TWI406326B - Dust collecting device, auto clean device and auto clean method - Google Patents

Abstract

A dust collecting device includes an air-extracting device, a dust collecting body, a brush and a moving device. The dust collecting body is communicating with the air-extracting device and having a suction inlet. The brush is disposed on the dust collecting body along the outline of the suction inlet. The moving device is used to move the dust collecting body disposed on the moving device.

Description

Dust collecting device, automatic cleaning device and automatic cleaning method

The present invention relates to a cleaning device and a cleaning method, and more particularly to a dust collecting device, an automatic cleaning device, and an automatic cleaning method.

The fabrication of an integrated circuit requires a high degree of cleanliness in order to achieve the desired function and purpose of the integrated circuit. Under the current technological development of semiconductors, the integration of integrated circuits has also increased. Therefore, the removal of fine dust of a machine such as a semiconductor component is very important.

Lead/Mark Scanner is a testing instrument used in the industry to detect the appearance of wafers. The glass base (including the stage) used for testing, such as foreign matter, such as particles or slag. In the detection process, the foot/printing machine will misjudge the normal product as a faulty product, which leads to problems such as a decrease in product yield and an increase in manufacturing cost.

Although the original foot/printing scanner has an air blowing device, the foreign matter and the glass base may affect the foreign matter due to the adhesion or electrostatic value.

In view of the above, an object of the present invention is to provide a dust collecting device capable of efficiently collecting foreign matter.

Another object of the present invention is to provide an automatic cleaning device that automatically and efficiently cleans the light transmissive base of a semiconductor machine.

It is still another object of the present invention to provide an automatic cleaning method capable of improving product yield and reducing manufacturing costs.

The invention provides a dust collecting device, which comprises an air extracting device, a dust collecting body, a bristles and a moving device. The vacuuming body is in communication with the air suction device and has a suction port. The bristles are disposed on the dust suction body along the contour of the suction port. The mobile device is configured to move the dust suction body disposed on the mobile device.

According to an embodiment of the present invention, in the dust collecting device described above, the air suction device includes a vacuum pump.

According to an embodiment of the present invention, the dust collecting device further includes a dust suction pipe that communicates the air suction device and the dust suction body.

According to an embodiment of the present invention, the dust collecting device further includes a filter disposed between the air extracting device and the dust collecting body.

According to an embodiment of the present invention, in the dust collecting device described above, the material of the bristles includes an antistatic material.

According to an embodiment of the present invention, in the dust collecting device described above, the bristles include annular bristles.

According to an embodiment of the present invention, in the dust collecting device described above, the moving device includes a lifting device to vertically move the dust suction body.

The invention provides an automatic cleaning device for cleaning a transparent base in a semiconductor machine. The automatic cleaning device comprises a dust collecting device and a switch. The dust collecting device includes an air suction device, a dust suction body, bristles, and a moving device. The vacuuming body is in communication with the air suction device and has a suction port. The bristles are disposed on the dust suction body along the contour of the suction port. The mobile device is configured to move the dust suction body disposed on the mobile device. The switch is electrically connected to the dust collecting device and the semiconductor machine for receiving the starting signal from the semiconductor machine, so that the dust collecting device cleans the transparent base during the operating time.

According to an embodiment of the present invention, the automatic cleaning device further includes a programmable logic controller electrically connected to the dust collecting device and the switch to program to control the actuation time.

According to an embodiment of the present invention, in the above automatic cleaning device, the switch includes a solenoid valve.

In accordance with an embodiment of the present invention, in the above automatic cleaning apparatus, the semiconductor machine includes a foot/printing scanning machine. The foot/printing scanning machine includes a light transmitting base, a stage, and a wafer picking device. The stage is disposed on the light transmissive base. The wafer pick-up device is disposed on one side of the light-transmitting base for picking up the wafer in the wafer tray at the feeding position, and placing the wafer on the stage.

According to an embodiment of the present invention, in the automatic cleaning device described above, the moving device includes a wafer pick-up device, and the dust-collecting body is located on a side of the wafer pick-up device near the light-transmitting base.

According to an embodiment of the present invention, in the automatic cleaning device, the moving device further includes a lifting device disposed on a side wall of the wafer pick-up device near one side of the light-transmitting base to vertically move the dust-collecting body.

According to an embodiment of the present invention, in the automatic cleaning device described above, the activation signal includes a signal sent when the wafer tray leaves the feeding position.

In accordance with an embodiment of the present invention, in the automatic cleaning device described above, the foot/printing scanning machine further includes a pusher for pushing or pushing the wafer tray into the feeding position.

