TWI399872B - Light emitting diode package structure and manufacturing process thereof - Google Patents

Description

Light-emitting diode package structure and process method thereof

A package structure and a method for manufacturing the same, in particular, a package structure of a light-emitting diode that penetrates a perforation of a different inner diameter in a rubber seat, a bracket or a heat dissipating component to form a bite of the rubber seat and the encapsulant Process method.

In recent years, Light Emitting Diode (LED) has the advantages of low power consumption, long component life, no need for warm-up time and fast response speed, and its small size, vibration resistance, and mass production. Light-emitting diodes have been commonly used in indicator lights and display devices for information, communication and consumer electronics, such as mobile phones and personal digital assistant (PDA) screen backlights, various outdoor displays, traffic lights And lights, etc.

Generally, the light-emitting diode chip is fixed to a bracket having a recessed rubber seat by a surface mount device (SMD) or a flip chip bonding technique, as shown in FIG. The "Fig. 1" is a side cross-sectional view showing the first conventional light emitting diode package structure.

In the rubber seat 71 having the recessed portion 72, at least two brackets 73 are embedded, and one of the brackets 73 is respectively exposed in the recessed portion 72 of the rubber seat 71, and the other end is respectively extended from the rubber seat 71. On both sides, the electrical connection portion 74 can be formed to be electrically connected to other electronic devices (not shown).

Then, the LED wafer 75 is fixed to the end of one of the brackets 73 exposed in the recessed portion 72 of the rubber seat 71 by surface bonding technology, and the light-emitting diode is transmitted through a wire bonding technique or a flip chip bonding technique. The pole body wafer 75 can be electrically connected to the other bracket 73 through the electrical conductor 76. Finally, the encapsulant 77 is formed on the recess 72 of the rubber seat 71. The encapsulant 77 can cover the light in the recess 72. Diode wafer 75 and bracket 73.

However, the above-mentioned LED package structure only fixes the encapsulant 77 to the glue holder 71 through the contact force between the encapsulant 77 and the surface of the recess 72, so that the influence of the external force exceeds the encapsulant 77 and the recess 72. When the contact force of the surface causes the encapsulant 77 to fall off the recess 72, and further, the electrical conductor 76 electrically connected between the LED wafer 75 and the bracket 73 may be torn and broken. Even the light-emitting diode wafer 75 is pulled off the bracket 73.

For the above reasons, some people have proposed an improvement method. Please refer to FIG. 2, and FIG. 2 is a side cross-sectional view showing a second conventional light-emitting diode package structure.

In the rubber seat 71 having the recessed portion 72, a groove 78 is provided at the inclined surface of the recessed portion 72. As shown, the groove 78 is provided at the bottom of the inclined surface of the recessed portion 72, in the depressed portion of the rubber seat 71. When the encapsulant 77 is formed on the 72, the encapsulant 77 can be filled in the recess 78 in addition to the recess 72 of the plastic holder 71.

The above-mentioned LED package structure can be filled in the recess 78 through the encapsulant 77. In addition to the contact force between the encapsulant 77 and the surface of the recess 72, the encapsulant 77 can form a fixing force through the encapsulant 77 and the recess 78. The packaged adhesive 77 can be effectively prevented from falling off from the recessed portion 72 by the external force, and the electrical wire 76 electrically connected to the bracket 73 can be effectively prevented from being broken or broken, or even The problem that the light-emitting diode wafer 75 is pulled off the bracket 73.

Although this method has the effect of solving the damage of the electrical wire and the LED chip, in the actual manufacturing process, the problem of difficulty in demolding is additionally derived, which seriously affects the manufacturing problem when the product is mass-produced. .

In summary, it has been known in the prior art that the problem of mass production caused by damage to the electrical wires and the light-emitting diode chips in order to prevent the package colloids from falling off has long been required. Therefore, it is necessary to propose an improved technical means to solve this problem. problem.

In view of the prior art, there is a problem of manufacturing mass production in order to prevent damage of an electrical conductor and a light-emitting diode wafer in order to prevent damage of the package colloid, and the present invention discloses a light-emitting diode package structure and a process method thereof, wherein:

In the first embodiment, the LED package structure disclosed in the present invention comprises: a rubber seat, at least two brackets, a light emitting diode chip and an encapsulant.

Wherein, the rubber seat has a recessed portion, and at least one occlusal perforation penetrating through the bottom surface of the rubber seat is provided on the bottom surface of the recessed portion, and the inner diameter of the bottom surface of the nipper penetrating through the rubber seat is larger than the inner diameter of the bottom surface of the through recessed portion; One end portion is embedded in the rubber seat outside the occlusion perforation and exposed to the recessed portion, and the other end of each of the brackets respectively extends out of the rubber seat to form an electrical connection portion; the illuminating diode chip is disposed in the recessed portion and exposed to each of the brackets An electrical connection is formed at the end of the recessed portion; and the encapsulant system covers the recessed portion, and the encapsulant is filled in the occlusal perforation, so that the encapsulant and the rubber seat form a snap-fit.

