JP2001257126A - Manufacturing method of laminated ceramic electronic component and manufacturing device of laminated ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an undesirable deformation of a ceramic green sheets or a breakage in the ceramic green sheets from being developed due to a negative pressure which is exerted on suction holes when a laminate is obtained by repeating processes for transferring the ceramic green sheets on a stack table in a state that the sheets are held by an adsorbing head having the suction surface with a plurality of the suction holes distributed therein. SOLUTION: A plurality of ceramic green sheets 6 are transferred on a stack table 12 by a suction head 7 so that a laminate 26 consisting of the ceramic green sheets 6 is formed on the table 12 and thereafter, for smoothing the surfaces of these sheets 6, the surfaces of the sheets 6 are pressed by a press head 18 having a plane-shaped press surface 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a multilayer ceramic electronic component, and more particularly to an improvement in a method for handling stacked ceramic green sheets.

[0002]

2. Description of the Related Art When manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor, for example, a mother ceramic green sheet on which an internal conductor is printed is prepared in a state where it is lined with a carrier film as a support. A ceramic green sheet having a predetermined shape is cut out from the ceramic green sheet, the ceramic green sheet having the predetermined shape is separated from the carrier film, and the ceramic green sheets separated from the carrier film are stacked. ing.

As an apparatus suitable for manufacturing a multilayer ceramic electronic component while handling ceramic green sheets as described above, a manufacturing apparatus 1 partially shown in FIG. 9 is in practical use.

[0004] The manufacturing apparatus 1 converts a mother ceramic green sheet 3 backed by a carrier film 2 into
A cutting table 4 for positioning via the carrier film 2 is provided. Although not shown, internal conductors such as internal electrodes are printed on the surface of the mother ceramic green sheet 3 at a plurality of locations.

[0005] The carrier film 2 and the mother ceramic green sheet 3 are intermittently conveyed, for example, along the upper surface of the cutting table 4. Although not shown, the cutting table 4 is provided with a plurality of suction ports for applying a negative pressure for adsorbing the carrier film 2 based on vacuum suction. Positioned.

A cutting blade 5 is located above the cutting table 4. The cutting blade 5 is provided so as to be able to approach and separate from the cutting table 4, and cuts out a ceramic green sheet 6 having a predetermined shape from the mother ceramic green sheet 3 by the proximity thereof.

A suction head 7 is located in a space surrounded by the cutting blade 5. The suction head 7 is provided so as to be able to approach / separate from the cutting table 4 similarly to the cutting blade 5. The lower surface of the suction head 7 serves as a suction surface 8 for sucking the cut ceramic green sheet 6. The details of the suction surface 8 are shown in FIG.

A plurality of suction ports 9 and 10 to which a negative pressure is applied are distributed on the suction surface 8, and the cut-out ceramic green sheet 6 is provided with a negative pressure applied through the suction ports 9 and 10, respectively. It is held on the suction surface 8 by suction based on pressure. Suction ports 9 and 10
Are classified into a central suction port 9 distributed in the center of the suction surface 8 and a peripheral suction port 10 distributed in the peripheral portion. Preferably,
As well shown in FIG. 10, the peripheral suction port 10 is
It is provided with a higher distribution density than the central suction port 9, so that the ceramic green sheet 6 can be more strongly adsorbed at its peripheral edge.

The manufacturing apparatus 1 operates as follows.

First, the cutting blade 5 descends together with the suction head 7. Thereby, the cutting blade 5 cuts out the ceramic green sheet 6 having a predetermined shape from the mother ceramic green sheet 3. In order to enable such cutting, at least at this cutting stage, the cutting edge of the cutting blade 5 is in a state of protruding from the suction surface 8 of the suction head 7. The degree of protrusion is selected so as to protrude slightly longer than the thickness of the mother ceramic green sheet 3, whereby the cutting blade 5
The mother ceramic green sheet 3 is completely cut, but the carrier film 2 is not completely cut.

As described above, when the suction head 7 is lowered together with the cutting blade 5, the suction surface 8 is brought into contact with the ceramic green sheet 6. At this time, a negative pressure is applied to the suction ports 9 and 10, and the ceramic green sheet 6 cut out as described above is adsorbed on the adsorption surface 8. Next, the suction head 7 moves up together with the cutting blade 5. Thereby, the ceramic green sheet 6
Is separated from the carrier film 2 and is held by the suction head 7. FIG. 9 shows a state of the manufacturing apparatus 1 at this stage.

Next, although not shown, the suction head 7 holding the ceramic green sheet 6 is moved to a position above a stacking table located at a place different from the cutting table 4, and then the ceramic green sheet is placed on the stacking table. Like stacking sheets 6,
The suction head 7 is lowered. At this time, the ceramic green sheets 6 on the stacking table are somewhat pressed by the suction head 7. Then, by repeatedly performing the process of transporting the ceramic green sheets 6 onto the stacking table while holding the ceramic green sheets 6 by the suction head 7, a laminated body including a plurality of ceramic green sheets 6 is manufactured.

