TWI383875B - Sheet handling method and sheet processing device - Google Patents
Sheet handling method and sheet processing device Download PDFInfo
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- TWI383875B TWI383875B TW097108664A TW97108664A TWI383875B TW I383875 B TWI383875 B TW I383875B TW 097108664 A TW097108664 A TW 097108664A TW 97108664 A TW97108664 A TW 97108664A TW I383875 B TWI383875 B TW I383875B
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- workpiece
- thin plate
- sheet
- temporary
- processing apparatus
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- 238000000034 method Methods 0.000 title claims description 10
- 238000007599 discharging Methods 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 description 16
- 238000007796 conventional method Methods 0.000 description 9
- 230000037303 wrinkles Effects 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Punching Or Piercing (AREA)
Description
本發明係有關於一種在將由生胚薄片(greensheet)等之軟質構件形成之薄板形狀之被加工物定位後搬運之薄板搬運方法與薄板加工裝置。The present invention relates to a sheet conveying method and a sheet processing apparatus which are conveyed after positioning a workpiece having a thin plate shape formed of a soft member such as a green sheet.
習知之由生胚薄片等軟質構件形成之薄板形狀之被加工物定位時，在吸著台上定位後，進行吸著來保持被加工物(參照如專例文獻1)。When positioning is performed on a workpiece having a thin plate shape formed of a soft member such as a green sheet, the workpiece is positioned by absorbing on the sorption table (see, for example, Special Document 1).
第4A圖~第4D圖係顯示習知之薄板加工裝置的搬運方法。第4A圖中，被加工物102在暫置台100上藉由定位機構101而定位固定。定位之暫置台100設定於搬運裝置103之旁邊(第4B圖)。而且，搬運裝置103保持並搬運被加工物102(第4C圖)。在搬運被加工物102後，暫置台100回到原來的位置(第4D圖)。4A to 4D are views showing a conventional method of transporting a thin plate processing apparatus. In FIG. 4A, the workpiece 102 is positioned and fixed on the temporary stage 100 by the positioning mechanism 101. The positioning temporary table 100 is set beside the conveying device 103 (Fig. 4B). Further, the conveyance device 103 holds and conveys the workpiece 102 (Fig. 4C). After the workpiece 102 is conveyed, the temporary stage 100 returns to the original position (Fig. 4D).
又，當此種被加工物在保持中變形時，係藉由壓製而重新整形為平面(參照如專利文獻2)。Further, when such a workpiece is deformed while being held, it is reshaped into a flat surface by pressing (refer to Patent Document 2).
可是，上述習知之薄板加工裝置中，由於當被加工物在定位後固定時，於加工物與暫置台之間存在有空氣，或因為在搬運時與暫置台擦撞，因此被加工物產生皺褶。是故，難以確保保持搬運後之加工物的品質。However, in the above-described conventional thin plate processing apparatus, when the workpiece is fixed after positioning, air is present between the workpiece and the temporary stage, or the workpiece is wrinkled because it collides with the temporary stage during transportation. Pleats. Therefore, it is difficult to ensure the quality of the processed product after the conveyance.
【專利文獻1】日本公開公報特開平4-22850[Patent Document 1] Japanese Laid-Open Patent Publication No. 4-22850
【專利文獻2】日本公開公報特開2001-257126[Patent Document 2] Japanese Laid-Open Patent Publication No. 2001-257126
本發明係提供一種可防止在搬運工程中產生皺褶或位置偏離並且高品質之加工物。The present invention provides a workpiece which can prevent wrinkles or positional deviation and high quality in handling work.
本發明之薄板搬運方法，包含有以下步驟：將由軟質構件形成之薄板形狀的被加工物定位在暫置台上；在前述定位後，在設置於前述暫置台且形成複數列之孔部中，在不吸引前述被加工物之對向之2邊附近之狀態下藉由至少形成1列之孔部，吸引前述暫置台上之前述被加工物；在前述吸引狀態下，以設置於搬運裝置之板片進行壓製；在前述壓製後，由設置於前述板片且形成複數列之孔部進行吐出；利用前述板片進行吸引；在利用前述板片進行吸引後，將前述被加工物搬運至加工檯；及在前述搬運後，以前述加工檯在前述被加工物之對向之2邊保持前述被加工物。The method for transporting a thin plate according to the present invention includes the steps of: positioning a workpiece having a thin plate shape formed of a soft member on a temporary stage; and after positioning the hole, forming a plurality of holes in the plurality of rows. The workpiece on the temporary stage is sucked by at least one hole portion in a state in which the object is not attracted to the vicinity of the two sides of the object to be processed; and the plate is placed on the conveying device in the suction state. After the pressing, the sheet is formed by the holes provided in the plurality of rows, and is sucked by the sheet; after the sheet is sucked by the sheet, the workpiece is conveyed to the processing table. And after the conveyance, the workpiece is held by the processing table on the opposite sides of the workpiece.
