JP6207307B2 - Break device - Google Patents

Description

  The present invention relates to a break device.

  The liquid crystal device is configured by a bonded substrate in which a first substrate and a second substrate are bonded together with a sealing material so that a liquid crystal layer is interposed (for example, Patent Document 1). From the viewpoint of productivity, first, a large mother substrate is produced from this bonded substrate, and this is divided into a plurality of unit substrates. This cutting method will be described in detail. First, a scribe line is formed on the surface of the bonded substrate on the first substrate side, and then the bonded substrate is pressed and bent from the second substrate side to scribe the first substrate. Break along the line. Subsequently, a scribe line is formed on the surface of the bonded substrate on the second substrate side, and then the bonded substrate is pressed and bent from the first substrate side to break the second substrate along the scribe line.

JP2012-203235A

  In the method described above, after breaking the first substrate, it is necessary to break the second substrate by inverting the front and back of the bonded substrate. Thus, since reversing the front and back of the bonded substrate causes a problem that productivity is lowered, it is desirable to break the first substrate and the second substrate without reversing the front and back of the bonded substrate.

  The subject of this invention is providing the breaking apparatus which can break a 1st board | substrate and a 2nd board | substrate, without reversing the front and back of a bonding board | substrate.

  (1) A breaking device according to an aspect of the present invention includes a first scribe line and a second scribe line formed on a first substrate side surface of a bonded substrate obtained by bonding a first substrate and a second substrate. This is a breaking device for breaking a bonded substrate along a third scribe line formed on a substrate side surface. The break device includes a transport unit, a first break unit, a second break unit, and a third break unit. The transport unit transports the bonded substrate. The first break unit breaks the first substrate along the first scribe line. The second break unit breaks the first substrate along the second scribe line. The third break unit breaks the second substrate along the third scribe line. The first break unit, the second break unit, and the third break unit are arranged along the conveyance path of the bonded substrate.

  According to this configuration, the first substrate is broken by the first and second break units, and then the second substrate is broken by the third break unit. As described above, both the first substrate and the second substrate can be broken without reversing the front and back of the bonded substrate by the first to third break units arranged along the conveyance path. As a result, productivity can be improved.

  (2) Preferably, the second substrate has a terminal region. The region of the first substrate between the first scribe line and the second scribe line is opposed to the terminal region. The third scribe line is formed at a position corresponding to the first scribe line or the second scribe line. According to this structure, the terminal area | region of a 2nd board | substrate can be exposed by breaking a 1st board | substrate with a 1st and 2nd break unit.

  (3) Preferably, the first break unit, the second break unit, and the third break unit perform a break operation in synchronization with each other. According to this configuration, the bonded substrate can be divided more efficiently.

  (4) Preferably, the transport unit transports the bonded substrate so that the first substrate faces downward. According to this structure, the part of the area | region between the 1st scribe line and the 2nd scribe line in a 1st board | substrate can be dropped below.

  (5) Preferably, the 2nd break unit is arranged downstream of a conveyance way rather than the 1st break unit. Preferably, the second break unit includes a break bar and a backup bar. The break bar presses the bonded substrate from the second substrate side when breaking the bonded substrate. The backup bar includes a pair of support portions that support the bonded substrate from the first substrate side when the bonded substrate is broken. And one support part supports a bonding board | substrate between a 1st scribe line and a 2nd scribe line.

  According to this configuration, the second break unit can more reliably break the first substrate along the second scribe line.

  According to the breaking device according to the present invention, the first substrate and the second substrate can be broken without reversing the front and back of the bonded substrate.

Side surface sectional drawing of a bonding board | substrate. The perspective view of a break device. The side view explaining operation | movement of a break apparatus. The side view explaining operation | movement of a break apparatus. The enlarged view explaining the detail of a 2nd break unit.

  Hereinafter, an embodiment of a break device 100 according to the present invention will be described with reference to the drawings. Before describing the breaking device 100, first, a mother substrate (an example of a bonded substrate) 10 to be processed will be described. FIG. 1 is a side sectional view showing the mother substrate 10.