[0013] The laminate is further pressed and, if necessary, cut into dimensions to give individual multilayer ceramic electronic components, so as to take out raw chips for a plurality of multilayer ceramic electronic components. To be. Then, these green chips are fired, and then external electrodes and the like are formed, whereby a desired multilayer ceramic electronic component is obtained.

[0014]

With the recent demand for miniaturization of electronic equipment, miniaturization of monolithic ceramic electronic components such as monolithic ceramic capacitors used therein has been progressing. In particular, with respect to the multilayer ceramic capacitor, it is desired to increase the capacity while reducing the size. In a multilayer ceramic capacitor, as an effective means for promoting a reduction in size and an increase in capacity, there is a method of increasing the number of layers while reducing the thickness of a dielectric layer.

The thickness of the dielectric layer can be reduced by reducing the thickness of the mother ceramic green sheet 3 or the ceramic green sheet 6 handled in the manufacturing apparatus 1 shown in FIG. Generally, the thinner the ceramic green sheet becomes, the more difficult it becomes to handle it. However, the manufacturing apparatus 1 shown in FIG. 9 has a structure suitable for handling the thin ceramic green sheet 6 even if it becomes thin. It is evaluated in terms of having.

However, when the ceramic green sheet 6 is made extremely thin, for example, 10 μm or less in thickness, the ceramic green sheet 6 handled by the manufacturing apparatus 1 may cause undesired deformation or breakage. . More specifically, the deformation of the ceramic green sheet 6 occurs at a portion surrounded by the edge located on the suction surface 8 side of each of the suction ports 9 and 10, or the ceramic green sheet 6 is damaged at a portion contacting the edge. May be done. The cause is as follows.

FIG. 11 shows a specific suction port provided in the suction head 7 provided in the manufacturing apparatus 1, for example, a central suction port 9.
Is shown in an enlarged sectional view.

As described above, the suction of the ceramic green sheet 6 by the suction head 7 is performed by the suction ports 9 and 10.
Achieved by supplying a negative pressure to the Therefore, although there is a difference depending on the size of the suction ports 9 and 10 and the strength of the negative pressure, that is, the low suction pressure, the portion 6a of the ceramic green sheet 6 extending to cover the openings of the suction ports 9 and 10 is As shown in FIG. 11, the suction ports 9 and 10
Tend to be drawn into On the other hand, since the suction ports 9 and 10 are usually formed by performing drilling, laser processing, or the like on a metal plate that provides the suction surface 8, the suction ports 9 and 10 are located on the suction surface 8 side of the suction ports 9 and 10. The edge 11 has a relatively sharp corner.

Thus, when the portion 6a of the ceramic green sheet 6 is drawn into the suction ports 9 and 10, undesired deformation occurs in the portion 6a. The sharp edge 11 cuts into the ceramic green sheet 6, and the ceramic green sheet 6 is damaged at the portion where the edge 11 contacts.

The suction ports 9 and 10 as described above are used.
The phenomenon that the portion 6a of the ceramic green sheet 6 is drawn inward is generally not likely to occur in the state of being lined with the carrier film 2, but tends to occur after the ceramic green sheet 6 is peeled from the carrier film 2.

As described above, the ceramic green sheet 6
Undesirable deformation or breakage caused in the portion 6a of
After the stacking process of the plurality of ceramic green sheets 6 is completed, the ceramic green sheets 6 are brought in. FIG. 12 shows a part of each of the suction head 7 and the stacking table 12 in a cross section.
This shows a state in which a stacking process of a plurality of ceramic green sheets 6 is being performed.

As described above, when internal conductors such as internal electrodes are formed at a plurality of locations on the surface of the mother ceramic green sheet 3 and have predetermined positional relations with respect to the internal conductors. After the ceramic green sheet 6 having a predetermined shape is cut out from the mother ceramic green sheet 3, in the stacking step, while the positional relationship between the suction head 7 and the stacking table 12 is kept constant, the suction is performed on the stacking table 12. Ceramic green sheet 6 held by head 7
Need to be transported. This is because, in such a transport process, the suction head 7 and the stacking table 12
This is because, if the positional relationship between the internal conductors and the internal conductors arranged in the stacking direction of the plurality of ceramic green sheets 6 is undesirably shifted.

However, in the carrying step, the suction ports 9 and 10 of the suction head 7 are always brought to the same position with respect to the stacking table 12, so that, for example, as shown in FIG. The portions 6a of the ceramic green sheet 6, which have caused undesired deformation or breakage, will be aligned in the stacking direction.