本發明之薄板加工裝置，包含有：暫置台，係具有吸引由軟質構件形成之薄板形狀之被加工物使之可自由附著脫離之孔部者；定位部，係在前述暫置台上決定前述被加工物之位置者；搬運裝置，係具有吸引前述被加工物使之可自由附著脫離之板片，且由前述暫置台搬運被加工物者；及加工檯，係在前述被加工物之對向之2邊附近保持以前述搬運裝置搬運之前述被加工物者，其中前述板片之一邊長度比前述加工檯之用以保持前述被加工物的間隔短。The sheet processing apparatus according to the present invention includes: a temporary stage having a hole for attracting a workpiece which is formed by a thin member formed of a soft member so as to be freely detachable; and a positioning portion for determining the aforementioned portion on the temporary stage a position of the workpiece; a conveying device having a sheet that sucks and detaches the workpiece so as to be freely attached and detached, and the workpiece is conveyed by the temporary table; and the processing table is opposed to the workpiece The workpiece to be conveyed by the conveyance device is held in the vicinity of the two sides, wherein a length of one side of the sheet is shorter than an interval of the processing table for holding the workpiece.
藉由如此構成，可確保設定於暫置台之被加工物的位 置精確度，並可藉由進行壓製及吐出與吸引，防止空氣的存在與皺褶的發生。又，被加工物與加工檯之間也不會有擦撞。With such a configuration, the position of the workpiece to be placed on the temporary table can be secured. Accuracy is set and the presence of air and wrinkles can be prevented by pressing, spitting and attracting. Moreover, there is no collision between the workpiece and the processing table.
第1A圖係顯示本發明之實施形態中薄板加工裝置及其動作者。Fig. 1A is a view showing a thin plate processing apparatus and its actor in the embodiment of the present invention.
第1B圖係顯示本發明之實施形態中薄板加工裝置及其動作者。Fig. 1B is a view showing a thin plate processing apparatus and its actor in the embodiment of the present invention.
第1C圖係顯示本發明之實施形態中薄板加工裝置及其動作者。Fig. 1C is a view showing a thin plate processing apparatus and its actor in the embodiment of the present invention.
第1D圖係顯示本發明之實施形態中薄板加工裝置及其動作者。Fig. 1D is a view showing a thin plate processing apparatus and its actor in the embodiment of the present invention.
第1E圖係顯示本發明之實施形態中薄板加工裝置及其動作者。Fig. 1E is a view showing a thin plate processing apparatus and its actor in the embodiment of the present invention.
第2圖係本發明之實施形態中暫置台上的吐出與吸引機構者。Fig. 2 is a view showing a discharge and suction mechanism on a temporary stage in the embodiment of the present invention.
第3圖係本發明之實施形態中薄板搬運方法之流程圖。Fig. 3 is a flow chart showing a method of conveying a thin plate in an embodiment of the present invention.
第4A圖係顯示習知之薄板加工裝置之搬運方法。Fig. 4A shows a conventional method of transporting a thin plate processing apparatus.
第4B圖係顯示習知之薄板加工裝置之搬運方法。Fig. 4B is a view showing a conventional method of transporting a thin plate processing apparatus.
第4C圖係顯示習知之薄板加工裝置之搬運方法。Fig. 4C is a view showing a conventional method of transporting a thin plate processing apparatus.
第4D圖係顯示習知之薄板加工裝置之搬運方法。Fig. 4D shows a conventional method of transporting a thin plate processing apparatus.
首先，就對被加工物1進行加工之薄板加工裝置作說明。First, a thin plate processing apparatus for processing a workpiece 1 will be described.
