. . Further, the notice list display unit 83 displays the notice list display unit 83 on the screen by the function of the work order information display unit 242.
又,藉由置換指示輸入顯示部244之功能將輸入部即更新按鈕91、OK按鈕93及Cancel按鈕94顯示於畫面,藉由更新候補顯示部245將歷史顯示部90顯示於畫面。再者,藉由鎖定資訊輸入顯示部246之功能將輸入部即After輸入部84、Before輸入部85、Upper輸入部86、Under輸入部87及Search按鈕88顯示於畫面,藉由佈局顯示部247之功能將確認顯示部92顯示於畫面。 Moreover, the update button 91, the OK button 93, and the Cancel button 94, which are input means, are displayed on the screen by the function of the replacement instruction input display unit 244, and the history display unit 90 is displayed on the screen by the update candidate display unit 245. Further, by the function of the lock information input display unit 246, the input unit, that is, the Before input unit 84, the Before input unit 85, the Upper input unit 86, the Under input unit 87, and the Search button 88 are displayed on the screen, and the layout display unit 247 is displayed on the screen. The function confirms that the display unit 92 is displayed on the screen.
返回至圖5對下一步驟即步驟S220之更新設計資料輸入步驟進行說明。於該步驟中,操作者使用操作部234於初始畫面之類型輸入部81輸入更新前之設計資料D0或更新設計資料D1等所屬之類型(CAD Data Type:CAD資料類型)。另,亦可省略該類型之輸入。接著,操作者使用操作部234於資料名輸入部82輸入設計資料D0或設計更新資料D1等之資料名(CAD Data Name:CAD資料名)。此時,於類型輸入部81輸入有類型之情形時,於與資料名輸入部82連動之下拉選單顯示屬於所輸入之類型之資料名之一覽,因此亦可自該一覽選擇所需之資料名進行輸入。上述資料名係關於經更新之更新設計資料D1等之資訊之一種。 Returning to FIG. 5, the next step, the update design data input step of step S220, will be described. In this step, the operator inputs the type of the pre-update design data D0 or the update design data D1 (CAD) to the type input unit 81 of the initial screen using the operation unit 234. Data Type: CAD data type). Alternatively, input of this type can be omitted. Then, the operator inputs the material name (CAD Data Name) of the design data D0 or the design update data D1 to the material name input unit 82 using the operation unit 234. In this case, when the type input unit 81 inputs a type, the menu is displayed in conjunction with the data name input unit 82 to display a list of the data names belonging to the type entered, so that the desired material name can be selected from the list. Make your input. The above information is one of the information on the updated design data D1 and the like.
圖7顯示於類型輸入部81輸入類型「A」,於資料名輸入部82輸入資料名「AAA.gds」之狀態。當於資料名輸入部82輸入資料名「AAA.gds」時,將關係到該資料名之工作通知單JT之一覽(Ticket(Referenced CAD Data)List:通知單(所涉及之CAD資料)列表)藉由工作通知單資訊顯示部242之功能而顯示於通知單列表顯示部83。換言之,於通知單列表顯示部83顯示定義將標註有上述資料名之設計資料進行RIP展開等之一系列動作的工作通知單JT之一覽。 FIG. 7 shows a state in which the type input unit 81 inputs the type "A" and the material name input unit 82 inputs the material name "AAA.gds". When the material name "AAA.gds" is input to the material name input unit 82, a list of the work notifications JT of the material name (Ticket (Referenced CAD Data) List: notice list (the related CAD data) list) is entered. The notification list display unit 83 is displayed by the function of the work order information display unit 242. In other words, the notice list display unit 83 displays a list of work notices JT that define a series of operations such as RIP development such as design data to which the above-mentioned material names are attached.
於圖7中顯示3個工作通知單「AA1」、「AA2」、「AA3」。一覽中之1列表示1個工作通知單JT。一覽之第1行顯示通知單名(Ticket Name)。第2行之晶片佈局(Chip Layout)顯示是否已進行藉由圖像處理裝置3變更晶片內之圖案形狀或線寬等之佈局作業,如圖7般顯示為「True」之情形表示已進行佈局作業。未進行佈局作業之情形顯示為「False」。 In Figure 7, three work notices "AA1", "AA2", and "AA3" are displayed. One column in the list indicates one work notice JT. The first line of the list shows the ticket name (Ticket Name). The chip layout of the second row indicates whether or not the layout operation of changing the pattern shape or the line width in the wafer by the image processing apparatus 3 has been performed, and the case where "True" is displayed as shown in FIG. operation. The case where the layout job is not performed is displayed as "False".
同樣地,第3行之基板佈局(Wafer Layout)顯示是否已進行藉由圖像處理裝置3決定複數個晶片相對於描繪對象物即基板之配置位置之佈局作業,如圖7般顯示為「True」之情形表示已進行佈局作業。未進行佈局作業之情形顯示為「False」。 Similarly, the substrate layout (Wafer Layout) of the third row indicates whether or not the layout operation of determining the arrangement positions of the plurality of wafers with respect to the substrate to be drawn by the image processing apparatus 3 has been performed, and is displayed as "True" as shown in FIG. The situation indicates that a layout job has been performed. The case where the layout job is not performed is displayed as "False".
顯示第4行之RIP名(Rip Name)。RIP名係根據RIP展開處理之種類而標註。於圖7之例中,第1列之通知單名為「AA1」之工作通知單JT 中,定義將RIP名標註為「AA1.gds-123」之RIP展開處理係對設計資料D0或更新設計資料D1等執行。同樣地,第2列之「AA2」之工作通知單JT中,定義為執行「AA2.gds-345」之RIP展開處理,第3列之「AA3」之工作通知單JT中,定義為執行「AA3.gds-678」之RIP展開處理。 The RIP name of the 4th line is displayed. The RIP name is marked according to the type of RIP development processing. In the example of Figure 7, the notice of the first column is named "AA1" work notice JT In the definition, the RIP development processing system in which the RIP name is marked as "AA1.gds-123" is executed on the design data D0 or the updated design data D1. Similarly, in the work order JT of "AA2" in the second column, it is defined as the RIP expansion process of "AA2.gds-345", and the work notice JT of the "AA3" of the third column is defined as execution. RIP expansion processing of AA3.gds-678".
上述之複數個RIP展開處理係例如、圖案線寬之變粗處理或變細處理分別不同之RIP展開處理。換言之,複數個工作通知單JT(AA1、AA2、AA3)係定義對相同之設計資料D0或更新設計資料D1等,實施分別不同之RIP展開處理。 The plurality of RIP expansion processes described above are, for example, RIP expansion processes in which the pattern line width is thickened or thinned. In other words, a plurality of work notices JT (AA1, AA2, AA3) define different RIP expansion processes for the same design data D0 or updated design data D1.
第5行之更新日(Modified Day)顯示工作通知單JT被更新之日期。另,工作通知單JT所定義之項目不限定於圖7所示之項目,例如,亦可包含進行更新作業之作業者之姓名作為項目。 The modified day of the fifth line shows the date on which the work order JT was updated. Further, the item defined by the work order JT is not limited to the item shown in FIG. 7, and may include, for example, the name of the operator who performs the update operation as the item.
如圖7所示,於通知單列表顯示部83藉由工作通知單資訊顯示部242而顯示關係到關於經更新之更新設計資料D1等之資訊即資料名的工作通知單JT之一覽,因此可簡易地選擇需要隨著設計資料之更新而更新之所需之工作通知單JT。 As shown in FIG. 7, the notice list display unit 83 displays a list of work notices JT related to the information on the updated update design data D1, etc., by the work order information display unit 242. Simply select the required work order JT that needs to be updated as the design information is updated.
返回至圖5,於步驟S230之工作通知單選擇步驟中,操作者自顯示於畫面之工作通知單之一覽選擇應更新之工作通知單。於圖7中顯示操作者藉由操作部234自與顯示於通知單列表顯示部83之資訊對應之工作通知單JT(3個工作通知單JT)中選擇第2列之工作通知單JT即「AA2」作為更新對象的工作通知單JT之狀態。於圖7中對第2列施加陰影線,於實際之畫面中,藉由工作通知單強調顯示部243之功能,例如較其他列表現為更濃等、標註濃淡而表現關於所選擇之工作通知單JT之資訊而實現強調顯示。另,強調顯示之方法只要為可於畫面上視認關於所選擇之工作通知單之資訊與關於未被選擇之工作通知單JT之資訊之區別的方法,即可為任意方法。 Returning to Fig. 5, in the work order selection step of step S230, the operator selects the work notice to be updated from the list of work notices displayed on the screen. In FIG. 7, the operator selects the work notification JT of the second column from the work notification JT (three work notices JT) corresponding to the information displayed on the notice list display unit 83 by the operation unit 234. AA2" is the status of the work order JT as the update target. In FIG. 7, the second column is hatched, and in the actual screen, the function of the display unit 243 is emphasized by the work order, for example, it is thicker than other lists, and the highlight is displayed to indicate the selected work notification. A single JT information is used to achieve an emphasis display. Further, the method of emphasizing the display may be any method as long as it is a method for visually distinguishing between the information on the selected work notice and the information on the unselected work notice JT on the screen.