Normally, as described above, the ceramic green sheets 6 on the stacking table 12
Pressed by some. This is to make it difficult for the stacked ceramic green sheets 6 to be displaced from each other, and heat may be applied in addition to the pressing. However, such a suction head 7
Even when the pressing is performed, the suction port 9 or 10 is always located at the deformed or broken portion 6a of the ceramic green sheet 6, so that the pressing is not applied to this portion 6a, which is undesirable. There is no opportunity for the deformation or break to be corrected, and in the worst case, as the stack progresses, the deformation or break can evolve into a cut.

The plurality of ceramic green sheets 6
Is usually further pressed, but it is hardly expected that the deformation or breakage described above is corrected at this stage of the pressing.

For this reason, the laminate is further cut to dimensions giving individual multilayer ceramic electronic components, so that raw chips for a plurality of multilayer ceramic electronic components are taken out. Of these chips, those provided with the portion 6a where the suction port 9 or 10 in the ceramic green sheet 6 was located may all be defective.

An object of the present invention is to provide a method and an apparatus for manufacturing a multilayer ceramic electronic component which can solve the above-mentioned problems.

[0028]

SUMMARY OF THE INVENTION A method of manufacturing a multilayer ceramic electronic component according to the present invention comprises the steps of: cutting a ceramic green sheet having a predetermined shape from a mother ceramic green sheet lined with a support; A suction step of distributing a plurality of suction ports, each of which is provided with a negative pressure on the surface, by adsorbing the ceramic green sheet on the suction surface by bringing the suction head close to the ceramic green sheet on the support; By separating the head from the support,
A ceramic green sheet is peeled off from the carrier film, and a peeling step is performed, in which the ceramic green sheet is held by the suction head, and the ceramic green sheet is transported onto a stacking table while being held by the suction head, and a transport step is provided. A stacking step of stacking a plurality of ceramic green sheets so as to obtain a laminate composed of the plurality of ceramic green sheets by repeatedly performing the above-described transporting step.

In order to solve the above-mentioned technical problem, the manufacturing method according to the present invention employs a flat press to smooth the surface of the conveyed ceramic green sheet after each repetition of the conveying steps. The method further comprises a smoothing press step of pressing the surface of the ceramic green sheet with a press head having a surface.

In the manufacturing method according to the present invention, preferably, the smoothing press step is performed on a stacking table.

Further, it is preferable that the cutting step, the suction step, and the peeling step are performed on a cutting table located at a place different from the stacking table.

Preferably, the suction head holds a cutting blade around the suction surface, and a cutting step for cutting the ceramic green sheet is performed by bringing the cutting blade together with the suction head toward the cutting table. At the same time, an adsorption step of adsorbing the cut-out ceramic green sheet on the adsorption surface is performed.

It is preferable that a smoothing press step is performed while the cutting step, the suction step, and the peeling step are performed.

In the smoothing press step, the ceramic green sheet is preferably heated. In this case, it is more preferable that the temperature applied in the smoothing press step is set higher than the temperature applied in the cutting step, the adsorption step, and the peeling step.

Further, the transporting step may include a pressure pressing step of pressing a plurality of ceramic green sheets on the stacking table by a suction head so as to press the ceramic green sheets together.

The present invention is also directed to an apparatus for manufacturing a multilayer ceramic electronic component for performing the above-described manufacturing method.

According to the apparatus for manufacturing a multilayer ceramic electronic component of the present invention, there is provided a cutting table for positioning a mother ceramic green sheet lined with a support via the support, and a cutting table capable of approaching / separating from the cutting table. A cutting blade for cutting out a ceramic green sheet having a predetermined shape from the mother ceramic green sheet, and a plurality of cutting blades provided so as to be able to approach / separate from the cutting table, each of which has a suction surface to which a negative pressure is applied. The suction ports are distributed, and the cutting blade is held around the suction surface, and the cut-out ceramic green sheets are placed on the suction surface by suction based on the negative pressure respectively given through the plurality of suction ports. Suction head for holding and cutting table of suction head A stacking table for stacking a plurality of ceramic green sheets that are separated from the support by the separation from the support and conveyed in accordance with the movement of the suction head; A press head having a flat press surface for pressing the ceramic green sheet conveyed on the table so as to smooth the surface.

In the apparatus for manufacturing a multilayer ceramic electronic component according to the present invention, it is preferable that the cutting of the ceramic green sheet by the cutting blade and the pressing by the press head are performed in synchronization.

In the above case, preferably, the suction head and the press head are held by the same holding member. Further, the suction head and the press head are more preferably movable along one axis while being held by the holding member, and the cutting table and the stacking table are arranged along this one axis.

In the case described above, when the suction head is also used to press a plurality of ceramic green sheets on a stacking table so as to be pressed against each other, it is necessary to drive the pressing operation of the press head. It is preferable that the press drive device is also used to drive the press operation of the suction head.