According to an embodiment of the present invention, in the automatic cleaning device, the activation signal includes a pusher for pushing the wafer tray out of the feeding position. The signal that drives the thruster.

According to an embodiment of the present invention, in the above automatic cleaning device, the length of the bristles is, for example, greater than the height of the stage.

According to an embodiment of the present invention, in the above automatic cleaning device, the air suction device includes a vacuum pump.

According to an embodiment of the present invention, in the automatic cleaning device described above, the dust suction pipe communicates with the air suction device and the dust suction body.

According to an embodiment of the present invention, in the automatic cleaning device, the filter further includes a filter disposed between the air suction device and the dust suction body.

According to an embodiment of the present invention, in the above automatic cleaning device, the material of the bristles comprises an antistatic material.

According to an embodiment of the invention, in the above automatic cleaning device, the bristles comprise annular bristles.

According to an embodiment of the present invention, in the above automatic cleaning device, the moving device includes a lifting device to vertically move the dust suction body.

According to an embodiment of the present invention, in the above automatic cleaning device, the light transmissive base includes a base portion.

According to an embodiment of the present invention, in the above automatic cleaning device, the material of the base portion includes a light permeable material.

According to an embodiment of the present invention, in the above automatic cleaning device, the light permeable material comprises glass.

According to an embodiment of the present invention, in the automatic cleaning device, the light transmissive base further includes a coating layer disposed on the base portion.

According to an embodiment of the invention, in the above automatic cleaning device The material of the coating layer includes a white latex.

The present invention provides an automatic cleaning method for cleaning a light transmissive susceptor in a semiconductor machine using an automatic cleaning device as described above. The automatic cleaning method includes the following steps. First, before all wafers in the wafer tray at the feed position are detected, the foot/printing scanner will send a signal to drive the pusher and act as a start signal for the automatic cleaning device. Next, the start signal is transmitted to the switch. Then, the switch activates the dust collecting device to cause the dust collecting device to clean the light transmitting base. Next, the switch turns off the dust collector.

According to an embodiment of the present invention, in the automatic cleaning method described above, the mobile device includes a wafer pick-up device and a lifting device. The vacuuming body is located on a side of the wafer pick-up device adjacent to the light-transmitting base to horizontally move the vacuuming body. The lifting device is disposed on a side wall of the wafer pick-up device near one side of the light-transmitting base to vertically move the dust-collecting body.

According to an embodiment of the present invention, in the above automatic cleaning method, the step of activating the dust collecting device includes the following steps. First, turn on the air suction device. Next, the height of the dust suction body is defined by the vertical movement of the lifting device to bring the bristles into contact with the light transmitting base. Then, the foreign matter is brushed into the suction port by the horizontal movement of the wafer pickup device. Next, the foreign matter is removed from the light transmitting base by the suction of the air suction device.

According to an embodiment of the present invention, in the automatic cleaning method, the automatic cleaning device further includes a programmable logic controller electrically connected to the dust collecting device and the switch to write a program to control the actuation time.

According to an embodiment of the present invention, in the above automatic cleaning method, before the transmitting signal is transmitted to the switch, the following steps are further included. First, the start signal is received by the programmable logic controller, and the start signal including the time point of opening and the length of the actuation time is calculated via the programmed program. Next, the start signal including the time point of opening and the length of the actuation time is transmitted to the switch.

Based on the above, in the dust collecting device proposed by the present invention, since the dust collecting main body is provided on the moving device, the cleaning route and the height of the dust collecting body can be set as needed, and the foreign matter can be efficiently collected.

In addition, in the automatic cleaning device proposed by the present invention, the switch receives the activation signal from the semiconductor machine, so that the dust collecting device can automatically and effectively clean the light-transmitting base during the operating time.

In addition, since the automatic cleaning method proposed by the present invention can automatically clean the light-transmitting pedestal of the semiconductor machine, the product yield can be improved and the manufacturing cost can be reduced.

In turn, the use of manpower is greatly reduced, and the output efficiency of the machine is increased.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

FIG. 1 is a schematic view of a dust collecting device according to an embodiment of the present invention.

Referring to FIG. 1 , the dust collecting device 100 includes an air extracting device 102 , a dust collecting body 104 , bristles 106 , and a moving device 108 . The air suction device 102 is, for example, a vacuum pump.

The dust suction body 104 is disposed on the mobile device 108 and communicates with the air suction device 102 and has a suction port 110. In addition, the dust collecting device 100 further includes The dust suction pipe 112 is configured to communicate the air suction device 102 and the dust suction body 104.