當選擇更新對象之工作通知單JT時,更新候補顯示部245與該選擇動作連動而發揮功能。藉此,於圖7之歷史顯示部90,將所選擇之工作通知單JT之設計資料之歷史作為關於可更新之更新設計資料即更新候補設計資料之資訊顯示於畫面。於圖7之例中,4個更新歷史(更新候補設計資料)係顯示為4列,資料名為「AAA.gds」之設計資料於該工作通知單JT中,於更新日(Date)所示之日期,更新4次,且分別標註有序列號(Serial No.)。 When the work notification JT of the update target is selected, the update candidate display unit 245 functions in conjunction with the selection operation. Thereby, the history display unit 90 of FIG. 7 displays the history of the design information of the selected work order JT as information on the updateable design information, that is, the update candidate design data, on the screen. In the example of FIG. 7, four update histories (update candidate design data) are displayed in four columns, and the design data of the data name "AAA.gds" is in the work notice JT, as shown on the update date (Date). The date is updated 4 times and is marked with a serial number (Serial No.).
此處,將初始之設計資料D0設為序列號為「1」之設計資料「AAA.gds」,將最初更新後之更新設計資料D1設為序列號為「2」之設計資料「AAA.gds」,依序將更新設計資料D2之序列號設為「3」,將更新設計資料D3之序列號設為「4」。 Here, the initial design data D0 is set to the design data "AAA.gds" with the serial number "1", and the updated design data D1 after the initial update is set to the design data "AAA.gds" with the serial number "2". Then, the serial number of the updated design data D2 is set to "3", and the serial number of the updated design data D3 is set to "4".
與通知單列表顯示部83中之工作通知單JT之選擇動作連動,將關於所選擇之工作通知單JT之現狀之設計資料的資訊藉由更新候補顯示部245之功能而以歷史顯示部90強調顯示。於圖7之例中,顯示有將所選擇之工作通知單JT之現狀之設計資料為顯示於歷史顯示部90之第2列之序列號「2」之更新設計資料D1係強調顯示。於圖7中對第2列施加陰影線,於實際之畫面中,例如較其他列表現為更濃等、標註濃淡而強調顯示關於現狀之設計資料之資訊。由於如此般將關於現狀之設計資料之資訊藉由更新候補顯示部245之功能而強調顯示,故操作者可容易地掌握現狀之設計資料。 In conjunction with the selection operation of the work order JT in the notice list display unit 83, the information on the design information of the current work order JT is emphasized by the history display unit 90 by the function of the update candidate display unit 245. display. In the example of FIG. 7, the design data indicating the current status of the selected work order JT is displayed as the update design data D1 of the serial number "2" displayed in the second column of the history display unit 90. In FIG. 7, the second column is hatched, and in the actual screen, for example, it is thicker than other lists, and the highlighting is emphasized to highlight information about the current design data. Since the information on the current design data is highlighted by the function of the update candidate display unit 245, the operator can easily grasp the current design information.
如上所述,由於工作通知單JT之現狀之設計資料(更新前設計資料)係序列號為「2」之更新設計資料D1,故更新候補設計資料係其他設計資料,即序列號為「1」之設計資料D0、序列號為「3」之更新設計資料D2、序列號為「4」之更新設計資料D3之任一者。 As mentioned above, since the design information (pre-update design data) of the work order JT is the updated design data D1 with the serial number "2", the update candidate design data is other design data, that is, the serial number is "1". Any of the design data D0, the updated design data D2 whose serial number is "3", and the updated design data D3 whose serial number is "4".
又,佈局顯示部247與通知單列表顯示部83中之工作通知單JT之選擇動作連動而發揮功能。藉此,如圖7所示,將根據該工作通知單 JT而予以圖案描繪之晶片佈局之圖像顯示於確認顯示部92。該佈局圖像包含描繪對象物即圓形狀之基板外形95、與佈局至基板內之複數個晶片(區塊)96。 Further, the layout display unit 247 functions in conjunction with the selection operation of the work order JT in the notice list display unit 83. Thereby, as shown in Figure 7, will be based on the work notice An image of the wafer layout in which JT is patterned is displayed on the confirmation display unit 92. The layout image includes a substrate shape 95 that is a circular object in which the object is drawn, and a plurality of wafers (blocks) 96 that are laid out into the substrate.
圖7中顯示於基板內完全包含複數個晶片96之區域97內佈局晶片96之狀態。又,亦可藉由佈局顯示部247之功能放大顯示晶片96而顯示晶片96內之圖案。操作者藉由確認顯示於確認顯示部92之圖像,可容易地掌握根據該工作通知單JT而予以圖案描繪之晶片96內之圖案形狀或晶片96之佈局。 The state in which the wafer 96 is laid out in the region 97 in which the plurality of wafers 96 are completely contained in the substrate is shown in FIG. Further, the pattern in the wafer 96 can be displayed by enlarging the display wafer 96 by the function of the layout display unit 247. By confirming the image displayed on the confirmation display unit 92, the operator can easily grasp the pattern shape of the wafer 96 or the layout of the wafer 96 patterned according to the work order JT.
接著,對圖5所示之步驟S240之置換步驟進行說明。於圖7所示之例中,於工作單列表顯示部83所選擇之第2列之「AA2」之工作通知單JT中,現狀之設計資料係於歷史顯示部90所強調顯示之序列號為「2」之「AAA.gds」,該設計資料係如上述般相當於更新設計資料D1。 Next, the replacement step of step S240 shown in FIG. 5 will be described. In the example shown in FIG. 7, in the work notice JT of "AA2" in the second column selected by the work order list display unit 83, the current design data is highlighted by the history display unit 90. "AAA.gds" of "2", the design data is equivalent to the update design data D1 as described above.
將上述更新設計資料D1置換成相當於更新設計資料D3之序列號為「4」之「AAA.gds」之情形時,如圖8所示,操作者使用操作部234,選擇歷史顯示部90之第4列之序列號為「4」之「AAA.gds」。所選擇之第4列係於圖8中施加陰影線,於實際之畫面中,藉由更新候補顯示部245之功能,例如較其他列表現為更濃等、標註濃淡而強調顯示。 When the update design data D1 is replaced by "AAA.gds" corresponding to the update design data D3 whose serial number is "4", as shown in FIG. 8, the operator selects the history display unit 90 using the operation unit 234. The serial number of the fourth column is "AAA.gds" of "4". The selected fourth column is hatched in FIG. 8. In the actual screen, by updating the function of the candidate display unit 245, for example, it is thicker than other lists, and the highlight is displayed.
於該狀態下操作者藉由操作部234之滑鼠等點擊更新按鈕91(Replace CAD Data:更新CAD資料),且藉由置換指示輸入顯示部244之功能進行輸入指示。其結果,將「AA2」之工作通知單JT之設計資料自更新設計資料D1置換成更新設計資料D3。與該置換動作連動,顯示於確認顯示部92之內容切換成基於更新設計資料D3之內容,例如,變更晶片96內之顯示內容。 In this state, the operator clicks the update button 91 (Replace CAD Data) by the mouse or the like of the operation unit 234, and inputs an instruction by replacing the function of the instruction input display unit 244. As a result, the design information of the work order JT of "AA2" is replaced with the updated design data D3 from the updated design data D1. In conjunction with the replacement operation, the content displayed on the confirmation display unit 92 is switched to the content based on the update design data D3, for example, the display content in the wafer 96 is changed.
操作者確認確認顯示部92之內容等之後,決定設計資料之置換 之情形時,藉由操作部234之滑鼠等點擊OK按鈕93進行輸入指示,完成置換步驟,從而結束工作通知單JT之更新作業。未決定對某一設計資料之置換而研究對其他設計資料之置換之情形時,操作者藉由操作部234之滑鼠等點擊Cancel按鈕94進行輸入指示之後,返回至選擇顯示於歷史顯示部90之其他序列號之設計資料(AAA.gds)之作業。 After confirming the contents of the confirmation display unit 92, etc., the operator determines the replacement of the design data. In this case, the mouse button of the operation unit 234 or the like clicks the OK button 93 to input an instruction, and the replacement step is completed, thereby ending the update operation of the work order JT. When the replacement of a certain design data is not determined and the replacement of the other design data is studied, the operator inputs the instruction by clicking the Cancel button 94 by the mouse of the operation unit 234, and then returns to the selection display on the history display unit 90. The operation of other serial number design materials (AAA.gds).
藉由圖3所示之鎖定資訊輸入顯示部246之功能而顯示於畫面之輸入部(鎖定資訊輸入部)即After輸入部84、Before輸入部85、Upper輸入部86、Under輸入部87及Search按鈕88係於鎖定顯示於歷史顯示部90之更新候補之設計資料時使用。例如,當勾選After輸入部84之複選框,輸入日期之後,點擊Search按鈕88時,僅將關於該日期以後所更新之更新設計資料之資訊顯示於歷史顯示部90。同樣地,當於Before輸入部85輸入日期時,僅將關於該日期以前所更新之更新設計資料之資訊顯示於歷史顯示部90。於After輸入部84及Before輸入部85之兩者輸入日期之情形時,僅將關於特定期間內所更新之更新設計資料之資訊顯示於歷史顯示部90。 The function of the lock information input display unit 246 shown in FIG. 3 is displayed on the input unit (lock information input unit) of the screen, that is, the After input unit 84, the Before input unit 85, the Upper input unit 86, the Under input unit 87, and the Search. The button 88 is used when the design information of the update candidate displayed on the history display unit 90 is locked. For example, when the check box of the After input unit 84 is checked, and after the date is input, when the Search button 88 is clicked, only the information on the updated design data updated after the date is displayed on the history display unit 90. Similarly, when the date is input in the Before input unit 85, only the information on the updated design data updated before the date is displayed on the history display unit 90. When the date is input to both the After input unit 84 and the Before input unit 85, only the information on the updated design data updated in the specific period is displayed on the history display unit 90.