In the apparatus for manufacturing a multilayer ceramic electronic component according to the present invention, the cutting table, the suction head, the stacking table, and the press head each preferably include a heater.

Further, even if the suction surface is provided by a perforated plate formed by a plurality of independent through holes, the suction port is formed by a porous plate formed by a plurality of through holes penetrating the porous material. May be given.

[0043]

1 to 7 illustrate a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention. In these drawings, a manufacturing apparatus 13 for performing this manufacturing method is shown in a front view. Each state of the manufacturing apparatus 13 shown in FIGS.
This corresponds to each step included in the manufacturing method according to this embodiment.

The manufacturing apparatus 13 shown in FIGS.
Elements common to those shown in FIGS. 9 to 12 as elements included in the conventional manufacturing apparatus 1 are provided.
Therefore, for these common elements, the same reference numerals as those used in FIGS. 9 to 12 are used in FIGS. 1 to 7 to omit redundant description, or refer to FIGS. 9 to 12 in the description. Or you may.

As shown in FIGS. 9 to 12, the manufacturing apparatus 1 includes a cutting table 4, a cutting blade 5, a suction head 7, and a stacking table 12.

The mother ceramic green sheet 3 backed by the carrier film 2 as a support is
The sheet is completely conveyed along the upper surface of the cutting table 4 and, after the conveyance, is positioned with respect to the cutting table 4 via the carrier film 2. Therefore, although not shown, the cutting table 4 is provided with a plurality of suction ports for applying a negative pressure for sucking the carrier film based on vacuum suction. The cutting table 4 has a built-in heater 14.

The mother ceramic green sheet 3
Although not shown, an internal conductor film such as an internal electrode distributed at a plurality of locations is formed on the surface by, for example, printing.

A cutting blade 5 is located above the cutting table 4. The cutting blade 5 is provided so as to be able to approach and separate from the cutting table 4, and cuts out a ceramic green sheet 6 having a predetermined shape from the mother ceramic green sheet 3 by the proximity thereof.

The suction head 7 is located in a space surrounded by the above-described cutting blade 5. The suction head 7
Like the cutting blade 5, it is provided so as to be able to approach and separate from the cutting table 4. The lower surface of the suction head 7 serves as a suction surface 8 for sucking the cut ceramic green sheet 6. 9 and 1.
It has the configuration described above with reference to FIG. 0, in which a plurality of suction ports 9 and 10 to which a negative pressure is respectively applied are distributed. In this embodiment, the suction head 7
Is provided by a perforated plate in which suction ports 9 and 10 are formed by a plurality of independent through holes. The suction head 7 holds the above-described cutting blade 5 with the suction surface 8.
Hold around. The suction head 7 has a built-in heater 15.

In the illustrated embodiment, the suction head 7
As shown in FIGS. 9 and 10, the suction surface 8 is provided by a perforated plate in which the suction ports 9 and 10 are formed by a plurality of independent through holes. , The suction port is multi-stacked,
It is located at a different location from the cutting table 4. The stacking table 12 is for stacking a plurality of ceramic green sheets 6 held by the suction head 7 and conveyed in accordance with the movement of the suction head 7, although not shown, for sucking the ceramic green sheets 6 based on vacuum suction. Are provided. Further, the stacking table 12 has a built-in heater 16.

A press head 18 having a flat press surface 17 is provided so as to be able to approach and separate from the stacking table 12 described above. The press head 18 presses the ceramic green sheet 6 conveyed on the stacking table 12 so as to smooth the surface thereof in accordance with the approach operation to the stacking table 12. The press head 18 has a built-in heater 19.

The aforementioned suction head 7 and press head 18
Are held by the same holding member 20.

More specifically, the suction head 7 is held by a holding member 20 via a shaft 21, and the press head 18 is held by a holding member 20 via a shaft 22. The shafts 21 and 22 are
0 is provided so as to be displaceable by a predetermined range in the vertical direction. As for the shaft 21, FIG.
2, 3, 4, 5, and 7 show a state of being displaced upward, and FIG. 6 shows a state of being displaced downward. Also, regarding the shaft 22, FIGS. 1, 4, 5, 6, and 7 show a state where the shaft 22 is displaced upward, and FIGS. 2 and 3 show a state where the shaft 22 is displaced downward. .

Each of the shafts 21 and 22 is biased by, for example, a spring (not shown) so as to be maintained in an upwardly displaced state unless an external force is applied. The downward displacement of each of the shafts 21 and 22 is provided by a press drive 23. The press driving device 23 includes a plunger 24 that is located above the stacking table 12 and abuts on the head of the shaft 21 or 22 that has moved to be located above the stacking table 12. Thus, the shaft 21 or 22 is displaced downward against the elasticity of the spring described above.