  As shown in FIG. 1, the mother substrate 10 includes a first substrate 101 and a second substrate 102. The first substrate 101 and the second substrate 102 are bonded together by a sealing material (not shown), and a liquid crystal layer is formed between the first substrate 101 and the second substrate 102, for example. The liquid crystal layer is surrounded by a seal member. A plurality of unit substrates P are manufactured by dividing the mother substrate 10.

  For example, the first substrate 101 is a substrate on which a plurality of color filters are formed, and the second substrate 102 is a substrate on which a plurality of TFTs and terminal regions R1 are formed. The terminal region R1 is a region where the terminal T is formed, and is formed for each unit substrate P. Since the internal TFT and the external device are electrically connected through the terminal T, it is necessary to finally expose the terminal region R1 to the outside.

  First to third scribe lines L1 to L3 are formed between the unit substrates P so that the terminal region R1 can be exposed to the outside. Specifically, only the third scribe line L3 is formed on the second substrate 102, and the first scribe line L1 and the second scribe line L2 are formed on the first substrate 101. A region R2 of the first substrate 101 defined by the first scribe line L1 and the second scribe line L2 faces the terminal region R1 of the second substrate 102. The third scribe line L3 is formed at a position corresponding to the first scribe line L1. A scribe line set S including the first to third scribe lines L1 to L3 is formed for each unit substrate P. In the present embodiment, the scribe lines L1 to L3 are formed only in the direction orthogonal to the transport direction, but a plurality of scribe lines may be formed in a direction parallel to the transport direction.

  FIG. 2 is a perspective view showing the entire breaking device 100. Note that the left side of FIG. 2 is the upstream and the right side is the downstream. In the following description, “conveying direction” means a direction toward the downstream.

  As shown in FIG. 2, the breaking device 100 is a device for breaking the mother substrate 10 along the scribe lines L <b> 1 to L <b> 3 formed on both surfaces of the mother substrate 10, and the first breaking unit 1, It has 2 break unit 2, 3rd break unit 3, and several conveyance unit 4a-4c.

  Each conveyance unit 4a-4c is a unit for conveying the mother board | substrate 10 toward a downstream, for example, can be comprised by a cylindrical roller. Each of the transport units 4a to 4c may have a drive source for rotating the roller, or only one of the transport units has a drive source. The roller of the unit may be driven to rotate. Thus, the mother substrate 10 is transported downstream by the rotation of the rollers of the transport units 4a to 4c. A two-dot chain line in FIG. 2 indicates the conveyance path C of the mother substrate 10.

  The first to third break units 1 to 3 are arranged along the conveyance path C of the mother substrate 10, and from the upstream side, the first break unit 1, the second break unit 2, and the third break unit 3. They are in order. The plurality of transport units 4 a to 4 c are provided upstream of the first break unit 1, between the first break unit 1 and the second break unit 2, and between the second break unit 2 and the third break unit 3. Are arranged one by one. Each of these units 1 to 4c can be moved upstream and downstream so that the interval between the units can be changed.

  The first break unit 1 is a unit for dividing the first substrate 101 of the mother substrate 10 along a first scribe line L1 formed on the mother substrate 10. The first break unit 1 includes a break bar 11 and a backup bar 12. The break bar 11 and the backup bar 12 are arranged at positions facing each other in the vertical direction. More specifically, the break bar 11 and the backup bar 12 are arranged at positions facing each other via the conveyance path C of the mother substrate 10. The break bar 11 is arranged above the conveyance path C, and the backup bar 12 Is disposed below the conveyance path C.

  The break bar 11 extends in a direction parallel to the transport path C and perpendicular to the transport direction. The lower part of the break bar 11 is formed in a triangular prism shape extending in a direction parallel to the transport path C and perpendicular to the transport direction, and has a tapered shape that becomes thinner toward the tip (lower end). The ridge line portion at the tip of the break bar 11 is a pressing portion 111 that comes into contact with the mother substrate 10 during the break operation. The break bar 11 is installed to be movable up and down between an operating position and a non-operating position, and the pressing portion 111 presses the mother board 10 at the operating position. Further, when the break bar 11 is raised from the operating position and is in the non-operating position, the pressing portion 111 does not contact the mother substrate 10.