又,例如,當勾選Upper輸入部86之複選框,輸入序列號之後,點擊Search按鈕88時,僅將關於具有該序列號以上之序列號之更新設計資料之資訊顯示於歷史顯示部90。同樣地,當於Under輸入部87輸入序列號時,僅將關於具有該序列號以下之序列號之更新設計資料之資訊顯示於歷史顯示部90。於Upper輸入部86及Under輸入部87之兩者輸入序列號之情形時,僅將關於具有特定序號內之序列號之更新設計資料之資訊顯示於歷史顯示部90。若有此種鎖定資訊輸入顯示部246之功能,則於存在多個可置換之更新設計資料之情形時,可鎖定且減少其數量,因此可有效地進行更新作業。 Further, for example, when the check box of the Upper input unit 86 is checked, and after the serial number is input, when the Search button 88 is clicked, only information on the updated design data having the serial number or higher is displayed on the history display unit 90. . Similarly, when the serial number is input to the Under input unit 87, only the information on the updated design data having the serial number below the serial number is displayed on the history display unit 90. When the serial number is input to both the upper input unit 86 and the Under input unit 87, only the information on the updated design data having the serial number within the specific number is displayed on the history display unit 90. If there is such a function of the lock information input display unit 246, when there are a plurality of replaceable updated design materials, the number can be locked and reduced, so that the update operation can be performed efficiently.
圖6等所示之類型變更部89係於變更輸入至資料名輸入部82之設計資料D0或更新設計資料D1所屬之類型之情形或於未設定類型名之 情形時設定類型名之情形等利用,且輸入變更後之類型名或初始之類型名。 The type changing unit 89 shown in FIG. 6 and the like is a case where the type of the design data D0 or the updated design data D1 input to the material name input unit 82 is changed or the type name is not set. In the case of the case where the type name is set, the type name or the initial type name after the change is input.
接著,參照圖9及圖10對直接描繪裝置100之構成進行說明。圖9係本發明之一實施形態之直接描繪裝置100之側視圖,圖10係圖9所示之直接描繪裝置100之俯視圖。由於直接描繪裝置100為不使用光罩之曝光裝置,故可與各種圖案描繪適宜地對應。又,於具有直接描繪裝置100之圖案描繪系統4中,由於為了與各種圖案對應而頻繁地更新設計資料,因此適宜使用上述圖形使用者介面裝置2。 Next, the configuration of the direct drawing device 100 will be described with reference to FIGS. 9 and 10 . Fig. 9 is a side view of the direct drawing device 100 according to an embodiment of the present invention, and Fig. 10 is a plan view of the direct drawing device 100 shown in Fig. 9. Since the direct drawing device 100 is an exposure device that does not use a photomask, it can appropriately correspond to various pattern drawing. Further, in the pattern drawing system 4 having the direct drawing device 100, since the design data is frequently updated in order to correspond to various patterns, the above-described graphic user interface device 2 is suitably used.
該直接描繪裝置100係於在表面賦予有光阻膜(感光性材料)之半導體基板或玻璃基板等基板W之表面掃描經空間調變之光束而描繪曝光圖案之裝置。具體而言,係用以於多晶片模組之製造步驟中,於形成於描繪對象物即支持基板(以下簡稱為「基板」)W之表面且具有感光性之光阻膜描繪配線圖案之裝置。基板W係圓形狀,於其外周緣之一部分形成有稱為凹槽之缺口。亦有於基板W之外周緣之一部分設置有定向平面替代凹槽之情形。又,直接描繪裝置100係以將基板W內區劃之區塊(晶片)單位實施圖案描繪處理之圖案描繪裝置。另,直接描繪裝置100之描繪動作係使用上述之工作通知單JT而執行。 The direct drawing device 100 is a device that scans a spatially modulated light beam on a surface of a substrate W such as a semiconductor substrate or a glass substrate to which a photoresist film (photosensitive material) is applied, and draws an exposure pattern. Specifically, in the manufacturing process of the multi-wafer module, the device is formed on the surface of the support substrate (hereinafter referred to as "substrate") W, which is a drawing object, and has a photosensitive photoresist film to draw a wiring pattern. . The substrate W has a circular shape, and a notch called a groove is formed in one of the outer peripheral edges thereof. There is also a case where an orientation flat is provided instead of the groove at one of the outer circumferences of the substrate W. Further, the direct drawing device 100 is a pattern drawing device that performs pattern drawing processing on a block (wafer) unit in which the substrate W is divided. Further, the drawing operation of the direct drawing device 100 is executed using the above-described work order JT.
如圖9及圖10所示,直接描繪裝置100主要具備:載物台10,其保持基板W;載物台移動機構20,其係使載物台10移動;位置參數計測機構30,其計測與載物台10之位置對應之位置參數;光學頭部50,其係於基板W之表面照射脈衝光;1個對準攝影機60;及控制部70。 As shown in FIGS. 9 and 10, the direct drawing device 100 mainly includes a stage 10 that holds the substrate W, a stage moving mechanism 20 that moves the stage 10, and a position parameter measuring mechanism 30 that measures a positional parameter corresponding to the position of the stage 10; the optical head 50 is irradiated with pulsed light on the surface of the substrate W; one alignment camera 60; and a control unit 70.
又,於該直接描繪裝置100中,於對本體框架101安裝外罩102所形成之本體內部配置裝置各部而構成本體部,且於本體部之外側(於本實施形態中,如圖9所示,為本體部之+Y側)配置有基板收納盒110。於該基板收納盒110,收納有應接受曝光處理之未處理基板W, 藉由配置於本體內部之搬送機器人120而將該基板W裝載至本體部。又,對未處理基板W實施曝光處理(圖案描繪處理)之後,藉由搬送機器人120將該基板W自本體部卸載且返回至基板收納盒110。如此,搬送機器人120係作為搬送部發揮功能。 Further, in the direct drawing device 100, the main body portion is formed by arranging the respective portions of the device inside the main body formed by attaching the cover 102 to the main body frame 101, and is outside the main body portion (in the present embodiment, as shown in FIG. The substrate storage case 110 is disposed on the +Y side of the main body portion. The substrate storage case 110 houses an unprocessed substrate W to be subjected to exposure processing. The substrate W is loaded onto the main body portion by the transfer robot 120 disposed inside the main body. After the exposure processing (pattern drawing processing) is performed on the unprocessed substrate W, the substrate W is unloaded from the main body portion by the transfer robot 120 and returned to the substrate storage case 110. In this way, the transport robot 120 functions as a transport unit.
於該本體部中,如圖10所示,於外罩102所包圍之本體內部之+Y側端部配置有搬送機器人120。又,於該搬送機器人120之-Y側配置有基台130。該基台130中之一端側區域(圖9及圖10之+Y側區域)成為與搬送機器人120之間進行基板W之交接之基板交接區域。又,基台130中之Y方向中央側區域成為進行對基板W之圖案描繪之圖案描繪區域。頭支持部140係如圖10所示,具備:2條腳構件141,其係自基台130朝上方直立設置;及2條腳構件142,其係於較2條腳構件141更靠近-Y側自基台130朝上方直立設置。又,頭支持部140具備:樑構件143,其係以於2條腳構件141之頂部之間架橋之方式設置;及樑構件144,其係以於2條腳構件142之頂部之間架橋之方式設置。且,如圖9所示,於樑構件143之-Y側固定有對準攝影機(攝像部)60,如後述般可拍攝保持於載物台10之基板W之表面(被描繪面、被曝光面)上之複數個對準標記或下層圖案。 In the main body portion, as shown in FIG. 10, a transfer robot 120 is disposed at the +Y side end portion of the inside of the main body surrounded by the outer cover 102. Further, a base 130 is disposed on the -Y side of the transfer robot 120. One end side region (the +Y side region in FIGS. 9 and 10) of the base 130 serves as a substrate transfer region for transferring the substrate W to and from the transfer robot 120. Further, the center side region in the Y direction of the base 130 serves as a pattern drawing region for patterning the substrate W. As shown in FIG. 10, the head support portion 140 includes two leg members 141 which are erected upward from the base 130, and two leg members 142 which are closer to the Y-leg member 141. The side is placed upright from the base 130 upward. Further, the head supporting portion 140 is provided with a beam member 143 which is provided to bridge between the tops of the two leg members 141, and a beam member 144 which is bridged between the tops of the two leg members 142. Mode setting. Further, as shown in FIG. 9, an alignment camera (image pickup unit) 60 is fixed to the -Y side of the beam member 143, and the surface of the substrate W held by the stage 10 can be imaged as described later (the surface to be drawn is exposed). a plurality of alignment marks or lower patterns on the surface).
支持基板W之支持部即載物台10係於基台130上藉由載物台移動機構20朝X方向、Y方向以及θ方向移動。即,載物台移動機構20係使載物台10於水平面內二維移動而進行定位,且繞θ軸(鉛直軸)旋轉而調整相對於後述之光學頭部50之相對角度進行定位。 The stage 10, which is a support portion for supporting the substrate W, is moved on the base 130 by the stage moving mechanism 20 in the X direction, the Y direction, and the θ direction. In other words, the stage moving mechanism 20 positions the stage 10 in two dimensions in the horizontal plane, and rotates around the θ axis (vertical axis) to adjust the relative angle with respect to the optical head 50 to be described later.
