TWI424224B - Method for processing a mother board - Google Patents

Description

Motherboard substrate processing method

The present invention relates to a mother board in which a mother board (a mother board is also referred to as a bonding board or a bonding board) in which two sheets of a brittle material such as glass are bonded, and a substrate of a plurality of unit substrates which are processed products is formed. In a more detailed manner, in the case of forming a unit substrate from a mother board, a substrate processing method for forming a terminal region for external connection on the periphery of the unit substrate is used.

The substrate processing method of the present invention is specifically used for processing a unit display panel or the like of a liquid crystal display panel.

In the liquid crystal display panel, two large-area glass substrates are used, a color filter is formed on one of the substrates, and a TFT (Thin Film Transistor) for driving the liquid crystal is formed on the other substrate and external connection is performed. Terminal area. Then, a mother board in which a liquid crystal is sealed is formed by bonding the two substrates, and then a unit display panel (unit substrate for a liquid crystal display panel) is divided into one sheet to manufacture a liquid crystal display panel. .

In the mother board of the liquid crystal display panel, a first substrate (also referred to as a CF side substrate) on the side where the color filter is formed and a second substrate on the side where the TFT and the terminal region are formed are bonded via a sealing material (also Called TFT substrate). At this time, the second substrate is bonded so that the substrate surface on which the TFT and the terminal region are formed is a bonding surface with the first substrate.

At this time, since the terminal region is a region where the signal line is connected between the TFT and the external device, the terminal region must be exposed. Therefore, when the panel dividing mother board is displayed for each unit, the portion of the first substrate (CF side substrate) facing the terminal region is along the outer end of the terminal region on the opposite side to the side on which the TFT is connected ( That is, the periphery of the unit display panel is divided, and the width (terminal width) required for mounting the signal line is removed from the outer side of the terminal region as waste.

In general, in the step of dividing the unit display panel from the mother board, a dividing method using a cutter wheel is used. At this time, the two substrates (the CF side substrate and the TFT side substrate) constituting the mother board are respectively scribed on each of the substrates by pressing the cutter wheel at a predetermined division position and relatively moving it. Groove). Secondly, by cutting the force along the scribe line, applying force to cut off (mechanical cut-off), or applying heating steam to cut off, the mother board is completely divided by each unit display panel. Then, the separated one unit display panel is transferred to the post-processing by the transfer robot.

A substrate processing system (substrate dividing system) and a substrate processing method (see Patent Document 1 and Patent Document 2) have been disclosed to efficiently perform processing by simultaneously performing the above-described series of substrate processing on both the upper and lower sides. According to the above document, two mother boards are simultaneously scribed by the upper and lower pair of cutter wheels. Secondly, the two sides are simultaneously cut by the steam cutting mechanism and the roller cutting mechanism, and the display is divided by each unit display panel. Then, the formed unit display panel is taken out one by one and transported to the post-processing.

In the liquid crystal display panel, in recent years, more and more large screens have been pursued, and therefore, the unit display panel has also been expected to have a large area. Further, when a plurality of unit display panels are formed by dividing one mother board, a part of the substrate is discarded as waste. However, it has been required to reduce the amount of waste discarded to effectively utilize the mother board. Therefore, when the color filter (CF), the TFT, and the terminal region are formed on the mother board, the substrate layout is considered such that the waste area formed between the adjacent unit display panels is minimized.

Fig. 15 and Fig. 16 are diagrams showing a substrate layout (plan view, front view, and right side view) of a mother board for a liquid crystal display panel in which the amount of waste generated is suppressed. The mother board has a structure in which a CF side substrate G1 and a TFT side substrate G2 are bonded. In the above example, a total of eight unit display panels U are arranged on the mother board. The mother board of Fig. 15(a) is provided with a unit display panel in which the terminal regions T are formed on the two-terminal two-terminal panel. The mother board of Fig. 15(b) is provided with a three-terminal panel in which the terminal regions T are formed on three sides. The mother board of Fig. 15(c) is provided with one terminal panel formed on one side of the terminal region T. Further, the mother board of Fig. 16 is provided with a terminal region T formed on four sides of the four terminal panels. The number of sides forming the terminal region is selected in accordance with the number of pixels included in the unit display panel U.

In the above-described substrate layout, the second substrate G2 (TFT side substrate) is disposed so that each unit display panel U is in contact with each other so as not to generate waste between the adjacent unit display panels U. Therefore, regarding the second substrate G2, only the outer peripheral portion of the mother board is generated as waste. On the other hand, the first substrate (CF side substrate) is generated as a waste material at the same time as the outer peripheral portion of the mother substrate U and the terminal region T of the second substrate G2. In the 15th and 16th drawings, the portion which becomes the waste is indicated by hatching.

Here, attention is paid to one of the terminal panel, the two-terminal panel, and the three-terminal panel shown in Fig. 15. Figure 17 is a view showing a part of a cross section of an adjacent unit display panel. In the above-described substrate layout, at least one pair of adjacent unit display panels U1, U2 displays the outer end surface L1 of the terminal region T of the panel U1 (only the end surface of the second substrate G2) in one unit, and the other The unit display panels U1 and U2 are disposed in such a manner that the end surface L2 of the terminal region T (the end faces of the first substrate G1 and the second substrate G2) are not in contact with each other in the unit display panel U2. Further, a specific example of the boundary of the unit display panel of such a relationship is indicated by a symbol "○" in Fig. 15.

When the mother board is divided, two types of cut surfaces are formed in the vicinity of the boundary between the unit display panel U1 and the unit display panel U2.

One of them is divided so that the second substrate G2 coincides with the end faces of the first substrate G1 (completely cut). This is called a just cut surface Ca. The full-cut surface Ca is a surface in which the unit display panel U1 and the unit display panel U2 are completely separated.

The other is to divide (cut only) the cut surface of the CF side substrate G1 only from the position where the full-cut surface Ca leaves the terminal width Wa (Fig. 15). This is called the terminal cut surface Cb (terminal cut surface). The terminal cut surface Cb is a cut surface that is divided to expose the terminal surface of the terminal region T. Then, the scrap region E is produced on the first substrate G1 between the full-cut surface Ca and the terminal cut surface Cb.

Figure 18 is a diagram showing the unit display panel U1, the unit display panel U2, and the scrap area E shown in Fig. 17, which are subjected to scribing (scribing, scribing, and simply scribing) and after the truncation process. A map of three separation states. In Fig. 18(a), the scrap area E is completely separated by the unit display panels U1, U2, and any unit display panel U1, U2 is in an ideal separation state which can be directly used as a good product. The unit display panel U1, U2 separated into this state is transferred to the next step as it is.