In the second embodiment, the LED package structure disclosed in the present invention comprises: a rubber seat, at least two brackets, a light emitting diode chip and an encapsulant.

Wherein, the rubber seat has a recessed portion, and at least one occlusal perforation penetrating through the bottom surface of the rubber seat is provided on the bottom surface of the recessed portion, and the inner diameter of the bottom surface of the nipper penetrating through the rubber seat is larger than the inner diameter of the bottom surface of the through recessed portion; One end is partially embedded in the plastic seat and exposed to the concave portion, and each of the brackets and the biting and perforating corresponding to each other is provided with a bracket perforation, and the other end of each of the brackets respectively extends the rubber seat to form an electrical connection portion; The body wafer is disposed in the recess and is electrically connected to the end of each of the brackets exposed to the recess and outside the bracket; and the encapsulant system covers the recess, and the encapsulant is filled in the bracket perforation and the bite perforation. The encapsulant is formed into a snap joint with the rubber seat.

In the third embodiment, the LED package structure includes: a rubber seat, at least two brackets, a heat dissipating component, a light emitting diode chip, and an encapsulant.

The rubber seat has a recessed portion; one end portion of each bracket is embedded in the rubber seat and exposed to the recessed portion, and the other end of each bracket extends out of the rubber seat to form an electrical connection portion; the heat dissipating component is buried in the rubber seat The top surface of the heat dissipating component is exposed to the recessed portion, and the bottom surface of the heat dissipating component is exposed to the bottom surface of the rubber seat, and at least one bite through hole penetrating through the bottom surface of the heat dissipating component is disposed on the top surface of the heat dissipating component, and the perforation hole penetrates through the heat dissipating component The inner diameter of the bottom surface is larger than the inner diameter of the top surface of the heat dissipating component; the light emitting diode chip is disposed on the top surface of the heat dissipating component outside the nipper and is electrically connected to the end of each of the brackets exposed to the recess; The encapsulant system is disposed on the rubber seat to cover the recessed portion, and the encapsulant is filled in the bite perforation, so that the encapsulant and the rubber seat form a snap-fit.

The method for manufacturing a light emitting diode package structure disclosed in the present invention comprises the following steps in the first embodiment:

Firstly, at least two brackets are formed; then, a rubber seat having a recessed portion is formed, and at least one bite through hole penetrating through the bottom surface of the rubber seat is provided on the bottom surface of the recessed portion, and the inner diameter of the bottom surface of the bite punching through the rubber seat is larger than the through recessed portion The inner diameter of the bottom surface; then, one end portion of each bracket is embedded in the rubber seat outside the nip hole and exposed to the recessed portion, and the other end of each bracket extends out of the rubber seat to form an electrical connection portion; The diode chip is electrically connected to the end portion of each of the brackets exposed to the recessed portion; finally, the encapsulant is covered on the recessed portion, and the encapsulant is filled in the occlusal perforation to make the encapsulant and the rubber seat Form a occlusal fixation.

The method for manufacturing the LED package structure disclosed in the present invention comprises the following steps in the second embodiment:

Firstly, at least two brackets are formed; then, a rubber seat having a recessed portion is formed, and at least one bite through hole penetrating through the bottom surface of the rubber seat is provided on the bottom surface of the recessed portion, and the inner diameter of the bottom surface of the bite punching through the rubber seat is larger than the through recessed portion The inner diameter of the bottom surface; then, one end portion of each bracket is buried in the rubber seat and exposed to the recessed portion, and each bracket and the occlusal perforation correspond to each other with a bracket perforation, and the other end of each bracket respectively extends the glue Forming an electrical connection portion; then, arranging the light-emitting diode chip in the recess portion and forming an electrical connection with each of the brackets exposed to the recess portion and the end portion of the bracket through the hole; finally, covering the package body with the recess portion The encapsulant is filled in the through hole of the bracket and the bite through hole, so that the encapsulant and the rubber seat form a snap-fit.

The method for manufacturing the LED package structure disclosed in the present invention comprises the following steps in the third embodiment:

First, at least two brackets and a rubber seat having a recessed portion are formed, and one end portion of each bracket is buried in the rubber seat and exposed to the recessed portion, and the other end of each bracket extends out of the rubber seat to form an electrical connection portion; The heat dissipating component is buried in the rubber seat, the top surface of the heat dissipating component is exposed to the recessed portion, and the bottom surface of the heat dissipating component is exposed to the bottom surface of the rubber seat, and at least one of the bottom surface of the heat dissipating component is disposed through the bottom surface of the heat dissipating component The occlusal perforation, the inner diameter of the occlusal perforation extending through the bottom surface of the heat dissipating component is larger than the inner diameter of the top surface of the heat dissipating component; and then, the illuminating diode chip is disposed on the top surface of the heat dissipating component outside the occlusal perforation and is exposed to the recessed portion with each bracket The end portions are respectively electrically connected; finally, the encapsulant is covered on the recessed portion, and the encapsulant is filled in the occlusal perforations to form a joint and a fixed joint between the encapsulant and the rubber seat.