第1A圖~第1E圖係顯示本發明之實施形態中薄板加工裝置及其動作者。第1A圖中，X方向與Y方向係以箭頭表示。Figs. 1A to 1E are views showing a thin plate processing apparatus and its actor in the embodiment of the present invention. In Fig. 1A, the X direction and the Y direction are indicated by arrows.
薄型加工裝置具有：暫置台2、定位部、搬運裝置8、昇降裝置9、及加工檯10。薄板形狀之被加工物1係由軟質構件所形成。被加工物1之暫置台2係具有與後述之吐出與吸引機構連接之孔部20、21、22。The thin processing apparatus includes a temporary stage 2, a positioning unit, a conveying device 8, a lifting device 9, and a processing table 10. The workpiece 1 in the form of a thin plate is formed of a soft member. The temporary stage 2 of the workpiece 1 has holes 20, 21, and 22 that are connected to a discharge and suction mechanism to be described later.
定位部係由定位銷3、4及定位機構5、6所構成，且在暫置台2上決定被加工物的位置。即，定位銷3為暫置台2上之X方向的基準，而定位銷4為Y方向的基準，X方向之定位機構5及Y方向之定位機構6係進行由未圖示之被加工物供給位置供給至暫置台2之被加工物1的定位。The positioning portion is constituted by the positioning pins 3 and 4 and the positioning mechanisms 5 and 6, and the position of the workpiece is determined on the temporary table 2. That is, the positioning pin 3 is the reference in the X direction on the temporary table 2, and the positioning pin 4 is the reference in the Y direction, and the positioning mechanism 5 in the X direction and the positioning mechanism 6 in the Y direction are supplied by the workpiece (not shown). The position is supplied to the positioning of the workpiece 1 of the temporary stage 2.
搬運裝置8係將以用以進行壓製及吐出與吸引之板片7所保持之被加工物1搬運到加工檯10。昇降裝置9使以用以進行壓製及吐出與吸引之板片7所保持之被加工物1昇降。加工檯10在Y方向上對向之2邊附近保持被加工物1。The conveyance device 8 conveys the workpiece 1 held by the sheet 7 for pressing, discharging, and suction to the processing table 10. The lifting device 9 raises and lowers the workpiece 1 held by the sheet 7 for pressing, discharging, and sucking. The processing table 10 holds the workpiece 1 in the vicinity of the two sides facing in the Y direction.
用以進行壓製及吐出與吸引之板片7的尺寸h係比在對向之2邊保持被加工物1之加工檯10的保持間隔尺寸H短。又，被加工物1之Y方向的長度比加工檯10之保持間隔尺寸H長。The size h of the sheet 7 for pressing, discharging, and sucking is shorter than the holding interval H of the processing table 10 that holds the workpiece 1 on the opposite sides. Further, the length of the workpiece 1 in the Y direction is longer than the holding interval dimension H of the processing table 10.
第2圖係顯示本發明之實施形態中暫置台上之吐出與吸引機構者。第2圖中，於暫置台2上，連接於吐出與吸引 機構之孔部20、21、22係呈3列朝Y方向配置。3列中，中央列係配置於實質上將以包圍被加工物1之4邊所限定之面積中分之位置。各列具有複數孔，例如，空氣由該等孔被吸引，藉此被加工物1(未圖示)可固定於暫置台2。此時，在被加工物1之Y方向上對向之2邊附近之孔(例如，孔部22中之孔221與孔222)不吸引被加工物1(未圖示)。又，3列之孔部20、21、22中，至少1列之孔部吸引被加工物1(未圖示)。Fig. 2 is a view showing a discharge and suction mechanism on a temporary stage in the embodiment of the present invention. In Fig. 2, on the temporary table 2, connected to the discharge and attraction The hole portions 20, 21, and 22 of the mechanism are arranged in three rows in the Y direction. In the three rows, the central column is disposed at a position that is substantially divided by the area defined by the four sides surrounding the workpiece 1. Each row has a plurality of holes, for example, air is attracted by the holes, whereby the workpiece 1 (not shown) can be fixed to the temporary table 2. At this time, the hole 1 (for example, the hole 221 and the hole 222 in the hole portion 22) in the vicinity of the two sides in the Y direction of the workpiece 1 does not attract the workpiece 1 (not shown). Further, among the three rows of the holes 20, 21, and 22, at least one of the holes is attracted to the workpiece 1 (not shown).