又,光學頭部50係相對於如此般構成之頭支持部140於上下方向自由移動地安裝。如此般對頭支持部140安裝有對準攝影機60與光學頭部50,且將兩者於XY平面內之位置關係固定化。又,該光學頭部50係進行對基板W之圖案描繪者,藉由頭移動機構(省略圖示)於上下方向移動。且,藉由使頭移動機構作動,光學頭部50於上下方向移 動,從而可高精度地調整光學頭部50與保持於載物台10之基板W之距離。如此,光學頭部50係作為描繪頭發揮功能。 Further, the optical head unit 50 is attached to the head support portion 140 configured in such a manner as to be freely movable in the vertical direction. The alignment camera 60 and the optical head 50 are attached to the head supporting portion 140 in such a manner, and the positional relationship between the two is fixed in the XY plane. Further, the optical head unit 50 is formed by patterning the substrate W, and is moved in the vertical direction by a head moving mechanism (not shown). Moreover, the optical head 50 is moved up and down by actuating the head moving mechanism The movement of the optical head 50 and the substrate W held by the stage 10 can be adjusted with high precision. In this manner, the optical head 50 functions as a drawing head.
且,以於2條樑構件143、144、2條腳構件141之頂部、及2條腳構件142之頂部架橋之方式,設置收納有光學頭部50之光學系統之盒172。 Further, the cartridge 172 of the optical system in which the optical head 50 is housed is provided so as to bridge the top of the two beam members 143 and 144 and the two leg members 141 and the top of the two leg members 142.
載物台10具有圓筒狀之外形,係用以將基板W以水平姿勢載置於其上表面而保持之保持部。於載物台10之上表面,形成有複數個吸引孔(省略圖示)。因此,當於載物台10上載置基板W時,基板W係藉由複數個吸引孔之吸引壓而吸附固定於載物台10之上表面。另,於本實施形態成為描繪處理之對象之基板W之表面(主面),藉由旋轉塗布法(旋轉式塗布方法)等預先形成有光阻(感光性材料)膜。 The stage 10 has a cylindrical outer shape and is a holding portion for holding the substrate W on the upper surface thereof in a horizontal posture. A plurality of suction holes (not shown) are formed on the upper surface of the stage 10. Therefore, when the substrate W is placed on the stage 10, the substrate W is adsorbed and fixed to the upper surface of the stage 10 by the suction pressure of the plurality of suction holes. In the surface (main surface) of the substrate W to be subjected to the drawing process in the present embodiment, a photoresist (photosensitive material) film is formed in advance by a spin coating method (rotary coating method) or the like.
載物台移動機構20係用以使載物台10相對於直接描繪裝置100之基台130於主掃描方向(Y軸方向)、副掃描方向(X軸方向)、及旋轉方向(繞Z軸之旋轉方向)移動之機構。載物台移動機構20具有:旋轉機構21,其係使載物台10旋轉;支持板22,其係將載物台10支持為可旋轉;副掃描機構23,其係使支持板22於副掃描方向移動;底板24,其係介隔副掃描機構23而支持支持板22;及主掃描機構25,其係使底板24於主掃描方向移動。 The stage moving mechanism 20 is for positioning the stage 10 with respect to the base 130 of the direct drawing device 100 in the main scanning direction (Y-axis direction), the sub-scanning direction (X-axis direction), and the rotation direction (around the Z-axis). The direction of rotation) the mechanism of movement. The stage moving mechanism 20 has a rotating mechanism 21 that rotates the stage 10, a support plate 22 that supports the stage 10 to be rotatable, and a sub-scanning mechanism 23 that supports the support plate 22 The scanning direction is moved; the bottom plate 24 supports the support plate 22 via the sub-scanning mechanism 23; and the main scanning mechanism 25 moves the bottom plate 24 in the main scanning direction.
旋轉機構21具有:馬達,其係由安裝於載物台10之內部之轉子構成。又,於載物台10之中央部下表面側與支持板22之間設置有旋轉軸承機構。因此,當使馬達動作時,轉子於θ方向移動,載物台10以旋轉軸承機構之旋轉軸為中心而於特定角度之範圍內旋轉。 The rotation mechanism 21 has a motor which is constituted by a rotor attached to the inside of the stage 10. Further, a rotary bearing mechanism is provided between the lower surface side of the central portion of the stage 10 and the support plate 22. Therefore, when the motor is operated, the rotor moves in the θ direction, and the stage 10 rotates within a specific angle around the rotation axis of the rotary bearing mechanism.
副掃描機構23具有線性馬達23a,其係藉由安裝於支持板22之下表面之移動子與敷設於底板24之上表面之固定子而產生副掃描方向之推進力。又,副掃描機構23具有一對導軌23b,其係相對於底板24而沿著副掃描方向引導支持板22。因此,當使線性馬達23a動作時,支 持板22及載物台10沿著底板24上之導軌23b而於副掃描方向移動。 The sub-scanning mechanism 23 has a linear motor 23a which generates a thrust force in the sub-scanning direction by a mover attached to the lower surface of the support plate 22 and a stator attached to the upper surface of the bottom plate 24. Further, the sub-scanning mechanism 23 has a pair of guide rails 23b that guide the support plate 22 in the sub-scanning direction with respect to the bottom plate 24. Therefore, when the linear motor 23a is actuated, The holding plate 22 and the stage 10 are moved in the sub-scanning direction along the guide rail 23b on the bottom plate 24.
主掃描機構25具有線性馬達25a,其係藉由安裝於底板24之下表面之移動子與敷設於頭支持部140之上表面之定子而產生主掃描方向之推進力。又,主掃描機構25具有一對導軌25b,其係相對於頭支持部140而沿著主掃描方向引導底板24。因此,當使線性馬達25a動作時,底板24、支持板22、及載物台10沿著基台130上之導軌25b而於主掃描方向移動。另,作為此種載物台移動機構20,可使用自先前以來大量使用之X-Y-θ軸移動機構。 The main scanning mechanism 25 has a linear motor 25a which generates a thrust force in the main scanning direction by a mover attached to the lower surface of the bottom plate 24 and a stator attached to the upper surface of the head support portion 140. Further, the main scanning mechanism 25 has a pair of guide rails 25b that guide the bottom plate 24 in the main scanning direction with respect to the head support portion 140. Therefore, when the linear motor 25a is operated, the bottom plate 24, the support plate 22, and the stage 10 are moved in the main scanning direction along the guide rail 25b on the base 130. Further, as such a stage moving mechanism 20, an X-Y-θ axis moving mechanism which has been used in a large amount since the prior art can be used.
位置參數計測機構30係用以利用雷射光之干涉而計測關於載物台10之位置參數之機構。位置參數計測機構30主要具有雷射光出射部31、光束分光器32、光束彎曲機33、第1干涉計34及第2干涉計35。 The position parameter measuring mechanism 30 is a mechanism for measuring the positional parameter of the stage 10 by the interference of the laser light. The position parameter measuring mechanism 30 mainly includes a laser light emitting unit 31, a beam splitter 32, a beam bending machine 33, a first interferometer 34, and a second interferometer 35.
雷射光出射部31係用以出射計測用之雷射光之光源裝置。雷射光出射部31係設置於固定位置、即相對於本裝置之基台130或光學頭部50固定之位置。自雷射光出射部31出射之雷射光係首先入射至光束分光器32,而分支成自光束分光器32朝向光束彎曲機33之第1分支光、與自光束分光器32朝向第2干涉計35之第2分支光。 The laser light emitting portion 31 is a light source device for emitting laser light for measurement. The laser light emitting portion 31 is provided at a fixed position, that is, a position fixed to the base 130 or the optical head 50 of the device. The laser light emitted from the laser light exiting portion 31 is first incident on the beam splitter 32, and branched into the first branched light from the beam splitter 32 toward the beam bending machine 33, and from the beam splitter 32 toward the second interferometer 35. The second branch light.
第1分支光係藉由光束彎曲機33反射而入射至第1干涉計34,且自第1干涉計34照射至載物台10之-Y側之端邊之第1部位(此處為-Y側之端邊之中央部)10a。且,於第1部位10a中反射之第1分支光係再次入射至第1干涉計34。第1干涉計34係基於朝向載物台10之第1分支光與自載物台10反射之第1分支光之干涉,計測與載物台10之第1部位10a之位置對應之位置參數。 The first branched light system is reflected by the beam bending machine 33 and enters the first interferometer 34, and is irradiated from the first interferometer 34 to the first portion of the end side of the -Y side of the stage 10 (here - The central portion of the end side of the Y side) 10a. Then, the first branched light system reflected in the first portion 10a is incident on the first interferometer 34 again. The first interferometer 34 measures the positional parameter corresponding to the position of the first portion 10a of the stage 10 based on the interference between the first branched light that is directed toward the stage 10 and the first branched light that is reflected from the stage 10.