In the 18th (b), the waste area E is not separated from the unit display panel U2, but is attached to the side of the full-cut surface Ca, and only the unit display panel U1 is completely separated. At this time, the unit display panel U1 is transferred to the next step as a good product, and the unit display panel U2 is discarded as a defective product, or the cutting process of the separation waste area E is added, and the quality is improved, and then the process proceeds to the next step. .

In Fig. 18(c), the scrap area E is not separated from the unit display panel U1, but is attached to the terminal cut surface Cb side, and only the unit display panel U2 is completely separated. At this time, the unit display panel U2 is transferred to the next step as a good product, and the unit display panel U1 is discarded as a defective product, or the cutting process of adding the separated waste area E is performed to improve the quality, and then transferred to the next step.

In the actual manufacturing step, the substrate division system is adjusted in such a manner that the waste area E is processed as completely as possible (Fig. 18(a)), but the waste area E is attached to the entire portion from time to time. The state of the cutting surface Ca (Fig. 18(b)) or the state of the terminal cutting surface Cb (Fig. 18(c)). In this case, in a state in which the scrap region E adheres to the full-cut surface Ca or in a state of adhering to the terminal cut surface Cb, it is necessary to perform an additional cutting process to improve the quality. For this purpose, two kinds of cutting mechanisms corresponding to the respective states are prepared, and it is determined which one of the two types of attachment states is present, and the cutting mechanism is selected in accordance with the attachment state of the waste area E, and the additional cutting process is performed.

On the other hand, a division method (refer to Patent Document 3) is disclosed in which the scrap area E is often attached to the full-cut surface (Fig. 18(b)), or is attached to the terminal cut surface (Fig. 18 (c) In the manner of )), the cutting process is performed, and in the next step, the waste area E is surely separated using a single type of cutting mechanism.

According to the division method described in this document, when the scribing process is performed by the laser beam or the cutter wheel, first, the first substrate G1 (CF side substrate) is processed, and then the upper substrate F1 is flipped up and down, and the second substrate G2 (TFT side) The substrate) is processed. At this time, for example, as shown in Fig. 19, the scribing performed on the cutter wheel of the terminal cutting surface Cb of the first substrate G1 is performed with a strong pressing force P1. Then, the full-cut surface Ca of the first substrate G1 is scribed with a pressing force P2 which is weaker than P1. Further, the full-cut surface Ca of the second substrate G2 is scribed with a strong pressing force P1. Thus, by applying a strong pressing force to the scribe line, the depth of the scribe groove can be adjusted, and the scrap region E can be often attached to the state of the full-cut surface Ca to be cut. As a result, it becomes possible to efficiently remove the waste by preparing only one kind of cutting mechanism.

In the same manner, when the scrap region E is often cut in the state in which the scrap region E is attached to the terminal cutting surface Cb side, for example, as shown in Fig. 20, the full cutting surface Ca of the first substrate G1 is drawn by the strong pressing force P1. On the other hand, the scribe line processing of the terminal cut surface Cb of the first substrate G1 is performed at a pressing force P2 which is weaker than P1. Further, the full-cut surface Ca of the second substrate G2 is scribed with a strong pressing force P1. At this time, only one cutting mechanism is prepared to efficiently remove the waste.

Patent Document 1: WO2005/087458

Patent Document 2: WO2002/057192

Patent Document 3: Japanese Patent Laid-Open Publication No. 2008-56507

With the large area of the mother board, it becomes difficult to flip the mother board down on the way of the scribing process. In particular, when the thickness Wt (see FIG. 15) of each substrate is 1 mm or less (for example, 0.05 to 0.7 mm), since the substrate is easily broken, the substrate is prevented from being reversed. Therefore, a method described in Patent Document 3 in which the first substrate (CF side substrate) and the second substrate (TFT side substrate) are reversed during processing to process both substrates is difficult. Therefore, it is necessary to use a lower substrate processing system in which the substrate is processed from the vertical direction, such as Patent Document 1 and Patent Document 2, which are described in Patent Document 1 and Patent Document 2.

In addition, as the unit display panel is increased in size, it is necessary to reduce the width of the terminal Wa which is the width of the portion exposed as the terminal region (see FIG. 15). Specifically, the previous terminal width Wa is about 10 mm, and it is necessary to reduce it to about 1 mm to 3 mm. When such a substrate layout is performed, in order to reliably separate the scrap regions, the dividing method described in Patent Document 3 shown in Figs. 19 and 20 can be used to remove the unnecessary scrap regions. However, there are cases where quality improvement cannot be achieved by this division method.

That is, in a state in which the scrap area E adheres to the terminal cut surface Cb side (see FIG. 20), the scrap area E is integrated with the unit display panel, and is integrally cut into a rectangular parallelepiped state, and is used to hold only the scrap area. The prominent part of E disappears. In addition, when the terminal width Wa is 1 mm to 3 mm, it is also difficult to separate only the scrap region E by the adsorption pad (see Patent Document 2). Therefore, once attached to the terminal cutting surface Cb side, it is difficult to separate the scrap area E from the terminal cutting surface Cb, and it has to be discarded as a defective product.

On the other hand, in a state in which the scrap region E adheres to the full-cut surface Ca side (see FIG. 19), even if the terminal width Wa becomes small, only one portion of the scrap region E protrudes by only 1 mm, so that only the portion can be gripped. Further, the shearing force or the bending moment required for the separation can be applied only to the scrap region E. Therefore, the scrap region E can be separated from the full-cut surface Ca by performing an additional cutting process.

In the above case, if it is intended to process a unit display panel that reduces the terminal width Wa of the terminal area from a large-area mother board, it is necessary to use the waste area E often without using the upper substrate processing system. A substrate processing method (see Fig. 19) attached to the side of the terminal cut surface Cb (also attached to the side of the full cut surface Ca when attached).

However, when the first substrate and the second substrate are scribed by the upper and lower cutter processing systems on the upper and lower cutter wheels, if only one of the one-side cutter wheels is pressed, the substrate will be facing one. Bending sharply. Therefore, in general, it is necessary to simultaneously perform scribing from the up and down direction by means of a pair of upper and lower cutter wheels. When it is necessary to perform the scribing on only one side, it is necessary to press the support roller without the blade edge to perform scribing on the other side.