The shaft 21 on which the suction head 7 is mounted
Has a configuration provided with, for example, a ball screw (not shown). As can be understood by comparing the position of the suction head 7 shown in FIG. 1 with the position shown in FIG. The distance between the can be changed, thereby
The suction head 7 can be vertically displaced.

As described above, the shafts 21 and 22
The holding member 20 holding the suction head 7 and the press head 18 via the rails 25 can be moved along the rail 25. The position at one end of such movement along one axis is shown in FIGS. 1-4, and the position at the other end is shown in FIGS. 5-7. The above-described cutting table 4 and stacking table 12 are arranged along one axis provided by the rail 25.

Hereinafter, the operation given by the manufacturing apparatus 13, ie, the manufacturing apparatus 13 will be described with reference to FIGS.
A method of manufacturing a multilayer ceramic electronic component according to the present invention will be described.

First, in the state shown in FIG.
Is at a position above the cutting table 4, but at a position separated from the cutting table 4. Also,
The press head 18 is at a position above the stacking table 12 but at a distance from the stacking table 12.

The mother ceramic green sheet 3 backed by the carrier film 2 is conveyed and positioned on the cutting table 4.

Further, on the stacking table 12, a laminate 26 obtained by stacking a plurality of ceramic green sheets 6 is arranged. This laminate 2
At the top of 6, the ceramic green sheet 6 conveyed last at this time is located.

The heaters 14, 15, 16 and 18
Respectively, the cutting table 4, the suction head 7, the stacking table 12, and the press head 18
Is in a heated state. In this case, a temperature of about 40 ° C. is applied to the cutting table 4 and the suction head 7, and a higher temperature of about 70 ° C. is applied to the stacking table 12 and the press head 18. Is preferred.

Next, when the ball screw provided on the shaft 21 is operated, as shown in FIG.
Moves down together with the suction head 7. Thereby, the cutting blade 5 cuts out the ceramic green sheet 6 having a predetermined shape from the mother ceramic green sheet 3. At least at this cutting stage, the cutting blade 5
Is in a state protruding from the suction surface 8 of the suction head 7. This degree of protrusion is selected so as to protrude slightly longer than the thickness of the mother ceramic green sheet 3, whereby the cutting blade 5 completely cuts the mother ceramic green sheet 3 but completely cuts the carrier film 2. It will not be cut.

As described above, when the suction head 7 moves down together with the cutting blade 5, the suction surface 8 contacts the ceramic green sheet 6. At this time, the suction port 9
And 10 (see FIGS. 9 and 10) are applied with a negative pressure, and the ceramic green sheet 6 cut out as described above is adsorbed on the adsorption surface 8.

On the other hand, the plunger 2 of the press driving device 23
When the projection 4 projects, the press head 18 is driven so as to be displaced downward. As a result, a pressing surface 17 of the press head 18 presses the surface of the ceramic green sheet 6 to perform a smoothing pressing step of smoothing the surface of the ceramic green sheet 6. As a result, undesired deformation in the portion 6a of the ceramic green sheet 6 shown in FIG. 11 is corrected. Further, the heating by the heaters 16 and 19 promotes such correction and acts to further enhance the adhesion between the ceramic green sheets 6.

Next, when the ball screw provided on the shaft 21 is operated, the suction head 7 moves up together with the cutting blade 5 as shown in FIG. Thereby, the ceramic green sheet 6 is peeled from the carrier film 2 and is held by the suction head 7. The heating by the heaters 14 and 15 described above acts so as to more easily cause such separation.

On the other hand, the press head 18 is maintained in a state where the smoothing press process by the press head 18 is being performed.

Next, as shown in FIG. 4, the plunger 24 of the press driving device 23 is raised, and as a result, the press head 18 is raised, and the smoothing press process is completed.

On the suction head 7 side, the cutting edge of the cutting blade 5 is returned to a state where it does not protrude from the suction surface 8.

Next, as shown in FIG. 5, the suction head 7 and the press head 18 held by the holding member 20 are used.
Move integrally to the left along the rail 25. As a result, the suction head 7 is positioned above the stacking table 12 and below the press driving device 23.

On the cutting table 4, a new portion of the mother ceramic green sheet 3 is conveyed together with the carrier film 2 and positioned.

Next, as shown in FIG. 6, the plunger 24 of the press driving device 23 projects downward, whereby
The suction head 7 is displaced downward via the shaft 21. Thus, the ceramic green sheets 6 held by the suction head 7 are stacked on the stack 26 on the stacking table 12. At this time, it is preferable that the ceramic green sheet 6 is somewhat pressed by the suction head 7.

Next, as shown in FIG. 7, the plunger 24 of the press driving device 23 is raised, and as a result, the suction head 7 is raised. At this time, the negative pressure applied to the suction ports 9 and 10 (see FIGS. 9 and 10) is cut off, so that the suction head 7 does not suction the ceramic green sheet 6.