板片7係進行壓製及吐出與吸引。板片7藉由X方向之定位機構5與Y方向之定位機構6定位。接著，在前述狀態下將吸引於暫置台2之被加工物1壓製後進行吐出與吸引，藉此去除存在之空氣與皺褶。The sheet 7 is pressed, spit and attracted. The sheet 7 is positioned by the positioning mechanism 5 in the X direction and the positioning mechanism 6 in the Y direction. Next, in the above state, the workpiece 1 sucked on the temporary stage 2 is pressed, and then discharged and sucked, thereby removing the existing air and wrinkles.
以下使用第1A圖~第1E圖、第3圖，就如上所構成之薄板加工裝置說明其動作。Hereinafter, the operation of the thin plate processing apparatus configured as described above will be described using Figs. 1A to 1E and Fig. 3 .
第3圖係顯示本發明之實施形態中薄板搬運方法的流程圖。第3圖中，由被加工物1的供給裝置(未圖示)將被加工物1搬運至暫置台2(S60)。其次，使為XY方向之基準之定位銷3、4動作(S61)，自連接於吐出與吸引機構之孔部20、21、22進行吐出並且藉由定位機構5、6定位(S63)。在被加工物1之Y方向上對向之2邊附近的孔不吸引被加工物1。又，3列之孔部20、21、22中，至少1列之孔部吸引被加工物1。如此將被加工物1固定於暫置台2後，動作完成之定位機構3、4、5、6回到基本位置(S64，第1A圖)。Fig. 3 is a flow chart showing a method of conveying a thin plate in the embodiment of the present invention. In the third drawing, the workpiece 1 is conveyed to the temporary stage 2 by a supply device (not shown) of the workpiece 1 (S60). Next, the positioning pins 3 and 4 which are the reference in the XY direction are operated (S61), and the holes 20, 21, and 22 connected to the discharge and suction mechanisms are discharged and positioned by the positioning mechanisms 5 and 6 (S63). The workpiece 1 is not attracted to the hole in the vicinity of the two sides in the Y direction of the workpiece 1 . Further, among the three rows of the holes 20, 21, and 22, at least one of the holes attracts the workpiece 1. When the workpiece 1 is fixed to the temporary table 2 in this manner, the positioning mechanisms 3, 4, 5, and 6 that have been completed are returned to the basic position (S64, FIG. 1A).
其次，搬運裝置8進行動作，板片7移動到暫置台2之位置。接著，在前述狀態下使昇降裝置9進行下降動作且以板 片7對吸引於暫置台2之被加工物1進行壓製(S65，第1B圖)。暫置台2與板片7對吐，然後，在對吸後，再次進行對吐(S66)。此時，將進入被加工物1與暫置台2及被加工物1與板片7間之空氣排出。又，暫置台2進行吐出，板片7進行吸引，使昇降裝置9上昇動作後傳送(S67)。被加工物1在無皺褶及無存留空氣之狀態下吸引於板片7(第1C圖)。Next, the conveying device 8 operates, and the sheet 7 is moved to the position of the temporary table 2. Next, in the above state, the lifting device 9 is lowered and the board is lowered. The sheet 7 presses the workpiece 1 attracted to the temporary stage 2 (S65, Fig. 1B). The temporary table 2 and the sheet 7 are spit, and then, after the suction, the spit is again performed (S66). At this time, the air that has entered the workpiece 1 and the temporary stage 2 and between the workpiece 1 and the sheet 7 is discharged. Further, the temporary table 2 performs the discharge, and the sheet 7 is sucked, and the lifting device 9 is moved up and then transferred (S67). The workpiece 1 is attracted to the sheet 7 without wrinkles and without air remaining (Fig. 1C).
其次，搬運裝置8動作使昇降裝置9下降，將被板片7吸引之被加工物1搬運到加工檯10(S68，第1D圖)。Then, the conveying device 8 is operated to lower the lifting device 9, and the workpiece 1 sucked by the sheet 7 is conveyed to the processing table 10 (S68, Fig. 1D).