Therefore, in the upper and lower substrate processing systems, the substrate processing method (see FIG. 19) in which the scrap region E does not always adhere to the terminal cut surface Cb side is used, and the cutter wheel is opposed to the full cut surface Ca from the upper and lower sides. To scribe the substrate at the same time. At this time, the pressing force P1 of the cutter wheel of the TFT side substrate is reinforced, and the pressing force P2 of the cutter wheel of the CF side substrate is weakened, and the pressing is simultaneously performed from the upper and lower sides. Further, when the terminal cut surface Cb is scribed, the cutter wheel is pressed against the CF side substrate, and the back-up roller is pressed against the TFT side substrate.

However, even if the substrate processing is performed by this method, in fact, it has been found that the groove depth cannot be controlled and it is impossible to divide into a desired shape. Specifically, the scrap area E is attached to the side of the terminal cut surface Cb, or the scribe line cannot be formed deep enough, and the display panel cannot be divided for each unit.

As a result of reviewing the cause, it is known from the applicant's analysis that the second-line scribing process is performed for the processing of the full-cut surface Ca and the processing of the terminal cut surface Cb for the terminal processing, and is present by the sandwich terminal region. The influence of the sealing material is less likely to cause cracks during the second scribing process. Explain this phenomenon.

21 and 22 are views showing a method of performing scribing processing on the upper and lower sides of the terminal region T having a gap of 1 mm to 3 mm which is sandwiched between the full-cut surface Ca and the terminal cut surface Cb by the cutter wheel. The 21st drawing is a processing method in which the full-cut surface Ca is first subjected to scribing processing, and then the terminal cutting surface Cb is subjected to scribing processing. Further, Fig. 22 is a processing method in which the terminal cutting surface Cb is processed first, and then the scribing processing of the full cutting surface Ca is performed.

First, the phenomenon when processing is performed from the full-cut surface Ca will be described. As shown in Fig. 21(a), the sealing material S1, S2 is provided on both sides via the terminal region T, and the first substrate G1 and the second substrate G2 are bonded together.

As shown in FIG. 21(b), the cutter wheel W1 is crimped to the position of the full-cut surface Ca on the side of the first substrate G1, and the cutter wheel W2 is crimped to the position of the full-cut surface of the second substrate G2 side. To perform the first scribing process. At this time, since the groove on the side of the second substrate G2 is formed to be deep, and the groove on the side of the first substrate G1 is formed shallow, the first substrate G1 is relatively smaller than the pressure applied to the side of the second substrate G2. Side crimping force. At the time of the first scribing process, since the stress does not exist in the vicinity of the full-cut surface Ca, the both sides of the first substrate G1 and the second substrate G2 can form a scribe groove without problems, and The depth of the groove according to the crimping force is formed.

Next, as shown in FIG. 21(c), the cutter wheel W1 is crimped to the position of the terminal cutting surface Cb of the first substrate G1, and the support roller W3 (roller without the tip) is crimped to the terminal of the second substrate G2. The second scribing process is performed on the extension line of the cut surface Cb. At this time, in order to form the groove of the terminal cut surface Cb on the first substrate G1 side deep, the pressure contact force applied to the cutter wheel W1 and the pressure contact force applied to the support roller are reinforced.

However, at the time of the second scribing process, the scribing groove formed as a result of the first scribing process is opened, and the vicinity of the terminal cut surface Cb is subjected to compression by the influence of the sealing material S1. The state of stress. That is, although the full-cut surface Ca of the first substrate G1 is to be opened toward the terminal cutting surface direction Cb side, the sealing material S blocks the force to be opened, so that the terminal cutting surface Cb is generated at a position of 1 mm to 3 mm from the full-cut surface Ca. The stress is compressed to impede the extension of the crack in the depth direction of the cracked surface of the terminal.

As a result, there is a case where it is impossible to form a deep scribe groove on the terminal cut surface Cb of the first substrate G1 by the second scribe line processing, and it is formed on the full cut surface Ca of the first substrate G1. The groove groove is formed deeper than the groove of the terminal cut surface Cb. Therefore, as shown in Fig. 21(d), the unit display panel in which the first substrate G1 is divided by the full-cut surface Ca is formed, and the first substrate G1 is not divided by the terminal cut surface Cb.

Next, the phenomenon when the terminal cutting surface Cb is first processed will be described. As shown in Fig. 22(a), the first substrate G1 and the second substrate G2 are bonded to each other via the terminal region T with the sealing members S1 and S2 on both sides.

As shown in FIG. 22(b), the crimping cutter wheel W1 is placed at the position of the terminal cutting surface Cb on the first substrate G1 side, and the position of the support roller W3 is crimped to the terminal cutting surface of the second substrate G2. The first line is processed. At this time, in order to form the groove on the side of the first substrate G1 deep to the extent of complete separation, the pressure contact force of the first substrate G1 is strengthened together with the pressure contact force of the support roller.

At the time of the first scribing process, there is no stress in the vicinity of the terminal cut surface Cb, so that the scribe groove is formed without problems, and a groove having a depth according to the pressure contact force can be formed.

Next, as shown in Fig. 22(c), the cutter wheel W1 is crimped to the position of the full-cut surface Ca on the side of the first substrate G1, and the full-cut surface Ca of the cutter wheel W2 on the side of the second substrate G2 is crimped. The position is used for the second scribing process. At this time, in order to form the groove on the second substrate G2 side deep and to form the groove on the first substrate G1 side shallow, the pressure contact force on the first substrate G1 side is made to be applied to the second substrate G2 side. The crimping force is reduced.

At the time of the second scribing process, the first scribing process groove has been opened at the terminal cut surface Cb, and affected by the seal material S2, the full cut surface Ca of the first substrate G1 side The vicinity is in a state in which a compressive stress is applied. That is, the terminal cut surface Cb of the first substrate G1 is intended to be flared toward the full cut surface Ca side, and since the seal member S2 blocks the force to be opened, compressive stress is generated at the full cut surface Ca, and the first substrate is hindered. The full-cut surface Ca of G1 extends toward the depth direction of the crack. As a result, in the second scribing process, a shallow scribe groove is formed on the full-cut surface Ca of the first substrate G1. This does not cause a problem with respect to the side of the first substrate G1, but causes a problem on the side of the second substrate which is simultaneously processed.

