KR100555795B1 - Cleaner of Semiconductor Package - Google Patents

Abstract

The present invention relates to a cleaning apparatus for a semiconductor package, wherein the substrate (3) in an inverted state in which the package faces downward is mounted on the magazine (110), loaded with a transfer rail (130), and a magazine (110). A conveyance rail unit 130 to which the substrate 3 of the substrate 3 is loaded and clamped, a conveying unit 140 installed near one side of the conveying rail unit 130 to move the loaded substrate 3 to a cleaning position, It is installed in the lower portion of the conveying rail unit 130 in a vacuum state and includes a cleaning means 150 for spraying the high pressure air toward the substrate 3 from below. Therefore, the impact of the camera module is minimized by injecting air from below from the air nozzle vibrating from side to side on the substrate loaded upside down, and fine dust and impurities attached to the epoxy are effectively cleaned to improve the reliability of the product. .

Description

Cleaner for Semiconductor Packages {CLEANING DEVICE OF SEMICONDUCTOR PACKAGE}

1 is a cross-sectional view schematically showing an example of a conventional semiconductor package,

2 is a front view of a cleaning apparatus for a semiconductor package according to the present invention,

3 is a side view of the conveying means according to the present invention;

4 is a plan view of the cleaning means according to the present invention;

5 is a front view of the cleaning means according to the present invention,

6 is a side view of the cleaning means according to the present invention;

Figure 7 is a side view of the use of the cleaning means according to Figure 6,

8 is a perspective view of the use of the cleaning means according to the present invention.

<Description of the code | symbol about the principal part of drawing>

110: magazine 120: loading unit

130: the soleil portion 140: transfer means

150: washing means 160: ion nozzle

170: dust collector 180: inspection unit

190: unloading unit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, and more particularly, to a cleaning apparatus for a semiconductor package for effectively removing foreign substances on the semiconductor chip and glass attached to the semiconductor chip after wire bonding during the production process of the lamination camera module. will be.

BACKGROUND ART In general, a solid state imaging device of a semiconductor package uses a photoelectric conversion device and a charge coupling device to photograph an object and output it as an electrical signal, and is used in a CCD (charge coupled device) camera or a digital camera.

1 is a cross-sectional view schematically showing an example of a semiconductor package using a conventional solid state image pickup device. As shown in the drawing, the semiconductor package 1 for a solid state image pickup device includes a semiconductor chip 2 for a solid state image pickup device. ), The semiconductor chip 2 for a solid state image pickup device is bonded to a wire 4 on a substrate 3, and a transparent glass 5 is attached to the upper portion of the semiconductor chip 2 for a solid state image pickup device.

And the camera module 7 provided with the housing 6 in the upper part of the glass 5 is installed.

In the semiconductor package 1 for a conventional solid state image pickup device configured as described above, the image signal of the light passing through the camera module 7 and the glass 5 is converted into an electrical signal by the semiconductor chip 2 for the solid state image pickup device. The converted electric signal is transmitted to the substrate 3 through the wire 4, and is transmitted to the external device through the metal line (not shown) in the substrate 3.

In the conventional semiconductor package for a solid-state image pickup device, a cleaning process is performed to remove foreign substances from the semiconductor chip 2 before attaching the glass 5, and after the glass 5 is attached, the camera module 7 is installed. Before the cleaning process takes place.

By the way, such a cleaning process is simply performed by a worker by holding the board | substrate 3 and injecting a brush or high pressure air. Therefore, there is a problem in that the semiconductor package is contaminated or not effectively cleaned by the operator.

The present invention is to solve the conventional problems as described above, to provide a cleaning device for a semiconductor package that can be effectively carried out by the process of cleaning the package by spraying air from below to the semiconductor chip and glass of the substrate to be loaded upside down. The purpose is.

In order to achieve the above object, the present invention provides a cleaning apparatus for a semiconductor package in which a substrate mounted in a magazine is loaded and cleaned with high pressure air, wherein the substrate in a state in which the package is inverted so that the package faces downward is mounted and loaded in the magazine. The conveying rail portion which is clamped, the conveying means for moving the loaded substrate close to one side of the conveying rail portion to the cleaning position, and the lower portion of the conveying rail portion in a vacuum state are installed under the vacuum toward the substrate under high pressure. Provided is a cleaning apparatus for a semiconductor package including cleaning means sprayed upward.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a front view of a cleaning apparatus for a semiconductor package according to the present invention, FIG. 3 is a side view of a conveying means according to the present invention, FIG. 4 is a plan view of the cleaning means according to the present invention, and FIG. 5 is a cleaning according to the present invention. 6 is a side view of the cleaning means according to the invention, FIG. 7 is a side view of the cleaning means according to FIG. 6, and FIG. 8 is a perspective view of the cleaning means according to the invention.