The structure and the manufacturing method disclosed in the present invention are as above, and the difference from the prior art is that the present invention penetrates the perforations having different inner diameters in the rubber seat, the bracket or the heat dissipating component, and then covers the encapsulant in the rubber seat. In the part, the perforation can be filled to form a bite between the rubber seat and the encapsulant, and a bite force is formed at the perforation to prevent the encapsulation colloid from falling off, which can avoid causing the electrical wire to be broken, broken, or even damaged. Diode wafer.

Moreover, in the structure and process method proposed by the present invention, as described above, in the actual manufacturing process, the mold is demolded, and the mold release can be performed at one time, and the special mold release mode is not required, that is, the mass production can be conveniently performed. Manufactured to solve the problem of demolding of the prior art mold, which seriously affects the manufacturing problems when the product is mass produced.

Through the above technical means, the present invention can achieve the technical effect of preventing mass damage of the electrical wires and the light-emitting diode chips by preventing the package colloid from falling off, and is suitable for mass production.

The embodiments of the present invention will be described in detail below with reference to the drawings and embodiments, so that the application of the technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented.

Hereinafter, the manufacturing process of the LED package structure disclosed in the first embodiment of the present invention will be described. Please refer to FIG. 3A, and FIG. 3A shows the LED of the present invention. Schematic diagram of the process of the rubber seat and the support process in the manufacturing process of the first embodiment of the package structure.

As shown in the figure, the two brackets 20 are formed in a stamping manner on a metal plate (not shown), and then the rubber seats 10 are formed in an insert molding manner so that the respective brackets 20 are provided. Part of it is buried in the rubber seat 10. Moreover, the rubber seat 10 has a recessed portion 11 between the bottom surface 111 of the recessed portion 11 and the bottom surface 12 of the rubber seat 10, and at least one occlusal perforation 13 is provided (only a single occlusal perforation 13 is used as a schematic in the drawing, and This is limited to the scope of application of the present invention, and the snap-in perforations 13 are formed through the bottom surface 111 of the recess 11 and the bottom surface 12 of the rubber seat 10.

In the actual manufacturing process, only the upper bracket 20 (not shown) and the lower mold (not shown) are embedded therein, and the protrusions having different outer diameters are formed in the lower mold (Fig. When the molded rubber seat 10 is injected, the two brackets 20 can be buried in the rubber seat 10 at the same time, and the nip holes 13 can be formed in the rubber seat 10, and the upper mold and the lower mold are The process of burying the capsule 10 can be completed by one-time demolding.

One end of each of the brackets 20 is partially embedded in the rubber seat 10 disposed outside the nip hole 13 and exposed to the recessed portion 11 of the rubber seat 10, and the other end is respectively extended from the two sides of the rubber seat 10, The electrical connection portion 21 can be formed to be electrically connected to other electronic devices (not shown). In other words, the LED chip that is subsequently disposed in the recess 11 of the rubber seat 10 is electrically connected to the other electronic device through the electrical connection portion 21 of the plastic holder 10 through the bracket 20 .

It should be noted that the occlusal perforation 13 is provided between the bottom surface 111 of the recessed portion 11 and the bottom surface 12 of the rubber seat 10, and the inner diameter 15 of the bottom surface 12 of the nipper 13 through the bottom surface 12 of the rubber seat 10 must be larger than the nip hole 13 The inner diameter 14 of the bottom surface 111 of the recessed portion 11 can be filled by the inner diameter 15 of the bottom surface 12 of the rubber seat 10 larger than the inner diameter 15 of the bottom surface 111 of the recessed portion 11 in the subsequent formation of the encapsulant. When the perforation 13 is engaged, the size difference between the inner diameter 14 and the inner diameter 15 is formed to form a occlusion and fixation of the encapsulant and the rubber seat 10.

As shown in the figure, the cross-sectional shape of the occlusal perforation 13 is a convex shape. Here, for example only, the cross-sectional shape of the occlusal perforation 13 may be trapezoidal (not shown) in addition to the convex shape, and The scope of application of the present invention is not limited by the drawings.

The above metal plate may be copper, iron or other metal plate or alloy plate which is excellent in electrical conductivity. That is to say, the material of the bracket 20 may be copper, iron or other metal or alloy with good conductivity. The material of the rubber seat 10 may be polyphthalamide (PPA) or other thermoplastic resin commonly used as the base 10 of the light-emitting diode structure.