In other words, on the side of the second substrate G2, the terminal cutting surface Cb of the first substrate G1 is to be opened in the first scribing process, but since the sealing members S1 and S2 block the force to be opened, the bending moment is added. On the other hand, a state in which compressive stress is applied in the vicinity of the full-cut surface Ca of the second substrate G2 is obtained. Therefore, the full-cut surface Ca of the second substrate G2 is in a state in which only a shallow scribe groove can be formed. In this state, when the second scribing process is repeated, when the cutter wheel W1 on the first substrate side is slightly scribed earlier than the cutter wheel W2 on the second substrate side, a strong bending moment is applied. On the other hand, a strong compressive stress is applied in the vicinity of the full-cut surface Ca of the second substrate, and the full-cut surface Ca of the second substrate G2 becomes almost impossible to perform the scribing process. At this time, when the pressing force is increased to perform the scribing process, cullet is generated.

As described above, it has been found that in the upper and lower substrate processing systems, it is difficult to form a desired scribe groove in any of the terminal cut surface Cb and the full cut surface Ca2 which are subjected to the second scribe line processing.

Therefore, an object of the present invention is to provide a substrate processing method for a mother board of a top and bottom substrate processing system, which is capable of stably and surely performing a desired groove even if it is a large-area mother board which is difficult to invert the substrate for processing. Deep scribing processing.

Further, a second object is to provide a substrate processing method which is a substrate processing method of a mother board of a top and bottom substrate processing system using a pair of cutter wheels, which can be used for processing the terminal region. Add the strength of your desire.

Further, a third object is to provide a substrate processing method in which a terminal width of a terminal region of a processed product (unit display panel) is even in a substrate processing method using a master substrate of a pair of cutter wheel upper and lower substrate processing systems It is narrowed, and there is no problem that the scrap area covering the terminal area adheres to the defective side of the terminal cutting surface side, and the waste area is completely separated, or in the event that the waste area cannot be completely separated, the scrap area can be surely removed later. Quality improvement.

In the substrate processing method of the present invention, the mother panel is divided by the upper and lower substrate processing systems to produce a unit display panel. At this time, the premise is that even if the scrap area cannot be completely separated from the unit display panel, the quality can be improved by performing processing by reliably dividing the scrap area by the additional cutting process.

The mother board to be processed in the present invention has a substrate structure (bonding substrate) to which the first substrate (CF side substrate) and the second substrate (TFT side substrate) are bonded. Further, in this substrate structure, a plurality of square unit display panels are formed in a state of being adjacent to each other. The second substrate side of each unit display panel is formed with a terminal region for external connection on at least one of the four peripheral edges. In at least one of the terminal regions included in each unit display panel, the outer end of the terminal region is a full-cut surface that is divided across the two substrates, and the inner end of the terminal region is a first substrate that is only divided and opposed. The shape of the terminal cutting surface is formed. Specifically, one of the terminal panel, the two-terminal panel, and the three-terminal panel shown in Fig. 15 conforms to the region indicated by the symbol ○, and constitutes a terminal region sandwiched between the full-cut surface and the terminal-cut surface. In the case of such a mother board, it is difficult to perform the division of the scrap area by the additional cutting process in the terminal area of the above-mentioned ○ mark.

Moreover, in order to solve the above problem, the first cutter wheel facing the first substrate of the mother board and the second cutter wheel facing the second substrate are scribed from both sides of the first substrate and the second substrate. In the processing, the terminal is formed by exposing the terminal regions of the display panels of the respective units while the panel is divided by the respective units. At this time, the terminal region sandwiched by the full-cut surface of the mother board and the terminal cut surface is subjected to scribing processing, (a) first, while crimping the position of the first cutter wheel on the terminal cutting surface of the first substrate Pressing the second cutter wheel at the position of the full cutting surface of the second substrate to perform the scribing process on both sides simultaneously, and after (b), crimping the first cutter wheel on the full cutting surface of the first substrate The support roller without the cutting edge is crimped to the vicinity of the full cutting surface of the second substrate and is subjected to scribing on one side.

According to the present invention, a pair of cutter wheels, or a cutter wheel and a support roller are used, and the first substrate and the second substrate are simultaneously crimped from both sides, and the total cutting surface and the terminal cutting surface are performed by a total of two processing operations. The scribing process is performed, and the position of the first cutting surface of the first substrate and the position of the full cutting surface of the second substrate are scribed at the first scribing process. Then, at the time of the second scribing process, the position of the full-cut surface of the first substrate is scribed by a scribe line which is weaker than the position of the terminal cut surface of the first substrate.

That is, in the first scribing process, the processed surface (terminal cut surface) of the first substrate which must be strongly crossed and the processed surface (full cut surface) of the second substrate are first scribed each other. In the first scribing, no stress is generated on the substrate, so that any one of the first substrate and the second substrate can be formed deeply. Furthermore, in this case, a pair of cutter wheels are crimped to a position separated by the length of the terminal width, and since the distance is short, there is almost no influence. Next, in the second scribing process, the machined surface (the full cut surface of the first substrate) that is lightly scribing is scribed. In the second scribing process, by applying compressive stress to the machined surface, it is difficult to form a deep scribe groove, and the scribe line is originally scheduled to be shallow, so that there is no problem.

In this way, when the upper and lower sides are simultaneously scribed, the pressure contact position of the cutter wheel is moved, and the position of the deep scribe groove is first formed for processing.

According to the present invention, when a pair of cutter wheels are used to perform the scribing process on the terminal areas of the terminal cutting surface and the full cutting surface from the upper and lower sides, the scrap area covering the part can also be covered from the unit display panel. When it is completely divided or cannot be divided, it can be reliably attached to the full-cut surface side of the unit display panel to divide, and when the waste area cannot be divided, the additional cutting process can be used to surely Improve quality.

(means and effects to solve other problems)

In the above invention, the support roller system may be pressure-bonded to an adjacent position of the scribe groove formed on the full-cut surface of the second substrate.

According to this, when the full cutting surface of the first substrate is scribed by the first cutter wheel, the support roller is arranged to avoid the scribe line formed on the full cutting surface of the second substrate to crimp the substrate, so that the substrate is no longer Damage to the ditch.

In the above invention, it is also possible to perform the scribing process on one of the terminal regions sandwiching the full-cut surface and the terminal cutting surface, and after performing the scribing processing step of (a), the terminal region to be processed and processed is After the processing of the different terminal areas, the scribing process of (b) is performed on the initial terminal area.