The bristles 106 are disposed on the dust suction main body 104 along the outline of the suction port 110, and the foreign matter can be brushed into the suction port 110. The material of the bristles 106 is, for example, an antistatic material, and it is possible to prevent foreign matter from being adsorbed on the bristles 106 by electrostatic force. In the present embodiment, the bristles 106 are disposed, for example, along the contour of the suction port 110 to form an annular bristles, but are not intended to limit the present invention.

The mobile device 108 is configured to move the dust suction body 104 disposed on the mobile device 108. The moving device 108 includes a lifting device 114. The dust collecting body 104 is fixed on the lifting device 114, and the cleaning body 104 can be vertically moved by the lifting device 114. Therefore, the lifting device 114 can set the bristles 106 at a height suitable for cleaning, and can It is avoided that the object to be cleaned is damaged due to the height of the vacuum main body 104 being too low. The lifting device 114 is driven, for example, by a pneumatic cylinder.

Additionally, mobile device 108 may further include horizontal mobile device 116. The horizontal moving device 116 is coupled to the lifting device 114 and can be used to horizontally move the cleaning body 104. The horizontal moving device 116 is, for example, a robotic arm.

On the other hand, the dust collecting device 100 further includes a filter 118 which is provided in the dust suction pipe 112 between the air suction device 102 and the dust suction main body 104, and can be used to filter foreign matter sucked by the suction port 110.

As can be seen from the above embodiment, the mobile device 108 in the dust collecting device 100 can set the predetermined cleaning route and the height of the dust collecting body 104 as needed, so that the dust collecting device 100 can efficiently collect foreign matter.

2 is a schematic view of an automatic cleaning device according to an embodiment of the present invention. 3 is an automatic cleaning device and a foot/printing scanner of the present invention. Schematic diagram of the electrical connection of the station.

Referring to FIG. 2, the automatic cleaning device 200 is applied to a semiconductor machine having a light transmissive base for cleaning the light transmissive base in the semiconductor machine. In the present embodiment, the semiconductor machine is described by taking the foot/printing machine 300 as an example. Hereinafter, the pin/printer table 300 will be described first.

The foot/printing scan station 300 includes a light transmissive base 302, a stage 304, and a wafer pickup device 306. The light transmissive base 302 includes a base portion 318. The material of the base portion 318 is, for example, a light transmissive material such as glass. In addition, the transparent base 302 further includes a coating layer 320 disposed on the base portion 318. The material of the coating layer 320 is, for example, a white latex. In the case where the light transmissive base 302 includes the coating layer 320, the entire light transmissive base 302 is translucent.

The stage 304 is disposed on the light transmissive base 302 and can be used to carry the wafer. The material of the stage 304 is, for example, a metal material. When the wafer is placed on the stage 304, the shadow of the wafer is displayed on the transparent base 302, and is read by a camera (not shown) to determine whether it is abnormal.

The wafer pick-up device 306 includes a wafer pick-up head 308. The wafer pick-up device 306 is disposed on one side of the transparent substrate 302, and the wafer 314 in the wafer tray 312 at the feeding position 310 is picked up by the wafer pick-up head 308, and the wafer 314 is placed on the stage 304. After picking up the wafer 314, the wafer pick-up device 306 is moved over the stage 304, for example, by a linear pulley (not shown) in the wafer pick-up device 306.

In addition, the foot/printing scan station 300 can further include a pusher 316 for pushing the wafer tray 312 into or out of the feed position 310.

The automatic cleaning device 200 includes a dust collecting device 202 and a switch 204. this The difference between the dust collecting device 202 in the embodiment and the dust collecting device 100 in the above embodiment is that in the dust collecting device 202, the horizontal moving device in the moving device 108' is the wafer in the foot/front printing scanner table 300. Pickup device 306. The lifting device 114 in the moving device 108' is disposed on the side wall of the wafer pick-up device 306 near one side of the transparent substrate 302, so that the cleaning body 104 is also located on the side of the wafer pick-up device 306 near the transparent substrate 302, and The dust suction body 104 fixed to the lifting device 114 can be vertically moved by the lifting device 114. In addition, in order to prevent the dust-collecting body 104 from colliding with the stage 304 when cleaning the light-transmitting base 302, the distance between the dust-collecting body 104 and the light-transmitting base 302 must be greater than the height of the stage 304. As such, in order to ensure that the bristles 106 can contact the light transmissive base 302, the length of the bristles 106 is, for example, greater than the height of the stage 304. In addition, the dust collecting device 202 and the dust collecting device 100 are substantially the same in materials, installation methods, and functions of other members, and thus will not be described again.

