TWI371501B - Deposition apparatus and deposition method - Google Patents
Deposition apparatus and deposition methodInfo
- Publication number
- TWI371501B TWI371501B TW094109705A TW94109705A TWI371501B TW I371501 B TWI371501 B TW I371501B TW 094109705 A TW094109705 A TW 094109705A TW 94109705 A TW94109705 A TW 94109705A TW I371501 B TWI371501 B TW I371501B
- Authority
- TW
- Taiwan
- Prior art keywords
- deposition
- deposition method
- deposition apparatus
- Prior art date
Links
- 238000000151 deposition Methods 0.000 title 2
- 230000008021 deposition Effects 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0077—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for tempering, e.g. with cooling or heating circuits for temperature control of elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004097112 | 2004-03-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200535270A TW200535270A (en) | 2005-11-01 |
TWI371501B true TWI371501B (en) | 2012-09-01 |
Family
ID=35056224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094109705A TWI371501B (en) | 2004-03-29 | 2005-03-29 | Deposition apparatus and deposition method |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080241587A1 (en) |
EP (1) | EP1741802B1 (en) |
JP (1) | JP5191656B2 (en) |
KR (1) | KR100830388B1 (en) |
CN (1) | CN1938447B (en) |
TW (1) | TWI371501B (en) |
WO (1) | WO2005093120A1 (en) |
Families Citing this family (32)
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EP1862788A1 (en) * | 2006-06-03 | 2007-12-05 | Applied Materials GmbH & Co. KG | Evaporator for organic material, coating installation, and method for use thereof |
EP2187709B1 (en) * | 2007-09-10 | 2018-03-21 | Ulvac, Inc. | Vapor emission device, organic thin-film vapor deposition apparatus and method of organic thin-film vapor deposition |
US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
US10442226B2 (en) | 2008-06-13 | 2019-10-15 | Kateeva, Inc. | Gas enclosure assembly and system |
US8383202B2 (en) | 2008-06-13 | 2013-02-26 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US9604245B2 (en) | 2008-06-13 | 2017-03-28 | Kateeva, Inc. | Gas enclosure systems and methods utilizing an auxiliary enclosure |
US12064979B2 (en) | 2008-06-13 | 2024-08-20 | Kateeva, Inc. | Low-particle gas enclosure systems and methods |
US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
JP5171964B2 (en) * | 2008-11-14 | 2013-03-27 | 株式会社アルバック | Organic thin film deposition apparatus, organic EL element manufacturing apparatus, and organic thin film deposition method |
JP5696530B2 (en) * | 2010-05-01 | 2015-04-08 | 東京エレクトロン株式会社 | Thin film forming method and film forming apparatus |
JP5792438B2 (en) * | 2010-08-12 | 2015-10-14 | 東京エレクトロン株式会社 | Film forming apparatus and film forming method |
US9120344B2 (en) | 2011-08-09 | 2015-09-01 | Kateeva, Inc. | Apparatus and method for control of print gap |
US9034428B2 (en) | 2011-08-09 | 2015-05-19 | Kateeva, Inc. | Face-down printing apparatus and method |
JP5994080B2 (en) * | 2012-04-13 | 2016-09-21 | 株式会社Joled | Vacuum device, organic film forming method, organic EL element manufacturing method, organic EL display panel, organic EL display device, organic EL light emitting device, and method for selecting material constituting getter material |
WO2014045904A1 (en) * | 2012-09-21 | 2014-03-27 | コニカミノルタ株式会社 | Method for manufacturing glass product |
KR101970449B1 (en) | 2013-12-26 | 2019-04-18 | 카티바, 인크. | Apparatus and techniques for thermal treatment of electronic devices |
CN107611287A (en) | 2014-01-21 | 2018-01-19 | 科迪华公司 | Equipment and technology for electronic device package |
US9343678B2 (en) | 2014-01-21 | 2016-05-17 | Kateeva, Inc. | Apparatus and techniques for electronic device encapsulation |
WO2015168036A1 (en) | 2014-04-30 | 2015-11-05 | Kateeva, Inc. | Gas cushion apparatus and techniques for substrate coating |
WO2015177916A1 (en) * | 2014-05-23 | 2015-11-26 | 株式会社シンクロン | Thin film deposition method and deposition device |
CN104313542B (en) * | 2014-10-24 | 2016-09-28 | 京东方科技集团股份有限公司 | ITO layer and the manufacture method of ITO pattern, display base plate and display device |
WO2016086192A1 (en) | 2014-11-26 | 2016-06-02 | Kateeva, Inc. | Environmentally controlled coating systems |
DE102015107297A1 (en) * | 2015-05-11 | 2016-11-17 | Von Ardenne Gmbh | processing arrangement |
CN107431015B (en) * | 2015-11-10 | 2021-11-12 | 东京毅力科创株式会社 | Vaporizer, film forming apparatus, and temperature control method |
CN105316626A (en) * | 2015-11-20 | 2016-02-10 | 苏州赛森电子科技有限公司 | Coating film raw material guiding device of evaporation table for semiconductor processing |
US20180369861A1 (en) * | 2015-12-24 | 2018-12-27 | Flosfia Inc. | Film forming method |
KR102369676B1 (en) | 2017-04-10 | 2022-03-04 | 삼성디스플레이 주식회사 | Apparatus and method for manufacturing a display apparatus |
CN110047774B (en) * | 2018-01-17 | 2021-08-27 | 杭州纤纳光电科技有限公司 | Equipment for preparing perovskite thin film in immersion mode, use method and application |
US20250051924A1 (en) * | 2021-12-22 | 2025-02-13 | University Of Maryland, College Park | Vapor deposition systems and methods, and nanomaterials formed by vapor deposition |
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JP5107500B2 (en) | 2003-08-20 | 2012-12-26 | 公益財団法人国際科学振興財団 | Vapor deposition equipment |
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-
2005
- 2005-03-29 US US10/594,495 patent/US20080241587A1/en not_active Abandoned
- 2005-03-29 KR KR1020067022081A patent/KR100830388B1/en not_active IP Right Cessation
- 2005-03-29 WO PCT/JP2005/005928 patent/WO2005093120A1/en active Application Filing
- 2005-03-29 EP EP05727877.2A patent/EP1741802B1/en not_active Not-in-force
- 2005-03-29 TW TW094109705A patent/TWI371501B/en active
- 2005-03-29 CN CN2005800099904A patent/CN1938447B/en not_active Expired - Fee Related
- 2005-03-29 JP JP2006511584A patent/JP5191656B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPWO2005093120A1 (en) | 2008-02-14 |
TW200535270A (en) | 2005-11-01 |
US20080241587A1 (en) | 2008-10-02 |
KR20070000500A (en) | 2007-01-02 |
EP1741802B1 (en) | 2013-08-21 |
CN1938447A (en) | 2007-03-28 |
WO2005093120A1 (en) | 2005-10-06 |
KR100830388B1 (en) | 2008-05-20 |
EP1741802A1 (en) | 2007-01-10 |
EP1741802A4 (en) | 2009-08-19 |
JP5191656B2 (en) | 2013-05-08 |
CN1938447B (en) | 2010-06-09 |
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