Next, please refer to FIG. 3B, and FIG. 3B is a cross-sectional view showing the process of the light-emitting diode in the manufacturing process of the first embodiment of the light-emitting diode package structure of the present invention.

After the perforation 13 is formed through the bottom surface 111 of the recess 11 and the bottom surface 12 of the rubber seat 10, and one end of each of the brackets 20 is partially buried in the rubber seat 10 disposed outside the nip hole 13, The LED package 30 is fixed to the end of one of the brackets 20 exposed in the recess 11 of the rubber seat 10 by a surface mount device (SMD), and is connected by wire bonding or The flip chip bonding is electrically connected to the other bracket 20, and the drawing is shown to form the LED body 30 through the electric wire 51 and the other bracket 20 by wire bonding technology. The sexual connections (which are merely illustrative and are not intended to limit the scope of application of the present invention), can provide different electrical polarities of the LEDs 30, respectively.

Finally, please refer to "3C", which is a cross-sectional view showing the process of the encapsulation process in the manufacturing process of the first embodiment of the LED package structure of the present invention.

Then, the encapsulant 40 is formed on the recess 11 of the plastic holder 10, and the encapsulant 40 can cover the LED array 30 and the holder 20 in the recess 11. And the occlusion hole 13 is formed between the bottom surface 111 of the recessed portion 11 and the bottom surface 12 of the rubber seat 10. When the encapsulant 40 is formed, the encapsulant 40 is filled in the nip hole 13 to form the rubber seat 10 and the package. The occlusal fixation between the colloids 40 can complete the first embodiment of the LED package structure of the present invention.

Since the inner diameter 15 of the bottom surface 12 of the rubber seat 10 is larger than the inner diameter 14 of the bottom surface 111 of the recess portion 11, the encapsulant 40 has a contact force in addition to the bottom surface 111 of the recess portion 11, thereby increasing the package. The occlusal force of the colloid 40 and the occlusion hole 13 can fix the encapsulant 40 more firmly in the recess 11 of the rubber seat 10, thereby preventing the external force from causing the encapsulation 40 to fall off, resulting in the electrical conductor 51 being encapsulated. When 40 is detached, it may be broken, broken, or even damaged by the LED chip.

It should be noted that when the encapsulant 40 is filled in the nip 13 , it needs to be filled to the inner diameter 15 of the nip 13 to be larger than the inner diameter 14 of the nip 13 to form a nip between the rubber seat 10 and the encapsulant 40 . The bite force in the encapsulating colloid 40 and the bite perforation 13 is increased, and in the filling, the bite perforation 13 can be filled with the encapsulating colloid 40, except that the portion shown in the drawing is filled in the bite perforation 13. For purposes of illustration, the scope of application of the invention is not limited thereby.

The above-mentioned encapsulant 40 is formed, for example, by dispensing (herein, by way of example only, and is not intended to limit the application of the invention), and the encapsulant 40 may be doped with phosphor powder (pattern) When the light emitted from the LED chip 30 is irradiated to the phosphor powder to excite visible light of another color, the light emitted by the LED chip 30 can be combined with the fluorescent light. The light excited by the powder mixes to produce a light mixing effect.

Next, the manufacturing process of the LED package structure disclosed in the second embodiment of the present invention will be described. Please refer to FIG. 4A, and FIG. 4A shows the LED of the present invention. Schematic diagram of the process of the rubber seat and the support process in the manufacturing process of the second embodiment of the body package structure.

The difference between the second embodiment and the first embodiment is that the position of the occlusal perforation 13 is different. In the first embodiment, the occlusion hole 13 and the bracket 20 are separately disposed on the rubber seat 10 and exposed to the recess 11 . in.

In the second embodiment, the bracket 20 is provided with a bracket through hole 22, and the bracket through hole 22 is corresponding to the engaging hole 13 provided on the recessed portion 11 of the rubber seat 10, and the bracket through hole 22 and the bite through hole 13 can be formed through. For the perforation of the bracket 20 and the rubber seat 10, the perforation formed in the second embodiment has the same effect as the occlusion perforation 13 in the first embodiment, that is, the encapsulation 40 can be filled in the bracket perforation 22 and the occlusion The through hole 13 is formed to form the rubber seat 10 and the snap-fit connection between the bracket 20 and the encapsulant 40, that is, the snap-fit connection between the rubber seat 10 and the encapsulant 40 can be achieved as in the first embodiment.

And because the bracket 20 is buried in the rubber seat 10, the bite force formed by the second embodiment through the bracket hole 22 and the bite hole 13 is greater than the bite force of the first embodiment, and the rubber seat can be more stably 10 and the bracket 20 is engaged and fixed with the encapsulant 40.