Next, the state returns to the state shown in FIG. That is, the suction head 7 held by the holding member 20
Then, the press head 18 moves to the right, the suction head 7 is positioned above the cutting table 4, and the press head 18 is positioned above the stacking table 12 and below the press driving device 23. .

As described above, the above-described steps are repeated until the number of stacked ceramic green sheets 6 in the stacked body 26 on the stacking table 12 reaches a desired number.

The laminated body 26 provided with the desired number of laminated ceramic green sheets 6 is further pressed and, if necessary, cut into dimensions to give individual laminated ceramic electronic components, thereby obtaining a plurality of laminated ceramic green sheets. They are made to take out raw chips for electronic components. Then, these green chips are fired, and then external electrodes and the like are formed, whereby a desired multilayer ceramic electronic component is obtained.

In the embodiment described above, the suction head 7
And the press head 18 can be moved along one axis while being held by the same holding member 20.
May be adopted.

That is, as shown in FIG. 8, the suction head 7 has the arrow 2 as in the above-described embodiment.
As shown by 7, the reciprocating movement is performed between each position above the cutting table 4 and above the stacking table 12.
As shown by 8, it can be moved up and down above the stacking table 12. Therefore, the press head 18 performs the smooth press step in accordance with the downward movement, and in the state where the suction head 7 is moved upward,
Is brought to a position above the stacking table 12.

As described above, the present invention has been described in relation to the illustrated embodiment.
Various modifications are possible.

For example, in the illustrated embodiment, the smoothing press process using the press head 18 is performed on the stacking table 12, but may be performed on a table different from the stacking table 12.

In the illustrated embodiment, the cutting step, the suction step, and the peeling step are performed by the stacking table 12.
Although performed on the cutting table 4 located at a different place from the above, at least one of the cutting step, the suction step, and the peeling step may be performed on another table.

Further, the suction head 7 holds the cutting blade 5, and a cutting step of cutting out the ceramic green sheet 6 is performed by bringing the cutting blade 5 close to the cutting table 4 together with the suction head 7. At the same time, an adsorption step of adsorbing the cut-out ceramic green sheet 6 on the adsorption surface 8 was performed, but an adsorption head and a cutting blade were separately provided,
The cutting step and the adsorption step may be performed at different stages.

The smoothing press step was performed while the cutting step, the suction step, and the peeling step were performed. However, at a different time from the cutting step, the suction step, and the peeling step, the smoothing press step was performed. May be implemented.

In the illustrated embodiment, a common press drive unit 23 is used to drive both the press operation of the press head 18 and the press operation of the suction head 7, but separate press drive units are used. May be used.

In the illustrated embodiment, the suction head 7
As shown in FIGS. 9 and 10, the suction surface 8 is provided by a perforated plate in which the suction ports 9 and 10 are formed by a plurality of independent through holes. The suction port may be provided by a porous plate formed by a plurality of through holes penetrating the porous material, or may be provided by a mesh plate.

When the adsorption surface is provided by, for example, a porous plate, the deformation shown in FIG. 11 is unlikely to occur in the ceramic green sheet 6, but the surface of the ceramic green sheet extends along the surface of the porous plate. The surface is roughened, which may cause delamination or the like in the multilayer ceramic electronic component. Therefore, also in this case, it is significant to perform the smoothing press step using the press head according to the present invention.

[0086]

As described above, according to the present invention, when stacking a plurality of ceramic green sheets,
Each time the ceramic green sheet is conveyed onto the stacking table while being held by the suction head, the ceramic green sheet is pressed by a press head having a flat press surface in order to smooth the surface of the conveyed ceramic green sheet. Pressing the surface of the sheet, the smoothing press step is performed, so that undesired deformation or breakage of the ceramic green sheet caused by the suction port provided on the suction surface of the suction head Can be advantageously modified.

Therefore, it is possible to prevent the resulting multilayer ceramic electronic component from becoming defective due to such undesired deformation or breakage.

The deformation or breakage of the ceramic green sheet as described above tends to occur particularly in the case of a thin ceramic green sheet. Therefore, the present invention can be advantageously applied particularly when handling a thin ceramic green sheet. As a result, according to the present invention, it is possible to reduce the thickness of the multilayer ceramic electronic component while increasing the number of layers of the multilayer ceramic electronic component, and to produce a small-sized multilayer ceramic electronic component having excellent performance with a high yield. In particular, when the present invention is applied to the production of a multilayer ceramic capacitor, it is possible to advantageously realize a large capacity while being small.

In the method for manufacturing a multilayer ceramic electronic component according to the present invention, if the smoothing press step is performed on a stacking table, the transporting step and the smoothing press step that are repeatedly performed are efficiently advanced. be able to.