另一方面,第2分支光係入射至第2干涉計35,且自第2干涉計35照射至載物台10之-Y側之端邊之第2部位(與第1部位10a不同之部位)10b。且,於第2部位10b中反射之第2分支光係再次入射至第2干涉計35。第2干涉計35係基於朝向載物台10之第2分支光與自載物台10反 射之第2分支光之干涉,計測與載物台10之第2部位10b之位置對應之位置參數。第1干涉計34及第2干涉計35係將藉由各個計測所取得之位置參數發送至控制部70。 On the other hand, the second branch light is incident on the second interferometer 35, and is irradiated from the second interferometer 35 to the second portion (the portion different from the first portion 10a) on the side of the -Y side of the stage 10. ) 10b. Further, the second branched light system reflected in the second portion 10b is again incident on the second interferometer 35. The second interferometer 35 is based on the second branch light directed toward the stage 10 and the self-loading stage 10 The interference of the second branch light of the shot is measured, and the positional parameter corresponding to the position of the second portion 10b of the stage 10 is measured. The first interferometer 34 and the second interferometer 35 transmit the positional parameters obtained by the respective measurements to the control unit 70.
光學頭部50係向保持於載物台10上之基板W之表面照射脈衝光之光照射部。樑構件143係以跨越載物台10及載物台移動機構20之方式架設於基台130上,光學頭部50係設置於樑構件143上之副掃描方向之大致中央。光學頭部50係經由照明光學系統53而連接於1個雷射振盪器54。又,於光源即雷射振盪器54,連接有進行雷射振盪器54之驅動之雷射驅動部55。當使雷射驅動部55動作時,脈衝光自雷射振盪器54出射,該脈衝光經由照明光學系統53而導入至光學頭部50之內部。 The optical head 50 is a light irradiation unit that irradiates the surface of the substrate W held on the stage 10 with pulsed light. The beam member 143 is mounted on the base 130 so as to straddle the stage 10 and the stage moving mechanism 20, and the optical head 50 is disposed substantially at the center of the beam member 143 in the sub-scanning direction. The optical head 50 is connected to one laser oscillator 54 via an illumination optical system 53. Further, a laser drive unit 55 that drives the laser oscillator 54 is connected to the laser oscillator 54, which is a light source. When the laser driving unit 55 is operated, pulsed light is emitted from the laser oscillator 54, and the pulsed light is introduced into the optical head 50 via the illumination optical system 53.
於光學頭部50之內部,自照明光學系統53至光學頭部50之內部由導入部導入脈衝光,經導入之脈衝光係作為成形為特定之圖案形狀之光束而將脈衝光照射至基板W之表面,將基板W上之光阻膜(感光層)曝光,藉此於基板W之表面描繪圖案。 Inside the optical head 50, pulse light is introduced from the illumination optical system 53 to the inside of the optical head 50 by the introduction portion, and the introduced pulse light is irradiated to the substrate W as a light beam shaped into a specific pattern shape. On the surface, the photoresist film (photosensitive layer) on the substrate W is exposed, whereby a pattern is drawn on the surface of the substrate W.
於圖9之直接描繪裝置100中,將光源即雷射振盪器54設置於盒172內,經由照明光學系統53將來自雷射振盪器54之光導入至光學頭部50之內部。於本實施形態之基板W之主面上預先形成有藉由紫外線之照射而感光之光阻(感光性材料)膜,雷射振盪器54係出射波長λ為約365nm之紫外線(i線)之雷射光源。當然,雷射振盪器54亦可為出射基板W之感光性材料感光之波長帶所包含之其他波長之光者。 In the direct drawing device 100 of FIG. 9, a laser oscillator 54, which is a light source, is placed in the cartridge 172, and light from the laser oscillator 54 is introduced into the optical head 50 via the illumination optical system 53. On the main surface of the substrate W of the present embodiment, a photoresist (photosensitive material) film which is exposed by ultraviolet light is formed in advance, and the laser oscillator 54 emits ultraviolet rays (i-line) having a wavelength λ of about 365 nm. Laser source. Of course, the laser oscillator 54 may also be light of other wavelengths included in the wavelength band of the photosensitive material that emits the substrate W.
圖11係顯示直接描繪裝置100之照明光學系統53及投影光學系統517之圖。來自圖9所示之雷射振盪器54之光係經由圖11所示之照明光學系統53及鏡面516,而照射至光調變單元512之空間光調變器511。以空間光調變器511空間調變後之光係經由投影光學系統517而照射至載物台10所支持之基板W上。 FIG. 11 is a view showing the illumination optical system 53 and the projection optical system 517 of the direct drawing device 100. The light from the laser oscillator 54 shown in FIG. 9 is irradiated to the spatial light modulator 511 of the light modulation unit 512 via the illumination optical system 53 and the mirror 516 shown in FIG. The light that has been spatially modulated by the spatial light modulator 511 is irradiated onto the substrate W supported by the stage 10 via the projection optical system 517.
照明光學系統53具備望遠鏡540、聚光透鏡541、衰減器542及聚 焦透鏡543。望遠鏡540具有將光(雷射光束)之光束直徑(剖面形狀)於X及Z方向擴展之功能,且包含3片透鏡。聚光透鏡541具有將雷射光束於X方向擴展之功能。衰減器542係調整通過之雷射光束之能量(透射量)。聚焦透鏡543具有使雷射光束之剖面尺寸於Z方向縮小之功能。自聚焦透鏡543出射之光(雷射光束)係經由鏡面516而作為於X方向延伸且於Y方向經縮小之線狀之照明光照射至空間光調變器511。另,照明光學系統53無須必定如圖11所示般構成,亦可追加其他光學元件。 The illumination optical system 53 includes a telescope 540, a collecting lens 541, an attenuator 542, and a collecting device. Focus lens 543. The telescope 540 has a function of expanding the beam diameter (cross-sectional shape) of the light (laser beam) in the X and Z directions, and includes three lenses. The condenser lens 541 has a function of expanding the laser beam in the X direction. The attenuator 542 adjusts the energy (transmittance) of the laser beam passing therethrough. The focus lens 543 has a function of reducing the cross-sectional size of the laser beam in the Z direction. The light (laser beam) emitted from the self-focusing lens 543 is irradiated to the spatial light modulator 511 as illumination light that extends in the X direction and is reduced in the Y direction via the mirror surface 516. Further, the illumination optical system 53 does not have to be configured as shown in FIG. 11, and other optical elements may be added.
自照明光學系統53照射至空間光調變器511之光係為了使自空間光調變器511反射之正反射光(0次光)通過後述之投影光學系統之遮蔽板521之開口,且以遮蔽板521遮蔽自空間光調變器511產生之(±1)次繞射光,較佳為接近於平行光者。因此,將照明光學系統53之開口數NA1設定為大於0(零),且0.06以下。另,開口數NA1係當將於X方向延伸之線狀之照明光貫通之YZ平面之照明光相對於光軸之最大角度設為θ1時,藉由NA1=n.sinθ1求出。其中,n為媒質之折射率,本實施形態之情形時,由於媒質為空氣,故折射率n為1。 The light emitted from the illumination optical system 53 to the spatial light modulator 511 is such that the regular reflection light (zero-order light) reflected from the spatial light modulator 511 passes through the opening of the shielding plate 521 of the projection optical system to be described later, and The shielding plate 521 shields (±1) times of diffracted light generated from the spatial light modulator 511, preferably close to parallel light. Therefore, the number of openings NA1 of the illumination optical system 53 is set to be larger than 0 (zero), and 0.06 or less. Further, the number of openings NA1 is defined by NA1=n when the maximum angle of the illumination light of the YZ plane through which the linear illumination light extending in the X direction passes is set to θ1 with respect to the optical axis. Sin θ1 is obtained. Here, n is the refractive index of the medium. In the case of the present embodiment, since the medium is air, the refractive index n is 1.
投影光學系統517具備4片透鏡518、519、520、522、與遮蔽板(光圈構件)521、變焦透鏡523及聚焦透鏡524。投影光學系統517之透鏡518、519、520、522及遮蔽板521構築成為兩側遠心之异離體(Schrieren)光學系統,通過透鏡520之光係向具有開口之遮蔽板521導入,一部分之光(正反射光(0次光))係通過開口向透鏡522導入,剩餘之光((±1)次繞射光)係以遮蔽板521遮蔽。通過透鏡522之光係向變焦透鏡523導入,經由聚焦透鏡524以特定之倍率向基板W上之光阻膜(感光性材料)導入。另,投影光學系統517不必完全如圖11所示般構成,亦可追加其他光學元件。 The projection optical system 517 includes four lenses 518, 519, 520, and 522, a shielding plate (aperture member) 521, a zoom lens 523, and a focus lens 524. The lenses 518, 519, 520, and 522 of the projection optical system 517 and the shielding plate 521 are constructed as a two-sided telecentric optical system, and are guided by the light of the lens 520 to the shielding plate 521 having an opening, and a part of the light is introduced. (Regular reflection light (zero-order light)) is introduced into the lens 522 through the opening, and the remaining light ((±1) times of diffracted light) is shielded by the shielding plate 521. The light passing through the lens 522 is introduced into the zoom lens 523, and introduced into the photoresist film (photosensitive material) on the substrate W at a specific magnification via the focus lens 524. Further, the projection optical system 517 does not have to be completely configured as shown in FIG. 11, and other optical elements may be added.