The main purpose is to form the bracket perforation 22 on the bracket 20 at the same time when the metal plate (not shown) is punched. Then, the manner of forming the rubber seat 10 and the biting the perforation 13 is as described in the first embodiment, and is not described here. Further, as shown in the figure, the bracket 20 formed by the punching of the bracket 20 corresponds to the engaging hole 13 provided by the rubber seat 10, and the bracket hole 22 of the bracket 20 is embedded in the rubber seat 10, The penetration of the rubber seat 10 and the bracket 20 is formed. The electrical connection portion 21 formed at the other end of the bracket 20 is the same as that of the first embodiment, and details are not described herein.

Similarly, the inner diameter 15 of the occlusal perforation 13 and the bracket perforation 22 extending through the bottom surface 12 of the rubber seat 10 must be greater than the inner diameter 24 of the occlusal perforation 13 and the stent perforation 22 extending through the top surface 23 of the stent 20, as illustrated in the first embodiment. In the embodiment, the description will not be repeated here. When the encapsulant is filled in the occlusal perforation 13 and the bracket perforation 22, the size difference between the inner diameter 24 and the inner diameter 15 is formed to form the occlusion and fixation of the encapsulant and the rubber seat 10. The cross-sectional shape of the occlusal perforation 13 and the bracket perforation 22 shown in the figure is a convex shape, and may also have a trapezoidal shape, and is not limited to the application scope of the present invention.

Next, please refer to FIG. 4B, and FIG. 4B is a cross-sectional view showing the process of the light-emitting diode in the manufacturing process of the second embodiment of the light-emitting diode package structure of the present invention.

The LED substrate 30 is fixedly exposed at one end of one of the recesses 11 of the rubber seat 10, and the LED substrate 30 is electrically connected to the other bracket 20 in the same manner as the first embodiment. As described in the figure, it will not be described here, but it is worth noting that the LED chip 30 needs to be fixed to the outside of the bracket 20 in the bracket 20 to fix the LED chip 30 to the bracket 20 . One of the ends.

Finally, please refer to FIG. 4C. FIG. 4C is a cross-sectional view showing the process of the encapsulation process in the manufacturing process of the second embodiment of the LED package structure of the present invention.

Then, the encapsulant 40 is formed on the recess 11 of the plastic holder 10, and the encapsulant 40 can cover the LED array 30 and the holder 20 in the recess 11. Moreover, since the occlusion perforation 13 and the bracket perforation 22 are disposed between the top surface 23 of the bracket 20 and the bottom surface 12 of the rubber seat 10, the encapsulant 40 is filled in the occlusion hole 13 and the bracket perforation 22 when the encapsulant 40 is formed. In order to form the occlusion and fixation between the rubber seat 10 and the encapsulant 40, the second embodiment of the LED package structure of the present invention can be completed.

And because the encapsulation colloid 40 is engaged with the occlusal perforation 13 and the puncturing force formed in the bracket perforation 22, and the bracket 20 is buried in the rubber seat 10, the occlusion force in the second embodiment is greater than that in the first embodiment. The second biting force can fix the encapsulant 40 more firmly in the recess 11 of the rubber seat 10 than the first embodiment. In addition, the manner in which the encapsulation 40 fills the occlusal perforations 13 and the bracket perforations 22 has been described in the first embodiment, and details are not described herein.

Next, the manufacturing process of the LED package structure disclosed in the present invention will be described in the third embodiment. Please refer to FIG. 5A, and FIG. 5A shows the LED of the present invention. FIG. 2 is a schematic cross-sectional view showing the process of the rubber seat and the support in the manufacturing process of the third embodiment of the package structure.

The third embodiment differs from the first embodiment and the second embodiment in that, in addition to the difference in the position at which the nip 13 is disposed, in the third embodiment, the LED package further includes a heat dissipating component. 60. In the first embodiment, the occlusal perforation 13 and the bracket 20 are separately disposed on the rubber seat 10 and exposed to the recess 11.

In the second embodiment, the bracket 20 is provided with a bracket through hole 22, and the bracket through hole 22 is corresponding to the engaging hole 13 provided on the recess 11 of the rubber seat 10, and the bite force generated by the second embodiment will be It is larger than the bite force generated by the first embodiment.

In the third embodiment, the occlusal perforations 63 are disposed through the heat dissipating member 60. The occlusal perforations 63 formed in the third embodiment have the same effect as the occlusal perforations 13 of the first embodiment. The encapsulation 40 is filled in the occlusion hole 63, thereby forming the heat dissipating component 60, the occlusion and fixing between the rubber seat 10 and the encapsulant 40, that is, the rubber seat 10 and the second embodiment can be achieved. The occlusion between the encapsulants 40 is fixed.

However, due to the difference in materials formed by the heat dissipating component 60 and the rubber seat 10, that is, the bite force generated by the third embodiment is greater than the bite force generated by the first embodiment, the heat dissipating component 60 and the glue can be more stably The seat 10 is engaged with the encapsulant 40 to be fixed.