接著，在Y方向對向之2邊附近保持被加工物1，使昇降裝置9進行上昇動作，然後藉由加工檯10傳送(S69)。此時，安裝於搬運裝置8之板片7的尺寸h比在對向之2邊保持被加工物1之加工檯10的保持間隔尺寸H短，因此，可自昇降裝置9的上方傳送(第1E圖)。因此，可防止在横向的搬入動作時所發生之被加工物1與接收台的擦撞等。又，加工檯10移動到加工區(未圖示)後對被加工物1進行加工。Next, the workpiece 1 is held in the vicinity of the two sides in the Y direction, and the lifting device 9 is moved upward, and then transported by the processing table 10 (S69). At this time, the dimension h of the sheet 7 attached to the conveying device 8 is shorter than the holding interval dimension H of the processing table 10 that holds the workpiece 1 on the opposite sides, so that it can be transported from above the lifting device 9 (the 1E picture). Therefore, it is possible to prevent the workpiece 1 and the receiving table from colliding or the like which occurs during the lateral loading operation. Further, the processing table 10 is moved to a processing area (not shown) to process the workpiece 1.
以上，一連串的加工作業結束(S70)。As described above, a series of processing operations are completed (S70).
又，本實施形態中與設置於薄板加工裝置的暫置台2之吐出與吸引機構連接之孔部可構成為3列。可是，該列不限於3列，亦可為4列、5列。但是，若列數為奇數，中央列宜配置在實質上可將以包圍被加工物1之4邊所限定之面積中分之位置上。Further, in the present embodiment, the hole portions connected to the discharge and suction mechanisms provided in the temporary table 2 of the thin plate processing apparatus can be configured in three rows. However, the column is not limited to three columns, and may be four columns or five columns. However, if the number of columns is an odd number, the central column should be disposed at a position substantially equal to the area defined by the four sides surrounding the workpiece 1.
根據本發明之薄板搬運方法與薄板加工裝置，可防止加工中產生的皺褶等，而可進行簡單且精確度佳之加工， 在產業上極為有用。According to the sheet conveying method and the sheet processing apparatus of the present invention, wrinkles and the like generated during processing can be prevented, and processing which is simple and accurate can be performed. Very useful in the industry.
100,2‧‧‧暫置台100, 2‧‧‧ temporary table
101,5,6‧‧‧定位機構101,5,6‧‧‧ Positioning mechanism
102,1‧‧‧被加工物102,1‧‧‧Processed objects
103,8‧‧‧搬運裝置103,8‧‧‧Transportation device
3,4‧‧‧定位銷3,4‧‧ Locating pins
7‧‧‧板片7‧‧‧ plates
9‧‧‧昇降裝置9‧‧‧ lifting device
10‧‧‧加工檯10‧‧‧Processing table
20,21,22‧‧‧孔部20, 21, 22‧ ‧ Hole Department
221,222‧‧‧穴221, 222‧ ‧ points
H,h‧‧‧尺寸H, h‧‧‧ size
X,Y‧‧‧方向X, Y‧‧ direction
第1A圖係顯示本發明之實施形態中薄板加工裝置及其動作者。Fig. 1A is a view showing a thin plate processing apparatus and its actor in the embodiment of the present invention.
第1B圖係顯示本發明之實施形態中薄板加工裝置及其動作者。Fig. 1B is a view showing a thin plate processing apparatus and its actor in the embodiment of the present invention.
第1C圖係顯示本發明之實施形態中薄板加工裝置及其動作者。Fig. 1C is a view showing a thin plate processing apparatus and its actor in the embodiment of the present invention.
第1D圖係顯示本發明之實施形態中薄板加工裝置及其動作者。Fig. 1D is a view showing a thin plate processing apparatus and its actor in the embodiment of the present invention.
第1E圖係顯示本發明之實施形態中薄板加工裝置及其動作者。Fig. 1E is a view showing a thin plate processing apparatus and its actor in the embodiment of the present invention.
第2圖係本發明之實施形態中暫置台上的吐出與吸引機構者。Fig. 2 is a view showing a discharge and suction mechanism on a temporary stage in the embodiment of the present invention.
第3圖係本發明之實施形態中薄板搬運方法之流程圖。Fig. 3 is a flow chart showing a method of conveying a thin plate in an embodiment of the present invention.
第4A圖係顯示習知之薄板加工裝置之搬運方法。Fig. 4A shows a conventional method of transporting a thin plate processing apparatus.
第4B圖係顯示習知之薄板加工裝置之搬運方法。Fig. 4B is a view showing a conventional method of transporting a thin plate processing apparatus.