為了減小照射至與焦點位置(聚焦位置)相應之基板W上之光之直 徑(寬度)之變化,必須將投影光學系統517之景深設定為較長(較深)。因此,投影光學系統517之開口數NA2較佳為較小,設定為例如0.1。另,開口數NA2係當將於X方向延伸之線狀之投影光貫通之YZ平面之投影光相對於光軸之最大角度設為θ2時,藉由NA2=n.sinθ2求出。其中,n為媒質之折射率,本實施形態之情形時,由於媒質為空氣,故折射率n為1。 In order to reduce the light that is irradiated onto the substrate W corresponding to the focus position (focus position) The change in the diameter (width) must set the depth of field of the projection optical system 517 to be long (deep). Therefore, the number of openings NA2 of the projection optical system 517 is preferably small, and is set to, for example, 0.1. Further, the number of openings NA2 is defined by NA2=n when the maximum angle of the projection light of the YZ plane through which the linear projection light extending in the X direction passes is set to θ2 with respect to the optical axis. Sin θ2 is obtained. Here, n is the refractive index of the medium. In the case of the present embodiment, since the medium is air, the refractive index n is 1.
以投影光學系統517之開口數NA2除照明光學系統53之開口數NA1而得之值(σ值)係如上所述,為了將空間光調變器511所反射之正反射光以所需之形狀照射至基板W上,較佳為接近於0者,例如設定為大於0且0.6以下。 The value (σ value) obtained by dividing the aperture number NA1 of the illumination optical system 53 by the aperture number NA2 of the projection optical system 517 is as described above, in order to convert the regular reflection light reflected by the spatial light modulator 511 into a desired shape. The irradiation onto the substrate W is preferably close to zero, and is set to be, for example, greater than 0 and 0.6 or less.
於空間光調變器511電性連接有進行光調變單元512之調變控制之描繪控制部515。描繪控制部515及投影光學系統517係內置於光學頭部50。於描繪控制部515,分別電性連接有曝光控制部514與描繪信號處理部513。於曝光控制部514,電性連接有描繪信號處理部513與載物台移動機構20。曝光控制部514及描繪信號處理部513係設置於圖13之控制部70內。 A rendering control unit 515 that performs modulation control of the optical modulation unit 512 is electrically connected to the spatial light modulator 511. The drawing control unit 515 and the projection optical system 517 are built in the optical head unit 50. The drawing control unit 515 is electrically connected to the exposure control unit 514 and the drawing signal processing unit 513, respectively. The drawing control unit 514 is electrically connected to the drawing signal processing unit 513 and the stage moving mechanism 20. The exposure control unit 514 and the rendering signal processing unit 513 are provided in the control unit 70 of Fig. 13 .
圖12係放大顯示空間光調變器511之圖。圖12所示之空間光調變器511係利用半導體裝置製造技術而製造,採用可變更晶格之深度之繞射晶格。於空間光調變器511交替平行地排列形成複數個可動帶530a及固定帶531b,如後述般,可動帶530a可相對於背後之基準面個別地升降移動,固定帶531b相對於基準面固定。作為繞射晶格型之空間光調變器,例如已知有GLV(Grating Light Valve:光柵光閥)(Silicon Light Machines(聖荷西,加利福尼亞州)之註冊商標)。 Figure 12 is a diagram showing an enlarged view of the spatial light modulator 511. The spatial light modulator 511 shown in Fig. 12 is manufactured by a semiconductor device manufacturing technique, and employs a diffraction lattice in which the depth of the crystal lattice can be changed. The plurality of movable belts 530a and the fixed belt 531b are alternately arranged in parallel with each other in the spatial light modulator 511. As will be described later, the movable belt 530a can be moved up and down individually with respect to the reference plane on the back side, and the fixed belt 531b is fixed to the reference surface. As a spatial lattice modulator of a diffraction lattice type, for example, a GLV (Grating Light Valve) (registered trademark of Silicon Light Machines (San Jose, Calif.)) is known.
於固定帶531b之上表面設置有固定反射面,於可動帶530a之上表面設置有可動反射面。於複數個可動帶530a及固定帶531b上,照射光束剖面於排列方向上較長之線狀之光。於空間光調變器511中,若對 鄰接之各1條可動帶530a及固定帶531b,將1個帶對設為晶格要素,則相互鄰接之3個以上之晶格要素對應於描繪之圖案之1個像素。於本實施形態中,將相互鄰接之4個晶格要素之集合設為與1個像素對應之調變元件,於圖12中,將構成1個調變元件之帶對之集合以標註有符號535之粗線之矩形包圍。 A fixed reflecting surface is provided on the upper surface of the fixing belt 531b, and a movable reflecting surface is provided on the upper surface of the movable belt 530a. The plurality of movable belts 530a and the fixed belt 531b are irradiated with light having a linear cross section in the arrangement direction. In the spatial light modulator 511, if Each of the adjacent movable belts 530a and 531b has one belt pair as a lattice element, and three or more lattice elements adjacent to each other correspond to one pixel of the drawn pattern. In the present embodiment, a set of four lattice elements adjacent to each other is a modulation element corresponding to one pixel, and in FIG. 12, a set of pairs of one modulation element is marked with a symbol. The rectangle of 535 is surrounded by a rectangle.
驅動器電路單元536係藉由於可動帶530a與基準面之間給予電壓(電位差),而使可動帶530a向基準面側彎曲。其結果,可動帶530a於自基準面分離之初始位置、與接觸於基準面之位置之間升降移動,而設定可動帶530a之高度位置。 The driver circuit unit 536 bends the movable belt 530a toward the reference surface side by applying a voltage (potential difference) between the movable belt 530a and the reference surface. As a result, the movable belt 530a moves up and down between the initial position separated from the reference surface and the position in contact with the reference surface, and sets the height position of the movable belt 530a.
圖9所示之控制部70係用以一面執行各種運算處理,一面控制直接描繪裝置100內之各部之動作之資訊處理部。圖13係顯示直接描繪裝置100之上述各部與控制部70之間之連接構成之方塊圖。如圖13所示,控制部70係與上述之旋轉機構21、線性馬達23a、25a、雷射光出射部31、第1干涉計34、第2干涉計35、照明光學系統53、雷射驅動部55、投影光學系統517及對準攝影機60電性連接。控制部70係例如由具有CPU或記憶體之電腦構成,且使電腦根據安裝於電腦之程式動作,藉此進行上述各部之動作控制。 The control unit 70 shown in FIG. 9 is an information processing unit that controls the operation of each unit in the direct drawing device 100 while performing various kinds of arithmetic processing. FIG. 13 is a block diagram showing the connection between the above-described respective units of the direct drawing device 100 and the control unit 70. As shown in FIG. 13, the control unit 70 is connected to the above-described rotating mechanism 21, linear motors 23a and 25a, laser light emitting unit 31, first interferometer 34, second interferometer 35, illumination optical system 53, and laser drive unit. 55. The projection optical system 517 and the alignment camera 60 are electrically connected. The control unit 70 is configured by, for example, a computer having a CPU or a memory, and causes the computer to operate in accordance with a program installed on the computer, thereby performing operation control of each of the above units.
又,控制部70包含具有CPU或記憶體72等之電腦71、與曝光控制部514。圖14係顯示控制描繪動作之控制部之方塊圖。電腦71內之CPU根據特定之程式進行運算處理,藉此實現光柵處理部73及資料產生部75。 Further, the control unit 70 includes a computer 71 having a CPU, a memory 72, and the like, and an exposure control unit 514. Fig. 14 is a block diagram showing a control unit for controlling the drawing operation. The CPU in the computer 71 performs arithmetic processing in accordance with a specific program, thereby realizing the raster processing unit 73 and the data generating unit 75.
相當於例如1個半導體封裝之圖案之資料係藉由外部之CAD等所產生之圖案資料,預先作為配線圖案資料76準備於記憶體72。基於該配線圖案資料76與資料產生部75而如後述般將半導體封裝之描繪圖案描繪於基板W上。另,此處,電腦71擔負圖11所示之描繪信號處理部513之功能。 The data corresponding to, for example, the pattern of one semiconductor package is prepared in advance as the wiring pattern data 76 in the memory 72 by pattern data generated by external CAD or the like. The drawing pattern of the semiconductor package is drawn on the substrate W based on the wiring pattern data 76 and the data generating unit 75 as will be described later. Here, the computer 71 functions as the drawing signal processing unit 513 shown in FIG.
上述配線圖案資料76相當於自圖1所示之設計資料製作裝置1經由網路N發送至直接描繪裝置100之上述之設計資料D0或更新設計資料D1等。又,於記憶體72亦保存有自圖像處理裝置2經由網路N發送至直接描繪裝置100之上述工作通知單JT。 The wiring pattern data 76 corresponds to the above-described design data D0 or updated design data D1 transmitted from the design material creation device 1 shown in FIG. 1 to the direct drawing device 100 via the network N. Further, the above-described work notification JT transmitted from the image processing device 2 to the direct drawing device 100 via the network N is also stored in the memory 72.
光柵處理部73係將藉由資料產生部75所產生之描繪資料表示之單位區域分割而進行光柵處理,產生光柵資料77而保存於記憶體72。如此於光柵資料77之準備後、或與光柵資料77之準備並行,而描繪未處理之基板W。上述之光柵處理係根據上述工作通知單JT所定義之RIP展開處理等執行,而產生相當於本案發明之描繪資料之光柵資料77。 The raster processing unit 73 performs raster processing by dividing the unit area indicated by the drawing data generated by the data generating unit 75, and generates raster data 77 and stores it in the memory 72. The unprocessed substrate W is depicted after the preparation of the raster data 77 or in parallel with the preparation of the raster data 77. The above-described raster processing is performed in accordance with the RIP expansion processing defined by the above-mentioned work order JT, and raster information 77 corresponding to the drawing material of the present invention is generated.