Therefore, please refer to FIG. 5B, and FIG. 5B is a perspective exploded view showing the bracket and the heat dissipating component of the third embodiment of the LED package structure of the present invention. Two brackets 83 are formed on the first metal plate 81 by stamping, and the heat dissipating member 84 is formed on the second metal plate 82 by punching, and then the first metal plate 81 and the second metal plate 82 are respectively disposed through The positioning portions 85 of the first metal plate 81 and the second metal plate 82 are positioned and coupled with each other, that is, the bracket 83 and the heat dissipating member 84 are coupled to each other, so that the bracket 83 and the heat dissipating member 84 are integrally formed, and the above-mentioned only provides a bracket 83 and heat dissipation. The manner in which the component 84 is processed is not intended to limit the scope of application of the present invention.

Referring to FIG. 5A again, after the coupling process of the bracket 20 and the heat dissipating component 60 is completed, the rubber seat 10 is formed in a buried manner so that the respective brackets 20 and the heat dissipating component 60 are buried in the rubber seat 10 . Inside. The manner of embedding the bracket 20 and the rubber seat 10 is the same as that of the first embodiment, and details are not described herein.

The heat dissipating component 60 is embedded in the rubber seat 10, and the top surface 61 of the heat dissipating component 60 is exposed to the recessed portion 11, and the bottom surface 62 of the heat dissipating component 60 is exposed to the bottom surface 12 of the rubber seat 10 on the top surface of the heat dissipating component 60. Between the bottom surface 62 of the heat dissipating member 60 and the bottom surface 62 of the heat dissipating member 60, at least one nip hole 63 is provided (the two nip holes 63 are shown in the drawing as a schematic, and the application scope of the present invention is not limited thereto), and the nip hole 63 is penetrated through The top surface 61 of the heat dissipating component 60 and the bottom surface 62 of the heat dissipating component 60.

Similarly, the inner diameter 65 of the bottom surface 62 of the heat dissipating member 60 must be greater than the inner diameter 64 of the top surface 61 of the heat dissipating member 60, which is described in the first embodiment. Therefore, when the encapsulation colloid is filled in the occlusal perforation 63, the size difference between the inner diameter 64 and the inner diameter 65 is formed to form a occlusion and fixation of the encapsulant and the rubber seat 10, and the occlusal perforation 13 is illustrated in the drawing. The cross-sectional shape is a convex shape, and may also have a trapezoidal shape, and is not limited to the application scope of the present invention.

Next, please refer to FIG. 5C, and FIG. 5C is a cross-sectional view showing the process of the light-emitting diode in the manufacturing process of the third embodiment of the light-emitting diode package structure of the present invention.

The light emitting diode chip 30 is fixedly exposed on the heat dissipating component 60 of the rubber seat 10, and the light emitting diode chip 30 and the two brackets 20 are respectively electrically connected, as described in the first embodiment. It is to be noted that the light-emitting diode chip 30 needs to be fixed to the heat-dissipating element 60 other than the biting hole 63 to fix the light-emitting diode chip 30 to the heat-dissipating element 60.

Finally, please refer to FIG. 5D, which is a cross-sectional view showing the process of the encapsulation process in the manufacturing process of the third embodiment of the LED package structure of the present invention.

Next, an encapsulant 40 is formed on the recess 11 of the plastic holder 10 to cover the heat dissipating member 60, the recess 11 and the holder 20 on which the LED wafer 30 is placed. And because the occlusion hole 63 is disposed between the top surface 61 of the heat dissipating component 60 and the top surface 62 of the heat dissipating component 60, the encapsulant 40 is filled in the nip hole 63 when the encapsulant 40 is formed, thereby forming the rubber seat 10. The third embodiment of the LED package structure of the present invention can be completed by the occlusion and sealing between the encapsulant 40.

And because the encapsulation force formed by the encapsulation 40 and the occlusion hole 63 is caused by the material of the heat dissipating component 60, the occlusal force generated by the third embodiment is greater than the occlusion force generated by the first embodiment. Therefore, compared with the first embodiment, the third embodiment can more stably fix the encapsulant 40 in the recess 11 of the rubber seat 10. In addition, the manner in which the encapsulating body 40 is filled with the nip holes 63 has been described in the first embodiment, and will not be described again.

In summary, it can be seen that the difference between the present invention and the prior art is that the present invention penetrates the perforations having different inner diameters in the rubber seat, the bracket or the heat dissipating component, and then covers the encapsulant in the recess in the rubber seat. The perforation can be filled to form a bite between the rubber seat and the encapsulant, and a bite force is formed at the perforation to prevent the encapsulation colloid from falling off, thereby preventing the electrical wire from being torn, broken, or even damaging the LED. Wafer.

Moreover, in the structure and process method proposed by the present invention, the mold release in the actual manufacturing process can be demolded at one time, and there is no need to design a special demolding mode, that is, it can be conveniently mass-produced. In order to solve the problem of mold release in the prior art, the manufacturing problems in the mass production of the product are seriously affected.

