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TWI482811B - A photohardenable resin composition, a hardened product thereof, and a printed wiring board - Google Patents

A photohardenable resin composition, a hardened product thereof, and a printed wiring board Download PDF

Info

Publication number
TWI482811B
TWI482811B TW103122267A TW103122267A TWI482811B TW I482811 B TWI482811 B TW I482811B TW 103122267 A TW103122267 A TW 103122267A TW 103122267 A TW103122267 A TW 103122267A TW I482811 B TWI482811 B TW I482811B
Authority
TW
Taiwan
Prior art keywords
group
resin composition
compound
photopolymerization initiator
photocurable resin
Prior art date
Application number
TW103122267A
Other languages
English (en)
Chinese (zh)
Other versions
TW201504304A (zh
Inventor
Shigeru Matsumoto
Akio Norikoshi
Shinobu Kondo
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201504304A publication Critical patent/TW201504304A/zh
Application granted granted Critical
Publication of TWI482811B publication Critical patent/TWI482811B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerization Catalysts (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW103122267A 2013-06-28 2014-06-27 A photohardenable resin composition, a hardened product thereof, and a printed wiring board TWI482811B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013136938 2013-06-28
JP2014018492A JP5540165B1 (ja) 2013-06-28 2014-02-03 光硬化性樹脂組成物、その硬化物およびプリント配線板

Publications (2)

Publication Number Publication Date
TW201504304A TW201504304A (zh) 2015-02-01
TWI482811B true TWI482811B (zh) 2015-05-01

Family

ID=51409457

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103122267A TWI482811B (zh) 2013-06-28 2014-06-27 A photohardenable resin composition, a hardened product thereof, and a printed wiring board

Country Status (4)

Country Link
JP (1) JP5540165B1 (ja)
CN (1) CN104428712B (ja)
TW (1) TWI482811B (ja)
WO (1) WO2014208406A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102578976B1 (ko) * 2017-03-31 2023-09-18 아지노모토 가부시키가이샤 밀봉용 조성물
CN111954849A (zh) * 2018-04-10 2020-11-17 Dic株式会社 感光性树脂组合物、固化物、绝缘材料、阻焊剂用树脂材料和抗蚀构件
JP2020166271A (ja) * 2019-03-29 2020-10-08 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
CN111269611A (zh) * 2020-03-25 2020-06-12 广东三求光固材料股份有限公司 光固化热固化组合物及其应用
JP7424500B2 (ja) * 2020-09-29 2024-01-30 Dic株式会社 光硬化型ライニング材用樹脂組成物、光硬化型ライニング材、及びその硬化物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582862A (en) * 1982-02-26 1986-04-15 Ciba-Geigy Corporation Ketone with morpholino and s-phenyl groups as photoinitiator in pigmented coating
CN1184117A (zh) * 1996-12-06 1998-06-10 希巴特殊化学控股公司 新的α－氨基苯乙酮光引发剂
JP2008519760A (ja) * 2004-11-10 2008-06-12 サン ケミカル リミテッド ピペラジノ系の光開始剤

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0912654A (ja) * 1995-06-26 1997-01-14 Nippon Kayaku Co Ltd エネルギー線硬化性樹脂組成物及びその硬化物
JP2002023363A (ja) * 2000-07-13 2002-01-23 Dainippon Ink & Chem Inc フォトリソグラフィー用樹脂組成物
TW200303895A (en) * 2002-03-06 2003-09-16 Hitachi Chemical Co Ltd Photosensitive resin composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582862A (en) * 1982-02-26 1986-04-15 Ciba-Geigy Corporation Ketone with morpholino and s-phenyl groups as photoinitiator in pigmented coating
CN1184117A (zh) * 1996-12-06 1998-06-10 希巴特殊化学控股公司 新的α－氨基苯乙酮光引发剂
JP2008519760A (ja) * 2004-11-10 2008-06-12 サン ケミカル リミテッド ピペラジノ系の光開始剤

Also Published As

Publication number Publication date
JP5540165B1 (ja) 2014-07-02
TW201504304A (zh) 2015-02-01
WO2014208406A1 (ja) 2014-12-31
CN104428712B (zh) 2016-10-19
CN104428712A (zh) 2015-03-18
JP2015028588A (ja) 2015-02-12

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