Further, in the method for manufacturing a multilayer ceramic electronic component according to the present invention, if the cutting step, the suction step, and the peeling step are performed on a cutting table located at a place different from the stacking table,
Since the cutting step, the suction step, and the peeling step are performed on a common cutting table, the efficiency of these steps can be improved, and the cutting step, the suction step, and the peeling step can be performed on the stacking table. Can be performed at the same time as the stacking process, so that the efficiency of the process can be improved also in this regard.

Further, if the suction head holds the cutting blade, and the cutting blade is brought close to the cutting table together with the suction head so that the cutting step and the suction step are performed simultaneously, the cutting step and the suction step can be performed simultaneously. The adsorption step can proceed efficiently.

[0092] Further, by performing the smoothing press step while the cutting step, the suction step, and the peeling step are performed, the efficiency of the step can be improved by the simultaneous progress of a plurality of steps. Can be.

Further, if the ceramic green sheets are heated in the smoothing press step, not only the correction of undesired deformation in the ceramic green sheets is promoted, but also the adhesion between the ceramic green sheets is increased. be able to.

If the temperature applied in the above-described smoothing press step is set higher than the temperatures applied in the cutting step, the adsorption step and the peeling step,
Correction of deformation and adhesion of the ceramic green sheet in the smoothing press step can be achieved satisfactorily while the step of peeling the ceramic green sheet from the support such as a carrier film proceeds without any problem. In this regard, in the multilayer ceramic electronic component manufacturing apparatus according to the present invention, if each of the cutting table, the suction head, the stacking table, and the press head has a heater, it is easy to perform temperature control independently of each other. Therefore, it is possible to easily set the temperature conditions as described above.

In the method of manufacturing a multilayer ceramic electronic component according to the present invention, when carrying out the transporting step, a plurality of ceramic green sheets on the stacking table are pressed by a suction head so as to be pressed against each other.
By performing the pressure pressing step, the adhesion between the ceramic green sheets in a laminate obtained by laminating a plurality of ceramic green sheets can be further improved.

In the apparatus for manufacturing a multilayer ceramic electronic component according to the present invention, when the suction head and the press head are held by the same holding member, the cutting blade cuts out the ceramic green sheet and the suction head sucks the ceramic green sheet. In addition, it is easy to synchronize the peeling with the pressing by the press head.

In this case, the suction head and the press head can be moved along one axis while being held by the holding member. When the cutting table and the stacking table are arranged along this one axis, the entire apparatus can be moved. Can be reduced in size.

Further, if a press drive device for driving the press operation of the press head is also used for driving the press operation of the suction head, the press drive device can be used in common. The cost can be reduced and the size of the device can be reduced.

[Brief description of the drawings]

FIG. 1 is a front view schematically showing a multilayer ceramic electronic component manufacturing apparatus 13 according to an embodiment of the present invention, showing a first step included in a method for manufacturing a multilayer ceramic electronic component.

FIG. 2 is a view corresponding to FIG. 1 and shows a second step included in a method for manufacturing a multilayer ceramic electronic component.

FIG. 3 is a view corresponding to FIG. 1 and shows a third step included in the method for manufacturing a multilayer ceramic electronic component.

FIG. 4 is a view corresponding to FIG. 1, showing a fourth step included in the method for manufacturing a multilayer ceramic electronic component.

FIG. 5 is a view corresponding to FIG. 1 and shows a fifth step included in the method for manufacturing a multilayer ceramic electronic component.

FIG. 6 is a view corresponding to FIG. 1, showing a sixth step included in the method for manufacturing a multilayer ceramic electronic component.

FIG. 7 is a view corresponding to FIG. 1 and shows a seventh step included in the method for manufacturing a multilayer ceramic electronic component.

FIG. 8 is a front view schematically showing a main part of an apparatus for manufacturing a multilayer ceramic electronic component according to another embodiment of the present invention.

FIG. 9 is an enlarged front view of a part of each of the suction head 7 and the cutting table 4 in the multilayer ceramic electronic component manufacturing apparatus 1 of interest to the present invention.

FIG. 10 is a view showing a suction surface of a suction head 7 shown in FIG. 9;

FIG. 11 is a view for explaining a problem to be solved by the present invention, and shows a portion 6a in which a ceramic green sheet 6 is deformed or damaged due to a suction port 9 provided in a suction head 7; It is sectional drawing which expands and shows.

FIG. 12 is a cross-sectional view of a part of each of the suction head 7 and the stacking table 12, and illustrates a stacked state of a plurality of ceramic green sheets 6 that have been deformed or damaged as illustrated in FIG.