According to this, the processed portion processed by the pair of cutter wheels can be processed, and the processed portion processed by the one cutter wheel and the support roller can be processed, so that the processing can be performed in a balanced manner, and the exchange can be shortened. Adjustment time and standby time caused by the cutter wheel and the support roller.

Further, in the above invention, the width (terminal width) of the full-cut surface and the terminal cut surface may be set to be 1 mm to 3 mm. By reducing the width of the terminal, the area of the motherboard that can be used as a unit display panel can be increased. In this case, the scrap area covering the terminal area adheres only to the side of the completely cut surface, so that it can be surely removed.

In the above invention, the mother board may have a configuration in which the unit display panel is formed vertically and horizontally along the orthogonal XY directions, and the substrate Y may be formed so as not to be separated from the X direction. The last part of the direction is clamped and moved in front of the Y direction, and the screen is divided by the unit display panel in the Y direction and the X direction, or by dividing the motherboard in the X direction. When the Y-direction is clamped and moved in the Y direction and the X direction, and the display panel is divided for each unit, the Y-direction is first scribed, and the yoke is clamped at the same time. One of the terminal regions of the full-cut surface and the terminal cutting surface is subjected to the scribing process of (a) in this order, and the scribing process of (b), and the scribing process in the Y direction in the X direction is performed. Wire processing is also possible.

According to this, when the unit display panel is two-dimensionally formed on the mother board in the XY direction, the unit display panel is moved in the Y direction while being sandwiched by the substrate so as not to be separated from the X direction. Then, in the Y direction, the scribing process of (a) is performed in this order, and the scribing process of (b) is performed, and then the X-direction scribing process is performed. By setting the processing order in this way, it is possible to reliably display the panel division for each unit, and if the additional cutting processing is performed, the quality can be surely improved.

An embodiment of the substrate processing method of the present invention will be described with reference to the drawings. The substrate processing method described below is a method used in the manufacturing process of the liquid crystal display panel, and specifically, a substrate which is a unit display panel as a liquid crystal display panel, which is divided from the mother board and which is taken out one by one. In the processing system.

(substrate processing system)

First, the overall configuration of the substrate processing system used in carrying out the substrate processing method of the present invention will be described.

Fig. 1 is a perspective view showing the overall configuration of a substrate processing system 1 using the substrate processing method of the present invention. Fig. 2 is a perspective view of the A view of Fig. 1 (except for the gantry 10 described later). Fig. 3 is a plan view of the substrate processing system 1 (excluding the frame 11 and the pillar 14 to be described later). Fig. 4 is a B-B' cross-sectional view of Fig. 3, Fig. 5 is a C-C' cross-sectional view of Fig. 3, and Fig. 6 is a D-D' cross-sectional view of Fig. 3, and Fig. 7 is a 3 is a cross-sectional view of E-E', and Fig. 8 is a cross-sectional view of F-F' of Fig. 3.

Here, a case where the unit display panel is arranged in two rows in the X direction and the mother board 90 arranged in the Y direction in four rows is processed will be described. Further, the XYZ direction used in the description will be shown in the drawing.

First, explain the overall structure of the system.

In the substrate processing system 1, the mother substrate 90 is transferred from the substrate loading side 1L toward the substrate carrying-out side 1R, and the scribing process and the cutting process are performed in the middle.

The mother board 90 (bonding substrate) is placed on the second substrate G2 (TFT side substrate) on the upper side, and placed on the lower side as the first substrate G1 (CF side substrate).

The substrate processing system 1 has a frame structure formed by a hollow gantry 10, a main frame 11, and a pillar 14. Above the gantry 10, a substrate support device 20 for supporting the motherboard 90 is disposed. The substrate supporting device is constituted by the first substrate supporting portion 20A and the second substrate supporting portion 20B. The substrate dividing mechanism 30 is disposed at a position intermediate the first substrate supporting portion 20A and the second substrate supporting portion 20B.

As shown in Fig. 4 (Fig. 3B-B' section), the first substrate supporting portion 20A and the second substrate supporting portion 20B are each constituted by five supporting units 21 arranged in the X direction. Each of the support units 21 is fixed to the gantry 10 on the side close to the substrate dividing mechanism 30. The timing belt is rotated around the support unit 21, and is coupled to the transfer unit 50 to be described later.

The substrate dividing mechanism 30 is provided with an upper rail 31 and a lower rail 32, and the upper rail 31 is attached to the upper scribing mechanism 60 so as to be movable in the X direction, and is mounted to the lower rail 32 so as to be movable in the X direction. There is a lower scribing mechanism 70.

As shown in Fig. 5 (C-C' section of Fig. 3), the scribing mechanism 60 is attached to the second cutter wheel W2, and is switched by the elevating mechanism 61 for moving the second cutter wheel W2 up and down. The blade direction of the second cutter wheel W2 is composed of a rotation mechanism 62 in the Y direction and the X direction, and an X-axis drive mechanism 63.

The scribing mechanism 70 is configured by arranging the first cutter wheel W1 and the support roller W3 in the Y direction, and the lifting mechanism 71 for lifting and lowering the first cutter wheel W1 and the support roller W3, and the first cutter wheel The direction of the cutting edge and the direction of rotation of the supporting roller are switched between the rotating mechanism 72 in the Y direction and the X direction, and the X-axis driving mechanism 73. The elevating mechanism 71 and the rotating mechanism 72 are configured to be press-contactable to the substrate by either one of the first cutter wheel W1 or the support roller W3, and further, the moving direction of the crimping wheel can be directed to the Y direction. Or X direction.

As shown in FIG. 1 or FIG. 2, the chucking device 50 that sandwiches the end portion (the rear end of the mother board 90) on the substrate loading side of the mother board 90 is disposed on the substrate loading side 1L side of the substrate supporting device 20. The gripping device 50 is constituted by a pair of gripping members 51 (51L, 51R), a lifting mechanism 55 (55L, 55R) for lifting and lowering the gripper 51, and a moving base 57, and sandwiching the mother board 90. The mother board 90 is moved in the Y direction. This clamping device 50 is driven by a linear motor mechanism 58. Further, the movement is performed on the gap and the lower side of the support unit 21, and the state in which the mother board 9 is held is maintained, and the substrate dividing mechanism 30 can be passed up to the rear end of the mother board 90. The clip 51L and the gripping tool 51 are respectively formed on the left side of the unit display panel of the mother board 90, and the right side column is sandwiched, and the position in the center of the substrate is divided along the Y direction. The mother boards 90 divided by the left and right sides are supported by the respective columns and are conveyed in the Y direction.