According to the present invention, as shown in FIG. 2, a case 100 having a caster 102 at a lower end thereof, and a magazine 3 on which the substrate 3 of the package 1 is mounted inside the case 100. 110, a loading unit 120 for extracting the substrate 3 from the magazine 110, a transfer rail unit 130 on which the substrate 3 is loaded, and a substrate 3 loaded on the transfer rail unit 130. ) Is largely composed of a conveying means 140 for conveying) and a washing means 150 for cleaning the substrate 3.

In addition, the inspection unit 180 which inspects the state of the semiconductor chip 2 of the substrate 3 at the rear end of the transfer rail 130 and the unloading unit 190 which unloads the substrate 3 having been cleaned and inspected are provided. Is installed.

Here, preferably about 120 semiconductor chips 2 are mounted in one cell of the substrate 3, after the wire bonding in producing a lamination camera module, the glass 5 is attached to each semiconductor chip 2. ) And the camera module 7 are attached.

This substrate 3 is preferably mounted in the magazine 110 with the camera module 7 of the semiconductor chip 2 facing downward, i.e., in an upside down state.

The magazine 110 includes a sensor (not shown) for detecting a mounting state of the substrate 3 mounted therein. And the lower portion of the magazine 110 is provided with a lifting device 112 that can raise and lower the magazine 110, the upper portion of the magazine 110 to extract the substrate 3 from the elevated magazine 110 The loading unit 120 is installed.

The loading unit 120 moves the substrate 3 in the raised magazine 110 by installing a roller. And one side of the loading unit 120 is provided with a conveying rail 130 extending in the longitudinal direction.

Cylinders 132 for clamping the moved substrate 3 are installed on both sides of the transfer rail 130.

In addition, a transfer means 140 for moving the substrate 3 loaded to one side proximal portion of the transfer rail 130 to a cleaning position is installed.

3, the transfer means 140 shown in FIG. 3 is provided with a pusher 142 that pushes the loaded substrate 3 forward, and a cylinder 143 is installed at one side leading to the pusher 142, thereby providing a Adjust the height up and down.

In addition, an LM guide 144 is provided to move the pusher 142 to one side of the cylinder 143, and includes a timing belt 145 and a timing motor 146 for driving the LM guide 144 forward and backward. do.

On the other hand, the cleaning means 150 is installed in a vacuum state in which the high-pressure air is injected downward from the upper side toward the fixed substrate 3 is turned over to the lower portion of the transfer rail 130.

4, 5, and 6, the cleaning means 150 is provided with a cover 151 for maintaining the interior in a vacuum state, and the sub-motor 152 capable of forward and reverse rotation inside the cover 151 is provided. Is installed.

A lead screw 153 is installed at one side of the sub-motor 152, and a nut bracket 154 is moved forward and backward along the lead screw 153 on the lead screw 153.

The nozzle plate 155 is connected to one side of the nut bracket 154, and a plurality of air nozzles 156, through which high pressure air is injected, are installed at the upper portion of the nozzle plate 155.

About 5 air nozzles 156 are arranged in the same line as the number of semiconductor chips 2 on the substrate 3, and nozzle parts are provided to face upwards, and preferably 30 ° to 90 ° injection angles. Has

The number of air nozzles 156 may be variously mounted according to the type of package 1.

In addition, an air cylinder 158 connected to the bracket 157 is further installed between the nut bracket 154 and the nozzle plate 155. The air cylinder 158 vibrates the nozzle plate 155 horizontally and vertically. Preferably, the nozzle plate 155 can also be rotated.

In addition, the height adjustment lever 159 is provided on the nut bracket 154 like the guide 159a so that the nozzle plate 155 is height-adjusted in the vertical direction according to the thickness of the substrate 3.

In addition, at least one ion nozzle 160 is installed in the cover of the cleaning means 150 to face upward.

The ion nozzle 160 removes static electricity generated in the package 1 before and after the cleaning process performed by the cleaning means 150.

Referring back to FIG. 2, a dust collector 170 is connected to the lower end of the cover 151 of the cleaning means 150.

The dust collector 170 is vacuum sucked from the bottom so that the foreign matter removed in the cleaning process is suspended and is not reattached on the package 1.