第4C圖係顯示習知之薄板加工裝置之搬運方法。Fig. 4C is a view showing a conventional method of transporting a thin plate processing apparatus.
第4D圖係顯示習知之薄板加工裝置之搬運方法。Fig. 4D shows a conventional method of transporting a thin plate processing apparatus.
1‧‧‧被加工物1‧‧‧Processed objects
2‧‧‧暫置台2‧‧‧Placement
3,4‧‧‧定位銷3,4‧‧ Locating pins
5,6‧‧‧定位機構5,6‧‧‧ Positioning agency
7‧‧‧板片7‧‧‧ plates
8‧‧‧搬運裝置8‧‧‧Transportation device
9‧‧‧昇降裝置9‧‧‧ lifting device
10‧‧‧加工檯10‧‧‧Processing table
H,h‧‧‧尺寸H, h‧‧‧ size
X,Y‧‧‧方向X, Y‧‧ direction
Claims (6)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007064764 | 2007-03-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200902269A TW200902269A (en) | 2009-01-16 |
| TWI383875B true TWI383875B (en) | 2013-02-01 |
Family
ID=39759254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097108664A TWI383875B (en) | 2007-03-14 | 2008-03-12 | Sheet handling method and sheet processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5110078B2 (en) |
| CN (1) | CN101541493B (en) |
| TW (1) | TWI383875B (en) |
| WO (1) | WO2008111311A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103481355B (en) * | 2013-09-27 | 2015-11-11 | 福建群峰机械有限公司 | One splits brick machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0422850A (en) * | 1990-05-18 | 1992-01-27 | Hitachi Ltd | Thin plate holding device, appearance inspecting method, and printing method |
| JP2001015380A (en) * | 1999-06-28 | 2001-01-19 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic component |
| JP2001257126A (en) * | 2000-03-13 | 2001-09-21 | Murata Mfg Co Ltd | Manufacturing method of laminated ceramic electronic component and manufacturing device of laminated ceramic electronic component |
| JP2003291125A (en) * | 2002-04-04 | 2003-10-14 | Murata Mfg Co Ltd | Method for fabricating ceramics green sheet |
| JP2004031489A (en) * | 2002-06-24 | 2004-01-29 | Murata Mfg Co Ltd | Ceramic green sheet peeling method and ceramic green sheet peeling device |
| CN1792746A (en) * | 2005-12-27 | 2006-06-28 | 友达光电股份有限公司 | Working piece deliverying method and hold thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004276279A (en) * | 2003-03-13 | 2004-10-07 | Murata Mfg Co Ltd | Ceramic green sheet with support film and its manufacturing method |
-
2008
- 2008-03-12 TW TW097108664A patent/TWI383875B/en active
- 2008-03-12 CN CN2008800004664A patent/CN101541493B/en active Active
- 2008-03-12 JP JP2009503907A patent/JP5110078B2/en active Active
- 2008-03-12 WO PCT/JP2008/000539 patent/WO2008111311A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0422850A (en) * | 1990-05-18 | 1992-01-27 | Hitachi Ltd | Thin plate holding device, appearance inspecting method, and printing method |
| JP2001015380A (en) * | 1999-06-28 | 2001-01-19 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic component |
| JP2001257126A (en) * | 2000-03-13 | 2001-09-21 | Murata Mfg Co Ltd | Manufacturing method of laminated ceramic electronic component and manufacturing device of laminated ceramic electronic component |
| JP2003291125A (en) * | 2002-04-04 | 2003-10-14 | Murata Mfg Co Ltd | Method for fabricating ceramics green sheet |
| JP2004031489A (en) * | 2002-06-24 | 2004-01-29 | Murata Mfg Co Ltd | Ceramic green sheet peeling method and ceramic green sheet peeling device |
| CN1792746A (en) * | 2005-12-27 | 2006-06-28 | 友达光电股份有限公司 | Working piece deliverying method and hold thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200902269A (en) | 2009-01-16 |
| CN101541493A (en) | 2009-09-23 |
| JPWO2008111311A1 (en) | 2010-06-24 |
| CN101541493B (en) | 2011-08-24 |
| JP5110078B2 (en) | 2012-12-26 |
| WO2008111311A1 (en) | 2008-09-18 |
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