As shown in Fig. 6 (D-D' section of Fig. 3), a vapor shutoff device 100 is disposed on the substrate carry-out side 1R of the substrate supporting device 20, and is provided with a mother board 90 for transporting, and heating steam is applied thereto. The upper vapor unit 101 is sprayed, and the lower vapor unit 102 is sprayed by the lower portion. The mother board 90 which has been subjected to the scribing process passes between the heating vapors sprayed from the steam shutoff device 100 to expand the mother board 90, and mainly performs the cutting process for the positive direction of the mother board in the X direction. The vapor shutoff device 100 can be moved in the Y direction by the linear motor mechanism 130.

As shown in Fig. 7 (E-E' cross section of Fig. 3), a roller shutoff device 110 is disposed at a position on the substrate carry-out side 1R of the vapor cell 100, and the transferred mother substrate 90 is formed along the substrate. The adjacent position of the scribe groove in the Y direction (the side of the scribe groove) presses the cutting rollers 111 to 113, and provides a cutoff pressure in the Y direction of the substrate 2 to positively cut off. The roller shutoff device 110 is movable in the Y direction by the linear motor 130.

As shown in FIG. 8 (F-F' cross section of FIG. 3), the substrate unloading device 120 is disposed at a position on the substrate carrying-out side 1R of the roller device 110, and one unit display panel is taken out from the mother board 90. And transfer it to the next step. The upper rail 121 is provided in the substrate unloading device 120, and the transport robot 80 movable in the X direction is attached to the upper rail 121. The substrate unloading device 120 can be moved in the Y direction by the linear motor 130.

The transport robot 80 has a plate 83 to which the adsorption pad 82 is attached, a rotation mechanism 84 that rotates the plate 83, an elevating mechanism 85 that elevates the plate 83, and an X-axis drive mechanism 86. The transport robot 80 sucks one unit display panel divided from the mother board 90 and moves it to the upper side. Further, while moving and moving in the X-axis direction while rotating the unit display panel, the linear motor 130 is moved in the Y direction, and one operation is performed one by one. The unit display panel that has been carried out is taken to a step not shown, and the next processing is performed.

The board 83 of the transport robot 80 is provided with a hook 87 and a pusher 88, and is an additional cut-off processing mechanism for removing the scrap when the unit display panel of the carry-out unit is attached with waste.

Fig. 9 is a view showing an operation of cutting off the hooks 87 and the push rods 88. The hook 87 can be rotated about a support shaft fixed to the plate 83. As shown in FIG. 9( a ), the second substrate G2 (TFT side substrate) of the unit display panel is adsorbed by the adsorption pad 82 while the hook 87 and the push rod 88 are evaded upward. Next, as shown in Fig. 9(b), the hook 87 is actuated and brought into contact with the waste of the end of the first substrate G1 on the opposite side of the adsorption surface, and the scrap is supported from below. On the other hand, as shown in Fig. 9(c), the pusher 88 is actuated and the waste adhered to the end of the second substrate G2 is pressed from above. In this way, the scrap is reliably divided by applying a bending moment to the scrap.

(scored processing)

Next, an operation procedure using the scribing process of the mother board 90 of the substrate processing system 1 described above will be described. The scribing process is performed in the substrate dividing mechanism 30 (Fig. 5), and the present invention is mainly used in the process of performing terminal processing on a unit display panel by scribing.

Figure 10 is a diagram showing the basic processing procedure for terminal processing in accordance with the present invention. As shown in Fig. 10(a), the boundary portion of the adjacent two unit display panels U1, U2 on the mother board 90 is formed with a terminal region T sandwiched between the full-cut surface Ca and the terminal cut surface Cb. The width of the terminal area is about 1 mm to 3 mm. The scribing wheel performs the scribing process on the upper and lower sides of the portion to perform the processing of exposing the bonding surface of the terminal region T (the bonding surface between the first substrate G1 and the second substrate G2).

When the unit display panel U1 is taken out from the mother board 90, the transfer robot 80 is attached to the upper substrate surface (Fig. 9). Therefore, the second substrate G2 (TFT side substrate) is placed on the upper side, and the first substrate (CF side) is placed. The substrate) is disposed on the lower side. When it is made to be adsorbed to the unit display panel U1 and removed from the unit display panel U2, the terminal area T (the second substrate G2 side) comes to the upper side of the scrap area E (the first substrate G1 side), and the waste area E adheres to the full-cut surface Ca of the unit display panel U2, and is easily separated from the terminal cut surface Cb.

Further, in the above-described substrate processing system 1, when the unit display panel is taken out one by one from the mother board 90, the unit display panel which is a boundary portion with the full-cut surface Ca is adjacent to the two unit display panels adjacent to each other. The unit display panel in which the terminal cut surface Cb is a boundary portion is taken out, and the scrap region E is easily attached to the side of the unit display panel in which the full-cut surface Ca becomes a boundary portion. This point will be described later.

As shown in Fig. 10(b), first, the second cutter wheel W2 of the scribing mechanism 60 is aligned with the position of the full-cut surface Ca of the second substrate G2. Then, the first cutter wheel W1 of the scribing mechanism 70 is aligned with the position of the terminal cutting surface Cb of the first substrate G1. Then, the first scribe line is simultaneously performed on both sides with a strong crimping force. At this time, stress does not occur in the vicinity of the terminal region T, so that the groove can be deeply stretched.

The both sides of the terminal region T in which the scribe groove is formed are the regions fixed by the sealing members S1 and S2. Therefore, as a result of the scribe groove expansion, a compressive stress is applied in the vicinity of the terminal cut surface Cb.

Next, as shown in Fig. 10(c), the first cutter wheel W1 of the scribing mechanism 70 is aligned with the position of the full-cut surface Ca. Furthermore, the support roller W3 of the scribing mechanism 60 is aligned with the second substrate G2. At this time, the support roller W3 is moved to the side so as to be deviated from the position of the full-cut surface Ca in which the scribe groove is formed first, and does not damage the scribe groove. Then, the second scribing process is performed with a weaker crimping force than the first time.

At this time, the entire cut surface of the first substrate G1 is subjected to scribing processing while resisting stress, so that it is difficult to stretch it deeply, and the scribe line becomes shallow. It is preferable that this portion is formed into a scribe groove which is shallower than the terminal cutting surface Cb, so that an ideal scribe groove is formed.