The dust collector 170, the blower fan 171 is installed inside, the motor 172 for driving the blower fan 171 is installed, the foreign matter sucked through the blower fan 171 to the outside Exhaust duct 173 which helps to discharge is configured to penetrate the lower surface of the case 100 to the outside.

The operation of the cleaning apparatus of the semiconductor package according to the present invention configured as described above will be described with reference to the drawings.

Preferably, a cleaning process is performed to remove foreign substances from the semiconductor chip 2 before the glass 5 is attached to the semiconductor package 1, and after the glass 5 is attached, cleaning is performed before installation of the camera module 7. Each process takes place.

The magazine 110 is mounted with the inverted substrate 3 so that the camera module 7 faces downward.

The main body of the magazine 110 where the mounting of the substrate 3 is completed is positioned in the loading unit 120 by the elevation of the elevating device 112. In the loading unit 120, the mounted substrate 3 is sequentially lifted up again to the roller. It is seated, and is loaded on the conveyance rail unit 130 by the rotation of the roller.

At this time, the substrate 3 loaded on the transfer rail 130 is loaded as it is upside down, and is moved by the transfer means 140 to the position where the cleaning means 150 is located.

First, the pusher 142 whose height is adjusted as the cylinder 143 is moved forward along the LM guide 144 by the driving of the timing motor 146 and the timing valve 145.

At this time, the pusher 142 repeatedly pushes the rear surface of the substrate 3. That is, the substrate 3 divided into four cells is pushed about four times according to the cleaning operation.

On the other hand, when the substrate 3 is moved to the position of the cleaning means 150 in the lower, by the operation of the cylinder 132 to fix both ends of the substrate (3).

Then, the high pressure air is injected toward the inverted substrate 3 from the cleaning means 150.

The cleaning means 150 is operated while the inside of the cover 151 maintains a vacuum. The power supply of the sub-motor 152 drives the lead screw 153, and the nut bracket 154 coupled thereto. ) Is moved.

As the nut bracket 154 moves, the nozzle plate 155 and the air nozzle 156 installed on the nozzle plate 155 are also moved.

As shown in FIGS. 7 and 8, each air nozzle 156 is responsible for cleaning each semiconductor chip 2, and the semiconductor chip 2 in the same cell is also cleaned by the forward movement of the nut bracket 154. .

When one cell cleaning is completed on the substrate 3 as described above, the sub-motor 152 reversely rotates to move the nut bracket 154 to the initial position, and then the pusher 142 operates to move the substrate 3 to the next position. The cell is moved to the cleaning position. Therefore, the above cleaning operation is repeated.

At this time, the injection angle of the air nozzle 156 is about 30 ° to 90 °, and the air cylinder 158 provided between the nut bracket 154 and the nozzle plate 155 operates repeatedly so that the nozzle plate 155 is horizontal. The cleaning effect can be doubled by injecting air while oscillating vertically or rotating.

The thickness of the substrate 3 is different according to the type of the substrate 3 before the cleaning operation, so that the gap between the substrate 3 and the air nozzle 156 needs to be adjusted. For this purpose, the height adjusting lever 159 is used. When the height adjustment lever 159 is rotated in one direction, it is lifted along the guide 159a, and when it is rotated in the other direction, it is lowered along the guide 159a.

In addition, the ion nozzle 160 penetrated from the lower portion of the cover 151 is sprayed immediately before the substrate 3 is cleaned, thereby protecting the product by preventing static electricity. In addition, ions are injected into another ion nozzle 160 toward the semiconductor chip 2 on the substrate 3 immediately cleaned, thereby preventing static electricity.

In the meantime, in the cleaning process, high-pressure air injection causes fine dust and epoxy-attached impurities separated from the semiconductor chip 2 and the glass 5 to float in the cover 151, and thus the package 1 A dust collecting device 170 for suctioning vacuum so as not to be reattached to is used.

The dust collector 170 is directly connected to the lower end of the cover 151, and the blowing fan 171 is rotated by the driving of the motor 172 to suck in impurities in the cover 151.

The sucked impurities are discharged to the outside through the exhaust duct 173 installed through the bottom of the case 100.

After the cleaning is completed, the substrate 3 is moved to a subsequent process to inspect the inspection unit 180 through a camera and a microscope to determine whether there is a defect.

In addition, the inspected substrate 3 is mounted on the magazine 110 through the unloading unit 190.