The technical problem can solve the problem that the prior art can prevent the damage of the electrical conductor and the LED chip caused by the prevention of the falling off of the encapsulant, thereby preventing the electrical colloid and the LED chip from being prevented from falling off. Damaged and suitable for the technical efficacy of mass production manufacturing.

While the embodiments of the present invention have been described above, the above description is not intended to limit the scope of the invention. Any changes in the form and details of the embodiments may be made without departing from the spirit and scope of the invention. The scope of the invention is to be determined by the scope of the appended claims.

10. . . Plastic seat

11. . . Depression

111. . . Bottom

12. . . Bottom

13. . . Occlusal perforation

14. . . the inside diameter of

15. . . the inside diameter of

20. . . support

twenty one. . . Electrical connection

twenty two. . . Bracket perforation

twenty three. . . Top surface

twenty four. . . the inside diameter of

30. . . Light-emitting diode chip

40. . . Encapsulant

51. . . Electrical wire

60. . . Heat sink

61. . . Top surface

62. . . Bottom

63. . . Occlusal perforation

64. . . the inside diameter of

65. . . the inside diameter of

71. . . Plastic seat

72. . . Depression

73. . . support

74. . . Electrical connection

75. . . Light-emitting diode chip

76. . . Electrical wire

77. . . Encapsulant

78. . . Groove

81. . . First metal plate

82. . . Second metal plate

83. . . support

84. . . Heat sink

85. . . Positioning department

FIG. 1 is a side cross-sectional view showing the first conventional light emitting diode package structure.

FIG. 2 is a side cross-sectional view showing a second conventional light emitting diode package structure.

FIG. 3A is a cross-sectional view showing the process of the rubber seat and the bracket in the manufacturing process of the first embodiment of the light emitting diode package structure of the present invention.

FIG. 3B is a cross-sectional view showing the process of the light-emitting diode in the manufacturing process of the first embodiment of the light-emitting diode package structure of the present invention.

FIG. 3C is a cross-sectional view showing the process of the encapsulation process in the manufacturing process of the first embodiment of the LED package structure of the present invention.

FIG. 4A is a cross-sectional view showing the process of the rubber seat and the bracket in the manufacturing process of the second embodiment of the LED package structure of the present invention.

FIG. 4B is a cross-sectional view showing the process of the light emitting diode in the manufacturing process of the second embodiment of the LED package structure of the present invention.

FIG. 4C is a cross-sectional view showing the process of the encapsulation process in the manufacturing process of the second embodiment of the LED package structure of the present invention.

FIG. 5A is a cross-sectional view showing the process of the rubber seat and the bracket in the manufacturing process of the third embodiment of the LED package structure of the present invention.

FIG. 5B is a perspective exploded view of the bracket and the heat dissipating component of the third embodiment of the LED package structure of the present invention.

FIG. 5C is a cross-sectional view showing the process of the light emitting diode in the manufacturing process of the third embodiment of the LED package structure of the present invention.

FIG. 5D is a schematic cross-sectional view showing the process of the encapsulation process in the manufacturing process of the third embodiment of the LED package structure of the present invention.

10. . . Plastic seat

111. . . Bottom

12. . . Bottom

13. . . Occlusal perforation

14. . . the inside diameter of

15. . . the inside diameter of

20. . . support

30. . . Light-emitting diode chip

40. . . Encapsulant

51. . . Electrical wire

Claims (14)