Then, a deep scribe line and a shallow scribe groove result are formed, and the cutting process of the subsequent steam cut (Fig. 6) and the roll cut (Fig. 7) is performed, as shown in Fig. 10(d). Indeed, the scrap region E is divided in a state of being attached to the side of the full-cut surface Ca of the first substrate G1.

Then, the scrap area E attached to the full-cut surface Ca is surely divided from the full-cut surface Ca by the additional cutting processing operation (Fig. 9) of the hook 87 and the push rod 88.

By the above processing, the unit display panel is removed from the mother board, and before moving to the next step, the scrap area E can be completely separated.

The above description has been made on the case where the terminal processing is performed separately for the terminal area of one of the unit display panels. In the actual motherboard 90, a plurality of unit display panels are arranged vertically and horizontally. Around the display panel of each unit, not only the terminal area T of the terminal cut surface Cb and the full cut surface Ca but also the boundary of other shapes are included.

In this case, the processing is not performed on one boundary, but can be processed equally according to the alternate processing between the plurality of boundaries. This case will be explained by specific examples.

Fig. 11 shows an example in which the unit display panel which is a two-terminal panel is arranged in two rows in the X direction, and the mother board 90 is arranged in four rows in the Y direction, and is scribed in the Y direction. Further, Fig. 12 is an example of scribing in the X direction.

First, the Y-direction line is first described. In the scribe line in the Y direction, it is assumed that the rear end of the mother board 90 is sandwiched by the chucking device 50 so that the scribe line is not separated in the X direction.

Regarding the Y direction, as shown in Fig. 11, the terminal region T along the central portion of the mother board 90 is divided into three boundaries of the terminal region T _L near the left end and the full-cut surface T _R near the right end. Line processing. Among them, only the central terminal region T is a terminal region that is sandwiched between the terminal cutting surface and the full-cut surface (a missing terminal region where the scrap region cannot be removed from the terminal cutting surface).

At this time, the center terminal region T is subjected to the first strong scribe line (set to Y1). That is, the terminal cut surface of the first substrate G1 and the full cut surface of the second substrate G2 are strongly scribed. Next, the terminal region T _L near the left end is subjected to a second strong scribe line (set to Y2). Next, the third-time strong scribe line (set to Y3) is performed on the full-cut surface T _R near the right end. Then, finally, the full-cut surface of the first substrate of the central terminal region T is subjected to a fourth weak scribe line (set to Y4) with a weak scribe line. At this time, the side line is scribed by the support roller while being placed beside the full-cut surface of the second substrate G2.

In other words, after performing the scribing process on the center terminal region T, the terminal region T _L near the left end and the full-cut surface T _R near the right end are first scribed, and then the center terminal region is again performed. The weak scribing process of T is performed alternately.

When the scribe line in the Y direction is completed by the above procedure, the X-direction scribe line is next performed.

In the X direction, as shown in Fig. 12, the full-cut surface T _F near the front end of the mother board 90 and the terminal area T sandwiched between the full-cut surface and the terminal cut surface at the center of the substrate, And scribing the terminal area T _B near the rear end.

At this time, the three terminal regions T in the X direction are the same as before, and the terminal cutting surface of the first substrate G1 and the full cutting surface of the second substrate G2 are strongly scribed first, and then gently The unit display panel can be surely taken out by scribing the full-cut surface of the substrate G1. Specifically, as shown in Fig. 12, X2 (the full cut surface of the terminal cut surface of the first substrate G1 and the second substrate G2), X3 (the full cut surface of the first substrate G1), and X4 (first) are used. The terminal cut surface of the substrate G1 and the full cut surface of the second substrate G2), X5 (the full cut surface of the first substrate G1), X6 (the terminal cut surface of the first substrate G1 and the full cut surface of the second substrate G2), The order of X7 (the full cut surface of the first substrate G1) is processed. Further, when the processing of X3, X5, and X7 is performed, the scribing is performed while pressing the side of the full-cut surface of the second substrate G2 with the support roller.

(The order in which the unit display panel is taken out)

Next, the order of taking out when the mother board is subjected to scribing processing and taking out the divided unit display panel will be described.

For example, as shown in Fig. 10, when a unit display panel is taken out from one of the mother boards having the terminal area T of the terminal cutting surface Cb and the full-cut surface Ca, the adjacent two unit display panels are The unit display panel U2 which is the boundary portion of the full-cut surface Ca is taken out, and the unit display panel U1 which takes the terminal cut surface Cb as a boundary portion is taken out first, and it is important that the scrap area E is easily attached to the full-cut surface Ca to become a boundary. Part of the unit displays the side of panel U2. When this order is changed, the scrap area E adheres to the terminal cut surface Cb side and remains. Therefore, when the unit display panel is taken out from the motherboard, the order of taking out becomes important.

Fig. 13 is a view showing a unit display panel in which two display units are arranged in two rows in the X direction and four rows in the Y direction, and the drawing order of the unit display panel is shown.

The unit display panel (1) is a boundary portion with respect to the adjacent unit display panel (2) (3) (indicated by a ○ mark in the drawing), and the terminal cutting surface Cb of the unit display panel (1) is a boundary portion. Therefore, the unit display panel (1) must be taken out first.

In the state where the unit display panel (1) is taken out, the terminal cut surface Cb becomes a boundary between the unit display panel (2) and the adjacent unit display panel (4). Further, the unit display panel (3) becomes a boundary with respect to the boundary with the adjacent unit display panel (4) (5). In this case, it is only necessary to take out one of the unit display panels (2) and (3), and it is relatively easy to carry out the removal from one side of the front end of the mother board, so that the unit display panel (2) is taken out first.

In the state where the unit display panel (1) (2) is taken out, the terminal cut surface Cb is bordered at the boundary between the unit display panel (3) and the adjacent unit display panel (4) (5). Therefore, the unit display panel (3) is taken out second. In the same manner as described below, in the order of (1), (2), ... (8) in which the number attached to each unit display panel is small, the unit display panel is taken out.

Fig. 14 is a view showing the state of adhesion of the scrap regions of the respective unit substrates (1) to (8) taken out.

Any unit display panel can also be taken out in such a manner that the waste does not adhere to the terminal cutting surface Cb. Therefore, even if the scrap adheres to the unit display panel, the scrap can be surely removed by the additional cutting process after the hook 87 and the pusher 88 are used.