Therefore, the substrate 3 mounted upside down in the magazine 110 in the direction to be cleaned from the beginning is more effectively cleaned by the air nozzle 156 which is shaken by the vibration in the cleaning means 150.

Although the present invention has been illustrated and described with respect to certain preferred embodiments, the present invention is not limited to the above-described embodiments, and a person skilled in the art to which the present invention pertains has the present invention set forth in the claims below. Various modifications may be made without departing from the spirit of the invention.

As described above, the cleaning device of the semiconductor package according to the present invention sprays air from below from an air nozzle vibrating from side to side on a substrate to be loaded upside down, thereby minimizing the impact of the camera module, and impurities adhering to fine dust and epoxy. This is effectively cleaned, thereby improving the reliability of the product.

Claims (10)

delete In the cleaning device of a semiconductor package is loaded with a substrate mounted in a magazine and cleaned with high pressure air, A transfer rail part in which the substrate is mounted and loaded in a magazine and clamped while the package is turned downward; Transfer means for moving the substrate, which is installed and installed near one side of the transfer rail, to a cleaning position; Cleaning means is installed in the lower portion of the conveying rail portion in a vacuum state, the high pressure air is injected from below to the substrate toward the substrate, Cleaning apparatus for a semiconductor package comprising a. In the cleaning device of a semiconductor package is loaded with a substrate mounted in a magazine and cleaned with high pressure air, A transfer rail portion on which the substrate of the magazine is loaded and clamped; Transfer means for moving the substrate, which is installed and installed near one side of the transfer rail, to a cleaning position; It is provided in the vacuum state in the lower portion of the conveying rail portion includes a cleaning means for spraying the high pressure air toward the substrate from below, The transfer means, Pusher which is adjusted up and down by cylinder, Timing belt and timing motor for forward and backward with the pusher as an LM guide, The cleaning apparatus of the semiconductor package characterized by the above-mentioned. In the cleaning device of a semiconductor package is loaded with a substrate mounted in a magazine and cleaned with high pressure air, A transfer rail portion on which the substrate of the magazine is loaded and clamped; Transfer means for moving the substrate, which is installed and installed near one side of the transfer rail, to a cleaning position; It is provided in the vacuum state in the lower portion of the conveying rail portion includes a cleaning means for spraying the high pressure air toward the substrate from below, The cleaning means, A cover to keep the interior in a vacuum state, A sub-motor installed inside the cover; A lead screw installed on one side of the sub-motor, A nut bracket installed on the lead screw and moving forward and backward; A nozzle plate installed at one side of the nut bracket, A plurality of nozzles are arranged in the upper portion of the nozzle plate to face upwards, the air nozzle is sprayed with high pressure air, The cleaning apparatus of the semiconductor package characterized by the above-mentioned. The method of claim 4, wherein An air cylinder connected to the bracket between the nut bracket and the nozzle plate is further installed to vibrate the nozzle plate horizontally and vertically. The method of claim 4, wherein A height adjustment lever is further provided on the nut bracket, and the nozzle plate is cleaned up and down according to the thickness of the substrate. The method of claim 4, wherein The air nozzle cleaning device of the semiconductor package, characterized in that having an injection angle of 30 ° ~ 90 °. In the cleaning device of a semiconductor package is loaded with a substrate mounted in a magazine and cleaned with high pressure air, A transfer rail portion on which the substrate of the magazine is loaded and clamped; Transfer means for moving the substrate, which is installed and installed near one side of the transfer rail, to a cleaning position; It is provided in the vacuum state in the lower portion of the conveying rail portion includes a cleaning means for spraying the high pressure air toward the substrate from below, And at least one ion nozzle is further included in the cover of the cleaning means to remove static electricity generated in the package before and after the cleaning process performed by the cleaning means. In the cleaning device of a semiconductor package is loaded with a substrate mounted in a magazine and cleaned with high pressure air, A transfer rail portion on which the substrate of the magazine is loaded and clamped; Transfer means for moving the substrate, which is installed and installed near one side of the transfer rail, to a cleaning position; It is provided in the vacuum state in the lower portion of the conveying rail portion includes a cleaning means for spraying the high pressure air toward the substrate from below, And a dust collecting device connected to the bottom of the cover of the cleaning means and sucked under the vacuum so that the foreign matter removed in the cleaning process is not reattached on the package. The method of claim 9, The dust collector, Blowing fan installed inside, A motor for driving the blowing fan; As the exhaust duct is discharged to the outside foreign matter sucked through the blowing fan, The cleaning apparatus of the semiconductor package characterized by the above-mentioned.

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