如此所產生之描繪資料係自資料產生部75傳送至曝光控制部514,藉由使曝光控制部514控制光調變單元512、載物台移動機構20之各部而進行1條量之描繪。另,藉由曝光控制部514進行之光調變單元512之控制係如圖11所示般經由描繪控制部515執行。且,當對1條之曝光記錄結束時,對下一個分割區域進行相同之處理,對每條反復進行描繪。於本實施形態中,本發明之控制部係藉由控制部70、描繪控制部515、曝光控制部514及驅動器電路單元536等而實現。 The drawing data thus generated is transmitted from the data generating unit 75 to the exposure control unit 514, and the exposure control unit 514 controls each of the optical modulation unit 512 and the stage moving mechanism 20 to perform one-dimensional drawing. The control of the light modulation unit 512 by the exposure control unit 514 is executed via the drawing control unit 515 as shown in FIG. Further, when the exposure recording for one piece is completed, the same processing is performed on the next divided area, and each piece is repeatedly drawn. In the present embodiment, the control unit of the present invention is realized by the control unit 70, the drawing control unit 515, the exposure control unit 514, the driver circuit unit 536, and the like.
又,直接描繪裝置100係於每條之描繪動作時,藉由經由圖11所示之描繪控制部515執行之由曝光控制部514進行之光調變單元512之控制,基於對區劃基板W之複數個區塊(晶片)之各者所設定之曝光條件而以區塊單位執行曝光動作。該區塊(晶片)相當於顯示於圖8所示之確認顯示部92之晶片96。 Further, when the direct drawing device 100 is controlled by the light control unit 512 by the exposure control unit 514, which is executed by the drawing control unit 515 shown in FIG. 11, the direct drawing device 100 is based on the division substrate W. The exposure conditions set by each of a plurality of blocks (wafers) are performed in units of blocks. This block (wafer) corresponds to the wafer 96 shown on the confirmation display portion 92 shown in FIG.
於本實施形態中,將圖14所示之電腦71設置於直接描繪裝置100,但亦可將該電腦71設置於圖1所示之圖像處理裝置3內。該情形時,由圖像處理裝置3執行上述光柵處理(RIP展開)等,將所產生之光柵資料(描繪資料)經由網路N而發送至直接描繪裝置100。 In the present embodiment, the computer 71 shown in FIG. 14 is installed in the direct drawing device 100. However, the computer 71 may be provided in the image processing device 3 shown in FIG. 1. In this case, the image processing device 3 executes the above-described raster processing (RIP expansion) or the like, and transmits the generated raster data (drawing data) to the direct drawing device 100 via the network N.
該直接描繪裝置100具有基於上述之第1干涉計34、第2干涉計35之各計測結果而控制載物台10之位置之功能。以下,對此種載物台10之位置控制進行說明。 The direct drawing device 100 has a function of controlling the position of the stage 10 based on the respective measurement results of the first interferometer 34 and the second interferometer 35 described above. Hereinafter, the position control of the stage 10 will be described.
如已述般,第1干涉計34及第2干涉計35係分別計測與載物台10之第1部位10a及第2部位10b之位置對應之位置參數。第1干涉計34及第2干涉計35係將藉由各個計測所取得之位置參數發送至控制部70。如圖14所示,控制部70具有作為算出部之電腦71。該電腦71之功能係例如藉由使電腦71之CPU根據特定之程式動作而實現。 As described above, the first interferometer 34 and the second interferometer 35 measure positional parameters corresponding to the positions of the first portion 10a and the second portion 10b of the stage 10, respectively. The first interferometer 34 and the second interferometer 35 transmit the positional parameters obtained by the respective measurements to the control unit 70. As shown in FIG. 14, the control unit 70 has a computer 71 as a calculation unit. The function of the computer 71 is realized, for example, by causing the CPU of the computer 71 to operate according to a specific program.
另一方面,控制部70係基於自第1干涉計34及第2干涉計35發送之位置參數而算出載物台10之位置(Y軸方向之位置及繞Z軸之旋轉角度)。接著,控制部70一面參照所算出之載物台10之位置,一面使載物台移動機構20動作,藉此正確控制載物台10之位置或載物台10之移動速度。此處,控制部70係藉由使載物台10繞Z軸旋轉,亦修正主掃描方向之移動所引起之載物台10之傾斜(繞Z軸之旋轉角度之偏移)。又,控制部70一面參照所算出之載物台10之位置,一面使雷射驅動部55動作,藉此正確控制脈衝光對基板W之表面之照射位置。 On the other hand, the control unit 70 calculates the position (the position in the Y-axis direction and the rotation angle around the Z-axis) of the stage 10 based on the positional parameters transmitted from the first interferometer 34 and the second interferometer 35. Next, the control unit 70 operates the stage moving mechanism 20 with reference to the calculated position of the stage 10, thereby accurately controlling the position of the stage 10 or the moving speed of the stage 10. Here, the control unit 70 also corrects the inclination of the stage 10 (offset of the rotation angle about the Z axis) caused by the movement in the main scanning direction by rotating the stage 10 about the Z axis. Moreover, the control unit 70 operates the laser drive unit 55 while referring to the calculated position of the stage 10, thereby accurately controlling the irradiation position of the pulse light on the surface of the substrate W.
接著,參照圖15之流程圖對上述之直接描繪裝置100之動作之一例進行說明。 Next, an example of the operation of the above-described direct drawing device 100 will be described with reference to a flowchart of FIG.
於直接描繪裝置100中進行基板W之處理時,首先,進行調整自光學頭部50照射之脈衝光之位置或光量之校準處理(步驟S1)。於校準處理中,首先,藉由移動底板24,而將未圖示之CCD相機配置於光學頭部50之下方。然後,一面使CCD相機於副掃描方向移動,一面自光學頭部50照射脈衝光,藉由CCD相機拍攝所照射之脈衝光。控制部70係基於所取得之圖像資料,使光學頭部50之照明光學系統53動作,藉 此,調整自光學頭部50照射之脈衝光之位置或光量。 When the substrate W is processed in the direct drawing device 100, first, a calibration process of adjusting the position or amount of the pulsed light irradiated from the optical head 50 is performed (step S1). In the calibration process, first, a CCD camera (not shown) is placed below the optical head 50 by moving the bottom plate 24. Then, while the CCD camera is moved in the sub-scanning direction, pulsed light is irradiated from the optical head 50, and the pulsed light is irradiated by the CCD camera. The control unit 70 operates the illumination optical system 53 of the optical head 50 based on the acquired image data. Thereby, the position or amount of the pulsed light irradiated from the optical head 50 is adjusted.
當校準處理完成時,接著,作業者或搬送機器人120搬入基板W且載置於載物台10之上表面(步驟S2)。 When the calibration process is completed, the operator or the transfer robot 120 then loads the substrate W and mounts it on the upper surface of the stage 10 (step S2).
接著,直接描繪裝置100進行調整載置於載物台10上之基板W與光學頭部50之相對位置之對準處理(步驟S3)。於上述之步驟S2中,基板W係載置於載物台10上之大致特定之位置,但作為用以描繪微細之圖案之位置精度而言並不充分之情形較多。因此,藉由進行對準處理而將基板W之位置或傾斜度進行微調整,從而提高後續之描繪處理之精度。 Next, the direct drawing device 100 performs an alignment process of adjusting the relative positions of the substrate W placed on the stage 10 and the optical head 50 (step S3). In the above-described step S2, the substrate W is placed at a substantially specific position on the stage 10, but it is often insufficient as a positional accuracy for drawing a fine pattern. Therefore, the position or inclination of the substrate W is finely adjusted by performing the alignment process, thereby improving the accuracy of the subsequent drawing process.
於對準處理中,首先,藉由對準攝影機60分別拍攝形成於基板W之上表面之四角之對準標記。控制部70係基於藉由對準攝影機60所取得之圖像中之各對準標記之位置,而算出基板W之距理想位置之偏移量(X軸方向之位置偏移量、Y軸方向之位置偏移量、及繞Z軸之傾斜量)。然後,藉由使載物台移動機構20朝降低所算出之偏移量之方向動作,而修正基板W之位置。 In the alignment process, first, alignment marks formed on the four corners of the upper surface of the substrate W are respectively photographed by the alignment camera 60. The control unit 70 calculates the offset amount of the substrate W from the ideal position based on the position of each alignment mark in the image obtained by the alignment camera 60 (the positional shift amount in the X-axis direction and the Y-axis direction). The positional offset and the amount of tilt around the Z axis). Then, the position of the substrate W is corrected by operating the stage moving mechanism 20 in the direction of lowering the calculated offset amount.
接著,直接描繪裝置100對對準處理後之基板W進行描繪處理(步驟S4)。即,直接描繪裝置100一面使載物台10朝主掃描方向及副掃描方向移動,一面自光學頭部50向基板W之上表面照射脈衝光,藉此於基板W之上表面對區劃基板W內之複數個區塊各者描繪規則性圖案。該描繪動作係基於上述描繪資料而執行。 Next, the direct drawing device 100 performs drawing processing on the substrate W after the alignment processing (step S4). In other words, the direct drawing device 100 irradiates the upper surface of the substrate W with the pulse light from the optical head 50 while moving the stage 10 in the main scanning direction and the sub-scanning direction, thereby dicing the substrate W on the upper surface of the substrate W. Each of the plurality of blocks within the port depicts a regular pattern. This drawing operation is performed based on the above-described drawing material.