The above is about the two-terminal panel, and the same is true for one terminal panel and three-terminal panel (Fig. 15). Furthermore, regarding the four-terminal panel (Fig. 16), the order of taking out is not a problem.

[Industry application areas]

The substrate processing method of the present invention can be used for scribing of a mother board for a liquid crystal panel.

1. . . Substrate processing system

20. . . Substrate support device

30. . . Substrate dividing mechanism

50. . . Clamping device

60. . . Upper scribing mechanism

70. . . Lower scribing mechanism

80. . . Handling robot

87. . . hook

88. . . Putt

90. . . motherboard

100. . . Vapor shutoff device

110. . . Roller cutting device

111 to 113. . . Truncate wheel

120. . . Substrate carry-out device

Ca. . . Full cut surface

Cb. . . Terminal cutting surface

E. . . Waste area

G1. . . First substrate (CF side substrate)

G2. . . Second substrate (TFT side substrate)

P1. . . Press pressure

P2. . . Press pressure

S1. . . Sealing material

S2. . . Sealing material

T. . . Terminal area

U1. . . Unit display panel (terminal cutting surface facing the boundary)

U2. . . Unit display panel (full cut surface facing the border)

W1. . . All the cutter wheels

W2. . . Second cutter wheel

W3. . . Support roller

Fig. 1 is a perspective view showing the overall configuration of a substrate processing system used in the substrate processing method of the present invention.

Figure 2 is an A perspective view of the substrate processing system of Figure 1.

Figure 3 is a plan view of the substrate processing system of Figure 1.

Fig. 4 is a cross-sectional view taken along line B-B' of Fig. 3.

Fig. 5 is a cross-sectional view taken along line C-C' of Fig. 3.

Fig. 6 is a cross-sectional view taken along line D-D' of Fig. 3.

Figure 7 is a cross-sectional view taken along line E-E' of Figure 3.

Fig. 8 is a cross-sectional view taken along line F-F' of Fig. 3.

Fig. 9 (a) to (c) are views showing the operation of the substrate transfer robot.

Fig. 10 (a) to (d) are views showing a procedure of scribing processing used in the substrate processing method of the present invention.

Fig. 11 is a view showing an example of a processing procedure when the mother board is scribed in the Y direction.

Fig. 12 is a view showing an example of a processing procedure when the mother board is scribed in the X direction.

Fig. 13 is a view showing an example of a procedure for taking out a unit display panel from a mother board by a transport robot.

Fig. 14 (a) to (d) are diagrams showing the state of the scrap attached to the unit display panel taken out from the mother board.

Fig. 15 (a) to (c) show the layout of the substrate of the mother board (one terminal panel, two terminal panel, three terminal panel).

Fig. 16 is a view showing a layout of a substrate of a mother board (four-terminal panel).

Figure 17 is a partial view showing a section between adjacent unit display panels.

Fig. 18 (a) to (c) show three kinds of separation state diagrams between adjacent unit display panels.

Fig. 19 is a view showing the terminal processing of a conventional mother board.

Fig. 20 is a view showing a terminal processing of a conventional mother board.

Fig. 21 (a) to (d) show a conventional terminal processing diagram of the upper and lower substrate processing systems.

Fig. 22 (a) to (d) show a conventional terminal processing diagram of the upper and lower substrate processing systems.

Ca. . . Full cut surface

Cb. . . Terminal cutting surface

E. . . Waste area

G1. . . First substrate (CF side substrate)

G2. . . Second substrate (TFT side substrate)

P1. . . Press pressure

P2. . . Press pressure

S1. . . Sealing material

S2. . . Sealing material

T. . . Terminal area

U1. . . Unit display panel (terminal cutting surface facing the boundary)

U2. . . Unit display panel (full cut surface facing the border)

W1. . . All the cutter wheels

W2. . . Second cutter wheel

W3. . . Support roller

Claims (4)

A substrate processing method for forming a substrate, wherein the substrate to be processed has a substrate structure in which a first substrate and a second substrate are bonded to each other, and the plurality of square unit display panels are arranged adjacent to each other to form the substrate. In the substrate structure, at least one peripheral edge of the second substrate side of each unit display panel is formed with a terminal region for external connection, and at least one of the terminal regions of each unit display panel is formed such that the outer end of the terminal region is horizontal. The inner end of the terminal region is formed so as to divide only the terminal cut surface of the first substrate that faces the first substrate while the entire cut surface is divided across the two sides of the substrate. The board is formed by scribing from both sides of the first substrate and the second substrate by using a first cutter wheel facing the first substrate and a second cutter wheel facing the second substrate A substrate processing method for a mother board for processing a terminal for exposing the terminal regions of each unit display panel while dividing the display panel by each unit, In order to perform scribing on one of the terminal areas of the mating surface of the mother board and the terminal cutting surface, (a) first crimping the first cutter wheel to the terminal cutting surface of the first substrate Positioning, and pressing the second cutter wheel to the position of the full-cut surface of the second substrate and performing the scribing process on both sides with strong crimping force, and after (b), crimping the first cutter wheel At the same time as the full-cut surface of the first substrate, the support roller without the blade tip is crimped to the entire second substrate The vicinity of the cut surface is subjected to the scribing process on one side by the crimping force which is weaker than the scribing process of the above (a); after the scribing process step of the above (a), the terminal area is different from that in the process. After the processing of the terminal region, the scribing processing step of (b) is performed on the first terminal region. The substrate processing method of the mother board according to the first aspect of the invention, wherein the support roller is pressure-bonded to be formed adjacent to a scribed groove of the full-cut surface of the second substrate. A substrate processing method for a mother board according to the first or second aspect of the invention, wherein the width of the full-cut surface and the terminal cutting surface is 1 mm to 3 mm. The substrate processing method of the mother board according to the first aspect of the invention, wherein the mother board has a configuration in which a unit display panel is formed vertically and horizontally along an orthogonal XY direction, and the mother board is not separated by When the X-direction is sandwiched between the last portion of the Y-direction of the substrate and moved forward in the Y direction, and the S-direction is performed in the Y-direction and the X-direction, and the display panel is divided for each unit, the Y direction is first performed. At the same time as the scribing process, one of the terminal regions sandwiching the full-cut surface and the terminal cutting surface is processed in accordance with the scribing process of the above (a) and the scribing process of the above (b). On the other hand, the scribing process is performed after the scribing process in the Y direction in the X direction.