  The backup bar 12 extends along the longitudinal direction of the break bar 11, that is, extends in a direction parallel to the transport path C and perpendicular to the transport direction. The backup bar 12 has two upper portions, and each upper portion is formed in a triangular prism shape extending in a direction parallel to the transport path C and orthogonal to the transport direction. Each upper portion of the backup bar 12 has a tapered shape that becomes thinner toward the tip (upper end). Two ridge line portions at each tip of the backup bar 12 are support portions 121 a and 121 b that come into contact with the mother substrate 10. Each of the support portions 121 a and 121 b extends along the longitudinal direction of the pressing portion 111. Each support part 121a, 121b extends at a predetermined interval from each other. And the press part 111 is arrange | positioned in the position facing between the support part 121a and the support part 121b. In addition, the distance between each support part 121a, 121b is wider than the width | variety of the press part 111. FIG.

  The second break unit 2 is a unit for dividing the first substrate 101 of the mother substrate 10 along a second scribe line L <b> 2 formed on the mother substrate 10. The second break unit 2 includes a break bar 21 and a backup bar 22. The break bar 21 has a pressing portion 211 at the tip (lower end), and the backup bar 22 has two support portions 221a and 221b at the tip (upper end). Since the second break unit 2 has the same configuration as the first break unit 1 described above, detailed description thereof is omitted.

  The third break unit 3 is a unit for dividing the second substrate 102 of the mother substrate 10 along a third scribe line L3 formed on the mother substrate 10. The third break unit 3 includes a break bar 31 and a backup bar 32. The break bar 31 has a pressing portion 311 at the tip (upper end), and the backup bar 32 has two support portions 321a and 321b at the tip (lower end). The third break unit 3 has the same configuration as the first break unit 1 described above except that the break bar 31 is located below the conveyance path C and the backup bar 32 is located above the conveyance path C. Detailed description will be omitted.

  Next, the operation of the break device 100 configured as described above will be described.

  As shown in FIG. 2, first, the positions of the units 1 to 4c are adjusted based on the size of the mother substrate 10 and the pitch of the scribe lines L1 to L3. The mother substrate 10 is formed with a plurality of scribe line sets including first to third scribe lines L1 to L3 by a scribe device (not shown). In the following description, the scribe line set formed on the downstream end of the mother substrate 10 is referred to as a first scribe line set S1, and the scribe line set formed on the upstream side of the first scribe line set S1 is a second scribe line. A scribe line set formed on the upstream side of the second scribe line set S2 is a third scribe line set S3. Each scribe line set excluding the first scribe line set S1 includes first to third scribe lines L1 to L3. The first scribe line set S1 includes only the second scribe line L2 and the third scribe line L3, and does not include the first scribe line L1.

  Next, the mother board | substrate 10 is intermittently conveyed by each conveyance unit 4a-4c. Specifically, the mother substrate 10 is transported downstream by the transport units 4a to 4c, and the second scribe line L2 of the first scribe line set S1 of the mother substrate 10 is the second break unit as shown in FIG. When 2 is reached, the conveyance is stopped. More specifically, when the second scribe line L2 of the first scribe line set S1 of the mother substrate 10 is positioned below the pressing portion 211 of the break bar 21 in the second break unit 2, each of the transport units 4a to 4c is connected to the mother substrate. 10 transport is stopped. At this time, the first scribe line L1 of the second scribe line set S2 is located below the pressing portion 111 of the break bar 11 of the first break unit 1. In addition, while the mother board | substrate 10 is conveyed, the break bars 11-31 of each break unit 1-3 are in a non-operation position.

  In this state, the first and second break units 1 and 2 operate. Specifically, the break bar 11 of the first break unit 1 is lowered to the operating position, and the pressing portion 111 moves the mother substrate 10 from the second substrate 102 side along the first scribe line L1 of the second scribe line set S2. Press. Thus, the first substrate 101 of the mother substrate 10 is broken along the first scribe line L1 of the second scribe line set S2.