當描繪處理完成時,直接描繪裝置100使載物台移動機構20動作而使載物台10及基板W移動於搬出位置。然後,作業者或搬送機器人120自載物台10之上表面搬出基板W(步驟S5)。 When the drawing process is completed, the direct drawing device 100 operates the stage moving mechanism 20 to move the stage 10 and the substrate W to the carry-out position. Then, the operator or the transfer robot 120 carries out the substrate W from the upper surface of the stage 10 (step S5).
於上述實施形態之直接描繪裝置100中,係基板W相對於光學頭部50等移動之構成,但亦可使光學頭部50等相對於經固體支持之基板 W移動,而實現相對移動。 In the direct drawing device 100 of the above-described embodiment, the substrate W is moved relative to the optical head 50 or the like, but the optical head 50 or the like may be opposed to the substrate supported by the solid. W moves while achieving relative movement.
圖案描繪裝置並不限於如上述般對供晶片等形成之基板W描繪圖案之直接描繪裝置100,例如,亦可為對應設為用於曝光處理之光罩之基板描繪圖案之圖案描繪裝置。 The pattern drawing device is not limited to the direct drawing device 100 for patterning a substrate W formed of a wafer or the like as described above, and may be, for example, a pattern drawing device corresponding to a substrate drawing pattern of a photomask for exposure processing.
81‧‧‧類型輸入部 81‧‧‧ Type Input Department
82‧‧‧資料名輸入部 82‧‧‧Information Name Input Department
83‧‧‧通知單列表顯示部 83‧‧‧Notice list display
84‧‧‧After輸入部 84‧‧‧After Input Department
85‧‧‧Before輸入部 85‧‧‧Before input department
86‧‧‧Upper輸入部 86‧‧‧Upper Input Department
87‧‧‧Under輸入部 87‧‧‧Under Input Department
88‧‧‧Search按鈕 88‧‧‧Search button
89‧‧‧類型變更部 89‧‧‧Type Change Department
90‧‧‧歷史顯示部 90‧‧‧History Display Department
91‧‧‧更新按鈕 91‧‧‧Update button
92‧‧‧確認顯示部 92‧‧‧Confirmation display
93‧‧‧OK按鈕 93‧‧‧OK button
94‧‧‧Cancel按鈕 94‧‧‧Cancel button
95‧‧‧基板外形 95‧‧‧Substrate shape
96‧‧‧晶片(區塊) 96‧‧‧ wafer (block)
97‧‧‧區域 97‧‧‧Area
200‧‧‧顯示部 200‧‧‧Display Department
Claims (9)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014027284A JP6389040B2 (en) | 2014-02-17 | 2014-02-17 | GUI apparatus, pattern drawing system, job ticket update method and program for pattern drawing apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201543173A TW201543173A (en) | 2015-11-16 |
TWI553425B true TWI553425B (en) | 2016-10-11 |
Family
ID=53799991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104105415A TWI553425B (en) | 2014-02-17 | 2015-02-16 | Gui device for pattern drawing device, pattern drawing system, method for updating job ticket and recording medium |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6389040B2 (en) |
KR (1) | KR101800990B1 (en) |
CN (1) | CN105992997B (en) |
TW (1) | TWI553425B (en) |
WO (1) | WO2015122243A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112231039B (en) * | 2020-10-23 | 2023-09-19 | 岭东核电有限公司 | Work order information statistical method, device, computer equipment and storage medium |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080205767A1 (en) * | 2007-02-14 | 2008-08-28 | Fujifilm Corporation | Extraction method, extraction apparatus, program, drawing data creation method, and drawing data creation apparatus |
TW201314376A (en) * | 2011-09-30 | 2013-04-01 | Dainippon Screen Mfg | Image display apparatus for direct drawing apparatus and recording medium |
TW201329642A (en) * | 2011-09-07 | 2013-07-16 | Dainippon Screen Mfg | Drawing apparatus and drawing method |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4265722B2 (en) * | 2000-08-07 | 2009-05-20 | 富士通マイクロエレクトロニクス株式会社 | Pattern data correction method and apparatus |
JP2006162956A (en) * | 2004-12-07 | 2006-06-22 | Dainippon Screen Mfg Co Ltd | Generating device for pattern formation data, generating system for pattern formation data and method for generating the pattern formation data |
US20060123381A1 (en) * | 2004-12-07 | 2006-06-08 | Dainippon Screen Mfg. Co., Ltd. | Data generating system, patterning data generating apparatus, method of generating patterning data and storage medium carrying patterning data |
JP2008197451A (en) * | 2007-02-14 | 2008-08-28 | Fujifilm Corp | Extraction method, extraction device, and program |
JP2008242356A (en) * | 2007-03-29 | 2008-10-09 | Fujifilm Corp | Method and apparatus for creating drawing data |
KR20090063414A (en) * | 2007-12-14 | 2009-06-18 | 김순필 | Program for computer test |
KR20100077301A (en) * | 2008-12-29 | 2010-07-08 | 박영미 | The system for computer program |
JP5731864B2 (en) * | 2011-03-18 | 2015-06-10 | 株式会社Screenホールディングス | Drawing data correction device and drawing device |
KR20120130124A (en) * | 2011-05-20 | 2012-11-29 | 가부시키가이샤 히다치 하이테크놀로지즈 | Light exposure device, light exposure method, and manufactuiring method of display panel substrate, and inspection method of light exposure device |
JP5801674B2 (en) | 2011-09-30 | 2015-10-28 | 株式会社Screenホールディングス | Image display device and program for direct drawing device |
JP5946620B2 (en) * | 2011-09-30 | 2016-07-06 | 株式会社Screenホールディングス | Image display device and program for direct drawing device |
-
2014
- 2014-02-17 JP JP2014027284A patent/JP6389040B2/en active Active
-
2015
- 2015-01-20 WO PCT/JP2015/051355 patent/WO2015122243A1/en active Application Filing
- 2015-01-20 KR KR1020167016862A patent/KR101800990B1/en active IP Right Grant
- 2015-01-20 CN CN201580008338.4A patent/CN105992997B/en active Active
- 2015-02-16 TW TW104105415A patent/TWI553425B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080205767A1 (en) * | 2007-02-14 | 2008-08-28 | Fujifilm Corporation | Extraction method, extraction apparatus, program, drawing data creation method, and drawing data creation apparatus |
TW201329642A (en) * | 2011-09-07 | 2013-07-16 | Dainippon Screen Mfg | Drawing apparatus and drawing method |
TW201314376A (en) * | 2011-09-30 | 2013-04-01 | Dainippon Screen Mfg | Image display apparatus for direct drawing apparatus and recording medium |
Also Published As
Publication number | Publication date |
---|---|
WO2015122243A1 (en) | 2015-08-20 |
CN105992997B (en) | 2019-06-07 |
KR20160089483A (en) | 2016-07-27 |
JP2015153213A (en) | 2015-08-24 |
CN105992997A (en) | 2016-10-05 |
JP6389040B2 (en) | 2018-09-12 |
TW201543173A (en) | 2015-11-16 |
KR101800990B1 (en) | 2017-11-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101449262B1 (en) | Generating apparatus of wiring data, generating method, and drawing apparatus | |
TWI632475B (en) | Computer-implemented method of designing metrology targets and computer program product | |
JP2022001965A (en) | Lithographic process and lithographic apparatus, and inspection process and inspection apparatus | |
JP6364059B2 (en) | Exposure apparatus, exposure method, and article manufacturing method | |
TWI750640B (en) | Method for determining an alignment model associated with a mark layout, computer program product, measurement system, and lithography apparatus | |
KR20230050337A (en) | How to Arrange Patterns for Field Stitching | |
KR20190003803A (en) | Partial Alignment Modeling Method | |
KR20130027424A (en) | Drawing apparatus and drawing method | |
TWI612392B (en) | Gui device for exposure device, exposure system, method for setting exposure condition and recording medium | |
TWI553425B (en) | Gui device for pattern drawing device, pattern drawing system, method for updating job ticket and recording medium | |
JP2009192693A (en) | Pattern drawing device | |
KR102231933B1 (en) | A lithographic mask for euv lithography | |
CN116569112A (en) | Method and apparatus for imaging non-stationary objects | |
TWI530986B (en) | System and method for manufacturing three dimensional integrated circuit | |
US20230359802A1 (en) | Wiring data generation apparatus, drawing system, and wiring data generation method | |
TWI526865B (en) | Gui device for direct drawing device, direct drawing system, method for setting drawing area and recording medium | |
TWI645255B (en) | Drawing method | |
JP5872310B2 (en) | Drawing apparatus, template creation apparatus, and template creation method | |
JP2011035333A (en) | Scanning exposure device, scanning exposure method, method of manufacturing semiconductor device, and program | |
JP2013135201A (en) | Exposure method and device manufacturing method | |
JP2014106654A (en) | Computer system, drawing system, and switching method | |
KR20230152568A (en) | Correction method, exposure method, article manufacturing method, computer program, optical apparatus, and exposure apparatus | |
TW202111442A (en) | Drawing method and drawing apparatus | |
JP2010251409A (en) | Exposure method, exposure apparatus, and device manufacturing method | |
JP2009180873A (en) | Mask for transferring circuit pattern, method for forming mask pattern, program for forming mask pattern, mask pattern forming apparatus, method for manufacturing semiconductor device, and apparatus for manufacturing the semiconductor device |