Referring to FIG. 2 and FIG. 3 simultaneously, the switch 204 is electrically connected to the dust collecting device 202 and the semiconductor machine 300 for receiving the start signal sent by the semiconductor machine 300, so that the dust collecting device 202 cleans the light-transmitting base during the operating time. Block 302. The switch 204 is, for example, a solenoid valve. The actuation time is, for example, set to a fixed time from the opening to the opening and closing of the switch 204. The start signal is, for example, a signal sent by the wafer tray 312 as it exits the feed position 310, such as a signal used by the pusher 316 to drive the pusher 316 when the wafer tray 312 is pushed out of the feed position 310.

In addition, the automatic cleaning device 200 further includes a programmable logic controller 206 electrically connected to the dust collecting device 202 and the switch 204 for programming control. Acting time. After receiving the activation signal, the automatic cleaning device 200 can control the time point at which the switch 204 is turned on and the length of the operation time of the switch 204 from on to on.

Hereinafter, the cleaning process of the light-transmissive base 302 in the automatic cleaning device 200 cleaning foot/printing scanner table 300 will be exemplified.

First, the foot/printing scan station 300 sends a signal for driving the pusher 316 before the detection of all the wafers 314 in the wafer tray 312 at the feed position 310, and serves as the start signal for the automatic cleaning device 200. .

Then, the programmable logic controller 206 receives the startup signal, and calculates a startup signal including the time point of the opening and the length of the actuation time via the programmed program.

Then, the start signal including the time point of opening and the length of the actuation time is transmitted to the switch 204.

Next, at the time of opening, the dust collecting device 202 is activated to cause the dust collecting device 202 to clean the light transmitting base 302 within the operating time. Initiating the dust collecting device 202 includes opening the air extracting device 102, defining the height of the dust collecting body 106 by vertical movement of the lifting device 114 in the moving device 108', contacting the bristles 106 with the light transmitting base 302, and by the wafer picking device The horizontal movement of 306 (horizontal moving device) causes the foreign matter to be brushed into the suction port 110, and the foreign matter is removed from the light transmitting base 302 by the suction of the air extracting device 102.

Thereafter, when the operation time of the dust collecting device 202 is completed, the switch 204 closes the dust collecting device.

Based on the above, the switch 204 receives the start of the semiconductor machine. The signal can enable the dust collecting device 202 to clean the transparent base 302 during the operating time to achieve the effect of automatic cleaning, and can greatly reduce the use of manpower.

In addition, the automatic cleaning device 200 can effectively remove foreign matter on the transparent base 302, thereby improving product yield and reducing manufacturing costs.

In summary, the above embodiment has at least one of the following advantages: 1. The dust collecting device of the above embodiment is capable of efficiently collecting foreign matter.

2. The automatic cleaning effect can be achieved by the automatic cleaning device in the above embodiment, thereby greatly reducing the use of manpower.

3. The automatic cleaning method in the above embodiment can improve product yield and reduce manufacturing cost.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

100, 202‧‧‧ dust collecting device

102‧‧‧Exhaust device

104‧‧‧ Vacuum body

106‧‧‧ bristles

108, 108’‧‧‧Mobile devices

110‧‧‧Inhalation

112‧‧‧Dust suction line

114‧‧‧ Lifting device

116‧‧‧Horizontal mobile device

118‧‧‧Filter

200‧‧‧Automatic cleaning device

204‧‧‧Switch

206‧‧‧Programmable Logic Controller

300‧‧‧Foot/printing scanner

302‧‧‧Lighting base

304‧‧‧ stage

306‧‧‧ wafer pick-up device

308‧‧‧ wafer pick-up head

310‧‧‧ Feeding position

312‧‧‧ Chip plate

314‧‧‧ wafer

316‧‧‧ propeller

318‧‧‧Base section

320‧‧‧coating layer

FIG. 1 is a schematic view of a dust collecting device according to an embodiment of the present invention.

2 is a schematic view of an automatic cleaning device according to an embodiment of the present invention.

FIG. 3 is a schematic diagram showing the electrical connection between the automatic cleaning device and the foot/printing scanning machine of the present invention.