  During the break operation by the first break unit 1, the mother board 10 is supported from below by the support portions 121 a and 121 b of the backup bar 12. Specifically, the support parts 121a and 121b support the mother substrate 10 in a state of straddling the first scribe line L1 of the second scribe line set S2. That is, one support part 121a is in contact with the first substrate 101 on the upstream side of the first scribe line L1 of the second scribe line set S2. The other support portion 121b is in contact with the first substrate 101 on the downstream side of the first scribe line L1 of the second scribe line set S2.

  Similarly, the break bar 21 of the second break unit 2 is also lowered to the operating position, and the pressing portion 211 presses the mother substrate 10 from the second substrate 102 side along the second scribe line L2 of the first scribe line set S1. To do. Accordingly, the first substrate 101 of the mother substrate 10 is broken along the second scribe line L2 of the first scribe line set S1.

  During the break operation by the second break unit 2, the mother board 10 is supported from below by the support portions 221 a and 221 b of the backup bar 22. Specifically, the support portions 221a and 221b support the mother substrate 10 while straddling the second scribe line L2 of the first scribe line set S1. That is, the one support portion 221a is in contact with the first substrate 101 on the upstream side of the second scribe line L2 of the first scribe line set S1. The other support portion 221b is in contact with the first substrate 101 on the downstream side of the second scribe line L2 of the first scribe line set S1.

  When the first substrate 101 of the mother substrate 10 is broken along the second scribe line L2 of the first scribe line set S1 and the first scribe line L1 of the second scribe line set S2, the first and second break units are provided. Each of the break bars 11 and 21 of 1 and 2 returns to the inoperative position. And each conveyance unit 4a-4c act | operates and the mother board | substrate 10 is conveyed further downstream.

  As shown in FIG. 4, when the third scribe line L <b> 3 of the first scribe line set S <b> 1 of the mother substrate 10 reaches the third break unit 3, each of the transfer units 4 a to 4 c stops the transfer of the mother substrate 10. Specifically, when the third scribe line L3 of the first scribe line set S1 of the mother board 10 is positioned above the pressing portion 311 of the break bar 31 in the third break unit 3, each of the transfer units 4a to 4c performs a transfer operation. Stop. In this state, the second scribe line L2 of the second scribe line set S2 of the mother substrate 10 reaches the second break unit 2. Specifically, the second scribe line L2 of the second scribe line set S2 of the mother substrate 10 is located below the pressing portion 211 of the break bar 21 in the second break unit 2. Furthermore, in this state, the first scribe line L1 of the third scribe line set S3 of the mother substrate 10 reaches the first break unit 1. Specifically, the first scribe line L1 of the third scribe line set S3 of the mother substrate 10 is located below the pressing portion 111 of the break bar 11 in the first break unit 1.

  In this state, the first break unit 1, the second break unit 2, and the third break unit 3 operate in synchronization with each other. Specifically, the break bar 11 of the first break unit 1 is lowered to the operating position, and the pressing portion 111 moves the mother substrate 10 from the second substrate 102 side along the first scribe line L1 of the third scribe line set S3. Press. Thus, the first substrate 101 of the mother substrate 10 is broken along the first scribe line L1 of the third scribe line set S3. The mother substrate 10 is supported from below by the support portions 121 a and 121 b of the pack-up bar 12.

  Further, the break bar 21 of the second break unit 2 is lowered to the operating position, and the pressing portion 211 presses the mother substrate 10 from the second substrate 102 side along the second scribe line L2 of the second scribe line set S2. As a result, the first substrate 101 of the mother substrate 10 is broken along the second scribe line L2 of the second scribe line set S2. Here, since the mother substrate 10 is transported with the first substrate 101 facing downward, a portion corresponding to the region R2 of the first substrate 101 falls downward and the terminal T is exposed to the outside. .