A light-emitting diode package structure comprising: a rubber seat having a recessed portion; and at least one bite-perforation penetrating through a bottom surface of the rubber seat on the bottom surface of the recess portion, the bite perforations penetrating the rubber seat The inner diameter of the bottom surface is larger than the inner diameter of the bottom surface of the recessed portion; at least two brackets, one end portion of the brackets is embedded in the rubber seat disposed outside the occlusal perforations and exposed to the recessed portions, and the brackets are The other end of the strip extends to form an electrical connection portion; a light-emitting diode chip is disposed in the recess and electrically connected to the ends of the brackets exposed to the recess; and an encapsulant, Covering the recessed portion, the encapsulant is filled in the occluded perforations, so that the encapsulant and the rubber seat are engaged and fixed. The light emitting diode package structure of claim 1, wherein the occlusal perforations have a trapezoidal shape or a convex shape. A light-emitting diode package structure comprising: a rubber seat having a recessed portion; and at least one bite-perforation penetrating through a bottom surface of the rubber seat on the bottom surface of the recess portion, the bite perforations penetrating the rubber seat The inner diameter of the bottom surface is larger than the inner diameter of the bottom surface of the recessed portion; at least two brackets, one end portion of the brackets is embedded in the rubber seat and exposed to the recessed portion, and the brackets correspond to the occlusal perforations Wherein the other end of the bracket is formed to extend the plastic seat to form an electrical connection portion; a light-emitting diode chip is disposed in the recess and exposed to the recess portion and the bracket The outer ends of the brackets are respectively electrically connected; and an encapsulant is disposed on the recesses, and the encapsulant is filled in the perforations of the brackets and the occlusal perforations, so that the encapsulant and the rubber seat Form a occlusal fixation. The light-emitting diode package structure of claim 3, wherein the occlusal perforations and the cross-sections of the brackets each have a trapezoidal shape or a convex shape. A light-emitting diode package structure comprising: a rubber seat having a recess; at least two brackets, one end portion of the brackets being embedded in the rubber seat and exposed to the recess, the other of the brackets An end of the heat dissipating component is embedded in the plastic seat a bottom surface of the rubber seat, and at least one occlusion hole penetrating through the bottom surface of the heat dissipating component on the top surface of the heat dissipating component, wherein the inner diameter of the nipper penetrating through the bottom surface of the heat dissipating component is larger than the inner surface of the heat dissipating component a light-emitting diode chip disposed on a top surface of the heat dissipating component outside the occlusal perforations and electrically connected to an end portion of the brackets exposed to the recessed portion; and an encapsulant disposed on the The adhesive seat covers the recessed portion, and the encapsulant is filled in the occluded perforations to form a binding and fixing of the encapsulant to the rubber seat. The light-emitting diode package structure of claim 5, wherein the occlusal perforations have a trapezoidal shape or a convex shape. The light-emitting diode package structure according to claim 5, wherein the brackets are formed by integral coupling with the heat dissipating components. A method for manufacturing a light emitting diode package structure, comprising the steps of: forming at least two brackets; forming a rubber seat having a recessed portion; and providing at least one bite through hole penetrating through a bottom surface of the rubber seat on a bottom surface of the recessed portion The inner diameter of the bite perforations extending through the bottom surface of the rubber seat is larger than the inner diameter of the bottom surface of the recessed portion; one end portion of the brackets is embedded in the rubber seat outside the bite perforations and exposed to the recess The other end of the brackets respectively extend from the rubber seat to form an electrical connection portion; a light-emitting diode chip is disposed in the recess portion and electrically connected to the ends of the brackets exposed to the recess portion; And covering a recessed portion of the encapsulant, and the encapsulant is filled in the occlusal perforations to form a binding and fixing of the encapsulant and the adhesive seat. The method of manufacturing a light emitting diode package structure according to claim 8, wherein the occlusal perforations have a trapezoidal shape or a convex shape. A method for manufacturing a light emitting diode package structure, comprising the steps of: forming at least two brackets; forming a rubber seat having a recessed portion; and providing at least one bite through hole penetrating through a bottom surface of the rubber seat on a bottom surface of the recessed portion The inner diameter of the occlusal perforations extending through the bottom surface of the rubber seat is larger than the inner diameter of the bottom surface of the recessed portion; one end portion of the brackets is embedded in the plastic seat and exposed to the recessed portion, and the brackets are The occlusal perforations are respectively provided with a bracket through hole, and the other ends of the brackets respectively extend out the rubber seat to form an electrical connection portion; a light emitting diode chip is disposed in the recess portion and exposed to the brackets The recessed portion and the end portions of the brackets are respectively electrically connected; and an encapsulant is covered on the recessed portion, and the encapsulant is filled in each of the bracket perforations and the occlusal perforations to make the package The colloid forms a snap-fit connection with the rubber seat. The method of manufacturing a light-emitting diode package structure according to claim 10, wherein the occlusal perforations and the cross-section of each of the brackets have a trapezoidal shape or a convex shape. A method for manufacturing a light emitting diode package structure, comprising the steps of: forming at least two brackets and a rubber seat having a recess portion, one end portion of the brackets being embedded in the rubber seat and exposed to the recess portion, The other ends of the brackets respectively extend the plastic seat to form an electrical connection portion; a heat dissipating component is embedded in the rubber seat, a top surface of the heat dissipating component is exposed to the recessed portion, and a bottom surface of the heat dissipating component is exposed And a bottom surface of the heat dissipating component is disposed on the bottom surface of the heat dissipating component, and at least one of the bottom surface of the heat dissipating component has an inner diameter that is greater than a bottom surface of the heat dissipating component. An inner diameter of the light-emitting diode chip is disposed on a top surface of the heat dissipating component outside the occlusal perforations and electrically connected to an end portion of the bracket exposed to the recess; and an encapsulant is covered The encapsulant is filled in the occluded perforations to form a occlusion and fixation of the encapsulant with the rubber seat. The method for manufacturing a light emitting diode package structure according to claim 12, wherein the occlusal perforations have a trapezoidal shape or a convex shape. The method of manufacturing a light emitting diode package structure according to claim 12, wherein the brackets are integrally formed by coupling the heat dissipating components.