[Explanation of symbols]

 2 Carrier film (support) 3 Mother ceramic green sheet 4 Cutting table 5 Cutting blade 6 Ceramic green sheet 7 Suction head 8 Suction surface 9, 10 Suction port 12 Stacking table 13 Manufacturing equipment 14, 15, 16, 19 Heater 17 Press surface Reference Signs List 18 press head 20 holding member 23 press driving device 25 rail 26 laminate

Claims (16)

[Claims] 1. A cutting step of cutting a ceramic green sheet having a predetermined shape from a mother ceramic green sheet lined with a support, and a plurality of suction ports to which a negative pressure is applied to its suction surface are distributed. By causing the suction head to approach the ceramic green sheet on the support, the ceramic green sheet is suctioned onto the suction surface,
An adsorbing step, separating the ceramic green sheet from the carrier film by separating the adsorbing head from the support, and holding the ceramic green sheet in a state held by the adsorbing head; Transporting the sheet on a stacking table while being held by the suction head, and by repeatedly performing the transporting step, a plurality of the ceramic green sheets are obtained so as to obtain a laminate including the ceramic green sheets. A method for manufacturing a laminated ceramic electronic component, comprising stacking ceramic green sheets, comprising a stacking step, wherein after each of the repeating transporting steps, in order to smooth the surface of the transported ceramic green sheet, a planar shape is formed. Press with press surface Further comprising a smoothing pressing step of pressing the surface of the ceramic green sheet with a pad. 2. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the smoothing press step is performed on the stacking table. 3. The multilayer ceramic electronic component according to claim 1, wherein the cutting step, the suction step, and the peeling step are performed on a cutting table located at a location different from the stacking table. Manufacturing method. 4. The suction head holds a cutting blade around the suction surface, and cuts out the ceramic green sheet by bringing the cutting blade close to the cutting table together with the suction head. 4. The method for manufacturing a multilayer ceramic electronic component according to claim 3, wherein a cutting step is performed, and an adsorption step of adsorbing the cut ceramic green sheet on the adsorption surface is performed. 5. 5. The production of the multilayer ceramic electronic component according to claim 1, wherein the smoothing press step is performed while the cutting step, the suction step, and the peeling step are performed. Method. 6. The method according to claim 1, wherein the ceramic green sheet is heated in the smoothing pressing step. 7. The temperature applied in the smoothing press step is set higher than the temperature applied in the cutting step, the suction step, and the peeling step.
A method for manufacturing a multilayer ceramic electronic component according to claim 6. 8. The method according to claim 1, wherein the transporting step includes a pressure pressing step in which the plurality of ceramic green sheets on the stacking table are pressed by the suction head so as to be pressed against each other. A method for manufacturing the multilayer ceramic electronic component according to the above. 9. A cutting table for positioning a mother ceramic green sheet lined with a support via the support, and a mother ceramic green sheet provided so as to be able to approach / separate from the cutting table. A cutting blade for cutting out a ceramic green sheet having a predetermined shape from a plurality of suction ports which are provided so as to be able to approach / separate from the cutting table and have a suction surface to which a negative pressure is respectively applied. And the cutting blade is held around the suction surface, and the cut-out ceramic green sheet is held on the suction surface by suction based on negative pressures respectively given through the plurality of suction ports. Head for cutting, and the cutting table of the suction head A stacking table for stacking the plurality of ceramic green sheets that are separated from the support by separation from the support and conveyed in accordance with the movement of the suction head; and a stacking table that is provided so as to be able to approach and separate from the stacking table. A press head having a flat press surface, which presses the surface of the ceramic green sheet conveyed onto the stacking table according to an operation so as to be smooth. 10. The apparatus for manufacturing a multilayer ceramic electronic component according to claim 9, wherein the cutting of the ceramic green sheet by the cutting blade and the pressing by the press head are performed in synchronization. 11. The apparatus for manufacturing a multilayer ceramic electronic component according to claim 10, wherein the suction head and the press head are held by the same holding member. 12. The suction head and the press head are movable along one axis while being held by the holding member, and the cutting table and the stacking table are arranged along the one axis.
An apparatus for manufacturing a multilayer ceramic electronic component according to claim 11. 13. The suction head is also used for pressing a plurality of the ceramic green sheets on the stacking table so as to press against each other, and includes a press driving device for driving a pressing operation of the press head. 2. The apparatus according to claim 1, further comprising: the press driving device is used to drive a pressing operation of the suction head. 3.
3. The apparatus for manufacturing a multilayer ceramic electronic component according to item 2. 14. The apparatus for manufacturing a multilayer ceramic electronic component according to claim 9, wherein the cutting table, the suction head, the stacking table, and the press head each include a heater. 15. The method for manufacturing a multilayer ceramic electronic component according to claim 9, wherein the suction surface is provided by a perforated plate in which the suction port is formed by a plurality of independent through holes. 16. The multilayer ceramic electronic component according to claim 9, wherein the suction surface is provided by a porous plate having the suction port formed by a plurality of through holes penetrating a porous material. Production method.