  During the break operation by the second break unit 2, the mother board 10 is supported from below by the support portions 221 a and 221 b of the backup bar 22. More specifically, as illustrated in FIG. 5, the support portions 221 a and 221 b support the mother substrate 10 in a state of straddling the second scribe line L <b> 2 of the second scribe line set S <b> 2. That is, one support portion 221a is in contact with the first substrate 101 on the upstream side of the second scribe line L2. The other support portion 221b is in contact with the first substrate 101 on the downstream side of the second scribe line L2. Here, one support portion 221b is in contact with the first substrate 101 between the first scribe line L1 and the second scribe line L2 in the second scribe line set S2. That is, one support portion 221b is in contact with the region R2 of the first substrate.

  Further, the break bar 31 of the third break unit 3 rises to the operating position, and the pressing portion 311 presses the mother substrate 10 from the first substrate 101 side along the third scribe line L3 of the first scribe line set S1. As a result, the second substrate 102 of the mother substrate 10 is broken along the third scribe line L3 of the first scribe line set S1. The mother substrate 10 is supported from above by the support portions 321 a and 321 b of the backup bar 32.

  By repeating the above operation, the mother substrate 10 can be divided and a plurality of unit substrates P can be taken out.

[Modification]
As mentioned above, although embodiment of this invention was described, this invention is not limited to these, A various change is possible unless it deviates from the meaning of this invention.

Modification 1
In the above embodiment, the first break unit 1, the second break unit 2, and the third break unit 3 are arranged in this order from the upstream side, but the present invention is not particularly limited to this. For example, the third break unit 3 may be arranged on the most upstream side, or the arrangement of the first break unit 1 and the second break unit 2 may be switched.

Modification 2
In the above embodiment, the first to third break units 1 to 3 execute the break operation in synchronization with each other, but are not particularly limited thereto. For example, the first to third break units 1 to 3 may execute the respective break operations at different timings.

Modification 3
In the above embodiment, the mother substrate 10 is transported with the first substrate 101 facing downward and the second substrate 102 facing upward. However, the present invention is not limited to this. The two substrates 102 may be transported in a state of facing downward. In this case, in the first to third break units 1 to 3, the positions of the break bars 11 to 31 and the backup bars 12 to 32 are reversed up and down with respect to the above-described embodiment.

DESCRIPTION OF SYMBOLS 100 Break apparatus 1 1st break unit 2 2nd break unit 3 3rd break unit 4a-4c Conveyance unit 10 Mother board (bonding board)
101 1st board | substrate 102 2nd board | substrate L1 1st scribe line L2 2nd scribe line L3 3rd scribe line

Claims (5)

First and second scribe lines formed on the first substrate side surface of the bonded substrate obtained by bonding the first substrate and the second substrate, and a third scribe line formed on the second substrate side surface; A breaking device for breaking a bonded substrate along
A transport unit for transporting the bonded substrate;
A first break unit for breaking the first substrate along the first scribe line;
A second break unit for breaking the first substrate along the second scribe line;
A third break unit for breaking the second substrate along the third scribe line;
With
The first break unit, the second break unit, and the third break unit are arranged spaced apart from each other along the conveyance path of the bonded substrate board ,
The first break unit has a first break bar that presses the bonded substrate along the first scribe line from the second substrate side,
The second break unit has a second break bar that presses the bonded substrate along the second scribe line from the second substrate side,
The third break unit has a third break bar that presses the bonded substrate along the third scribe line from the first substrate side.
Break device. The second substrate has a terminal region;
A region of the first substrate between the first scribe line and the second scribe line is opposed to the terminal region;
The third scribe line is formed at a position corresponding to the first scribe line or the second scribe line;
The break device according to claim 1.   The break device according to claim 1, wherein the first break unit, the second break unit, and the third break unit perform a break operation in synchronization with each other.   The break device according to any one of claims 1 to 3, wherein the transport unit transports the bonded substrate so that the first substrate faces downward. The second break unit is disposed downstream of the transport path from the first break unit,
The second break unit includes a break bar that presses the bonded substrate from the second substrate side when the bonded substrate is broken, and the bonded substrate that is bonded to the first substrate when the bonded substrate is broken. A backup bar including a pair of support portions supported from the substrate side;
One of the support portions supports the bonded substrate between the first scribe line and the second scribe line,
The break device according to any one of claims 1 to 4.

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