100‧‧‧dust collection device

102‧‧‧Exhaust device

104‧‧‧ Vacuum body

106‧‧‧ bristles

108‧‧‧Mobile devices

110‧‧‧Inhalation

112‧‧‧Dust suction line

114‧‧‧ Lifting device

116‧‧‧Horizontal mobile device

118‧‧‧Filter

Claims (26)

An automatic cleaning device for cleaning a light-transmitting base in a semiconductor machine, comprising: a dust collecting device comprising: an air extracting device; a vacuuming body communicating with the air extracting device and having a suction port; a bristles disposed on the dust suction body along a contour of the suction port; and a moving device for moving the dust suction body disposed on the mobile device; and a switch electrically connecting the dust collecting device and the semiconductor machine And a receiving signal sent by the semiconductor machine to enable the dust collecting device to clean the transparent base during an operating time. The automatic cleaning device of claim 1, further comprising a programmable logic controller electrically connected to the dust collecting device and the switch to program to control the actuation time. The automatic cleaning device of claim 1, wherein the switch comprises a solenoid valve. The automatic cleaning device of claim 1, wherein the semiconductor machine comprises a foot/printing scanning machine, the foot/printing scanning machine comprises: the transparent base; a loading platform; And the wafer pick-up device is disposed on one side of the light-transmitting base for picking up A wafer in a wafer tray at a feed location is taken and the wafer is placed on the wafer. The automatic cleaning device of claim 4, wherein the moving device comprises the wafer pick-up device, and the vacuuming body is located on a side of the wafer pick-up device adjacent to the light-transmitting base. The automatic cleaning device of claim 5, wherein the moving device further comprises a lifting device disposed on a side wall of the wafer pick-up device adjacent to one side of the light-transmitting base to vertically move the vacuuming body. The automatic cleaning device of claim 4, wherein the activation signal comprises a signal sent when the wafer tray leaves the feeding position. The automatic cleaning device of claim 4, wherein the foot/printing scanning machine further comprises a pusher for pushing or pushing the wafer tray into the feeding position. The automatic cleaning device of claim 8, wherein the activation signal comprises a signal for driving the propeller when the propeller is to be pushed out of the feeding position. The automatic cleaning device of claim 4, wherein the length of the bristles is greater than the height of the stage. The automatic cleaning device of claim 1, wherein the suction device comprises a vacuum pump. The automatic cleaning device according to claim 1, further comprising a dust suction pipe connecting the air suction device and the dust suction body. Such as the automatic cleaning device described in claim 1 of the patent scope, A filter is disposed between the air suction device and the dust suction body. The automatic cleaning device of claim 1, wherein the material of the bristles comprises an antistatic material. The automatic cleaning device of claim 1, wherein the bristles comprise an annular bristles. The automatic cleaning device of claim 1, wherein the moving device comprises a lifting device to vertically move the cleaning body. The automatic cleaning device of claim 1, wherein the light transmissive base comprises a base portion. The automatic cleaning device of claim 17, wherein the material of the base portion comprises a light transmissive material. The automatic cleaning device of claim 18, wherein the permeable material comprises glass. The automatic cleaning device of claim 17, wherein the light transmissive base further comprises a coating layer disposed on the base portion. The automatic cleaning device of claim 20, wherein the material of the coating layer comprises a white latex. An automatic cleaning method for cleaning the transparent substrate in the semiconductor machine using an automatic cleaning device as described in claim 11, the method comprising: all of the wafer trays located at the feeding position Before the wafers are detected, the pin/printing machine sends a signal for driving the pusher, and serves as the start signal of the automatic cleaning device; and transmits the start signal to the switch; The switch activates the dust collecting device to cause the dust collecting device to clean the light transmitting base; and the switch closes the dust collecting device. The automatic cleaning method of claim 22, wherein the moving device comprises: the wafer pick-up device, and the vacuuming body is located on a side of the wafer pick-up device near the light-transmitting base to horizontally move the vacuuming body And a lifting device disposed on a side wall of the wafer pick-up device on a side of the light-transmitting base to vertically move the dust-collecting body. The automatic cleaning method of claim 23, wherein the step of activating the dust collecting device comprises: opening the air extracting device; defining a height of the dust collecting body by vertical movement of the lifting device, so that the bristles are transparent The light base is in contact; the foreign matter is brushed into the suction port by the horizontal movement of the wafer pick-up device; and the foreign matter is removed from the light-transmitting base by the suction force of the air suction device. The automatic cleaning method of claim 22, wherein the automatic cleaning device further comprises a programmable logic controller electrically connected to the dust collecting device and the switch to program to control the actuation time. The automatic cleaning method of claim 25, wherein before the transmitting the signal to the switch, the method further comprises: receiving, by the programmable logic controller, the startup signal, and calculating, by using the programmed program, The time point of opening and the length of the actuation time The start signal is transmitted; and the start signal including the time point of opening and the length of the actuation time is transmitted to the switch.